JP2013192367A - Electric power conversion apparatus - Google Patents

Abstract

There is a bus bar electrically connected to an electric motor or a direct current battery in a power converter, and there is a problem that Joule heat generated in the bus bar raises the internal temperature of the power converter. Moreover, since it is used for an electric vehicle, it is required to reduce the size of the power conversion device due to restrictions on storage space.
A power conversion device comprising a power module incorporating a semiconductor element, a DC bus bar for supplying a DC current, an AC bus bar for outputting an AC current, and a water channel housing having a cooling water channel through which a refrigerant flows. A power module is arranged in the cooling water channel of the water channel housing, the DC bus bar is cooled on the first surface of the water channel housing, and the AC bus bar is cooled on the second surface of the water channel housing.
[Selection] Figure 3

Description

  The present invention relates to a power converter provided with an inverter circuit, and more particularly to a novel power converter capable of efficiently cooling a semiconductor power module and a bus bar.

  An electric vehicle, a hybrid vehicle, or the like is equipped with an electric motor as a power source for the vehicle, and generally includes an electric power conversion device having an inverter device as a main component in order to control electric power supplied to the electric motor. .

  The inverter device is a semiconductor power module incorporating a power semiconductor element such as an insulated gate bipolar transistor, a drive circuit for driving the semiconductor power module, a control circuit for controlling them, and a direct current that is a wiring for power supplied from a battery. A bus bar, an AC bus bar which is a wiring for power supplied to the electric motor, and a capacitor for current smoothing are provided.

  In a power conversion device equipped with such an inverter device, cooling of the power conversion device is indispensable in order to fully demonstrate its performance, and this occurs particularly in power semiconductor elements of conventionally proposed inverter devices. As a technique for cooling the heat to be generated, for example, Japanese Patent Laying-Open No. 2008-259267 (Patent Document 1) discloses a structure in which a heat sink is provided on both surfaces of a semiconductor power module.

  In addition to this, it may be necessary to cool not only the power semiconductor element but also the Joule heat generated in the bus bar. Regarding the cooling of the bus bar, for example, Japanese Patent Application Laid-Open No. 2011-18847 (Patent Document 2) discloses a structure in which the bus bar is directly cooled through the bus bar in the cooling water passage of the semiconductor power module.

JP 2008-259267 A JP 2011-18847 A

  By the way, in this type of power conversion device, many electronic components, for example, a power semiconductor element composed of an insulated gate bipolar transistor having a large calorific value is used, and the power conversion device has a high temperature due to heat generation from these electronic components. There is a phenomenon that becomes an environment.

  Furthermore, the power converter has a conductive wire (bus bar) electrically connected to the electric motor or the direct current battery. Joule heat generated by the conductive wire also raises the internal temperature of the power converter, resulting in the power converter. There is a phenomenon that raises the temperature.

  In addition, since this type of power conversion device is used in an electric vehicle, a hybrid vehicle, or the like, it is required to reduce the size of the power conversion device due to restrictions on the storage space.

  An object of the present invention is to efficiently carry away heat generated by a conductive wire (bus bar) electrically connected to a power semiconductor element, an electric motor, or a direct current battery to the outside, and to provide a power conversion device that is reduced in size. is there.

  A feature of the present invention is that a semiconductor power module including a semiconductor element constituting an inverter circuit, a DC bus bar that supplies a DC current to the inverter circuit, an AC bus bar that outputs an AC current converted by the inverter circuit, and a refrigerant A power conversion device comprising a waterway housing having a cooling water passage through which a semiconductor power module is disposed in the cooling water passage of the waterway housing, cooling the DC bus bar on the first surface of the waterway housing, and / or The AC bus bar is cooled on the second side of the enclosure.

  According to the present invention, the semiconductor power module and the bus bar of the inverter device can be efficiently cooled, and the inverter device can be reduced in size.

1 is a system configuration diagram showing a schematic system of an electric vehicle. It is a circuit diagram which shows the structure of the inverter circuit which is the main components of a power converter device. 1 is an external perspective view of a power converter according to an embodiment of the present invention. It is the disassembled perspective view which decomposed | disassembled the power converter device shown in FIG. 3, and was seen from the diagonal. It is AA sectional drawing which cut the power converter shown in FIG. 3 by the line of AA. It is the external appearance perspective view which looked at the semiconductor power module from diagonally. It is a block diagram which shows the structure which combined the motor generator and the power converter device.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Prior to that, the configuration of a power conversion device targeted by the present invention will be described.

