JP2018067665A - Circuit body and resin molded body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit body including an electric circuit having wiring shape suitable for a circuit body having various surface shape, and a resin molded body including the circuit body.SOLUTION: A circuit body 1 includes a resin sheet body 10, and an electric circuit 40 having wiring shape along the surface shape of the sheet body 10. The sheet body 10 has surface shape including a predetermined reference plane 21, an offset face 31 displaced from the reference plane 21 in a thickness direction of the sheet body 10, and a coupling face 32 connecting the reference plane 21 and the offset face 31. The electric circuit 40 has wiring shape 40 extending along the coupling face 32 so as to pass through both a straight circumferential edge portion a1 being a border between the offset face 31 and the coupling face 32 and having straight shape, and a straight circumferential base end portion b1 being a border between the reference plane 21 and the coupling face 32 and having straight shape.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a circuit body including a resin sheet body and an electric circuit having a wiring shape along the surface shape of the sheet body, and a resin molded body including the circuit body.

  Conventionally, a circuit body including a resin sheet body and an electric circuit having a wiring shape along the surface shape of the sheet body is known. For example, one of the conventional circuit bodies (hereinafter referred to as “conventional circuit body”) is formed by forming a conductive film on a resin film by vapor deposition or the like and then etching the conductive film into a predetermined wiring shape. Is done. Furthermore, the conventional circuit body is processed (for example, extruded) so as to have a hemispherical (dome-shaped) convex portion when applied to a touch panel (see, for example, Patent Document 1). .

JP 2014-2580 A

  In the conventional circuit body, an optimum wiring shape is sought while considering the deformation degree (elongation amount) of the sheet body and the electric circuit when performing the above-described processing (formation of a hemispherical convex portion). However, it is not clear whether the wiring shape sought in the conventional circuit body is also suitable for a circuit body having irregularities different from the hemispherical shape. From the viewpoint of utilizing the circuit body for various applications, it is desired to find a wiring shape suitable for the circuit body having various shapes of irregularities (that is, various surface shapes).

  The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a circuit body including an electric circuit having a wiring shape suitable for a circuit body having various surface shapes, and the circuit body. Another object is to provide a molded resin product.

In order to achieve the above-described object, a “circuit body” according to the present invention is characterized by the following (1) to (3).
(1)
A circuit body comprising a resin sheet body and an electric circuit having a wiring shape along the surface shape of the sheet body,
The sheet body is
The surface shape includes a predetermined reference surface, an offset surface displaced in the thickness direction of the sheet body from the reference surface, and a connection surface connecting the reference surface and the offset surface,
The electrical circuit is
Both a linear peripheral edge that is a boundary between the offset surface and the coupling surface and has a linear shape, and a linear base end that is a boundary between the reference surface and the coupling surface and has a linear shape, Having the wiring shape extending along the connecting surface so as to pass through,
It must be a circuit body.
(2)
In the circuit body according to (1) above,
The linear peripheral edge and the linear base end are parallel;
The electrical circuit is
Having the wiring shape extending along the connection surface so as to pass through the shortest path connecting the linear peripheral edge and the linear base end;
It must be a circuit body.
(3)
In the circuit body according to (1) or (2) above,
The boundary between the reference surface and the connecting surface has a polygonal shape,
The electrical circuit is
As the linear base end portion, a base end portion between one vertex of the boundary between the reference plane and the connection surface and another vertex adjacent to the one vertex has a length of 1: 8: 1. Passing through the central part when divided into three parts,
It must be a circuit body.

  According to the circuit body having the configuration (1), the electric resistance value of the electric circuit passing through the portion having the surface shape including the reference surface, the offset surface, and the connecting surface (hereinafter referred to as “offset portion”) can be accurately obtained. Can be set. In other words, the difference (variation) between the target electric resistance value (design value) and the actual electric resistance value (actual value) after manufacture can be reduced for the electric circuit passing through the offset portion.

