JP2018113337A - Component mounting system, component mounting method, and correction value calculation device - Google Patents

Abstract

An object of the present invention is to provide a component mounting system, a component mounting method, and a correction value calculation device capable of accurately correcting a component mounting position shift due to the influence of fluctuation caused by a suction nozzle. A component mounting step (ST2) in which a component is rotated by a suction nozzle and mounted on a substrate, and a displacement amount acquisition step (ST10) for acquiring a displacement amount from a normal position of the component mounted on the substrate. And a correction value calculating step (ST7) for calculating a feedback correction value for correcting the mounting operation in the component mounting step (ST2) based on the acquired positional deviation amount. Then, in the correction value calculation step (ST7), a feedback correction value is calculated from the amount of displacement of the component mounted on the substrate for each suction nozzle and for each predetermined rotation angle, and in the component mounting step (ST2) The mounting operation is corrected using the feedback correction value of the predetermined rotation angle of the suction nozzle that mounts. [Selection] Figure 11

Description

  The present invention relates to a component mounting system and a component mounting method for mounting a component on a board using a feedback correction value calculated based on a positional deviation amount of the component mounted on the board, and a correction value calculating device for calculating a feedback correction value. It is about.

  In the component mounting apparatus, components supplied by the component supply device are taken out and mounted on a substrate by a suction nozzle provided in a mounting head that moves in the horizontal direction by an XY beam including an X-axis beam and a Y-axis beam. Conventionally, in order to improve the mounting accuracy of mounting components on the board, the mounting position deviation from the normal position of the component mounted on the board is inspected with an inspection device etc., and the feedback correction calculated based on the mounting position deviation amount The mounting operation of the component mounting apparatus is corrected using the value (see, for example, Patent Document 1).

  In the component mounting system of Patent Document 1, a mounting position deviation amount is detected for each component mounted on a substrate by an inspection device arranged downstream of the component mounting device, and a feedback correction value calculated for each component is used. The mounting operation in the component mounting apparatus is corrected.

JP 2016-58603 A

  However, in the prior art including Patent Document 1, the mounting position deviation is fed back for each component mounted on the substrate. However, the cause of the component mounting position deviation is the difference in the mounting angle of the suction nozzle or the suction nozzle. The part due to various fluctuations in the components of the component mounting apparatus, such as distortion, is large, and there is a problem that there is room for further improvement in order to improve mounting accuracy.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a component mounting system, a component mounting method, and a correction value calculation device that can accurately correct a mounting position shift of a component due to the influence of fluctuation caused by a suction nozzle.

  A component mounting system according to the present invention includes a plurality of suction nozzles, a component mounting unit that mounts the component on the substrate by rotating the component in a rotation direction parallel to a mounting surface of the substrate by the suction nozzle, and a substrate by the component mounting unit A mounting control means for controlling a mounting operation for mounting the component on the board, a positional deviation amount acquiring means for acquiring a positional deviation amount from a normal position of the component mounted on the board by the component mounting means, and the positional deviation amount acquiring means. Correction value calculation means for calculating a feedback correction value for correcting the mounting operation of the component mounting means based on the amount of positional deviation acquired by the correction value calculation means for each suction nozzle and a predetermined value. The feedback correction value is calculated from the amount of positional deviation of the component mounted on the board at each rotation angle, and the mounting control means mounts the component Correcting the mounting operation by the component mounting device with a serial the feedback correction value of the predetermined rotational angle of the suction nozzle.

  The component mounting method of the present invention includes a component mounting step of mounting a component on the substrate by rotating the component in a rotation direction parallel to the mounting surface of the substrate by the suction nozzle, and a normal position of the component mounted on the substrate in the component mounting step. And a correction value for calculating a feedback correction value for correcting a mounting operation in the component mounting process based on the positional deviation amount acquired in the positional deviation amount acquisition step. Calculating the feedback correction value from the amount of displacement of the component mounted on the substrate for each suction nozzle and for each predetermined rotation angle in the correction value calculating step, In the component mounting process, the mounting operation is corrected using the feedback correction value of the predetermined rotation angle of the suction nozzle for mounting the component. That.

  The correction value calculation apparatus of the present invention is a position from a normal position of a component mounted on a substrate by component mounting means for rotating the component in a rotational direction parallel to the mounting surface of the substrate by a plurality of suction nozzles. A correction value calculation unit is provided that calculates a feedback correction value for correcting the mounting operation of the component mounting means for each suction nozzle and for each predetermined rotation angle based on the deviation amount.

  According to the present invention, it is possible to accurately correct a component mounting position shift due to the influence of fluctuation caused by the suction nozzle.

Configuration explanatory diagram of a component mounting system according to an embodiment of the present invention The top view which shows the structure of the component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the component mounting apparatus of one embodiment of the present invention Structure explanatory drawing of the mounting head and component supply part of the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting system of one embodiment of this invention Explanatory drawing of the amount of position shift of the component computed in the inspection device of one embodiment of the present invention (A) (b) Explanatory drawing which shows the example of the shape of the components mounted in a board | substrate in the component mounting apparatus of one embodiment of this invention (A) (b) Explanatory drawing which shows the example of the pocket of a carrier tape used in the component mounting apparatus of one embodiment of this invention, and the gap of components. (A) (b) Explanatory drawing of the influence on the position shift of a component by rotation of the suction nozzle in the component mounting apparatus of one embodiment of this invention (A) An explanatory diagram showing an example of a component mounted on an imaged board by an inspection apparatus according to an embodiment of the present invention. (B) An explanation showing a relationship between an example of a calculated misregistration amount and a feedback correction value. Figure The flowchart of the component mounting method in the component mounting system of one embodiment of this invention FIG. 3 is a flowchart of a feedback correction value calculation method in the management computer according to the embodiment of the present invention.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configuration, shape, and the like described below are illustrative examples, and can be appropriately changed according to the specifications of the component mounting system, the component mounting apparatus, and the inspection apparatus. Below, the same code | symbol is attached | subjected to the element which respond | corresponds in all the drawings, and the overlapping description is abbreviate | omitted. In FIG. 2 and a part to be described later, as a biaxial direction orthogonal to each other in a horizontal plane, an X direction (horizontal direction in FIG. 2) of the substrate transport direction and a Y direction (vertical direction in FIG. 2) orthogonal to the substrate transport direction. Is shown. In FIG. 3 and a part to be described later, the Z direction (vertical direction in FIG. 3) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane. In FIG. 4 and a part to be described later, the θ direction, which is the direction of rotation with the axis in the Z direction (Z axis) as the rotation axis, is shown.

