JP2015117361A - Resin composition for semiconductor encapsulation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor encapsulation, which has an excellent injection property when used as an underfill, provides a cured product with excellent adhesiveness, and can suppress occurrence and propagation of a fillet crack.SOLUTION: Provided is a resin composition for semiconductor encapsulation, comprising a glycoluril compound represented by formula (I) as an epoxy compound, and a curing agent. Also provided is a resin composition for semiconductor encapsulation comprising an epoxy compound or an epoxy resin excluding the glycoluril compound represented by formula (I). (Rand Rmay be the same or different, and represent H, a lower alkyl group, or a phenyl group; and Rto Rmay be the same or different, and represent H or a glycidyl group.)

Description

  The present invention relates to a semiconductor sealing resin composition comprising a glycoluril compound.

  In recent years, development of a resin composition that fills (seals) a clearance between a semiconductor element and a substrate and fixes them together, that is, an underfill, is progressing with a change in a semiconductor mounting method to a flip chip type.

  In general, a resin composition for encapsulating a semiconductor used as an underfill is required to have good injectability when filling the clearance. Further, the cured product is required to have excellent adhesion and suppression of generation and progress of cracks caused by a difference in thermal expansion coefficient between a substrate called a fillet crack and a material such as a semiconductor element.

  In order to meet such requirements, Patent Document 1 proposes a reactive diluent for epoxy resin that is used to adjust a high-viscosity epoxy resin composition to a viscosity suitable for work. However, when the monofunctional epoxy compound or polyhydric alcohol glycidyl ether described in this document is used as a diluent, there is a problem that the glass transition temperature (Tg) of the cured product and other mechanical properties are lowered. there were.

  Moreover, a method of adding a rubber component to a resin composition is known for the purpose of suppressing fillet cracks. However, when a rubber component is added to the resin composition, not only the glass transition temperature (Tg) and other mechanical properties of the cured product are lowered, but also the viscosity of the resin composition is increased, as in the above method. There was a problem such as.

JP-A-6-172336

  An object of the present invention is to provide a resin composition for encapsulating a semiconductor that is excellent in injectability when used as an underfill, has excellent adhesion of a cured product, and can suppress the occurrence and progress of fillet cracks. And

As a result of intensive studies to solve the above-mentioned problems, the present inventor has found that the intended purpose is achieved by using a resin composition containing a glycoluril compound as an epoxy compound. Has been completed.
That is, the first invention is a resin composition for semiconductor encapsulation characterized by containing a glycoluril compound represented by the chemical formula (I) and a curing agent.

（式中、Ｒ^１およびＲ^２は、同一または異なって、水素原子、低級アルキル基またはフェニル基を表し、Ｒ^３、Ｒ^４およびＲ^５は、同一または異なって、水素原子またはグリシジル基を表す。）
第２の発明は、化学式（Ｉ）で示されるグリコールウリル化合物を除くエポキシ化合物またはエポキシ樹脂を含有することを特徴とする第１の発明の半導体封止用樹脂組成物である。
第３の発明は、無機充填剤、硬化促進剤、コアシェルゴムおよび反応性希釈剤を含有することを特徴とする第１の発明または第２の発明の半導体封止用樹脂組成物である。

(In the formula, R ¹ and R ² are the same or different and each represents a hydrogen atom, a lower alkyl group or a phenyl group, and R ³ , R ⁴ and R ⁵ are the same or different and each represents a hydrogen atom or a glycidyl group. .)
A second invention is a resin composition for encapsulating a semiconductor according to the first invention, which contains an epoxy compound or an epoxy resin excluding the glycoluril compound represented by the chemical formula (I).
3rd invention is a resin composition for semiconductor sealing of 1st invention or 2nd invention characterized by containing an inorganic filler, a hardening accelerator, core-shell rubber, and a reactive diluent.

  The resin composition for encapsulating a semiconductor of the present invention is excellent in injectability when used as an underfill and excellent in adhesion of a cured product, and can suppress the occurrence and progress of fillet cracks.

