JP2018182061A - Led socket and led socket structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain excellent heat dissipation even when obtaining a resin molding by a first half body and a second half body.SOLUTION: An LED socket 5 for supporting an LED structure 6 in which a light emission part 8 such as an LED element on an upper surface of a substrate 7 and an electric power supply part 9 are arranged, includes holing means 15 and 16 capable of attaching the substrate 7 in an almost board thickness with an opening 10 and an attachment hole 11. The LED socket comprises: a first half body 1 in which the light emission part 8 is projected from the opening 10 from a lower direction to an upper direction, and which is made of a resin capable of supporting the LED structure 6 in a state of holding the substrate 7 with the holding means 15 and 16; a second half body 2 that is made of the resin, includes an arrangement part 25 for a connection member capable of being electrically connected to the electric power supply part 9 with an upper opening 20 and an upper attachment hole 21, arranges the light emission part in the upper opening, and is connected to the first half body in the state where the upper attachment hole is positioned on the same axial line; and a heat dispassion member 3 or 3A which is nipped between the first or second half body, and is arranged so as to be contacted to the attachment member such as a screw penetrated into the attachment hole 11 from the upper attachment hole 21.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an LED socket used for a COB (Chip On Board) type in which an LED (Light Emitting Diode) element is mounted on a ceramic or aluminum substrate, and an LED socket structure holding a COB type LED.

  The COB type is referred to as an LED structure, or an LED package, a COB type LED package, or the like. Therefore, in this specification, the COB type is referred to as an LED structure as in Patent Document 1, the holder for holding the LED structure is referred to as an LED socket, and the LED socket holding the LED structure is an LED socket structure. It is called.

  Compared with SMD (Surface Mount Device) type, the position of the feed terminal is on the surface (upper surface) side and the number of mounted chips is larger than that of SMD (Surface Mount Device) type, and it is suitable for high power and high luminous flux illumination. As an LED socket structure which hold | maintains a LED structure in the LED socket which is illustrated by literature 1, it is integrated in a lamp, an apparatus for illumination, etc. 10 and 11 show two examples of the LED socket structure disclosed in Document 1.

  FIG. 10A is an exploded perspective view of the LED socket structure, and FIG. 10B is a view of the LDE socket structure as viewed from the back side. The reference numerals 0210 and 0110 indicate the same LED structure, and the reference numerals 0200 and 0100 indicate the same LED socket. The LED structure 0210 includes a substrate 0211, a light emitting unit 0212, a feed pad (feed unit) 0213, and a support unit 0214. Among these, the light emitting unit 0212 has an LED element disposed on a substrate and sealed in a resin. The feed pad 0213 has feed terminals at two places on the front surface side, and can connect the ends of wires (hereinafter referred to as lead wires) connected to the external power supply to the feed terminals via the feed terminals and the like. . The support portion 0214 is a substrate portion excluding the light emitting portion and the feed pad on the substrate, and is a portion supported by the LED socket. The LED structure is mounted by being fitted inside from the back side to the opening 0203 of the LED socket with the light emitting unit 0212 facing up to the LED socket.

  That is, the LED socket 0200 has a substantially central, substantially rectangular opening 0203, six support receiving portions a at the opening edge, and two cantilever elastic supporting portions b which are main portions. In (a), reference numerals a and b are not included in the original drawing and newly added. The opening 0203 exposes the light emitting unit above the substrate. The six bearing receiving portions a except for those adjacent to the cantilever elastic supporting portion b as inferred from (b), receive the supporting portion 0214 of the LED structure so as not to come out upward, and the supporting portions Are fitted within the socket thickness and the two bearing receptacles a which are adjacent to the cantilever resilient support mate with the corresponding side of the bearing 0214. Each cantilever elastic support portion b crimps and fixes the substrate by laterally elastic supporting the opposite side surfaces of the substrate in a sandwiched state with a cantilever structure. As a result, it is possible to substantially eliminate the possibility that the LED structure may be damaged or malfunction. The above LED socket is developed as shown in FIG. 11 because a feed terminal etc. is incorporated as a feed mechanism.