  First, the configuration of the component mounting system 1 will be described with reference to FIG. The component mounting system 1 has a function of mounting a component on a substrate to manufacture a mounting substrate, and includes a solder printing device M1, component mounting devices M2 and M3, and an inspection device M4. These devices are connected to the management computer 3 via the communication network 2. The component mounting apparatuses M2 and M3 provided in the component mounting system 1 are not limited to two, and may be one or three or more.

  The solder printing apparatus M1 screen-prints cream solder for component joining on a substrate to be mounted. The component mounting apparatuses M2 and M3 perform a component mounting operation in which the component taken out from the component supply unit is transported and mounted on the board on which the cream solder for component bonding is printed by the component mounting unit 12 (see FIG. 2). The inspection device M4 inspects the mounting state of the component on the board on which the component is mounted by the component mounting devices M2 and M3, and detects a misalignment state from the normal position of the component. The management computer 3 calculates a feedback correction value Vc for correcting the mounting operation to be fed back to the component mounting apparatuses M2 and M3, based on the line management function and the inspection information including the amount of positional deviation of the component acquired by the inspection apparatus M4. It also has the function to do.

  Next, the configuration of the component mounting apparatuses M2 and M3 will be described with reference to FIGS. FIG. 3 partially shows the AA cross section in FIG. The component mounting apparatuses M2 and M3 have a function of executing a mounting operation for mounting a component supplied from a component supply unit on a substrate. In FIG. 2, a substrate transport mechanism 5 is disposed in the X direction in the center of the base 4. The substrate transport mechanism 5 carries the substrate 6 transported from the upstream side into the mounting work position and positions and holds it. Moreover, the board | substrate conveyance mechanism 5 carries out the board | substrate 6 in which component mounting operation was completed downstream.

  On both sides (front side, rear side) of the substrate transport mechanism 5, component supply units 7 are arranged. A plurality of tape feeders 8 are mounted in parallel on each component supply unit 7. The tape feeder 8 pitch-feeds a carrier tape having pockets for housing components from the outside of the component supply unit 7 toward the substrate transport mechanism 5 (tape feeding direction), thereby mounting the mounting head of the component mounting unit 12. Supplies the part to the part suction position where the part is picked up.

  A Y-axis beam 9 having a linear drive mechanism is disposed along the Y direction at both ends in the X direction on the upper surface of the base 4. Similarly, two (front side, rear side) X-axis beams 10 having linear drive mechanisms are coupled to the Y-axis beam 9 so as to be movable in the Y direction. The X-axis beam 10 is disposed along the X direction. A mounting head 11 is mounted on each of the two X-axis beams 10 so as to be movable in the X direction. The mounting head 11 includes a plurality of suction units 11a capable of moving up and down by sucking and holding components. A suction nozzle 11b (see FIG. 3) for sucking and holding components is attached to each lower end portion of the suction unit 11a.

  In FIG. 2, by driving the Y-axis beam 9 and the X-axis beam 10, the mounting head 11 moves in the X direction and the Y direction. As a result, the two mounting heads 11 pick up and pick up components from the component suction positions of the tape feeders 8 arranged in the corresponding component supply units 7 by the suction nozzles 11 b and are positioned on the substrate transport mechanism 5. Attach to the mounting point. That is, the Y-axis beam 9, the X-axis beam 10, and the mounting head 11 constitute a component mounting unit 12 that mounts components on the substrate 6. As described above, the component mounting apparatuses M2 and M3 include the two component mounting portions 12 on the front side and the rear side.

  A component recognition camera 13 is disposed between the component supply unit 7 and the board transport mechanism 5. When the mounting head 11 that picks up the component from the component supply unit 7 moves above the component recognition camera 13, the component recognition camera 13 captures the component held in the mounting head 11 and recognizes the holding posture of the component. To do. A substrate recognition camera 14 is attached to the plate 10a to which the mounting head 11 is attached. The board recognition camera 14 moves integrally with the mounting head 11.

  When the mounting head 11 moves, the substrate recognition camera 14 moves above the substrate 6 positioned by the substrate transport mechanism 5, images a substrate mark (not shown) provided on the substrate 6, and images the substrate 6. Recognize position. The board recognition camera 14 moves above the component suction position of the tape feeder 8 and recognizes the state of the carrier tape near the component suction position. In the component mounting operation on the substrate 6 by the mounting head 11, the mounting position is corrected in consideration of the component recognition result by the component recognition camera 13 and the substrate position recognition result by the substrate recognition camera 14.

  As shown in FIG. 3, a carriage 15 in which a plurality of tape feeders 8 are mounted in advance on a feeder base 15 a is set in the component supply unit 7. The position of the carriage 15 is fixed in the component supply unit 7 by clamping the feeder base 15a to the fixed base (not shown) provided on the base 4 by the clamp mechanism 15b. The carriage 15 holds a tape reel 17 for storing the carrier tape 16 holding the component D in a wound state. The carrier tape 16 pulled out from the tape reel 17 is pitch-fed by the tape feeder 8 to the component suction position by the suction nozzle 11b.