  FIG. 1 is a system configuration diagram showing a system of an electric vehicle (hereinafter referred to as “EV vehicle”). The motor generator 20 not only generates a running torque for the vehicle, but also has a function of converting mechanical energy applied from the outside to the motor generator 20 into electric power.

  The motor generator 20 is, for example, a permanent magnet synchronous motor (three-phase), and performs switching operation as an electric motor and a generator. For example, the regenerative control is performed in a driving state or a deceleration driving state down a slope, and the battery 30 can be charged as a generator.

  The rotational torque generated by the motor generator 20 is transmitted to the wheels 12 via the transmission 18 and the differential gear 16. On the other hand, during regenerative braking operation, rotational torque is transmitted from the wheel 12 to the motor generator 20, and AC power is generated based on the supplied rotational torque. The generated AC power is converted to DC power by the power converter 40 to charge the high-voltage battery 30 and the charged power is reused again as travel energy.

  The power converter 40 is electrically connected to the battery 30 via the DC cable 32, and power is exchanged between the battery 30 and the power converter 40.

  When the motor generator 20 is operated as an electric motor, the power converter 40 converts the DC power supplied from the battery 30 via the DC cable 32 into AC power and supplies the AC power to the motor generator 20 via the AC cable 34. .

  Next, a specific configuration of the inverter circuit 42 of the power conversion device will be described with reference to FIG. In the following description, an insulated gate bipolar transistor is used as a power semiconductor element and is abbreviated as IGBT.

  In FIG. 2, an IGBT 52 and a diode 56 operating as an upper arm, and an IGBT 62 and a diode 66 operating as a lower arm constitute a series circuit 50 of upper and lower arms. The inverter circuit 42 is provided corresponding to three phases of the U phase, the V phase, and the W phase of the AC power to be output from the series circuit 50.

  These three phases correspond to the three-phase windings of the armature winding of the motor generator 20 in this embodiment. The series circuit 50 of the three-phase upper and lower arms outputs an alternating current from the intermediate electrode 69 of the series circuit. This intermediate electrode 69 is connected to an AC bus bar 86 via an AC terminal 59 and further electrically connected to each phase winding of the motor generator 20 via an AC connector 88.

The collector electrode of the IGBT 52 of the upper arm is electrically connected to the positive electrode conductor plate 92 via the positive electrode terminal 57, and the emitter electrode of the IGBT 62 of the lower arm is electrically connected to the negative electrode conductor plate 94 via the negative electrode terminal 58. The positive electrode conductor plate 92 and the negative electrode conductor plate 94 are electrically connected to the capacitor 90, and are further electrically connected to the battery 30 via the DC connector 38. (Refer to Fig. 3 and Fig. 4)
The control circuit 72 is a control signal for controlling the upper arm IGBT 52 and the lower arm IGBT 62 constituting the serial circuit 50 of each phase constituting the inverter circuit 42 based on the control command from the upper control device. A control pulse is generated and supplied to the driver circuit 74.

  Based on the control pulse, the driver circuit 74 sends a drive pulse for controlling the IGBT of each phase via the signal emitter electrode 55 of the IGBT 52, the gate electrode 54, the signal emitter electrode 65 of the IGBT 62, and the gate electrode 64. Supply. Each phase IGBT performs conduction or cutoff operation based on the drive pulse from the driver circuit 74, converts the DC power supplied from the battery 30 into three-phase AC power, and supplies it to the motor generator 20.

  The control circuit 72 includes a microcomputer (hereinafter referred to as “microcomputer”) for performing arithmetic processing on the switching timing of the IGBT 52 and the IGBT 62. Information input to the microcomputer includes a target torque value required for the motor generator 20, a current value supplied from the series circuit 50 to the motor generator 20, and a magnetic pole position of the rotor of the motor generator 20.

  The target torque value is based on a command signal output from a host controller (not shown). The current value is detected based on a detection signal from the current sensor 80. The magnetic pole position is detected based on a detection signal output from a rotating magnetic pole sensor (not shown) such as a resolver provided in the motor generator 20.

