JP2013051360A - Manufacturing method of insulation substrate and manufacturing method of multilayer lamination plate - Google Patents

Abstract

An insulating substrate manufacturing method capable of improving the productivity of an insulating substrate is provided.
A method of manufacturing an insulating substrate is a method of manufacturing an insulating substrate 21 having a concave pattern 21a. Stages 41 and 43 that can approach or leave each other, and a convex pattern 421 attached to the stage 41 are provided. A step of preparing the imprint mold 42 having the guide pins 431 attached to the stage 43, a step of inserting the guide pins 431 into the through holes 21b formed in the insulating substrate 21, and the stages 41 and 43 And the step of inserting guide pins 431 into the guide holes 422 formed in the imprint mold 42 and the insulating substrate 21 between the imprint mold 42 and the stage 43 to insulate The concave pattern 21 a is formed on the substrate 21 and the tip of the guide pin 431 is brought into contact with the bottom surface of the guide hole 422. It is provided with a step.
[Selection] Figure 7

Description

  The present invention relates to a method for manufacturing an insulating substrate and a method for manufacturing a multilayer laminate.

  After aligning the template and wafer using the global alignment process, the template is pressed against the resist material on the wafer to transfer the concave / convex pattern on the template to the resist material. A pattern forming method formed on a material is known (see, for example, Patent Document 1).

JP 2010-283207 A

  In the above invention, in order to form the concave portion (concave pattern) in the resist pattern at a predetermined depth, it is also necessary to control the pressing force when pressing the template against the resist material.

  For this reason, in the above-described invention, two controls, that is, a control for aligning the template and the resist material and a control of the pressing force to the resist material in the planar direction are required, so that the productivity of the wafer is sufficiently increased. Could not improve.

  The problem to be solved by the present invention is to provide a method for manufacturing an insulating substrate and a method for manufacturing a multi-layer laminate capable of sufficiently improving productivity.

[1] A method for manufacturing an insulating substrate according to the present invention is a method for manufacturing an insulating substrate having a first concave pattern, the first stage and the second stage being capable of approaching or separating from each other; A first imprint mold attached to the first stage and having a first convex pattern corresponding to the first concave pattern; and the second stage, the first imprint mold, or the Preparing a first guide pin attached to a first stage, inserting the first guide pin into a first through-hole formed in the insulating substrate, and the first A first stage that is formed on the first imprint mold, the first stage, or the second stage with the stage and the second stage approaching each other and that faces the first guide pin of A step of inserting the first guide pin into the id hole, and sandwiching the insulating substrate between the first imprint mold and the second stage, and the first substrate is inserted into the insulating substrate. Forming a concave pattern and bringing the tip of the first guide pin into contact with the bottom surface of the first guide hole.

[2] In the above invention, the first guide hole is formed in the first imprint mold, and the first guide hole and the first convex pattern are formed in the same process. May be.

[3] In the above invention, the first guide pin is attached to the first imprint mold, and the first imprint mold has a fixing hole to which the first guide pin is fixed. And the fixing hole and the first convex pattern may be formed in the same process.

[4] In the above invention, the first stage has a jig interposed between the first imprint mold and the first guide pin is attached to the jig. It may be done.

[5] A method for manufacturing an insulating substrate according to the present invention is a method for manufacturing an insulating substrate having a first concave pattern, the first stage and the second stage being capable of approaching or separating from each other; A first imprint mold attached to the first stage and having a first convex pattern corresponding to the first concave pattern; and the second stage, the first imprint mold, or the A first guide pin attached to a first stage; and a first guide pin attached to the first imprint mold, the first stage, or the second stage and facing the first guide pin. A guide bush, a step of inserting the first guide bush into a first through hole formed in the insulating substrate, a step of the first stage, and a step of the second step. And inserting the first guide pin into the inner hole of the first guide bush, and the insulation between the first imprint mold and the second stage. And sandwiching a conductive substrate to form the first concave pattern on the insulating substrate, and to bring the tip of the first guide pin into contact with the bottom surface of the first guide bush. It is characterized by.

[6] A method for producing a multilayer laminate according to the present invention is a method for producing a multilayer laminate having a first printed wiring board and a second printed wiring board laminated to each other. Forming a first insulating substrate having a first through-hole, and forming a first printed wiring board by filling the first concave pattern of the first insulating substrate with a conductor. A third stage and a fourth stage that can approach or separate from each other, a second imprint mold attached to the third stage and having a second convex pattern, and the fourth stage A second guide pin attached to the second imprint mold or the third stage, and the second guide pin of the first insulating substrate. Inserting into the through hole; and Laminating the second insulating substrate on the first printed wiring board while inserting the second guide pin into a second through-hole formed in the second insulating substrate; The third stage and the fourth stage are made to approach each other, and are formed on the second imprint mold, the third stage, or the fourth stage, and face the second guide pin. A step of inserting the second guide pin into the second guide hole; and the first printed wiring board and the second insulating property between the second imprint mold and the fourth stage. The second convex pattern of the second imprint mold is transferred to the second insulating substrate with the substrate sandwiched therebetween to form a second concave pattern on the second insulating substrate. And the tip of the second guide pin Contacting the bottom surface of the second guide hole; filling the second concave pattern formed on the second insulating substrate with a conductor to form the second printed wiring board; And.

[7] A method for producing a multilayer laminate according to the present invention is a method for producing a multilayer laminate having a first printed wiring board and a second printed wiring board laminated to each other, Forming a first insulating substrate having a first through-hole, and forming a first printed wiring board by filling the first concave pattern of the first insulating substrate with a conductor. A third stage and a fourth stage that can approach or separate from each other, a second imprint mold attached to the third stage and having a second convex pattern, and the fourth stage A second guide pin attached to the second imprint mold or the third stage; and a second guide pin attached to the second imprint mold, the third stage or the fourth stage, A second guide bush facing the second guide pin, a step of inserting the second guide bush into the first through hole of the first insulating substrate, and a third The stage and the fourth stage are brought close to each other, and the second guide pin is inserted into the inner hole of the second guide bush; the second imprint mold and the fourth stage The first printed wiring board and the second insulating substrate are sandwiched between stages, and the second convex pattern of the second imprint mold is transferred to the second insulating substrate. Forming a second concave pattern on the second insulating substrate and bringing the tip of the second guide pin into contact with the bottom surface of the second guide bush; and the second insulation The second recess formed on the conductive substrate Forming a second printed wiring board by filling a conductor in a pattern.

