JP2008135660A - Display device manufacturing method and connection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a display unit and a connection device for reducing the number of manufacturing steps and work-in-hand stock among the steps. <P>SOLUTION: The method includes a connection step of causing a tape carrier package to be stuck by pressure onto a panel board and a printed circuit board. In the connection step, each tape carrier package is arranged on the face of the board in a way that each opposite one side of the panel board and the printed circuit board, which are arranged in a row on a plane face, is covered, and thereby in the manufacturing method of the display unit, the crimping between the panel board and the tape carrier package and the crimping between the tape carrier package and the printed circuit board are performed together as a whole. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a display device manufacturing method and a connection device. More specifically, the present invention relates to a method for manufacturing a display device including a connection process between a display panel, a tape carrier package, and a printed circuit board, and the connection device.

A display device such as a liquid crystal display device incorporates various electronic members in order to perform display drive control, and these constitute a single module. Examples of such an electronic member include a tape carrier package (TCP), a printed circuit board (PCB), and the like, and these are usually provided around a substrate serving as a panel. As a typical configuration of a module including such an electronic member, the following forms are known.

FIG. 4 is a schematic plan view of a liquid crystal display module in a COF (Chip On Film) system. As shown in FIG. 4, five source TCPs 102 are connected to one side of the glass substrate 101 serving as a panel, and one source PCB 103 is further connected to the five source TCPs 102. In addition, two gate TCPs 104 are connected to the other side of the glass substrate 101, and one gate PCB 105 is further connected to the two source TCPs 102. An anisotropic conductive film (ACF) is attached between the members, and the glass substrate 101, the source TCP 102, the source PCB 103, the gate TCP 104, and the gate PCB 105 are attached along the anisotropic conductive film (ACF). Each is connected physically and electrically (for example, refer to Patent Document 1). Here, a general process for mounting such an electronic component on a panel substrate will be described below.

First, an ACF is attached on the substrate surface to each side of the source side and the gate side of the glass substrate 101 to be a panel. Subsequently, the plurality of TCPs 102 and 104 are arranged so as to overlap with the ACF on the glass substrate 101, and then the process proceeds to the provisional pressure bonding step and further to the main pressure bonding step. Then, when the main press bonding is completed, temporary wiring is once performed on the manufactured module, an inspection signal is input to perform display inspection, and electrical connection between the glass substrate 101 and the TCPs 102 and 104 is confirmed. Through these steps, first, the TCPs 102 and 104 are connected to the glass substrate 101. Then, it progresses to the connection process with PCB. In the connection process with the PCB, the PCB and the TCP are usually connected via the ACF as in the connection process with the TCP. In the case of a PCB, a single PCB 103, 105 is connected to a plurality of TCPs 102, 104, the terminal pitch and terminal width are relatively wide, and so high accuracy is not required for alignment. There is a method in which a plurality of TCPs 102 and 104 are collectively bonded without performing pressure bonding. Similarly, after the main press bonding of the PCBs 103 and 105 is completed, an inspection signal is input to the manufactured module to perform display inspection, and electrical connection with the PCBs 103 and 105 is confirmed. In this way, the COF module is completed.

In addition, as a method of performing such connection with high accuracy, a method is disclosed in which first the glass substrate and each member are relatively aligned by the image recognition means, and then the connection process of each member is performed ( For example, see Patent Document 2.) In addition, as a method of attaching ACF to a glass substrate, TCP and PCB, it is common to first apply to an object member and then peel off the separator, but cut and apply the ACF together with the separator. A method of attaching the separator and peeling the separator in a later process has also been proposed, and an optimum method is adopted depending on the equipment configuration and specifications (for example, see Patent Document 3).

As described above, various methods for connecting the glass substrate, the TCP and the PCB have been proposed, but a large number of in-process inventory occurs between the processes, and the equipment installation space including the storage location is wide. Since there is a current situation that productivity has been reduced, there has been a demand for a method for assembling modules more efficiently.
JP-A-8-304845 Japanese Patent Laid-Open No. 11-186701 JP-A-6-215848

The present invention has been made in view of the above-described present situation, and an object of the present invention is to provide a display device manufacturing method and a connection device in which the in-process inventory between processes decreases as the number of processes decreases.