Hereinafter, the present invention will be described in detail.
The glycoluril compound used in the practice of the present invention is an epoxy compound represented by the following chemical formula (I).
1-glycidyl glycoluril,
1,3-diglycidyl glycoluril,
1,4-diglycidyl glycoluril,
1,6-diglycidyl glycoluril,
1,3,4-triglycidyl glycoluril,
1,3,4,6-tetraglycidylglycoluril,
1-glycidyl-3a-methylglycoluril,
1,3-diglycidyl-3a-methylglycoluril,
1,4-diglycidyl-3a-methylglycoluril,
1,6-diglycidyl-3a-methylglycoluril,
1,3,4-triglycidyl-3a-methylglycoluril,
1,3,4,6-tetraglycidyl-3a-methylglycoluril,
1-glycidyl-3a, 6a-dimethylglycoluril,
1,3-diglycidyl-3a, 6a-dimethylglycoluril,
1,4-diglycidyl-3a, 6a-dimethylglycoluril,
1,6-diglycidyl-3a, 6a-dimethylglycoluril,
1,3,4-triglycidyl-3a, 6a-dimethylglycoluril,
1,3,4,6-tetraglycidyl-3a, 6a-dimethylglycoluril,
1-glycidyl-3a, 6a-diphenylglycoluril,
1,3-diglycidyl-3a, 6a-diphenylglycoluril,
1,4-diglycidyl-3a, 6a-diphenylglycoluril,
1,6-diglycidyl-3a, 6a-diphenylglycoluril,
1,3,4-triglycidyl-3a, 6a-diphenylglycoluril,
1,3,4,6-tetraglycidyl-3a, 6a-diphenylglycoluril and the like can be mentioned. These glycoluril compounds may be used alone or in combination of two or more.

（式中、Ｒ^１およびＲ^２は、同一または異なって、水素原子、低級アルキル基またはフェニル基を表し、Ｒ^３、Ｒ^４およびＲ^５は、同一または異なって、水素原子またはグリシジル基を表す。）

(In the formula, R ¹ and R ² are the same or different and each represents a hydrogen atom, a lower alkyl group or a phenyl group, and R ³ , R ⁴ and R ⁵ are the same or different and each represents a hydrogen atom or a glycidyl group. .)

  Examples of the curing agent used in the practice of the present invention include amine-based or acid anhydride-based curing agents. These have many types and are excellent in adhesion to a semiconductor element passivation film (for example, polyimide). Therefore, when used in a resin composition for semiconductor encapsulation, peeling during a moisture absorption reflow resistance test is prevented. be able to.

  As the amine-based curing agent, known amine-based curing agents can be used without particular limitation. For example, triethylenetetraamine, tetraethylenepentamine, m-xylenediamine, trimethylhexamethylenediamine, 2- Aliphatic polyamines such as methylpentamethylenediamine, isophoronediamine, 1,3-bisaminomethylcyclohexane, bis (4-aminocyclohexyl) methane, norbornenediamine, 1,2-diaminocyclohexane, and the like, N- Piperazine-type polyamines such as aminoethylpiperazine and 1,4-bis (2-amino-2-methylpropyl) piperazine, diethyltoluenediamine, dimethylthiotoluenediamine, 4,4'-diamino-3,3'-diethyldiphenylmethane , Aromatic polyamines such as bis (methylthio) toluenediamine, diaminodiphenylmethane, m-phenylenediamine, diaminodiphenylsulfone, diethyltoluenediamine, trimethylenebis (4-aminobenzoate), polytetramethylene oxide-di-p-aminobenzoate Is mentioned. You may use these individually or in combination of 2 or more types.

  In the resin composition for semiconductor encapsulation of the present invention, the amount of the amine curing agent used is the total of the glycoluril compound, the epoxy compound or epoxy resin excluding the glycoluril compound, and the reactive diluent epoxy combined. It is preferable to set it as 0.01-3.0 equivalent with respect to an epoxy equivalent.

