JP2018123295A - Aromatic polyamide and surface modifier - Google Patents
Aromatic polyamide and surface modifier Download PDFInfo
- Publication number
- JP2018123295A JP2018123295A JP2017143159A JP2017143159A JP2018123295A JP 2018123295 A JP2018123295 A JP 2018123295A JP 2017143159 A JP2017143159 A JP 2017143159A JP 2017143159 A JP2017143159 A JP 2017143159A JP 2018123295 A JP2018123295 A JP 2018123295A
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- aromatic polyamide
- carbon atoms
- film
- mmol
- Prior art date
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- Granted
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- 239000004760 aramid Substances 0.000 title claims abstract description 47
- 229920003235 aromatic polyamide Polymers 0.000 title claims abstract description 47
- 239000003607 modifier Substances 0.000 title claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 29
- 239000010419 fine particle Substances 0.000 claims abstract description 20
- 125000003118 aryl group Chemical group 0.000 claims abstract description 18
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 16
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims abstract description 6
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000012986 modification Methods 0.000 abstract description 4
- 230000004048 modification Effects 0.000 abstract description 4
- -1 heptamethylene group Chemical group 0.000 description 43
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 20
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 18
- 239000002904 solvent Substances 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 15
- 229920005575 poly(amic acid) Polymers 0.000 description 15
- 238000003786 synthesis reaction Methods 0.000 description 15
- 238000005259 measurement Methods 0.000 description 14
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Polymers O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 14
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 12
- 238000005160 1H NMR spectroscopy Methods 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000002966 varnish Substances 0.000 description 10
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000005227 gel permeation chromatography Methods 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 235000002597 Solanum melongena Nutrition 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920006395 saturated elastomer Polymers 0.000 description 6
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 5
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 5
- 125000005370 alkoxysilyl group Chemical group 0.000 description 5
- 239000012043 crude product Substances 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- LMDZBCPBFSXMTL-UHFFFAOYSA-N 1-Ethyl-3-(3-dimethylaminopropyl)carbodiimide Substances CCN=C=NCCCN(C)C LMDZBCPBFSXMTL-UHFFFAOYSA-N 0.000 description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- 229940125904 compound 1 Drugs 0.000 description 4
- 229940125782 compound 2 Drugs 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000010550 living polymerization reaction Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 101100203596 Caenorhabditis elegans sol-1 gene Proteins 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 229940126214 compound 3 Drugs 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000012074 organic phase Substances 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- OHVLMTFVQDZYHP-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CN1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O OHVLMTFVQDZYHP-UHFFFAOYSA-N 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 2
- FPQQSJJWHUJYPU-UHFFFAOYSA-N 3-(dimethylamino)propyliminomethylidene-ethylazanium;chloride Chemical compound Cl.CCN=C=NCCCN(C)C FPQQSJJWHUJYPU-UHFFFAOYSA-N 0.000 description 2
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- YNESATAKKCNGOF-UHFFFAOYSA-N lithium bis(trimethylsilyl)amide Chemical compound [Li+].C[Si](C)(C)[N-][Si](C)(C)C YNESATAKKCNGOF-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- NUJGJRNETVAIRJ-UHFFFAOYSA-N octanal Chemical compound CCCCCCCC=O NUJGJRNETVAIRJ-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
- 125000006833 (C1-C5) alkylene group Chemical group 0.000 description 1
- 125000006736 (C6-C20) aryl group Chemical group 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- IHCCLXNEEPMSIO-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 IHCCLXNEEPMSIO-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- WDBQJSCPCGTAFG-QHCPKHFHSA-N 4,4-difluoro-N-[(1S)-3-[4-(3-methyl-5-propan-2-yl-1,2,4-triazol-4-yl)piperidin-1-yl]-1-pyridin-3-ylpropyl]cyclohexane-1-carboxamide Chemical compound FC1(CCC(CC1)C(=O)N[C@@H](CCN1CCC(CC1)N1C(=NN=C1C)C(C)C)C=1C=NC=CC=1)F WDBQJSCPCGTAFG-QHCPKHFHSA-N 0.000 description 1
- BWGRDBSNKQABCB-UHFFFAOYSA-N 4,4-difluoro-N-[3-[3-(3-methyl-5-propan-2-yl-1,2,4-triazol-4-yl)-8-azabicyclo[3.2.1]octan-8-yl]-1-thiophen-2-ylpropyl]cyclohexane-1-carboxamide Chemical compound CC(C)C1=NN=C(C)N1C1CC2CCC(C1)N2CCC(NC(=O)C1CCC(F)(F)CC1)C1=CC=CS1 BWGRDBSNKQABCB-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 1
- IRQWEODKXLDORP-UHFFFAOYSA-N 4-ethenylbenzoic acid Chemical compound OC(=O)C1=CC=C(C=C)C=C1 IRQWEODKXLDORP-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
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- 125000002078 anthracen-1-yl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C([*])=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 125000000748 anthracen-2-yl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C([H])=C([*])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
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- 238000011156 evaluation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UKVIEHSSVKSQBA-UHFFFAOYSA-N methane;palladium Chemical compound C.[Pd] UKVIEHSSVKSQBA-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- SKTCDJAMAYNROS-UHFFFAOYSA-N methoxycyclopentane Chemical compound COC1CCCC1 SKTCDJAMAYNROS-UHFFFAOYSA-N 0.000 description 1
- LZXXNPOYQCLXRS-UHFFFAOYSA-N methyl 4-aminobenzoate Chemical compound COC(=O)C1=CC=C(N)C=C1 LZXXNPOYQCLXRS-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000007342 radical addition reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- ZMCBYSBVJIMENC-UHFFFAOYSA-N tricaine Chemical compound CCOC(=O)C1=CC=CC(N)=C1 ZMCBYSBVJIMENC-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Polyamides (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
【課題】無機微粒子の表面修飾等に利用可能な芳香族ポリアミドを提供する。【解決手段】下記式(1)で表される芳香族ポリアミド。(式中、Xは、炭素数1〜10のアルキレン基を表し、Rは、互いに独立して、炭素数1〜10のアルキル基又は炭素数6〜20のアリール基を表し、R1及びR2は、互いに独立して、炭素数1〜10のアルキル基を表し、R3は、互いに独立して、炭素数1〜10のアルキル基又は炭素数6〜20のアリール基を表し、Arは、1,3−フェニレン基又は1,4−フェニレン基を表し、nは、2以上の整数を表し、kは、1〜3の整数を表す。)【選択図】なしAn aromatic polyamide that can be used for surface modification of inorganic fine particles is provided. An aromatic polyamide represented by the following formula (1): (In the formula, X represents an alkylene group having 1 to 10 carbon atoms, R independently represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms, and R1 and R2 represent Each independently represents an alkyl group having 1 to 10 carbon atoms, R 3 independently represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms, Ar represents 1, 3 represents a 3-phenylene group or a 1,4-phenylene group, n represents an integer of 2 or more, and k represents an integer of 1 to 3.) [Selection] None
Description
本発明は、芳香族ポリアミドに関し、更に詳述すれば、無機微粒子の表面修飾等に利用可能な芳香族ポリアミドに関する。 The present invention relates to an aromatic polyamide, and more specifically to an aromatic polyamide that can be used for surface modification of inorganic fine particles.