The inventor has studied various module manufacturing processes for mounting TCP and PCB on a panel substrate, and has focused on the arrangement of the panel substrate, TCP, and PCB in the manufacturing process. Then, TCP is arranged on the substrate surface so as to overlap each side of the panel substrate and the PCB that are arranged side by side on the plane, and the TCP crimping step and the PCB crimping step are collectively performed. It has been found that the TCP connection / inspection process and the PCB connection / inspection process can be combined. In addition, as a result of further intensive studies, the inventor has found an apparatus that can achieve such a process, and has conceived that the above problems can be solved brilliantly, and has reached the present invention. is there.

That is, this invention is a manufacturing method of the display apparatus including the connection process of crimping | bonding a tape carrier package with respect to a panel board | substrate and a printed circuit board, Comprising: The said connection process is a panel board | substrate arrange | positioned along with the plane, Place the tape carrier package on the board surface so as to cover each opposite side of the printed circuit board, and press and bond the panel board and the tape carrier package and the tape carrier package and the printed circuit board at once. This is a method for manufacturing a display device.

The present invention is also a connection device for crimping a tape carrier package to a panel substrate and a printed circuit board, wherein the connection device faces each of the panel substrate and the printed circuit board arranged side by side on a plane. Device having a crimping portion that arranges a tape carrier package on a substrate surface so as to cover one side of the substrate, and performs pressure bonding between the panel substrate and the tape carrier package and pressure bonding between the tape carrier package and the printed circuit board in a lump. But there is.

The contents of the present invention will be described below. First, the manufacturing method of the display device of the present invention will be described in detail.

The manufacturing method of the display device of the present invention includes a connection step of pressure-bonding the tape carrier package to the panel substrate and the printed circuit board. Examples of the display device manufactured by the display device manufacturing method of the present invention include a liquid crystal display device and an organic electroluminescence display device. The panel substrate plays a role as a display panel of the display device, and has scanning lines, signal lines, switching elements and the like for driving control of the device on the substrate. Examples of the material for the panel substrate include glass and plastic. The printed circuit board (PCB) is a board having electrodes connected to the input terminals of the tape carrier package, and serves to supply a scanning signal and the like. The tape carrier package (TCP) is obtained by mounting an integrated circuit (IC) on a printed board on which a wiring pattern is formed, and plays a role as a driver IC.

The connection step includes arranging the tape carrier package on the substrate surface so as to cover each opposing side of the panel substrate and the printed circuit board arranged side by side on a plane, and crimping the panel substrate and the tape carrier package; In addition, the tape carrier package and the printed circuit board are collectively bonded. Conventionally, a module is manufactured by a flow of a TCP connection process, a display inspection (after TCP connection), a PCB connection process, and a display inspection (after PCB connection), but the panel substrate and the printed circuit board are arranged on a plane. With this arrangement, the step of crimping TCP onto the panel substrate and the step of crimping PCB to TCP can be performed at a time, and the manufacturing process is reduced to about half. Further, according to this method, the connection inspection process between the panel substrate and the TCP and the connection inspection process between the TCP and the PCB can be combined. Furthermore, since the process of transferring each of the panel substrate, TCP, and PCB to each crimping work place is reduced by about half, the possibility of foreign matters entering each member can be reduced. Occurrence of connection failure due to mixing can be suppressed. Crimping can be performed by heating and / or pressurizing for a certain time, and a method of pressing once may be used, or a temporary pressing and then a final pressing are used. Also good. In this case, the temporary pressure bonding is usually performed at a lower temperature, a lower pressure and a shorter time than the main pressure bonding. In addition, when the crimping is performed in two stages of temporary crimping and main crimping, the crimping process is a process of crimping TCP to the panel substrate and the PCB in a lump by only one of the temporary crimping process and the final crimping process. It is good also as a process of carrying out pressure bonding collectively in any process. Here, “collectively” includes both cases of simultaneous operation and a case of performing a series of operations in the same process. For example, when performing main pressure bonding, TCP is attached in the same work space. The case where it carries out in succession one by one on the panel substrate side and the PCB side is included. In the following description of the present specification, the one-time pressure bonding is referred to as “main pressure bonding”.

Next, a preferred embodiment in the method for manufacturing a display device of the present invention will be described in detail.

The above connecting step performs temporary pressure bonding and main pressure bonding. In both the temporary pressure bonding and the main pressure bonding, pressure bonding between the panel substrate and the tape carrier package and pressure bonding between the tape carrier package and the printed circuit board are performed. It is preferable to carry out all at once. That is, when the above-mentioned crimping is a two-stage process including a temporary crimping process and a final crimping process, it is preferable to collectively crimp the tape carrier package to the panel substrate and the printed circuit board in any process. Thus, the connection process is further reduced, and the occurrence of poor connection of products is suppressed.

