JP2012089761A - Light-emitting diode module and lighting device provided with the same - Google Patents

Abstract

A light-emitting diode module is further reduced in cost and thickness.
A light emitting diode module includes an LED element, wiring patterns a, b forming a drive circuit of the LED element, a first recess, and a second recess in which the LED element is mounted. Is formed on the bottom surface of the first recess 11 and part of the wiring patterns 3a and 3b extends to the bottom surface of the first recess 11 and extends to the bottom surface of the first recess 11 of the wiring patterns 3a and 3b. The electric wire 22 which electrically connects the provided part and the LED element 21 and the fluorescent material 31 which fills the 2nd recessed part 12, and converts the wavelength of the light which the LED element 21 emits are provided.
[Selection] Figure 2

Description

  The present invention relates to a light emitting diode module including a light emitting diode element and a wavelength conversion material that converts the wavelength of light emitted from the light emitting diode element, and an illumination device including the light emitting diode module.

  In recent years, lighting devices using light emitting diode (LED) elements (hereinafter also referred to as “LED elements”) as light sources are becoming widespread. As a typical method for realizing white illumination light using an LED element as a light source, a method in which an LED element and a phosphor are combined is known.

  For example, a method is known in which a blue LED element is combined with a red phosphor and a green phosphor, and white light is synthesized by light emitted from the blue LED element and red light and green light emitted from the phosphor when excited by the light. (For example, see Patent Document 1). Further, for example, a near ultraviolet LED element and RGB (red, green, blue) phosphors are combined, and white light is generated by red light, green light, and blue light emitted from the phosphor when excited by light emitted from the near ultraviolet LED element. A method of synthesizing is known (see, for example, Patent Document 2).

  A conventional light emitting diode module using an LED element is configured, for example, by mounting an LED package in which an LED element is incorporated or an LED package in which an LED element and a phosphor are combined (for example, Patent Document 1 or 3). See).

JP 2007-122950 A International Publication No. 2009/063915 Pamphlet JP 2006-324283 A

  For example, since the light emitting diode module disclosed in Patent Document 1 or 3 is configured by mounting an LED package on a wiring board, the number of parts is inevitably increased due to its structure, thereby reducing the cost. It becomes difficult. In addition, in the light emitting diode module having such a structure, the height dimension (the dimension in the direction orthogonal to the component mounting surface of the wiring board) inevitably adds the height dimension of the LED package to the thickness of the wiring board. Therefore, it is difficult to reduce the size, particularly to reduce the thickness.

  Further, for example, the light emitting diode module disclosed in Patent Document 2 is configured by mounting an LED element on a substrate, providing a reflector or a side wall around the LED element, and filling a phosphor inside the reflector or the side wall. Yes. Therefore, the height of the light emitting diode module disclosed in Patent Document 2 is inevitably obtained by adding the height of the reflector and the side wall to the thickness of the wiring board. Therefore, although the light emitting diode module disclosed in Patent Document 2 can be made thinner than the light emitting diode module disclosed in Patent Document 1 or 3, there is a certain limit to downsizing, in particular, thinning.

  The present invention has been made in view of such circumstances, and an object thereof is to realize further reduction in cost and thickness of a light emitting diode module.

<First Aspect of the Present Invention>
According to a first aspect of the present invention, a light emitting diode element, a wiring pattern constituting a driving circuit of the light emitting diode element, a first recess is formed, and a second recess in which the light emitting diode element is mounted is the first recess. A circuit board formed on the bottom surface of the recess and having a part of the wiring pattern extending into the first recess, a portion of the wiring pattern extending into the first recess, and the light emitting diode element. A light emitting diode module comprising: an electric wire to be electrically connected; and a wavelength conversion material that fills the second recess and converts the wavelength of light emitted from the light emitting diode element.

In this manner, a first recess is formed on the circuit board, a second recess is formed on the bottom surface of the first recess, a light emitting diode element is mounted on the second recess, and a wavelength conversion material is filled. As a result, the number of parts of the light emitting diode module can be reduced and the height dimension of the light emitting diode module can be made smaller than before.
Thereby, according to the 1st aspect of this invention, the effect that the further cost reduction and thickness reduction of a light emitting diode module can be implement | achieved is acquired.

  Further, the wiring pattern of the circuit board is extended into the first recess, and the wiring pattern and the light emitting diode element are electrically connected by the electric wire in the first recess, so that the electric wire does not protrude from the surface of the circuit board. Can be. As a result, the electric wire that electrically connects the wiring pattern and the light emitting diode element can be protected, so that the possibility of the electric wire being disconnected due to some external factor can be reduced.

<Second Aspect of the Present Invention>
According to a second aspect of the present invention, in the first aspect of the present invention described above, the circuit board is configured by forming the wiring pattern on one surface of one insulating substrate, and the wiring pattern is formed. The light emitting diode module is characterized in that the first recess and the second recess are integrally formed by recessing a part of the surface.

  As described above, according to the second aspect of the present invention, a single-layer substrate having a wiring pattern formed on one surface of a single insulating substrate is used as a circuit board, and one surface of the circuit board on which the wiring pattern is formed is provided. It is characterized in that the first recess and the second recess are integrally formed by recessing the part. Due to such features, the second aspect of the present invention makes the light emitting diode module much more distinctive than when a multilayer substrate in which a recess is formed by laminating a plurality of insulating substrates, for example, is used as a circuit substrate. It becomes possible to manufacture at low cost.

  Therefore, according to the second aspect of the present invention, the number of parts of the light emitting diode module can be further reduced, so that the effect of further reducing the cost of the light emitting diode module can be obtained.

<Third Aspect of the Present Invention>
According to a third aspect of the present invention, in the first aspect or the second aspect of the present invention described above, a light-emitting portion configured by the light-emitting diode element, the first concave portion, the second concave portion, and the wavelength conversion material. And a part of the wiring pattern is extended into the first recess of each light emitting part, and is electrically connected to the light emitting diode element of each light emitting part by the electric wire. It is a light emitting diode module.
According to the 3rd aspect of this invention, in the light emitting diode module provided with a some light emission part, the effect by the 1st aspect or 2nd aspect of this invention mentioned above can be acquired.

<Fourth aspect of the present invention>
According to a fourth aspect of the present invention, in any one of the first to third aspects of the present invention described above, the light emitting device includes a light-transmitting protective material filled in the first recess. It is a diode module.

  In this way, by filling the first concave portion in which the electrical connection portion between the wiring pattern by the electric wire and the light emitting diode element is accommodated with the protective material having translucency, the electrical connection portion is cut off from the atmosphere. And can be protected. Therefore, according to the fourth aspect of the present invention, it is possible to further reduce the possibility that the electric wire is disconnected due to some external factor, and the electrical connection portion between the wiring pattern by the electric wire and the light emitting diode element is moisture in the atmosphere. It is possible to reduce the possibility of deterioration due to the above.

<Fifth aspect of the present invention>
According to a fifth aspect of the present invention, there is provided the light emitting diode module according to any one of the first to third aspects of the present invention, further comprising a light-transmitting protective plate that closes the first recess. It is.

  In this way, the first concave portion in which the electrical connection portion between the wiring pattern by the electric wire and the light-emitting diode element is accommodated is covered with a protective plate having translucency, thereby blocking the electrical connection portion from the atmosphere. Can be protected. Therefore, according to the fifth aspect of the present invention, it is possible to further reduce the possibility that the electric wire is disconnected due to some external factor, and the electrical connection portion between the wiring pattern by the electric wire and the light emitting diode element is moisture in the atmosphere. It is possible to reduce the possibility of deterioration due to the above.

<Sixth aspect of the present invention>
A sixth aspect of the present invention is a light emitting diode module according to the fifth aspect of the present invention, wherein the first recess is filled with an inert gas.
According to the sixth aspect of the present invention, it is possible to further reduce the possibility that the electrical connection portion between the wiring pattern by the electric wire and the light-emitting diode element is deteriorated due to moisture in the atmosphere or the like.

<Seventh aspect of the present invention>
A seventh aspect of the present invention is a light emitting diode module according to the fifth aspect or the sixth aspect of the present invention described above, wherein the protective plate is an optical member that controls light distribution. .
According to the seventh aspect of the present invention, it is possible to improve the light distribution performance without adding new parts.

<Eighth aspect of the present invention>
According to an eighth aspect of the present invention, in any one of the first to seventh aspects of the present invention described above, the circuit board includes a wall that partitions the second recess into two regions, and the light emission The diode element is mounted in each of the two regions, and the wavelength conversion material is filled in each of the two regions.
According to the eighth aspect of the present invention, two types of wavelength conversion materials having different characteristics can be mounted, so that the light emission characteristics of the entire light emitting diode module can be adjusted in more detail.

<Ninth aspect of the present invention>
According to a ninth aspect of the present invention, in the eighth aspect of the present invention described above, the wavelength conversion material is filled in one of the two regions and emits light of the first chromaticity. And a second wavelength conversion material that fills the other of the two regions and emits light of the second chromaticity.
According to the ninth aspect of the present invention, the light emitted from the entire light emitting diode module is a combination of light of the first chromaticity and light of the second chromaticity. Therefore, by variably adjusting the light emission amount of each light emitting diode element, the chromaticity of light emitted from the entire light emitting diode module can be variably adjusted between the first chromaticity and the second chromaticity.

<Tenth aspect of the present invention>
According to a tenth aspect of the present invention, in the above-described eighth aspect of the present invention, the wavelength conversion material is filled in one of the two regions and emits white light having a first color temperature. A light emitting diode module comprising: a material; and a second wavelength conversion material that fills the other of the two regions and emits white light having a second color temperature.
According to the tenth aspect of the present invention, the light emitted from the entire light emitting diode module is a combination of white light having the first color temperature and white light having the second color temperature. Therefore, by individually variably adjusting the light emission amount of the light emitting diode element, it is possible to variably adjust the color temperature of the white light emitted from the entire light emitting diode module between the first color temperature and the second color temperature. .

<Eleventh aspect of the present invention>
In an eleventh aspect of the present invention, a light emitting diode element, a wiring pattern constituting a driving circuit for the light emitting diode element, a first recess is formed, and a second recess in which the light emitting diode element is mounted is the first recess. A circuit board formed on the bottom surface of the recess and having a part of the wiring pattern extending into the first recess, a portion of the wiring pattern extending into the first recess, and the light emitting diode element. A light emitting diode module comprising: an electric wire that is electrically connected; and a wavelength conversion plate that blocks the opening of the first recess and converts the wavelength of light emitted from the light emitting diode element.

In this way, the first recess is formed on the circuit board, the second recess is formed on the bottom surface of the first recess, the light emitting diode element is mounted on the second recess, and the wavelength of the light emitted from the light emitting diode element is converted. By adopting a structure in which the first concave portion is closed by the wavelength conversion plate, the number of parts of the light emitting diode module can be reduced and the height dimension of the light emitting diode module can be made smaller than before.
Thereby, according to the 11th aspect of this invention, the effect that the further reduction in cost and thickness of a light emitting diode module can be implement | achieved is acquired.

  Further, the wiring pattern of the circuit board is extended into the first recess, and the wiring pattern and the light emitting diode element are electrically connected by the electric wire in the first recess, so that the electric wire does not protrude from the surface of the circuit board. Can be. As a result, the electric wire that electrically connects the wiring pattern and the light emitting diode element can be protected, so that the possibility of the electric wire being disconnected due to some external factor can be reduced.

  Further, the first concave portion in which the electrical connection portion between the wiring pattern by the electric wire and the light-emitting diode element is accommodated is covered with a wavelength conversion plate that converts the wavelength of the light emitted from the light-emitting diode element. Can be protected from the atmosphere. Accordingly, it is possible to further reduce the possibility that the electric wire is disconnected due to some external factor, and to reduce the possibility that the electrical connection portion between the wiring pattern by the electric wire and the light emitting diode element is deteriorated due to moisture in the atmosphere. Can be made.