  The reason is as follows. First, the circuit body by the same technique as the conventional circuit body (a technique of forming an electric circuit on the surface of a flat sheet body by printing or the like and then processing the sheet material (and the electric circuit) so as to have an offset portion). Manufacturing. At this time, according to tests and the like conducted by the inventor (details will be described later), a region (a part of the coupling surface) sandwiched between the linear peripheral edge of the offset surface and the linear base end of the reference surface It has been clarified that the deformation mode of the sheet material in) is simpler than the deformation mode of the sheet material in the region other than this region. For example, when the linear peripheral edge and the linear base end are parallel, it has become clear that the sheet material extends one-dimensionally (for example, extends in the extrusion direction during vacuum forming) in the former region. . On the other hand, in the latter region, it became clear that the sheet material was multidimensional (for example, extending in the extrusion direction but extending in other directions). Even when the linear peripheral edge and the linear base end are not parallel, the deformation mode (for example, the number of extending directions) in the former region is the deformation mode (extending direction) in the latter region. The number of

  Therefore, if an electric circuit is provided so as to pass through a region sandwiched between the linear peripheral edge and the linear base end (so as to pass through both the linear peripheral edge and the linear base end), the other Compared with the case where the electric circuit is provided so as to pass through the region, it is easier to predict the degree of deformation of the electric circuit at the time of manufacture (during processing). If the shape of the electric circuit (width before processing, etc.) is determined based on the predicted degree of deformation, the electric resistance value of the electric circuit passing through the offset portion (after processing) can be set with high accuracy. Such setting of the electrical resistance value with high accuracy can be applied to any shape of the offset portion as long as the offset portion has a linear peripheral edge portion and a linear base end portion. .

  Therefore, the circuit body of this configuration is not limited to the surface shape (semispherical convex portion) as in the conventional circuit body, but has a wiring shape suitable for a circuit body having various surface shapes (various shape offset portions). The electric circuit which has is provided.

  By the way, as long as the “electric circuit” has a wiring shape along the surface shape of the sheet body, it may be arranged so as to be in close contact (exposed) with the surface of the sheet body and pass through the inside of the sheet body. (For example, an electric circuit is sandwiched between the sheet body and another layered body). The “offset surface” may be a surface located at a position away from the reference surface in the thickness direction of the sheet body, and its shape, inclination, and the like are not particularly limited. For example, the offset surface may be a non-curved plane or a curved surface, and may be a plane parallel to or inclined with respect to the reference plane.

  According to the circuit body configured as described in (2) above, the electric circuit has the shortest path connecting the linear peripheral edge and the linear base end (that is, the linear peripheral edge and the linear base end parallel to each other). (Path orthogonal to). In this case, when the circuit body is manufactured, the direction in which the region extends (extension direction) coincides with the direction of the path of the electric circuit (path direction). Therefore, the circuit body of this configuration can set the electric resistance value of the electric circuit with higher accuracy than when the extending direction and the path direction do not match.

  According to the circuit body having the configuration (3), when the boundary between the reference surface and the connection surface is a polygonal shape, the shape of the wiring passing through the linear base end of the reference surface can be determined relatively easily. The reason is as follows. According to experiments conducted by the inventors, a peripheral portion between one vertex of the boundary between the reference surface and the connection surface and another vertex adjacent to the vertex has a length of 1: 8: 1 3 It was revealed that the central portion (portion having a length ratio of 8/10) when divided into two portions is usually linear. In other words, if the wiring shape is determined so as to pass through this central portion, the electric circuit normally passes through the linear base end portion. Therefore, the circuit body of this configuration can set the electric resistance value easily and with high accuracy.

Furthermore, in order to achieve the above-mentioned object, the “resin molding” according to the present invention is characterized by the following (4).
(4)
A resin comprising: a resin casing; and the circuit body according to any one of (1) to (3) supported by the casing by insert molding or pasting to the casing. It must be a molded body.