  FIGS. 11A and 11B are views of the LED socket 1210 mounted on the LED socket 1200, that is, the LED socket structure viewed from the front and the back. The LDE socket 1200 comprises a first half 1230 and a second half 1240. The first half 1230 corresponds to the LED socket 0200, the numeral 1231 corresponds to the bearing receiving portion a, and the numeral 1232 corresponds to the cantilever elastic supporting portion b. The second half 1240 has an upper opening at a central portion exposing the light emitting portion, a terminal receiving portion for a feeding terminal provided on the inner surface side, a guide groove for a lead wire, and the like (see FIG. 13 of Document 1). ). The first half 1230 and the second half 1240 are joined by the plurality of clips 1250 in an overlapping state. The reference numeral 1220 is a lead wire connected to the feed pad via a feed terminal or the like.

JP, 2015-204157, A

  It is preferable that the above LED socket be excellent in heat dissipation as well as durability and insulation. The point of heat dissipation is an important examination item as the total luminous flux is increased because the LED structure generates light and heat according to the input power. By the way, when the conventional LED socket is roughly divided from the material, both the first half and the second half are made of resin, the first half is made of resin, and the second half is made of ceramic such as aluminum porcelain. Divided into two types. Here, in addition to the fact that the first half becomes as thin as about 1.0 mm from the thickness of the substrate of the LED structure etc., the processability is excellent because the positioning of the substrate, the support structure, etc. become a complicated shape. It is a resin molded article. The second half is made of resin with emphasis on durability and processability, and is made of ceramic with emphasis on heat dissipation and insulation.

  However, when both the first half and the second half are made of resin as the material of the LED socket, the thickness of the plate is distorted by heat and stress is applied to the LED structure, which makes the difference in lighting life easy to occur. . This is because, for example, when the resin molded product is distorted, the contact pressure decreases and the temperature further rises accordingly, which affects the lighting life.

  In addition, when the first half is made of resin and the second half is made of ceramic as the material of the LED socket, the second half is made of ceramic, so it is easily broken when a force is applied. When attaching to a device such as a heat sink or the like, the first half body made of resin is screwed. As a result, as the heat conduction through the screw, the heat radiation from the second half hardly occurs, and the heat radiation of the whole socket can not be expected much. In addition, since the first half is thin, the contact mechanism is likely to be distorted due to the tightening force of the screw.

  From the above background, the object of the present invention is to provide excellent heat dissipation even when resin moldings are used for both the first half and the second half while maintaining a simple and simple structure. . Other objectives will be clarified in the following description.

  In order to achieve the above object, the invention according to claim 1 is specified to support the LED structure 6 in which the light emitting portion 8 such as an LED element and the power feeding portions 9a and 9b are disposed on the upper surface of the substrate 7 The LED socket 5 has holding means 15 and 16 capable of attaching the substrate 7 together with the opening 10 and the mounting hole 11 within a substantially plate thickness, and projects the light emitting portion 8 from below the opening 10 and With the first half 1 made of resin capable of supporting the LED structure 6 in a state where the substrate 7 is held by the holding means 15 and 16, the upper opening 20 and the upper mounting hole 21 are electrically connected to the feeding portion. It has a connecting member arranging portion 25 which can be connected, the light emitting portion is arranged in the upper opening, and the upper mounting hole is connected to the first half body coaxially with the mounting hole Resin second half 2 and the first A heat dissipating member 3 (3A) held between the body 1 and the second half 2 and capable of abutting on a mounting member S such as a screw penetrating from the upper mounting hole 21 to the mounting hole 11 And is characterized.

  In the above invention, the mounting member is a member similar to a screw or a bolt. The material is preferably excellent in heat conduction like a metal or an alloy. It is preferable that the heat dissipating member is excellent in heat conduction like a metal or an alloy as the mounting member. In terms of shape, it may be plate-like as in claim 3 or linear as in claim 4.