  The microcomputer in the control circuit 72 calculates current command values for the d-axis and q-axis of the motor generator 20 based on the target torque value, and the calculated d-axis and q-axis current command values and the detected d-axis. The voltage command values for the d-axis and the q-axis are calculated based on the difference between the current values of the axes and the q-axis, and the calculated voltage command values for the d-axis and the q-axis are calculated based on the detected magnetic pole position. It is converted into voltage command values for phase, V phase, and W phase. Then, the microcomputer generates a pulse-like modulated wave based on a comparison between the fundamental wave (sine wave) and the carrier wave (triangular wave) based on the voltage command values of the U phase, V phase, and W phase, and the generated modulation wave The wave is output to the driver circuit 74 as a PWM (pulse width modulation) signal.

  When driving the lower arm, the driver circuit 74 outputs a drive signal obtained by amplifying the PWM signal to the gate electrode of the corresponding IGBT 62 of the lower arm. Further, when driving the upper arm, the driver circuit 74 amplifies the PWM signal after shifting the level of the reference potential of the PWM signal to the level of the reference potential of the upper arm, and uses this as a drive signal as a corresponding upper arm. Are output to the gate electrodes of the IGBTs 52 respectively.

  The above is the specific configuration of the inverter circuit. Since this configuration is well known, further description is omitted.

  As described above, many electronic components, for example, power semiconductor elements such as insulated gate bipolar transistors that generate a large amount of heat are used in the power converter, and the power converter is heated by the heat generated from these electronic components. There is a phenomenon that becomes an environment.

  Furthermore, the power converter has a conductive wire (bus bar) electrically connected to the electric motor or the direct current battery. Joule heat generated by the conductive wire also raises the internal temperature of the power converter, resulting in the power converter. There is a phenomenon that raises the temperature.

  In addition, since this type of power conversion device is used in an electric vehicle, a hybrid vehicle, or the like, it is necessary to make the power conversion device small in size due to restrictions on the storage space.

  The present invention proposes a technique for efficiently removing heat generated by a conductive wire (bus bar) electrically connected to a power semiconductor element, an electric motor, or a DC battery while being small in size.

  3 is an external perspective view of the power converter 40, FIG. 4 is an exploded perspective view of the power converter shown in FIG. 3 in an exploded view, and FIG. 5 is an AA line of the power converter shown in FIG. FIG. 6 is a cross-sectional view taken along line AA, and FIG. 6 is an external perspective view of the semiconductor power module as viewed obliquely.

  An embodiment of the present invention will be described based on the drawings as described above. In FIG. 3, reference numeral 110 is a water channel housing, and a cooling water inlet 112 is provided on a short side surface 110 </ b> A located at right angles to the longitudinal direction. Cooling water flowing in from the cooling water inlet 112 flows inside the water channel housing 110. It flows out from a cooling water outlet (not shown). The water channel housing 110 is made of a material having good heat conductivity, preferably an aluminum alloy, and heat is taken away by the cooling water flowing inside the water channel housing 110.

  And three through-holes (not shown) are opened in the long side surface 110B of the water channel housing 110, and the U-phase semiconductor power module 500a, the V-phase semiconductor power module 500b, and the W-phase are respectively formed in these through-holes. The semiconductor power module 500c is inserted. The U-phase semiconductor power module 500a, the V-phase semiconductor power module 500b, and the W-phase semiconductor power module 500c incorporate a series circuit 50 of U-phase, V-phase, and W-phase upper and lower arms whose main components are power semiconductor elements. doing.

  As is well known, the U-phase semiconductor power module 500a, the V-phase semiconductor power module 500b, and the W-phase semiconductor power module 500c include power semiconductor elements (IGBT52, IGBT62, The diode 56 and the diode 66) are sealed inside, and are connected to the positive terminal 57, the negative terminal 58, the AC terminal 59, which are external connection terminals, the upper arm gate terminal 54 and the upper arm emitter terminal 55, which are connection terminals for control signals. The lower arm gate terminal 64 and the lower arm emitter terminal 65 are electrically connected.