It is preferable that the connection step includes a step of collectively bonding an anisotropic conductive film on the panel substrate and the printed circuit board. An anisotropic conductive film (ACF) is obtained by mixing conductive particles in a thermosetting or thermoplastic resin film, and has conductivity and can also serve as an adhesive. In addition, when TCP is connected to a plurality of sides of the panel substrate, it is preferable to attach an ACF to a plurality of sides on the panel substrate surface. By arranging the panel substrate and the printed circuit board side by side on a plane, the ACF can be pasted together on both substrates. According to this method, the ACF attaching process can be reduced to half of the conventional process, and the process of transferring the panel substrate, TCP and PCB to the attaching work place can be reduced by half. As in the case of the above-described crimping, it is possible to suppress the occurrence of connection failure due to foreign matter mixing.

The connecting step is preferably performed in a state in which the panel substrate and the printed circuit board are sucked and held at regular intervals. By adsorbing and holding the panel substrate and the printed circuit board at regular intervals and proceeding to each step, it becomes possible to connect each component with high accuracy.

In the manufacturing method of the display device, it is preferable that the connection step is performed after the panel substrate and the printed circuit board are positioned by the image recognition device. By using the image recognition device, the arrangement of the panel substrate and the printed circuit board can be adjusted with high accuracy, and the quality of the manufactured module is also good. As the image recognition means, a method of providing an alignment mark on each substrate and recognizing it is preferable. As such a recognition means, for example, alignment marks are provided on the plane where the panel substrate and the printed circuit board are arranged, and on the portion where the panel substrate and the printed circuit board are aligned, and the alignment is performed. For example, a method of adjusting each position when there is a deviation in the mark can be used. As such an image recognition device, for example, a positioning table that can be finely adjusted in X (horizontal direction), Y (orthogonal direction), and θ (rotation direction), and a CCD camera that recognizes the amount of deviation of the substrate. And a coordinate position detection / control circuit and the like.

Next, the connection device of the present invention will be described in detail. The connection device of the present invention is a device that can achieve the display device manufacturing method described above.

The connection device of the present invention is a connection device that presses the tape carrier package against the panel substrate and the printed circuit board, and the connection device is opposed to the panel substrate and the printed circuit board arranged side by side on a plane. A tape carrier package is disposed on the substrate surface so as to cover each side, and has a crimping portion that collectively crimps the panel substrate and the tape carrier package and crimps the tape carrier package and the printed circuit board together. As a structure of a crimping | compression-bonding part, what has a TCP conveyance mechanism, a heating mechanism, and / or a pressurization mechanism is mentioned, for example. According to the connection device of the present invention, it is possible to reduce the module manufacturing process and suppress the occurrence of defective connection of the manufactured module. In addition, since the manufacturing process can be reduced, the connection device can be reduced in size, and the installation space for the equipment can be reduced.

Next, a preferred embodiment of the connection device of the present invention will be described in detail below.

The crimping part collectively press-bonds the tape carrier package to the panel substrate and the printed circuit board at once, and collectively press-bonds the panel carrier and the printed circuit board to which the tape carrier package is temporarily bonded. It is preferable to be configured with a main crimping part. By making the crimping step into two stages, a temporary crimping step and a main crimping step, a better crimping effect can be obtained. In addition, since the conditions for performing temporary pressure bonding and the conditions for performing main pressure bonding are usually different, it is preferable to provide separate pressure bonding portions.

It is preferable that the connection device has an anisotropic conductive film attaching portion that collectively attaches the anisotropic conductive film onto the panel substrate and the printed circuit board. Since the conditions for attaching the ACF are different from the conditions such as provisional pressure bonding and main pressure bonding, it is preferable to provide different bonding portions.

The connection device preferably includes a mounting table that holds the panel substrate and the printed circuit board by suction at regular intervals. By adsorbing and holding the panel substrate and the printed circuit board at regular intervals and proceeding to each step, it becomes possible to connect each component with high accuracy.

The connection device preferably includes an image recognition device that adjusts a distance between the panel substrate and the printed circuit board. By using the image recognition device, the arrangement of the panel substrate and the printed circuit board can be adjusted with high accuracy, and the quality of the manufactured module is also good. In addition, it is preferable to provide a mechanism for recognizing alignment marks provided on each substrate in the apparatus, and for example, the above-described image recognition unit and image recognition apparatus can be preferably used. Further, it is more preferable that the connection device has a structure in which the adjustment of the distance between the panel substrate and the printed circuit board is performed before the above-described suction holding of both the substrates.

