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JP2010006641A - Corrosion resistant member and treatment device using the same - Google Patents

Corrosion resistant member and treatment device using the same Download PDF

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JP2010006641A
JP2010006641A JP2008168145A JP2008168145A JP2010006641A JP 2010006641 A JP2010006641 A JP 2010006641A JP 2008168145 A JP2008168145 A JP 2008168145A JP 2008168145 A JP2008168145 A JP 2008168145A JP 2010006641 A JP2010006641 A JP 2010006641A
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corrosion
intermediate layer
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Masahiro Nakahara
正博 中原
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Kyocera Corp
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Abstract

【課題】 中間層の形成時に、アルミナ基材からイットリア膜へAl成分の拡散が起こるためにアルミナ基材の強度が低下する。
【解決手段】 アルミナを主成分とする基材4に、イットリウム酸化物を主成分とする耐食膜2を中間層3を介して設けた耐食性部材1であって、中間層3は、基材側にYAl12を主成分とする第1中間層3aと、耐食膜2側にYAlを主成分とする第2中間層3bとを有することを特徴とする。
【選択図】 図1
PROBLEM TO BE SOLVED: To reduce the strength of an alumina base material because an Al component is diffused from an alumina base material to an yttria film when an intermediate layer is formed.
SOLUTION: A corrosion resistant member 1 in which a corrosion resistant film 2 mainly composed of yttrium oxide is provided on a substrate 4 mainly composed of alumina via an intermediate layer 3, the intermediate layer 3 being formed on the substrate side. The first intermediate layer 3a mainly composed of Y 3 Al 5 O 12 and the second intermediate layer 3b mainly composed of Y 4 Al 2 O 9 are provided on the corrosion-resistant film 2 side.
[Selection] Figure 1

Description

本発明は、半導体製造装置,液晶製造装置等の製造装置(各種のエッチング装置,ALD装置,CVD装置,PVD装置,計測装置,真空装置等を含む)等の処理装置に使用され、特に腐食性ガスやプラズマに曝される構成部品に好適に使用できる耐食性部材に関し、さらにこれを用いた処理装置に関する。   The present invention is used for a processing apparatus such as a semiconductor manufacturing apparatus, a liquid crystal manufacturing apparatus or the like (including various etching apparatuses, ALD apparatuses, CVD apparatuses, PVD apparatuses, measuring apparatuses, vacuum apparatuses, etc.), and particularly corrosive. The present invention relates to a corrosion-resistant member that can be suitably used for components exposed to gas or plasma, and further relates to a processing apparatus using the same.

近年、真空チャンバーの内壁材、マイクロ波導入窓、フォーカスリング、サセプタ等の耐食性部材は、フッ素または塩素などのハロゲン系腐食性ガスの雰囲気下でプラズマに曝される。このような耐食性部材は、従来の金属に代わり、より耐食性に優れたセラミックで形成することが提案され実用化されている。セラミックスは、腐食性ガス成分との反応生成物の融点が高いものが多く、高温のプラズマ下においても蒸発しにくい。このため、腐食の進行が遅れ、結果的に優れた耐食性を示すこととなる。   In recent years, corrosion-resistant members such as an inner wall material of a vacuum chamber, a microwave introduction window, a focus ring, and a susceptor are exposed to plasma in an atmosphere of a halogen-based corrosive gas such as fluorine or chlorine. Such a corrosion-resistant member has been proposed and put into practical use by being formed of a ceramic having higher corrosion resistance instead of a conventional metal. Ceramics often have a high melting point of a reaction product with a corrosive gas component, and are difficult to evaporate even under high-temperature plasma. For this reason, the progress of corrosion is delayed, and as a result, excellent corrosion resistance is exhibited.

しかしながら、各種半導体製造装置用の耐食性部材にセラミックスを用いると、部材形状が厚肉のものになると全体を均質に焼成することが難しい。このため、耐食性部材の表面と内部での、密度差および不純物成分の分布等に差が生じる。これにより、耐食性および機械的特性の低下を招く。   However, when ceramics are used for corrosion resistant members for various semiconductor manufacturing apparatuses, it is difficult to uniformly fire the whole when the member shape is thick. For this reason, a difference arises in the density difference, the distribution of impurity components, and the like between the surface and the inside of the corrosion-resistant member. This leads to a decrease in corrosion resistance and mechanical properties.

この問題に対し、最近では基材表面にセラミック製の耐食膜を形成する試みがなされている。耐食膜は薄いためにより均質に焼成することが可能である。このため、耐食膜の表面と内部で耐食性および機械的特性に差を生じる可能性が少なく、特性的にも良好な半導体製造装置用部材を得ることが可能である。   Recently, attempts have been made to form a ceramic corrosion resistant film on the surface of the substrate. Since the corrosion-resistant film is thin, it can be fired more uniformly. For this reason, it is possible to obtain a member for a semiconductor manufacturing apparatus that is less likely to cause a difference in corrosion resistance and mechanical properties between the surface and the inside of the corrosion-resistant film, and that has good characteristics.

例えば、特許文献1ではアルミナ基材に溶射法によりイットリア膜を形成し、これを1300〜1800℃で熱処理して、イットリア膜とアルミナ基材の間にイットリアとアルミナの反応生成物からなる中間層を形成することが提案されている。
特開2002−1865号公報
For example, in Patent Document 1, an yttria film is formed on an alumina base material by a thermal spraying method, and this is heat-treated at 1300 to 1800 ° C., and an intermediate layer composed of a reaction product of yttria and alumina between the yttria film and the alumina base material. Has been proposed to form.
Japanese Patent Laid-Open No. 2002-1865

しかしながら、高温での熱処理によりアルミナ基材のAl成分とイットリア膜のY成分を反応させて、反応生成物からなる中間層を形成すると、基材であるアルミナの機械的強度が低下することがある。   However, when the Al component of the alumina base material is reacted with the Y component of the yttria film by heat treatment at a high temperature to form an intermediate layer made of the reaction product, the mechanical strength of alumina as the base material may be reduced. .