<Twelfth aspect of the present invention>
According to a twelfth aspect of the present invention, in the eleventh aspect of the present invention described above, the circuit board is configured by forming the wiring pattern on one surface of one insulating substrate, and the wiring pattern is formed. The light emitting diode module is characterized in that the first recess and the second recess are integrally formed by recessing a part of the surface.

  Thus, in the twelfth aspect of the present invention, a single-layer substrate having a wiring pattern formed on one side of one insulating substrate is used as a circuit board, and one of the surfaces of the circuit board on which the wiring pattern is formed. It is characterized in that the first recess and the second recess are integrally formed by recessing the part. With such a feature, the twelfth aspect of the present invention makes the light emitting diode module much more distinctive than when a multilayer substrate in which a recess is formed by laminating a plurality of insulating substrates, for example, is used as a circuit substrate. It becomes possible to manufacture at low cost.

  Therefore, according to the twelfth aspect of the present invention, the number of parts of the light emitting diode module can be further reduced, so that the effect of further reducing the cost of the light emitting diode module can be obtained.

<13th aspect of this invention>
According to a thirteenth aspect of the present invention, in the eleventh aspect or the twelfth aspect of the present invention described above, the light emitting section configured by the light emitting diode element, the first concave portion, the second concave portion, and the wavelength conversion plate. And a part of the wiring pattern is extended into the first recess of each light emitting part, and is electrically connected to the light emitting diode element of each light emitting part by the electric wire. It is a light emitting diode module.
According to the thirteenth aspect of the present invention, in the light emitting diode module including a plurality of light emitting units, the operational effects according to the eleventh aspect or the twelfth aspect of the present invention described above can be obtained.

<Fourteenth aspect of the present invention>
A fourteenth aspect of the present invention is characterized in that, in any one of the first to thirteenth aspects of the present invention described above, the first recess and the second recess are filled with an inert gas. It is a light emitting diode module.
According to the fourteenth aspect of the present invention, it is possible to further reduce the possibility that the electrical connection portion between the wiring pattern by the electric wire and the light-emitting diode element is deteriorated due to moisture in the atmosphere or the like.

<15th aspect of this invention>
According to a fifteenth aspect of the present invention, in any one of the first to fourteenth aspects of the present invention described above, a first light emitting diode element and a second light emitting diode element are mounted in the second recess, and the wavelength The conversion plate converts the wavelength of the light emitted from the first light emitting diode element to emit light of the first chromaticity and converts the wavelength of the light emitted from the second light emitting diode element into a second wavelength. A light emitting diode module including a second wavelength conversion unit that emits light of chromaticity.
According to the fifteenth aspect of the present invention, the light emitted from the entire light emitting diode module is a combination of light of the first chromaticity and light of the second chromaticity. Therefore, by variably adjusting the light emission amount of each light emitting diode element, the chromaticity of light emitted from the entire light emitting diode module can be variably adjusted between the first chromaticity and the second chromaticity.

<Sixteenth aspect of the present invention>
According to a sixteenth aspect of the present invention, in any one of the first to fourteenth aspects of the present invention described above, a first light emitting diode element and a second light emitting diode element are mounted in the second recess, and the wavelength The conversion plate converts the wavelength of the light emitted from the first light emitting diode element to emit white light having a first color temperature, and converts the wavelength of the light emitted from the second light emitting diode element to change the wavelength. A light-emitting diode module comprising: a second wavelength conversion unit that emits white light of two color temperatures.
According to the sixteenth aspect of the present invention, the light emitted from the entire light emitting diode module is a combination of white light having the first color temperature and white light having the second color temperature. Therefore, by individually variably adjusting the light emission amount of the light emitting diode element, it is possible to variably adjust the color temperature of the white light emitted from the entire light emitting diode module between the first color temperature and the second color temperature. .

<Seventeenth aspect of the present invention>
According to a seventeenth aspect of the present invention, there is provided a light emitting diode element, a recess in which the light emitting diode element is mounted, a circuit board on which a wiring pattern constituting a driving circuit for the light emitting diode element is formed, the light emitting diode element, A light emitting diode module comprising: an electric wire that electrically connects a wiring pattern; and a wavelength conversion material that converts a wavelength of light emitted from the light emitting diode element.

By adopting such a structure in which a recess is formed in a circuit board and a light emitting diode element is mounted in the recess, the number of parts of the light emitting diode module is reduced and the height dimension of the light emitting diode module is made smaller than before. Is possible.
Thereby, according to the 17th aspect of this invention, the effect that the further reduction in cost and thickness of a light emitting diode module can be implement | achieved is acquired.

<Eighteenth aspect of the present invention>
According to an eighteenth aspect of the present invention, in the seventeenth aspect of the present invention described above, the circuit board is configured by forming the wiring pattern on one surface of one insulating substrate, and the wiring pattern is formed. The light emitting diode module is characterized in that the concave portion is integrally formed by recessing a part of the surface.

  As described above, according to the eighteenth aspect of the present invention, a single-layer substrate having a wiring pattern formed on one side of a single insulating substrate is used as a circuit board, and one surface of the circuit board on which the wiring pattern is formed. It is characterized in that the concave portion is integrally formed by denting the portion. And according to such characteristics, the eighteenth aspect of the present invention makes a light-emitting diode module much different from the case where a multilayer substrate in which a recess is formed by laminating a plurality of insulating substrates, for example, is used as a circuit substrate. It becomes possible to manufacture at low cost.

  Therefore, according to the eighteenth aspect of the present invention, the number of parts of the light emitting diode module can be further reduced, so that the effect of further reducing the cost of the light emitting diode module can be obtained.

<Nineteenth Aspect of the Present Invention>
According to a nineteenth aspect of the present invention, there is provided a light emitting diode element, a recess in which the light emitting diode element is mounted, a circuit board on which a wiring pattern constituting a drive circuit of the light emitting diode element is formed, and an enclosure surrounding the recess. A body, an electric wire that electrically connects the light emitting diode element and the wiring pattern inside the enclosure, and a wavelength conversion material that fills the recess and converts the wavelength of light emitted from the light emitting diode element. It is a light emitting diode module provided.

Thus, by forming a recess in the circuit board, mounting a light emitting diode element in the recess and filling the wavelength conversion material, the number of parts of the light emitting diode module is reduced and the height dimension of the light emitting diode module Can be made smaller than before.
Thus, according to the nineteenth aspect of the present invention, there can be obtained an effect that the light emitting diode module can be further reduced in cost and thickness.

  Further, by electrically connecting the wiring pattern and the light emitting diode element with the electric wires inside the enclosure, the electric wires protruding from the surface of the circuit board can be protected with the enclosure. Therefore, the possibility that the electric wire is disconnected due to some external factor can be reduced.

<20th aspect of the present invention>
According to a twentieth aspect of the present invention, in the nineteenth aspect of the present invention described above, the circuit board is configured by forming the wiring pattern on one surface of one insulating substrate, and the wiring pattern is formed. The light emitting diode module is characterized in that the concave portion is integrally formed by recessing a part of the surface.

  Thus, in the twentieth aspect of the present invention, a single-layer substrate having a wiring pattern formed on one side of a single insulating substrate is used as a circuit board, and one surface of the circuit board on which the wiring pattern is formed. It is characterized in that the concave portion is integrally formed by denting the portion. And, according to such a feature, the twentieth aspect of the present invention makes the light emitting diode module markedly different from the case where, for example, a multilayer substrate in which a recess is formed by laminating a plurality of insulating substrates is used as a circuit substrate. It becomes possible to manufacture at low cost.

  Therefore, according to the twentieth aspect of the present invention, the number of parts of the light emitting diode module can be further reduced, so that the effect of further reducing the cost of the light emitting diode module can be obtained.

<21st aspect of this invention>
According to a twenty-first aspect of the present invention, in the nineteenth aspect or the twentieth aspect of the present invention described above, a plurality of light-emitting portions each including the light-emitting diode element, the concave portion, the enclosure, and the wavelength conversion material are provided. The light-emitting diode module is characterized in that the wiring pattern is electrically connected to the light-emitting diode element of each light-emitting portion with the electric wire inside the surrounding portion of each light-emitting portion.
According to the twenty-first aspect of the present invention, in the light-emitting diode module including a plurality of light-emitting portions, the operational effects of the nineteenth aspect or the twentieth aspect of the present invention described above can be obtained.

<Twenty-second aspect of the present invention>
According to a twenty-second aspect of the present invention, in any one of the nineteenth to twenty-first aspects of the present invention described above, the light-transmitting protective material filled inside the enclosure is provided. It is a light emitting diode module.

  In this way, by filling the inside of the enclosure that surrounds the electrical connection portion between the wiring pattern by the electric wire and the light emitting diode element, the electrical connection portion is shielded from the atmosphere by filling the protective material having translucency. Can be protected. Therefore, according to the twenty-second aspect of the present invention, it is possible to further reduce the possibility that the electric wire is disconnected due to some external factor, and the electrical connection portion between the wiring pattern by the electric wire and the light emitting diode element is moisture in the atmosphere. It is possible to reduce the possibility of deterioration due to the above.

<Twenty-third aspect of the present invention>
A twenty-third aspect of the present invention is the light-emitting diode according to any one of the nineteenth to twenty-first aspects of the present invention, further comprising a protective plate having translucency that closes the inside of the enclosure. It is a module.

  In this way, by blocking the inner side of the enclosure surrounding the electrical connection portion between the wiring pattern of the electric wire and the light emitting diode element with a protective plate having translucency, the electrical connection portion is blocked from the atmosphere. Can be protected. Therefore, according to the twenty-third aspect of the present invention, it is possible to further reduce the possibility that the electric wire is disconnected due to some external factor, and the electrical connection portion between the wiring pattern by the electric wire and the light emitting diode element is moisture in the atmosphere. It is possible to reduce the possibility of deterioration due to the above.

<The 24th aspect of the present invention>
A twenty-fourth aspect of the present invention is a light-emitting diode module according to the twenty-third aspect of the present invention, wherein an inert gas is filled inside the enclosure.
According to the twenty-fourth aspect of the present invention, it is possible to further reduce the possibility that the electrical connection portion between the wiring pattern by the electric wire and the light-emitting diode element is deteriorated due to moisture in the atmosphere or the like.

<25th aspect of this invention>
A twenty-fifth aspect of the present invention is a light-emitting diode module according to the twenty-third or twenty-fourth aspect of the present invention, wherein the protective plate is an optical member that controls light distribution. .
According to the twenty-fifth aspect of the present invention, the light distribution performance can be improved without adding new parts.

<26th aspect of this invention>
A twenty-sixth aspect of the present invention is the light-emitting diode module according to any one of the twenty-third to twenty-fifth aspects of the present invention, wherein the enclosure is formed integrally with the protective plate. It is.
According to the twenty-sixth aspect of the present invention, the light emitting diode module according to the twenty-third to twenty-fifth aspects of the present invention can be realized with a smaller number of parts, and the manufacturing cost can be further reduced. Cost reduction is possible.

<Twenty Seventh Aspect of the Present Invention>
A twenty-seventh aspect of the present invention is the light-emitting diode element according to any one of the nineteenth to twenty-sixth aspects of the present invention, wherein the circuit board is formed with a wall partitioning the recess into two regions. Are mounted on each of the two regions, and the wavelength conversion material is filled in each of the two regions.
According to the twenty-seventh aspect of the present invention, two types of wavelength conversion materials having different characteristics can be mounted, so that the light emission characteristics of the entire light emitting diode module can be adjusted in more detail.

<Twenty-eighth aspect of the present invention>
According to a twenty-eighth aspect of the present invention, in the twenty-seventh aspect of the present invention, the wavelength conversion material is filled in one of the two regions and emits light of the first chromaticity. And a second wavelength conversion material that fills the other of the two regions and emits light of the second chromaticity.
According to the twenty-eighth aspect of the present invention, the light emitted from the entire light emitting diode module is a combination of light of the first chromaticity and light of the second chromaticity. Therefore, by variably adjusting the light emission amount of each light emitting diode element, the chromaticity of light emitted from the entire light emitting diode module can be variably adjusted between the first chromaticity and the second chromaticity.