  A sheet 130A having an insulating function and a heat dissipation function (hereinafter referred to as a heat dissipation sheet) 130A is placed in close contact with the upper surface 110c of the water channel housing 110, and further, a positive electrode conductor plate 92 made of copper functioning as a DC bus bar, and a copper A capacitor 90 is placed via a negative electrode conductor plate 94 made of the same. On the capacitor 90, a control board 120 for controlling the semiconductor power modules 500a, 500b, and 500c is placed.

  Although the control circuit 72 and the driver circuit 74 are mounted on the control board 120, they are omitted in the drawing. The driver circuit 74 is connected to the U-phase semiconductor power module 500a, the V-phase semiconductor power module 500b, and the W-phase semiconductor power module 500c, which are electrically connected thereto. The IGBTs 52 and 62 of the upper and lower arms are controlled via the emitter terminal 55, the lower arm gate terminal 64, and the lower arm emitter terminal 65.

  As a matter of course, the IGBTs 52 and 62 of the individual upper and lower arms are also controlled via the arm gate terminal 54, the upper arm emitter terminal 55, the lower arm gate terminal 64, and the lower arm emitter terminal 65, respectively.

  A battery positive electrode portion 92a connected to the positive electrode of the battery is formed on the short side orthogonal to the long side direction of the positive electrode conductor plate 92 functioning as a DC bus bar. Similarly, the negative electrode conductor plate 94 functioning as a DC bus bar is formed. A battery negative electrode portion 94a connected to the negative electrode of the battery is formed on the longitudinal direction side.

  The positive electrode conductor plate 92 and the negative electrode conductor plate 94 are desirably arranged in a laminated form for the purpose of reducing wiring inductance, and may be in close contact with each other with insulating paper or resin interposed therebetween.

  Here, a cooling water passage 111 of the water channel housing 110 is formed along the longitudinal direction of the positive electrode conductor plate 92 and the negative electrode conductor plate 94, and the cooling water flows in the longitudinal direction. This increases the efficiency of heat removal.

  The cooling water passage 111 is formed in a straight line and the semiconductor power modules 500a, 500b, and 500c are sequentially arranged along the cooling water passage 111, and the cooling water passage 111 is folded and flows in a U shape. It is possible to adopt a configuration in which the semiconductor power modules 500a, 500b, and 500c are formed and sequentially arranged along this. In the case where the cooling water passage 111 is formed in a straight line, the cooling water inlet / outlet may be provided on the opposing surface of the water passage housing 110, and in the case where the cooling water passage 111 is formed in a U shape, It is only necessary to provide a cooling water inlet / outlet on one side.

  A positive electrode portion 92b connected to the positive electrode terminal 57 of the semiconductor power module is formed on the long side of the positive electrode conductor plate 92. Similarly, the negative electrode terminal of the semiconductor power module is formed on the long side of the negative electrode conductor plate 94. A negative electrode portion 94 b connected to 58 is formed.

  Below the water channel housing 110, three U-phase AC bus bars 86a, V-phase AC bus bars 86b and W-phase AC bus bars 86c made of copper are arranged. A connection terminal 86aa of the U-phase AC bus bar 86a is a U-phase semiconductor. Connected to the AC terminal 59 of the power module 500a, the connection terminal 86bb of the V-phase AC bus bar 86b is connected to the AC terminal 59 of the V-phase semiconductor power module 500b, and the connection terminal 86cc of the W-phase AC bus bar 86c is the W-phase semiconductor power module. It is connected to the AC terminal 59 of 500c.

  Here, the cooling water passage 111 of the water channel housing 110 is formed along the direction in which the three U-phase AC bus bars 86a, the V-phase AC bus bars 86b, and the W-phase AC bus bars 86c extend, and the AC bus bars extend in the extending direction. Cooling water flows. This increases the efficiency of heat removal.

  As shown in FIGS. 4 and 5, a sheet (hereinafter referred to as a heat dissipation sheet) 130 </ b> B having an insulating function and a heat dissipation function is disposed in close contact with the bottom surface 110 </ b> D of the water channel housing 110. The three U-phase AC bus bars 86a, the V-phase AC bus bars 86b, and the W-phase AC bus bars 86c described above are disposed in close contact with the heat dissipation sheet 130B.