[8] A method for producing a multilayer laminate according to the present invention is a method for producing a multilayer laminate having a first printed wiring board and a second printed wiring board laminated to each other, A step of forming a first insulating substrate; a step of filling the first concave pattern of the first insulating substrate with a conductor to form the first printed wiring board; and approaching or separating from each other. Possible third and fourth stages, a second imprint mold attached to the third stage and having a second convex pattern, the fourth stage, and the second imprint Preparing a mold or a second guide pin attached to the third stage, and inserting the second guide pin into an imprint through-hole formed in the first insulating substrate. Process and second A step of laminating the second insulating substrate on the first printed wiring board while inserting the second guide pin into a second through hole formed in the insulating substrate; and the third stage. And the fourth stage are made close to each other, and the second imprint mold, the third stage, or the fourth stage is formed on the second stage and is opposed to the second guide pin. A step of inserting the second guide pin into the guide hole; and the first printed wiring board and the second insulating substrate between the second imprint mold and the fourth stage. Sandwiching and transferring the second convex pattern of the second imprint mold to the second insulating substrate to form a second concave pattern on the second insulating substrate; and The tip of the second guide pin is A step of contacting the bottom surface of the second guide hole, a step of filling the second concave pattern formed on the second insulating substrate with a conductor, and forming the second printed wiring board; The imprint through hole is formed together with the first concave pattern by an imprint method in the step of forming the first concave pattern.

[9] A method for producing a multilayer laminate according to the present invention is a method for producing a multilayer laminate having a first printed wiring board and a second printed wiring board laminated to each other, A step of forming a first insulating substrate; a step of filling the first concave pattern of the first insulating substrate with a conductor to form the first printed wiring board; and approaching or separating from each other. Possible third and fourth stages, a second imprint mold attached to the third stage and having a second convex pattern, the fourth stage, and the second imprint A second guide pin attached to the mold or the third stage, and a second guide pin attached to the second imprint mold, the third stage, or the fourth stage, and A second guide bushing, a step of inserting the second guide bush into an imprint through hole formed in the first insulating substrate, the third stage, A step of making the fourth stage approach each other and inserting the second guide pin into the inner hole of the second guide bush; and between the second imprint mold and the fourth stage. Sandwiching the first printed wiring board and the second insulating substrate, transferring the second convex pattern of the second imprint mold to the second insulating substrate; Forming a second concave pattern on the second insulating substrate, abutting the tip of the second guide pin against the bottom surface of the second guide bush, and forming the second insulating substrate on the second insulating substrate. Said second concave pattern Filling the conductor to form the second printed wiring board, wherein the imprint through hole is formed by the imprint method in the step of forming the first concave pattern. It is characterized by being formed together with the concave pattern.

  According to the present invention, the guide pin performs alignment between the imprint mold and the insulating substrate in the planar direction and restriction of the pressing force when pressing the imprint mold against the insulating substrate. And it becomes possible to fully improve the productivity of a multilayer laminated board.

FIG. 1 is a cross-sectional view of a multilayer laminate in an embodiment of the present invention. FIG. 2 is a flowchart showing a method for manufacturing a multilayer laminate in the embodiment of the present invention. FIG. 3 is a flowchart showing the first printed wiring board preparation step of FIG. FIG. 4 is a cross-sectional view illustrating the first insulating substrate preparation step and the first device preparation step of FIG. FIG. 5 is a plan view of the second stage of the imprint apparatus according to the embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating the first insertion step of FIG. FIG. 7 is a cross-sectional view for explaining the first pattern forming step of FIG. FIG. 8 is a cross-sectional view showing a modification of the imprint apparatus according to the embodiment of the present invention (part 1). FIG. 9 is a cross-sectional view showing a modification of the imprint apparatus according to the embodiment of the present invention (part 2). FIG. 10 is a cross-sectional view showing a modification of the imprint apparatus according to the embodiment of the present invention (part 3). FIG. 11 is a cross-sectional view showing a modification of the imprint apparatus according to the embodiment of the present invention (part 4). FIG. 12 is a cross-sectional view showing a modification of the imprint apparatus according to the embodiment of the present invention (part 5). FIG. 13 is a sectional view showing a modification of the imprint apparatus according to the embodiment of the present invention (No. 6). FIG. 14 is a cross-sectional view showing a modification of the imprint apparatus according to the embodiment of the present invention (part 7). FIG. 15 is a cross-sectional view showing a modification of the imprint apparatus according to the embodiment of the present invention (No. 8). FIG. 16 is a cross-sectional view illustrating the second insulating substrate preparation step and the second device preparation step of FIG. FIG. 17 is a cross-sectional view illustrating the second pattern formation step of FIG. 18 is a cross-sectional view for explaining a modification of the second mounting step and the stacking step in FIG. 2 (No. 1). FIG. 19 is a cross-sectional view for explaining a modification of the second placement step and the lamination step in FIG. 2 (part 2). FIG. 20 is a cross-sectional view for explaining a modification of the second placement step and the lamination step in FIG. 2 (No. 3). FIG. 21 is a cross-sectional view illustrating a modified example of the first printed wiring board preparation step of FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a cross-sectional view of a multilayer laminate plate according to this embodiment.

  As shown in FIG. 1, the multilayer laminated board 1 has a first printed wiring board 2 and a second printed wiring board 3 laminated on the first printed wiring board 2.

  The first printed wiring board 2 includes a first insulating substrate 21 and a first wiring pattern 22 as shown in FIG.

  As shown in the figure, the first insulating substrate 21 is formed with a first concave pattern 21a and a first through hole 21b.

  The first concave pattern 21 a is a pattern for forming the first wiring pattern 22, and is recessed in a trench shape on the main surface of the first insulating substrate 21. The first concave pattern 21a is formed by a thermal imprint method to be described later.