<29th Aspect of the Present Invention>
According to a twenty-ninth aspect of the present invention, in the twenty-seventh aspect of the present invention, the wavelength conversion material is filled in one of the two regions and emits white light having a first color temperature. A light emitting diode module comprising: a material; and a second wavelength conversion material that fills the other of the two regions and emits white light having a second color temperature.
According to the twenty-ninth aspect of the present invention, the light emitted from the entire light emitting diode module is a combination of white light having the first color temperature and white light having the second color temperature. Therefore, by individually variably adjusting the light emission amount of the light emitting diode element, it is possible to variably adjust the color temperature of the white light emitted from the entire light emitting diode module between the first color temperature and the second color temperature. .

<Thirty Aspect of the Present Invention>
A thirtieth aspect of the present invention is a light emitting diode module according to any one of the nineteenth to twenty-ninth aspects of the present invention described above, wherein the enclosure is made of a silicone material.
According to the thirtieth aspect of the present invention, by forming the enclosure with a silicone material that is generally excellent in heat resistance and light resistance, the electric wire protection function of the enclosure can be maintained for a longer period of time.

<Thirty-first aspect of the present invention>
According to a thirty-first aspect of the present invention, in any one of the second aspect, the twelfth aspect, the eighteenth aspect or the twentieth aspect of the present invention, the insulating substrate is an alumina-based ceramic substrate, zirconia-alumina. A light-emitting diode module, which is one selected from the group consisting of a ceramic substrate and a glass-ceramic substrate.
According to the thirty-first aspect of the present invention, by using one selected from the group consisting of an alumina-based ceramic substrate, a zirconia-alumina-based ceramic substrate and a glass-ceramic substrate having high thermal conductivity as an insulating substrate, a light-emitting diode Since the heat generated by the element can be efficiently radiated, the reliability of the light emitting diode module can be further improved. Moreover, since these substrates have high reflectance, the light extraction efficiency of the light emitting diode module can be further improved by using these substrates. Furthermore, since these substrates are excellent in moldability, the use of these substrates makes it easier to manufacture the circuit board of the light emitting diode module. Thereby, the manufacturing cost of the light emitting diode module can be further reduced.

<Thirty-second aspect of the present invention>
A thirty-second aspect of the present invention is a light emitting diode module according to any one of the first to thirty-first aspects of the present invention described above, a driving power source for the light emitting diode element, and from the driving power source to the light emitting diode element. And a control device that controls the power supply.
According to the thirty-second aspect of the present invention, in the illuminating device using the light emitting diode module, the operational effect of any of the first to thirty-first aspects of the present invention described above can be obtained.

  According to the present invention, it is possible to obtain the operational effect that the light emitting diode module can be further reduced in cost and thickness.

The whole block diagram of an illuminating device. The top view and side sectional view of the light emission part of the light emitting diode module of 1st Example. The top view and side sectional view of the 1st modification of the 1st example. The top view of the 2nd modification of 1st Example. The block diagram of an illuminating device. 4 is a timing chart illustrating control of a transistor by a control unit. 9 is a timing chart illustrating a modification example of transistor control by the control unit. The circuit diagram which illustrated the 1st modification of the circuit composition of a light emitting diode module. The circuit diagram which illustrated the 2nd modification of the circuit composition of a light emitting diode module. The circuit diagram which illustrated the 3rd modification of the circuit composition of a light emitting diode module. The circuit diagram which illustrated the 4th modification of the circuit composition of a light emitting diode module. The top view and side sectional view of the light emission part of the light emitting diode module of 2nd Example. The top view and side sectional drawing of the modification of 2nd Example. The top view and side sectional drawing of the light emission part of the light emitting diode module of 3rd Example. The top view and side sectional drawing of the modification of 3rd Example. The top view and side sectional drawing of the light emission part of the light emitting diode module of 4th Example. The top view and side sectional drawing of the modification of 4th Example. The top view and side sectional view of the light emission part of the light emitting diode module of 5th Example. The top view and side sectional drawing of the modification of 5th Example. The top view and side sectional drawing of the light emission part of the light emitting diode module of 6th Example. The top view and side sectional drawing of the modification of 6th Example. The top view and side sectional drawing of the light emission part of the light emitting diode module of 7th Example. The top view and side sectional drawing of the modification of 7th Example. The top view and side sectional drawing of the light emission part of the light emitting diode module of 8th Example. The top view and side sectional drawing of the modification of 8th Example. The top view and side sectional drawing of the light emission part of the light emitting diode module of 9th Example. The top view and side sectional drawing of the modification of 9th Example. The top view and side sectional drawing of the light emission part of the light emitting diode module of 10th Example. The top view and side sectional view of the modification of 10th Example. The top view and side sectional drawing of the light emission part of the light emitting diode module of 11th Example. The top view and side sectional drawing of the modification of 11th Example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement.

<Configuration of lighting apparatus 100>
The structure of the illuminating device 100 which concerns on this invention is demonstrated referring FIG.
FIG. 1 is an overall configuration diagram of the illumination device 100.

  The lighting device 100 includes a light emitting diode module 10, a power source 30 that is a driving power source of the light emitting diode element mounted on the light emitting diode module 10, and a control device 20 that controls power supply from the power source 30 to the light emitting diode module 10. Prepare. The light emitting diode module 10 includes a circuit board 1 in which wiring patterns 3a and 3b constituting a driving circuit of the light emitting diode element are formed of a metal having good conductivity such as a copper foil, and a light emitting diode element mounted on the circuit board 1 And a plurality of light emitting units 2 including

  The circuit board 1 is an insulating substrate, and various materials can be applied. For example, a material selected from ceramics, resin, glass epoxy, composite resin containing a filler in the resin, or the like may be used. For example, in order to improve the light reflectivity and improve the light extraction efficiency of the light emitting section 2, it is preferable to use a silicone resin containing a white pigment such as alumina powder, silica powder, magnesium oxide, or titanium oxide. In addition, for example, it is possible to improve heat dissipation by using a metal substrate such as a copper substrate or an aluminum substrate. In this case, however, it is necessary to form a wiring pattern on the wiring substrate through electrical insulation. There is.

  As the circuit board 1, it is preferable to use one selected from the group consisting of an alumina-based ceramic substrate, a zirconia-alumina-based ceramic substrate, and a glass-ceramic substrate as an insulating substrate, and in particular, a reflectance of 85% or more, further 90 It is more preferable to use one having a reflectance of ˜95%. Thereby, the light extraction efficiency from the light emitting unit 2 can be further improved. In addition, the above substrates all have high thermal conductivity, and the circuit board 1 is constituted by these substrates, so that the heat generated by the light emitting diode elements can be efficiently radiated. Therefore, the reliability of the light emitting diode module 10 can be further improved. Furthermore, since these substrates are all excellent in moldability, the circuit board 1 can be manufactured more easily by using these substrates. Thereby, the manufacturing cost of the light emitting diode module 10 can be further reduced.

  Moreover, when the circuit board 1 employ | adopts the single layer board | substrate with which the wiring pattern was formed only in the surface, you may provide copper foil etc. in the whole back surface. As a result, the heat radiation efficiency from the back surface of the circuit board 1 to the heat sink or the like can be improved, so that the heat radiation performance of the light emitting diode module 10 can be further improved. Furthermore, the circuit board 1 may be appropriately provided with, for example, through holes for fixing with screws, cutouts, or the like.

  For the wiring patterns 3a and 3b, a known method such as a method by screen printing or a method by photolithography etching can be used. Alternatively, a method of forming a wiring pattern by ejecting conductive ink, metal particles, or the like from an ink jet head can be used.

<First embodiment of the present invention>
A first embodiment of the present invention and its modification will be described with reference to FIGS.

1. First Embodiment of Light Emitting Diode Module 10 FIG. 2 illustrates the light emitting section 2 of the light emitting diode module 10 according to the first embodiment. FIG. 2A is a plan view of the light emitting section 2, and FIG. ) Is a side sectional view of the light emitting section 2.

  In the circuit board 1, a first recess 11 is formed in a portion corresponding to each light emitting unit 2, and a second recess 12 is formed in the bottom surface of the first recess 11. More specifically, the first recess 11 is a rectangular recess, and the second recess 12 is a rectangular recess formed substantially at the center of the bottom surface of the first recess 11.

  In particular, as shown in FIG. 2, the circuit board 1 employs a single layer substrate in which wiring patterns 3a and 3b are formed on one side of a single insulating substrate, and a part of the surface on which the wiring patterns 3a and 3b are formed is recessed. It is preferable that the first concave portion 11 and the second concave portion 12 are integrally formed by bending. Accordingly, for example, the light emitting diode module 10 can be manufactured at a much lower cost than a case where a multilayer substrate in which a recess is formed by stacking a plurality of insulating substrates is used as a circuit substrate.

  More specifically, the circuit board 1 in which the first concave portion 11 and the second concave portion 12 are formed, for example, when a ceramic substrate is used, the first concave portion 11 is pressed with a ceramic substrate before sintering. And if the 2nd recessed part 12 is formed and a ceramic substrate is sintered after that, it can manufacture easily. For example, when using a substrate made of a thermosetting resin such as a phenol resin or an epoxy resin, the first concave portion 11 and the second concave portion 12 are formed with a pressing mold before heating, and then heated and cured. It can be manufactured easily.

  An LED element (light emitting diode element) 21 is mounted in the second recess 12. The LED element 21 is a surface-mount type (SMD type) LED element, and a face-up type, a face-down type (flip chip), or a bonded type (vertical type) LED element can be used.

  A part of the wiring patterns 3 a and 3 b of the circuit board 1 extends to the inside of the first recess 11, more specifically to the bottom surface of the first recess 11. From the viewpoint of facilitating the formation of the wiring patterns 3a and 3b from the surface of the circuit board 1 to the bottom surface of the first recess 11, the first recess 11 of the circuit board 1 has, for example, a side surface as shown in the figure instead of a vertical surface. The shape may be a gently inclined surface.

The LED element 21 mounted in the second recess 12 is electrically connected to a portion extending to the bottom surface of the first recess 11 of the wiring patterns 3a and 3b by, for example, an electric wire 22 wired by wire bonding or the like. Yes. The second recess 12 is filled with a fluorescent material 31 as a “wavelength conversion material” that converts the wavelength of light emitted from the LED element 21. That is, the light emitting unit 2 of the first embodiment includes the first concave portion 11 and the second concave portion 12 formed in the circuit board 1, the LED element 21 mounted in the second concave portion 12, and the fluorescence filled in the second concave portion 12. It is composed of a material 31.
In this embodiment, the circuit board 1 has an overall thickness of about 1 mm, and the thickness of the portion where the second recess 12 is formed (the distance from the back surface of the circuit board 1 to the bottom surface of the second recess 12) is about 0.00. Although it is 3-0.5 mm, it is not specifically limited to this.

  The LED element 21 is an LED element that emits near-ultraviolet light. The fluorescent material 31 is made of a filler that disperses and holds a red fluorescent material, a green fluorescent material, and a blue fluorescent material. Near-ultraviolet light emitted from the LED element 21 is wavelength-converted into red light, green light and blue light by the red phosphor, green phosphor and blue phosphor, respectively. Then, white light is emitted from the light emitting unit 2 by combining the red light, the green light, and the blue light. The color temperature of the white light emitted from the light emitting unit 2 can be adjusted by changing the mixing ratio of the red phosphor, the green phosphor, and the blue phosphor contained in the phosphor 31.

  The fluorescent material 31 may be formed by mixing, for example, a blue phosphor and a yellow phosphor in a filler. In this case, near-ultraviolet light emitted from the LED element 21 is wavelength-converted into blue light and yellow light by the blue phosphor and the yellow phosphor. Then, white light is emitted from the light emitting section 2 by combining the blue light and the yellow light. Further, instead of the combination of the blue phosphor and the yellow phosphor, a combination of a red phosphor and a blue-green (cyan) phosphor can be used in the same manner.