The crimping part preferably has a mechanism for sucking and holding the tape carrier package and a mechanism for raising and lowering the tape carrier package. Since the connection device of the present invention connects the TCP to the panel substrate and the printed circuit board arranged side by side on the plane, the TCP arrangement is provided by having a mechanism for raising and lowering the TCP while sucking and holding it. Can be easily performed.

According to the display device manufacturing method and the connection device of the present invention, the connection process between the panel substrate and the TCP and the connection process between the TCP and the PCB, which have been conventionally performed separately, can be performed collectively. As the number of processes decreases, the in-process inventory between processes decreases, and a significant cost reduction can be realized. In addition, since the transfer process of the panel substrate, TCP, and PCB is reduced, the possibility that foreign matters are mixed into each member can be reduced, and the occurrence of poor connection due to foreign matters is also suppressed.

Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited only to these examples.

(Example 1)
FIG. 1 is a schematic plan view illustrating a configuration of a connection device used in the first embodiment. Hereinafter, the manufacturing method of the display device of the present invention when the connection device of the present invention is used and the structure of the connection device of the present invention will be described together with the flow of the connection process. In this embodiment, a model is used in which five source TCPs and one source PCB are connected along one side of the glass substrate, and three gate TCPs and one gate PCB are connected along the other side of the glass substrate.

First, the worker 1 places the glass substrate 13 a taken out from the glass substrate supply tray 3 on the glass substrate image recognition table 6. The glass substrate image recognition table 6 is provided with a guide pin so that it can be positioned roughly. A CCD camera and an image recognition device installed below the glass substrate image recognition table 6 read alignment marks at both ends of the glass substrate 13a, and correct the difference from a preset reference position to cure the glass substrate 13a. It is transferred to a tool table (mounting table) 7 and fixed by suction.

Next, the worker 1 places the PCB 15 taken out from the PCB supply tray 2 on the PCB image recognition table 5. The PCB image recognition table 5 is provided with a guide pin so that it can be positioned roughly. The CCD camera and the image recognition device installed above the PCB image recognition table 5 read the alignment marks at both ends of each PCB 15 and correct the difference from the preset reference position to the PCB 15 on the jig table 7. Transfer and fix each by adsorption. In the jig table 7, the glass substrate 13a and the PCB 15 are sucked and fixed in a state where they are positioned at the connection positions.

Here, the structure and operation of the jig table 7 will be described. The circular index unit 8 provided below the jig table 7 has a structure that rotates clockwise by means such as driving of a servo motor, stops accurately every 90 °, and holds its position. In addition, four sets of jig tables 7 are attached to the index unit 8, and each jig table 7 has a structure that can be rotated every 90 °. Therefore, when the jig table 7 is moved to each work station of the ACF adhering portion 9, the TCP temporary crimping portion 10, and the main crimping portion 12 provided on the outer periphery of the index unit 8, It is possible to direct the processing direction to the direction of each work station.

When the glass substrate 13a is transferred to the jig table 7, the index unit 8 on which the jig table 7 on which the glass substrate 13a and the PCB 15 are attracted and fixed is rotated by 90 °, and the jig table 7 is attached to the ACF attaching portion. 9 is placed before. Then, ACF is attached to a predetermined position on the source side of the glass substrate 13a and the PCB 15, and the separator is peeled off. When the source side operation is completed, the jig table 7 is rotated by 90 °, and similarly, ACF is attached to a predetermined position on the gate side, the separator is peeled off, and the gate side operation is completed.

When the ACF attachment is completed, the index unit 8 rotates 90 °, and the jig table 7 on which the glass substrate 13a and the PCB 15 are sucked and fixed is arranged in front of the TCP temporary pressure bonding portion 10. Then, the source TCP cut into individual pieces from the TCP reels 11a and 11b by the external punching die is accurately positioned by image recognition, and temporarily press-bonded to a predetermined position on the source side. When the source side work is completed by repeating the TCP pre-bonding operation on the five source sides, the jig table 7 is rotated 90 °, and the gate side is similarly cut into individual pieces from the TCP reels 11a and 11b by an external punching die. The gate TCP thus obtained is positioned with high accuracy by image recognition, and provisional pressure bonding is performed at a predetermined position on the gate side. The temporary press bonding step is performed under conditions of, for example, 50 to 80 ° C., 0.5 to 2 seconds, and 0.5 to 1 MPa, relatively low temperature, a short time, and a low pressure. The gate side operation is completed by repeating the TCP temporary crimping operation of the three gate sides.