また、表面の溶射法により形成された膜は緻密化されるわけでなく、依然、積層溶射粒子間には隙間が存在し、この隙間から腐食性ガスが侵入して中間層および基材を腐食することがある。   Also, the film formed by the surface spraying method is not densified, and there are still gaps between the laminated sprayed particles, and corrosive gas enters through these gaps to corrode the intermediate layer and the substrate. There are things to do.

さらに、熱処理前の溶射法により形成されたイットリア膜は、アルミナ基材との境界面で基材表面と均質に接触していないため、熱処理後に均質な中間層となりにくい。   Furthermore, since the yttria film formed by the thermal spraying method before the heat treatment is not in homogeneous contact with the substrate surface at the interface with the alumina substrate, it is difficult to form a homogeneous intermediate layer after the heat treatment.

本発明は、基材の機械的特性を損なうことがなく、耐食膜を緻密化でき、均質で良好な中間層を備えた耐食性部材およびこれを用いた処理装置を提供することを目的とする。   An object of the present invention is to provide a corrosion-resistant member having a uniform and good intermediate layer and a processing apparatus using the same, which can densify the corrosion-resistant film without impairing the mechanical properties of the substrate.

本発明の耐食性部材は、アルミナを主成分とする基材に、イットリウム酸化物を主成分とする耐食膜を中間層を介して設けた耐食性部材であって、前記中間層は、前記基材側にYAl12を主成分とする第1中間層と、前記耐食膜側にYAlを主成分とする第2中間層とを有することを特徴とする。 The corrosion-resistant member of the present invention is a corrosion-resistant member in which a corrosion-resistant film mainly composed of yttrium oxide is provided on a substrate mainly composed of alumina via an intermediate layer, and the intermediate layer is formed on the substrate side. And having a first intermediate layer mainly composed of Y 3 Al 5 O 12 and a second intermediate layer mainly composed of Y 4 Al 2 O 9 on the corrosion-resistant film side.

また、本発明の処理装置は、内側がガスまたはそのプラズマの環境下に曝される容器を備えたものであり、上記耐食性部材を容器内の部品の少なくともガスまたはそのプラズマに曝される面に用いたことを特徴とする。   Further, the processing apparatus of the present invention includes a container whose inside is exposed to a gas or plasma environment thereof, and the corrosion-resistant member is disposed on at least a surface of the component in the container exposed to the gas or plasma thereof. It is used.

本発明の耐食性部材によれば、アルミナ基材から膜側へのAl成分の拡散を極力抑えることが可能となり、基材の機械的特性低下を抑制することが可能となる。   According to the corrosion-resistant member of the present invention, it is possible to suppress the diffusion of the Al component from the alumina base material to the film side as much as possible, and to suppress the deterioration of the mechanical properties of the base material.

また、本発明の処理装置によれば、従来の部品を用いた場合と比較して、部品の寿命が長くなり、ひいては信頼性の高い処理装置を提供できる。   Moreover, according to the processing apparatus of this invention, compared with the case where the conventional components are used, the lifetime of components becomes long and can also provide a highly reliable processing apparatus.

以下、本発明を実施するための最良の形態(以下、本実施形態という)について説明する。   Hereinafter, the best mode for carrying out the present invention (hereinafter referred to as the present embodiment) will be described.

図1に示すように、本実施形態の耐食性部材1は、アルミナを主成分とする基材4(基材4中のアルミナが50質量%以上)にイットリウム酸化物を主成分とする耐食膜2(耐食膜2中のイットリウム酸化物が50質量%以上)を中間層3を介して設けたものである。ここで、中間層3は、基材4側にYAl12(以下、YAGという)を主成分とする第1中間層3a(中間層3a中のYAGが50質量%以上)と、耐食膜2側にYAl(以下、YAMという)を主成分とする第2中間層3b(中間層3b中のYAMが50質量%以上)とを有する。 As shown in FIG. 1, the corrosion-resistant member 1 of this embodiment includes a corrosion-resistant film 2 mainly composed of yttrium oxide on a substrate 4 mainly composed of alumina (alumina in the substrate 4 is 50% by mass or more). (Yttrium oxide in the corrosion-resistant film 2 is 50 mass% or more) is provided via the intermediate layer 3. Here, the intermediate layer 3 has a first intermediate layer 3a (YAG in the intermediate layer 3a is 50% by mass or more) mainly composed of Y 3 Al 5 O 12 (hereinafter referred to as YAG) on the base 4 side, A second intermediate layer 3b (YAM in the intermediate layer 3b is 50% by mass or more) mainly composed of Y 4 Al 2 O 9 (hereinafter referred to as YAM) is provided on the corrosion-resistant film 2 side.

このような構成とすれば、従来の耐食膜(基材4に溶射により耐食膜2を形成し、これを1300〜1800℃の高温で熱処理して耐食膜2と基材4間にイットリアとアルミナの反応生成物を形成した耐食膜)と比較して、基材4であるアルミナ中のAl成分が耐食膜2側へ拡散し、基材4の機械的特性が低下することを防止することが可能となる。   With such a structure, the conventional corrosion-resistant film (corrosion-resistant film 2 is formed on substrate 4 by thermal spraying, and this is heat-treated at a high temperature of 1300 to 1800 ° C. so that yttria and alumina are interposed between corrosion-resistant film 2 and substrate 4. It is possible to prevent the Al component in the alumina that is the base material 4 from diffusing to the corrosion resistant film 2 side and the mechanical properties of the base material 4 from being deteriorated as compared with the corrosion resistant film forming the reaction product of It becomes possible.