2. First Modified Example of First Embodiment FIG. 3 illustrates a first modified example of the light emitting unit 2 of the light emitting diode module 10 of the first example, and FIG. 3A is a plan view of the light emitting unit 2. FIG. 3B is a side sectional view of the light emitting unit 2.

In the first modification, in addition to the first embodiment described above, a wall 13 that further partitions the second recess 12 into two regions is formed on the circuit board 1. The LED element 21 is mounted in each of these two regions. One of the two regions is filled with a first fluorescent material 31a as a “first wavelength converting material”, and the other is filled with a second fluorescent material 31b as a “second wavelength converting material”. . Since other configurations are the same as those of the first embodiment (FIG. 2) described above, detailed description thereof is omitted.
In the first modification, the wiring patterns 3a and 3b can be provided on the upper surface of the wall 13 that partitions the second recess 12 into two regions.

  For the first fluorescent material 31a and the second fluorescent material 31b, fluorescent materials having the same characteristics may be used, or fluorescent materials having different characteristics may be used. If fluorescent materials having different characteristics are used, the light emission characteristics of the entire light emitting diode module 10 can be adjusted in more detail.

  For example, if the first fluorescent material 31a that emits light of the first chromaticity and the second fluorescent material 31b that emits light of the second chromaticity are used, the light emitted from the entire light emitting diode module 10 is the first. This is a combination of light of chromaticity and light of second chromaticity. Therefore, by individually variably adjusting the light emission amount of the LED element 21, the chromaticity of light emitted from the entire light emitting diode module 10 can be variably adjusted between the first chromaticity and the second chromaticity. . More specifically, for example, when the first fluorescent material 31a is a blue fluorescent material and the second fluorescent material 31b is a yellow fluorescent material, the light emitted from the entire light emitting diode module 10 is blue light and yellow light. It becomes the synthesized white light. And white light of various color temperatures can be obtained by variably adjusting the light emission amount of the LED element 21 individually. Alternatively, the first fluorescent material 31a may be a red fluorescent material, and the second fluorescent material 31b may be a blue-green fluorescent material.

  Further, for example, if the first fluorescent material 31a that emits white light of the first color temperature and the second fluorescent material 31b that emits white light of the second color temperature are used, the light emitted from the entire light emitting diode module 10 is: This is a combination of white light having the first color temperature and white light having the second color temperature. Therefore, by individually adjusting the light emission amount of the LED element 21, the color temperature of the white light emitted from the entire light emitting diode module 10 can be variably adjusted between the first color temperature and the second color temperature. Become. More specifically, for example, a phosphor material in which a red phosphor, a green phosphor and a blue phosphor are mixed is used, and the mixing ratio is changed between the first phosphor material 31a and the second phosphor material 31b. Thereby, the first color temperature of the white light emitted from the first fluorescent material 31a can be made different from the second color temperature of the white light emitted from the second fluorescent material 31b. And white light of various color temperatures can be obtained by variably adjusting the light emission amount of the LED element 21 individually. Or the fluorescent material which mixed the blue fluorescent substance and the yellow fluorescent substance may be used, the mixing ratio may be changed with the 1st fluorescent material 31a and the 2nd fluorescent material 31b, and a red fluorescent substance and a blue-green fluorescent substance are used. You may change the mixing ratio with the 1st fluorescent material 31a and the 2nd fluorescent material 31b using the mixed fluorescent material.

  The light obtained by synthesizing the light emitted from the first fluorescent material 31a and the light emitted from the second fluorescent material 31b is not particularly limited to white light, and is obtained from the light emitting diode module 10. The phosphor may be appropriately selected and determined according to the color temperature, chromaticity, luminance, saturation, etc. of the emitted light.

3. Second Modification of First Embodiment FIG. 4 is a plan view illustrating a second modification of the light emitting unit 2 of the light emitting diode module 10 of the first embodiment.

  In the second modified example, in addition to the first modified example (FIG. 3) described above, four first LED elements 21a are further mounted in one of the two regions partitioned by the wall 13 of the second recess 12. On the other side, four second LED elements 21b are mounted. Since other configurations are the same as those of the first modified example (FIG. 3) described above, detailed description thereof is omitted.

4). LED element Each LED element 21 is an LED element that emits near-ultraviolet light having a peak wavelength of 405 nm, and more specifically, a GaN-based light source that emits light in the near-ultraviolet region using an InGaN semiconductor as a light-emitting layer. LED elements are preferred. However, the type and emission wavelength characteristics of the LED element 21 are not particularly limited to LED elements that emit near-ultraviolet light, and various LED elements can be used as long as the gist of the present invention is not changed.

  Specifically, for example, an LED element that emits blue light may be used. When this blue LED element is used, the peak wavelength of light is preferably in the wavelength range of 360 nm to 460 nm, preferably 400 nm to 450 nm. In this case, the fluorescent material 31 (the first fluorescent material 31a and the second fluorescent material 31b in the modification) is, for example, a material in which a yellow fluorescent material is dispersed and held in a filler, or a red fluorescent material and a green fluorescent material. What is necessary is just to use what is dispersed and held.

5. Phosphors and fillers In the present invention, various types of phosphors and fillers can be used, and specific examples thereof are as follows.

(1) Red phosphor The emission peak wavelength of the red phosphor is usually 570 nm or more, preferably 580 nm or more, more preferably 585 nm or more, and usually 780 nm or less, preferably 700 nm or less, more preferably 680 nm or less. Are suitable. Among them, as the red phosphor, for example, (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Ca, Sr, Ba) Si (N, O) ₂ : Eu, (Ca, Sr, Ba) ) AlSi (N, O) ₃ : Eu, (Sr, Ba) ₃ SiO ₅ : Eu, (Ca, Sr) S: Eu, SrAlSi ₄ N ₇ : Eu, (La, Y) ₂ O ₂ S: Eu, Eu _{(dibenzoylmethane)} 3 · 1,10-phenanthroline complexes of β- diketone Eu complex, a carboxylic acid Eu _complex, K 2 _SiF 6: Mn is _{preferred, (Ca, Sr, Ba)} 2 Si 5 (N , O) ₈ : Eu, (Sr, Ca) AlSi (N, O) ₃ : Eu, SrAlSi ₄ N ₇ : Eu, (La, Y) ₂ O ₂ S: Eu, K ₂ SiF ₆ : Mn are more preferable. .

(2) Orange phosphor An orange phosphor having an emission peak wavelength of 580 nm or more, preferably 590 nm or more and 620 nm or less, preferably 610 nm or less can be suitably used in place of the red phosphor. Examples of such orange phosphors include (Sr, Ba) ₃ SiO ₅ : Eu, (Sr, Ba) ₂ SiO ₄ : Eu, (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Ca, Sr, Ba) AlSi (N, O) ₃ : Ce and the like.

(3) Green phosphor The emission peak wavelength of the green phosphor is usually 500 nm or more, preferably 510 nm or more, more preferably 515 nm or more, usually less than 550 nm, preferably 542 nm or less, more preferably 535 nm or less. Are suitable. Among them, as the green phosphor, for example, Y ₃ (Al, Ga) ₅ O ₁₂ : Ce, CaSc ₂ O ₄ : Ce, Ca ₃ (Sc, Mg) ₂ Si ₃ O ₁₂ : Ce, (Sr, Ba) ₂ SiO ₄ : Eu, (Si, Al) ₆ (O, N) ₈ : Eu (β-sialon), (Ba, Sr) ₃ Si ₆ O ₁₂ : N ₂ : Eu, SrGa ₂ S ₄ : Eu, BaMgAl ₁₀ O ₁₇ : Eu and Mn are preferable.

(4) Blue phosphor The emission peak wavelength of the blue phosphor is usually 420 nm or more, preferably 430 nm or more, more preferably 440 nm or more, usually less than 500 nm, preferably 490 nm or less, more preferably 480 nm or less, still more preferably. Is preferably in the wavelength range of 470 nm or less, particularly preferably 460 nm or less. Among them, as a blue phosphor, for example, (Ca, Sr, Ba) MgAl ₁₀ O ₁₇ : Eu, (Sr, Ca, Ba, Mg) ₁₀ (PO ₄ ) ₆ (Cl, F) ₂ : Eu, (Ba, Ca , Mg, Sr) ₂ SiO ₄ : Eu, (Ba, Ca, Sr) ₃ MgSi ₂ O ₈ : Eu are preferred, (Ba, Sr) MgAl ₁₀ O ₁₇ : Eu, (Ca, Sr, Ba) ₁₀ (PO ₄ ) ₆ (Cl, F) ₂ : Eu, Ba ₃ MgSi ₂ O ₈ : Eu are more preferable, and Sr ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu, BaMgAl ₁₀ O ₁₇ : Eu is particularly preferable.

(5) Yellow phosphor The emission peak wavelength of the yellow phosphor is usually 530 nm or more, preferably 540 nm or more, more preferably 550 nm or more, and usually 620 nm or less, preferably 600 nm or less, more preferably 580 nm or less. Are suitable. Among them, as the yellow phosphor, for example, Y ₃ Al ₅ O ₁₂ : Ce, (Y, Gd) ₃ Al ₅ O ₁₂ : Ce, (Sr, Ca, Ba, Mg) ₂ SiO ₄ : Eu, (Ca, Sr) Si ₂ N ₂ O ₂ : Eu, α-sialon, La ₃ Si ₆ N ₁₁ : Ce (however, a part thereof may be substituted with Ca or O) are preferable.

(6) Blue-green phosphor The blue-green phosphor includes halophosphate phosphors such as (Ba, Ca, Mg) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu ²⁺ (peak wavelength 483 nm), 2SrO · 0. Phosphate phosphors such as 84P ₂ O ₅ .0.16B ₂ O ₃ : Eu ²⁺ (peak wavelength 480 nm), and silicates such as Sr ₂ Si ₃ O ₈ · 2SrCl ₂ : Eu ²⁺ (peak wavelength 490 nm) Phosphor, BaAl ₈ O ₁₃ : Eu ²⁺ (peak wavelength 480 nm), BaMg ₂ Al ₁₆ O ₂₇ : Eu ²⁺ , Mn ²⁺ (peak wavelengths 450 nm, 515 nm), SrMgAl ₁₀ O ₁₇ : Eu ²⁺ (peak wavelength 480 nm), ^{_{sr 4 Al 14 O 25: Eu}} 2+ ( about a peak wavelength 480 nm) aluminate phosphor such as, BaSi ₂ N ₂ O ₂ There are eu ²⁺ (about a peak wavelength 480 nm) oxynitride-based fluorescent material or the like. Instead of a single type of blue-green phosphor, a plurality of types of blue-green phosphors may be mixed and used, or a blue phosphor and a green phosphor may be mixed as appropriate so that the emitted light is blue-green. It may be made to become.

(7) Filler A thermoplastic resin, a thermosetting resin, a photocurable resin, or the like is used as a filler for dispersing and holding the phosphor in the fluorescent material 31, but against near-ultraviolet light emitted from the LED element 21. It is preferable to use a material having sufficient transparency and durability. Specifically, for example, (meth) acrylic resins such as poly (meth) methyl acrylate, styrene resins such as polystyrene and styrene-acrylonitrile copolymers, polycarbonate resins, polyester resins, phenoxy resins, butyral resins, polyvinyl alcohol, ethyl cellulose And cellulose resins such as cellulose acetate and cellulose acetate butyrate, epoxy resins, phenol resins, and silicone resins. Examples of the inorganic material include, for example, a solution obtained by hydrolytic polymerization of a solution containing a metal alkoxide, a ceramic precursor polymer or a metal alkoxide by a sol-gel method, or an inorganic material obtained by solidifying a combination thereof, such as a siloxane bond. It is possible to use an inorganic material or glass having

6). Control device 20
An example of the control device 20 of the illumination device 100 will be described with reference to FIGS.

