JP2008028367A - Taping component, taping component taping data creation method and taping component fabrication method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a taping component capable of efficiently mounting various electronic components on a printed wiring board.
A taping component (1) includes a carrier tape (2) and a cover tape (3) covering the carrier tape (2). The carrier tape (2) has a plurality of types of electronic components (50a, 50b) mounted on a printed circuit board. Storage portions 4a, 4b, and 4c capable of storing 50c are formed. The storage units 4a, 4b, and 4c have different shapes depending on the electronic components 50a, 50b, and 50c to be stored. The taping component 1 is configured to be wound in a reel shape.
[Selection] Figure 1

Description

  The present invention relates to a taping component used in an electronic component mounting apparatus for mounting various electronic components on a printed wiring board, a taping data creation method for the taping component, and a taping component production method.

2. Description of the Related Art Conventionally, an electronic component mounting device (hereinafter referred to as a mounting device) that mounts various electronic components such as resistors, capacitors, and ICs on a printed wiring board is sequentially supplied from an electronic component supply device (hereinafter referred to as a chip feeder). This was supplied and sucked by a suction nozzle and mounted at a specified position on the circuit board.
FIG. 13 is a diagram showing a configuration of a conventional taping component.
The carrier tape 201 of the taping component 200 shown in FIG. 13A is formed with a storage portion 203 that can store the electronic component 202. In this case, the interval between the adjacent storage portions 203 is equal pitch X1, and the tape width of the carrier tape 201 is Y1.
In addition, the carrier tape 211 of the taping component 210 shown in FIG. 13B is formed with a storage portion 213 that can store the electronic component 212. In this case, the interval between the adjacent storage portions 213 is a pitch X2 wider than the pitch X1 shown in FIG. 13A, and the tape width of the carrier tape 211 is Y2 wider than the tape width Y1 shown in FIG.
In addition, the carrier tape 221 of the taping component 220 shown in FIG. 13C is formed with a storage portion 223 that can store the electronic component 222. In this case, the interval between the adjacent storage portions 223 is a pitch X3 wider than the pitch X2 shown in FIG. 13B, and the tape width of the carrier tape 221 is Y3 wider than the tape width Y2 shown in FIG. 13B.
In Patent Document 1 as a conventional example, it is possible to determine whether or not an appropriate reel is attached to a feeder, thereby more reliably mounting the electronic component at an appropriate position on a printed wiring board. The technology to be performed is disclosed.
JP 2005-310986 A

By the way, in the conventional taping component like Patent Document 1, only one type of electronic component is enclosed as shown in FIG. For this reason, in the mounting apparatus, it is necessary to store chip feeders in which taping components are set for the types of electronic components to be mounted on the printed wiring board. However, the number of chip feeders that can be stored in the mounting device is limited.
In recent printed wiring boards, the number and types of electronic components to be mounted tend to increase as the mounting density increases, and the number of chip feeders used has increased. For this reason, if there are more types of electronic components used on the printed wiring board than the number of chip feeders that can be stored in one mounting device, it is necessary to use multiple mounting devices to cope with it. There was a problem that it caused a decrease in sex.

Furthermore, since the number of electronic components used in one printed wiring board and the number of electronic components stored in the taping component are different, the electronic components in the taping component are emptied at different timings during production. As a result, there has been a problem that the mounting apparatus frequently stops in order to replace the taping parts, leading to a decrease in the operating rate of the mounting apparatus.
In view of the above-described problems, the present invention provides a taping component capable of efficiently mounting various electronic components on a printed wiring board, a taping data creation method for such a taping component, and a taping component manufacturing method. The purpose is to provide.