有機材料の耐熱性や、力学特性及び電気的特性を向上させるため、シリカゲルや酸化チタン等の無機微粒子を有機高分子と混ぜたハイブリッド材料(ナノコンポジット)がよく研究されている。しかし、有機材料と無機材料はそもそも性質が大きく異なるので、添加できる無機微粒子の量が限られるという問題があるうえに、添加した無機微粒子を有機材料中で分散させるのが難しいだけでなく、時間が経つと添加した無機微粒子が有機材料中で凝集してしまう等の問題がある。 In order to improve the heat resistance, mechanical properties, and electrical properties of organic materials, hybrid materials (nanocomposites) in which inorganic fine particles such as silica gel and titanium oxide are mixed with organic polymers have been well studied. However, since organic materials and inorganic materials have very different properties in the first place, there is a problem that the amount of inorganic fine particles that can be added is limited, and it is not only difficult to disperse the added inorganic fine particles in the organic material, but also the time. As a result, there is a problem that the added inorganic fine particles aggregate in the organic material.
そこで、これらの問題を解決するために無機微粒子表面を有機低分子化合物や有機高分子で修飾することが行われてきている。特に、有機高分子で修飾する場合は、(1)無機表面に開始部位を導入してそこからリビング重合を行う、又は(2)リビングポリマー末端に無機物と結合できる官能基(−Si(OR)3、−PO3H、−CO2H、−SH等)を導入し、無機微粒子表面に反応させる、という2つの方法が主に行われている。 Therefore, in order to solve these problems, the surface of inorganic fine particles has been modified with an organic low molecular weight compound or an organic polymer. In particular, in the case of modification with an organic polymer, (1) a start site is introduced into the inorganic surface and living polymerization is performed therefrom, or (2) a functional group (—Si (OR)) capable of binding to an inorganic substance at the living polymer terminal. 3 , —PO 3 H, —CO 2 H, —SH, etc.) are introduced and reacted with the surface of the inorganic fine particles.
しかし、リビング重合は付加重合と開環重合に限られるので、得られるポリマーはあまり耐熱性のない脂肪族ポリマーである。この場合、無機微粒子を有機材料に混ぜて耐熱性を上げようとしても表面修飾した脂肪族ポリマーが先に熱分解し、表面修飾しない無機微粒子を混ぜた材料と同じ問題を抱える。また、そもそも修飾した脂肪族ポリマーが耐熱性の高い縮合系芳香族ポリマーと混ざりにくいことも大きな問題となる。 However, since living polymerization is limited to addition polymerization and ring-opening polymerization, the resulting polymer is an aliphatic polymer with little heat resistance. In this case, even if inorganic fine particles are mixed with an organic material to increase the heat resistance, the surface-modified aliphatic polymer is thermally decomposed first, and thus has the same problem as a material mixed with inorganic fine particles that are not surface-modified. Another major problem is that the modified aliphatic polymer is hardly mixed with the condensed aromatic polymer having high heat resistance.
これらの問題を解決するには、耐熱性に優れた縮合系芳香族高分子で無微粒子表面を修飾すればよい。しかし、縮合系芳香族高分子は重縮合でしか得られないため、リビング重合の特性を生かした前記(1)及び(2)のアプローチは不可能であった。 In order to solve these problems, the surface of the fine particles may be modified with a condensed aromatic polymer having excellent heat resistance. However, since the condensed aromatic polymer can be obtained only by polycondensation, the approaches (1) and (2) utilizing the characteristics of living polymerization have been impossible.
本発明は、このような事情に鑑みてなされたものであり、無機微粒子の表面修飾等に利用可能な芳香族ポリアミドを提供することを目的とする。 This invention is made | formed in view of such a situation, and it aims at providing the aromatic polyamide which can be utilized for the surface modification etc. of inorganic fine particles.
本発明者らは、これまで開発してきた重縮合のリビング重合である連鎖縮合重合(CGCP)による芳香族ポリアミド重合法(非特許文献1参照)において、不飽和結合を有する開始剤を用いて得られた不飽和末端を利用することで、無機物表面と反応する−Si(OR)3等が導入できる結果、無機微粒子表面の修飾剤として利用可能な芳香族ポリアミドが得られることを見出し、本発明を完成した。 In the aromatic polyamide polymerization method (refer to Non-Patent Document 1) by chain condensation polymerization (CGCP), which is a polycondensation living polymerization that has been developed so far, the present inventors have obtained using an initiator having an unsaturated bond. As a result of the introduction of -Si (OR) 3 that reacts with the inorganic surface by utilizing the unsaturated terminal thus obtained, it has been found that an aromatic polyamide that can be used as a modifier for the surface of the inorganic fine particles can be obtained. Was completed.
すなわち、本発明は、下記芳香族ポリアミド及び表面修飾剤を提供する。
1.下記式(1)で表される芳香族ポリアミド。
2.下記式(2)で表される1の芳香族ポリアミド。
3.R1及びR2が、互いに独立して、メチル基又はエチル基である1又は2の芳香族ポリアミド。
4.1〜3のいずれかの芳香族ポリアミドを含む表面修飾剤。
5.1〜3のいずれかの芳香族ポリアミドで表面修飾されている無機微粒子。
6.5の無機微粒子と有機マトリックス樹脂とを含む有機・無機ハイブリット材料。
7.6の有機・無機ハイブリット材料を用いて作製されるフィルム。
8.下記式(3)で表される芳香族ポリアミド。
9.R1及びR2が、互いに独立して、メチル基又はエチル基である8の芳香族ポリアミド。
That is, the present invention provides the following aromatic polyamide and surface modifier.
1. An aromatic polyamide represented by the following formula (1).
2. 1 aromatic polyamide represented by the following formula (2).
3. 1 or 2 aromatic polyamide in which R 1 and R 2 are each independently a methyl group or an ethyl group.
The surface modifier containing the aromatic polyamide in any one of 4.1-3.
5. Inorganic fine particles that are surface-modified with any one of aromatic polyamides 1 to 3.
An organic / inorganic hybrid material comprising 6.5 inorganic fine particles and an organic matrix resin.
A film produced using the organic / inorganic hybrid material of 7.6.
8). An aromatic polyamide represented by the following formula (3).
9. 8. An aromatic polyamide of 8, wherein R 1 and R 2 are each independently a methyl group or an ethyl group.
本発明によれば、無機微粒子表面の修飾剤として利用可能な芳香族ポリアミドを提供できる。この芳香族ポリアミドを用いてシリカや窒化ホウ素等の無機微粒子表面を修飾し、ポリイミド等の耐熱性高分子に混合して更に耐熱性と力学特性とを上げた有機・無機ハイブリッド材料の開発が期待できる。 ADVANTAGE OF THE INVENTION According to this invention, the aromatic polyamide which can be utilized as a modifier of the inorganic fine particle surface can be provided. It is expected to develop organic / inorganic hybrid materials in which the surface of inorganic fine particles such as silica and boron nitride is modified using this aromatic polyamide and mixed with heat-resistant polymers such as polyimide to further improve heat resistance and mechanical properties. it can.
本発明の芳香族ポリアミドは、下記式(1)で表されるものである。
式(1)中、Xは、炭素数1〜10のアルキレン基を表す。Rは、互いに独立して、炭素数1〜10のアルキル基又は炭素数6〜20のアリール基を表す。R1及びR2は、互いに独立して、炭素数1〜10のアルキル基を表す。R3は、互いに独立して、炭素数1〜10のアルキル基又は炭素数6〜20のアリール基を表す。Arは、1,3−フェニレン基又は1,4−フェニレン基を表す。nは、2以上の整数を表す。kは、1〜3の整数を表す。 In formula (1), X represents an alkylene group having 1 to 10 carbon atoms. R represents a C1-C10 alkyl group or a C6-C20 aryl group mutually independently. R 1 and R 2 each independently represent an alkyl group having 1 to 10 carbon atoms. R 3 independently represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms. Ar represents a 1,3-phenylene group or a 1,4-phenylene group. n represents an integer of 2 or more. k represents an integer of 1 to 3.