  Next, the configuration of the mounting head 11 will be described with reference to FIG. The mounting head 11 includes a plurality of suction units 11a, and each suction unit 11a includes a drive mechanism. By driving the drive mechanism, the suction nozzle 11b mounted at the lower end of each suction unit 11a is moved up and down (arrow b), and the suction nozzle 11b is rotated in the θ direction about the nozzle axis AN as a rotation axis (arrow c). ) Is possible.

  That is, the mounting head 11 serves as a component suction portion that mounts the component D by sucking the component D and rotating the component D at a predetermined angle in a rotation direction (θ direction) parallel to the mounting surface of the substrate 6. The component mounting unit 12 includes a component suction unit, and includes a plurality of suction nozzles 11b. The component D is mounted on the substrate 6 by rotating the component D in the rotation direction parallel to the mounting surface of the substrate 6 by the suction nozzle 11b. It becomes a component mounting means.

  Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. The management computer 3, the component mounting apparatuses M2 and M3, and the inspection apparatus M4 are connected via the communication network 2. The component mounting apparatuses M2 and M3 include a mounting control unit 20, a mounting storage unit 21, a component mounting unit 12, a display unit 22, an input unit 23, a recognition processing unit 24, and a communication unit 25. The mounting storage unit 21 stores mounting data 21a and correction value data 21b in addition to the mounting program for executing the component mounting operation described above.

  The mounting data 21a is data that is referred to when the component D is mounted on the substrate 6, and is the coordinates of the mounting position (normal position) of the component D on the substrate 6, the rotation angle of the component D when mounting, the mounting Information such as the type of component D to be processed is included. The correction value data 21b includes a feedback correction value Vc transmitted from the management computer 3 described later.

  The mounting control unit 20 is an arithmetic device such as a CPU, and controls each unit based on a program and data stored in the mounting storage unit 21 to perform a mounting operation for mounting the component D on the board 6 by the component mounting unit 12. Control. The recognition processing unit 24 detects the position of the substrate 6 by performing recognition processing on the imaging result obtained by the substrate recognition camera 14. In addition, the recognition processing unit 24 detects the position of the component D in the state held by the mounting head 11 by performing recognition processing on the imaging result obtained by the component recognition camera 13.

  The mounting control unit 20 mounts the mounting operation by the component mounting unit 12 based on the mounting data 21a, the correction value data 21b, the position of the board 6, the position of the component D held in the component mounting unit 12, and the feedback correction value Vc. Is corrected and the component D is mounted on the substrate 6. Further, the mounting control unit 20 mounts the component D held by the mounting head 11 (component suction unit) on the substrate 6 by rotating the component D by the rotation angle specified in the mounting data 21a. Thus, the mounting control unit 20 serves as a mounting control unit that controls the mounting operation of mounting the component D on the board 6 by the component mounting unit 12 (component mounting unit).

  The input unit 23 is an input device such as a keyboard, a touch panel, or a mouse, and is used when an operation command or data is input. The display unit 22 is a display device such as a liquid crystal panel, and displays various information such as various screens such as an operation screen for operation by the input unit 23. The communication unit 25 is a communication interface, and exchanges signals and data with the other component mounting apparatuses M2 and M3, the management computer 3, and the inspection apparatus M4 via the communication network 2.

  5, the inspection apparatus M4 includes an inspection control unit 30, an inspection storage unit 31, an inspection camera 32, a display unit 33, an input unit 34, and a communication unit 35. The inspection control unit 30 is an arithmetic device such as a CPU, and includes a positional deviation amount calculation unit 30a as an internal processing function. The inspection storage unit 31 is a storage device, and stores mounting data 31a, displacement data 31b, and the like. The mounting data 31a is data relating to the substrate 6 on which the component D is mounted, and the coordinates of the mounting position (normal position) of the component D on the substrate 6, the rotation angle of the component D when mounting, the mounted component D Contains information such as the type.

  The input unit 34 is an input device such as a keyboard, a touch panel, or a mouse, and is used when an operation command or data is input. The display unit 33 is a display device such as a liquid crystal panel, and displays various information such as various screens such as an operation screen for operation by the input unit 34. The communication unit 35 is a communication interface, and exchanges signals and data with the component mounting apparatuses M <b> 2 and M <b> 3 and the management computer 3 via the communication network 2.

  The inspection camera 32 images the component D mounted on the substrate 6 from above. The positional deviation amount calculation unit 30a calculates the positional deviation amounts ΔX, ΔY, Δθ (see FIG. 6) from the normal position N of the component D mounted on the substrate 6 from the image captured by the inspection camera 32. A deviation amount calculation process is executed. The calculated misregistration amounts ΔX, ΔY, Δθ are stored in the examination storage unit 31 as misregistration amount data 31 b and are transmitted to the management computer 3 via the communication unit 35.

  As described above, the inspection apparatus M4 includes the inspection camera 32 (imaging unit) that images the component D, and the positional deviation amounts ΔX, ΔY, Δθ from the normal position N of the component D from the image captured by the inspection camera 32. A positional deviation amount calculating section 30a for calculating the positional deviation amount ΔX, ΔY, Δθ from the normal position N of the component D mounted on the substrate 6 by the component mounting section 12 (component mounting means). It becomes a quantity acquisition means.

  Here, with reference to FIG. 6, an example of the positional shift amounts ΔX, ΔY, Δθ from the normal position N of the component D mounted on the board 6 included in the positional shift amount data 31b will be described. In the mounting operation by the component mounting unit 12, the component D taken out by the suction nozzle 11 b of the mounting head 11 from the tape feeder 8 of the component supply unit 7 is transferred with the target normal position N set on the substrate 6 as a target. Installed. At this time, the component center C of the component D does not necessarily coincide with the normal position N correctly, and the positional deviation amount ΔX in the X direction and the positional deviation amount ΔY, θ direction in the Y direction (rotation direction parallel to the mounting surface). The position is shifted by the amount of shift Δθ.