It is more preferable that the above-mentioned present invention is embodied as specified in claims 2 to 5.
(1) The first half 1 or / and the second half has a recess for disposing the heat dissipation member, and the heat dissipation member is between the first half and the second half, It has the structure which has the contact part contact | abutted on the said attachment member in one end side, and the other end side is extended to vicinity of the said arrangement | positioning part for connection members (Claim 2).
(2) The heat dissipation member has a plate-like shape, and the insertion hole which allows the attachment member to penetrate from the upper attachment hole to the attachment hole and the edge of the insertion hole are provided in a protruding manner for the second half. It has the structure which has a cylinder part inserted in an upper attachment hole (Claim 3).

(3) The heat dissipating member has a linear shape and can be press-contacted to the mounting member. This heat dissipation member specifies the configuration of the modified example of FIG. The term "linear" means that it is elongated and includes round, flat and polygonal cross sections.
(4) The second half body has a recess between the connecting member disposition portion and the recess, and has an insulating chip made of ceramic or the like disposed in the recess. (Claim 5).

  On the other hand, the invention of claim 6 is characterized in that the LED structure 6 is assembled to the LED socket 5 according to any one of claims 1 to 4 as the LED socket structure 50.

  In the first aspect of the present invention, both the halves are made of resin as an LED socket having a first half for supporting the LED structure and a second half having an arrangement portion for arranging a connecting member such as a feeding terminal. Therefore, in addition to being able to stably maintain processing accuracy at the time of mass production and to reduce manufacturing cost as compared with ceramic, the heat dissipating member held between both halves is excellent in heat dissipation. That is, the heat dissipation member allows heat generated in the electrical connection member connected to the light emitting portion and the power feeding portion to efficiently escape to the outside, that is, to, for example, the applied lamp and various appliances through the attachment member such as a screw. It is possible to give the best heat dissipation characteristics as a measure against heat that tends to build up on the two halves made of steel.

  In the invention of claim 2, first, since the first half or / and the second half has the recess for the heat dissipation member, the thickness dimension of the entire LED socket is substantially the same as the thickness without the heat dissipation member. Can be maintained. At the same time, the heat dissipating member has an abutting portion on one end side that abuts the mounting member, and the other end side extends to the vicinity of the connecting member arranging portion of the second half, and the heat is most likely generated in the LED socket It flows efficiently from the side to the mounting member side, and finally, it is possible to efficiently dissipate the heat to the above-mentioned applicable lamp and various fixtures via the mounting member such as a screw.

  In the invention of claim 3, since the heat dissipating member is plate-shaped and has the insertion hole into which the mounting member is inserted and the cylindrical portion inserted into the upper mounting hole of the second half, both heat dissipating members It can be tightened with the half body.

  According to the fourth aspect of the invention, since the heat dissipating member has a linear shape and can be brought into pressure contact with the mounting member, the processing accuracy is not required so much, and the weight is light and easy to implement.

  In the invention of claim 5, since the second half body has the insulating chip disposed in the recess provided between the connecting member disposition portion and the recess portion, the heat dissipating member is provided by the presence of the tip An electrical failure is prevented from occurring with the connection member provided in the placement portion, and heat is further facilitated to flow to the heat dissipation member side via the chip to improve the heat dissipation characteristics.

  According to the sixth aspect of the present invention, the LED socket structure can have the advantages and added values as recited in the first to fifth aspects.

