JP2010229221A - Thermosetting resin composition - Google Patents

Abstract

A thermosetting resin composition capable of obtaining good storage stability and obtaining good heat resistance and light resistance in a cured product thereof, a printed wiring board using the same, and a reflector for a light emitting device I will provide a.
In a thermosetting resin composition, a two-component thermosetting composition used by mixing an agent A and an agent B, wherein the agent A includes a copolymer of styrene-maleic anhydride and Including an organic solvent, the B agent contains a polyfunctional alicyclic epoxy resin and an inorganic filler.
[Selection figure] None

Description

  The present invention relates to a thermosetting resin composition containing an inorganic filler. Specifically, the cured product has light resistance and heat resistance that do not change color due to light irradiation or thermal history, and may contain an inorganic filler. The present invention relates to a thermosetting resin composition that can be used, and a printed wiring board and a light-emitting element reflector using the same.

  In recent years, light-emitting elements such as LEDs that emit light with low power have been put to practical use as backlights for liquid crystal displays such as portable terminals, personal computers, and televisions, and as light sources for lighting fixtures. Since such a light emitting element has high luminance and generates a large amount of heat, discoloration such as yellowing of peripheral materials due to heat or light and a decrease in transmittance are problematic.

  Further, the use of directly mounting these light emitting elements on a printed wiring board on which a solder resist film is formed is increasing. The printed wiring board on which such light-emitting elements such as LEDs are mounted, and reflectors used in the light-emitting elements ensure the brightness of the light-emitting elements so as to ensure brightness and not reduce the amount of light reflected by the light-emitting elements. It is required to use frequently. Therefore, a high reflectance is required for a thin film formed on a printed wiring board or a light-emitting element reflector.

  However, exposure to light from a light source for a long time may cause deterioration such as yellowing due to light, which may reduce the reflectance. Further, in a heating process such as soldering when the light emitting element is mounted on the substrate, it is exposed to a high temperature of 250 ° C. or more, so that there is a problem that yellowing or the like is deteriorated due to heat and the reflectance is lowered.

  Therefore, in order to obtain and maintain high reflectivity, an inorganic filler having high reflectivity such as titanium oxide is blended in a resin composition having colorless and transparent, light resistance and sufficient solder heat resistance, It is necessary to form a thin film.

  An example of a highly transparent heat-resistant material is a composition of an acid anhydride and an epoxy resin. However, this reaction is slow, and particularly in a usage form in which a thin film is formed and cured like a solder resist, the acid anhydride is volatilized, so it is difficult to obtain a good cured product. In addition, when a curing catalyst is added to accelerate curing, there is a problem that coloring occurs due to the influence of the curing catalyst, or discoloration such as yellowing after a heat resistance or light resistance test occurs.

  On the other hand, according to the composition of a highly reactive acid or its anhydride and an epoxy group-containing resin, a good cured product can be obtained without a catalyst, and a certain degree of heat resistance, high transparency, and light resistance can be obtained. (See, for example, Patent Document 1). However, there is a problem that sufficient heat resistance such as solder heat resistance required for a solder resist film or the like cannot be obtained.

JP 2005-36218 A

  The present invention has been made in view of such problems, and its purpose is to obtain good storage stability and thermosetting that can obtain good heat resistance and light resistance in the cured product. It is providing a resin composition, a printed wiring board using the resin composition, and a light-emitting element reflector.

  In order to achieve the above object, the thermosetting resin composition of one embodiment of the present invention is a two-component thermosetting resin composition used by mixing agent A and agent B, and agent A is The styrene-maleic anhydride copolymer and an organic solvent are included, and the B agent contains a polyfunctional alicyclic epoxy resin and an inorganic filler.

  By using a composition of a copolymer of styrene-maleic anhydride and a polyfunctional alicyclic epoxy resin, good reactivity can be obtained, and good heat resistance and light resistance can be obtained in the cured product. be able to. Furthermore, by mixing the thermosetting resin composition with a two-component solution containing a styrene-maleic anhydride copolymer in the first agent and an inorganic filler in the second agent, a mixture of maleic anhydride and inorganic filler is obtained. This makes it possible to prevent a decrease in storage stability due to.

  In the thermosetting resin composition having such a configuration, titanium oxide can be included as an inorganic filler. By including titanium oxide, it becomes possible to obtain a high reflectance in the cured product of the thermosetting resin composition.