FIG. 5 is a block diagram of the lighting device 100.
The lighting device 100 includes a light emitting diode module 10, a control device 20, and a power supply 30. The light emitting diode module 10 is a second modification (FIG. 4) of the first embodiment of the light emitting diode module 10 described above. The control device 20 controls power supply from the power supply 30 to the light emitting diode module 10.

As described above, in the plurality of light emitting units 2 of the light emitting diode module 10, four first LED elements 21a are mounted in one of the two regions partitioned by the wall 13 of the second recess 12, and the four light emitting units 2 are provided in the other. The second LED element 21b is mounted.
In addition, the number of the 1st LED element 21a and the 2nd LED element 21b can be suitably determined according to the characteristic of the illumination light calculated | required by the illuminating device 100, and the light emission characteristic of an LED element.

  The four first LED elements 21 a and the four second LED elements 21 b are electrically connected to the wiring patterns 3 a and 3 b of the circuit board 1 by electric wires 22. More specifically, the four first LED elements 21a have anode terminals connected to the wiring pattern 3a by electric wires 22, and cathode terminals connected to the wiring pattern 3b by electric wires 22. On the other hand, in the four second LED elements 21b, the cathode terminal is connected to the wiring pattern 3a by the electric wire 22, and the anode terminal is connected to the wiring pattern 3b by the electric wire 22. That is, the four first LED elements 21a are connected in parallel, and similarly, the four second LED elements 21b are connected in parallel. The anode terminals of the four first LED elements 21a are connected to the cathode terminals of the four second LED elements 21b. The cathode terminals of the four first LED elements 21a are connected to the anode terminals of the four second LED elements 21b.

  If the circuit configuration using the two wiring patterns 3a and 3b is employed in this way, the circuit board 1 can be formed so that the wiring patterns do not intersect with each other. Therefore, the wiring pattern is formed only on one side of the circuit board 1. To form a circuit. That is, since it is possible to use an inexpensive circuit board 1 in which a wiring pattern is formed only on one side, the light emitting diode module 10 according to the present invention can be realized at a lower cost.

  The control device 20 includes resistors R1 and R2 as transistors for driving the light emitting diode module 10, transistors Q1 to Q4, and a controller 201 for controlling the driver circuit. The drive circuit of the light emitting diode module 10 is a full-bridge type drive circuit including four transistors Q1, Q2, Q3, and Q4.

  The collector terminal of the transistor Q1 is connected to the positive electrode of the power supply 30 via a current adjusting resistor R1. The collector terminal of the transistor Q2 is connected to the positive electrode of the power supply 30 via a current adjusting resistor R2. The emitter terminal of the transistor Q1 is connected to the collector terminal of the transistor Q3. The emitter terminal of the transistor Q2 is connected to the collector terminal of the transistor Q4. The emitter terminal of the transistor Q3 and the emitter terminal of the transistor Q4 are connected to the negative electrode of the power supply 30. The base terminals of the transistors Q1, Q2, Q3, and Q4 are individually connected to the control unit 201. A wiring pattern 3a of the light emitting diode module 10 is connected to a connection point between the emitter terminal of the transistor Q1 and the collector terminal of the transistor Q3 by a cable or the like. A wiring pattern 3b of the light emitting diode module 10 is connected to a connection point between the emitter terminal of the transistor Q2 and the collector terminal of the transistor Q4 by a cable or the like.

The resistor R1 and the resistor R2 are provided to adjust the current flowing through each LED element 21 of the light emitting diode module 10 to an appropriate current value (for example, around 60 mA per LED element 21). The resistance values of the resistor R1 and the resistor R2 are the upper limit of the total luminous flux of white light emitted from the light emitting unit 2 when a current is continuously passed only to the first LED element 21a, and continuously only to the second LED element 21b. The upper limit of the total luminous flux of white light emitted from the light emitting unit 2 when a current is passed is set to be substantially equal within a preset allowable range in consideration of product variation and the like.
Note that the resistor for adjusting the current flowing through each LED element 21 is not particularly limited to the resistor R1 and the resistor R2. For example, the collector currents of the transistors Q1 and Q2 may be adjusted by one resistor, or a current adjusting resistor may be provided in each of the light emitting units 2 of the light emitting diode module 10.

  The control unit 201 performs control to turn on the transistors Q1 and Q4 while the transistors Q2 and Q3 are off, and turn on the transistors Q2 and Q3 while the transistors Q1 and Q4 are off. To do. That is, the control unit 201 executes control for alternately switching the on states of the transistors Q1 and Q4 and the on states of the transistors Q2 and Q3. Therefore, while the transistors Q1 and Q4 are in the on state, current flows only to the first LED element 21a of each light emitting unit 2, and white light is emitted only from the first fluorescent material 31a. On the other hand, while the transistors Q2 and Q3 are in the on state, a current flows only through the second LED element 21b of each light emitting unit 2, and white light is emitted only from the second fluorescent material 31b.

FIG. 6 is a timing chart illustrating control of the transistors Q1 to Q4 by the control unit 201.
The control unit 201 performs control to adjust the ratio (duty ratio) between the time for turning on the transistors Q1 and Q4 and the time for turning on the transistors Q2 and Q3.

  When the transistors Q1 and Q4 are turned on, the total current I1 flows through the four first LED elements 21a in each light emitting section 2, and white light is emitted only from the first fluorescent material 31a of each light emitting section 2. On the other hand, when the transistors Q2 and Q3 are turned on, the total current I2 flows through the four second LED elements 21b in each light emitting section 2, and white light is emitted only from the second fluorescent material 31b of each light emitting section 2. Such switching of the on-states of the transistors Q1 to Q4 is desirably performed at a period t0 (for example, 20 ms) at which the flickering of light emitted from the light emitting unit 2 is not noticeable to the naked eye.

Thus, when the ON state of the transistors Q1 and Q4 and the ON state of the transistors Q2 and Q3 are alternately switched, the first driving current Id1 and the second LED element 21b per one first LED element 21a. The second driving current Id2 is expressed by the following formulas (1) and (2).
Id1 = (t1 / t0) · (I1 / 4) (1)
Id2 = (t2 / t0) · (I2 / 4) (2)
That is, the ratio Id1 / Id2 between the first drive current Id1 and the second drive current Id2 changes according to the change in the ratio t1 / t2 between the on period t1 of the transistors Q1 and Q4 and the on period t2 of the transistors Q2 and Q3. On the other hand, the sum of the first drive current Id1 and the second drive current Id2 in one cycle t0 is constant. Therefore, by changing the ratio t1 / t2 of the on periods t1 and t2, the white light emitted from the first fluorescent material 31a in a state where the total luminous flux of white light emitted from each light emitting unit 2 is held substantially constant. The ratio between the intensity of light and the intensity of white light emitted from the second fluorescent material 31b changes.

FIG. 7 is a timing chart illustrating a modified example of the control of the transistors Q1 to Q4 by the control unit 201.
In the control example of the timing chart shown in FIG. 7, the on / off cycle t0 of the transistors Q1 and Q2, the on period t1 of the transistor Q1, and the on period t2 of the transistor Q2 are the same as in the control example of FIG. On the other hand, the transistor Q3 is controlled so that the ON state of the pulse width t3 is repeated at a constant period while the transistor Q2 is in the ON state (period t2), and the transistor Q4 is controlled while the transistor Q1 is in the ON state (period t1) Control is performed so that the ON state of the pulse width t3 is repeated at a constant cycle.

Assuming that the number of pulses of the current I1 in the period t1 is n1 and the number of pulses of the current I2 in the period t2 is n2, as is clear from the above-described formulas (1) and (2), per one of the first LED elements 21a The first drive current Id1 and the second drive current Id2 per one second LED element 21b are expressed by the following equations (3) and (4).
Id1 = (n1 · t3 / t0) · (I1 / 4) (3)
Id2 = (n2 · t3 / t0) · (I2 / 4) (4)
That is, by changing the pulse width t3, the magnitudes of the first drive current Id1 and the second drive current Id2 can be increased or decreased in the same direction at the same rate.
If the pulse width t3 is maximized and the duty ratio of the pulse is 100%, the current always flows through the first LED element 21a in the period t1, and the period t2 in the same manner as in the control example of FIG. A current always flows through the second LED element 21b.

  As is clear from the above equations (3) and (4), if the pulse number n1 of the current I1 in the period t1 and the pulse number n2 of the current I2 in the period t2 are constant, the first pulse can be changed even if the pulse width t3 is changed. The ratio Id1 / Id2 between the drive current Id1 and the second drive current Id2 is constant. On the other hand, if the period t0 is constant and the on-period t1 of the transistor Q1 and the on-period t2 of the transistor Q2 are changed, one of the pulse numbers n1 and n2 increases and the other decreases, so the first drive current Id1 and the second drive The ratio Id1 / Id2 with the current Id2 changes. If the pulse width t3 is changed, the total luminous flux of white light emitted from the light emitting unit 2 can be changed.

7). Modification of Circuit Configuration of Circuit Board 1 The circuit configuration of the four first LED elements 21a and the four second LED elements 21b in each light emitting unit 2 is not particularly limited to the above configuration (FIG. 5), and various Deformation is possible. Hereinafter, an example of another circuit configuration will be described with reference to FIGS.
When the circuit configuration described below is adopted, the wiring patterns inevitably intersect with each other on the circuit board 1. For example, wiring patterns are formed on both the front surface and the back surface and connected by through holes or the like. It is necessary to use a double-sided substrate. Further, the configuration of the LED drive circuit when the circuit configuration described below is adopted is well known and need not be illustrated and will not be described.

(1) First Modification of Circuit Configuration FIG. 8 is a circuit diagram illustrating a first modification of the circuit configuration of the light emitting diode module 10.
In the first modification of the circuit configuration of the light emitting diode module 10, the four first LED elements 21a are connected in parallel, and similarly, the four second LED elements 21b are connected in parallel. The four first LED elements 21a have an anode terminal connected to the first line 4a and a cathode terminal connected to the second line 4b. On the other hand, the four second LED elements 21b have an anode terminal connected to the third line 4c and a cathode terminal connected to the fourth line 4d. That is, the modification has a circuit configuration in which four first LED elements 21a connected in parallel and four second LED elements 21b connected in parallel are separated. Therefore, the drive currents of the four first LED elements 21 and the drive currents of the four second LED elements 21b can be controlled independently.

(2) Second Modification of Circuit Configuration FIG. 9 is a circuit diagram illustrating a second modification of the circuit configuration of the light emitting diode module 10.
In the second modification of the circuit configuration of the light emitting diode module 10, the four first LED elements 21a are connected in series, and similarly, the four second LED elements 21b are connected in series. The anode terminal of the first LED element 21a on the most upstream side in the forward current direction is connected to the first line 4a, and the cathode terminal of the first LED element 21a on the most downstream side in the forward current direction is connected to the second line 4b. . On the other hand, the anode terminal of the second LED element 21b on the most upstream side in the forward current direction is connected to the third line 4c, and the cathode terminal of the second LED element 21b on the most downstream side in the forward current direction is connected to the fourth line 4d. Yes. That is, the modification has a circuit configuration in which four first LED elements 21a connected in series and four second LED elements 21b connected in series are separated. Therefore, the drive currents of the four first LED elements 21 and the drive currents of the four second LED elements 21b can be controlled independently.

(3) Third Modification of Circuit Configuration FIG. 10 is a circuit diagram illustrating a third modification of the circuit configuration of the light emitting diode module 10.
In the third modification of the circuit configuration of the light-emitting diode module 10, all the four first LED elements 21a have all anode terminals connected to the first line 5a and all cathode terminals connected to the second line 5b. Yes. In the four second LED elements 21b, all anode terminals are connected to the second line 5b, and all cathode terminals are connected to the third line 5c.