本実施形態において、基材4のAl成分が耐食膜2側へ拡散しないのは、基材4側に予め合成されたYAG層を中間層3として形成するためである。また、中間層3を形成した後、熱処理して基材4とYAGからなる第1中間層3aを接合させた場合にも、Al成分がYAGからなる第1中間層3aにほとんど拡散しない。また、基材4の機械的特性が低下することもない。また、本発明では耐食膜2側にも予め合成されたYAMからなる第2中間層3bを形成するため、第2中間層3bから耐食膜2へのAl成分の拡散もほとんどない。また、耐食膜2については、従来の溶射法ではなく、イットリア粒子を含むスラリーをコーティングした後、熱処理して緻密膜を形成する方法を採用しており、従来よりも緻密化された耐食膜となる。   In the present embodiment, the reason why the Al component of the base material 4 does not diffuse to the corrosion-resistant film 2 side is to form a YAG layer synthesized in advance on the base material 4 side as the intermediate layer 3. Also, when the intermediate layer 3 is formed and then heat treated to join the base material 4 and the first intermediate layer 3a made of YAG, the Al component hardly diffuses into the first intermediate layer 3a made of YAG. Further, the mechanical properties of the substrate 4 are not deteriorated. In the present invention, since the second intermediate layer 3b made of YAM synthesized in advance is also formed on the corrosion resistant film 2 side, there is almost no diffusion of the Al component from the second intermediate layer 3b to the corrosion resistant film 2. In addition, the corrosion resistant film 2 is not a conventional thermal spraying method, but a method in which a slurry containing yttria particles is coated and then heat treated to form a dense film. Become.

また、本実施形態の耐食性部材1は、耐食膜2および中間層3の平均ボイド率が1%以下であることを特徴としている。耐食膜2および中間層3の平均ボイド率が1%以下であれば、本実施形態の耐食性部材1を例えば半導体製造装置のチャンバー内の内壁部材として用いた場合に、装置内に供給されるハロゲン系腐食性ガスが膜表面のボイドを通過して部材内に入り込み耐食膜2や中間層3あるいは基材4が腐食されにくい。   Moreover, the corrosion-resistant member 1 of this embodiment is characterized in that the average void ratio of the corrosion-resistant film 2 and the intermediate layer 3 is 1% or less. If the average void ratio of the corrosion-resistant film 2 and the intermediate layer 3 is 1% or less, when the corrosion-resistant member 1 of this embodiment is used as, for example, an inner wall member in a chamber of a semiconductor manufacturing apparatus, halogen supplied into the apparatus The system corrosive gas passes through the voids on the film surface and enters the member, so that the corrosion resistant film 2, the intermediate layer 3, or the base material 4 is hardly corroded.

なお、平均ボイド率は例えば100μm×100μmの範囲が観察できるように、予め表面に精密な研削加工をした耐食膜2と各中間層3の表面を、任意の倍率に調節した金属顕微鏡またはSEM等により写真または画像として撮影し、この写真または画像を画像解析装置により解析することにより算出することが可能である。画像解析装置としては例えばニレコ社製のLUZEX−FS等を用いればよい。   In addition, the average void ratio is, for example, a metal microscope or SEM in which the surface of the corrosion-resistant film 2 and the intermediate layer 3 whose surfaces are precisely ground are adjusted to an arbitrary magnification so that a range of 100 μm × 100 μm can be observed. It is possible to calculate by taking a photograph or an image as described above and analyzing the photograph or image with an image analysis apparatus. As an image analysis apparatus, for example, LUZEX-FS manufactured by Nireco Corporation may be used.

さらに、本発明の耐食性部材1は、耐食膜2表面の算術平均高さ(Ra)が1μm以下であることを特徴としている。本発明の耐食性部材1の耐食膜2は緻密膜であり膜表面は従来の溶射法と比較して滑らかな表面となっている。算術平均高さ(Ra)が1μm以下であればハロゲン系腐食性ガスとの接触面積を少なくできるために、腐食の進行度合いが遅くなり耐食膜2の寿命を延ばすことが可能である。   Furthermore, the corrosion resistant member 1 of the present invention is characterized in that the arithmetic average height (Ra) of the surface of the corrosion resistant film 2 is 1 μm or less. The corrosion-resistant film 2 of the corrosion-resistant member 1 of the present invention is a dense film, and the film surface is a smooth surface as compared with the conventional thermal spraying method. If the arithmetic average height (Ra) is 1 μm or less, the contact area with the halogen-based corrosive gas can be reduced. Therefore, the progress of corrosion is slowed and the life of the corrosion-resistant film 2 can be extended.

なお、表面の算術平均高さ(Ra)はJIS B 0601−2001に準拠して、接触式または非接触式の表面粗さ計を用い、例えばカットオフ値(基準長さ)0.8mm、評価長さ4mmのJIS規格(JIS B 0601 3,JIS B 0633 4,JIS B 0031 付属書G,F)に則った条件設定で測定することが可能である。   The arithmetic average height (Ra) of the surface is based on JIS B 0601-2001, using a contact or non-contact surface roughness meter, for example, a cutoff value (reference length) of 0.8 mm, evaluation It is possible to measure under the condition setting according to the JIS standard (JIS B 0601 3, JIS B 0633 4, JIS B 0031 appendices G and F) having a length of 4 mm.