(A) is the perspective view which looked at the LED socket of the form of this invention from the upper side, (a) is the perspective view which looked at the LED socket structure which assembled | attached the LED structure to the LED socket from the upper side. It is the general exploded perspective view which disassembled the said LED socket structure and was seen from the upper side. The 1st half body item which comprises the said LED socket is shown, (a) is an inner surface thru | or a top view, (b) is an outer surface thru | or a bottom view. (A) is an AA line schematic cross section of Drawing 3 (a), (b) is an explanatory view showing the state where an LED structure was temporarily fixed to the first half. The 2nd half which comprises the said LED socket is shown, (a) is an inner surface thru | or a bottom view, (b) is an outer surface thru | or a top view. (A) is a BB line schematic cross section figure of Fig.5 (a), (b) is a CC line schematic cross section diagram of Fig.5 (a). (A) is a schematic block diagram for explaining the procedure of assembling the power supply terminal while arranging the heat dissipating member and the chip in the second half, (b) is a top view of the single heat dissipating member constituting the LED socket (C) is a view on arrow X of (b). The feed terminal (connection member) single item which comprises the LED socket is shown, (a) is a top view, (b) is a Y arrow view of (a). The modification which changed the thermal radiation member which comprises the said LED socket is shown, (a) is a block diagram shown corresponding to Fig.7 (a), (b) is an enlarged top view of a single thermal radiation member. As LED socket and socket structure of patent document 1, (a) shows FIG. 2 (a) of the document 1, and (b) shows FIG. 1 (b) of the document 1. As shown in FIG. As the LED socket and socket structure of Patent Document 1, (a) and (b) show FIG. 12 of Document 1.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this description, the member configurations of the LED socket and the LED socket structure are described, and then their operation features and modified examples will be described in order.

(Member configuration) The LED socket structure 50 shown in FIG. 1 and FIG. 2 is one in which the LED structure 6 is assembled to the LED socket 5 to which the present invention is applied. It is mounted by a plurality of screws S. Here, the LED structure 6 is a well-known commercially available product, in which a light emitting portion 8 such as an LED element and a power feeding portion 9 are disposed on the upper surface of a substrate 7 such as aluminum. The power supply unit 9 is provided at two terminals for receiving the supply of external power via the power supply terminal 4 to the terminals of the lead wires 45 and 46 connected to the external power supply.

  Moreover, a heat sink etc. may be employ | adopted as an attachment part by the side of the illumination apparatus which mounts the LED socket structure 50 so that it may be excellent in a thermal radiation characteristic. The screw S such as a bolt is a typical mounting member, but instead of the screw S, a metal connecting rod and a mounting means such as a nut may be used. In addition, the nut N is shown in figure corresponding to each screw S in FIG. 1 and FIG. The nut N is illustrated for the sake of convenience, and in actuality, it can be omitted by forming a female screw screwing with the screw S in the mounting portion, or can be screwed into the screw portion protruding from the insertion hole provided in the mounting portion. The screw S is screwed into the fitting portion or fixed in advance to the mounting portion.

  The LED socket 5 includes a first half 1 made of resin capable of supporting the LED structure 6 as shown in FIG. 2 and a second half 2 made of resin connected in a state of being superimposed on the first half 1. , A heat dissipation member 3 sandwiched between the first half 1 and the second half 2, two feed terminals 4 and a leaf spring (not shown), and two insulating chips 39 .

  Among them, the first half 1 is an annular injection molded product as shown in FIG. 2 to FIG. 4 and is provided on the outer peripheral side from the opening 10 provided at the central portion and the opening 10 and penetrating vertically. There are a plurality of (two in this example) mounting holes 11, a plurality of (two in this example) connecting pieces 12 provided on the upper surface 1a and a plurality (four in this example) bosses A positioning portion 15 and an elastic pinching piece 16 are integrally provided as holding means which are provided on the edge of the opening 10 in the notch portion 14 and the lower surface 1b provided at the portion and which can position and hold the substrate 7.

  The opening 10 has a shape that can project around the light emitting portion 8 and the feeding portion 9 to the upper surface 1 a side. Each mounting hole 11 is a circular hole provided concentrically. Each connection piece 12 has a claw 12a provided on the outer periphery of the upper surface and protruding inward at the tip. Each boss 13 is provided between the opening 10 and the outer circumference. The notch portion 14 is provided at a position corresponding to the lead-out position of the lead wires 45 and 46 connected to a feed terminal 4 incorporated in the second half 2 described later and drawn to the outside. Reference numerals 19a and 19b indicate whether the power supply unit 9 of the LED structure is on the anode side or the cathode side.