In order to achieve the above object, an invention according to claim 1 is a taping component set in an electronic component mounting apparatus for mounting an electronic component on a printed wiring board, and includes a plurality of types of electronic components and the electronic components. It is characterized by comprising a carrier tape having a storage portion for storing each and a cover tape covering the carrier tape.
The invention according to claim 2 is characterized in that the carrier tape is configured to be wound together with the cover tape.
The invention according to claim 3 is characterized by the taping component according to claim 1 or 2, wherein the storage portion stores a plurality of types of electronic components mounted on the printed wiring board.
The invention according to claim 4 is characterized in that the storage portion has a taping component according to any one of claims 1 to 3 having a different shape for each electronic component to be stored.
According to a fifth aspect of the present invention, the carrier tape is characterized by the taping component according to any one of the first to fourth aspects, wherein the storage portions are formed at equal intervals in the tape longitudinal direction.
According to a sixth aspect of the present invention, in the carrier tape, a plurality of the storage portions are arranged at different intervals in the tape longitudinal direction, and the plurality of the storage portions are formed at equal intervals as one set. 5. A taping component according to any one of items 4 to 4 is characterized.

According to a seventh aspect of the present invention, in the carrier tape, a plurality of types of electronic components are repeatedly stored as one set, and a reference mark indicating a reference position is provided for each set. A taping component according to any one of the above features.
The invention according to claim 8 is the taping component according to claim 7, wherein the reference mark is a bar code recording information of the electronic component.
The invention according to claim 9 is a taping component taping data creation method set in an electronic component mounting apparatus for mounting an electronic component on a printed wiring board, and the step of extracting the electronic component according to a predetermined selection condition A step of combining the extracted electronic components based on a predetermined condition, a step of determining whether or not the combined electronic component satisfies equipment conditions of the electronic component mounting apparatus, and the combined electronic component is the electronic component A step of creating taping data when the equipment conditions of the mounting device are satisfied, and a step of changing the selection conditions when the combined electronic component does not satisfy the equipment conditions of the electronic component mounting device. And
The invention according to claim 10 is characterized in that the selection condition is information on the number of used electronic components to be mounted on the printed circuit board.

The invention according to claim 11 is the taping component taping data creation method according to claim 9 or 10, wherein the selection condition is tape width information when the electronic component is taped.
The invention according to claim 12 is the taping component taping data creation method according to any one of claims 9 to 11, wherein the selection condition is mounting position information of an electronic component mounted on the printed wiring board. Features.
According to a thirteenth aspect of the present invention, the selection condition is nozzle information used when mounting an electronic component on the printed wiring board. The taping component taping data creation according to any one of the ninth to twelfth aspects Features method.
The invention according to claim 14 is the taping component according to any one of claims 9 to 13, wherein the selection condition is mold information for forming a storage portion for storing the electronic component in the carrier tape. It features a taping data creation method.
The invention described in claim 15 is characterized by a taping component manufacturing method for manufacturing a taping component based on taping data generated by the taping component taping data generation method according to any one of claims 9 to 14. To do.

According to the taping component of the present invention, it is possible to reduce the number of taping components used in the electronic component mounting apparatus by storing a plurality of types of electronic components in one carrier tape. As a result, the number of types of electronic components that can be mounted on the printed wiring board by a single electronic component mounting apparatus can be greatly increased, so that the mounting efficiency of electronic components by the electronic component mounting apparatus can be improved.
Further, according to the taping data creation method for taping parts of the present invention, taping data for making plural types of electronic parts into taping parts can be easily obtained by changing selection conditions such as the quantity of electronic parts to be stored in the taping parts. Can be created. Therefore, if a taping component is produced using this taping data, it is possible to easily produce a taping component in which a plurality of types of electronic components are stored in one carrier tape. At this time, for example, by matching the quantity of electronic components in the taping component of the present invention with the number of electronic components of other taping components, it is possible to reduce the number of taping component replacements during production. It becomes possible to prevent a reduction in the operating rate of the electronic component mounting apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1A and 1B are views showing the structure of a taping component according to a first embodiment of the present invention. FIG. 1A is a plan view and FIG. 1B is a cross-sectional view. In addition, illustration of the cover tape is abbreviate | omitted in Fig.1 (a).
A taping component 1 shown in FIG. 1 includes a carrier tape 2 and a cover tape 3 that covers the carrier tape 2. The carrier tape 2 is formed with storage portions 4a, 4b, and 4c that can store a plurality of types of electronic components 50a, 50b, and 50c mounted on a printed wiring board. The storage units 4a, 4b, and 4c have different shapes depending on the electronic components 50a, 50b, and 50c to be stored. The taping component 1 configured as described above is used by being set on a chip feeder of a mounting device for mounting an electronic component on a printed wiring board. For this reason, the taping component 1 of the present embodiment is configured to be wound in a reel shape. That is, the carrier tape 2 is configured to be wound together with the cover tape 3.