The first through hole 21b is a positioning hole when the first concave pattern 21a is formed by a thermal imprint method. The first through hole 21b is formed by subjecting the first insulating substrate 21 to laser processing using a UV-YAG laser or CO ₂ laser, micro drill processing, or the like.

  Such first insulating substrate 21 is made of, for example, an insulating thermoplastic resin such as polyimide (PI), liquid crystal polymer (LCP), polyethylene (PE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN). It is composed of Examples of the thickness of the first insulating substrate 21 include about 8 to 50 μm, but are not particularly limited thereto.

  The first wiring pattern 22 is formed by filling the first concave pattern 21a of the first insulating substrate 21 described above with a conductor such as copper, and the wiring 22a and the wiring 22a are electrically connected. Via hole 22b connected to the. In the present embodiment, the via hole 22 b electrically connects the first and second printed wiring boards 2 and 3.

  Similar to the first printed wiring board 2, the second printed wiring board 3 also includes a second insulating substrate 31 and a second wiring pattern 32. The second printed wiring board 3 has the same configuration as the first printed wiring board 2 except that the shape of the second wiring pattern 32 is different.

  That is, the second insulating substrate 31 of the second printed wiring board 3 is made of the above-described insulating thermoplastic resin, and has a second concave pattern 31a corresponding to the second wiring pattern 32. A second through hole 31b for positioning the second insulating substrate 31 is formed when the second concave pattern 31a is formed by the thermal imprint method. Further, the second wiring pattern 32 has wirings 32 a and via holes 32 b having shapes different from those of the first wiring pattern 22.

  Below, the manufacturing method of the multilayer laminated board 1 in this embodiment is demonstrated.

  2 is a flowchart showing a method for manufacturing a multilayer laminated board in the present embodiment, FIG. 3 is a flowchart showing a first printed wiring board preparation step of FIG. 2, and FIG. 4 is a first insulating substrate preparation step of FIG. FIG. 5 is a plan view of the second stage of the imprint apparatus according to the present embodiment, FIG. 6 is a cross-sectional view illustrating the first insertion step of FIG. 3, and FIG. FIG. 4 is a cross-sectional view illustrating a first pattern formation step in FIG. 3.

  As shown in FIG. 2, the manufacturing method of the multilayer laminated board in the present embodiment includes a first printed wiring board preparation step S1, a second insulating substrate preparation step S2, a second device preparation step S3, A second placing step S4, a stacking step S5, a second inserting step S6, a second pattern forming step S7, and a second wiring forming step S8 are provided.

  First, the first printed wiring board preparation step S1 will be described with reference to FIGS.

  As shown in FIG. 3, the first printed wiring board preparation step S1 includes a first insulating substrate preparation step S11, a first apparatus preparation step S12, a first placement step S13, and a first mounting step S13. It includes an insertion step S14, a first pattern formation step S15, and a first wiring formation step S16. The first apparatus preparation step S12, the first placement step S13, the first insertion step S14, and the first pattern formation step S15 in the present embodiment constitute the method for manufacturing an insulating substrate of the present invention. .

  In the first insulating substrate preparation step S11, as shown in FIG. 4, the first insulating substrate 21 described above is prepared.

  As shown in FIGS. 4 and 5, in the first insulating substrate 21, a first through hole 21 b into which a guide pin 431 of the imprint apparatus 4 described later can be inserted has a position corresponding to the guide pin 431. Previously formed. The size of the first through hole 21b is such that the first insulating substrate 21 is not easily displaced in a state where the guide pin 431 can be inserted and the guide pin 431 is inserted into the first through hole 21b. For example, when the guide pin 431 has a diameter of 0.1 mm, the diameter may be about 0.1 to 0.13 mm.

  Next, in the first apparatus preparation step S12, an imprint apparatus 4 for forming the first concave pattern 21a on the first insulating substrate 21 is prepared. Hereinafter, the imprint apparatus 4 will be described.

  As illustrated in FIG. 4, the imprint apparatus 4 includes a first stage 41 to which an imprint mold 42 is attached, and a second stage 43.

  As shown in the figure, the first stage 41 is a member that sandwiches the first insulating substrate 21 and the imprint mold 42 between the second stage 43, although not particularly illustrated. A heater for heating the first insulating substrate 21 is embedded via the imprint mold 42.

  A convex pattern 421 and a guide hole 422 are formed in the imprint mold 42.

  The convex pattern 421 is a pattern protruding from the main surface of the imprint mold 42. In the present embodiment, the first concave pattern 21 a is formed on the first insulating substrate 21 by transferring the convex pattern 421 to the first insulating substrate 21 by a thermal imprint method. Therefore, the convex pattern 421 has a shape corresponding to the first concave pattern 21 a to be formed on the first insulating substrate 21. The convex pattern 421 corresponds to an example of the first convex pattern of the present invention.

  The guide hole 422 is a hole disposed at a position corresponding to a guide pin 431 described later in the imprint mold 42. The guide hole 422 positions the first insulating substrate 21 already inserted in the guide pin 431 and the imprint mold 42 by inserting the guide pin 431. Further, the guide hole 422 has a depth at which the bottom surface of the guide hole 422 comes into contact with the tip of the guide pin 431 when the convex pattern 421 is pushed into the first insulating substrate 21 in the first pattern forming step S15 described later. (See FIG. 7). The guide hole 422 corresponds to an example of the first guide hole of the present invention.

  In the present embodiment, such a convex pattern 421 and a guide hole 422 can be formed in the same process using, for example, a semiconductor manufacturing technique such as electron beam lithography, photolithography, and etching. In this way, by forming the convex pattern 421 and the guide hole 422 in the same process, the relative positional relationship between the convex pattern 421 and the guide hole 422 can be accurately defined in the imprint mold 42. . The method for forming the convex pattern 421 and the guide hole 422 is not particularly limited to the above method.

The imprint mold 42 described above can be made of, for example, silicon (Si), but the material constituting the imprint mold 42 is not particularly limited. For example, the imprint mold 42 is replaced with silicon (Si), quartz (SiO ₂ ), silicon carbide (SiC), glassy carbon (GC), nickel (Ni), copper (Cu), tantalum (Ta), etc. You may comprise.