  According to the resin molded body having the configuration of the above (4), various resin molded bodies including a sheet body on which an electrical circuit having a highly accurate electrical resistance value is wired as in the above (1) to (3) ( For example, a switch part for a vehicle can be provided.

  ADVANTAGE OF THE INVENTION According to this invention, the circuit body provided with the electric circuit which has a wiring shape suitable for the circuit body which has various surface shapes, and the resin molding provided with the circuit body can be provided.

  The present invention has been briefly described above. Further, details of the present invention will be further clarified by reading a form for carrying out the invention described below (hereinafter referred to as “embodiment”) with reference to the accompanying drawings.

FIG. 1 is a perspective view of a circuit body according to an embodiment of the present invention as viewed from the front side. FIG. 2 is an exploded perspective view of the state before the circuit body and the resin casing constituting the resin molded body according to the embodiment of the present invention are attached to each other, as viewed from the direction corresponding to the back side of the resin molded body. . Fig.3 (a) is the perspective view which looked at the resin molding which concerns on embodiment of this invention from the back side, FIG.3 (b) is the perspective view which looked at the resin molding from the front side. . FIG. 4A is a diagram showing a part of a circuit body before three-dimensional processing, and FIG. 4B is a diagram showing a part of the circuit body after three-dimensional processing. Fig.5 (a) is a photograph showing the extension of the resin film at the time of forming a convex part in a planar resin film, and FIG.5 (b) is the resin at the time of forming a concave part in a planar resin film. It is a photograph showing elongation of a film. FIG. 6 is a cross-sectional view of the convex portion when the convex portion is formed on the planar resin film. FIG. 7 is a cross-sectional view of the convex portion when the convex portion is formed on the planar resin film. FIGS. 8A to 8D are diagrams illustrating a procedure for performing a three-dimensional process using vacuum forming and pressure forming by exemplifying positions corresponding to the AA cross section of FIG. 1.

<Embodiment>
Hereinafter, the resin body 3 including the circuit body 1 and the circuit body 1 and the resin casing 2 according to the embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the circuit body 1 is a film-like circuit body having a three-dimensionally processed portion, and a resin film 10 (sheet body) and a wiring shape (conductor pattern) along the surface shape of the resin film 10. And an electric circuit 40 having a). As shown in FIGS. 2 and 3, the circuit body 1 is used as one component of the resin molded body 3.

  The resin film 10 is made of a resin such as polycarbonate, polyethylene terephthalate, and polyimide. The resin film 10 includes a flat planar portion 20 and a plurality of offset portions 30 having an uneven shape. Each offset portion 30 is formed by subjecting a corresponding portion of the flat portion 20 to three-dimensional processing using vacuum forming, pressure forming, or the like as will be described later.

  In the example shown in FIGS. 1 to 3, as a plurality (eight) offset portions 30, seven protruding portions 30 that protrude in a rectangular parallelepiped shape on the front side of the circuit body 1 (recessed in a rectangular parallelepiped shape on the back side) A recess 30 is formed which is recessed in a rectangular parallelepiped shape on the front side of the circuit body 1 (projecting in a rectangular parallelepiped shape on the back side).

  Hereinafter, for convenience of explanation, on the front side of the resin film 10, the surface of the flat portion 20 is referred to as a “reference surface 21”, and the top surface of each offset portion 30 (the bottom surface for the recessed portion 30) is referred to as “offset surface 31. And each side surface of each offset portion 30 is referred to as a “connecting surface 32”. The offset surface 31 can be referred to as a surface displaced from the reference surface 21 in the thickness direction of the resin film 10, and the connecting surface 32 can also be referred to as a surface connecting the reference surface 21 and the offset surface 31.