  The positional deviation amounts ΔX, ΔY, and Δθ are acquired by performing positional deviation amount calculation processing by the positional deviation amount calculation unit 30a on the result of imaging the component D mounted on the substrate 6 by the inspection camera 32. The positional deviation amounts ΔX, ΔY, Δθ are acquired for a plurality of components D mounted on one substrate 6 and stored as positional deviation amount data 31b.

  In FIG. 5, the management computer 3 includes a management control unit 40, a management storage unit 41, a display unit 42, an input unit 43, and a communication unit 44. The input unit 43 is an input device such as a keyboard, a touch panel, or a mouse, and is used when an operation command or data is input. The display unit 42 is a display device such as a liquid crystal panel, and displays various information such as various screens such as an operation screen for operation by the input unit 43. The communication unit 44 is a communication interface, and exchanges signals and data with the component mounting apparatuses M2 and M3 and the inspection apparatus M4 via the communication network 2.

  The management control unit 40 is an arithmetic device such as a CPU, and includes a correction value calculation unit 40a, a correction value transmission unit 40b, and a component selection unit 40c as internal processing functions. The management storage unit 41 is a storage device, and stores mounting data 41a, component information 41b, positional deviation amount data 41c, correction value data 41d, and the like.

  The mounting data 41a is data that is referred to when the component D is mounted on the substrate 6, and is the coordinates of the mounting position (normal position) of the component D on the substrate 6, the rotation angle of the component D when mounting, the mounting Information such as the type of component D to be processed is included. The component information 41b includes the shape and size of the component D mounted on the board 6, the gaps Gx and Gy (see FIG. 8) between the pocket 16b of the carrier tape 16 in which the component D is stored and the stored component D. Information is stored in association with the type of component D.

  Here, the shape of the component D included in the component information 41b will be described with reference to FIG. A plan view of the two types of parts D (1) and D (2) is shown in FIG. 7A, and a side view thereof is shown in FIG. 7B. The component D (1) and the component D (2) are two-terminal elements such as a resistor and a capacitor having electrodes Db at both ends in the X direction of the main body portion Da. The part D (1) and the part D (2) have the same size in the X direction and the Y direction in plan view, but the part D (1) has a wider interval between the electrodes Db. Therefore, the part D (1) has a wider suction surface Dc (XY surface of the main body Da) with which the lower end of the suction nozzle 11b comes into contact, and is normal even when the positions of the suction nozzle 11b and the part D are shifted during component suction. The allowable range for the adsorption position deviation that can be adsorbed on the substrate is wide.

  Further, the step Dh between the suction surface Dc and the upper surface of the electrode Db has a larger shape in the component D (2). Therefore, the inclination of the adsorption posture (the inclination of the component with respect to the horizontal plane) when the adsorption nozzle 11b adsorbs including the boundary between the main body portion Da and the electrode Db due to the adsorption deviation is larger in the component D (2). For these reasons, the size of the component D (2) is the same as that of the component D (1), but the mounting position variation (positional deviation amounts ΔX, ΔY, Δθ) due to the suction variation is the component D (1). Bigger than.

  Here, with reference to FIG. 8, the gaps Gx and Gy between the pocket 16b of the carrier tape 16 included in the component information 41b and the stored component D will be described. In FIG. 8A, the base tape 16a of the carrier tape 16 (1) includes a concave pocket 16b that accommodates the component D (3) and a sprocket of the tape feeder 8 that pitch-feeds the carrier tape 16 (1). Feed holes 16c with which (not shown) are engaged are formed at equal intervals. A cover tape 16d is affixed to the upper surface of the pocket 16b that houses the component D (3).

  Between the part D (3) housed in the pocket 16b and the inner wall of the pocket 16b, gaps Gx1 and Gx2 are generated in the X direction, and gaps Gy1 and Gy2 are generated in the Y direction. Due to these gaps G, the part D (3) moves irregularly in the pocket 16b during pitch feeding, and the suction position when the suction nozzle 11b sucks the part D (3) varies. For this reason, the mounting position when the component D (3) is mounted on the substrate 6 varies.

  In FIG. 8B, a part D (4) having the same size as the part D (3) is stored in the pocket 16b of the carrier tape 16 (2). Gaps Gx3 and Gx4 are generated in the X direction and gaps Gy3 and Gy4 are generated in the Y direction between the part D (4) and the inner wall of the pocket 16b. The pocket 16b of the carrier tape 16 (2) is larger than the pocket 16b of the carrier tape 16 (1), and the gap G (Gx3 + Gx4, Gy3 + Gy4) generated in the carrier tape 16 (2) is generated in the carrier tape 16 (1). It is larger than the gap G (Gx1 + Gx2, Gy1 + Gy2). Therefore, the size of the component D (4) is the same as that of the component D (3), but the mounting position variation when mounted on the substrate 6 is larger than that of the component D (3).

  In FIG. 5, the positional deviation amount data 41 c includes positional deviation amount data 31 b including positional deviation amounts ΔX, ΔY, and Δθ continuously acquired during the production of the mounting board from the inspection apparatus M4. Sent and stored. That is, the management storage unit 41 that stores the positional deviation amount data 41c serves as a positional deviation amount storage unit that continuously stores the positional deviation amounts ΔX, ΔY, and Δθ during production.