また、他の実施形態の耐食性部材1は、図2に示すように、第1中間層3aと第2中間層3bの間に、YAlOからなる第3中間層5を有することを特徴としている。第1中間層3aのYAGと第2中間層3bのYAMの接触面は、比較的低温で熱処理した場合にはYAG,YAM中に微量に含まれる低融点のガラス成分などにより互いに接合されているが、高温で熱処理すると、反応層であるYAlO(以下YAPと記載)からなる第3中間層5を形成することが可能であり、この中間層5の生成によって、第1中間層3aと第2中間層3bの接合強度を増加させることが可能となる。 Further, as shown in FIG. 2, the corrosion-resistant member 1 of another embodiment is characterized by having a third intermediate layer 5 made of YAlO 3 between the first intermediate layer 3a and the second intermediate layer 3b. . The contact surfaces of YAG of the first intermediate layer 3a and YAM of the second intermediate layer 3b are bonded to each other by a low melting point glass component contained in a trace amount in YAG and YAM when heat-treated at a relatively low temperature. However, when heat treatment is performed at a high temperature, it is possible to form the third intermediate layer 5 made of YAlO 3 (hereinafter referred to as YAP) which is a reaction layer. It becomes possible to increase the bonding strength of the two intermediate layers 3b.

なお、第3中間層5については、本実施形態の耐食性部材1の断面をX線回折装置により解析し、そのチャートからYAP層の存在を確認することができる。   In addition, about the 3rd intermediate | middle layer 5, the cross section of the corrosion-resistant member 1 of this embodiment can be analyzed with an X-ray-diffraction apparatus, and presence of a YAP layer can be confirmed from the chart.

次に本実施形態の耐食性部材1の製造方法について説明する。まず、基材4については、市販の純度が99質量%以上、平均粒径が0.5〜5μmのアルミナ1次原料を購入し、これにバインダー、溶媒を添加してスラリーとした後、スプレードライヤーにて噴霧造粒してアルミナ2次原料を作製する。造粒後、アルミナ2次原料を湿式静水圧プレス成形法(ラバープレス法)にて成形圧力50〜150MPaで成形し、これを切削加工により所定の寸法に加工し成形体とする。そして、切削加工後の成形体を、大気雰囲気の焼成炉にて最高温度1500〜1700℃の焼成温度で焼成することにより得られる。   Next, the manufacturing method of the corrosion-resistant member 1 of this embodiment is demonstrated. First, about the base material 4, after purchasing the alumina primary raw material whose commercially available purity is 99 mass% or more and whose average particle diameter is 0.5-5 micrometers and adding a binder and a solvent to this, it is made a slurry, and is sprayed. Spray granulation with a drier to produce an alumina secondary material. After granulation, the alumina secondary raw material is molded at a molding pressure of 50 to 150 MPa by a wet isostatic press molding method (rubber press method), and this is processed into a predetermined size by cutting to obtain a molded body. And it can obtain by baking the molded object after a cutting process by the baking temperature of 1500-1700 degreeC of maximum temperature in the baking furnace of an atmospheric atmosphere.

次に、本実施形態の耐食性部材1の耐食膜については、まずアルミナとイットリアの比率を調整して予め合成した純度99%以上のYAG原料、YAM原料と、市販の純度99.5質量%以上のイットリア1次原料を準備する。しかる後に、各原料毎にパインダーと水系または有機系溶媒を添加してスラリーとする。これを基材4の表面にディップコーティング法、バーコーティング法またはスプレーコーティング法等の塗布方法により塗布する。そして、50〜200℃で乾燥後、炉内が大気雰囲気の焼成炉を用いて熱処理することにより製造することができる。このとき、イットリア,YAG,YAMの各原料については、平均粒径1μm以下、より好ましくは0.8μm以下に微粉砕したものを準備する。さらに好ましくは0.5μm以下の平均粒径とするのが良く、このように微粉砕した原料を用いると、熱処理温度を従来の1300℃よりも低温化させることが可能となり、1100℃以上1300℃未満の温度で緻密化させることが可能となる。また、耐食膜2の原料としては、イットリアゾルを用いることもできる。   Next, for the corrosion resistant film of the corrosion resistant member 1 of the present embodiment, first, a YAG raw material having a purity of 99% or higher, a YAM raw material, and a commercially available purity of 99.5% by weight or higher, which were synthesized in advance by adjusting the ratio of alumina and yttria. The yttria primary raw material is prepared. Thereafter, a binder and an aqueous or organic solvent are added to each raw material to form a slurry. This is applied to the surface of the substrate 4 by a coating method such as dip coating, bar coating, or spray coating. And after drying at 50-200 degreeC, it can manufacture by heat-processing in the furnace using the baking furnace of an atmospheric condition. At this time, yttria, YAG, and YAM are prepared by pulverizing them to an average particle size of 1 μm or less, more preferably 0.8 μm or less. More preferably, the average particle size is 0.5 μm or less. When the finely pulverized raw material is used, the heat treatment temperature can be made lower than the conventional 1300 ° C., and 1100 ° C. or higher and 1300 ° C. It becomes possible to make it dense at a temperature below. Further, yttria sol can be used as a raw material for the corrosion-resistant film 2.

なお、粗粒および微粒の平均粒径は、分散媒に粗粒、微粒をそれぞれ投入し分散機にて分散媒中に分散させた後、レーザー回折散乱法を用いた測定装置(日機装(株)社製マイクロトラック)にて測定を行うことができる。   The average particle size of the coarse particles and fine particles is measured by using a laser diffraction scattering method (Nikkiso Co., Ltd.) after adding the coarse particles and fine particles to the dispersion medium and dispersing them in the dispersion medium using a disperser. Measurement can be performed with a Microtrac).

また、本実施形態の他の製造方法として、YAGおよびYAMの原料およびイットリア原料を重ね合わせると所望の膜厚となるように薄く成形し、これらを基材4の表面に載置して加圧後、熱処理することにより各層を基材4の表面に接合する方法がある。   Further, as another manufacturing method of the present embodiment, when YAG and YAM raw materials and yttria raw materials are overlapped, they are thinly formed so as to have a desired film thickness, and these are placed on the surface of the substrate 4 and pressed. Thereafter, there is a method of bonding each layer to the surface of the substrate 4 by heat treatment.