炭素数1〜10のアルキレン基の具体例としては、メチレン基、エチレン基、メチルエチレン基、トリメチレン基、プロピレン基、メチルプロピレン基、テトラメチレン基、ペンタメチレン基、ヘキサメチレン基、ヘプタメチレン基、オクタメチレン基、デカメチレン基等が挙げられるが、中でも、炭素数1〜5のアルキレン基が好ましく、炭素数1〜3のアルキレン基がより好ましく、トリメチレン基がより一層好ましい。 Specific examples of the alkylene group having 1 to 10 carbon atoms include methylene group, ethylene group, methylethylene group, trimethylene group, propylene group, methylpropylene group, tetramethylene group, pentamethylene group, hexamethylene group, heptamethylene group, Although an octamethylene group, a decamethylene group, etc. are mentioned, Especially a C1-C5 alkylene group is preferable, a C1-C3 alkylene group is more preferable, and a trimethylene group is much more preferable.
炭素数1〜10のアルキル基の具体例としては、メチル基、エチル基、n−プロピル基、イソプロピル基、シクロプロピル基、n−ブチル基、イソブチル基、sec−ブチル基、tert−ブチル基、n−ペンチル基、1−メチル−n−ブチル基、2−メチル−n−ブチル基、3−メチル−n−ブチル基、1,1−ジメチル−n−プロピル基、1,2−ジメチル−n−プロピル基、2,2−ジメチル−n−プロピル基、1−エチル−n−プロピル基、シクロペンチル基、n−ヘキシル基、1−メチル−n−ペンチル基、2−メチル−n−ペンチル基、3−メチル−n−ペンチル基、4−メチル−n−ペンチル基、1,1−ジメチル−n−ブチル基、1,2−ジメチル−n−ブチル基、1,3−ジメチル−n−ブチル基、2,2−ジメチル−n−ブチル基、2,3−ジメチル−n−ブチル基、3,3−ジメチル−n−ブチル基、1−エチル−n−ブチル基、2−エチル−n−ブチル基、1,1,2−トリメチル−n−プロピル基、1,2,2−トリメチル−n−プロピル基、1−エチル−1−メチル−n−プロピル基、1−エチル−2−メチル−n−プロピル基、シクロヘキシル基、n−ヘプチル基、n−オクチル基、n−ノニル基、n−デシル基等が挙げられる。 Specific examples of the alkyl group having 1 to 10 carbon atoms include methyl group, ethyl group, n-propyl group, isopropyl group, cyclopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, 1-methyl-n-butyl group, 2-methyl-n-butyl group, 3-methyl-n-butyl group, 1,1-dimethyl-n-propyl group, 1,2-dimethyl-n -Propyl group, 2,2-dimethyl-n-propyl group, 1-ethyl-n-propyl group, cyclopentyl group, n-hexyl group, 1-methyl-n-pentyl group, 2-methyl-n-pentyl group, 3-methyl-n-pentyl group, 4-methyl-n-pentyl group, 1,1-dimethyl-n-butyl group, 1,2-dimethyl-n-butyl group, 1,3-dimethyl-n-butyl group 2,2-dimethyl-n-butyl group 2,3-dimethyl-n-butyl group, 3,3-dimethyl-n-butyl group, 1-ethyl-n-butyl group, 2-ethyl-n-butyl group, 1,1,2-trimethyl-n -Propyl group, 1,2,2-trimethyl-n-propyl group, 1-ethyl-1-methyl-n-propyl group, 1-ethyl-2-methyl-n-propyl group, cyclohexyl group, n-heptyl group , N-octyl group, n-nonyl group, n-decyl group and the like.
炭素数6〜20のアリール基の具体例としては、フェニル基、α−ナフチル基、β−ナフチル基、o−ビフェニリル基、m−ビフェニリル基、p−ビフェニリル基、1−アントリル基、2−アントリル基、9−アントリル基、1−フェナントリル基、2−フェナントリル基、3−フェナントリル基、4−フェナントリル基、9−フェナントリル基等が挙げられる。これらの中でも、R、R1、R2としては、メチル基、エチル基が好ましい。また、R3としては、炭素数1〜8のアルキル基が好ましく、炭素数1〜5のアルキル基がより好ましく、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、n−ペンチル基等がより好ましい。 Specific examples of the aryl group having 6 to 20 carbon atoms include phenyl group, α-naphthyl group, β-naphthyl group, o-biphenylyl group, m-biphenylyl group, p-biphenylyl group, 1-anthryl group, and 2-anthryl group. Group, 9-anthryl group, 1-phenanthryl group, 2-phenanthryl group, 3-phenanthryl group, 4-phenanthryl group, 9-phenanthryl group and the like. Among these, as R, R 1 and R 2 , a methyl group and an ethyl group are preferable. R 3 is preferably an alkyl group having 1 to 8 carbon atoms, more preferably an alkyl group having 1 to 5 carbon atoms, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, n -A pentyl group or the like is more preferable.
kは、1〜3の整数を表すが、2又は3が好ましく、3がより好ましい。nは、2以上の整数であれば特に限定されないが、2〜100の整数が好ましい。 k represents an integer of 1 to 3, preferably 2 or 3, and more preferably 3. Although n will not be specifically limited if it is an integer greater than or equal to 2, The integer of 2-100 is preferable.
式(1)で表される芳香族ポリアミドとしては、下記式(2)で表されるものが好ましい。 As aromatic polyamide represented by Formula (1), what is represented by following formula (2) is preferable.
本発明の芳香族ポリアミドの数平均分子量(Mn)は、1,000〜200,000が好ましく、1,000〜20,000がより好ましい。なお、本発明においてMnは、ゲルパーミエーションクロマトグラフィー(GPC)によるポリスチレン換算測定値である。 The number average molecular weight (Mn) of the aromatic polyamide of the present invention is preferably 1,000 to 200,000, and more preferably 1,000 to 20,000. In the present invention, Mn is a measured value in terms of polystyrene by gel permeation chromatography (GPC).
本発明の芳香族ポリアミドは、非特許文献1の方法で得られる下記式(3)で表される芳香族ポリアミドを原料として得ることができる。 The aromatic polyamide of the present invention can be obtained using, as a raw material, an aromatic polyamide represented by the following formula (3) obtained by the method of Non-Patent Document 1.
式(3)で表されるビニル基を有する芳香族ポリアミドと、アルコキシシリル基含有チオール化合物とを、ラジカル付加反応させて、式(1)で表される芳香族ポリアミドが得られる。この場合、式(3)で表される芳香族ポリアミドと、アルコキシシリル基含有チオール化合物との反応比率は、特に限定されないが、反応効率等を考慮すると、式(3)の芳香族ポリアミド1molに対し、チオール化合物が1〜100mol程度とすることができるが、5〜50molが好ましく、10〜30molがより好ましい。 An aromatic polyamide represented by the formula (1) is obtained by subjecting an aromatic polyamide having a vinyl group represented by the formula (3) and an alkoxysilyl group-containing thiol compound to a radical addition reaction. In this case, the reaction ratio between the aromatic polyamide represented by the formula (3) and the alkoxysilyl group-containing thiol compound is not particularly limited, but in consideration of the reaction efficiency, etc., 1 mol of the aromatic polyamide of the formula (3) On the other hand, although a thiol compound can be about 1-100 mol, 5-50 mol is preferable and 10-30 mol is more preferable.