  Mounting devices are generally divided into “robot type (XY robot)” and “rotary type” except for special applications. The robot type includes a movable head that moves along an X axis and a Y axis that is orthogonal to the X axis, and the variable head includes a plurality of suction means that suck electronic components to be mounted on a printed wiring board along the X axis direction. They are arranged side by side. On the other hand, in the rotary type, a portion (table) holding a printed wiring board moves in the XY direction, and a plurality of suction means (nozzles) for sucking electronic components are arranged in a circular shape. The taping component 1 of the present embodiment can be applied to any type of mounting apparatus.

FIG. 2 is a view showing a general tape structure of a taping component.
As shown in FIG. 2A, the carrier tape 2 of the taping component 1 has a feed hole 6 for sending an electronic component to the mounting device, and a storage portion 4 formed by embossing. Then, as can be seen from the cross-sectional view of FIG. 2B, a storage portion 4 in which electronic parts are stored is continuously formed across the rib portion 2a. As shown in FIG. 2C, the carrier tape 2 is covered with a cover tape 3 and can be wound up in a reel shape.
Moreover, in the taping component 1 of this Embodiment shown in FIG. 1, each accommodating part 4a-4c of the carrier tape 2 is formed in the tape longitudinal direction at equal intervals. In this case, the interval X between the adjacent storage portions 4a to 4c is set according to the feed width of the electronic component having the largest feed amount among the electronic components 50a to 50c to be stored. Also, the tape width Y of the carrier tape 2 is set in accordance with the electronic component having the widest tape width among the electronic components 50a to 50c that are similarly accommodated in the accommodating portions 4a to 4c.

The carrier tape 2 of the taping component 1 according to the first embodiment repeatedly stores three types of electronic components 50a, 50b, and 50c as one set. A reference mark 5 indicating a reference position is provided for each set. The reference mark 5 will be described later.
As described above, in the taping component 1 of the first embodiment, by storing a plurality of types of electronic components 50a to 50c in one carrier tape 2, the number of taping components used in the mounting device can be reduced. become.
As a result, the number of types of electronic components that can be mounted on the printed wiring board by a single mounting device can be greatly increased, so that the mounting efficiency of the electronic components by the mounting device can be improved.

3A and 3B are views showing the structure of a taping component according to the second embodiment of the present invention. FIG. 3A is a plan view and FIG. 3B is a cross-sectional view. In addition, illustration of a cover tape is abbreviate | omitted in Fig.3 (a). The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.
The taping component 1 shown in FIG. 3 is different from the carrier tape 2 shown in FIG. 1 in that the storage portions 4a to 4c are formed at equal intervals in the tape longitudinal direction. The pieces are arranged at different intervals, and the plurality is formed as a set at equal intervals. In this case, the interval X between the storage units 4 is set to a feed width corresponding to the feed amount of the larger one of the electronic components stored in the adjacent storage units. For example, when the adjacent electronic components are the electronic components 50a and 50c, the interval between the storage portions 4a and 4c is set to the feed width X2 corresponding to the feed amount of the electronic component 50c. In addition, when the adjacent electronic components are the same electronic components 50a and 50a, the space | interval between the accommodating parts 4a and 4a is set to X1. Also in this case, the tape width Y of the carrier tape 2 is adjusted to the electronic component having the widest tape width among the electronic components 50a to 50c accommodated in the accommodating portions 4a to 4c. Further, in the carrier tape 2 shown in FIG. 2, two types of electronic components 50a and 50c are repeatedly stored as one set, and a reference mark 5 indicating a reference position is provided for each set.
As described above, in the taping component 1 of the second embodiment, it is possible to store a plurality of types of electronic components 50a to 50c having different feed widths in one carrier tape 2, and the taping component used in the mounting apparatus can be stored. It becomes possible to reduce the quantity. If comprised in this way, since the kind of electronic component which can be mounted in a printed wiring board with one mounting apparatus can be increased easily, the productivity of a mounting apparatus can be improved easily.