When the pre-bonding is completed, the index unit 8 is rotated by 90 °, and the jig table 7 on which the glass substrate 13a and the PCB 15 are sucked and fixed and the TCP is temporarily bonded is disposed in front of the main bonding part 12. Then, the tool is lowered to a predetermined position on the source side to perform the main pressure bonding. When the work on the source side is completed, the jig table 7 is rotated 90 °, and the tool is lowered to a predetermined position on the gate side to perform the main pressure bonding. The main press bonding step is performed under conditions of a relatively high temperature, a long time, and a high pressure, for example, 150 to 200 ° C., 10 to 20 seconds, and 2 to 3 MPa.

When the main press-bonding is completed, the index unit 8 is rotated by 90 °, the jig table 7 to which the glass substrate 13b to which the PCB 15 is connected is sucked and fixed is disposed in front of the worker 1, and the suction fixing is released. Then, the operator 1 takes out the glass substrate 13 b from the jig table 7 and places it on the glass substrate storage tray 4. In this way, the connection process is completed.

In addition, since the connection apparatus used in the present embodiment is composed of four work stations, four jig tables are provided on the index unit, but the number of jig tables depends on the number of work stations. It is preferable to adjust the rotation amount of the index unit. Further, in this embodiment, a semi-automatic method in which the glass substrate is manually supplied into the apparatus is adopted. However, by doing so, the apparatus can be reduced in size.

Hereinafter, the provisional pressure bonding process will be described in detail. FIG. 2 is a schematic cross-sectional view illustrating a side surface of the temporary crimping portion 10 of the connection device used in the first embodiment. The provisional pressure bonding unit 10 is provided with an image recognition device, and the position of the jig table 7 is corrected with high accuracy in accordance with the positional relationship of the connection state between the glass substrate 13a and the PCB 15 that are sucked and fixed to the jig table 7. The glass substrate 13a and the PCB 15 thus corrected are supported by backup structures 20a and 20b provided on the lower side of the back surface. Moreover, the temporary crimping | compression-bonding part 10 is provided with the temporary crimping | compression-bonding unit 16, and a temporary crimping | compression-bonding process is performed by this. A heater 17 and a thermocouple 18 for maintaining a preset temperature condition are attached to the temporary pressure bonding unit 16. Further, a collet 19 is attached to the temporary press-bonding unit 16, and an external vacuum is generated on the collet 19 for attracting and holding the TCP 14 that has been cut and transported from the TCP reels 11 a and 11 b by an outer punching die Is connected. Then, the collet 19 causes the TCP 14 to descend at a predetermined pressure while being sucked and held, and is connected to the glass substrate and the PCB all at once. Through the above steps, the temporary pressure bonding is completed.

Hereinafter, the main crimping process will be described in detail. FIG. 3 is a schematic cross-sectional view illustrating a side surface of the main crimping portion 12 of the connection device used in the first embodiment. An image recognition device is also provided in the main crimping section 12, and the position of the jig table 7 is corrected with high accuracy in accordance with the positional relationship of the connection state between the glass substrate 13 a and the PCB 15 that is sucked and fixed to the jig table 7. The glass substrate 13a and the PCB 15 thus corrected are supported by backup structures 20a and 20b provided on the lower side of the back surface. Further, the main crimping section 12 is provided with main crimping units 21a and 21b, whereby the main crimping process is performed. Heaters 22a and 22b are attached to the main pressure bonding units 21a and 21b, respectively. Also, the crimping tools 23a and 23b are attached to the main crimping units 21a and 21b. Near the tips of the crimping tools 23a and 23b, a thermocouple 24a for accurately setting and controlling the crimping temperature, 24b are respectively attached. Further, a buffer material 25 is provided between the crimping tools 23a and 23b and the glass substrate 13, TCP 14 and PCB 15 of the connection portion. It is possible to uniformly pressurize the main crimping portion 12 by the buffer material 25. As the material of the buffer material 25, a silicon rubber sheet or a sheet-like material in which a silicon resin is contained in glass fiber and having a high heat-resistant temperature is preferably used. The crimping tools 23a and 23b are lowered to a predetermined position simultaneously or continuously, and are raised by a preset timer, thereby making it possible to adjust the pressure, time, and temperature that meet the connection conditions. Through this process, the main press bonding is completed.