  The positioning portion 15 is provided on the lower surface 1 b as a step, and the two corner portions facing each other in the substantially rectangular substrate 7 are received with corresponding steps so that the substrate 7 can be positioned within the thickness of the first half 1 Do. On the other hand, the elastic clamping pieces 16 are respectively provided at the other opposite edges of the opening 10 and are projected in a downward inclined state, and horizontally or slightly inward when receiving an inward pressing force from the downward inclined state. It can be switched to the inclined state. Further, an L-shaped step 16 a capable of receiving the substrate 7 is formed on the tip side of each elastic holding piece 16.

  FIG. 4 (b) shows a state in which the LED structure is temporarily fixed to the first half. In this structure, for example, when the other side of the substrate 7 is pushed in the longitudinal direction from the state where the substrate 7 applies only one end to the corresponding positioning portion 15 on one side and places it on the step 16a on both sides, each elastic holding piece 16 is switched to the horizontal or slightly inward inclined state. In that state, the substrate 7 of the LED structure 6 is sandwiched between the opposing surfaces of the two steps 16 a and temporarily fixed. The concave portion 2c1 of FIG. 5A provided in the above-mentioned second half is a space for relief so as not to be inadvertently hit when the respective elastic clamping pieces 16 are switched to the inward inclined state. .

  That is, in this structure, although the substrate 7 is temporarily fixed using the positioning portion 15 and the elastic holding piece 16, it is a pressing method of temporarily fixing while pressing in the longitudinal direction as an operation point. The substrate 7 of the LED structure can be held more accurately and more quickly than in a structure in which the substrate of the body is held by the cantilever elastic support (reference numeral 1232 in FIG. 11B) facing in the horizontal direction. Further, in this structure, the LED socket structure 50 is designed to be in the main fixed state by screwing the LED socket structure 50 to the mounting portion of a device such as a lamp with a plurality of screws S.

  In addition, the code | symbol 18 is the shallow recessed part provided in two places. Each recess 18 escapes the upper part of the corresponding feed terminal 4 incorporated in the second half 2. The reference numerals 19a and 19b are marks which are marked on the lower surface 1b of the first half to make the direction of the corresponding feeding part 9 known when the LED structure 6 is assembled to the first half 1, thereby preventing misassembly.

The second half 2 is an annular injection-molded article which is overlapped with the first half 1 as shown in FIGS. 2 and 5 to 7 and has an opening 20 provided at the central portion and a lower surface 2a. The pedestal 2d is provided between the recess 20 and the recess 20 at two places where the heat dissipation member 3 is disposed. Mounting holes 21 and bosses 26 which vertically penetrate through, notches 22 provided at two locations on the outer periphery, four recesses 23 at which the bosses 13 are fitted, and lead wires 45 and 46 Two grooves 24 to be arranged, a recess 25 communicating with the groove 24 and an engagement groove 25a on the back side of the recess 25, two engagement grooves 25b provided around the pedestal 2d, and a pedestal 2d Small recess 25c provided on the opposite side to recess 25
And a chip recess 29 provided between each pedestal 2d and the recess 2c. The reference numeral 2c1 denotes a recess formed on a part of the lower surface 2a between the opening 20 and the recess 2c.

  The opening 20 has a substantially circular shape that exposes the light emitting unit 8 from the bottom to the top, and an edge is provided in the upper inclined portion 20 a. The recess 2 c is provided along the outer peripheral side and has a depth corresponding to the thickness of the heat dissipation member 3. The pedestal 2d is lower than the lower surface 2a and slightly higher than the recess 2c. The mounting hole 21 is provided coaxially with the mounting hole 11. The bosses 26 are fitted in the holes 34 of the heat dissipating member. The notch 22 has a rib 22a protruding from the lower edge, and the upper surface 2b side of the rib 22a is formed as a step 22b. The claws 12a of the connecting piece 12 engage with the step 22b. Each recess 23 is provided concentrically.