Here, the reference mark will be described with reference to FIG.
FIG. 4 is a diagram showing a configuration example of a reference mark. Reference marks include holes 5a shown in (a), slits 5b shown in (b), print marks 5c shown in (c), and (d). The barcode 5d shown can be considered.
When the reference mark is formed by the barcode 5d shown in FIG. 4D, the number of parts, the feed width, or each piece of component information (external shape L (length) width (W) height is obtained using the barcode 5d. (T)) information, emboss depth, component library number, suction nozzle number, etc.) may be recorded.
The component information may be recorded using a magnetic tape or an IC tag.
With this configuration, even when a plurality of types of electronic components are stored in one taping component 1, the position of the electronic component can be easily grasped, and erroneous mounting can be reliably prevented.

Hereinafter, a method for producing the taping component as described above will be described.
First, a taping data creation method for creating taping parts will be described.
FIG. 5 is a diagram showing a main configuration of an electronic component data creation system capable of creating taping data and the like according to the present embodiment.
The electronic component data creation system shown in FIG. 5 includes a component information database 101, a design information database 102, an equipment information database 103, a wiring board information database 104, a taping data creation unit 105, and an NC (Numerical Control) data creation unit. 106.
The component information database 101 stores information such as external dimensions and packing forms of various electronic components, tape information (feed amount), mounting equipment conditions (nozzles), and the like. The design information database 102 stores parts list information for each product.

The facility information database 103 stores information on a mounting device that mounts an electronic component, for example, information on an electronic component that can be mounted on the mounting device. The wiring board information database 104 stores information such as part position information (part coordinates, angle, etc.) for placing parts for each type of printed wiring board and mounting method. The taping data creation unit 105 creates taping data to be used when producing the taping component 1 composed of a plurality of electronic components as described above, based on the component information database 101, the design information database 102, and the facility information database 103. To do.
This taping data is also used in a carrier tape processing apparatus and the like which will be described later. The taping data is also output to the NC data creation unit 106. The NC data creation unit 106 determines whether the mounting apparatus is a mounting equipment based on the part information database 101, the design information database 102, the equipment information database 103, the wiring board information database 104, the taping data from the taping data creation unit 105, and the like. Create and output suitable NC data.

Hereinafter, an example of a taping data creation method in the taping data creation unit 105 will be described. FIG. 6 is a diagram showing an example of various information used in the taping data creation unit 105 shown in FIG.
In the electronic component area 121 shown in FIG. 6, the component number and name of the electronic component used for one printed wiring board are described. The used number area 122 describes the used number of each electronic component to be used. The supply form area 125 describes the form (for example, tape material, tape width, feed amount, method, etc.) of each electronic component. The supply unit occupation number area 123 describes the number of occupations that each electronic component occupies the supply unit.
Here, the supply unit occupation number refers to the number of chip feeders (electronic component supply devices occupy the component supply units (slots) of the mounting device) in which electronic components are set. For example, if the tape containing the electronic parts is widened, the size of the chip feeder is increased, for example, if the number of supply units occupied when the tape width is 8 mm is “1”, the tape feeder is supplied when the tape width is 12 mm. When the part occupation number is “2” and the tape width is 24 mm, the supply part occupation number is “3”, and when the tape width is 32 mm, the supply part occupation number is “4”.
Equipment set No. In the area 124, the equipment number of the set mounting device for the chip feeder and the supply part number of the component supply part (slot) for setting the chip feeder are shown. Therefore, in the example shown in FIG. 6, it is shown that when mounting an electronic component on a certain printed wiring board, five mounting devices as an equipment set are required.

However, in this case, the number of chip feeders set in the fifth mounting device is only two sets, and the utilization efficiency is poor compared to other mounting devices. Depending on the factory or the like, the number of mount devices that can be used is limited. When five mount devices are required, it is necessary to mount the electronic components in two steps, which may deteriorate the production efficiency.
Therefore, in the present embodiment, the taping data creation unit 105 creates taping data for storing a plurality of types of electronic components 50a to 50c in one carrier tape 2, and a plurality of types of taping data is generated based on the taping data. The number of taping parts used in the mounting apparatus was reduced by producing taping parts that housed electronic parts. Accordingly, for example, in the example shown in FIG. 6, the number of mount devices to be used is reduced from five to four.