As described above, according to the display device manufacturing method using the connection device according to the present embodiment, the installation space of about half of the conventional connection device is sufficient. In addition, the number of workers can be reduced to about half that of the prior art, and the number of work steps can be reduced by about 30% compared to the prior art.

In addition, although the connection apparatus of a present Example becomes a form which provided each work station in the outer periphery of an index unit, it is not specifically limited to such a form, For example, it walks by developing an index unit linearly. There is a mode in which each member is transported by a beam method, each work station is provided on both sides, and a member transport line is arranged side by side. Thereby, it is possible to increase the processing capacity while realizing space saving. In such a case, the substrate storage device may be arranged at the end of the transfer line as necessary, or a return conveyor is provided so that the finished product returns to the operator. It is good also as a various form.

1 is a schematic plan view showing a device configuration of a connection device used in Example 1. FIG. It is a cross-sectional schematic diagram which shows the side surface of the temporary crimping | compression-bonding part of the connection apparatus used in Example 1. FIG. 3 is a schematic cross-sectional view illustrating a side surface of a main crimping portion of a connection device used in Example 1. FIG. It is a plane schematic diagram of the liquid crystal display module in the COF system used conventionally.

Explanation of symbols

1: Worker 2: PCB supply tray 3: Glass substrate supply tray 4: Glass substrate storage tray 5: PCB image recognition table 6: Glass substrate image recognition table 7: Jig table (mounting table)
8: Index unit 9: ACF attaching part 10: Temporary pressure bonding part 11a, 11b: TCP reel 12: Main pressure bonding part 13a, 13b: Glass substrate 14: TCP
15: PCB
16: provisional pressure bonding unit 17: heater 18: thermocouple 19: collet 20a, 20b: backup structure 21a, 21b: main pressure bonding unit 22a, 22b: heater 23a, 23b: pressure bonding tool 24a, 24b: thermocouple 25: buffer material 101 : Glass substrate 102: Source TCP
103: Source PCB
104: Gate TCP
105: Gate PCB

Claims (11)

A manufacturing method of a display device including a connection step of pressure bonding a tape carrier package to a panel substrate and a printed circuit board,
In the connecting step, the tape carrier package is arranged on the substrate surface so as to cover each opposite side of the panel substrate and the printed circuit board arranged side by side on the plane, and the panel substrate and the tape carrier package are bonded. And the manufacturing method of the display apparatus characterized by performing crimping | compression-bonding with a tape carrier package and a printed circuit board collectively. The connecting step performs temporary pressure bonding and main pressure bonding. In both the temporary pressure bonding and the main pressure bonding, pressure bonding between the panel substrate and the tape carrier package and pressure bonding between the tape carrier package and the printed circuit board are performed. The method for manufacturing a display device according to claim 1, wherein the manufacturing is performed in a lump. The method for manufacturing a display device according to claim 1, wherein the connecting step includes a step of collectively bonding anisotropic conductive films on the panel substrate and the printed circuit board. 2. The method of manufacturing a display device according to claim 1, wherein the connecting step is performed in a state where the panel substrate and the printed circuit board are sucked and held at regular intervals. 2. The method of manufacturing a display device according to claim 1, wherein the connection step is performed after the panel substrate and the printed circuit board are positioned by the image recognition device. A connection device for crimping a tape carrier package against a panel substrate and a printed circuit board,
The connecting device arranges a tape carrier package on a substrate surface so as to cover each opposing side of a panel substrate and a printed circuit board arranged side by side on a plane, and press-bonding the panel substrate and the tape carrier package; And the connection apparatus characterized by having a crimping | compression-bonding part which crimps | bonds a tape carrier package and a printed circuit board collectively. The pressure-bonding portion collectively press-bonds the tape carrier package to the panel substrate and the printed circuit board at once, and the pressure-bonding portion to the panel substrate and the printed circuit board to which the tape carrier package is temporarily bonded. The connection device according to claim 6, wherein the connection device includes a main crimping portion. The connection device according to claim 6, further comprising an anisotropic conductive film attaching portion that collectively attaches the anisotropic conductive film onto the panel substrate and the printed circuit board. The connection device according to claim 6, further comprising a mounting table that holds the panel substrate and the printed circuit board by suction at regular intervals. The connection device according to claim 6, further comprising an image recognition device that adjusts a distance between the panel substrate and the printed circuit board. The connection device according to claim 6, wherein the crimping portion includes a mechanism that holds the tape carrier package by suction and a mechanism that raises and lowers the tape carrier package.

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