  The electric circuit 40 is formed by printing a conductive pattern on the front surface of the resin film 10 using a conductive ink containing silver, copper, or the like, a conductive paste, or the like. The electric circuit 40 includes a reference conductor pattern 41 extending along the reference surface 21, an offset conductor pattern 42 extending along the offset surface 31, and a connecting conductor pattern 43 extending along the connecting surface 32. In addition, it is preferable that the conductive ink and the conductive paste have a degree of flexibility that can cope with deformation at the time of molding, which will be described later. An insulating film (not shown) is provided on the front surface of the resin film 10 so as to cover the electric circuit 40.

  The reference conductor pattern 41, the offset conductor pattern 42, and the connecting conductor pattern 43 are formed corresponding to the respective offset portions 30. In each offset portion 30, the corresponding connecting conductor pattern 43 connects the corresponding reference conductor pattern 41 and the corresponding offset conductor pattern 42.

  Thus, the electric circuit 40 has a wiring shape (conductor pattern) along the surface shape (uneven shape) of the resin film 10. The uneven shape of the electric circuit 40 (specifically, the offset conductor pattern 42 and the connecting conductor pattern 43) is subjected to the above-described three-dimensional processing after the electric circuit 40 is printed on the planar resin film 10 (plane portion 20). As a result, it is formed simultaneously with the offset portion 30 of the resin film 10.

  The reference conductor pattern 41 extending from each offset portion 30 is gathered at one place in the terminal portion 22 located at one end (right side in FIG. 1) of the flat portion 20 to constitute a circuit terminal 44. The circuit terminal 44 is connected to a counterpart terminal (not shown) when the resin molded body 3 is used.

  In the vicinity of the terminal portion 22 of the circuit body 1, a through hole 23 used for alignment when the circuit body 1 and the resin casing 2 described later are attached is provided.

  As shown in FIG. 3A, the resin body 3 is manufactured by attaching the circuit body 1 to the resin housing 2. For this pasting, the resin casing 2 is provided with a flat portion 50 corresponding to the flat portion 20 of the circuit body 1. Further, the resin casing 2 has a plurality of operation portions 60 (projections or depressions) having concavo-convex shapes corresponding to the respective offset portions 30 at positions corresponding to the respective offset portions 30 of the circuit body 1. Part) is formed.

  The circuit body 1 is attached to the resin casing 2 in a state where, for example, an adhesive is applied to the back side surface (attachment surface) of the flat portion 50 of the resin casing 2 or an adhesive tape is applied. As shown in FIG. 2, the front side surface of the planar portion 20 of the circuit body 1 (that is, the side surface (i.e., the respective offset portions 30 of the circuit body 1 are respectively fitted with the corresponding operation portions 60 of the resin housing 2). The reference surface 21. the attachment surface) and the back side surface of the flat portion 50 of the resin housing 2 are attached. At the time of pasting, the positioning pin 61 protruding from the resin casing 2 is inserted into the through hole 23 of the circuit body 1 so that the circuit body 1 is positioned with respect to the resin casing 2. From the viewpoint of further improving the positioning accuracy, pasting may be performed while correcting the positions of both based on an image photographed using a camera or the like. In addition, after pasting, the pasting surfaces may be pressed (pressed) in the pasting direction. The molded resin body 3 is formed by pasting the processed circuit body 1 to the molded resin casing 2, but the planar circuit body 1 before processing is pasted to the unmolded resin casing 2. Then, the resin molded body 3 may be formed by integration by pressing.

  The resin molded body 3 is one of the components constituting a map lamp that is grounded to a ceiling or the like above the driver's seat of an automobile. When the operator's fingertip or the like contacts (or presses) the operation portion 60 (the front side surface shown in FIG. 3B), the resin molded body 3 is behind the operation portion 60 due to the contact. The change in the capacitance generated in the circuit body 1 (offset conductor pattern 42) is output from the circuit terminal 44 to a control device (not shown) or the like. In other words, the resin molded body 3 has a so-called capacitance-type contact sensor function.