  As the acid anhydride-based curing agent, known acid anhydride-based curing agents can be used without any particular limitation. For example, methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, alkylated tetrahydro Phthalic anhydride, hexahydrophthalic anhydride, methyl hymic anhydride, succinic anhydride substituted with alkenyl groups, methyl nadic anhydride, glutaric anhydride, 3,4-dimethyl-6- ( 2-Methyl-1-propenyl) -1,2,3,6-tetrahydrophthalic anhydride, 1-isopropyl-4-methyl-bicyclo [2.2.2] oct-5-ene-2,3-dicarboxylic Acid anhydride, norbornane-2,3-dicarboxylic acid anhydride, methylnorbornane-2,3-dicarboxylic acid anhydride, hydrogenated methylnadic acid anhydride, diethyl Such Rutaru acid anhydride. Commercially available products include acid anhydrides (grade: YH306, YH307) manufactured by Mitsubishi Chemical Corporation. You may use these individually or in combination of 2 or more types.

  In the resin composition for semiconductor encapsulation of the present invention, the amount of the acid anhydride curing agent used is the glycoluril compound, the epoxy compound or epoxy resin excluding the glycoluril compound, and each epoxy of the reactive diluent. The total epoxy equivalent is preferably 0.5 to 1.5 equivalents.

  As an epoxy compound or an epoxy resin excluding the glycoluril compound used in the practice of the present invention (hereinafter referred to as an epoxy resin together), it is preferably liquid at room temperature, Other liquid epoxy resins and / or diluents can be added and used in a liquid state.

  Examples of the epoxy resin include bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, biphenyl type epoxy resin, novolac type epoxy resin, alicyclic epoxy resin, and naphthalene. Type epoxy resin, ether type or polyether type epoxy resin, oxirane ring-containing polybutadiene, aminophenol type epoxy resin, silicone epoxy copolymer resin and the like.

The epoxy resin that is liquid at room temperature is a bisphenol A type epoxy resin having an average molecular weight of about 400 or less; branched polyfunctional bisphenol A such as p-glycidyloxyphenyldimethyltrisbisphenol A diglycidyl ether. Type epoxy resin; bisphenol F type epoxy resin; phenol novolak type epoxy resin having an average molecular weight of about 570 or less; vinyl (3,4-cyclohexene) dioxide, 3,4-epoxycyclohexylcarboxylic acid (3,4-epoxycyclohexyl) ) Methyl, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 2- (3,4-epoxycyclohexyl) -5,1-spiro (3,4-epoxycyclohexyl) -m-dioxane Alicyclic epoxy tree Biphenyl type epoxy resin such as 3,3 ′, 5,5′-tetramethyl-4,4′-diglycidyloxybiphenyl; diglycidyl hexahydrophthalate, diglycidyl 3-methylhexahydrophthalate, hexahydroterephthalic acid Glycidyl ester type epoxy resin such as diglycidyl; Glycidylamine type epoxy such as diglycidyl aniline, diglycidyl toluidine, triglycidyl-p-aminophenol, tetraglycidyl-m-xylylenediamine, tetraglycidyl bis (aminomethyl) cyclohexane Resin; Hydantoin type epoxy resin such as 1,3-diglycidyl-5-methyl-5-ethylhydantoin; naphthalene ring-containing epoxy resin and the like.
In addition, epoxy resins having a silicone skeleton such as 1,3-bis (3-glycidoxypropyl) -1,1,3,3-tetramethyldisiloxane, (poly) ethylene glycol diglycidyl ether, (poly ) Diepoxide compounds such as propylene glycol diglycidyl ether, butanediol glycidyl ether, neopentyl glycol diglycidyl ether; and triepoxide compounds such as trimethylolpropane triglycidyl ether and glycerin triglycidyl ether.

  It is also possible to use a solid or ultra-high viscosity epoxy resin at room temperature. Examples of such an epoxy resin include high molecular weight bisphenol A type epoxy resin, novolac epoxy resin, tetrabromobisphenol A type epoxy resin, and the like. It is done. These can adjust fluidity in combination with an epoxy resin that is liquid at room temperature.

  When using an epoxy resin that is solid or ultra-highly viscous at room temperature, low-viscosity epoxy resins such as (poly) ethylene glycol diglycidyl ether, (poly) propylene glycol diglycidyl ether, butanediol glycidyl ether, neopentyl glycol It is preferably combined with a diepoxide compound such as diglycidyl ether; a triepoxide compound such as trimethylolpropane triglycidyl ether or glycerin triglycidyl ether.