FIG. 7 is a flowchart showing taping data creation processing according to the present embodiment. The processing described below is executed by the taping data creation unit 105 shown in FIG.
In this case, the taping data creation unit 105 first extracts electronic components based on a predetermined selection condition in step S1. Here, as selection conditions, for example, (1) the number of electronic components used is small, (2) the tape width is the same, (3) the tape width is wide, and (4) the component is attracted when mounting. The size of the nozzle to be used is the same, (4) the placement position on the printed wiring board is close, (5) the shape of the molding die is the same when producing the storage part for storing the electronic components on the carrier tape. Conceivable. Moreover, since the shape of the suction nozzle, the tact time, the recognition camera, and the illumination method differ depending on the type of mounting device, it is conceivable to select electronic components using these as parameters.
Next, in step S2, the extracted electronic components are combined based on a predetermined condition. Here, the predetermined condition may be the maximum taping length of the taping component. In subsequent step S3, it is determined whether or not the electronic components combined in step S2 satisfy the equipment conditions of the mounting apparatus. If the equipment conditions are satisfied ("Y" in S3), taping data is obtained in step S4. Create and finish the process.
On the other hand, if the equipment condition is not satisfied in step S3 ("N" in S3), the selection condition is changed in step S5, and the process returns to step S1 for processing.

FIG. 8 is a flowchart showing a first embodiment of taping data creation processing. In the process shown in FIG. 8, the wide tape width is a condition for selecting an electronic component. In addition, electronic parts are stored at regular intervals on a carrier tape. The first predetermined value is arbitrary, the second predetermined value is a value equal to or less than the maximum tape length of another reel, and the third predetermined value is a maximum supply section occupation number that can be mounted on the mounting device.
In this case, first, in step S11, those whose number is less than the first predetermined value are extracted. Next, in step S12, an electronic component having the widest tape width of the carrier tape is extracted. Next, in step S13, it is determined whether or not there are two or more extracted electronic components. If there are two or more types (Y in S13), the maximum feed amount is obtained in step S14. Next, in step S15, the maximum feed amount of the used number x is integrated, and a combination in which the sum is less than or equal to a second predetermined value is created. Note that the integrated value can be obtained by multiplying the number of products used by the number used per printed circuit board of the target model (or one sheet when a plurality of printed wiring boards are arranged on one sheet).

In step S16, the electronic component supply unit (slot) occupation number is integrated, and in subsequent step S17, it is determined whether or not the integrated value of the supply unit occupation number is equal to or less than a third predetermined value. Here, when it is determined that the integrated value of the supply unit occupation number is equal to or smaller than the third predetermined value (“Y” in S17), in step S18, the order of the electronic components is adjusted to the mounting order, and then in step S19. Create taping data and finish the process.
If it is determined in step S13 that the widest electronic component is one type (“N” in S13), or in step S17, the integrated value of the supply unit occupation number is not less than or equal to the third predetermined value ( In step S17, “N”), the process proceeds to step S20, and then the wide electronic component is extracted, and the process returns to step S13.

FIG. 9 is a flowchart showing a second embodiment of the taping data creation process. In the process shown in FIG. 9, it is assumed that the tape width is wide as the electronic component selection condition. In addition, the interval between the electronic components stored in the carrier tape is different.
In this case, first, in step S21, those whose number is less than the first predetermined value are extracted. Next, in step S22, the electronic component having the widest tape width of the carrier tape is extracted. Next, in step S23, it is determined whether or not there are two or more extracted electronic components. If there are two or more types (Y in S23), the maximum feed amount is obtained in step S24. Next, in step S25, the maximum feed amount of the used number x is integrated, and a combination whose total is equal to or less than a second predetermined value is created. Note that the integrated value can be obtained by multiplying the number of products used by the number used per printed circuit board of the target model (or one sheet when a plurality of printed wiring boards are arranged on one sheet).