  The printed wiring board of one embodiment of the present invention is obtained by thermosetting a solder resist film formed by applying the thermosetting resin composition having the above-described configuration to the surface of a printed wiring board on which a circuit is formed. It is characterized by that. Sufficient solder heat resistance is obtained by applying the thermosetting resin composition to a printed wiring board. Further, even when a light emitting element is mounted, high light resistance can be obtained, and further, by using titanium oxide as an inorganic filler, light emission efficiency can be improved.

  The light-emitting element reflector of one embodiment of the present invention is obtained by thermosetting a coating film formed by applying the thermosetting resin composition having the above-described structure onto a substrate. . By applying the thermosetting resin composition to the reflector for a light-emitting element, it becomes possible to obtain sufficient heat resistance and light resistance against heat and light from the light-emitting element, and titanium oxide is used as an inorganic filler. Accordingly, it is possible to improve the illuminance by reflecting the light from the element.

  In the thermosetting resin composition, it is possible to obtain good storage stability, and in the cured product, it is possible to obtain good heat resistance and light resistance in the printed wiring board and the light-emitting element reflector.

It is a figure which shows the heating temperature distribution of the conveyor-type heating furnace which concerns on the Example of this invention.

  The thermosetting resin composition of the present invention is an epoxy resin that does not volatilize in the process of forming a thin film such as a solder resist, has excellent transparency, and provides a highly heat-resistant cured product such as solder heat resistance. The first feature is that a copolymer of styrene-maleic anhydride is used as the curing agent.

  The thermosetting resin composition of the present invention has a second feature in that it is a curing system related to a combination of a polyfunctional alicyclic epoxy resin and a copolymer of styrene-maleic anhydride. Thereby, it can harden | cure even if it does not use the curing catalyst which causes discoloration, and favorable heat resistance and light resistance can be obtained in the hardened | cured material.

  On the other hand, when an inorganic filler was added to such a composition, it turned out that a viscosity increases with time and storage stability deteriorates. Thus, as a result of extensive studies, the present inventors have found that deterioration of storage stability is caused by mixing an inorganic filler with a styrene-maleic anhydride copolymer, and the present invention has been completed. . That is, the thermosetting resin composition of the present invention has a third feature in that it is a two-component type in which an agent A containing a styrene-maleic anhydride copolymer and an agent B containing an inorganic filler are mixed. There is.

  Therefore, the thermosetting resin composition of this embodiment is a two-component thermosetting composition used by mixing the A agent and the B agent, and the A agent is a copolymer of styrene-maleic anhydride. The B agent contains a polyfunctional alicyclic epoxy resin and an inorganic filler.

  Below, each structural component of the thermosetting resin composition of this embodiment is demonstrated in detail.

  Specific examples of the styrene-maleic anhydride copolymer contained in the agent A include SMA-1000P, SMA-2000P (manufactured by Sartomer). In such a styrene-maleic anhydride copolymer, the copolymerization ratio (molar ratio) of styrene units to maleic anhydride units is preferably 1: 1 to 3: 1. When the ratio of styrene units is less than 1, a copolymer cannot be formed, and when it exceeds 3, the number of crosslinking points decreases and it becomes difficult to obtain solder heat resistance. Moreover, it is preferable that molecular weight is 800-6000. More preferably, it is 1: 1 to 2: 1.

  The organic solvent contained in the agent A is usually used to adjust the viscosity by dissolving a solid styrene-maleic anhydride copolymer. Specifically, for example, ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; methyl cellosolve, butyl cellosolve, methyl carbitol, ethyl carbitol, butyl carbitol, propylene glycol monomethyl Glycol ethers such as ether, dipropylene glycol monoethyl ether, triethylene glycol monoethyl ether, carbitol acetate, etc .; Esters such as ethyl acetate, butyl acetate, and acetic acid esterified products of the above glycol ethers; ethanol, propanol, ethylene Alcohols such as glycol and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, sorbet Organic solvents such as petroleum-based solvents such as Tonafusa the like. These can be used alone or in combination of two or more.

  The polyfunctional alicyclic epoxy resin contained in the agent B is a polyfunctional epoxy compound having two or more alicyclic epoxy structures, and specifically includes, for example, Celoxide 2021P, Epolide GT-301, Epolide GT-403. , EHPE-3150, etc. (all manufactured by Daicel Chemical Industries). These epoxy compounds can be used after diluted with an organic solvent. It is preferable that 30-900 mass parts of such polyfunctional alicyclic epoxy resin is added with respect to 100 mass parts of styrene-maleic anhydride copolymers. If it is less than 30 parts by mass, the solvent resistance and heat resistance deteriorate, and if it exceeds 900 parts by mass, the heat resistance deteriorates. More preferably, it is 50-500 mass parts.