  The second stage 43 is a stage on which the first insulating substrate 21 is placed. As in the first stage 41, a heater for heating the first insulating substrate 21 is embedded in the second stage 43.

  The second stage 43 is formed with a suction hole communicating with a vacuum pump (not shown). In this embodiment, the vacuum pump sucks the first insulating substrate 21 placed on the second stage 43 through the suction hole, and the first insulation is placed on the second stage 43. The conductive substrate 21 is held.

  In addition, as shown in FIGS. 4 and 5, four guide pins 431 protruding toward the first stage 41 are attached to the second stage 43. The guide pin 431 corresponds to an example of the first guide pin of the present invention.

  Examples of the material of the guide pin 431 include stainless steel, silver (Ag), gold (Au), palladium (Pd), copper (Cu), nickel (Ni), and aluminum (Al). As a diameter of the guide pin 431 in this embodiment, about 0.1-2 mm can be mentioned, As a height, about 550 micrometers can be mentioned. In addition, about the material of the guide pin 431, it does not specifically limit to what was illustrated above, The magnitude | size of the guide pin 431 is not specifically limited to the diameter and height which were illustrated above. Further, the number of guide pins 431 is not particularly limited.

  Moreover, although the guide pin 431 in this embodiment is a column shape, if the shape of the guide pin 431 is a pin shape, it will not specifically limit.

  Returning to FIG. 3, in the first placement step S <b> 13, the guide pins 431 are inserted into the first through holes 21 b of the first insulating substrate 21, and the first insulating substrate 21 is moved to the second state. Place on stage 43. Thereby, the first insulating substrate 21 is positioned with respect to the second stage 43. Here, when wrinkles occur in the first insulating substrate 21, the surface of the first insulating substrate 21 is leveled and the wrinkles are removed.

  Further, in the present embodiment, the first insulating substrate 21 placed on the second stage 43 is sucked and held by the vacuum pump through the suction holes. Thereby, generation | occurrence | production of a new wrinkle is suppressed.

  In the steps from the first placement step S13 to the first pattern formation step S15, the heaters provided in the first and second stages 41 and 43 are turned on, and the imprint mold 42 is turned on. The first insulating substrate 21 is heated to a temperature suitable for transferring the convex pattern 421.

  Next, in the first insertion step S <b> 14, as shown in FIG. 6, the first stage 41 is moved closer to the second stage 43, and the guide pin 431 is inserted into the guide hole 422 formed in the imprint mold 42. To insert. Thereby, the 2nd stage 43 and the imprint mold 42 are positioned in a plane direction (XY direction in a figure). That is, the first insulating substrate 21 held on the second stage 43 is also positioned with respect to the imprint mold 42.

  Next, in the first pattern forming step S15, as shown in FIG. 7, the first stage 41 is further moved closer to the second stage 43, and the convex pattern 421 of the imprint mold 42 is moved to the first pattern forming step S15. Push into the insulating substrate 21. Thereby, the convex pattern 421 of the imprint mold 42 is transferred to the first insulating substrate 21, and the first concave pattern 21 a corresponding to the convex pattern 421 is formed on the first insulating substrate 21. It is formed.

  At this time, in the present embodiment, the tip of the guide pin 431 is brought into contact with the bottom surface of the guide hole 422 to stop the approach of the first stage 41 to the second stage 43, and the first insulating property. The amount by which the imprint mold 42 is pushed into the substrate 21 is regulated. Thereby, since the pressing force applied to the 1st insulating board | substrate 21 can be prescribed | regulated, the 1st concave pattern 21a can be formed with high precision. In particular, the first concave pattern 21a can be accurately formed at a predetermined depth.

  Next, although not particularly illustrated, the first insulating substrate 21 is cooled, the first stage 41 is separated from the second stage 43, and the imprint mold 42 is released from the first insulating substrate 21. Let

  Next, in the first wiring formation step S16, although not particularly illustrated, a plating layer made of a conductor such as copper is formed on the main surface of the first insulating substrate 21 on which the first concave pattern 21a is formed by plating. Form. At this time, the inside of the first concave pattern 21a is filled with a plating layer.

  Next, in the first insulating substrate 21, the plating layer is polished and planarized by CMP (Chemical Mechanical Polishing) or the like until the main surface on which the first concave pattern 21a is formed is exposed. As a result, the conductor remains only inside the first concave pattern 21a, and the first wiring pattern 22 (the wiring 22a and the via hole 22b) corresponding to the first concave pattern 21a is formed, and the first printed wiring board 2 is formed. Is completed.

  As described above, in this embodiment, when the imprint mold 42 and the first insulating substrate 21 are aligned in the planar direction and the imprint mold 42 is pressed against the first insulating substrate 21 by the guide pins 431. Both the pressing force regulation and running. For this reason, a plurality of means (for example, control of the actuator in the planar direction and control of the actuator in the vertical direction) are used to perform the alignment and pressing force control with high accuracy. One concave pattern 21a can be formed on the first insulating substrate 21 in a short time. Thereby, the productivity of the first insulating substrate 21 can be improved.

  In the present embodiment, the convex pattern 421 of the imprint mold 42 and the guide hole 422 are formed in substantially the same process, so that the relative positions of the convex pattern 421 and the guide hole 422 are obtained. The relationship can be accurately defined. Thereby, the first concave pattern 21 a can be accurately formed at a predetermined position on the first insulating substrate 21.

  Here, the imprint apparatus 4 prepared in the first printed wiring board preparation step S1 in the present embodiment is not limited to the above. For example, the imprint apparatuses 4 a to 4 h described below may be prepared and the first concave pattern 21 a may be formed on the first insulating substrate 21.

  8 to 15 are cross-sectional views showing modifications of the imprint apparatus according to this embodiment.

  For example, as shown in FIG. 8, the first insulating substrate 21 is first bonded to the first insulating substrate 21 using an imprint apparatus 4 a in which a guide hole 422 is formed in a portion exposed from the imprint mold 42 on the surface of the first stage 41. The concave pattern 21a may be formed.