アルコキシシリル基含有チオール化合物の具体例としては、3−(トリメトキシシリル)プロパンチオール、3−(トリエトキシシリル)プロパンチオール等が挙げられる。 Specific examples of the alkoxysilyl group-containing thiol compound include 3- (trimethoxysilyl) propanethiol and 3- (triethoxysilyl) propanethiol.
重合開始剤としては、熱又は還元性物質等によって分解してラジカル種を発生するものであれば、特に限定はなく、例えば、2,2'−アゾビスイソブチロニトリル等のアゾ化合物、ベンゾイルパーオキシド、tert−ブチルパーベンゾエート、tert−ブチルハイドロパーオキシド、ジ−tert−ブチルパーオキシド、クメンハイドロパーオキシド等の過酸化物等が挙げられる。これらは、1種単独で用いても、2種以上を組み合わせて用いてもよい。 The polymerization initiator is not particularly limited as long as it can be decomposed by heat or a reducing substance to generate radical species. For example, azo compounds such as 2,2′-azobisisobutyronitrile, benzoyl And peroxides such as peroxide, tert-butyl perbenzoate, tert-butyl hydroperoxide, di-tert-butyl peroxide, cumene hydroperoxide, and the like. These may be used alone or in combination of two or more.
前記反応は、有機溶媒中で行うこともできる。使用可能な溶媒としては、芳香族ポリアミドが溶解し、重合反応を妨げないものであれば任意であり、例えば、ペンタン、ヘキサン、ヘプタン、オクタン、シクロヘキサン等の脂肪族炭化水素類;ジエチルエーテル、ジイソプロピルエーテル、ジブチルエーテル、シクロペンチルメチルエーテル、テトラヒドロフラン、1,4−ジオキサン等のエーテル類;ベンゼン、トルエン、キシレン、メシチレン、アニソール等の芳香族炭化水素類;クロロホルム、ジクロロメタン、ジクロロエタン、四塩化炭素等のハロゲン化炭化水素類、アセトニトリル、プロピオニトリル等のニトリル類等が挙げられる。これらのうち、ニトリル類が好ましく、特にアセトニトリルが好適である。 The reaction can also be performed in an organic solvent. Any solvent can be used as long as it dissolves the aromatic polyamide and does not interfere with the polymerization reaction. For example, aliphatic hydrocarbons such as pentane, hexane, heptane, octane, and cyclohexane; diethyl ether, diisopropyl Ethers such as ether, dibutyl ether, cyclopentyl methyl ether, tetrahydrofuran, and 1,4-dioxane; aromatic hydrocarbons such as benzene, toluene, xylene, mesitylene, and anisole; halogens such as chloroform, dichloromethane, dichloroethane, and carbon tetrachloride And nitriles such as acetonitrile and propionitrile. Of these, nitriles are preferable, and acetonitrile is particularly preferable.
反応温度は、50〜150℃程度が好ましく、60〜100℃程度がより好ましい。反応時間は、通常1〜120時間程度である。反応終了後は、定法に従って後処理をし、必要に応じて再沈殿等の精製を施して目的物を得ることができる。 The reaction temperature is preferably about 50 to 150 ° C, more preferably about 60 to 100 ° C. The reaction time is usually about 1 to 120 hours. After completion of the reaction, the desired product can be obtained by post-treatment according to a conventional method and, if necessary, purification such as reprecipitation.
本発明の芳香族ポリアミドは、その末端にアルコキシシリル基を有しているため、このアルコキシシリル基を利用して無機微粒子の表面や、無機基板の表面等を修飾することができる。芳香族ポリアミドは、耐熱性に優れているため、本発明の芳香族ポリアミドを無機材料の表面処理剤として用いるとともに、有機マトリックスとしてもポリイミドやポリアミド等の耐熱性に優れた樹脂を用いることで、耐熱性及び力学特性に優れた有機・無機ハイブリット材料の開発が期待できる。 Since the aromatic polyamide of the present invention has an alkoxysilyl group at the terminal, the surface of the inorganic fine particles, the surface of the inorganic substrate, etc. can be modified using this alkoxysilyl group. Since the aromatic polyamide is excellent in heat resistance, the aromatic polyamide of the present invention is used as a surface treatment agent for inorganic materials, and also by using a resin excellent in heat resistance such as polyimide and polyamide as an organic matrix, Development of organic / inorganic hybrid materials with excellent heat resistance and mechanical properties can be expected.
以下、合成例、調製例、比較調製例、実施例及び比較例を挙げて本発明をより具体的に説明するが、本発明は下記実施例に限定されない。実施例で用いた各試薬及び各測定装置は以下のとおりである。
[試薬]
DMF:ジメチルホルムアミド
DMAP:N,N−ジメチル−4−アミノピリジン
EDCI:1−エチル−3−(3−ジメチルアミノプロピル)カルボジイミド
THF:テトラヒドロフラン
AIBN:2,2'−アゾビスイソブチロニトリル
[GPC]
装置:Shodex GPC-101(昭和電工(株)製)
カラム:Shodex KF-804l 2本(昭和電工(株)製)
カラム温度:40℃
溶媒:THF 1mL/分
検出器:UV(254nm)、RI
検量線:標準ポリスチレン
[1H−NMR]
装置:JEOL ECA-500 and ECA-600
[TG−DTA]
装置:Seiko Instruments Inc. TG/DTA 6200
[走査型電子顕微鏡(SEM)]
装置:JSM-7400F(日本電子(株)製)
Hereinafter, the present invention will be described more specifically with reference to synthesis examples, preparation examples, comparative preparation examples, examples and comparative examples, but the present invention is not limited to the following examples. Each reagent and each measuring apparatus used in the examples are as follows.
[reagent]
DMF: dimethylformamide DMAP: N, N-dimethyl-4-aminopyridine EDCI: 1-ethyl-3- (3-dimethylaminopropyl) carbodiimide THF: tetrahydrofuran AIBN: 2,2′-azobisisobutyronitrile [GPC ]
Device: Shodex GPC-101 (manufactured by Showa Denko KK)
Column: Two Shodex KF-804l (Showa Denko Co., Ltd.)
Column temperature: 40 ° C
Solvent: THF 1 mL / min Detector: UV (254 nm), RI
Calibration curve: Standard polystyrene [ 1 H-NMR]
Equipment: JEOL ECA-500 and ECA-600
[TG-DTA]
Equipment: Seiko Instruments Inc. TG / DTA 6200
[Scanning Electron Microscope (SEM)]
Device: JSM-7400F (manufactured by JEOL Ltd.)
[1]芳香族ポリアミドの合成
[実施例1]芳香族ポリアミド1の合成
(1)化合物1の合成
200mLナスフラスコに、3−アミノ安息香酸エチル20.0015g(0.106mol)、アセトニトリル13mL(0.249mol)及び乾燥エタノール132mLを加え、室温で1時間攪拌した。その後、5%パラジウム炭素2.00gを加え、水素雰囲気下で6日間攪拌した。塩化メチレンを加えてからセライトを用いてろ過し、減圧下で溶媒を留去した後、粗生成物を再結晶(良溶媒:塩化メチレン、貧溶媒:ヘキサン)し、化合物1を白色固体として得た(収量18.8231g、収率80%)。TG−DTA測定の結果、化合物1の融点は、48.8−51.9℃であった。1H−NMR測定の結果を以下に示す。
1H-NMR (600MHz, CDCl3) δ 7.36 (d, J=7.6Hz, 1H), 7.27 (s, 1H), 7.22 (t, J=7.9Hz, 1H), 6.77 (d, J=7.9Hz, 1H), 4.35 (q, J=7.2Hz, 2H), 3.67 (br s, 1H), 3.20 (q, J=7.2Hz, 2H), 1.38 (t, J=7.2Hz, 3H), 1.26 (t, J=7.2 Hz, 3H).