(4) Fourth Modified Example of Circuit Configuration FIG. 11 is a circuit diagram illustrating a fourth modified example of the circuit configuration of the light emitting diode module 10.
In the fourth modification of the circuit configuration of the light emitting diode module 10, the four first LED elements 21a are connected in series, and similarly, the four second LED elements 21b are connected in series. The anode terminal of the first LED element 21a on the most upstream side in the forward current direction is connected to the first line 5a. The cathode terminal of the first LED element 21a on the most downstream side in the forward current direction and the anode terminal of the second LED element 21b on the most upstream side in the forward current direction are connected to the second line 5b. The cathode terminal of the second LED element 21b on the most downstream side in the forward current direction is connected to the third line 5c.

8). As described above, in the light emitting diode module 10 according to the present invention, the first recess 11 is formed on the circuit board 1, and the second recess 12 is formed on the bottom surface of the first recess 11. 2 Since the LED element 21 is mounted in the recess 12 and the structure in which the fluorescent material 31 (first fluorescent material 31a and second fluorescent material 31b in the modification is filled) is employed, the number of parts of the light emitting diode module 10 is reduced. Reduction and the height dimension of the light emitting diode module 10 can be made smaller than before.
Thereby, according to this invention, the effect that the further cost reduction and thickness reduction of the light emitting diode module 10 can be implement | achieved is acquired.

  In addition, the wiring patterns 3a and 3b of the circuit board 1 are extended to the bottom surface of the first recess 11, and the wiring patterns 3a and 3b and the LED element 21 are electrically connected by the electric wires 22 such as bonding wires in the first recess 11. By connecting, the electric wire 22 can be prevented from projecting to the surface of the circuit board 1. As a result, it is possible to protect the electric wires 22 that electrically connect the wiring patterns 3a and 3b and the LED elements 21, so that the possibility that the electric wires 22 are disconnected due to some external factor can be reduced.

  Although the light emitting diode module 10 including the plurality of light emitting units 2 has been described as an example as the first embodiment, the light emitting diode module 10 according to the present invention may be configured with only one light emitting unit 2. It goes without saying that the effects of the present invention can be obtained even in such an embodiment. The same applies to other embodiments described below.

<Second embodiment of the present invention>
A second embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the first embodiment or the modification thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

12A and 12B illustrate the light emitting unit 2 of the light emitting diode module 10 of the second embodiment. FIG. 12A is a plan view of the light emitting unit 2 and FIG. 12B is a side sectional view of the light emitting unit 2. It is.
FIG. 13 illustrates a modification of the light emitting unit 2 of the light emitting diode module 10 of the second embodiment. FIG. 13A is a plan view of the light emitting unit 2, and FIG. It is a sectional side view.

  The light emitting section 2 of the light emitting diode module 10 of the second embodiment (FIG. 12) and its modification (FIG. 13) is a light transmitting portion that is further filled in the first recess 11 in addition to the light emitting section 2 of the first embodiment. The protective material 32 which has property is provided. As the protective material 32, for example, a transparent resin material, a glass material, or the like can be used. The protective material 32 may be a translucent material such as milky white.

  In this way, by filling the first recess 11 in which the electrical connection portion between the wiring patterns 3a, 3b and the LED element 21 by the electric wire 22 is accommodated with the translucent protective material 32, the electrical connection is achieved. The connection part can be shielded from the atmosphere and protected. Therefore, in the second embodiment of the present invention, the possibility that the electric wire 22 is disconnected due to some external factor can be further reduced, and the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wire 22 is reduced. The possibility of deterioration due to moisture in the atmosphere or the like can be reduced.

<Third embodiment of the present invention>
A third embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the first embodiment or the modification thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 14 illustrates the light emitting unit 2 of the light emitting diode module 10 according to the third embodiment. FIG. 14A is a plan view of the light emitting unit 2, and FIG. 14B is a side sectional view of the light emitting unit 2. It is.
FIG. 15 illustrates a modification of the light emitting unit 2 of the light emitting diode module 10 of the third embodiment. FIG. 15A is a plan view of the light emitting unit 2, and FIG. It is a sectional side view.

  The light emitting part 2 of the light emitting diode module 10 of the third embodiment (FIG. 14) and its modification (FIG. 15) has a light-transmitting property that blocks the first recess 11 in addition to the light emitting part 2 of the first embodiment. A protective plate 33 is provided. The protective plate 33 can be made of, for example, a transparent resin material or a glass material, and is adhered to the circuit board 1 with, for example, a silicone material or an ultraviolet curing adhesive. The protective plate 33 may be made of a translucent material such as milky white. The thickness of the protective plate 33 is preferably about 0.2 to 0.3 mm, for example. Further, the light refractive index of the protective plate 33 is used for the fluorescent material 31 (in the modified example, the first fluorescent material 31a and the second fluorescent material 31b) in order to further improve the light extraction efficiency from the light emitting unit 2. It is preferable to be equal to or larger than the filler.

  In this way, the first recess 11 in which the electrical connection portions between the wiring patterns 3a and 3b and the LED elements 21 by the electric wires 22 are accommodated is covered with the protective plate 33 having translucency so that the electrical connection is achieved. The part can be protected from the atmosphere by protection. Therefore, in the third embodiment of the present invention, the possibility that the electric wire 22 is disconnected due to some external factor can be further reduced, and the electric connection portion between the wiring patterns 3a, 3b and the LED element 21 by the electric wire 22 is reduced. The possibility of deterioration due to moisture in the atmosphere or the like can be reduced.

  In the third embodiment of the present invention, it is preferable that the space A of the first recess 11 is further filled with an inert gas. Thereby, it is possible to further reduce the possibility that the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wires 22 is deteriorated due to moisture in the atmosphere. For example, nitrogen gas can be used as the inert gas. Further, a dry gas may be filled in place of the inert gas.

  Furthermore, in the third embodiment of the present invention, the shape of the light emitting surface of the light emitting section 2 is compared with the second embodiment in which the protective material 32 is filled in the second recess 12 by using the plate-shaped protection plate 33. Can be made constant with high accuracy. Therefore, the light extraction efficiency of the light emitting unit 2 can be further improved, and more stable light extraction efficiency of the light emitting unit 2 can be obtained.

<Fourth embodiment of the present invention>
A fourth embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the first embodiment or the modification thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 16 illustrates the light emitting unit 2 of the light emitting diode module 10 of the fourth embodiment. FIG. 16A is a plan view of the light emitting unit 2 and FIG. 16B is a side sectional view of the light emitting unit 2. It is.
FIG. 17 illustrates a modification of the light emitting unit 2 of the light emitting diode module 10 of the fourth embodiment. FIG. 17A is a plan view of the light emitting unit 2, and FIG. It is a sectional side view.

  The light emitting section 2 of the light emitting diode module 10 of the fourth embodiment (FIG. 16) and its modification (FIG. 17) is formed of a light-transmitting material in addition to the light emitting section 2 of the first embodiment. The first recess 11 is closed by an optical member 34 that controls light distribution. The optical member 34 is bonded to the circuit board 1 with, for example, a silicone material or an ultraviolet curable adhesive, and for example, a lens or a prism formed using a transparent resin material, a glass material, or the like can be used.

  In the fourth embodiment of the present invention, similarly to the third embodiment, the possibility that the electric wire 22 is disconnected due to some external factor can be further reduced, and the wiring patterns 3a and 3b and the LED element 21 by the electric wire 22 can be reduced. The possibility of deterioration due to moisture in the atmosphere or the like can be reduced. Further, in the fourth embodiment of the present invention, the light distribution performance of the light emitting unit 2 of the light emitting diode module 10 can be improved without adding new parts.

  In the fourth embodiment of the present invention, it is preferable that the space B of the first recess 11 is further filled with an inert gas. Thereby, it is possible to further reduce the possibility that the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wires 22 is deteriorated due to moisture in the atmosphere. For example, nitrogen gas can be used as the inert gas. Further, a dry gas may be filled in place of the inert gas.

<Fifth embodiment of the present invention>
A fifth embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the first embodiment or the modification thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

18A and 18B illustrate the light emitting unit 2 of the light emitting diode module 10 of the fifth embodiment. FIG. 18A is a plan view of the light emitting unit 2 and FIG. 18B is a side sectional view of the light emitting unit 2. It is.
FIG. 19 illustrates a modification of the light emitting unit 2 of the light emitting diode module 10 of the fifth embodiment. FIG. 19A is a plan view of the light emitting unit 2, and FIG. It is a sectional side view.

  In the light emitting section 2 of the light emitting diode module 10 of the fifth embodiment (FIG. 18) and its modification (FIG. 19), the second recess 12 is not filled with the fluorescent material 31, and instead of the first recess 11 A fluorescent plate 35 is provided as a “wavelength conversion plate” that closes the opening and converts the wavelength of light emitted from the LED element 21. That is, the light emitting unit 2 of the fifth embodiment includes a first recess 11 and a second recess 12 formed in the circuit board 1, an LED element 21 mounted in the second recess 12, and a fluorescent plate that closes the opening of the first recess 11. 35.

As the fluorescent plate 35, for example, a plate obtained by kneading and mixing the aforementioned phosphor into a translucent resin material can be used. Alternatively, it is also possible to use a plate-shaped member formed of a light-transmitting resin material and having the phosphor applied thereto.
In the fifth embodiment, the first recess 11 or the second recess 12 or both may be filled with a transparent resin or the like.

  Further, the fluorescent plate 35 in the modification of the fifth embodiment (FIG. 19) is a “first wavelength conversion unit” corresponding to the LED element 21 mounted in one of the two regions of the second recess 12 partitioned by the wall 13. And the second fluorescent part 35b as the “second wavelength conversion part” corresponding to the LED element 21 mounted in the other region. Such a fluorescent plate 35 can be realized, for example, by applying the phosphor to the surface of a plate-like member formed of a translucent resin material as described above. In this case, the phosphor applied to the first fluorescent part 35a and the fluorescent substance applied to the second fluorescent part 35b can be appropriately selected. For example, the same fluorescence is applied to the first fluorescent part 35a and the second fluorescent part 35b. The body may be applied, or phosphors having different characteristics may be applied.

  For example, the first fluorescent part 35a and the second fluorescent part 35b constitute a fluorescent plate 35 with a first fluorescent part 35a that emits light of the first chromaticity and a second fluorescent part 35b that emits light of the second chromaticity. For example, the light emitted from the entire light emitting diode module 10 is a combination of light of the first chromaticity and light of the second chromaticity. Therefore, by individually variably adjusting the light emission amount of the LED element 21, the chromaticity of light emitted from the entire light emitting diode module 10 can be variably adjusted between the first chromaticity and the second chromaticity. . More specifically, for example, by applying a blue phosphor to the first fluorescent part 35a and applying a yellow phosphor to the second fluorescent part 35b, the light emitted from the entire light emitting diode module 10 is blue light and yellow. It becomes white light that combines light. And white light of various color temperatures can be obtained by variably adjusting the light emission amount of the LED element 21 individually. Alternatively, a red phosphor may be applied to the first fluorescent part 35a, and a blue-green phosphor may be applied to the second fluorescent part 35b.

  Further, for example, a fluorescent plate 35 in which a phosphor that emits white light having a first color temperature is applied to the first fluorescent part 35a and a phosphor that emits white light having a second color temperature is applied to the second fluorescent part 35b is used. For example, the light emitted from the entire light emitting diode module 10 is a combination of white light having the first color temperature and white light having the second color temperature. Therefore, by individually adjusting the light emission amount of the LED element 21, the color temperature of the white light emitted from the entire light emitting diode module 10 can be variably adjusted between the first color temperature and the second color temperature. Become. More specifically, for example, a phosphor material in which a red phosphor, a green phosphor and a blue phosphor are mixed is used, and the mixing ratio is changed between the first phosphor portion 35a and the second phosphor portion 35b. Thereby, the first color temperature of the white light emitted from the first fluorescent part 35a can be made different from the second color temperature of the white light emitted from the second fluorescent part 35b. And white light of various color temperatures can be obtained by variably adjusting the light emission amount of the LED element 21 individually. Alternatively, for example, a phosphor material in which a blue phosphor and a yellow phosphor are mixed may be used, and the mixing ratio may be changed between the first phosphor portion 35a and the second phosphor portion 35b, or the red phosphor and the blue-green phosphor may be changed. A mixed fluorescent material may be used, and the mixing ratio may be changed between the first fluorescent part 35a and the second fluorescent part 35b.