The inorganic filler contained in the agent B is used for property control of the composition such as fluidity and viscosity adjustment, and property control of the cured product such as physical strength improvement, coloring, and optical property improvement. When a high reflectance is required such as a substrate for mounting a light emitting element, a colored pigment having a high reflectance at an emission wavelength, for example, in the case of visible light, a white colored pigment such as zinc oxide or titanium oxide is preferably used. Provides high reflectivity. Titanium oxide is classified into a rutile type and an anatase type depending on the crystal structure. The anatase type has a higher reflectance on the low wavelength side in the visible light region, and a good initial reflectance can be obtained, and the appearance is bluish and a coating film that looks whiter is obtained, but the photoactivity is high. For this reason, it is desirable to use a rutile type since the deterioration of the resin is likely to proceed and the color change due to light irradiation is likely to occur. A well-known thing can be used as a rutile type titanium oxide. Specifically, the Taipei R-820, the Taipei R-830, the Taipei R-930, the Taipei R-550, the Taipei R-630, the Taipei R-680, the Taipei R-670, the Taipei R-680, the Taipei R-670, Type R-780, Type R-850, Type CR-50, Type CR-57, Type CR-80, Type CR-90, Type CR-93, Type CR-95, Type CR-97, Type CR-60, Taipei CR-63, Taipei CR-67, Taipei CR-58, Taipei CR-85, Taipei UT771 (Ishihara Sangyo Co., Ltd.), Taipei Pure R-100, Taiwan Pure R-101, Taiwan Pure R-102, Taiwan Pure R-103, Tai Pure R-1 4, Tai Pure R-105, Tai Pure R-108, Tai Pure R-900, Tai Pure R-902, Tai Pure R-960, Tai Pure R-706, Tai Pure R-931 (manufactured by DuPont), TITON R-25, TITON R -21, TITON R-32, TITON R-7E, TITON R-5N, TITON R-61N, TITON R-62N, TITON R-42, TITON R-45M, TITON R-44, TITON R-49S, TITON GTR -100, TITON GTR-300, TITON D-918, TITON TCR-29, TITON TCR-52, TITON FTR-700 (manufactured by Sakai Chemical Industry Co., Ltd.)
Etc. can be used.

  As anatase type titanium oxide, TA-100, TA-200, TA-300, TA-400, TA-500 (manufactured by Fuji Titanium Industry Co., Ltd.), Taipei A-100, Taipei A-220, Taipei W- 10 (manufactured by Ishihara Sangyo Co., Ltd.), TITANIX JA-1, TITANIX JA-3, TITANIX JA-4, TITANIX JA-5 (manufactured by Teika), KRONOS KA-10, KRONOS KA-15, KRONOS KA-20, KRONOS KA-30 (made by Titanium Industry Co., Ltd.), A-100, A-100, A-100, SA-1, SA-1L (made by Sakai Chemical Industry Co., Ltd.), etc. are mentioned.

  The compounding quantity of such a titanium oxide is 30-80 mass parts with respect to 100 mass parts of total amounts of the copolymer of a styrene-maleic anhydride and a polyfunctional alicyclic epoxy resin. Even if the blending amount exceeds 80 parts by mass, the reflectance is not improved and dispersion becomes difficult. On the other hand, when it is less than 30 parts by mass, the hiding power is small, and it becomes difficult to obtain a cured product having a high reflectance.

  Further, extender pigments such as silica and barium sulfate for improving fluidity, and bentonite for obtaining far modification can also be used.

  In addition, when it may have electroconductivity, it is also possible to use a metal particle. The shape can be, for example, a spherical or flat shape with an average particle size of 0.5 to 10 μm, or a fiber shape with a length of 0.5 to 100 μm. And it is preferable that 10-60 mass parts is added with respect to 100 mass parts of total amounts of the copolymer of a styrene-maleic anhydride and a polyfunctional alicyclic epoxy resin. If the amount is less than 10 parts by mass, the conductivity cannot be obtained, and if it exceeds 60 parts by mass, the conductivity cannot be improved according to the amount added, which is economically inappropriate.

