JP2009023061A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009023061A5 JP2009023061A5 JP2007190266A JP2007190266A JP2009023061A5 JP 2009023061 A5 JP2009023061 A5 JP 2009023061A5 JP 2007190266 A JP2007190266 A JP 2007190266A JP 2007190266 A JP2007190266 A JP 2007190266A JP 2009023061 A5 JP2009023061 A5 JP 2009023061A5
- Authority
- JP
- Japan
- Prior art keywords
- metal ion
- waste liquid
- slurry
- component
- dilution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002002 slurry Substances 0.000 claims description 153
- 239000007788 liquid Substances 0.000 claims description 148
- 229910021645 metal ion Inorganic materials 0.000 claims description 130
- 239000002699 waste material Substances 0.000 claims description 130
- 238000000034 method Methods 0.000 claims description 100
- 238000010790 dilution Methods 0.000 claims description 73
- 239000012895 dilution Substances 0.000 claims description 73
- 239000002245 particle Substances 0.000 claims description 65
- 230000005484 gravity Effects 0.000 claims description 36
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 34
- 239000012498 ultrapure water Substances 0.000 claims description 34
- 238000005498 polishing Methods 0.000 claims description 32
- 239000000126 substance Substances 0.000 claims description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000000243 solution Substances 0.000 claims description 20
- 238000007865 diluting Methods 0.000 claims description 19
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims description 15
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 5
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 5
- 239000010808 liquid waste Substances 0.000 claims description 3
- 230000036961 partial effect Effects 0.000 claims description 2
- 239000013500 performance material Substances 0.000 claims 1
- 230000002829 reductive effect Effects 0.000 description 24
- 239000012466 permeate Substances 0.000 description 11
- 229910052721 tungsten Inorganic materials 0.000 description 11
- 239000010937 tungsten Substances 0.000 description 11
- 238000003860 storage Methods 0.000 description 10
- 239000002198 insoluble material Substances 0.000 description 8
- 238000011084 recovery Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 238000004064 recycling Methods 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- -1 tungsten ion Chemical class 0.000 description 5
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 239000003456 ion exchange resin Substances 0.000 description 4
- 229920003303 ion-exchange polymer Polymers 0.000 description 4
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 3
- 239000013522 chelant Substances 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000003113 dilution method Methods 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008929 regeneration Effects 0.000 description 3
- 238000011069 regeneration method Methods 0.000 description 3
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910001447 ferric ion Inorganic materials 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 238000003911 water pollution Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- 229910000360 iron(III) sulfate Inorganic materials 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007190266A JP4353991B2 (ja) | 2007-07-22 | 2007-07-22 | スラリー廃液の再生方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007190266A JP4353991B2 (ja) | 2007-07-22 | 2007-07-22 | スラリー廃液の再生方法及び装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009023061A JP2009023061A (ja) | 2009-02-05 |
| JP2009023061A5 true JP2009023061A5 (fr) | 2009-05-07 |
| JP4353991B2 JP4353991B2 (ja) | 2009-10-28 |
Family
ID=40395382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007190266A Expired - Fee Related JP4353991B2 (ja) | 2007-07-22 | 2007-07-22 | スラリー廃液の再生方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4353991B2 (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5358266B2 (ja) * | 2009-04-24 | 2013-12-04 | 野村マイクロ・サイエンス株式会社 | 排スラリー中の有用固形成分の回収方法 |
| JP5604062B2 (ja) * | 2009-07-01 | 2014-10-08 | 野村マイクロ・サイエンス株式会社 | 排スラリー中の有用固形成分の回収方法 |
| US20120042575A1 (en) * | 2010-08-18 | 2012-02-23 | Cabot Microelectronics Corporation | Cmp slurry recycling system and methods |
| CN104526539B (zh) * | 2014-12-16 | 2017-07-28 | 河北工业大学 | 陀螺光学元件石英衬底材料cmp抛光表面粗糙度的控制方法 |
| JP7244896B2 (ja) * | 2018-11-19 | 2023-03-23 | 株式会社Ｍｆｃテクノロジー | Ｃｍｐスラリー再生方法 |
| JP7208779B2 (ja) * | 2018-12-11 | 2023-01-19 | キオクシア株式会社 | 基板処理装置 |
| JP7481761B2 (ja) | 2022-10-04 | 2024-05-13 | 株式会社Ｍｆｃテクノロジー | Ｃｍｐ用セリアスラリー再生方法 |
-
2007
- 2007-07-22 JP JP2007190266A patent/JP4353991B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4353991B2 (ja) | スラリー廃液の再生方法及び装置 | |
| JP2009023061A5 (fr) | ||
| KR101487586B1 (ko) | 반도체처리공정에서 발생한 슬러리 함유 폐수를 재생하는 방법 및 장치 | |
| US6482325B1 (en) | Apparatus and process for separation and recovery of liquid and slurry abrasives used for polishing | |
| US6346195B1 (en) | Ion exchange removal of metal ions from wastewater | |
| JP2010167551A (ja) | 使用済みスラリーの再生方法 | |
| TWI417430B (zh) | 基板研磨液之使用點處理方法與系統 | |
| JP2017143190A (ja) | 基板処理装置用排水システム、排水方法及び排水制御装置並びに記録媒体 | |
| JP4580433B2 (ja) | 研磨用スラリーの再生方法 | |
| JP5163078B2 (ja) | 研磨装置とその方法 | |
| TW548245B (en) | A process for treating aqueous waste containing copper and copper CMP particles | |
| WO2001070462A1 (fr) | Procede de polissage mecanico-chimique d'un substrat | |
| JP2002534252A (ja) | スラッジを発生させないｃｍｐ銅廃棄物の処理 | |
| JP5248209B2 (ja) | 薬液回収装置及び薬液回収方法 | |
| JP2007319974A (ja) | 半導体研磨用スラリーの回収方法及び回収システム並びに再生方法及び再生システム | |
| CN100467227C (zh) | 化学机械抛光废液分流收集装置及其收集方法 | |
| JP7244896B2 (ja) | Ｃｍｐスラリー再生方法 | |
| JP7469790B2 (ja) | 金属膜用スラリーの製造方法および製造装置 | |
| JP2003200347A (ja) | スラリ再生方法およびそれを用いたスラリ再生装置 | |
| CN101301539A (zh) | 六阀吸附滤池工艺及设备 | |
| JP2002083789A (ja) | 研磨材の回収装置 | |
| KR100552432B1 (ko) | 콜로이드 실리카 슬러리를 재생할 수 있는 웨이퍼 경면가공 장치 및 이러한 슬러리의 재생 방법 | |
| US20230174394A1 (en) | Treatment of slurry copper wastewater with ultrafiltration and ion exchange | |
| KR20020003939A (ko) | 씨엠피 장치의 슬러리 재생 시스템 | |
| JP2007098534A (ja) | スラリ再生方法 |