  Next, a preferable aspect of the connection conductor pattern 43 on the connection surface 32 will be described with reference to FIGS. FIG. 4A is a diagram illustrating a portion that becomes the offset portion 30 after processing in the planar circuit body 1 before performing processing (three-dimensional formation processing) for forming the offset portion 30. FIG. 4B is a view showing the offset portion 30 formed by such processing. In FIG. 4A, a two-dot chain line aa indicates a position where a boundary between the offset surface 31 and the connecting surface 32 is formed when the three-dimensional processing is performed, and a two-dot chain line bb indicates a three-dimensional processing. The boundary between the reference surface 21 and the connecting surface 32 formed by The positions of the two-dot chain line aa and the two-dot chain line bb are based on the shape of a mold for performing the three-dimensional processing (see, for example, FIG. 8) and the like (see FIG. )) Can be specified.

  As shown in FIG. 4A, when the electric circuit 40 is printed on the surface of the planar resin film 10, the width of the connection conductor pattern 43 is larger than the width of the reference conductor pattern 41 and the offset conductor pattern 42. It has been enlarged. This is based on the following reason.

  That is, if processing (three-dimensional processing) is performed on the resin film 10 on which the electric circuit 40 is printed by using vacuum forming or pressure forming to form the offset portion 30, the reference surface 21 and the offset surface 31 are expanded. The amount of extension of the connecting surface 32 increases with respect to the amount. In other words, the extension amount of the connection conductor pattern 43 is larger than the extension amounts of the reference conductor pattern 41 and the offset conductor pattern 42. In addition, as the extension amount of the conductor pattern is larger, the width of the conductor pattern in the extended portion is reduced, and the circuit resistance is increased.

  The width of the connecting conductor pattern 43 in this example is determined in consideration of the above-described difference in the extension amount. Therefore, when the part shown in FIG. 4A is processed as shown in FIG. 4B, the width of the connection conductor pattern 43 and the widths of the reference conductor pattern 41 and the offset conductor pattern 42 are substantially reduced after the processing. It becomes the same size. As a result, variations in the electrical resistance value of the electrical circuit 40 due to processing (differences in electrical resistance values among the reference conductor pattern 41, the offset conductor pattern 42, and the connecting conductor pattern 43) can be suppressed.

  Further, as shown in FIG. 4B, in the processed circuit body 1, the electric circuit 40 (the reference conductor pattern 41, the offset conductor pattern 42, and the connection conductor pattern 43) is formed between the offset surface 31 and the connection surface 32. A portion that is a boundary and has a linear shape (hereinafter referred to as “linear peripheral edge a1”), and a portion that is a boundary between the reference surface 21 and the connecting surface 32 and has a linear shape (hereinafter “linear base end portion”) b1 ")), and has a wiring shape extending along the connecting surface 32. Conversely, the wiring shape before processing (see FIG. 4A) is determined so as to have such a wiring shape after processing.

  Furthermore, in this example, as shown in FIG. 4B, the linear peripheral edge portion a1 and the linear base end portion b1 are substantially parallel, and the electric circuit 40 (the connecting conductor pattern 43) is connected to the linear peripheral edge portion. The wiring shape extends along the connection surface 32 so as to pass through the shortest path connecting between a1 and the linear base end b1. In other words, the electric circuit 40 (the connecting conductor pattern 43) is orthogonal to the linear peripheral edge a1 and the linear base end b1 that are parallel to each other.

  Since the electric circuit 40 has the above-described wiring shape, the electric resistance value of the electric circuit 40 that passes through the offset portion 30 can be set with high accuracy. In other words, the difference (variation) between the target electrical resistance value (design value) and the actual processed electrical resistance value (actual value) for the electrical circuit 40 passing through the offset portion 30 can be reduced. it can.