To a 200 mL eggplant flask, 20.0015 g (0.106 mol) of ethyl 3-aminobenzoate, 13 mL (0.249 mol) of acetonitrile and 132 mL of dry ethanol were added and stirred at room temperature for 1 hour. Thereafter, 2.00 g of 5% palladium carbon was added and stirred for 6 days under a hydrogen atmosphere. After adding methylene chloride and filtering through celite, and distilling off the solvent under reduced pressure, the crude product was recrystallized (good solvent: methylene chloride, poor solvent: hexane) to obtain Compound 1 as a white solid. (Yield 18.8231 g, Yield 80%). As a result of TG-DTA measurement, the melting point of Compound 1 was 48.8-51.9 ° C. The results of 1 H-NMR measurement are shown below.
1 H-NMR (600MHz, CDCl 3 ) δ 7.36 (d, J = 7.6Hz, 1H), 7.27 (s, 1H), 7.22 (t, J = 7.9Hz, 1H), 6.77 (d, J = 7.9Hz , 1H), 4.35 (q, J = 7.2Hz, 2H), 3.67 (br s, 1H), 3.20 (q, J = 7.2Hz, 2H), 1.38 (t, J = 7.2Hz, 3H), 1.26 ( t, J = 7.2 Hz, 3H).
(2)化合物2の合成
50mLナスフラスコに、4−ビニル安息香酸を2.5016g(16.9mmol)及びフェノール1.7142g(18.2mmol)を加えた。別途用意した30mLナスフラスコに、乾燥DMF15mL及びDMAP2.3020g(18.8mmol)を加え、前記50mLナスフラスコに加えた。0℃で20分間攪拌し、EDCI4.2065g(21.9mmol)を加え、再び0℃で16時間攪拌した。その後、室温で22時間攪拌し、水を加えて反応を停止し、ジエチルエーテルで3回抽出した後、有機相を1mol/L塩酸で1回、飽和炭酸水素ナトリウム水溶液で1回、更に飽和塩化ナトリウム水溶液で1回洗浄した。その後、無水硫酸マグネシウムで乾燥してろ過し、減圧下で溶媒を留去して、化号物2を白色固体として得た(粗収量3.168g、粗収率95%)。TG−DTA測定の結果、化合物2の融点は、94.7−97.9℃であった。1H−NMR測定の結果を以下に示す。
1H-NMR (600MHz, CDCl3) δ 8.16 (d, J=8.2Hz, 2H), 7.53 (d, J=8.2 Hz, 2H), 7.43 (t, J=7.9Hz, 2H), 7.27 (t, J=7.6Hz, 1H), 7.22 (d J=8.2Hz, 2H), 6.79 (dd, J=17.9 and 11.0Hz, 1H), 5.91 (d, J=17.5Hz, 1H), 5.43 (d, J=11.0 Hz, 1H).
To a 50 mL eggplant flask, 2.516 g (16.9 mmol) of 4-vinylbenzoic acid and 1.7142 g (18.2 mmol) of phenol were added. To a separately prepared 30 mL eggplant flask, 15 mL of dry DMF and 2.3020 g (18.8 mmol) of DMAP were added and added to the 50 mL eggplant flask. The mixture was stirred at 0 ° C for 20 minutes, 4.2065 g (21.9 mmol) of EDCI was added, and the mixture was stirred again at 0 ° C for 16 hours. Then, the mixture was stirred at room temperature for 22 hours, water was added to stop the reaction, and the mixture was extracted three times with diethyl ether. The organic phase was extracted once with 1 mol / L hydrochloric acid, once with a saturated aqueous sodium bicarbonate solution, and further saturated with chloride. Washed once with aqueous sodium solution. Then, it dried with anhydrous magnesium sulfate and filtered, and the solvent was distilled off under reduced pressure to obtain Compound 2 as a white solid (crude yield 3.168 g, crude yield 95%). As a result of TG-DTA measurement, the melting point of Compound 2 was 94.7-97.9 ° C. The results of 1 H-NMR measurement are shown below.
1 H-NMR (600MHz, CDCl 3 ) δ 8.16 (d, J = 8.2Hz, 2H), 7.53 (d, J = 8.2 Hz, 2H), 7.43 (t, J = 7.9Hz, 2H), 7.27 (t , J = 7.6Hz, 1H), 7.22 (d J = 8.2Hz, 2H), 6.79 (dd, J = 17.9 and 11.0Hz, 1H), 5.91 (d, J = 17.5Hz, 1H), 5.43 (d, J = 11.0 Hz, 1H).
(3)化合物3の合成
50mLナスフラスコを減圧下、ヒートガンで加熱乾燥した後にアルゴン置換を行い室温に戻した。窒素気流下で、1mol/L LiHMDSのTHF溶液11.2mL(11.2mmol)を加え、0℃で20分間攪拌した。乾燥THF5.2mLに溶かした化合物2 0.4007g(2.02mmol)を加え、窒素気流下で乾燥THF12.6mLに溶かした化合物1 1.9408g(10.0mmol)を1時間かけて滴下し加えた。0℃で5時間攪拌し、飽和塩化アンモニウム水溶液を加えて反応を停止し、塩化メチレンで3回抽出した後、有機相を水で3回洗浄し、無水硫酸マグネシウムで乾燥してろ過後、減圧下で溶媒を留去して、化合物3を薄黄色固体として得た(粗収量2.0631g、粗収率88%)。GPC測定の結果、Mn=1,200、分散度(Mw/Mn)=1.17であった。 The 50 mL eggplant flask was heated and dried with a heat gun under reduced pressure, and then purged with argon and returned to room temperature. Under a nitrogen stream, 11.2 mL (11.2 mmol) of 1 mol / L LiHMDS in THF was added and stirred at 0 ° C. for 20 minutes. Compound 2 (0.407 g, 2.02 mmol) dissolved in 5.2 mL of dry THF was added, and 1.9408 g (10.0 mmol) of Compound 1 dissolved in 12.6 mL of dry THF was added dropwise over 1 hour under a nitrogen stream. . The mixture was stirred at 0 ° C. for 5 hours, quenched with saturated aqueous ammonium chloride solution, extracted with methylene chloride three times, the organic phase washed with water three times, dried over anhydrous magnesium sulfate, filtered, and reduced in pressure. The solvent was distilled off under reduced pressure to obtain compound 3 as a pale yellow solid (crude yield 2.0631 g, crude yield 88%). As a result of GPC measurement, Mn = 1,200 and dispersity (Mw / Mn) = 1.17.
(4)芳香族ポリアミド1の合成
耐圧反応管に、乾燥トルエン15mL、3−(トリメトキシシリル)−1−プロパンチオール0.29mL(1.52mmol)、化合物3 0.4509g(0.153mmol)及びAIBN12.6mg(0.0767mmol)を加え、凍結脱気を4回行った。60℃で2日攪拌した後、減圧下で溶媒を留去して、黄色粘性液体を得た(粗収量0.7503g、粗収率155%)。粗生成物を沈殿精製し(良溶媒:塩化メチレン、貧溶媒:ヘキサン)、芳香族ポリアミド1を薄黄色固体として得た(収量0.3941g、収率82%)。GPC測定の結果、Mn=2,100、Mw/Mn=1.14であった。1H−NMR測定の結果を以下に示す。
1H-NMR (600MHz, CDCl3) δ 7.84 (d, J=7.9Hz, 1H), 7.73 (s, 1H), 7.29 (q, J=7.9Hz, 1H), 7.18 (t, J=7.9Hz, 1H), 4.35 (q, J=7.2Hz, 2H), 3.68 (s, 2nH), 3.54 (s, 9H), 2.76 (t, J=7.7Hz, 2H), 2.63 (t, J=7.9Hz, 2H), 2.50 (t, J=7.2Hz, 2H), 1.66 (quint, J=7.6Hz, 2H), 1.34 (t, J=7.2Hz, 3H), 1.00-0.84 (m, 3nH), 0.72 (t, J=8.1Hz, 2H).