  In this embodiment, an antioxidant can be blended for the purpose of reducing discoloration due to deterioration caused by heat applied to the coating film. Such an antioxidant is not particularly limited, but is preferably a hindered phenol compound. Examples of hindered phenol compounds include Nocrack 200, Nocrack M-17, Nocrack SP, Nocrack SP-N, Nocrack NS-5, Nocrack NS-6, Nocrack NS-30, Nocrack 300, Nocrack NS-7, Nocrack DAH. (All are manufactured by Ouchi Shinsei Chemical Co., Ltd.); MARK AO-30, MARK AO-40, MARK AO-50, MARK AO-60, MARK AO616, MARK AO-635, MARK AO-658, MARK AO -15, MARK AO-18, MARK 328, MARK AO-37 (all manufactured by Adeka Argus Chemical Co., Ltd.); Irganox 245, Irganox 259, Irganox 565, Irganox 1010, Irganox 1035, Irganox 1076, Irganox 1081, Irganox 1098, Irganox 1222, Irganox 1330, Irganox 1425WL (all of these are manufactured by Ciba Japan).

  The blending amount of the antioxidant is preferably 0.4 to 25 parts by mass, more preferably 0.8 to 15 parts by mass with respect to 100 parts by mass of the styrene-maleic anhydride copolymer. If it is less than 0.4 part by mass, the effect of preventing discoloration due to deterioration caused by heat applied to the coating film is small, and if it exceeds 25 parts by mass, it becomes difficult to obtain heat resistance and storage stability.

  Furthermore, in the composition of this embodiment, photodegradation can be reduced by containing a hindered amine light stabilizer.

  Examples of the hindered amine light stabilizer include TINUVIN 622LD, TINUVIN 144; CHIMASSORB 944LD, CHIMASSORB 119FL (all of which are manufactured by Ciba Specialty Chemicals); MARK LA-57, LA-62, LA-67, LA-63. LA-68 (all are manufactured by Adeka Gas Chemical Co., Ltd.); Sanol LS-770, LS-765, LS-292, LS-2626, LS-1114, LS-744 (all are Sankyo Lifetech ( Etc.).

  Such a light stabilizer is preferably added in an amount of 0.1 to 10 parts by mass with respect to 100 parts by mass of a styrene-maleic anhydride copolymer.

  In the heat-resistant thermosetting composition of this embodiment, the dispersibility and sedimentation properties of inorganic filler components such as titanium oxide can be improved by incorporating a dispersant. For example, ANTI-TERRA-U, ANTI-TERRA-U100, ANTI-TERRA-204, ANTI-TERRA-205, DISPERBYK-101, DISPERBYK-102, DISPERBYK-103, DISPERBYK-106, DISPERBYK-108, DISPERBYK-109, DISPERBYK-110, DISPERBYK-111, DISPERBYK-112, DISPERBYK-116, DISPERBYK-130, DISPERBYK-140, DISPERBYK-142, DISPERBYK-145, DISPERBYK-161, DISPERBYK-162, 63 DISPERBYSPER 166, DISP RBYK-167, DISPERBYK-168, DISPERBYK-170, DISPERBYK-171, DISPERBYK-174, DISPERBYK-180, DISPERBYK-182, DISPERBYK-183, DISPERBYK-185, DISPERBYK-184, DISPERBYK-ER, 2009, DISPERBYK-2020, DISPERBYK-2025, DISPERBYK-2050, DISPERBYK-2070, DISPERBYK-2096, DISPERBYK-2150, BYK-P104, BYK-P104S, BYK-P105, BYK-9076, BYK-9076, BYK-776 Big Chemie Manufactured by Japan), Disparon 2150, Disparon 1210, Disparon KS-860, Disparon KS-873N, Disparon 7004, Disparon 1830, Disparon 1860, Disparon 1850, Disparon DA-400N, Disparon PW-36, Disparon DA-703-50 (Manufactured by Enomoto Kasei Co., Ltd.), florene G-450, florene G-600, florene G-820, florene G-700, florene DOPA-44, florene DOPA-17 (manufactured by Kyoeisha Chemical Co., Ltd.).

  In order to effectively achieve the above object, the content of the dispersant is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the inorganic filler. More preferably, it is 0.5-5 mass parts.

  Furthermore, if necessary, antifoaming agents such as silicone, fluorine and copolymer resins, leveling agents, flame retardants such as phosphate esters, known thickeners such as polyamide resins and organic bentonites, silanes and titanates Coupling agents such as a system and an aluminate system, a curing accelerator, a thermal polymerization inhibitor and the like can be used.