  The reason is as follows. According to the test conducted by the inventor and the like (details will be described later), a region c1 (the coupling surface 32) sandwiched between the linear peripheral edge a1 of the offset surface 31 and the linear base end b1 of the reference surface 21. The deformation mode of the resin film 10 in a part of the region is more than the deformation mode of the resin film 10 in a region other than the region c1 (for example, a region sandwiched between the curved peripheral edge a2 and the curved base end b2). It turned out to be simple. Specifically, when the linear peripheral edge part a1 and the linear base end part b1 are parallel, it has been clarified that the resin film 10 extends almost one-dimensionally (for example, in the extrusion direction) in the region c1. . On the other hand, in the region other than the region c1, it has become clear that the resin film 10 is almost two-dimensional (for example, extending in the extrusion direction and extending in other directions).

  Therefore, the electric circuit 40 passes through a region c1 sandwiched between the linear peripheral edge a1 and the linear base end b1 (so as to pass through both the linear peripheral edge a1 and the linear base end b1). If it provides, compared with the case where the electric circuit 40 is provided so that it may pass through another area | region, it will become easy to predict the deformation | transformation degree of the electric circuit 40 at the time of a process. Then, if the shape of the electric circuit 40 (the width of the connecting conductor pattern 43 before processing as shown in FIG. 4A) is determined based on the predicted degree of deformation, it passes through the offset portion 30 (after processing). Thus, the electrical resistance value of the electrical circuit 40 can be set with high accuracy. As understood from the above description, the electrical resistance value can be set with such high accuracy as long as the offset portion 30 has the linear peripheral edge portion a1 and the linear base end portion b1. The present invention can also be applied to the offset portion 30.

  The deformation mode of the resin film 10 described above will be further described with reference to the photograph shown in FIG. The photograph in FIG. 5 (a) shows the molding in the case where a convex portion having a square offset surface 31 is molded (for example, vacuum forming) on the resin film 10 on which a grid-like straight line is printed in order to visualize the deformation mode. The subsequent resin film 10 is shown. As understood from FIG. 5A, the linear portion a <b> 1 (the central portion of the side of the peripheral portion) in the peripheral portion of the offset surface 31 and the linear portion in the base end portion of the reference surface 21. In the region between the portion b1 (the central portion of the side of the base end portion), each grid surrounded by the straight line is deformed almost one-dimensionally. That is, the shape of each grid is deformed from a square to a rectangle.

  On the other hand, the shape of each grid is multidimensionally deformed around the curved portion b2 (the portion corresponding to the apex of the base end portion) in the base end portion of the reference surface 21. That is, the shape of each grid is deformed from a square to a rhombus.

  On the other hand, the photograph in FIG. 5B shows the resin film after formation when a concave portion having a square offset surface 31 is formed (for example, vacuum formation) on the same resin film 10 as described above. Also in FIG. 5B, as in FIG. 5A, out of the linear portion a <b> 1 (the central portion of the side of the peripheral portion) of the peripheral portion of the offset surface 31 and the base end portion of the reference surface 21. The shape of each grid is deformed from a square to a rectangle in a region between the linear portion b1 (the central portion of the base end side). On the other hand, the shape of each grid is deformed from a square to a rhombus or the like around the curved portion a2 (the portion corresponding to the apex of the peripheral portion) in the peripheral portion of the offset surface 31. However, in the example shown in FIG. 5B, the area where each grid changes one-dimensionally is narrower than in the example shown in FIG. In consideration of such deformation, the electric circuit 40 has a linear portion a1 (a central portion of the side of the peripheral portion) of the peripheral portion of the offset surface 31 regardless of whether the convex portion is formed or the concave portion is formed. ) And the linear portion b1 (the central portion of the side of the base end portion) of the base end portion of the reference surface 21 is preferably passed through as close to the center as possible.

  By the way, as shown in FIG. 5A and FIG. 5B, in the resin film 10 after processing, the peripheral portion of the offset surface 31 has a curved curved surface, and the offset surface 31 and the connecting surface The boundary (boundary line) with 32 may not always be clear. The same applies to the boundary (boundary line) between the reference surface 21 and the coupling surface 32. In this case, for example, as shown in FIG. 6, the offset surface 31 and the reference surface 21 are defined as surfaces (planes) that do not have a curved portion, and curved surfaces that connect the offset surface 31 and the reference surface 21, which are these surfaces, are defined. It may be defined as a connecting surface 32. According to this definition, the peripheral edge portion of the offset surface 31 corresponds to the position a in FIG. 6, and the base end portion of the reference surface 21 corresponds to the position b in FIG.