  As the diluent, either a non-reactive diluent or a reactive diluent can be used, but a reactive diluent is preferred. In the present specification, the reactive diluent refers to a compound having one epoxy group and having a relatively low viscosity at room temperature. In addition to the epoxy group, other polymerizable functional groups such as, for example, , An alkenyl group such as vinyl and allyl; and an unsaturated carboxylic acid residue such as acryloyl and methacryloyl.

  Examples of the reactive diluent include mono-like compounds such as n-butyl glycidyl ether, 2-ethylhexyl glycidyl ether, phenyl glycidyl ether, cresyl glycidyl ether, ps-butylphenyl glycidyl ether, styrene oxide, and α-pinene oxide. Epoxide compounds; monoepoxide compounds having other functional groups such as allyl glycidyl ether, glycidyl methacrylate, and 1-vinyl-3,4-epoxycyclohexane.

  The inorganic filler used in the practice of the present invention is blended in a resin composition for semiconductor encapsulation, and when used as an underfill by adjusting the thermal expansion coefficient of the composition, Improve heat resistance and moisture resistance.

  In the semiconductor sealing resin composition of the present invention, the amount of the inorganic filler used is 10 to 500 parts by weight with respect to 100 parts by weight of the semiconductor sealing resin composition not containing the inorganic filler. preferable.

  As an inorganic filler, a well-known thing can be used as a component of the resin composition for semiconductor sealing or underfill without a restriction | limiting. Examples thereof include silica, acrylic beads, glass beads, urethane beads, and the like. From the viewpoint of cost and compatibility with other components of the semiconductor sealing resin composition, silica is preferable.

  As the curing accelerator used in the practice of the present invention, those known for epoxy resins can be used without limitation. Examples include imidazole-based curing accelerators (including microcapsule type and epoxy adduct type), tertiary amine-based curing accelerators and phosphorus-based curing accelerators. From the viewpoints of compatibility with the other components of the resin composition and the curing rate.

Examples of the imidazole curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole. And the imidazole compound.
In addition, encapsulated imidazole called microcapsule type imidazole or epoxy adduct type imidazole can also be used. That is, an imidazole-based latent curing agent encapsulated by adducting an imidazole compound with urea or an isocyanate compound and then blocking the surface with an isocyanate compound, or adducting an imidazole compound with an epoxy compound, and then further treating the surface with an isocyanate compound An imidazole-type latent curing agent encapsulated by blocking with can also be used. Specifically, NovaCure HX3941HP, NovaCure HXA3042HP, NovaCure HXA3922HP, NovaCure HXA3792, NovaCure HX3748, NovaCure HX3721, NovaCure HX3722, NovaCure HX3088, NovaCure HX3741 and NovaCure HX3741 Etc. Note that NovaCure is a product in which encapsulated imidazole and thermosetting epoxy resin are mixed in a certain ratio.

  In the resin composition for semiconductor encapsulation of the present invention, the amount of curing accelerator used is appropriately set depending on the type of curing accelerator, but in the case of an imidazole curing accelerator, the glycoluril compound and the glycoluril compound are excluded. It is preferable to set it as 0.01-100 weight part with respect to the weight (100 weight part) which match | combined the epoxy resin.

  The core-shell rubber used in the practice of the present invention is used for the purpose of suppressing the occurrence and progress of fillet cracks when the semiconductor sealing resin composition is used as an underfill. Specifically, the inclusion of the core-shell rubber lowers the elasticity of the cured resin composition for semiconductor encapsulation, thereby reducing the stress generated in the fillet portion and suppressing the occurrence of fillet cracks. Moreover, when a fillet crack occurs, the core-shell rubber acts as a stress relaxation agent, and the progress of the fillet crack can be suppressed.

In the present specification, the core-shell rubber refers to a rubber material having a multilayer structure composed of a core layer having a different composition and one or more shell layers covering the core layer. As core-shell rubber, the core layer is composed of a material with excellent flexibility, and the shell layer is composed of a material with excellent affinity for glycoluril compounds and epoxy resins excluding glycoluril compounds, thereby increasing dispersibility. While achieving low elasticity.
Examples of the constituent material of the core layer include silicone elastomers, butadiene elastomers, styrene elastomers, acrylic elastomers, polyolefin elastomers, and silicone / acrylic composite elastomers.
On the other hand, examples of the constituent material of the shell layer include an acrylic resin and an epoxy resin, and the acrylic resin is preferable from the viewpoint of affinity for a glycoluril compound and an epoxy resin excluding the glycoluril compound.