  The correction value calculation unit 40a is displaced in the X direction from the normal position N of the component D mounted on the substrate 6 acquired by the inspection apparatus M4 (position displacement amount acquisition means) and stored in the position displacement amount data 41c. A feedback correction value Vc for correcting the mounting operation of the component mounting unit 12 (component mounting means) is calculated based on the amount ΔX and the positional shift amount ΔY in the Y direction (hereinafter simply referred to as “position shift amount ΔX, ΔY”). . The correction value calculation unit 40a calculates a feedback correction value Vc from the positional deviation amounts ΔX and ΔY of the component D mounted on the substrate 6 for each suction nozzle 11b and for each predetermined rotation angle. The significance of calculating the feedback correction value Vc for each suction nozzle 11b and for each predetermined rotation angle will be described later.

  The correction value calculation unit 40a calculates a feedback correction value Vc by statistical processing every time a predetermined number of positional deviation amounts ΔX and ΔY are collected for each suction nozzle 11b and for each predetermined rotation angle. As the statistical processing, for example, calculation of an average value of a predetermined number of positional deviation amounts ΔX and ΔY excluding outliers is used. The predetermined number at that time is determined based on an allowable error of the feedback correction value Vc calculated by statistical processing. As a result, it is possible to calculate the feedback correction value Vc with appropriate accuracy.

  The feedback correction value Vc calculated for each suction nozzle 11b and for each predetermined rotation angle is used for correcting the mounting operation of the component D mounted by the component mounting unit 12. The correction value transmitting unit 40b associates the feedback correction value Vc corresponding to the component D mounted on the substrate 6 and transmits it to the component mounting apparatuses M2 and M3 that mount the component D. The transmitted feedback correction value Vc is stored as correction value data 21b in the mounting storage unit 21 of the component mounting apparatuses M2 and M3. Thereby, the mounting position shift of the component D can be accurately corrected.

  Here, the significance of calculating the feedback correction value Vc for each suction nozzle 11b and for each predetermined rotation angle will be described with reference to FIG. As shown by a two-dot chain line in FIG. 9A, the suction nozzle 11b is mounted on the mounting head 11 in a posture in which the nozzle axis AN is vertical (Z direction). However, there are cases where the nozzle axis AN is inclined and mounted from the vertical direction due to the mounting condition of the suction nozzle 11b or the distortion of the suction nozzle 11b itself. The inclination of the nozzle axis AN differs for each suction nozzle 11b.

  As described above, when the mounting operation is performed by the suction nozzle 11b in which the nozzle axis AN is inclined, the component center C is displaced from the normal position N and the component D is mounted on the substrate 6. Further, as shown in FIG. 9B, when the suction nozzle 11b is rotated, the mounting position (component center C) of the component D is moved and mounted on the substrate 6 according to the rotation angle. As a result, as in the example shown in FIG. 9B, the positional deviation amounts ΔX and ΔY are different for each rotation angle, such as 0 °, 90 °, 180 °, and 270 °.

  In this way, in a state where the positional deviation amounts ΔX and ΔY are different for each suction nozzle 11b and for each predetermined rotation angle, if the feedback operation value Vc is calculated for the entire substrate 6 to correct the mounting operation, the suction nozzle 11b is corrected. In some cases, the positional deviation may not be corrected appropriately. Even in such a case, by calculating the feedback correction value Vc for each suction nozzle 11b and for each predetermined rotation angle to correct the mounting operation, it depends on the mounting condition of the suction nozzle 11b and the distortion of the suction nozzle 11b itself. The mounting position shift of the component D can be accurately corrected.

  In FIG. 5, the component selection unit 40 c performs feedback based on one of the shape of the component D and the size of the component D included in the mounting data 41 a and the component information 41 b, the rotation angle of the component D, and the target mounting accuracy. The component D used for calculating the correction value Vc is selected. For example, when selecting the component D, the component selection unit 40c selects the component D (2) shown in FIG. 7 and the component D (4) shown in FIG. Exclude from the target. Thereby, the mounting position shift of the component D can be accurately corrected. As described above, the component selection unit 40c serves as a component selection unit that selects the component D to be used for calculating the feedback correction value Vc, and the correction value calculation unit 40a performs the positional deviation amount ΔX of the component D selected by the component selection unit. , ΔY, the feedback correction value Vc is calculated.

  Here, a specific example of the calculation of the feedback correction value Vc by the correction value calculation unit 40a will be described with reference to FIG. FIG. 10A shows 13 components D1 * to D5 *, D6% to D10%, D11 #, D12 to D13 (shown by solid lines) mounted on the substrate 6 and their component centers C1 to C13 ( Displayed with black circles, C6 to C13 are omitted), normal positions N1 to N13 (displayed with white circles, N6 to N13 are omitted), which are the mounting targets, and the position of the component D when mounted at the normal position N (shown with broken lines) Display) is displayed.

  Twelve parts D1 * to D5 *, D6% to D10%, D11 #, and D12 are mounted on the substrate 6 by the same suction nozzle 11b. The components D1 * to D5 * have a rotation angle of 0 °, the components D6% to D10% have a rotation angle of 90 °, and the component D11 # has a rotation angle of 45 ° and is mounted on the substrate 6. Among these, the component D11 # having a rotation angle of 45 ° and the component D12 having a shape that tends to have a large mounting variation are excluded from the calculation target of the feedback correction value Vc by the component selection unit 40c. The component D13 mounted on the substrate 6 by the suction nozzle 11b different from the suction nozzle 11b mounting the components D1 * to D5 *, D6% to D10%, D11 #, and D12 is rotated at the same rotation angle by the same suction nozzle 11b. The feedback correction value Vc is calculated together with other components D that are not shown.

  That is, in this example, the correction value calculation unit 40a performs feedback correction from the positional deviation amounts ΔX and ΔY of the components D1 * to D5 * and the components D6% to D10% that are mounted on the substrate 6 at the same rotation angle by the same suction nozzle 11b. Assume that each value Vc is calculated. In FIG. 11B, the positional deviation amounts ΔX and ΔY of the parts D1 * to D5 * and the parts D6% to D10% acquired by the inspection apparatus M4 are shown in an XY graph. The correction value calculation unit 40a statistically processes (in this case, calculates an average value) the positional deviation amounts ΔX and ΔY of the parts D1 * to D5 * and the parts D6% to D10%, thereby obtaining a feedback correction value Vcx (X direction). 0 °), feedback correction value Vcx (90 °), Y-direction feedback correction value Vcy (0 °), and feedback correction value Vcy (90 °), respectively.