In a pressure-resistant reaction tube, 15 mL of dry toluene, 0.29 mL (1.52 mmol) of 3- (trimethoxysilyl) -1-propanethiol, 0.4509 g (0.153 mmol) of Compound 3 and 12.6 mg (0.0767 mmol) of AIBN were added. In addition, freeze deaeration was performed 4 times. After stirring at 60 ° C. for 2 days, the solvent was distilled off under reduced pressure to obtain a yellow viscous liquid (crude yield 0.7503 g, crude yield 155%). The crude product was purified by precipitation (good solvent: methylene chloride, poor solvent: hexane) to obtain aromatic polyamide 1 as a light yellow solid (yield 0.3941 g, yield 82%). As a result of the GPC measurement, Mn = 2,100 and Mw / Mn = 1.14. The results of 1 H-NMR measurement are shown below.
1 H-NMR (600MHz, CDCl 3 ) δ 7.84 (d, J = 7.9Hz, 1H), 7.73 (s, 1H), 7.29 (q, J = 7.9Hz, 1H), 7.18 (t, J = 7.9Hz , 1H), 4.35 (q, J = 7.2Hz, 2H), 3.68 (s, 2nH), 3.54 (s, 9H), 2.76 (t, J = 7.7Hz, 2H), 2.63 (t, J = 7.9Hz , 2H), 2.50 (t, J = 7.2Hz, 2H), 1.66 (quint, J = 7.6Hz, 2H), 1.34 (t, J = 7.2Hz, 3H), 1.00-0.84 (m, 3nH), 0.72 (t, J = 8.1Hz, 2H).
[実施例2]芳香族ポリアミド2の合成
(1)化合物4の合成
500mLナスフラスコに、乾燥THF150mL、4−アミノ安息香酸メチル11.3422g(75.0mmol)、オクタナール10.5mL(67.3mmol)、ナトリウムトリアセトキシボロヒドリド23.8462g(113mmol)及び酢酸8.6mL(150mmol)を加え、室温で3日間攪拌した。その後、飽和炭酸水素ナトリウム水溶液を加えて反応を停止し、酢酸エチルで3回抽出した後、飽和塩化ナトリウム水溶液で3回洗浄した。無水硫酸マグネシウムで乾燥した後ろ過し、減圧下で溶媒を留去し、粗生成物を白色固体として得た(粗収量18.3628g、粗収率93%)。粗生成物を再結晶(メタノール)し、化合物4を白色固体として得た(収量9.0872g、収率46%)。TG−DTA測定の結果、化合物4の融点は、88.6−91.8℃であった。1H−NMR測定の結果を以下に示す。
1H-NMR (500MHz, CDCl3) δ 7.85 (d, J=8.6Hz, 2H), 6.53 (d, J=8.9Hz, 2H), 4.08 (br s, 1H), 3.84 (s, 3H), 3.15 (q, J=6.1Hz, 2H), 1.62 (quint, J=7.2Hz, 2H), 1.39 (quint, J=7.6Hz, 2H), 1.40-1.26 (m, 8H), 0.89 (t, J=7.0Hz, 3H).
In a 500 mL eggplant flask, dry THF 150 mL, methyl 4-aminobenzoate 113.422 g (75.0 mmol), octanal 10.5 mL (67.3 mmol), sodium triacetoxyborohydride 23.8462 g (113 mmol) and acetic acid 8.6 mL ( 150 mmol) was added and stirred at room temperature for 3 days. Thereafter, the reaction was stopped by adding a saturated aqueous sodium hydrogen carbonate solution, extracted three times with ethyl acetate, and then washed three times with a saturated aqueous sodium chloride solution. After drying over anhydrous magnesium sulfate, filtration was performed, and the solvent was distilled off under reduced pressure to obtain a crude product as a white solid (crude yield 18.3628 g, crude yield 93%). The crude product was recrystallized (methanol) to obtain compound 4 as a white solid (yield 9.0872 g, yield 46%). As a result of TG-DTA measurement, the melting point of Compound 4 was 88.6-91.8 ° C. The results of 1 H-NMR measurement are shown below.
1 H-NMR (500MHz, CDCl 3 ) δ 7.85 (d, J = 8.6Hz, 2H), 6.53 (d, J = 8.9Hz, 2H), 4.08 (br s, 1H), 3.84 (s, 3H), 3.15 (q, J = 6.1Hz, 2H), 1.62 (quint, J = 7.2Hz, 2H), 1.39 (quint, J = 7.6Hz, 2H), 1.40-1.26 (m, 8H), 0.89 (t, J = 7.0Hz, 3H).
(2)化合物5の合成
50mLナスフラスコを減圧下、ヒートガンで加熱乾燥し、アルゴンで置換した後に室温に戻した。窒素気流下で、1mol/L LiHMDSのTHF溶液5.2mL(5.2mmol)を加え、−10℃で45分間攪拌した。50mLナシフラスコに化合物4 1.3250g(5.03mmol)、化合物2 0.1015g(0.512mmol)及び乾燥THF5.2mLを加え、窒素気流下で先程の50mLナスフラスコに加えた。−10℃で4時間攪拌し、飽和塩化アンモニウム水溶液を加えて反応を停止し、塩化メチレンで3回抽出した後、有機相を1mol/L水酸化ナトリウム水溶液で3回洗浄し、無水硫酸マグネシウムで乾燥してろ過後、減圧下で溶媒を留去して、化合物3を含む黄色粘性液体を得た(粗収量1.1919g、粗収率84%)。GPC測定の結果、Mn=3,300、Mw/Mn=1.08であった。 The 50 mL eggplant flask was heated and dried with a heat gun under reduced pressure, replaced with argon, and returned to room temperature. Under a nitrogen stream, 5.2 mL (5.2 mmol) of 1 mol / L LiHMDS in THF was added and stirred at −10 ° C. for 45 minutes. To a 50 mL pear flask were added 1.3250 g (5.03 mmol) of Compound 4, 0.115 g (0.512 mmol) of Compound 2, and 5.2 mL of dry THF, and the mixture was added to the previous 50 mL eggplant flask under a nitrogen stream. The mixture was stirred at −10 ° C. for 4 hours, quenched with a saturated aqueous ammonium chloride solution, extracted three times with methylene chloride, and then the organic phase was washed three times with a 1 mol / L aqueous sodium hydroxide solution and washed with anhydrous magnesium sulfate. After drying and filtration, the solvent was distilled off under reduced pressure to obtain a yellow viscous liquid containing Compound 3 (crude yield 1.1919 g, crude yield 84%). As a result of the GPC measurement, Mn = 3,300 and Mw / Mn = 1.08.