なお、本実施形態において耐食膜2に用いるイットリウム酸化物としてイットリアを例に挙げたが、これに限定されない。その他のイットリウム酸化物としてYFe12やYVO,YBaCu等でも適用可能である。 In the present embodiment, yttria is used as an example of the yttrium oxide used for the corrosion-resistant film 2, but the present invention is not limited to this. Other yttrium oxides such as Y 3 Fe 5 O 12 , YVO 4 , YBa 2 Cu 3 O 7 and the like can also be applied.

次に、耐食性部材1を実際に半導体製造装置に設置した場合の実施形態を示す。図3に本実施形態の耐食性部材1を適用した処理容器11を有する誘導結合型プラズマエッチング装置を示す。   Next, an embodiment when the corrosion-resistant member 1 is actually installed in a semiconductor manufacturing apparatus will be described. FIG. 3 shows an inductively coupled plasma etching apparatus having a processing container 11 to which the corrosion-resistant member 1 of this embodiment is applied.

処理容器11はドーム状をなし、その内壁表面に粗面部12を有している。この処理容器11の下に金属製の下部チャンバー13が処理容器11に密着するように設けられている。処理容器11の内面には、本実施形態の耐食膜が粗面部表面に形成されている。下部チャンバー13内の上部には支持テーブル14が基台20の上に配置されている。   The processing container 11 has a dome shape and has a rough surface portion 12 on the inner wall surface thereof. A metal lower chamber 13 is provided under the processing container 11 so as to be in close contact with the processing container 11. The corrosion resistant film of the present embodiment is formed on the surface of the rough surface portion on the inner surface of the processing container 11. A support table 14 is disposed on a base 20 in the upper part of the lower chamber 13.

この支持テーブル14の上に静電チャック15が設けられており、静電チャック15上に半導体ウェハ16が載置される。 静電チャック15の電極には直流電源が接続されており、これにより半導体ウェハ16を静電吸着する。また、支持テーブル14にはRF電源が接続されている。   An electrostatic chuck 15 is provided on the support table 14, and a semiconductor wafer 16 is placed on the electrostatic chuck 15. A direct current power source is connected to the electrode of the electrostatic chuck 15, thereby electrostatically adsorbing the semiconductor wafer 16. An RF power source is connected to the support table 14.

一方、下部チャンバー13の底部には真空ポンプ19が接続されている。下部チャンバー13内を真空排気可能となっている。また、下部チャンバー13の上部には半導体ウェハ16の上方にエッチングガス、例えばCFガスを供給するガス供給ノズル17が設けられている。処理容器11の周囲には誘導コイル18が設けられており、この誘導コイル18にはRF電源から例えば13.56MHzのマイクロ波が印加される。 On the other hand, a vacuum pump 19 is connected to the bottom of the lower chamber 13. The inside of the lower chamber 13 can be evacuated. A gas supply nozzle 17 for supplying an etching gas such as CF 4 gas is provided above the semiconductor wafer 16 above the lower chamber 13. An induction coil 18 is provided around the processing container 11. A microwave of 13.56 MHz, for example, is applied to the induction coil 18 from an RF power source.

このエッチング装置においては、真空ポンプ19によりチャンバー13内を所定の真空度まで排気する。静電チャック15により半導体ウェハ16を静電吸着した後、ガス供給ノズル17からエッチングガスとして例えばCFガスを供給しつつ、RF電源から誘導コイル19に給電する。これにより、半導体ウェハ16の上方部分にエッチングガスのプラズマが形成され、半導体ウェハ16が所定のパターンにエッチングされる。なお、高周波電源から支持テーブル14に給電することにより、エッチングの異方性を高めることができる。 In this etching apparatus, the inside of the chamber 13 is exhausted to a predetermined degree of vacuum by the vacuum pump 19. After the semiconductor wafer 16 is electrostatically attracted by the electrostatic chuck 15, power is supplied to the induction coil 19 from the RF power supply while supplying, for example, CF 4 gas as an etching gas from the gas supply nozzle 17. As a result, plasma of an etching gas is formed in the upper part of the semiconductor wafer 16, and the semiconductor wafer 16 is etched into a predetermined pattern. Note that the anisotropy of etching can be increased by supplying power to the support table 14 from a high-frequency power source.

このようなエッチング処理の際、処理容器11の内面はCFガスやそれらのプラズマによる腐食を受ける。従って、本実施形態の耐食性部材1を適用すれば耐食性に優れるために、従来のアルミナの処理容器を用いた場合と比較して、容器寿命が長くなり好適である。 During such an etching process, the inner surface of the processing vessel 11 is corroded by CF 4 gas or plasma thereof. Therefore, since the corrosion resistance member 1 of the present embodiment is excellent in corrosion resistance, the container life is longer than that in the case of using a conventional alumina processing container.

下部チャンバー13、静電チャック15、支持テーブル14、あるいは半導体ウェハ16を固定・保持するためのリング(不図示)等を構成する部材にも本発明の耐食性部材1を適用可能であり、優れた耐食性と機械的特性を示すために、装置寿命が長くなり、メンテナンスを頻繁に実施し、部材を交換する必要がなくなるため、半導体の製造コストを大幅に削減することが可能となる。   The corrosion-resistant member 1 of the present invention can be applied to members constituting the lower chamber 13, the electrostatic chuck 15, the support table 14, or a ring (not shown) for fixing and holding the semiconductor wafer 16, and the like. In order to show corrosion resistance and mechanical characteristics, the life of the apparatus is extended, maintenance is frequently performed, and it is not necessary to replace the member, so that the manufacturing cost of the semiconductor can be greatly reduced.