  Furthermore, the correction value calculation unit 40a uses the feedback correction value Vc (45 °) of the component D11 # mounted at a rotation angle of 45 ° as the feedback correction value Vc (45%) of the components D6% to D10% whose rotation angle is 90 °. 90 °) and the feedback correction value Vc (0 °) of the components D1 * to D5 * whose rotation angle is 0 ° are complemented. That is, the correction value calculating unit 40a mounts the feedback correction value Vc (45 °) when mounting the component D11 # mounted at the first rotation angle (45 °) other than the predetermined rotation angles (0 ° and 90 °). ) Is a feedback correction value Vc (90 °) for a second rotation angle (90 °) larger than the first rotation angle and a feedback correction value Vc for a third rotation angle (0 °) smaller than the first rotation angle. (0 °) is interpolated and calculated.

  Note that the interpolation method is not limited to the linear interpolation by the linear function shown in FIG. A quadratic function, a cubic function, a feedback correction value Vc (90 °) for the second rotation angle (90 °), and a feedback correction value Vc (0 °) for the third rotation angle (0 °) on the circumference. It may be calculated by interpolating with a circle of two points. Thereby, even when the number of components D11 # mounted at the first rotation angle (45 °) is small, it is possible to accurately correct the mounting position shift of the component D due to the influence of fluctuation caused by the suction nozzle 11b.

  In addition, when the feedback correction value Vc is calculated for only one of the rotation angle 0 ° or 90 °, the correction value calculation unit 40a performs the first rotation other than the predetermined rotation angle (0 ° or 90 °). The feedback correction value Vc (45 °) when mounting the component D11 # mounted at an angle (45 °) is set to a predetermined rotation angle (0 ° or 90 °) closest to the first rotation angle (45 °). The feedback correction value Vc (0 °) or the feedback correction value Vc (90 °) is calculated.

  As a method of calculating the feedback correction value Vc (0 °), the feedback correction value Vc (0 °) or the rotation angle (90 °) of the rotation angle (0 °) closest to the first rotation angle (45 °). The feedback correction value Vc (90 °) may be used as it is, or may be calculated by rotating the rotation angle difference (45 ° or −45 °). Thereby, even when the number of components D11 # mounted at the first rotation angle (45 °) is small, it is possible to accurately correct the mounting position shift of the component D due to the influence of fluctuation caused by the suction nozzle 11b.

  As described above, the correction value calculation unit 40a rotates the component D in the rotation direction (θ direction) parallel to the mounting surface of the substrate 6 by the plurality of suction nozzles 11b and mounts the component D on the substrate 6 (components). Based on the amount of displacement ΔX, ΔY from the normal position N of the component D mounted on the substrate 6 by the mounting portion 12), the mounting operation of the component mounting means is corrected for each suction nozzle 11b and for each predetermined rotation angle. The correction value calculation means calculates the feedback correction value Vc.

  Moreover, the management computer 3 provided with the correction value calculation part 40a becomes a correction value calculation apparatus. The correction value calculation apparatus is not limited to the management computer 3 connected to the component mounting apparatuses M2 and M3 and the inspection apparatus M4 and the communication network 2. The correction value calculation apparatus may be a computer including the correction value calculation unit 40a, and may not be connected to the component mounting apparatuses M2 and M3 and the inspection apparatus M4.

  Next, a component mounting method for correcting the mounting operation using the feedback correction value Vc calculated from the positional deviation amounts ΔX and ΔY of the component D will be described along the flow of FIGS. In FIG. 11, the component selection unit 40c (component selection means) first selects the component D to be used for calculating the feedback correction value Vc (ST1: component selection step). Next, the mounting control unit 20 corrects the mounting operation using the feedback correction value Vc of the predetermined rotation angle of the suction nozzle 11b on which the component D is mounted based on the mounting data 21a and the correction value data 21b, and the suction nozzle 11b. Thus, the component D is rotated in the rotation direction (θ direction) parallel to the mounting surface of the substrate 6 to mount the component D on the substrate 6 (ST2: component mounting step).

  Next, the inspection camera 32 (imaging unit) images the component D on the board 6 on which the component D is mounted by the component mounting apparatuses M2 and M3 and is conveyed to the inspection apparatus M4 (ST3: imaging process). Next, the misregistration amount calculation unit 30a calculates misregistration amounts ΔX and ΔY from the normal position N of the component D from the image captured in the imaging step (ST3) (ST4: misregistration amount calculation step). As described above, in the imaging step (ST3) and the positional deviation amount calculating step (ST4), the positional deviation amounts ΔX and ΔY from the normal position N of the component D mounted on the substrate 6 in the component mounting step (ST2) are acquired. This is the positional deviation amount acquisition step (ST10).

  In FIG. 11, the management storage unit 41 then stores the positional deviation amounts ΔX and ΔY transmitted from the inspection apparatus M4 (the positional deviation amount acquisition means) continuously during production (ST5: positional deviation amount storage step). Next, the correction value calculation unit 40a determines whether or not a predetermined number of positional deviation amounts ΔX and ΔY are collected for each suction nozzle 11b and for each predetermined rotation angle (ST6: calculation possibility determination step).

  When the predetermined number of misregistration amounts ΔX and ΔY are collected (Yes in ST6), the correction value calculating unit 40a performs a component mounting process (based on the misregistration amounts ΔX and ΔY acquired in the misregistration amount acquisition step (ST10)). A feedback correction value Vc for correcting the mounting operation in ST2) is calculated (ST7: correction value calculating step). That is, in the correction value calculation step (ST7), the feedback correction value Vc is calculated every time a predetermined number of positional deviation amounts ΔX and ΔY are collected for each suction nozzle 11b and for each predetermined rotation angle.