  As shown in FIG. 9, an imprint apparatus 4 b in which guide pins 431 are attached to the imprint mold 42 and guide holes 422 are formed in the second stage 43 may be used. In this case, the first insulating substrate 21 is placed on the imprint mold 42 in the first placement step S13 described above. In FIG. 9, the second stage 43 is disposed on the upper side in the drawing, and the first stage 41 is disposed on the lower side in the drawing (the same applies to FIGS. 10, 11, 14, and 15). .

  In the imprint apparatus 4b shown in FIG. 9, in the imprint mold 42, the fixing hole 422a that fits with the guide pin 431 and fixes the guide pin 431 is substantially the same as the convex pattern 421 of the imprint mold 42. By forming in the same process, the relative positional relationship between the guide pin 431 and the convex pattern 421 can be accurately defined. Thereby, the first concave pattern 21a of the first insulating substrate 21 can be accurately formed at a predetermined position.

  Further, as shown in FIG. 10, a guide pin 431 is attached to the first stage 41, and an imprint apparatus 4 c in which a guide hole 422 is formed in the second stage 43 is used for the first insulating substrate 21. The first concave pattern 21a may be formed. Also in this case, the first insulating substrate 21 is placed on the imprint mold 42 in the first placement step S13 as in the case of using the imprint apparatus 4b shown in FIG.

  As shown in FIG. 11, an imprint apparatus 4 d in which a jig 44 is attached to the first stage 41 and an imprint mold 42 and guide pins 431 are attached to the jig 44 may be used. Further, a guide hole may be formed in the jig 44 and a guide pin may be attached to the second stage 43.

  As shown in FIG. 12, an imprint apparatus 4 e in which guide pins 431 are attached to the imprint mold 42 and guide bushes 432 are attached to the second stage 43 may be used. Alternatively, as illustrated in FIG. 13, an imprint apparatus 4 f in which guide pins 431 are attached to the first stage 41 and guide bushes 432 are attached to the second stage 43 may be used.

  When the first concave pattern 21a is formed on the first insulating substrate 21 using the imprint apparatuses 4e and 4f shown in FIG. 12 or FIG. 13, in the first placement step S13, The first insulating substrate 21 is placed on the second stage 43 while the guide bush 432 is inserted into the first through hole 21 b of one insulating substrate 21. Next, in the first insertion step S14, the guide pin 431 is inserted into the inner hole 432a of the guide bush 432, and in the first pattern formation step S15, the tip of the guide pin 431 is inserted into the inner hole 432a of the guide bush 432. Make contact with the bottom.

  In the example shown in FIGS. 12 and 13, a guide hole 422 is formed in the second stage 43, and a part of the guide bush 432 is inserted into the guide hole 422. The guide bush 432 may be disposed on the surface of the stage 43.

  As shown in FIG. 14, an imprint apparatus 4 g in which guide bushes 432 are attached to the imprint mold 42 and guide pins 431 are attached to the second stage 43 may be used. Alternatively, as illustrated in FIG. 15, an imprint apparatus 4 h in which a guide bush 432 is attached to the first stage 41 and a guide pin 431 is attached to the second stage 43 may be used.

  When the first concave pattern 21a is formed on the first insulating substrate 21 using the imprint apparatuses 4g and 4h shown in FIG. 14 or FIG. 15, in the first placement step S13, The first insulating substrate 21 is placed on the imprint mold 42 while the guide bush 432 is inserted into the first through hole 21 b of the one insulating substrate 21. Next, in the first insertion step S14, the guide pin 431 is inserted into the inner hole 432a of the guide bush 432, and in the first pattern formation step S15, the tip of the guide pin 431 is inserted into the inner hole 432a of the guide bush 432. Make contact with the bottom.

  In the example shown in FIGS. 14 and 15, a guide hole 422 is formed in the imprint mold 42 and the first stage 41, and a part of the guide bush 432 is inserted into the guide hole 422. Instead, the guide bush 432 may be disposed on the surface of the imprint mold 42 or the first stage 41.

  The above-described effects can also be achieved by forming the first concave pattern 21a on the first insulating substrate 21 using the imprint apparatuses 4a to 4h shown in FIGS. 8 to 15 described above.

  Next, returning to FIG. 2, the second insulating substrate preparation step S2 to the second wiring formation step S8 will be described.

  16 is a cross-sectional view illustrating the second insulating substrate preparation step and the second apparatus preparation step in FIG. 2, FIG. 17 is a cross-sectional view illustrating the second pattern formation step in FIG. 2, and FIGS. FIG. 21 is a cross-sectional view illustrating a modified example of the second placement step and the stacking step in FIG. 2, and FIG.

  In the second insulating substrate preparation step S2, the second insulating substrate 31 described above is prepared as shown in FIG.

  In the second insulating substrate 31, as shown in FIG. 16, a second through hole 31b is formed in advance. The second through hole 31b is formed when the second concave pattern 31a is formed on the second insulating substrate 31 by a thermal imprint method using the imprint apparatus 5 described later. This is a hole for positioning 31.

  Next, in the second apparatus preparation step S3, the imprint apparatus 5 for forming the second concave pattern 31a on the second insulating substrate 31 is prepared by the thermal imprint method.

  As illustrated in FIG. 16, the imprint apparatus 5 includes a first stage 51 to which an imprint mold 52 is attached, and a second stage 53. The imprint apparatus 5 has the same configuration as the imprint apparatus 4 used in the first printed wiring board preparation step S1 except that the shape of the convex pattern 521 of the imprint mold 52 is different. It has become.

  That is, guide pins 531 are attached to the second stage 53, and guide holes 522 into which the guide pins 531 are inserted are formed in the imprint mold 52. The guide pin 531 can be inserted into the first through hole 21 b of the first printed wiring board 2 and can be inserted into the through hole 31 b of the second insulating substrate 31.

  The first stage 51 corresponds to an example of the third stage of the present invention, the second stage 53 corresponds to an example of the fourth stage of the present invention, and the imprint mold 52 corresponds to an example of the present invention. It corresponds to an example of the second imprint mold, the convex pattern 521 corresponds to an example of the second convex pattern of the present invention, the guide pin 531 corresponds to an example of the second guide pin of the present invention, The guide hole 522 corresponds to an example of the second guide hole of the present invention.