  In order to improve the injectability when using the resin composition for semiconductor encapsulation as an underfill and to suppress the occurrence of fillet cracks in the cured product, the average particle size of the core-shell rubber is preferably 50 μm or less.

  In the resin composition for semiconductor encapsulation of the present invention, the amount of the core-shell rubber used is 0.1 to 200 with respect to the combined weight (100 parts by weight) of the glycoluril compound and the epoxy resin excluding the glycoluril compound. It is preferable to use parts by weight.

The reactive diluent used in the practice of the present invention is used for the purpose of lowering the viscosity of the resin composition for semiconductor encapsulation. The reactive diluent has an epoxy group in the molecule, and reacts with the curing agent to become a part of the cured product. Various monoepoxy compounds and glycidyl ether compounds of polyhydric alcohols are reactive dilutions. Conventionally used as an agent. However, when a compound having only one functional group (epoxy group) that contributes to the reaction with the curing agent is used as a reactive diluent, three-dimensional crosslinking cannot be formed during curing. There has been a problem that the glass transition temperature (Tg) and toughness of the cured resin composition for semiconductor encapsulation are lowered.
In the resin composition for encapsulating a semiconductor of the present invention, a crosslink is formed three-dimensionally at the time of curing by using a reactive diluent comprising a compound containing two or more glycidyl groups in one molecule. can do. Thereby, the glass transition temperature (Tg) and toughness fall in the hardened | cured material of the resin composition for semiconductor sealing can be suppressed.

  As the reactive diluent, polypropylene glycol diglycidyl ether having two or more glycidyl groups in one molecule is suitable.

  In the semiconductor sealing resin composition of the present invention, the amount of the reactive diluent used is 0.1 with respect to the combined weight (100 parts by weight) of the glycoluril compound and the epoxy resin excluding the glycoluril compound. It is preferable to set it to -200 weight part.

In the resin composition for semiconductor encapsulation of the present invention, a silane coupling agent may be blended in order to improve adhesion.
Examples of the silane coupling agent include various silane coupling agents such as epoxy, amino, vinyl, methacrylic, acrylic, and mercapto. Among these, the epoxy-based silane coupling agent is preferable because it is excellent in the effect of improving the adhesion and mechanical strength when the semiconductor sealing resin composition is used as an underfill.

  Examples of the epoxy-based silane coupling agent include 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane (trade name: KBM-303, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidyl Sidoxypropylmethyldimethoxysilane (trade name: KBM-402, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropyltrimethoxysilane (trade name: KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropylmethyl Examples include diethoxysilane, (trade name: KBE-402, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropyltriethoxysilane (trade name: KBE-403, manufactured by Shin-Etsu Chemical Co., Ltd.), and the like.

  When mix | blending a silane coupling agent, it is preferable that a silane coupling agent is 0.01 to 10 weight% in the resin composition for semiconductor sealing.

  In the resin composition for encapsulating a semiconductor of the present invention, an antifoaming agent, an ion trapping agent, a surfactant, a surface modifier, a pigment, a dye, and other colorants are blended within a range not impairing the effects of the present invention. can do.

The resin composition for semiconductor encapsulation of the present invention is prepared by measuring and mixing a predetermined amount of each of the above-mentioned components. Examples of the apparatus used for mixing include a likai machine, a pot mill, a three-roll mill, a rotary mixer, and a twin screw mixer. When the epoxy resin excluding the glycoluril compound or the glycoluril compound is solid, it is preferably mixed by liquefaction or fluidization by heating or the like.
Even if each component is mixed at the same time, an appropriate mixing method such as mixing some components first and mixing the remaining components later may be employed.

  It is preferable to implement hardening of the resin composition for semiconductor sealing of this invention on the conditions of 100-250 degreeC / 1 second-30 minutes.

  The resin composition for semiconductor encapsulation of the present invention can be suitably used as an underfill. Moreover, the resin composition for semiconductor encapsulation of this invention can be used also for uses, such as an adhesive agent.