また、本実施形態の耐食性部材は図3に示す半導体製造装置の処理容器に限らず、エッチング装置やCVD成膜等、腐食性ガスを用いる処理用の部材としてあらゆる部分に適用することが可能である。   Further, the corrosion-resistant member of the present embodiment is not limited to the processing container of the semiconductor manufacturing apparatus shown in FIG. 3, but can be applied to any part as a processing member using a corrosive gas such as an etching apparatus or CVD film formation. is there.

本発明の耐食性部材1と、基材4に溶射法によりイットリア膜を形成し熱処理してイットリアとアルミナの反応生成物からなる中間層3を形成した従来の耐食性部材1を製造して耐食性を評価する試験を実施した。以下にその詳細について説明する。
<アルミナ基材の製造>
市販の純度が99質量%以上、平均粒径が1μmのアルミナ1次原料を購入し、これにバインダーおよび水系溶媒を添加してスラリーとした。その後、スプレードライヤーにて噴霧造粒してアルミナ2次原料を作製した。造粒後、アルミナ2次原料を湿式静水圧プレス成形法(ラバープレス法)にて成形圧力100MPaで成形した。そして、これを切削加工により縦375mm、横375mm、厚さ12.5mmの板形状の寸法に加工し成形体とした。切削加工後の成形体を、大気雰囲気の焼成炉にて最高温度1600℃の焼成温度で焼成し、焼成後に研削加工を施すことにより、縦300mm、横300mm、厚さ10mmの板状体を数個得た。
<耐食膜の製造>
まず本発明の耐食性部材1の耐食膜を製造した。所定量のイットリアとアルミナを混合して1000〜1500℃の温度範囲で加熱してYAl12組成の原料を得た後、これを微粉砕して平均粒径0.8μmのYAG原料を得た。同様の工程にてYAl組成の平均粒径0.8μmのYAM原料も得た。
Corrosion-resistant member 1 of the present invention and a conventional corrosion-resistant member 1 in which an yttria film is formed on a base material 4 by thermal spraying and heat-treated to form an intermediate layer 3 made of a reaction product of yttria and alumina are manufactured to evaluate corrosion resistance. A test was conducted. The details will be described below.
<Manufacture of alumina substrate>
A commercially available alumina primary material having a purity of 99% by mass or more and an average particle diameter of 1 μm was purchased, and a binder and an aqueous solvent were added thereto to form a slurry. Thereafter, spray granulation was performed with a spray dryer to prepare an alumina secondary material. After granulation, the alumina secondary material was molded at a molding pressure of 100 MPa by a wet isostatic press molding method (rubber press method). And this was processed into the plate-shaped dimension of length 375mm, width 375mm, and thickness 12.5mm by cutting, and it was set as the molded object. The molded body after cutting is fired at a firing temperature of 1600 ° C. at a maximum temperature in a firing furnace in an air atmosphere, and grinding is performed after firing to obtain several plate-like bodies having a length of 300 mm, a width of 300 mm, and a thickness of 10 mm. I got it.
<Manufacture of corrosion resistant film>
First, a corrosion resistant film of the corrosion resistant member 1 of the present invention was manufactured. A predetermined amount of yttria and alumina are mixed and heated in a temperature range of 1000 to 1500 ° C. to obtain a raw material having a Y 3 Al 5 O 12 composition, which is then finely pulverized to produce a YAG raw material having an average particle diameter of 0.8 μm Got. A YAM raw material having a Y 4 Al 2 O 9 composition and an average particle size of 0.8 μm was also obtained in the same process.

さらに、市販の純度99.5質量%、平均粒径0.5μmのイットリア1次原料を準備した。   Furthermore, a commercially available yttria primary material having a purity of 99.5% by mass and an average particle size of 0.5 μm was prepared.

次に、YAG,YAMおよびイットリアの1次原料と、バインダーおよび有機系溶媒を所定量混合してそれぞれスラリーとした。そして、まずYAG1次原料からなるスラリーを前記アルミナ基材表面へ15μmの厚みでスプレーコーティングし、10分間120℃の熱風をあてて乾燥させYAGからなる第1中間層3aを形成した。さらに、第1中間層3aの表面にYAM1次原料からなるスラリーを15μmの厚さでスプレーコーティングした。前記と同様に、10分間120℃の熱風をあてて乾燥し第2中間層3bを形成した。次に、イットリア1次原料からなるスラリーを同様の工程を経て第2層表面に20μmの厚さで形成した試験片を得た。しかる後、前記試験片を大気雰囲気炉にて最高温度1200℃で熱処理することにより、膜厚40μmの本発明の耐食性部材1の試料を得た。   Next, predetermined amounts of YAG, YAM and yttria primary materials, a binder and an organic solvent were mixed to form slurries. First, a slurry of YAG primary material was spray coated on the surface of the alumina substrate with a thickness of 15 μm, and dried by applying hot air at 120 ° C. for 10 minutes to form a first intermediate layer 3a made of YAG. Furthermore, the slurry which consists of a YAM primary raw material was spray-coated by the thickness of 15 micrometers on the surface of the 1st intermediate | middle layer 3a. Similarly to the above, the second intermediate layer 3b was formed by applying hot air at 120 ° C. for 10 minutes and drying. Next, the test piece which formed the slurry which consists of a yttria primary raw material with the thickness of 20 micrometers on the 2nd layer surface through the same process was obtained. Thereafter, the specimen was heat-treated at a maximum temperature of 1200 ° C. in an atmospheric furnace to obtain a sample of the corrosion-resistant member 1 of the present invention having a thickness of 40 μm.