  Next, in the second mounting step S4, as shown in FIG. 16, the first pin is inserted into the first through hole 21b of the first printed wiring board 2 and the first stage 53 is inserted into the first stage 53. The printed wiring board 2 is placed. At this time, as in the first placement step S13 of the first printed wiring board preparation step S1, wrinkles generated in the first printed wiring board 2 are removed and formed on the second stage 53. The first printed wiring board 2 is sucked and held by the vacuum pump through the suction hole.

  Next, in the stacking step S <b> 5, the second insulating substrate 31 is stacked on the first printed wiring board 2 while inserting the guide pins 531 into the second through holes 31 b of the second insulating substrate 31. Thereby, the 1st printed wiring board 2 and the 2nd insulating board 31 are positioned relatively.

  Next, in the second insertion step S <b> 6, the first stage 51 is brought close to the second stage 53 and the guide pin 531 is inserted into the guide hole 522. As a result, the second stage 53 and the imprint mold 52 are positioned in the planar direction, and the second insulating substrate 31 held by the second stage 53 is also positioned with respect to the imprint mold 52. .

  Next, in the second pattern formation step S7, as shown in FIG. 17, the first stage 51 is further moved closer to the second stage 53, and the convex pattern 521 of the imprint mold 52 is moved to the second pattern forming step S7. Push into the insulating substrate 31. Thereby, the convex pattern 521 of the imprint mold 52 is transferred to the second insulating substrate 31, and the second concave pattern 31 a corresponding to the convex pattern 521 is formed on the second insulating substrate 31. It is formed.

  At this time, as in the first pattern formation step S15 of the first printed wiring board preparation step S1, the tip of the guide pin 531 is brought into contact with the bottom surface of the guide hole 522, so that the second stage 53 can be contacted. The approach of the 1st stage 51 is stopped and the pushing amount of the imprint mold 52 with respect to the 2nd insulating substrate 31 is controlled. Thereby, since the pressing force applied to the second insulating substrate 31 can be defined, the second concave pattern 31a can be formed on the second insulating substrate 31 with high accuracy.

  Thus, also in the second pattern formation step S7, the guide pins 531 can be used to align the imprint mold 52 and the second insulating substrate 31 in the plane direction, and the imprint mold 52 can be used as the second insulating substrate. Both the restriction of the pressing force when pressing against 31 is executed. For this reason, a plurality of means (for example, control of the actuator in the planar direction and control of the actuator in the vertical direction) are used to perform the alignment and pressing force control with high accuracy. The two concave patterns 31a can be formed on the second insulating substrate 31 in a short time.

  Next, although not particularly illustrated, the first stage 51 is separated from the second stage 53, and the imprint mold 52 is released from the second insulating substrate 31.

  Next, in the second wiring formation step S8, the plating layer made of the conductor is formed by the plating method in the same manner as the first wiring formation step S16 in the first printed wiring board preparation step S1. After that, the second insulating substrate 31 is polished by CMP or the like so that the conductor remains only in the second concave pattern 31a formed in the second pattern formation step S7. The second wiring pattern 32 (wiring 32a and via hole 32b) is formed by planarization.

  Thereby, the second printed wiring board 3 is formed, and the multilayer laminated board 1 in which the first and second printed wiring boards 2 and 3 are laminated is completed.

  Here, in the second apparatus preparation step S3 in the present embodiment, the imprint apparatus 5 is prepared as described above, and the second placement process S4 to the second pattern formation are performed using the imprint apparatus 5. By performing step S7, the second concave pattern 31a is formed on the second insulating substrate 31, but there is no particular limitation.

  For example, the second concave pattern 31a may be formed on the second insulating substrate 31 using the imprint apparatus 4 used in the first printed wiring board preparation step S1. Alternatively, the second concave pattern 31a may be formed on the second insulating substrate 31 using an imprint apparatus having the same configuration as the imprint apparatuses 4a to 4h.

  For example, the second concave pattern 31a may be formed on the second insulating substrate 31 using an imprint apparatus having the same configuration as the imprint apparatus 4a shown in FIG. In this case, a guide pin is inserted into the guide hole formed in the first stage in the second insertion step S6.

  Further, the second concave pattern 31a may be formed on the second insulating substrate 31 by using an imprint apparatus having the same configuration as the imprint apparatus 4b shown in FIG. In the second mounting step S4 in this case, the second insulating substrate 31 is inserted into the second through hole 31b of the second insulating substrate 31 while inserting the guide pins 531 as shown in FIG. Place on the imprint mold 52. Next, in the stacking step S <b> 5, the first printed wiring board 2 is stacked on the second insulating substrate 31 while inserting the guide pins 531 into the first through holes 21 b of the first printed wiring board 2.

  Alternatively, the second concave pattern 31a may be formed on the second insulating substrate 31 by using an imprint apparatus having the same configuration as the imprint apparatuses 4c and 4d shown in FIG. Also in this case, as in the example shown in FIG. 18, the second insulating substrate 31 is placed on the imprint mold 52 in the second placement step S4, and then in the stacking step S5, the second One printed wiring board 2 is laminated on the second insulating substrate 31.

  Alternatively, the second concave pattern 31a may be formed on the second insulating substrate 31 using an imprint apparatus having the same configuration as the imprint apparatus 4e shown in FIG. In the second mounting step S4 in this case, as shown in FIG. 19, the first printed wiring board 2 is inserted while inserting the guide bush 532 into the first through hole 21b of the first printed wiring board 2. Place on the second stage 53. Next, in the stacking step S <b> 5, the second insulating substrate 31 is stacked on the first printed wiring board 2 while the guide bush 532 is inserted into the second through hole 31 b of the second insulating substrate 31. Next, in the second insertion step S6, the guide pin 531 is inserted into the inner hole 532a of the guide bush 532, and in the second pattern formation step S7, the tip of the guide pin 531 is brought into contact with the bottom surface of the inner hole 532a.