(3)芳香族ポリアミド2の合成
耐圧反応管に、乾燥トルエン8mL、3−(トリメトキシシリル)−1−プロパンチオール0.2mL(1.07mmol)、化合物5 0.3238g(0.0952mmol)及びAIBN7.83mg(0.0477mmol)を加え、凍結脱気を3回行った。60℃で22時間攪拌した後、減圧下で溶媒を除去して、薄黄色粘性液体を得た(粗収量0.5678g、粗収率165%)。粗生成物を沈殿精製し(良溶媒:ジエチルエーテル、貧溶媒:ヘキサン)、芳香族ポリアミド2を薄黄色固体として得た(収量0.0289g、収率8%)。1H−NMR測定の結果を以下に示す。
1H-NMR (600MHz, CDCl3) δ 7.08-6.91 (m, 1nH), 6.76-6.69 (m, 1mH), 3.77 (s, 3H), 3.78-3.73 (m, 2nH), 3.50 (s, 9H), 2.73 (s, 2H), 2.62 (s, 2H), 2.47 (q, J=7.4Hz, 2H), 1.65 (quint, J=8.0Hz 2H), 1.43 (s, 2nH), 1.28-1.11 (m, 10nH), 0.79 (t, J = 6.8 Hz 3nH), 0.68 (t, J=8.2Hz, 2H).
In a pressure-resistant reaction tube, dry toluene 8 mL, 3- (trimethoxysilyl) -1-propanethiol 0.2 mL (1.07 mmol), compound 5 0.3238 g (0.0952 mmol) and AIBN 7.83 mg (0.0477 mmol) were added. In addition, freeze deaeration was performed three times. After stirring at 60 ° C. for 22 hours, the solvent was removed under reduced pressure to obtain a pale yellow viscous liquid (crude yield 0.5678 g, crude yield 165%). The crude product was purified by precipitation (good solvent: diethyl ether, poor solvent: hexane) to obtain aromatic polyamide 2 as a pale yellow solid (yield 0.0289 g, yield 8%). The results of 1 H-NMR measurement are shown below.
1 H-NMR (600MHz, CDCl 3 ) δ 7.08-6.91 (m, 1nH), 6.76-6.69 (m, 1mH), 3.77 (s, 3H), 3.78-3.73 (m, 2nH), 3.50 (s, 9H ), 2.73 (s, 2H), 2.62 (s, 2H), 2.47 (q, J = 7.4Hz, 2H), 1.65 (quint, J = 8.0Hz 2H), 1.43 (s, 2nH), 1.28-1.11 ( m, 10nH), 0.79 (t, J = 6.8 Hz 3nH), 0.68 (t, J = 8.2Hz, 2H).
[2]芳香族ポリアミド修飾シリカゾルの作製
[実施例3−1]芳香族ポリアミド修飾シリカゾル1の作製
耐圧反応管に、芳香族ポリアミド1 0.1247g(0.0584mmol)、メチルエチルケトン1.9mL及びメチルエチルケトン−シリカゾル溶液(MEK−ST−40、日産化学工業(株)製)0.5010g(シリカ含有量:0.2004g)を加えた。60℃で5時間攪拌した後、減圧下で溶媒を留去して、芳香族ポリアミド修飾シリカゾル1を褐色粘性固体として得た(粗収量0.369g)。
[2] Preparation of aromatic polyamide-modified silica sol [Example 3-1] Preparation of aromatic polyamide-modified silica sol 1 In a pressure resistant reaction tube, 0.1247 g (0.0584 mmol) of aromatic polyamide 1, 1.9 mL of methyl ethyl ketone and methyl ethyl ketone- Silica sol solution (MEK-ST-40, manufactured by Nissan Chemical Industries, Ltd.) 0.5010 g (silica content: 0.204 g) was added. After stirring at 60 ° C. for 5 hours, the solvent was distilled off under reduced pressure to obtain aromatic polyamide-modified silica sol 1 as a brown viscous solid (crude yield 0.369 g).
[実施例3−2]シリカゾル溶液(Z1)の作製
芳香族ポリアミド修飾シリカゾル1 0.30gをDMAc2.7gに加え、10質量%シリカゾル溶液(Z1)を作製した。
[Example 3-2] Preparation of silica sol solution (Z1) 0.30 g of aromatic polyamide-modified silica sol 1 was added to 2.7 g of DMAc to prepare a 10 mass% silica sol solution (Z1).
[実施例3−3]芳香族ポリアミド修飾シリカゾル2の作製
芳香族ポリアミド2を用いた以外は、実施例3−1と同様の方法で芳香族ポリアミド修飾シリカゾルを褐色粘性固体として得た。
[Example 3-3] Preparation of aromatic polyamide-modified silica sol 2 An aromatic polyamide-modified silica sol was obtained as a brown viscous solid in the same manner as in Example 3-1, except that aromatic polyamide 2 was used.
[実施例3−4]シリカゾル溶液(Z2)の作製
芳香族ポリアミド修飾シリカゾル2 0.30gをDMAc2.7gに加え、10質量%シリカゾル溶液(Z2)を作製した。
[Example 3-4] Preparation of silica sol solution (Z2) 0.30 g of aromatic polyamide-modified silica sol 2 was added to 2.7 g of DMAc to prepare a 10 mass% silica sol solution (Z2).
[3]ポリアミック酸の合成
[合成例1]ポリアミック酸(S1)の合成
p−フェニレンジアミン3.248g(30mmol)を、DMAc88gに溶解させた。得られた溶液に3,3',4,4'−ビフェニルテトラカルボン酸二無水物8.751g(30mmol)を加え、窒素雰囲気下、23℃で24時間反応させた。GPC測定の結果、得られたポリアミック酸の重量平均分子量(Mw)は27,300、Mw/Mnは2.6であった。
[3] Synthesis of polyamic acid [Synthesis Example 1] Synthesis of polyamic acid (S1) 3.248 g (30 mmol) of p-phenylenediamine was dissolved in 88 g of DMAc. To the obtained solution, 8.751 g (30 mmol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride was added and reacted at 23 ° C. for 24 hours under a nitrogen atmosphere. As a result of GPC measurement, the weight average molecular weight (Mw) of the obtained polyamic acid was 27,300, and Mw / Mn was 2.6.
[合成例2]ポリアミック酸(S2)の合成
2,2'−ビス(トリフルオロメチル)ベンジジン5.962g(19mmol)を、DMAc88gに溶解させた。得られた溶液に3,3',4,4'−ビフェニルテトラカルボン酸二無水物4.382g(15mmol)及び4,4'−(ヘキサフルオロイソプロピリデン)ジフタル酸無水物1.654(4mmol)を加え、窒素雰囲気下、23℃で24時間反応させた。GPC測定の結果、得られたポリアミック酸のMwは17,000、Mw/Mnは2.3であった。
[Synthesis Example 2] Synthesis of polyamic acid (S2) 2,962 g (19 mmol) of 2,2′-bis (trifluoromethyl) benzidine was dissolved in 88 g of DMAc. To the resulting solution was added 3.382 g (15 mmol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and 4.654 (4 mmol) of 4,4 ′-(hexafluoroisopropylidene) diphthalic anhydride. And reacted at 23 ° C. for 24 hours under a nitrogen atmosphere. As a result of GPC measurement, Mw of the obtained polyamic acid was 17,000, and Mw / Mn was 2.3.
[合成例3]ポリアミック酸(S3)の合成
ジアミノジフェニルエーテル 3.867g(19mmol)をDMAc32gに溶解させた。得られた溶液にピロメリット酸二無水物4.133g(19mmol)を加え、窒素雰囲気下、23℃で24時間反応させた。GPC測定の結果、得られたポリアミック酸のMwは28,000、Mw/Mnは2.1であった。
[Synthesis Example 3] Synthesis of polyamic acid (S3) 3.867 g (19 mmol) of diaminodiphenyl ether was dissolved in 32 g of DMAc. To the resulting solution, 4.133 g (19 mmol) of pyromellitic dianhydride was added and reacted at 23 ° C. for 24 hours under a nitrogen atmosphere. As a result of GPC measurement, Mw of the obtained polyamic acid was 28,000, and Mw / Mn was 2.1.