  The light obtained by synthesizing the light emitted from the first fluorescent part 35a and the light emitted from the second fluorescent part 35b is not particularly limited to white light, and is required for the light emitting diode module 10. The phosphor may be appropriately selected according to the color temperature, chromaticity, luminance, saturation, etc. of the emitted light.

Thus, the first recess 11 is formed in the circuit board 1, the second recess 12 is formed on the bottom surface of the first recess 11, the LED element 21 is mounted on the second recess 12, and the LED element 21 is By adopting a structure in which the first recess 11 is closed with a fluorescent plate 35 that converts the wavelength of emitted light, the number of parts of the light emitting diode module 10 can be reduced and the height of the light emitting diode module 10 can be made smaller than before. Become.
Thereby, according to this invention, the effect that the further cost reduction and thickness reduction of the light emitting diode module 10 can be implement | achieved is acquired.

  Further, the wiring patterns 3 a and 3 b of the circuit board 1 are extended to the bottom surface of the first recess 11, and the wiring patterns 3 a and 3 b and the LED element 21 are electrically connected by the electric wires 22 in the first recess 11. The electric wire 22 can be prevented from projecting to the surface of the circuit board 1. As a result, it is possible to protect the electric wires 22 that electrically connect the wiring patterns 3a and 3b and the LED elements 21, so that the possibility that the electric wires 22 are disconnected due to some external factor can be reduced.

  Further, the first recess 11 in which the electrical connection portion between the wiring patterns 3a and 3b by the electric wire 22 and the LED element 21 is accommodated is covered with a fluorescent plate 35 that converts the wavelength of the light emitted from the LED element 21. The electrical connection can be protected from the atmosphere by protection. Therefore, the possibility that the electric wire 22 is disconnected due to some external factor can be further reduced, and the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wire 22 is caused by moisture in the atmosphere or the like. The possibility of deterioration can be reduced.

  In the fifth embodiment of the present invention, it is preferable that the space C of the first recess 11 and the second recess 12 is further filled with an inert gas. Thereby, it is possible to further reduce the possibility that the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wires 22 is deteriorated due to moisture in the atmosphere. For example, nitrogen gas can be used as the inert gas. Further, a dry gas may be filled in place of the inert gas.

<Sixth embodiment of the present invention>
A sixth embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the first embodiment or the modification thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 20 illustrates the light emitting unit 2 of the light emitting diode module 10 of the sixth embodiment. FIG. 20A is a plan view of the light emitting unit 2 and FIG. 20B is a side sectional view of the light emitting unit 2. It is.
In the light emitting section 2 of the light emitting diode module 10 of the sixth embodiment, the concave portion 14 in which the LED element 21 is mounted is formed in the circuit board 1, and the LED element 21 mounted in the concave portion 14 and the wiring patterns 3a, 3b, Are electrically connected by an electric wire 22. The fluorescent material 31 that converts the wavelength of light emitted from the LED element 21 is filled in the recess 14. That is, the light emitting section 2 of the sixth embodiment is composed of a recess 14 formed in the circuit board 1, an LED element 21 mounted in the recess 14, and a fluorescent material 31 filled in the recess 14.

  In particular, as shown in FIG. 20, the circuit board 1 employs a single layer substrate in which wiring patterns 3a and 3b are formed on one side of a single insulating substrate, and a part of the surface on which the wiring patterns 3a and 3b are formed is recessed. It is preferable to integrally mold the recess 14 by bending. Accordingly, for example, the light emitting diode module 10 can be manufactured at a much lower cost than a case where a multilayer substrate in which a recess is formed by stacking a plurality of insulating substrates is used as a circuit substrate.

  More specifically, as in the first embodiment, when using a substrate made of ceramics, for example, the recess 14 is formed with a pressing die on the ceramic substrate before sintering, and then the ceramic substrate is sintered. If it does, it can manufacture easily. For example, when a substrate made of a thermosetting resin such as a phenol resin or an epoxy resin is used, it can be easily manufactured by forming the concave portion 14 with a pressing mold before heating and then heat curing. .

  FIG. 21 illustrates a modification of the light emitting unit 2 of the light emitting diode module 10 of the sixth embodiment. FIG. 21A is a plan view of the light emitting unit 2, and FIG. It is a sectional side view.

In the modification of the sixth embodiment, in addition to the sixth embodiment described above, a wall 15 that further partitions the recess 14 into two regions is formed on the circuit board 1. The LED element 21 is mounted in each of these two regions. One of the two regions is filled with a first fluorescent material 31a as a “first wavelength converting material”, and the other is filled with a second fluorescent material 31b as a “second wavelength converting material”. . Other configurations are the same as those of the sixth embodiment (FIG. 20) described above, and thus detailed description thereof is omitted. Further, the first fluorescent material 31a and the second fluorescent material 31b are the same as the first modification of the first embodiment described above, and thus detailed description thereof is omitted.
In this modification, the wiring patterns 3a and 3b can be provided on the upper surface of the wall 15 that partitions the recess 14 into two regions.

Thus, by adopting a structure in which the recess 14 is formed in the circuit board 1 and the LED element 21 is mounted in the recess 14, the number of parts of the light emitting diode module 10 is reduced and the height of the light emitting diode module 10 is conventionally increased. Can be made smaller.
Thereby, according to this invention, the effect that the further cost reduction and thickness reduction of the light emitting diode module 10 can be implement | achieved is acquired.

<Seventh embodiment of the present invention>
A seventh embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the sixth embodiment or the modified example thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 22 illustrates the light emitting unit 2 of the light emitting diode module 10 of the seventh embodiment. FIG. 22A is a plan view of the light emitting unit 2, and FIG. It is.
FIG. 23 illustrates a modification of the light emitting unit 2 of the light emitting diode module 10 of the seventh embodiment. FIG. 23A is a plan view of the light emitting unit 2, and FIG. It is a sectional side view.

  The light emitting section 2 of the light emitting diode module 10 of the seventh embodiment (FIG. 22) and its modification (FIG. 23) is provided with a surrounding body 36 surrounding the recess 14 in addition to the light emitting section 2 of the sixth embodiment. The LED element 21 and the wiring patterns 3 a and 3 b are electrically connected by the electric wire 22 inside the surrounding body 36. That is, the light emitting unit 2 of the seventh embodiment includes a recess 14 formed in the circuit board 1, an LED element 21 mounted in the recess 14, a fluorescent material 31 filled in the recess 14, and an enclosure 36 surrounding the recess 14. It consists of

  The surrounding body 36 is a member having a substantially rectangular shape surrounding the periphery of the recess 14 and is bonded to the circuit board 1 with a silicone material or the like. What is necessary is just to set the height of the surrounding body 36 in the range which can protect the electric wire 22, for example, it is preferable to set it as about 0.3 mm. Any material may be used as the material of the enclosure 36. For example, the enclosure 36 can be made of a silicone material that is generally excellent in heat resistance and light resistance, so that the electric wire protection function of the enclosure 36 can be extended for a longer period of time. Can be maintained over time.

In this way, the concave portion 14 is formed in the circuit board 1, the LED element 21 is mounted in the concave portion 14, and the fluorescent material 31 (in the modified example, the first fluorescent material 31a and the second fluorescent material 31b) is used. By doing so, it becomes possible to reduce the number of parts of the light emitting diode module 10 and to make the height dimension of the light emitting diode module 10 smaller than the conventional one.
Thereby, according to this invention, the effect that the further cost reduction and thickness reduction of the light emitting diode module 10 can be implement | achieved is acquired.

  Further, by electrically connecting the wiring patterns 3a and 3b and the LED element 21 with the electric wires 22 inside the enclosure 36, the electric wires 22 protruding from the surface of the circuit board 1 can be protected with the enclosure 36. . Therefore, the possibility that the electric wire 22 is disconnected due to some external factor can be reduced.

<Eighth embodiment of the present invention>
The eighth embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the seventh embodiment or the modified example thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 24 illustrates the light emitting unit 2 of the light emitting diode module 10 according to the eighth embodiment. FIG. 24A is a plan view of the light emitting unit 2 and FIG. 24B is a side sectional view of the light emitting unit 2. It is.
FIG. 25 illustrates a modification of the light emitting unit 2 of the light emitting diode module 10 of the eighth embodiment. FIG. 25A is a plan view of the light emitting unit 2, and FIG. It is a sectional side view.

  The light emitting unit 2 of the light emitting diode module 10 of the eighth embodiment (FIG. 24) and its modification (FIG. 25) is further filled inside the enclosure 36 in addition to the light emitting unit 2 of the seventh embodiment. A protective material 32 having light properties is provided. As this protective material 32, for example, a transparent resin material, a glass material, or the like can be used, for example, or a translucent material such as milky white may be used.

  Thus, by filling the inner side of the enclosure 36 surrounding the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wire 22, the electrical connection can be achieved. The part can be protected from the atmosphere by protection. Therefore, in the eighth embodiment of the present invention, the possibility that the electric wire 22 is disconnected due to some external factor can be further reduced, and the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wire 22 is reduced. The possibility of deterioration due to moisture in the atmosphere or the like can be reduced.

<Ninth embodiment of the present invention>
A ninth embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the seventh embodiment or the modified example thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 26 illustrates the light emitting unit 2 of the light emitting diode module 10 of the ninth embodiment. FIG. 26A is a plan view of the light emitting unit 2 and FIG. It is.
27 shows a modification of the light emitting unit 2 of the light emitting diode module 10 of the ninth embodiment. FIG. 27A is a plan view of the light emitting unit 2, and FIG. It is a sectional side view.

  In the light emitting diode module 10 of the ninth embodiment (FIG. 26) and its modification (FIG. 27), in addition to the light emitting section 2 of the seventh embodiment, the light-transmitting property further blocks the inside of the enclosure 36. A protective plate 33 having The protective plate 33 is bonded to the upper end surface of the surrounding body 36 with, for example, a silicone material. As in the third embodiment, for example, a transparent resin material or a glass material can be used for the protective plate 33 of the ninth embodiment, or a translucent material such as milky white may be used. Further, the light refractive index of the protective plate 33 is used for the fluorescent material 31 (in the modified example, the first fluorescent material 31a and the second fluorescent material 31b) in order to further improve the light extraction efficiency from the light emitting unit 2. It is preferable to be equal to or larger than the filler.

  Thus, by closing the inner side of the enclosure 36 surrounding the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wire 22 with the protective plate 33 having translucency, the electrical connection portion is provided. Can be protected from the atmosphere. Therefore, in the ninth embodiment of the present invention, the possibility that the electric wire 22 is disconnected due to some external factor can be further reduced, and the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wire 22 is reduced. The possibility of deterioration due to moisture in the atmosphere or the like can be reduced.

  In the ninth embodiment of the present invention, it is preferable to further fill the space D inside the enclosure 36 with an inert gas. Thereby, it is possible to further reduce the possibility that the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wires 22 is deteriorated due to moisture in the atmosphere. For example, nitrogen gas can be used as the inert gas. Further, a dry gas may be filled in place of the inert gas.

<Tenth embodiment of the present invention>
A tenth embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the seventh embodiment or the modified example thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 28 illustrates the light emitting unit 2 of the light emitting diode module 10 of the tenth embodiment. FIG. 28A is a plan view of the light emitting unit 2 and FIG. 28B is a side sectional view of the light emitting unit 2. It is.
29 illustrates a modification of the light emitting unit 2 of the light emitting diode module 10 of the tenth embodiment. FIG. 29A is a plan view of the light emitting unit 2 and FIG. It is a sectional side view.