  Alternatively, the second concave pattern 31a may be formed on the second insulating substrate 31 using an imprint apparatus having the same configuration as the imprint apparatus 4f shown in FIG. In the second placement step S4 in this case, the first printed wiring board 2 is placed on the second stage 53 as in the example shown in FIG. 19, and then in the stacking step S5, the second insulation is performed. The conductive substrate 31 is laminated on the first printed wiring board 2. Next, in the second insertion step S6, the guide pin 531 is inserted into the inner hole 532a of the guide bush 532, and in the second pattern formation step S7, the tip of the guide pin 531 is brought into contact with the bottom surface of the inner hole 532a.

  Further, the second concave pattern 31a may be formed on the second insulating substrate 31 by using an imprint apparatus having the same configuration as the imprint apparatus 4g shown in FIG. In the second placement step S4 in this case, as shown in FIG. 20, the second insulating substrate 31 is inserted into the second through hole 31b of the second insulating substrate 31 while the guide bush 532 is inserted. Is placed on the imprint mold 52. Next, in the stacking step S <b> 5, the first printed wiring board 2 is stacked on the second insulating substrate 31 while inserting the guide bush 532 into the first through hole 21 b of the first printed wiring board 2. Next, in the second insertion step S6, the guide pin 531 is inserted into the inner hole 532a of the guide bush 532, and in the pattern formation step S7, the tip of the guide pin 531 is brought into contact with the bottom surface of the inner hole 532a.

  Further, the second concave pattern 31a may be formed on the second insulating substrate 31 by using an imprint apparatus having the same configuration as the imprint apparatus 4h shown in FIG. In the second placement step S4 in this case, as in the example shown in FIG. 20, the second insulating substrate 31 is placed on the imprint mold 52, and then in the lamination step S5, the first printed wiring is placed. The plate 2 is laminated on the second insulating substrate 31. Next, in the second insertion step S6, the guide pin 531 is inserted into the inner hole 532a of the guide bush 532, and in the second pattern formation step S7, the tip of the guide pin 531 is brought into contact with the bottom surface of the inner hole 532a.

  As described above, in the present embodiment, the guide pins 431 or the guide bushes 432 of the imprint apparatus 4 are inserted into the first through holes 21b of the first insulating substrate 21, and the first insulating substrate 21 is mounted. In the positioned state, the shape of the first wiring pattern 22 (first concave pattern 21a) is formed, and further, the first through hole 21b and the second through hole 31b of the second insulating substrate 31 are formed. In addition, the second concave pattern 31a is formed on the second insulating substrate 31 with the same guide pin 531 or guide bush 532 inserted and the both positioned relatively.

  That is, in the present embodiment, the first through-hole 21b of the first printed wiring board 2 is used as a positioning hole when forming the first wiring pattern 22 of the first printed wiring board 2, and The first printed wiring board 2 and the second printed wiring board 3 (second insulating substrate 31) are also used as alignment holes.

  Thereby, the relative positional relationship between the first wiring pattern 22 of the first printed wiring board 2 and the second concave pattern 31a of the second insulating substrate 31 can be accurately defined. As a result, the positional relationship between the first wiring pattern 22 of the first printed wiring board 2 and the second wiring pattern 32 formed in the second concave pattern 31a in the second printed wiring board 3. Is also precisely defined. Thereby, since the wiring patterns 22 and 32 of both the printed wiring boards 2 and 3 can be accurately connected by the via hole or the through hole, the reliability of the connection between the layers can be improved.

  In the second mounting step S4 in the present embodiment, the guide pins 531 and the guide bushes 532 are inserted into the first through holes 21b of the first printed wiring board 2, but there is no particular limitation. A first through hole 21c different from the first through hole 21b is formed in the first insulating substrate 21, and the guide pin 531 and the guide bush 532 are inserted into the first through hole 21c. The second pattern formation step S7 may be performed. For example, as shown in FIG. 21, when forming the first concave pattern 21a by the thermal imprint method in the first printed wiring board preparation step S1, the first through hole 21c is formed at the same time. Also good.

  Thereby, since the relative positional relationship between the first through hole 21 c and the first wiring pattern 22 is defined, the first printed wiring board 2 is accurately positioned via the guide pin 531 and the guide bush 532. can do. As a result, the positional relationship between the first wiring pattern 22 of the first printed wiring board 2 and the second wiring pattern 32 of the second printed wiring board 3 can be more accurately defined. The first through hole 21c corresponds to an example of the imprint through hole of the present invention.

  In the present embodiment, the multilayer laminated board 1 is composed of two printed wiring boards 2 and 3, but the number of printed wiring boards constituting the multilayer laminated board 1 is not particularly limited. For example, one or more printed wiring boards may be interposed between the first and second printed wiring boards 2 and 3, and three or more printed wiring boards may be stacked on each other.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Multilayer laminated board 2, 3 ... Printed wiring board 21, 31 ... Insulating board 21a, 31a ... Concave pattern 21b, 31b ... Through-hole 22, 32 ... Wiring pattern 4, 5 ... Imprint apparatus 41, 51 ... 1st Stage 42,52 ... imprint mold 421,521 ... convex pattern 422,522 ... guide hole 43,53 ... second stage 431,531 ... guide pin 432,532 ... guide bush 44 ... jig

Claims (9)