  Each groove 24 is superimposed on the corresponding notches 14 of the first half in the stacked state of both halves 1, 2 so that the lead 45 or 46 can be led out of the half. The pedestal 2 d holds the feed terminal 4. The recess 40 is provided with the base 40 of the feed terminal 4. The engaging grooves 25 a, 25 b engage with the corresponding locking portions 40 a, 42 of the feed terminal 4. In the small recess 25c, a plate spring (not shown) for pressing the connection portion 43 of the feed terminal 4 upward from below is disposed. An insulating chip 39 is fitted in the recess 29. The recess 29 is provided close to a part of the recess 2c. Then, it is preferable that the tip 39 fitted in the recess 29 be in contact with the heat dissipation member 3 disposed in the recess 2c. The material of the chip 39 is preferably made of ceramic excellent in insulation property, but may be another insulation material.

  Here, the heat dissipating member 3 is a metal-made press product as shown in FIGS. 7 (b) and 7 (c), and the insertion hole 31 disposed coaxially with the mounting holes 11 and 21 and the second half And a through hole 33 into which the corresponding boss 13 of the first half fits, and a through hole 34 into which the boss 26 of the second half fits. There is. Further, the heat radiating member 3 has a plate shape, and has a cylindrical portion 30 which is provided so as to protrude from the edge of the insertion hole 31 and is fitted into the upper mounting hole 31 of the second half. The cylindrical portion 30 is formed so as to protrude on the upper surface 3a side of the heat dissipation member 3 by burring, and is fitted into the mounting hole 21 of the second half as shown in 7 (a). And, in this structure, when the LED socket 5 is attached to the lamp and various devices with the screw S etc. in a state where the two halves 1 and 2 are connected and integrated, the heat dissipation member 3 is two halves by the presence of the cylindrical portion 30. It becomes possible to tighten together with 1 and 2 firmly.

  The feed terminal 4 is a pressed product of a conductive plate material, and is connected to the base 40 in the vertical arrangement as shown in FIG. 8, a locking portion 40 a provided on the tip side of the base 40, and the tip side of the base 40. A seat 41 received by the pedestal 2d, two locking portions 42 bent from the edge of the seat 41, a connection portion 43 raised obliquely upward from the front side of the seat 41, and a connection portion It has on the front end back surface of 43 and the regulation wall part 44 provided protruding on both sides integrally. Reference numeral 43 a is a contact portion that protrudes to the upper surface side of the connection portion 43 and abuts on the feeding portion 9.

  In the base portion 40, the tip side core wire of the lead wire 45 or 46 is coupled to the inner side surface by solder or the like. Then, in the state where the seat portion 41 is disposed on the pedestal 2d, the locking portion 40a is press-fit into the engagement groove 25a, and each locking portion 42 is press-fitted into the corresponding engagement groove 25b. Is mounted on the second half 2. At that time, a leaf spring (not shown) is incorporated in the small recess 25c. The leaf spring has the lower portion positioned in the small recess 25c, and the upper portion pressed in the downward direction of the connection portion 43 in a state where the position is regulated between both the regulation wall portions 44 projecting to the back side of the connection portion 43. Then, the contact portion 43a is reliably brought into contact with the feeding portion 9.

  As described above, the first half 1 is connected to the second half 2 in which the heat dissipating member 3 and the feeding terminal 4 biased by the plate spring are disposed. That is, the two halves 1 and 2 are fitted with the plurality of bosses 13 of the first half and the corresponding recesses 23 of the second half, and the claw 12a of the connecting piece of the first half and the second half Are connected by engagement with the step 22b of the

(Operational features) We will clarify the advantages of the above LED socket and LED socket structure.
(A) The above-mentioned LED socket 5 or LED socket structure 50 comprises a first half 1 for supporting the LED structure 6 and a second half 2 having an arrangement portion for arranging the feeding terminal 4 Since both the halves 1 and 2 are made of resin, the processing accuracy during mass production can be stably maintained and the manufacturing cost can be reduced as compared with those made of ceramic. At the same time, the heat dissipating member 3 excellent in heat conduction sandwiched between the two halves 1, 2 has excellent heat dissipating characteristics. That is, the heat dissipation member 3 acts to efficiently dissipate the heat generated in the light emitting portion 8, the power feeding portion 9, the power feeding terminal 4 and the like to the outside through the screw S, that is, the side of applied lamps and various appliances, It is possible to impart the best heat dissipation characteristics to the two halves 1 and 2 as a measure against heat that tends to build up.