  Hereinafter, the present embodiment will be specifically described with reference to examples and comparative examples. However, the present invention is not limited to these examples.

<Preparation of resin solution 1>
500 g of SMA-1000P (copolymerization resin having a molar ratio of styrene and maleic anhydride of 1: 1) and 500 g of carbitol acetate are placed in a stirrable sealed kettle equipped with a reflux tower and heated at 120 ° C. for 3 hours. Thus, a resin solution 1 having a nonvolatile content of 50 wt% was obtained.

<Preparation of resin solution 2>
500 g of SMA-2000P (a copolymer resin having a molar ratio of styrene and maleic anhydride of 2: 1) and 500 g of carbitol acetate are placed in a stirrable sealed kettle equipped with a reflux tower and heated at 120 ° C. for 3 hours. Thus, a resin solution 2 having a nonvolatile content of 50 wt% was obtained.

<Preparation of agent A and agent B>
As examples 1 to 8, agents A and B were prepared with the compositions shown in Table 1 and as comparative examples 1 to 8 with the compositions shown in Table 2. In addition, about the thing with a several compounding component, each compounding component was knead | mixed with the 3 roll mill, and it produced. In addition, the number in Table 1 and Table 2 shows a mass part.

  Using the A agent and B agent thus prepared, evaluation was performed as follows.

(1) Storage stability evaluation About the A agent of Examples 1-8 and Comparative Examples 1-8, using a rotational viscometer (Toki Sangyo VISCOMETER TV-33), the initial viscosity for 5 rotations per minute at 25 degreeC. Was measured. After storing this for 30 days, the viscosity was again measured in the same manner to determine the increase in viscosity. The results are shown in Table 3. In addition, what has a viscosity increase of 10% or less from an initial viscosity, (circle), what has a viscosity increase of 10-50%, (triangle | delta), what has a viscosity increase of 50% or more, and what gelatinized xx It was.

  As shown in Table 3, in the A agent of Examples 1 to 8, good storage stability was obtained. On the other hand, in the A agent of Comparative Examples 1-3, since the inorganic filler was included, the viscosity increased with time and the storage stability decreased.

(2) Heat resistance evaluation A agent and B agent were mixed, and the obtained thermosetting resin composition was patterned on a copper solid FR-4 substrate by screen printing so that the dried coating film was about 20 μm. This was printed, and this was heated at 150 ° C. for 60 minutes and cured to obtain a test piece. A rosin flux was applied to each test piece and allowed to flow in a solder bath at 260 ° C. for 30 seconds. Then, after washing with propylene glycol monomethyl ether acetate and drying, a peel test with a cellophane adhesive tape was performed to evaluate the peeling of the coating film. The results are shown in Table 4. In addition, the thing without peeling of a coating film was set as (circle), and the thing with peeling of a coating film was set as x.

  As shown in Table 4, in the thermosetting resin compositions of Examples 1 to 8, good heat resistance was obtained. On the other hand, in the A agent of Comparative Examples 4 and 5, since the epoxy resin does not have two or more alicyclic epoxy structures, sufficient heat resistance could not be obtained.

(3) Light and heat resistance evaluation 1
The A agent and the B agent of Examples 1 to 4, 7 and Comparative Example 6 were mixed, and the obtained thermosetting resin composition was screen-printed on a glass plate having a thickness of 1 mm to have a dry coating film thickness of about 20 μm. A pattern was printed, and this was heated at 150 ° C. for 60 minutes to be cured to obtain a test piece. With this as an initial value, the transmittance at a wavelength of 400 nm was measured using a transmittance measuring device (JASCO V-570: integrating sphere ISN-470). Conveyor type UV irradiator QRM-2082-E-01 (manufactured by Oak Manufacturing Co., Ltd.), metal halide lamp, cold mirror, 80 W / cm ² × 3 lamp, conveyor speed 6.5 m / min (integrated light quantity 1000 mJ / cm ² ) UV irradiation was repeated 20 times under the conditions described above. Then, it heated repeatedly by the conveyor type heating furnace twice. The transmittance after the test was measured by the same method. FIG. 1 shows the heating temperature distribution of the conveyor-type heating furnace used at this time. As shown in FIG. 1, the maximum temperature reached 260 ° C. 250 seconds after the addition. The results are shown in Table 5. In addition, in visual evaluation, the thing which does not have the difference of the color tone after an initial stage and a test was set to (circle), and the thing where the difference of a color tone is seen was set to x.