A method of manufacturing an insulating substrate having a first concave pattern,
A first stage and a second stage that are close to or away from each other, and a first imprint mold attached to the first stage and having a first convex pattern corresponding to the first concave pattern And preparing the second stage, the first imprint mold, or a first guide pin attached to the first stage;
Inserting the first guide pin into a first through hole formed in the insulating substrate;
The first stage and the second stage are moved closer to each other and formed on the first imprint mold, the first stage, or the second stage, and the first guide pin Inserting the first guide pin into the opposing first guide hole;
The insulating substrate is sandwiched between the first imprint mold and the second stage to form the first concave pattern on the insulating substrate, and the tip of the first guide pin is And a step of abutting against the bottom surface of the first guide hole. A method for manufacturing an insulating substrate according to claim 1,
The first guide hole is formed in the first imprint mold,
The method for manufacturing an insulating substrate, wherein the first guide hole and the first convex pattern are formed in the same process. A method for manufacturing an insulating substrate according to claim 1,
The first guide pin is attached to the first imprint mold,
The first imprint mold has a fixing hole to which the first guide pin is fixed;
The method for manufacturing an insulating substrate, wherein the fixing hole and the first convex pattern are formed in the same process. A method for manufacturing an insulating substrate according to claim 1,
The first stage has a jig interposed between the first imprint mold and the first stage.
The method of manufacturing an insulating substrate, wherein the first guide pin is attached to the jig. A method of manufacturing an insulating substrate having a first concave pattern,
A first stage and a second stage that are close to or away from each other, and a first imprint mold attached to the first stage and having a first convex pattern corresponding to the first concave pattern A first guide pin attached to the second stage, the first imprint mold, or the first stage, the first imprint mold, the first stage, or the second Preparing a first guide bush attached to the stage and facing the first guide pin;
Inserting the first guide bush into a first through hole formed in the insulating substrate;
Inserting the first guide pin into the inner hole of the first guide bush by bringing the first stage and the second stage closer to each other;
The insulating substrate is sandwiched between the first imprint mold and the second stage to form the first concave pattern on the insulating substrate, and the tip of the first guide pin is And a step of abutting against the bottom surface of the first guide bush. A method for producing a multilayer laminated board having a first printed wiring board and a second printed wiring board laminated together,
A step of forming a first insulating substrate having a first through hole by the manufacturing method according to claim 1,
Filling the first concave pattern of the first insulating substrate with a conductor to form the first printed wiring board;
A third stage and a fourth stage that are close to or away from each other; a second imprint mold attached to the third stage and having a second convex pattern; the fourth stage; Preparing a second imprint mold or a second guide pin attached to the third stage;
Inserting the second guide pin into the first through hole of the first insulating substrate;
Laminating the second insulating substrate on the first printed wiring board while inserting the second guide pin into the second through hole formed in the second insulating substrate;
The third stage and the fourth stage are brought close to each other and formed on the second imprint mold, the third stage, or the fourth stage, and the second guide pin Inserting the second guide pin into the opposing second guide hole;
Sandwiching the first printed wiring board and the second insulating substrate between the second imprint mold and the fourth stage, the second projection of the second imprint mold; The second pattern is transferred to the second insulating substrate to form a second concave pattern on the second insulating substrate, and the tip of the second guide pin is connected to the bottom surface of the second guide hole. A step of contacting the
And a step of filling the second concave pattern formed on the second insulating substrate with a conductor to form the second printed wiring board. Method. A method for producing a multilayer laminated board having a first printed wiring board and a second printed wiring board laminated together,
A step of forming a first insulating substrate having a first through hole by the manufacturing method according to claim 1,
Filling the first concave pattern of the first insulating substrate with a conductor to form the first printed wiring board;
A third stage and a fourth stage that are close to or away from each other; a second imprint mold attached to the third stage and having a second convex pattern; the fourth stage; A second imprint mold or a second guide pin attached to the third stage; and a second guide pin attached to the second imprint mold, the third stage or the fourth stage, and Preparing a second guide bushing opposite to the guide pins;
Inserting the second guide bush into the first through hole of the first insulating substrate;
Inserting the second guide pin into the inner hole of the second guide bush by bringing the third stage and the fourth stage closer to each other;
Sandwiching the first printed wiring board and the second insulating substrate between the second imprint mold and the fourth stage, the second projection of the second imprint mold; The second pattern is transferred to the second insulating substrate to form a second concave pattern on the second insulating substrate, and the tip of the second guide pin is connected to the bottom surface of the second guide bush. A step of contacting the
And a step of filling the second concave pattern formed on the second insulating substrate with a conductor to form the second printed wiring board. Method. A method for producing a multilayer laminated board having a first printed wiring board and a second printed wiring board laminated together,
A step of forming a first insulating substrate by the manufacturing method according to claim 1,
Filling the first concave pattern of the first insulating substrate with a conductor to form the first printed wiring board;
A third stage and a fourth stage that are close to or away from each other; a second imprint mold attached to the third stage and having a second convex pattern; the fourth stage; Preparing a second imprint mold or a second guide pin attached to the third stage;
Inserting the second guide pin into an imprint through-hole formed in the first insulating substrate;
Laminating the second insulating substrate on the first printed wiring board while inserting the second guide pin into the second through hole formed in the second insulating substrate;
The third stage and the fourth stage are brought close to each other and formed on the second imprint mold, the third stage, or the fourth stage, and the second guide pin Inserting the second guide pin into the opposing second guide hole;
Sandwiching the first printed wiring board and the second insulating substrate between the second imprint mold and the fourth stage, the second projection of the second imprint mold; The second pattern is transferred to the second insulating substrate to form a second concave pattern on the second insulating substrate, and the tip of the second guide pin is connected to the bottom surface of the second guide hole. A step of contacting the
Filling the second concave pattern formed on the second insulating substrate with a conductor to form the second printed wiring board, and
In the step of forming the first concave pattern, the imprint through hole is formed together with the first concave pattern by an imprint method, and the method for producing a multilayer laminated board is characterized in that: A method for producing a multilayer laminated board having a first printed wiring board and a second printed wiring board laminated together,
A step of forming a first insulating substrate by the manufacturing method according to claim 1,
Filling the first concave pattern of the first insulating substrate with a conductor to form the first printed wiring board;
A third stage and a fourth stage that are close to or away from each other; a second imprint mold attached to the third stage and having a second convex pattern; the fourth stage; A second imprint mold or a second guide pin attached to the third stage; and a second guide pin attached to the second imprint mold, the third stage or the fourth stage, and Preparing a second guide bushing opposite to the guide pins;
Inserting the second guide bush into an imprint through-hole formed in the first insulating substrate;
Inserting the second guide pin into the inner hole of the second guide bush by bringing the third stage and the fourth stage closer to each other;
The second convex shape of the second imprint mold is sandwiched between the first printed wiring board and the second insulating substrate between a second imprint mold and the fourth stage. The pattern is transferred to the second insulating substrate to form a second concave pattern on the second insulating substrate, and the tip of the second guide pin is placed on the bottom surface of the second guide bush. A contact process;
Filling the second concave pattern formed on the second insulating substrate with a conductor to form the second printed wiring board, and
In the step of forming the first concave pattern, the imprint through hole is formed together with the first concave pattern by an imprint method, and the method for producing a multilayer laminated board is characterized in that:

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