(A) The LED socket 5 or the LED socket structure 50 has the recess 2c in which the first half 1 is provided with the heat dissipating member 3 so that the thickness of the entire LED socket does not have the heat dissipating member 3 It can be maintained at the same thickness as the case. At the same time, the heat dissipation member 3 has the cylindrical portion 30 in contact with the screw S at one end, and the other end extends to the vicinity of the power supply terminal 4 disposed on the second half 2 side. It efficiently flows from the place where the most occurrence occurs to the mounting screw S side, and finally it is possible to dissipate heat efficiently to the applied lamp and various instruments through the screw S.

(C) The LED socket 5 or the LED socket structure 50 is excellent in appearance for lighting because the first half 1 and the second half 2 are substantially annular. At the same time, the heat dissipating member 3 is formed by the screw S because the heat dissipating member 3 is plate-shaped and has the insertion hole 31 into which the screw S is inserted and the cylindrical portion 30 inserted into the upper mounting hole 21 of the second half 2. It can be tightened with both halves 1, 2.

(D) The LED socket 5 or the LED socket structure 50 has the insulating chip 39 disposed in the recess 29 in which the second half 2 is provided between the feeding terminal 4 and the recess 2c. Therefore, the heat dissipation member 3 is prevented from causing an electrical failure due to the presence of the chip 29, and heat is further easily flowed to the heat dissipation member 3 side through the chip 29 to improve the heat dissipation characteristics.

(Heat Dissipation Characteristic) The inventor of the present invention has invented the invention component a in which both halves are made of resin, the power supply terminal and the heat dissipation member as the LED socket 5, the invention component a1 further including the chip 39, and the conventional LED socket. A conventional component b in which both halves are made of resin and a feed terminal, and a conventional component c in which both halves are a first LED half made of resin and a second half made of alumina ceramic as a conventional LED socket and a feeder terminal c The following simple tests were conducted to determine the superiority or inferiority of the heat dissipation characteristics.

  The test method is how to push the tip of the thermocouple under the feed terminal 4 and pinch the screw (M3) S with a finger to transmit the body temperature (36 ° C) without wind from when the ambient temperature is around 15 ° C. I examined. Specifically, the temperature rise after 5 minutes from when the screw S was picked was checked to compare the superiority and inferiority. Each first half, second half and feed terminal are of the same size. In each component, the distance between the screw S and the feeding terminal 4 was set to be the same, and in the test, the same environment was kept as much as possible. In addition, the material of the resin used was 30% polybutylene terephthalate with glass fiber.

  The test results show an average value of 5 times, rising 3.4 ° C. for invention component a and 3.8 ° C. for invention component a1. On the other hand, in the conventional component b, the temperature rose by 2.0 ° C., and in the conventional component c, the temperature rose by 2.8 ° C. From this result, it can be inferred that the inventive components a and a1 are considerably superior to the conventional components b and c in heat radiation characteristics or heat conduction characteristics, and it is more preferable to add the chip 39.

(Modification) FIG. 9 shows an example in which the heat dissipation member is changed. In this description, the same members and portions as those in the embodiment described above are denoted by the same reference numerals, duplicate explanations are omitted, and only changes are described in detail. That is, the change points are in the configuration of the heat dissipation member 3A and the configuration in which another boss 27 is added to the depressed portion 2c of the second half together with the boss 26.

  First, the heat dissipating member 3A is formed of a wire material such as a torsion spring, and is provided at one end side and in contact with the mounting member S at the contact portion 38 and at the other end side near the placement portion 25; And a bent portion 36 provided between the contact portion 37 and the contact portion 38. The heat dissipating member 3A is assembled on the recessed portion 2c in such a manner that the bent portion 36 is positionally restricted by a part of the step end surface at the boundary with the lower surface 2a and the bosses 26 and 27 as shown in FIG. Then, the contact portion 37 is in pressure contact with the tip 39 and a part of the contact portion 38 is disposed inside the insertion hole 31. Thereafter, in this modification, when the screw S is inserted from the mounting hole 21 of the second half into the mounting hole 11 of the first half, the screw S touches a part of the contact portion 38, and the contact portion 38 It is elastically displaced so as to escape further outward, and is finally maintained in a state of being in pressure contact with the screw S.