一方、比較例である従来の耐食性部材については、一定量の酸素、アセチレン及びイットリアからなる溶射粉末を燃焼室に導入し、スパークプラグで点火、爆発させ、この爆発によるエネルギによって溶射材からつくられるイットリア溶射粉末をアルミナ基材の上に衝突させ、溶射皮膜を形成させる爆発溶射法により膜厚40μmの溶射膜を形成した。これを1600℃の温度で熱処理してイットリア溶射膜とアルミナ基材間にイットリアとアルミナの反応生成物からなる中間層を有する耐食性部材の試料を製造した。なお、前記溶射膜形成時の溶射条件としては、O流量を75リットル/min、C流量を30リットル/min、爆発サイクル5回/秒、溶射するY粉末の平均粒径10μm、溶融率を70%以上とした。
<耐食膜の評価>
本実施例と従来の耐食性部材について、まず耐食膜を含んだ形でJIS R1601に準拠した3点曲げ強度試験用の抗折試験片20本をそれぞれの試料から切り出し、そのうち15本を用いて3点曲げ強度試験を実施し、耐食膜を含んだ形でのアルミナ基材の強度について評価した。
On the other hand, a conventional corrosion-resistant member, which is a comparative example, is made from a sprayed material by introducing a certain amount of sprayed powder composed of oxygen, acetylene and yttria into the combustion chamber, igniting and exploding with a spark plug, and the energy generated by the explosion. A yttria sprayed powder was collided on an alumina substrate to form a sprayed film having a thickness of 40 μm by an explosion spraying method in which a sprayed coating was formed. This was heat-treated at a temperature of 1600 ° C. to produce a sample of a corrosion-resistant member having an intermediate layer made of a reaction product of yttria and alumina between the yttria sprayed film and the alumina substrate. The spraying conditions for forming the sprayed film include an O 2 flow rate of 75 liters / min, a C 2 H 2 flow rate of 30 liters / min, an explosion cycle of 5 times / second, and an average particle size of Y 2 O 3 powder to be sprayed. The diameter was 10 μm and the melting rate was 70% or more.
<Evaluation of corrosion resistant film>
For this example and the conventional corrosion resistant member, first, 20 bending test pieces for a three-point bending strength test according to JIS R1601 were cut out from each sample in a form including a corrosion resistant film, and 15 of them were used for 3 A point bending strength test was conducted to evaluate the strength of the alumina base material including the corrosion resistant film.

なお、前記強度試験については、まず、基材4のみの強度を測定するために、基材4からJIS R1601に準拠した抗折試験片サイズの試料を加工により切り出した。そして、この表面を40μmだけ研削加工により削った試験片を準備して3点曲げ強度試験を行い、耐食膜を形成した試料と強度を比較した。   In addition, about the said strength test, in order to measure the intensity | strength of only the base material 4, the sample of the bending test piece size based on JISR1601 was cut out from the base material 4 by processing. Then, a test piece obtained by grinding the surface by 40 μm was prepared, a three-point bending strength test was performed, and the strength was compared with a sample on which a corrosion-resistant film was formed.

また、抗折試験片を用いて膜の相対密度は次のようにして求めた。まず、X線反射率法により膜密度を測定した。これをY焼結体の理論密度(5.03g/cm)で除算し、これを100倍することによって求めた。 Moreover, the relative density of the film | membrane was calculated | required as follows using a bending test piece. First, the film density was measured by the X-ray reflectivity method. This was obtained by dividing this by the theoretical density (5.03 g / cm 3 ) of the Y 2 O 3 sintered body and multiplying this by 100.

さらに、試料表面の一部にマスキングを施し、RIE(Reactive Ion Etchinng)装置にセットしてClガス雰囲気下でプラズマ中に3時間曝露した。その前後の表面のマスキング部との寸法差から1分間当たりのエッチングレートを算出して、基準試料として用意した密度4.90以上のイットリア焼結体(アルミナ含有量99.5質量%)のエッチングレートを1としたときの相対比較値をエッチングレート比として求めた。 Further, a part of the sample surface was masked, set in a RIE (Reactive Ion Etching) apparatus, and exposed to plasma in a Cl 2 gas atmosphere for 3 hours. Etching of yttria sintered body (alumina content 99.5 mass%) with a density of 4.90 or more prepared as a reference sample by calculating the etching rate per minute from the dimensional difference between the front and back masking portions. The relative comparison value when the rate was 1 was determined as the etching rate ratio.

耐食膜2と中間層3の平均ボイド率については、抗折試験片に、耐食膜2と中間層3を観察可能なように精密加工を施して、それぞれ100μm×100μmの範囲をSEMにより画像として撮影し、この画像を画像解析装置(ニレコ社製LUZEX−FS)により解析して算出した。   About the average void ratio of the corrosion-resistant film 2 and the intermediate layer 3, the bending test specimen is subjected to precision processing so that the corrosion-resistant film 2 and the intermediate layer 3 can be observed, and each 100 μm × 100 μm range is imaged by SEM. The image was taken and this image was analyzed and calculated by an image analyzer (LUZEX-FS manufactured by Nireco).

また、抗折試験片を用いてその算術平均高さ(Ra)をJIS B 0601−2001に準拠して、非接触式の表面粗さ計により測定した。
<評価結果と考察>
従来の耐食性部材は、まず3点曲げ強度については、基材4のみの強度から20%以上低下する結果となった。また、膜の相対密度については60%であり、エッチングレート比は2以上であった。さらに、ボイド率はイットリア溶射膜が15%、中間層が10%と気孔が非常に多く、算術平均高さは4μmと非常に粗い表面性状であった。この結果から、イットリア溶射膜形成後の熱処理段階で基材のAl成分がイットリア溶射膜へ拡散したために強度低下が生じたものと考えられる。
Moreover, the arithmetic mean height (Ra) was measured with the non-contact-type surface roughness meter based on JISB0601-2001 using the bending test piece.
<Evaluation results and discussion>
The conventional corrosion-resistant member has a result that the three-point bending strength is lowered by 20% or more from the strength of the base material 4 alone. The relative density of the film was 60%, and the etching rate ratio was 2 or more. Further, the void ratio was 15% for the yttria sprayed film and 10% for the intermediate layer, and there were very many pores, and the arithmetic average height was 4 μm, which was a very rough surface property. From this result, it is considered that the strength reduction occurred because the Al component of the base material diffused into the yttria sprayed film in the heat treatment stage after the formation of the yttria sprayed film.