  In FIG. 5, the capacitor 90 is electrically connected to the positive electrode conductor plate 92 via the positive electrode terminal 91a, and similarly connected to the negative electrode conductor plate 94 via the negative electrode terminal 91b of the capacitor 90.

  As shown in FIG. 6, the U-phase semiconductor power module 500a, the V-phase semiconductor power module 500b, and the W-phase semiconductor power module 500c are housed in a hollow can-like container 503, and a mounting housing 501 is formed at one end thereof. . If this mounting housing is attached to a through-hole provided in the side surface 110B connecting the upper surface 110C and the bottom surface 110D of the water channel housing 110, the can-like container 503 is exposed to the cooling water passage 111 of the water channel housing 110 as shown in FIG. To come.

  Accordingly, the heat generated by the IGBT or the like mainly includes the first heat dissipation surface 503a and the second heat dissipation surface formed by the container 503 of the U-phase semiconductor power module 500a, the V-phase semiconductor power module 500b, and the W-phase semiconductor power module 500c. Heat is dissipated from 503b to the cooling water flowing through the cooling water passage 111 in the water channel casing 110. At this time, in order to increase the contact area with the cooling water, the heat radiation surfaces 503a and 503b are provided with columnar or plate-shaped heat radiation fins (not shown).

  One of the features of this embodiment is that, as described above, the positive electrode conductor plate 92 and the negative electrode conductor plate 94 that are DC bus bars are disposed in close contact with the upper surface 110C of the water channel housing 110 via the heat dissipation sheet 130A. That is. .

  Another feature of the present embodiment is that the AC bus bars 86a, 86b, and 86c are arranged in close contact with the bottom surface 110D of the water channel housing 110 via the heat dissipation sheet 130B as described above.

  As described above, it is important that the heat radiation sheets 130A and 130B have both a heat radiation function and an insulation function. In this embodiment, the heat radiation sheets 130A and 130B are formed of a composite material. Specifically, it is a double structure sheet in which a heat dissipation sheet and an insulating sheet are bonded together.

  As the material of the heat radiating sheets 130A and 130B, PET (polyethylene terephthalate) is used for the insulating sheet portion, and the thickness is made as thin as possible in order to improve heat dissipation, and the thickness is 0.1 mm. ing. Further, a silicon-based resin material is used for the heat radiating sheet portion, and a thickness of 1.0 mm is used. Such heat-dissipating sheet parts and insulating sheet parts are not limited to the materials and thicknesses described, and other materials and specifications may be selected and adopted as appropriate, but these are the actual materials. Is desirable from the viewpoint of actual use.

  In the power converter configured as described above, a direct current is converted into an alternating current by the power converter 40 including an inverter circuit to drive the motor, and an alternating current is converted into a direct current in order to use the motor with a generator. However, the heat generated in the IGBT or the like of the inverter circuit used for that purpose is mainly formed by the container 503 of the U-phase semiconductor power module 500a, the V-phase semiconductor power module 500b, and the W-phase semiconductor power module 500c. Heat is radiated from the heat radiating surface 503a and the second heat radiating surface 503b to the cooling water flowing through the cooling water passage 111 in the water channel housing 110. For this reason, the heat generated by the semiconductor power modules 500a, 500b, and 500c itself is efficiently transferred to the cooling water and carried outside the water channel housing 110.

  Further, the Joule heat generated in the DC / AC conversion process in the DC bus bar and the U-phase AC bus bar 86a, the V-phase AC bus bar 86b, and the W-phase AC bus bar 86c formed by the positive electrode conductor plate 92 and the negative electrode conductor plate 94 Since it is transferred to the main body of the waterway housing 110 via 130B and is carried away to the outside by the cooling water flowing through the waterway housing 110, the Joule heat generated in both bus bars can be efficiently released.

  In addition, according to the present embodiment, the heat dissipation sheet 130A, the positive electrode conductor plate 92, the negative electrode conductor plate 94, and the capacitor 90 constituting the DC bus bar are stacked on the upper surface of the waterway casing 110, and the heat dissipation sheet 130B is disposed on the lower surface of the waterway casing 110. Since the AC bus bars are stacked, they can be efficiently and compactly packed and can be stored in a narrow storage space such as an electric vehicle or a hybrid vehicle.