  An electronic component to which the present invention can be applied uses an underfill and seals a clearance (gap) between a substrate and a semiconductor element. Here, examples of the electronic component to be sealed include a semiconductor element, an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, a diode, and a capacitor.

  EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention concretely, this invention is not limited to these.

<Preparation of resin composition>
The ratio shown in Table 1 is 1,3,4,6-tetraglycidylglycoluril (manufactured by Shikoku Kasei Kogyo Co., Ltd .: TG-G) and bisphenol F type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd .: YDF8170C) Used in. In addition, 50 parts by weight of 4,4′-diamino-3,3′-diethyldiphenylmethane (manufactured by Nippon Kayaku Co., Ltd .: Kayahard AA) as a curing agent, and epoxy surface-treated silica filler (manufactured by Admatechs) as an inorganic filler : SE5200SEE, 200 parts by weight of average particle size 2 μm), 2 parts by weight of 2-phenyl-4-methyl-5-hydroxymethylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd .: 2P4MHZ) as a curing accelerator, core shell rubber (core: silicone) Rubber, shell: 10 parts by weight of acrylic resin, average particle size 0.3 μm), 20 parts by weight of polypropylene glycol diglycidyl ether (epoxy equivalent: 320, total chlorine: 1000 ppm) as reactive diluent, silane coupling agent 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd .: KBM) The 2 parts by weight the blended resin composition 03), and kneaded with a roll mill, Examples 1-3 were prepared semiconductor sealing resin composition of Comparative Example 1.

<Viscosity>
About the resin composition obtained by the said operation, the viscosity of the resin composition was measured on 25 degreeC / 50rpm conditions using the Brookfield viscometer.

<Glass transition temperature>
The resin composition obtained by the above operation was heat-cured at 150 ° C./1 hour, and the glass transition temperature (Tg) of the obtained cured product was measured by the TMA method. In addition, Bruker ASX TMA4000SA was used as a measuring apparatus.

<Hygroscopic reflow resistance>
JKIT Type III substrate (manufactured by Hitachi ULSI Systems) (with a size of 30 mm × 50 mm × 0.7 mm, die size 10 mm × 10 mm × 0.7 mm, PI passivation die) on which PHASE2E175 (manufactured by Hitachi ULSI Systems) is flip-chip mounted. (Sn-3Ag-0.5Cu bump, bump pitch 175 μm), the resin composition obtained by the above operation was injected and cured by heating at 150 ° C./1 hour, and then the resistance value was measured. Next, after performing a reflow process (260 degreeC), it was left to stand on condition of 85 degreeC / 85% for 24 hours. Then, after performing the reflow process 3 times again, the resistance value was measured and the peeled state was observed, and the moisture absorption reflow resistance was evaluated according to the following criteria.
○ = Change rate of resistance value before and after reflow treatment is less than ± 10%, and ratio of area where peeling occurs is less than 1% × = Change rate of resistance value before and after reflow treatment is ± 10% or more and / or the ratio of the area where peeling occurs is 1% or more

<Fillet crack resistance>
The substrate subjected to the moisture absorption reflow treatment by the same method as described above was subjected to heating / cooling at 125 ° C./30 minutes and −55 ° C./30 minutes 1000 times, and then the fillet cracks on the substrate were observed. The fillet crack resistance was evaluated.
○ = Ratio of fillet crack die and horizontal length to die peripheral length is less than 30% × = Ratio of fillet crack die and horizontal length to die peripheral length is 30% or more

Claims (3)

A resin composition for encapsulating a semiconductor, comprising a glycoluril compound represented by chemical formula (I) and a curing agent.

(In the formula, R ¹ and R ² are the same or different and each represents a hydrogen atom, a lower alkyl group or a phenyl group, and R ³ , R ⁴ and R ⁵ are the same or different and each represents a hydrogen atom or a glycidyl group. .)   The resin composition for semiconductor encapsulation according to claim 1, comprising an epoxy compound or an epoxy resin excluding the glycoluril compound represented by the chemical formula (I).   The resin composition for semiconductor encapsulation according to claim 1 or 2, comprising an inorganic filler, a curing accelerator, a core shell rubber, and a reactive diluent.