  Further, according to the tests conducted by the inventors, as shown in FIG. 7, when the boundary b between the reference surface 21, the coupling surface, and 32 has a polygonal shape (rectangular shape in FIG. 6), the boundary The center when a base end portion between one vertex of b and another vertex adjacent to the one vertex is divided into three portions L1, L2, and L3 having a length of 1: 8: 1 It has been found that the portion L2 is usually linear (that is, the linear base end b1).

  In other words, if the wiring shape of the electric circuit 40 is determined so as to pass through the central portion L2, the electric circuit 40 normally passes through the linear base end b1. Therefore, the wiring shape passing through the straight base end b1 can be easily determined.

  Hereinafter, an example of processing using vacuum forming and pressure forming performed to form the offset portion 30 for the planar circuit body 1 on which the electric circuit 40 is printed will be briefly described with reference to FIG. To do.

  As shown in FIG. 8A, on the upper surface of a table 70 (mold) used for this processing, reference corresponding surfaces 71 corresponding to the reference surface 21, the offset surface 31, and the connecting surface 32 of the circuit body 1, respectively. , Offset corresponding surfaces 72 and 73 and a connection corresponding surface 74 exist. The offset corresponding surface 72 corresponds to the offset surface 31 of the protruding portion 30 in the offset portion 30, and the offset corresponding surface 73 corresponds to the offset surface 31 of the recessed portion 30 in the offset portion 30. A plurality of suction holes 75 penetrating in the vertical direction are formed at predetermined positions of the table 70.

  First, as shown in FIG. 8A, the planar circuit body 1 on which the electric circuit 40 is printed is placed on the upper surface of the table 70. Next, the lower part and the upper part of the table 70 are hermetically covered with a predetermined jig (not shown). In this state, the circuit body 1 is heated.

  Next, as shown in FIG. 8B, the circuit body 1 is vacuum-sucked downward (vacuum forming) using the suction holes 75 (vacuum forming), and compressed air is applied to the sealed space above the table 70. Then, the circuit body 1 is pressurized downward (pressure forming). As a result, the circuit body 1 is plastically deformed while extending so as to be in close contact over the entire upper surface of the table 70. Thereby, each offset part 30 is formed, respectively.

  Then, as shown in FIG. 8C, the processed circuit body 1 is taken out from the table 70, and excess portions on the periphery of the circuit body 1 are cut and removed (trimming). Thereby, as shown in FIG.8 (d), the circuit body 1 is completed.

  In the example shown in FIG. 8, both vacuum forming and pressure forming are used as processing, but only one of vacuum forming and pressure forming may be used. When processing is performed using vacuum forming or pressure forming as described above, the corners of the offset surface 31 may not be completely corners but may remain round.

  As described above, according to the resin molded body 3 including the circuit body 1 according to the embodiment of the present invention, it is easy to predict the degree of deformation of the electric circuit 40 during manufacturing (processing). Therefore, the circuit body 1 and the resin molded body 3 are suitable for circuit bodies having various surface shapes (offset portions having various shapes) as well as surface shapes (hemispherical convex portions) as in conventional circuit bodies. It can be said that the electric circuit 40 having a wiring shape is provided.

<Other aspects>
In addition, this invention is not limited to said each embodiment, A various modification is employable within the scope of the present invention. For example, the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like can be made as appropriate. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

  For example, in the above-described embodiment, the electric circuit 40 is formed on the front side surface of the resin film 10 by printing a conductor pattern using a conductive ink containing silver and copper and a conductive paste. Yes. However, the electric circuit 40 may be formed on the front surface of the resin film 10 by plating using a conductive material containing silver, copper, or the like.