また、イットリア溶射膜については、熱処理後も相対密度が60%と低く、このためエッチングレート比が2と大きく、緻密なイットリア焼結体と比較して耐食性が悪い結果となった。また、エッチングレート比には、耐食膜、中間層の平均ボイド率の高さ、表面粗さが粗いことも影響していることが考えられる。   Further, the yttria sprayed film had a relative density as low as 60% even after the heat treatment, and thus the etching rate ratio was as large as 2, resulting in poor corrosion resistance as compared with a dense yttria sintered body. In addition, it is considered that the etching rate ratio is influenced by the fact that the corrosion resistance film, the average void ratio of the intermediate layer, and the surface roughness are rough.

これと比較して本実施例の耐食性部材1は、3点曲げ強度が基材4のみの強度と同等であった。膜の相対密度も90%以上と高く、エッチングレート比もイットリア焼結体には劣るものの1.5以下と低く抑えられていた。また、平均ボイド率も耐食膜、第1中間層3a、第2中間層3bがそれぞれ0.8%,0.7%,0.5%と低く、耐食膜2表面の算術平均高さも0.9μmと滑らかな表面であった。   In comparison with this, the corrosion-resistant member 1 of this example had a three-point bending strength equivalent to that of the base material 4 alone. The relative density of the film was as high as 90% or more, and the etching rate ratio was inferior to that of the yttria sintered body, but was kept as low as 1.5 or less. Further, the average void ratio is as low as 0.8%, 0.7%, and 0.5% for the corrosion-resistant film, the first intermediate layer 3a, and the second intermediate layer 3b, respectively, and the arithmetic average height on the surface of the corrosion-resistant film 2 is also 0. It was a smooth surface of 9 μm.

本発明の耐食性部材の一実施形態を模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically one Embodiment of the corrosion-resistant member of this invention. 本発明の耐食性部材の他の実施形態を模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically other embodiment of the corrosion-resistant member of this invention. 本発明の処理装置の一実施形態を模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically one Embodiment of the processing apparatus of this invention.

符号の説明Explanation of symbols

1:耐食性部材
2:イットリア膜
3:中間層
3a:第1中間層
3b:第2中間層
4:基材
5:第3中間層
10:処理装置
11:処理容器
12:粗面部
13:チャンバー
14:支持テーブル
15:静電チャック
16:半導体ウエハ
17:ガス供給ノズル
18:誘導コイル
19:真空ポンプ
1: Corrosion resistant member 2: Yttria film 3: Intermediate layer 3a: First intermediate layer 3b: Second intermediate layer 4: Base material 5: Third intermediate layer 10: Processing apparatus 11: Processing vessel 12: Rough surface portion 13: Chamber 14 : Support table 15: electrostatic chuck 16: semiconductor wafer 17: gas supply nozzle 18: induction coil 19: vacuum pump

Claims (5)

アルミナを主成分とする基材に、イットリウム酸化物を主成分とする耐食膜を中間層を介して設けた耐食性部材であって、前記中間層は、前記基材側にYAl12を主成分とする第1中間層と、前記耐食膜側にYAlを主成分とする第2中間層とを有することを特徴とする耐食性部材。 A corrosion-resistant member in which a corrosion-resistant film mainly composed of yttrium oxide is provided on a substrate mainly composed of alumina via an intermediate layer, and the intermediate layer is formed on the substrate side with Y 3 Al 5 O 12. And a second intermediate layer containing Y 4 Al 2 O 9 as a main component on the corrosion-resistant film side. 前記耐食膜、前記第1中間層および前記第2中間層のそれぞれの平均ボイド率が1%以下であることを特徴とする請求項1に記載の耐食性部材。 2. The corrosion-resistant member according to claim 1, wherein an average void ratio of each of the corrosion-resistant film, the first intermediate layer, and the second intermediate layer is 1% or less. 前記耐食性膜の表面の算術平均高さ(Ra)が1μm以下であることを特徴とする請求項1または2に記載の耐食性部材。 The corrosion-resistant member according to claim 1 or 2, wherein the arithmetic average height (Ra) of the surface of the corrosion-resistant film is 1 µm or less. 前記第1中間層と前記第2中間層の間に、YAlOを主成分とする第3中間層を有することを特徴とする請求項1乃至3のいずれかに記載の耐食性部材。 4. The corrosion-resistant member according to claim 1, further comprising a third intermediate layer containing YAlO 3 as a main component between the first intermediate layer and the second intermediate layer. 5. 内側がガスまたはそのプラズマの環境下に曝される容器を備えた処理装置であって、請求項1乃至4のいずれかに記載の耐食性部材を、前記容器内の部品の少なくともガスまたはそのプラズマに曝される面に用いたことを特徴とする処理装置。 A processing apparatus comprising a container whose inside is exposed to an environment of gas or plasma thereof, wherein the corrosion-resistant member according to any one of claims 1 to 4 is applied to at least a gas or plasma of components in the container. A processing apparatus characterized by being used on a surface to be exposed.
JP2008168145A 2008-06-27 2008-06-27 Corrosion resistant member and treatment device using the same Pending JP2010006641A (en)

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