  The light emitting section 2 of the light emitting diode module 10 of the tenth embodiment (FIG. 28) and its modification (FIG. 29) is formed of a light-transmitting material in addition to the light emitting section 2 of the seventh embodiment. The first recess 11 is closed by an optical member 34 that controls light distribution. The optical member 34 is bonded to the upper end surface of the surrounding body 36 with, for example, a silicone material, and for example, a lens or a prism formed using a transparent resin material, a glass material, or the like can be used.

  In the tenth embodiment of the present invention, similar to the ninth embodiment, the possibility that the electric wire 22 is disconnected due to some external factor can be further reduced, and the wiring patterns 3a and 3b and the LED element 21 by the electric wire 22 can be reduced. The possibility of deterioration due to moisture in the atmosphere or the like can be reduced. Further, in the tenth embodiment of the present invention, the light distribution performance of the light emitting unit 2 of the light emitting diode module 10 can be improved without adding new parts.

  In the tenth embodiment of the present invention, it is preferable that the space E inside the enclosure 36 is further filled with an inert gas. Thereby, it is possible to further reduce the possibility that the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wires 22 is deteriorated due to moisture in the atmosphere. For example, nitrogen gas can be used as the inert gas. Further, a dry gas may be filled in place of the inert gas.

<Eleventh embodiment of the present invention>
An eleventh embodiment of the present invention and its modification will be described with reference to FIGS.
Since the LED element 21, the phosphor and the filler, and the control device 20 are the same as those in the first embodiment, illustration and description thereof are omitted. Regarding the configuration of the light emitting diode module 10, the same components as those in the seventh embodiment or the modified example thereof are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 30 illustrates the light emitting unit 2 of the light emitting diode module 10 of the eleventh embodiment. FIG. 30A is a plan view of the light emitting unit 2, and FIG. It is.
FIG. 31 illustrates a modification of the light emitting unit 2 of the light emitting diode module 10 of the eleventh embodiment. FIG. 31 (a) is a plan view of the light emitting unit 2, and FIG. 31 (b) is a diagram of the light emitting unit 2. It is a sectional side view.

  The light emitting unit 2 of the light emitting diode module 10 according to the eleventh embodiment (FIG. 30) and its modification (FIG. 31) transmits the protective plate 33 and the surrounding body 36 that cover the inside of the surrounding body 36 according to the ninth embodiment. A protective cover 37 is integrally formed of a material having a property. The protective cover 37 is bonded to the circuit board 1 with, for example, a silicone material or an ultraviolet curable adhesive. For the protective cover 37, for example, a transparent resin material, a glass material, or the like can be used. For example, a translucent material such as milky white may be used. Further, the light refractive index of the protective cover 37 is used for the fluorescent material 31 (in the modified example, the first fluorescent material 31a and the second fluorescent material 31b) in order to further improve the light extraction efficiency from the light emitting unit 2. It is preferable to be equal to or larger than the filler.

  In the eleventh embodiment of the present invention, by providing such a protective cover 37, it becomes possible to realize the light emitting diode module 10 having the same operational effects as the ninth embodiment with a smaller number of parts. That is, since the manufacturing cost can be further reduced, the cost can be further reduced. Furthermore, in the eleventh embodiment of the present invention, it becomes easier to further improve the light extraction efficiency in the light emitting section 2 as compared with the embodiment in which the surrounding body 36 is formed of a silicone material having a relatively small light refractive index. .

  In the eleventh embodiment of the present invention, it is preferable that the space F inside the protective cover 37 is filled with an inert gas. Thereby, it is possible to further reduce the possibility that the electrical connection portion between the wiring patterns 3a and 3b and the LED element 21 by the electric wires 22 is deteriorated due to moisture in the atmosphere. For example, nitrogen gas can be used as the inert gas. Further, a dry gas may be filled in place of the inert gas.

DESCRIPTION OF SYMBOLS 1 Circuit board 2 Light emission part 3a, 3b Wiring pattern 10 Light emitting diode module 11 1st recessed part 12 2nd recessed part 13 The wall which partitions a 2nd recessed part 14 Recessed part 15 The wall which partitions a recessed part 20 Control apparatus 21 LED element 21a 1st LED element 21b 2nd LED Element 22 Electric wire 30 Power source 31 Fluorescent material 31a First fluorescent material 31b Second fluorescent material 32 Protective material 33 Protective plate 34 Optical member 35 Fluorescent plate 35a First fluorescent portion 35b Second fluorescent portion 36 Enclosure 37 Protective cover 100 Illuminating device 201 Control Part Q1-Q4 Transistor R1, R2 Resistor

Claims (32)

A light emitting diode element;
A wiring pattern constituting a driving circuit of the light emitting diode element, a first recess is formed, and a second recess in which the light emitting diode element is mounted is formed on a bottom surface of the first recess, and a part of the wiring pattern is formed A circuit board extending into the first recess;
An electric wire for electrically connecting a portion of the wiring pattern extending into the first recess and the light emitting diode element;
A light emitting diode module comprising: a wavelength conversion material that fills the second recess and converts the wavelength of light emitted from the light emitting diode element.   The circuit board is configured by forming the wiring pattern on one surface of a single insulating substrate, and the first recess and the second recess are integrated by denting a part of the surface on which the wiring pattern is formed. The light emitting diode module according to claim 1, wherein the light emitting diode module is molded.   The light emitting diode element, the first concave portion, the second concave portion, and a plurality of light emitting portions composed of the wavelength conversion material are provided, and a part of the wiring pattern is extended into the first concave portion of each light emitting portion. The light-emitting diode module according to claim 1, wherein the light-emitting diode module is electrically connected to the light-emitting diode element of each light-emitting portion with the electric wire.   The light emitting diode module according to claim 1, further comprising a translucent protective material filled in the first recess.   The light emitting diode module according to any one of claims 1 to 3, further comprising a light-transmitting protective plate that closes the first recess.   The light emitting diode module according to claim 5, wherein the first recess is filled with an inert gas.   The light emitting diode module according to claim 5, wherein the protection plate is an optical member that controls light distribution.   The circuit board is formed with a wall that partitions the second recess into two regions, the light emitting diode element is mounted in each of the two regions, and the wavelength conversion material is formed in each of the two regions. The light-emitting diode module according to claim 1, wherein the light-emitting diode module is filled.   The wavelength converting material is filled in one of the two regions and emits light of the first chromaticity, and the other of the two regions is filled and emits light of the second chromaticity. The light emitting diode module according to claim 8, further comprising a second wavelength conversion material.   The wavelength conversion material is filled in one of the two regions and radiates white light having a first color temperature, and the other of the two regions is filled with white light having a second color temperature. The light emitting diode module according to claim 8, further comprising: a second wavelength conversion material that emits light. A light emitting diode element;
A wiring pattern constituting a driving circuit of the light emitting diode element, a first recess is formed, and a second recess in which the light emitting diode element is mounted is formed on a bottom surface of the first recess, and a part of the wiring pattern is formed A circuit board extending into the first recess;
An electric wire for electrically connecting a portion of the wiring pattern extending into the first recess and the light emitting diode element;
A wavelength conversion plate that closes the opening of the first recess and converts the wavelength of light emitted from the light-emitting diode element.   The circuit board is configured by forming the wiring pattern on one surface of a single insulating substrate, and the first recess and the second recess are integrated by denting a part of the surface on which the wiring pattern is formed. The light emitting diode module according to claim 11, wherein the light emitting diode module is molded.   A plurality of light emitting portions each including the light emitting diode element, the first concave portion, the second concave portion, and the wavelength conversion plate are provided, and a part of the wiring pattern extends into the first concave portion of each light emitting portion. The light-emitting diode module according to claim 11, wherein the light-emitting diode module is electrically connected to the light-emitting diode element of each light-emitting portion with the electric wire.   The light emitting diode module according to any one of claims 11 to 13, wherein the first concave portion and the second concave portion are filled with an inert gas.   A first light emitting diode element and a second light emitting diode element are mounted on the second recess, and the wavelength conversion plate radiates light of the first chromaticity by converting the wavelength of light emitted by the first light emitting diode element. And a second wavelength conversion unit that converts the wavelength of light emitted by the second light emitting diode element and emits light of a second chromaticity. 14. The light emitting diode module according to any one of 14.   A first light emitting diode element and a second light emitting diode element are mounted on the second recess, and the wavelength conversion plate converts the wavelength of light emitted from the first light emitting diode element to generate white light having a first color temperature. A first wavelength conversion unit that radiates, and a second wavelength conversion unit that radiates white light having a second color temperature by converting the wavelength of light emitted from the second light emitting diode element. The light emitting diode module of any one of 11-14. A light emitting diode element;
A recess in which the light emitting diode element is mounted, a circuit board on which a wiring pattern constituting a drive circuit of the light emitting diode element is formed;
An electric wire for electrically connecting the light emitting diode element and the wiring pattern;
A light-emitting diode module comprising: a wavelength conversion material that converts the wavelength of light emitted from the light-emitting diode element.   The circuit board is configured by forming the wiring pattern on one surface of a single insulating substrate, and the recess is integrally formed by denting a part of the surface on which the wiring pattern is formed. The light emitting diode module according to claim 17, wherein A light emitting diode element;
A recess in which the light emitting diode element is mounted, a circuit board on which a wiring pattern constituting a drive circuit of the light emitting diode element is formed;
A go body surrounding the recess;
An electric wire for electrically connecting the light emitting diode element and the wiring pattern inside the enclosure;
A light-emitting diode module comprising: a wavelength conversion material that wavelength-converts light emitted from the light-emitting diode element and is filled in the recess.   The circuit board is configured by forming the wiring pattern on one surface of a single insulating substrate, and the recess is integrally formed by denting a part of the surface on which the wiring pattern is formed. The light emitting diode module according to claim 19, wherein   The light emitting diode element, the concave portion, the enclosure, and a plurality of light emitting portions composed of the wavelength conversion material, and the wiring pattern is inside the enclosure portion of each light emitting portion, and the light emitting diode element of each light emitting portion 21. The light-emitting diode module according to claim 19 or 20, wherein the light-emitting diode module is electrically connected with the electric wire.   The light emitting diode module according to any one of claims 19 to 21, further comprising a translucent protective material filled inside the enclosure.   The light emitting diode module according to any one of claims 19 to 21, further comprising a protective plate having translucency that closes the inside of the enclosure.   The light emitting diode module according to claim 23, wherein an inert gas is filled inside the enclosure.   The light emitting diode module according to claim 23 or 24, wherein the protection plate is an optical member that controls light distribution.   The light emitting diode module according to any one of claims 23 to 25, wherein the surrounding body is formed integrally with the protective plate.   The circuit board is formed with a wall that partitions the recess into two regions, the light emitting diode element is mounted in each of the two regions, and the wavelength conversion material is filled in each of the two regions. 27. The light emitting diode module according to any one of claims 19 to 26, wherein:   The wavelength converting material is filled in one of the two regions and emits light of the first chromaticity, and the other of the two regions is filled and emits light of the second chromaticity. The light emitting diode module according to claim 27, further comprising: a second wavelength conversion material.   The wavelength conversion material is filled in one of the two regions and radiates white light having a first color temperature, and the other of the two regions is filled with white light having a second color temperature. The light emitting diode module according to claim 27, further comprising: a second wavelength conversion material that radiates light.   30. The light emitting diode module according to claim 19, wherein the enclosure is made of a silicone material.   21. The light-emitting diode according to claim 2, 12, 18 or 20, wherein the insulating substrate is one selected from the group consisting of an alumina-based ceramic substrate, a zirconia-alumina-based ceramic substrate, and a glass-ceramic substrate. module. The light emitting diode module according to any one of claims 1 to 31,
A driving power source for the light emitting diode element;
And a control device that controls power supply from the drive power source to the light emitting diode element.

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