  Furthermore, in the said embodiment, the circuit body 1 is supported by the resin housing | casing 2 by affixing the circuit body 1 on the resin housing | casing 2. FIG. However, the circuit body 1 may be supported by the resin housing 2 by the insert molding of the circuit body 1 to the resin housing 2.

  Furthermore, it may be formed so as to be buried in the resin film 10. In the above embodiment, the offset surface 31 is a flat surface, but may be a curved surface. The offset surface 31 has a quadrangular shape, but may have a polygonal shape other than the quadrangular shape.

Here, the features of the above-described embodiments of the “circuit body” and the “resin molded body” according to the present invention are summarized and listed in the following (1) to (4), respectively.
(1) A circuit body (1) comprising a resin sheet body (10) and an electric circuit (40) having a wiring shape along the surface shape of the sheet body,
The sheet body (10)
The surface including a predetermined reference surface (21), an offset surface (31) displaced in the thickness direction of the sheet body from the reference surface, and a connecting surface (32) connecting the reference surface and the offset surface. Has a shape,
The electrical circuit (40)
At the boundary between the offset surface (31) and the connecting surface (32) and having a linear peripheral edge (a1) having a linear shape, and at the boundary between the reference surface (21) and the connecting surface (32) The wiring shape (40) extending along the connecting surface (32) so as to pass through both the linear base end (b1) having a linear shape.
Circuit body.
(2) In the circuit body according to (1) above,
The linear peripheral edge (a1) and the linear base end (b1) are parallel,
The electrical circuit (40)
The wiring shape extends along the connecting surface (32) so as to pass through the shortest path connecting the linear peripheral edge (a1) and the linear base end (b1).
Circuit body.
(3) In the circuit body according to (1) or (2) above,
The boundary between the reference surface (21) and the connecting surface (32) has a polygonal shape,
The electrical circuit (40)
The straight base end portion (b1) is defined as a base end portion between one vertex of the boundary between the reference plane and the connecting surface and another vertex adjacent to the one vertex 1: 8: Passing through the central part when divided into three parts (L1, L2, L3) having a length of 1,
Circuit body.
(4) The resin body (2) and the circuit body according to any one of (1) to (3) supported by the casing by insert molding or pasting to the casing. And a resin molded body (3).

DESCRIPTION OF SYMBOLS 1 Circuit body 2 Resin housing | casing 3 Resin molding 10 Resin film (sheet body)
21 Reference surface 31 Offset surface 32 Connection surface 40 Electrical circuit 43 Connection conductor pattern (wiring shape)
a1 linear peripheral edge b1 linear base end

Claims (4)

A circuit body comprising a resin sheet body and an electric circuit having a wiring shape along the surface shape of the sheet body,
The sheet body is
The surface shape includes a predetermined reference surface, an offset surface displaced in the thickness direction of the sheet body from the reference surface, and a connection surface connecting the reference surface and the offset surface,
The electrical circuit is
Both a linear peripheral edge that is a boundary between the offset surface and the coupling surface and has a linear shape, and a linear base end that is a boundary between the reference surface and the coupling surface and has a linear shape, Having the wiring shape extending along the connecting surface so as to pass through,
Circuit body. The circuit body according to claim 1,
The linear peripheral edge and the linear base end are parallel;
The electrical circuit is
Having the wiring shape extending along the connection surface so as to pass through the shortest path connecting the linear peripheral edge and the linear base end;
Circuit body. In the circuit body according to claim 1 or 2,
The boundary between the reference surface and the connecting surface has a polygonal shape,
The electrical circuit is
As the linear base end portion, a base end portion between one vertex of the boundary between the reference plane and the connection surface and another vertex adjacent to the one vertex has a length of 1: 8: 1. Passing through the central part when divided into three parts,
Circuit body.   A resin molded body comprising: a resin casing; and the circuit body according to any one of claims 1 to 3 supported by the casing by insert molding or pasting to the casing. .