  Further, the power converter is connected to a conductive wire that is electrically connected to the motor and has good heat transfer, and the heat of the motor flows into the AC bus bar of the power converter through this conductive wire, and this heat is transferred to the inverter circuit. There is a phenomenon in which the temperature of the power converter is increased as a result of intrusion to the capacitor and, in some cases, the capacitor. The capacitor of the power converter is thermally weak, and it is required to reduce the heat entering from the outside as much as possible.

  In the present embodiment, external heat (for example, heat from the electric motor) flowing into the AC bus bar is transmitted to the water channel housing 110 through the heat dissipation sheet 130B. Since the water channel casing 110 is cooled by the cooling water flowing from the refrigerant inlet 112, the temperature is lower than the U-phase AC bus bar 86a, the V-phase AC bus bar 86b, and the W-phase AC bus bar 86c. The heat of the U-phase AC bus bar 86a, the V-phase AC bus bar 86b, and the W-phase AC bus bar 86c efficiently flows to the water channel housing 110. Therefore, even if the heat of the electric motor flows into the AC bus bar of the power converter, it can be expected to efficiently carry away with the cooling water flowing through the water channel housing 110.

  FIG. 7 is a configuration diagram showing a configuration in which the power converter 40 according to the present embodiment, which is summarized in a small size, is incorporated in the motor generator 20.

  In FIG. 7, the housing 200 that houses the simplified electric motor is formed with a housing portion 202 that houses the integrally formed power conversion device 40. The storage unit 202 is formed in a rectangular box shape as a whole, and the power conversion device 40 is stored in the box so as to fit tightly. As a result, a so-called electromechanical integrated motor generator 20 in which the electric motor and the power conversion device are integrated can be realized.

  And the cooling water inlet 112 and the refrigerant | coolant outlet of the water channel housing 110 which comprise a power converter device, the DC connector 38 etc. which are shown in FIG. 2 can be pulled out toward the exterior from the window parts 202A, 202B etc. which were provided in the accommodating part 202. It is configured as follows.

  The AC connector 88 may be exposed to the outside of the storage unit 202 and connected to the three-phase armature winding of the motor generator 20 or may be connected through the bottom wall surface of the bottom surface of the storage unit 202. It ’s good. Here, in the electromechanically integrated motor generator 20 in which the electric motor and the power conversion device are integrated, as shown in FIG. 7, the cooling water inlet 112 is formed on the connection side of the AC bus bars 86a, 86b, 86c and the armature winding. The cooling effect is improved by providing.

  In the above-described embodiments, the drive motor and electric power converter of the electric vehicle are integrated. However, the embodiments shown in FIGS. 3 to 6 are applied to a hybrid vehicle, and the electric motor. It is also possible to apply to a system in which the power converter is configured separately.

DESCRIPTION OF SYMBOLS 12 ... Wheel, 16 ... Differential gear, 18 ... Transmission, 20 ... Motor generator, 30 ... Battery, 32 ... DC cable, 34 ... AC cable, 38 ... DC connector, 40 ... Inverter device, 42 ... Inverter circuit, 50 ... Series of upper and lower arms, 52 ... IGBT of upper arm, 54 ... Upper arm gate electrode, 55 ... Upper arm emitter electrode, 56 ... Upper arm diode, 58 ... Negative electrode terminal, 59 ... AC terminal, 62 ... Lower arm IGBT 64 ... Lower arm gate electrode, 65 ... Lower arm emitter electrode, 66 ... Lower arm diode, 69 ... Intermediate electrode, 72 ... Control circuit, 74 ... Driver circuit, 80 ... Current sensor, 86 ... AC bus bar, 86a ... U Phase AC bus bar, 86b ... V phase AC bus bar, 86c ... W phase AC bus bar, 88 ... AC connector, 9 ... Capacitor 91a. Capacitor positive terminal 91b. Capacitor negative terminal 92. Positive conductor plate 92a. Battery positive electrode of the positive conductor plate 94. Negative conductor plate 94a. Battery negative electrode of the negative conductor plate 110 ... water channel housing, 110A ... side surface on the short side of the water channel housing, 111B ... side surface on the long side of the water channel housing, 110C ... top surface of the water channel housing, 111D ... bottom surface of the water channel housing,
DESCRIPTION OF SYMBOLS 112 ... Refrigerant inlet, 111 ... Cooling water flow path, 120 ... Control board, 130A, 130B ... Radiation sheet, 200 ... Housing, 202 ... Storage part, 500a ... U-phase semiconductor power module, 500b ... V-phase semiconductor power module, 500c ... W phase semiconductor power module.