  As shown in Table 5, in the thermosetting resin compositions of Examples 1 to 4 and 7, good light and heat resistance was obtained. On the other hand, in Comparative Example 6, since the polyfunctional alicyclic epoxy resin was not included, the difference in transmittance was increased, and discoloration was observed even in visual evaluation, and sufficient light and heat resistance could not be obtained. .

(4) Light and heat resistance evaluation 2
The A agent and B agent of Examples 5, 6, 8 and Comparative Examples 7, 8 were mixed, and test pieces were prepared in the same manner as in (2) by using the obtained thermosetting resin compositions. The Y value of the XYZ color system and each value of the L * a * b * color system were measured with a color difference meter CR-400 (manufactured by Minolta). Conveyor type UV irradiator QRM-2082-E-01 (manufactured by Oak Manufacturing Co., Ltd.), metal halide lamp, cold mirror, 80 W / cm ² × 3 lamp, conveyor speed 6.5 m / min (integrated light quantity 1000 mJ / cm ² ) UV irradiation was repeated 20 times under the conditions described above. Then, after repeating and heating twice with the conveyor type heating furnace used in light-and-heat-resistant evaluation 1, the test piece was measured by the same method. The results are shown in Table 6.

In Table 6, Y represents the reflectance of the XYZ color system, and L * represents the brightness of the L * a * b * color system. ΔE * ab is a value obtained by taking the square of the difference between the initial value and the value of L * a * b *, and taking the square root of the sum. a * indicates the red direction, -a * indicates the green direction, b * indicates the yellow direction, and -b * indicates the blue direction. The closer to zero, the lower the saturation. ΔE * ab indicates a change in color. A smaller value indicates a smaller color change. As for the visual evaluation items, those having almost no discoloration were marked with ◯, and those with clear discoloration were marked with ×.

  As shown in Table 6, in the thermosetting resin compositions of Examples 5, 6, and 8, good light and heat resistance was obtained. On the other hand, in Comparative Examples 7 and 8, since the polyfunctional alicyclic epoxy resin is not included, the color change becomes large, and the color change is also observed in the visual evaluation, so that sufficient light and heat resistance cannot be obtained. It was.

  Hereinafter, about Examples 1-8, confirmation evaluation whether a predetermined characteristic was acquired was performed.

(5) Solvent resistance Each test piece prepared in the same manner as in (2) was immersed in propylene glycol monomethyl ether acetate for 30 minutes and dried, and then a peel test with a cellophane adhesive tape was performed to peel off and discolor the coating film. Was evaluated. The results are shown in Table 7. In addition, what did not have peeling of a coating film or discoloration was set as (circle). As shown in Table 7, in the thermosetting resin compositions of Examples 1 to 8, good solvent resistance was obtained.

(6) Pencil hardness test The pencils B to 9H, which are sharpened so that the tip of the core is flattened, are pressed on each test piece prepared in the same manner as in the pencil hardness test (2) at an angle of about 45 °. The hardness of the pencil where no peeling occurred was recorded. The results are shown in Table 7. As shown in Table 7, in the thermosetting resin compositions of Examples 1 to 8, a good pencil hardness of 5H or more was obtained.

(7) Insulation resistance test A test piece was prepared under the same conditions as in (2) except that a comb-type electrode B coupon having an IPC B-25 test pattern was used instead of the FR-4 copper-clad laminate. A DC 500 V bias was applied to the test piece, and the insulation resistance value was measured. The results are shown in Table 7.

As shown in Table 7, in the thermosetting resin compositions of Examples 1 to 8, a good insulation resistance of 1 × 10 ¹³ or more was obtained.

Claims (4)

A two-component thermosetting resin composition used by mixing A agent and B agent,
The agent A contains a styrene-maleic anhydride copolymer and an organic solvent,
The B agent contains a polyfunctional alicyclic epoxy resin and an inorganic filler, and is a thermosetting resin composition.   The thermosetting resin composition according to claim 1, wherein the inorganic filler contains titanium oxide.   A printed wiring obtained by thermally curing a solder resist film formed by applying the thermosetting resin composition according to claim 1 or 2 onto a printed wiring board surface on which a circuit is formed. Board.   A reflector for a light emitting device, which is obtained by thermosetting a coating film formed by applying the thermosetting resin composition according to claim 1 or 2 onto a substrate.

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