  In the above modified example, the description in the latter half of (c) above is changed as follows. That is, since the heat radiating member 3A has a linear shape and can be brought into pressure contact with the screw S, the processing accuracy is reduced and the weight is reduced. As a result, the implementation becomes easy.

  The present invention is not limited at all to the LED structure, the LED socket, and the LED socket structure shown in the above-described embodiment and modification. The present invention only needs to be equipped with the technical elements specified in the claims, and the details can be changed as needed. As an example, in the embodiment and the modification, the recess for relief is provided on the second half side in order to prevent the overall thickness from being increased by the heat dissipation member, but this recess is on the first member side It does not matter if it is provided or provided in both halves.

  Further, the holding means for holding the substrate of the LED structure is not limited to the holding means shown in the embodiment, and other positioning structure, engagement structure, bonding structure and the like can be appropriately adopted. The insulating chip can be omitted, but it is preferable to add it in order to improve the heat radiation characteristics as well as to prevent electrical failure. The material is not limited to ceramic as long as it is insulating. The feed terminal and the plate spring can be modified, for example, in order to maintain the shape of the second half and the good contact with the feed portion.

1: First half (10 is an opening, 11 is a mounting hole)
2 ········ Second half (20: upper opening, 21: upper mounting hole, 25: placement portion)
3 ..... radiating member (30 tubular portion is abutting portion, the insertion hole 31)
3A · · · · · Heat dissipation member (36, 37 restricting portion, 38 is a contact portion)
4 ····· Feeding terminal (connection member)
5 ··· LED socket 6 · · · LED structure 7 · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · )
16 ・ ・ ・ Elastic clamping piece (holding means)
2c .... recess 29 .... chip recess 39 ... insulating chip 50 ... LED socket structure S · · · · · screw (mounting member)

Claims (6)

In an LED socket for supporting an LED structure in which a light emitting unit such as an LED element and a power feeding unit are disposed on the upper surface of a substrate,
The LED structure has an opening and a mounting hole and holding means capable of mounting the substrate within a substantially plate thickness, the light emitting portion protrudes upward from below the opening, and the substrate is held by the holding means. The first half made of resin that can support the body,
An upper opening and an upper mounting hole together with a connecting member arranging portion capable of being electrically connected to the feeding portion, the light emitting portion is arranged at the upper opening, and the upper mounting hole is coaxial with the mounting hole A second half made of resin connected to the first half while being positioned in
And a heat dissipating member interposed between the first half and the second half and disposed so as to be able to abut a mounting member such as a screw penetrating from the upper mounting hole to the mounting hole. LED socket characterized by   The first half or / and the second half has a recess for placing the heat dissipation member, and the heat dissipation member is between the first and second halves and attached to one end The LED socket according to claim 1, further comprising an abutting portion abutting on the member, and the other end side extending to the vicinity of the connecting member arranging portion.   The heat dissipation member has a plate-like shape, and is inserted into an insertion hole that allows the mounting member to penetrate from the upper mounting hole to the mounting hole and an edge of the insertion hole, and is mounted on the upper mounting hole of the second half. The LED socket according to claim 1 or 2, characterized in that it has a cylindrical portion to be inserted.   3. The LED socket according to claim 1, wherein the heat dissipating member has a linear shape and can be brought into pressure contact with the mounting member.   The second half body is characterized in that a recess is provided between the connecting member disposing portion and the recess and the insulating chip made of ceramic or the like is disposed in the recess. The LED socket according to claim 2 or 3.   An LED socket structure in which the LED structure is assembled to the LED socket according to any one of claims 1 to 5.

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