Claims (12)

A semiconductor power module including a semiconductor element constituting an inverter circuit; a DC bus bar for supplying a DC current to the inverter circuit; an AC bus bar for outputting an AC current converted by the inverter circuit; and the semiconductor power module. In the power conversion device consisting of a water channel housing having a cooling water channel through which cooling water to be cooled flows,
Disposing the semiconductor power module in the cooling water channel of the water channel housing, and thermally connecting at least part of the DC bus bar to the first surface of the water channel housing to cool the DC bus bar; and / or A power conversion device, wherein the second surface of the waterway housing and at least a part of the AC bus bar are thermally connected to be cooled. The power conversion device according to claim 1,
A power conversion device, wherein the waterway housing and the DC bus bar, and the waterway housing and the AC bus bar are in contact with each other via a heat dissipation sheet having an insulating function and a heat dissipation function. The power conversion device according to claim 2,
A through-hole is provided in a side surface of the waterway housing, and the semiconductor power module is inserted and fixed. The upper surface orthogonal to the side surface of the waterway housing and the DC bus bar are thermally connected by the heat radiating sheet to connect the DC bus bar. A power conversion device that is cooled and cooled by thermally connecting a bottom surface orthogonal to a side surface of the waterway housing and the AC bus bar with the heat dissipation sheet. The power conversion device according to claim 3,
The power converter according to claim 1, wherein the DC bus bar is brought into close contact with the water channel housing via the heat radiating sheet so that a longitudinal direction of the DC bus bar coincides with a direction of a cooling water passage provided in the water channel housing. The power conversion device according to claim 3,
The power converter, wherein the AC bus bar is brought into close contact with the water channel housing via the heat radiating sheet so that the direction in which the AC bus bar extends matches the direction of the cooling water passage provided in the water channel housing. The power conversion device according to claim 1,
The power conversion device according to claim 1, wherein the cooling water passage provided in the water channel housing is a passage extending linearly or a passage that is folded back and returned in the middle. A semiconductor power module including a semiconductor element constituting an inverter circuit; a DC bus bar for supplying a DC current to the inverter circuit; an AC bus bar for outputting an AC current converted by the inverter circuit; and the semiconductor power module. In a power converter comprising a water channel housing having a cooling water channel through which cooling water to be cooled flows, the semiconductor power module is disposed in the cooling water channel of the water channel housing, and an insulating function and a heat dissipation function are provided on a first surface of the water channel housing. A capacitor electrically connected to the DC bus bar is placed on the surface of the DC bus bar opposite to the contact surface with the heat dissipation sheet, and the DC bus bar is disposed in thermal contact with the heat dissipation sheet. And a heat dissipating sheet having an insulating function and a heat dissipating function on the side opposite to the first surface of the waterway housing. It arrange | positions so that the said alternating current bus bar may be contacted through, The power converter device characterized by the above-mentioned. The power conversion device according to claim 7,
The semiconductor power module is fixed to the waterway housing so as to be exposed in the cooling water passage through a through hole provided in a side surface connecting the first surface and the second surface of the waterway housing. The power converter characterized by the above-mentioned. The power conversion device according to claim 8, wherein
The power converter according to claim 1, wherein the DC bus bar is brought into close contact with the water channel housing via the heat radiating sheet so that a longitudinal direction of the DC bus bar coincides with a direction of a cooling water passage provided in the water channel housing. The power conversion device according to claim 8, wherein
The power converter, wherein the AC bus bar is brought into close contact with the water channel housing via the heat radiating sheet so that the direction in which the AC bus bar extends matches the direction of the cooling water passage provided in the water channel housing. The power converter according to any one of claims 1 to 10,
The power conversion device is mounted in a box-shaped storage portion formed in a housing of an electric motor and integrated with the electric motor. The power conversion device according to claim 11,
The power converter according to claim 1, wherein an inlet of the cooling water passage is disposed on a connection side of the AC bus bar and the armature winding of the motor.

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