  Here, the details of the correction value calculation step (ST7), that is, the feedback correction value calculation method will be described with reference to FIG. First, the correction value calculation unit 40a calculates the feedback correction value Vc from the positional deviation amounts ΔX and ΔY of the component D mounted on the substrate 6 for each suction nozzle 11b and for each predetermined rotation angle (ST11). Next, the correction value calculation unit 40a determines whether there is a component D mounted on the board 6 at a rotation angle outside the predetermined rotation angle for which the feedback correction value Vc is calculated (ST12).

  When there is a part D other than the predetermined rotation angle (Yes in ST12), the correction value calculation unit 40a determines whether or not there is a feedback correction value Vc for rotation angles before and after the predetermined rotation angle (ST13). . When there is a feedback correction value Vc for the front and rear rotation angles (Yes in ST13), the correction value calculation unit 40a provides a feedback correction value for mounting the component D mounted at the first rotation angle other than the predetermined rotation angle. Vc is calculated by interpolating the feedback correction value Vc of the second rotation angle larger than the first rotation angle and the feedback correction value Vc of the third rotation angle smaller than the first rotation angle (ST14: first Calculation step).

  In FIG. 12, when there is no feedback correction value Vc for the front and rear rotation angles (No in ST13), the correction value calculation unit 40a mounts a component D that is mounted at a first rotation angle other than a predetermined rotation angle. Is calculated using the feedback correction value Vc of a predetermined rotation angle closest to the first rotation angle (ST15: second calculation step). When the feedback correction value Vc of the first rotation angle other than the predetermined rotation angle is calculated in the first calculation step (ST14) or the second calculation step (ST15), then the correction value calculation unit 40a It is determined whether or not the feedback correction value Vc is calculated based on the rotation angle (ST16).

  When the feedback correction value Vc has not been calculated for all the rotation angles (No in ST16), the process returns to (ST13), and the feedback correction value Vc for other rotation angles is calculated. When feedback correction value Vc is calculated at all rotation angles (Yes in ST16) or when there is no component D other than the predetermined rotation angle (No in ST12), calculation of feedback correction value Vc ends.

  In FIG. 11, the correction value transmission unit 40b then associates the feedback correction value Vc corresponding to the component D mounted on the substrate 6 and transmits it to the component mounting apparatuses M2 and M3 that mount the component D (ST8: Correction value transmission step). When the feedback correction value Vc is transmitted, the process returns to the component mounting step (ST2), and the component D is mounted on the board 6 based on the feedback correction value Vc included in the correction value data 21b newly transmitted and stored. . When it is determined in the calculation possibility determination step (ST6) that a predetermined number of positional deviation amounts ΔX and ΔY are not collected (No), the feedback correction value Vc is not calculated and the process returns to the component mounting step (ST2), and has already been performed. Based on the stored correction value data 21b, the component D is mounted on the board 6.

  Thus, in the component mounting system 1, the positional deviation amounts ΔX and ΔY are acquired during the production of the mounting board, and the mounting operation is corrected based on the feedback correction value Vc calculated during the production. That is, during production, the inspection apparatus M4 (position deviation amount acquisition means) acquires the position deviation amounts ΔX and ΔY in the position deviation amount acquisition step (ST10), and during production, the correction value in the correction value calculation step (ST7). The calculation unit 40a (correction value calculation means) calculates the feedback correction value Vc.

  As described above, the component mounting system 1 according to the present embodiment is configured to mount the component D on the substrate 6 by rotating the component D in the rotation direction (θ direction) parallel to the mounting surface by the suction nozzle 11b. (Component mounting part 12), mounting control means (mounting control part 20) for controlling the mounting operation by the component mounting means, and positional deviation amount acquisition for acquiring positional deviation amounts ΔX, ΔY of the component D mounted on the substrate 6 Means (inspection apparatus M4) and correction value calculation means (correction value calculation unit 40a) for calculating a feedback correction value Vc for correcting the mounting operation based on the acquired positional deviation amounts ΔX and ΔY.

  Then, the correction value calculation means calculates the feedback correction value Vc from the positional deviation amounts ΔX and ΔY of the component D mounted on the substrate 6 for each suction nozzle 11b and for each predetermined rotation angle. The mounting operation by the component mounting means is corrected using the feedback correction value Vc of the predetermined rotation angle of the suction nozzle 11b for mounting the component D. Thereby, the mounting position shift of the component D due to the influence of the fluctuation caused by the suction nozzle 11b can be accurately corrected.

  In the component mounting system 1, the positional deviation amount acquisition means is not limited to the inspection apparatus M4. For example, the misregistration amount acquisition means may be configured by component mounting apparatuses M2 and M3 including the inspection camera 32 and the misregistration amount calculation unit 30a. Further, the correction value calculation means is not limited to the correction value calculation unit 40a provided in the management computer 3. For example, the correction value calculation unit may be configured to include the correction value calculation unit 40a in the component mounting apparatuses M2 and M3.

  The component mounting system, the component mounting method, and the correction value calculation apparatus according to the present invention have an effect that the component mounting position shift due to the influence of the fluctuation caused by the suction nozzle can be accurately corrected, and the component is mounted on the board. It is useful in the field.