[4]ハイブリッドフィルムの作製及びその評価
[実施例4−1]
ポリアミック酸(S1)6.0gに、シリカゾル溶液(Z1)0.90gを添加し、23℃で3時間攪拌してワニスを調製した。その後、ガラス基板上に、前記ワニスをバーコータで塗布し、膜厚250μmの塗布膜を作製し、80℃で1時間、300℃で1時間焼成した。
得られたフィルムに白濁はなく、黄色の綺麗なフィルムであった。また、このフィルムをカッターでガラス基板から剥離したところ、容易に剥離した。剥離したフィルムは、強い自己支持性が見られた。
[4] Production of hybrid film and evaluation thereof [Example 4-1]
To 6.0 g of polyamic acid (S1), 0.90 g of silica sol solution (Z1) was added and stirred at 23 ° C. for 3 hours to prepare a varnish. Thereafter, the varnish was applied onto a glass substrate with a bar coater to prepare a coating film having a thickness of 250 μm, and baked at 80 ° C. for 1 hour and at 300 ° C. for 1 hour.
The obtained film had no cloudiness and was a beautiful yellow film. Moreover, when this film was peeled from the glass substrate with a cutter, it was easily peeled off. The peeled film showed strong self-supporting properties.
[実施例4−2]
ポリアミック酸(S1)の使用量を2.4gとした以外は、実施例4−1と同様の条件でワニスとフィルムを作製した。得られたフィルムに白濁はなく、黄色の綺麗なフィルムであった。また、このフィルムをカッターでガラス基板から剥離したところ、容易に剥離した。剥離したフィルムは、強い自己支持性が見られた。
[Example 4-2]
A varnish and a film were produced under the same conditions as in Example 4-1, except that the amount of polyamic acid (S1) used was 2.4 g. The obtained film had no cloudiness and was a beautiful yellow film. Moreover, when this film was peeled from the glass substrate with a cutter, it was easily peeled off. The peeled film showed strong self-supporting properties.
[実施例4−3]
ポリアミック酸(S1)のかわりにポリアミック酸(S2)2.4gを使用した以外は、実施例4−1と同様の条件でワニスとフィルムを作製した。得られたフィルムに白濁はなく、黄色の綺麗なフィルムであった。また、このフィルムをカッターでガラス基板から剥離したところ、容易に剥離した。剥離したフィルムは、強い自己支持性が見られた。
[Example 4-3]
A varnish and a film were produced under the same conditions as in Example 4-1, except that 2.4 g of polyamic acid (S2) was used instead of polyamic acid (S1). The obtained film had no cloudiness and was a beautiful yellow film. Moreover, when this film was peeled from the glass substrate with a cutter, it was easily peeled off. The peeled film showed strong self-supporting properties.
[実施例4−4]
焼成条件を80℃で1時間、230℃で1時間焼成した以外は、実施例4−2と同様の条件でワニスとフィルムを作製した。得られたフィルムに白濁はなく、黄色の綺麗なフィルムであった。また、このフィルムをカッターでガラス基板から剥離したところ、容易に剥離した。剥離したフィルムは、強い自己支持性が見られた。
[Example 4-4]
A varnish and a film were produced under the same conditions as in Example 4-2, except that the baking was performed at 80 ° C. for 1 hour and at 230 ° C. for 1 hour. The obtained film had no cloudiness and was a beautiful yellow film. Moreover, when this film was peeled from the glass substrate with a cutter, it was easily peeled off. The peeled film showed strong self-supporting properties.
[実施例4−5]
ポリアミック酸(S1)のかわりにポリアミック酸(S3)3.0gを使用し、シリカゾル溶液(Z1)のかわりにシリカゾル溶液(Z2)0.90gを使用した以外は、実施例4−1と同様の条件でワニスとフィルムを作製した。得られたフィルムに白濁はなく、黄色の綺麗なフィルムであった。また、このフィルムをカッターでガラス基板から剥離したところ、容易に剥離した。剥離したフィルムは、強い自己支持性が見られた。
[Example 4-5]
The same as Example 4-1 except that 3.0 g of polyamic acid (S3) was used instead of polyamic acid (S1) and 0.90 g of silica sol solution (Z2) was used instead of silica sol solution (Z1). A varnish and a film were prepared under the conditions. The obtained film had no cloudiness and was a beautiful yellow film. Moreover, when this film was peeled from the glass substrate with a cutter, it was easily peeled off. The peeled film showed strong self-supporting properties.
[実施例4−6]
ポリアミック酸(S1)の使用量を0.8gとした以外は、実施例4−1と同様の条件でワニスとフィルムを作製した。得られたフィルムに白濁はなく、黄色の綺麗なフィルムであった。また、このフィルムをカッターでガラス基板から剥離したところ、容易に剥離した。剥離したフィルムは、強い自己支持性が見られた。また、断面をSEMで確認した結果、膜全体にゾルが綺麗に分散していた。SEM像を図1に示す。
[Example 4-6]
A varnish and a film were produced under the same conditions as in Example 4-1, except that the amount of polyamic acid (S1) used was 0.8 g. The obtained film had no cloudiness and was a beautiful yellow film. Moreover, when this film was peeled from the glass substrate with a cutter, it was easily peeled off. The peeled film showed strong self-supporting properties. Moreover, as a result of confirming the cross section by SEM, the sol was dispersed finely throughout the film. An SEM image is shown in FIG.
[比較調製例1]ゾル溶液(HZ1)の作製
MEK−ST−40ゾル溶液50g(シリカ含有量:20g)に、DMAc30gを加え、エバポレータを用いて、メチルエチルケトンの留去を行い、表面未修飾ゾル溶液(HZ1)を作製した。
[Comparative Preparation Example 1] Preparation of sol solution (HZ1) To 30 g of MEK-ST-40 sol solution (silica content: 20 g), 30 g of DMAc was added and methyl ethyl ketone was distilled off using an evaporator to remove the surface unmodified sol A solution (HZ1) was prepared.
[比較例1]
ポリアミック酸(S1)10.0gに、ゾル溶液(HZ1)0.3gを添加し、23℃で3時間攪拌してワニスを調製した。その後、ガラス基板上に、このワニスをバーコータで塗布し、膜厚250μmの塗布膜を作製し、80℃で1時間、300℃で1時間焼成した。
得られたフィルムに白濁はなく、黄色の綺麗なフィルムであったが、剥離はできなかった。
[Comparative Example 1]
To 10.0 g of polyamic acid (S1), 0.3 g of the sol solution (HZ1) was added and stirred at 23 ° C. for 3 hours to prepare a varnish. Then, this varnish was apply | coated with the bar coater on the glass substrate, the coating film with a film thickness of 250 micrometers was produced, and it baked at 80 degreeC for 1 hour and 300 degreeC for 1 hour.
The obtained film had no cloudiness and was a beautiful yellow film, but could not be peeled off.
[比較例2]
ゾル溶液(HZ1)の使用量を3gとした以外は、比較例2と同様にワニスとフィルムを作製した。得られたフィルムは、白濁しており、剥離はできなかった。
[Comparative Example 2]
A varnish and a film were produced in the same manner as in Comparative Example 2 except that the amount of the sol solution (HZ1) used was 3 g. The obtained film was cloudy and could not be peeled off.
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