1 Component mounting system 3 Management computer (correction value calculation device)
6 Substrate 11b Suction nozzle 12 Component mounting part (component mounting means)
32 Inspection camera (imaging part)
D part M4 inspection device (positional deviation acquisition means)
N Normal position ΔX, ΔY Misalignment

Claims (19)

Component mounting means comprising a plurality of suction nozzles, and mounting the component on the substrate by rotating the component in a rotation direction parallel to the mounting surface of the substrate by the suction nozzle;
A mounting control means for controlling a mounting operation for mounting a component on the board by the component mounting means;
A displacement amount acquisition means for acquiring a displacement amount from a normal position of a component mounted on the board by the component mounting means;
Correction value calculation means for calculating a feedback correction value for correcting the mounting operation of the component mounting means based on the positional deviation amount acquired by the positional deviation amount acquisition means,
The correction value calculation means calculates the feedback correction value from the positional deviation amount of the component mounted on the substrate for each suction nozzle and for each predetermined rotation angle,
The mounting control unit corrects the mounting operation by the component mounting unit using the feedback correction value of the predetermined rotation angle of the suction nozzle that mounts the component.   The misregistration amount acquisition unit includes: an imaging unit that images the component; and a misregistration amount calculation unit that calculates a misregistration amount from the normal position of the component from an image captured by the imaging unit. Item 2. The component mounting system according to Item 1.   The component mounting system according to claim 1, wherein the positional deviation amount acquisition unit acquires the positional deviation amount during production, and the correction value calculation unit calculates the feedback correction value during production.   The correction value calculation means uses the feedback correction value when mounting the component mounted at a first rotation angle other than the predetermined rotation angle as the predetermined rotation angle closest to the first rotation angle. The component mounting system according to claim 1, wherein the component mounting system is calculated using the feedback correction value.   The correction value calculation means sets the feedback correction value when mounting the component mounted at a first rotation angle other than the predetermined rotation angle to a second rotation angle larger than the first rotation angle. 4. The component mounting system according to claim 1, wherein the feedback correction value is calculated by interpolating the feedback correction value of a third rotation angle smaller than the first rotation angle. 5. A positional deviation amount storage unit for continuously storing the positional deviation amount during production;
6. The correction value calculation unit according to claim 1, wherein the correction value calculation unit calculates the feedback correction value every time a predetermined number of the positional deviation amounts are collected for each suction nozzle and for each predetermined rotation angle. Component mounting system. A component selection unit that selects the component to be used for calculating the feedback correction value;
The component mounting system according to claim 1, wherein the correction value calculation unit calculates the feedback correction value from the positional deviation amount of the component selected by the component selection unit. A component mounting step of mounting the component on the substrate by rotating the component in a rotation direction parallel to the mounting surface of the substrate by the suction nozzle;
A displacement amount acquisition step of acquiring a displacement amount from a normal position of the component mounted on the board in the component mounting step;
A correction value calculation step for calculating a feedback correction value for correcting a mounting operation in the component mounting step based on the positional deviation amount acquired in the positional deviation amount acquisition step;
In the correction value calculation step, the feedback correction value is calculated from the positional deviation amount of the component mounted on the substrate for each suction nozzle and for each predetermined rotation angle,
The component mounting method, wherein the mounting operation is corrected using the feedback correction value of the predetermined rotation angle of the suction nozzle for mounting the component in the component mounting step.   The misregistration amount acquisition step includes an imaging step of imaging the component, and a misregistration amount calculation step of calculating a misregistration amount from the normal position of the component from an image captured in the imaging step. Item 9. The component mounting method according to Item 8.   The component mounting method according to claim 8 or 9, wherein during the production, the positional deviation amount is acquired in the positional deviation amount acquisition step, and during the production, the feedback correction value is calculated in the correction value calculation step.   In the correction value calculation step, a feedback correction value when mounting the component mounted at a first rotation angle other than the predetermined rotation angle is a value of the predetermined rotation angle closest to the first rotation angle. The component mounting method according to claim 8, wherein the component mounting method is calculated using the feedback correction value.   In the correction value calculating step, a feedback correction value when mounting the component mounted at a first rotation angle other than the predetermined rotation angle is a second rotation angle larger than the first rotation angle. The component mounting method according to claim 8, wherein the component correction method is calculated by interpolating a feedback correction value and the feedback correction value of a third rotation angle smaller than the first rotation angle. A positional deviation amount storing step of continuously storing the positional deviation amount during production;
13. The feedback correction value is calculated every time a predetermined number of the positional deviation amounts are collected for each suction nozzle and for each predetermined rotation angle in the correction value calculating step. Component mounting method. A component selection step of selecting the component to be used for calculating the feedback correction value;
The component mounting method according to claim 8, wherein in the correction value calculation step, the feedback correction value is calculated from the positional deviation amount of the component selected in the component selection step.   Based on the amount of displacement from the normal position of the component mounted on the substrate by the component mounting means for rotating the component in a rotation direction parallel to the mounting surface of the substrate by a plurality of suction nozzles, And a correction value calculation apparatus provided with the correction value calculation part which calculates the feedback correction value which correct | amends mounting operation | movement of the said component mounting means for every predetermined rotation angle.   The correction value calculation unit calculates a feedback correction value when mounting the component mounted at a first rotation angle other than the predetermined rotation angle, at the predetermined rotation angle closest to the first rotation angle. The correction value calculation apparatus according to claim 15, wherein calculation is performed using the feedback correction value.   The correction value calculation unit sets a feedback correction value when mounting the component mounted at a first rotation angle other than the predetermined rotation angle to a second rotation angle larger than the first rotation angle. The correction value calculation apparatus according to claim 15, wherein the correction value is calculated by interpolating the feedback correction value and the feedback correction value of a third rotation angle smaller than the first rotation angle.   18. The correction value calculation unit according to claim 15, wherein the correction value calculation unit calculates the feedback correction value every time a predetermined number of the positional deviation amounts are collected for each suction nozzle and for each predetermined rotation angle. Correction value calculation device.   The correction value calculation device according to any one of claims 15 to 18, wherein the correction value calculation unit calculates the feedback correction value from the positional deviation amount of the selected part.

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