In step S26, the electronic component supply unit (slot) occupation number is integrated, and in subsequent step S27, it is determined whether or not the integrated value of the supply unit occupation number is equal to or less than a third predetermined value. Here, when it is determined that the integrated value of the supply unit occupation number is equal to or smaller than the third predetermined value (“Y” in S27), the order of the electronic components is matched with the mounting order in step S28. Next, after determining the feeding of each component in accordance with the mounting order, taping data is created in step S30, and the process ends. When it is determined in step S23 that the widest electronic component is one type (“N” in S23), or in step S27, the integrated value of the supply unit occupation number is not less than or equal to the third predetermined value ( In step S27, “N”), the process proceeds to step S31, where the next wide electronic component is extracted, and the process returns to step S23.
As described above, according to the taping component taping data creation method of the present embodiment, by changing the selection conditions such as the number of electronic components stored in the taping component 1, a plurality of types of electronic components can be used as taping components. It is possible to easily create the taping data.

Next, a method for producing a taping component based on the taping data created as described above will be described.
10 and 11 are diagrams showing a schematic structure of a taping component processing apparatus.
As shown in FIG. 10, when producing the taping component, the unprocessed carrier tape 2 is pulled out from the unwinding roll 7 at an arbitrary timing by the operations of the fixed chucks 8 and 9 and the moving chucks 10 and 11. The panel 12 is heated to an appropriate processing temperature. Next, it moves to the molding die 13 and the storage part 4 is processed. The carrier tape 2 embossed as the storage unit 4 is processed by a punching die 14 in a feed hole 5 for feeding out a chip feeder, and is taken up by a take-up roll 15. The storage portions having different shapes can be easily formed by sequentially changing the molding die 13.

  FIG. 11 shows the details of the hot platen and the molding part. The carrier tape 2 is heated by a hot plate whose vertical position is controlled by hot plate vertical devices 17 and 18, and an upper die 25 and a lower die 22 whose vertical positions are controlled by an upper die vertical device 24 and a lower die vertical device 21. The embossed part is processed with. In this embodiment, the lower die 22 is processed as a concave portion, and the upper die 25 supported by the upper die fixing seat 23 is sequentially processed as a convex portion. The lower mold 22 and the upper mold 25 are installed based on combination information of electronic parts obtained from the setup system and storage order information.

FIG. 12 is a diagram showing a schematic structure of a storage device that stores electronic components in the carrier tape 2 embossed as described above. In this case, the mounting device is installed in the chip feeder so that it can be pulled out from the reel wound up at the time of mounting. As the combined storage, the carrier tape 2 processed as described above is installed on the carrier tape roll 30 so that the storage order is reversed, and the electronic device corresponding to the storage portion 4 of the carrier tape 2 formed as described above. A method of sequentially storing components by the component mounting head 35 may be used. The component mounting head may be an apparatus or may be mounted by hand. While the carrier tape 2 is taken up by the take-up reel 31, the cover tape 3 is bonded with the iron 33. A reference mark serving as a reference position is provided by a marker 34 in a repeating unit for each printed wiring board to be produced. This mark can be used as a reference position when components are mounted on a printed wiring board. This mark may be made when the carrier tape 2 is processed.
In this case, the marker 34 in FIG. 12 can transmit a reference for repeatedly storing electronic components to the apparatus as a mark reading apparatus. The processing device for the carrier tape 2 and the component storage device may be connected, and the take-up roll 15 of the tape processing device and the carrier tape roll 30 of the component storage device for the carrier tape can be omitted. By processing the carrier tape 2 and storing the electronic components in this way, the carrier tape 2 storing a plurality of types of electronic components can be obtained.

When electronic components are mounted on a printed wiring board, the taping component 1 produced by the processing and storage method as described above is placed on a chip feeder. The mounting device has NC information of the taping component 1 corresponding to information such as the component mounting order, the mounting position on the board and the dimensions of the component, and sequentially takes out the electronic components from the taping component 1 in accordance with this NC information. To be installed. As a result, the mounting apparatus can sequentially take out different types of components from the chip feeder on which the reels are set in the order of mounting.
As described above, in this embodiment, if a taping component is manufactured using taping data, a taping component in which a plurality of types of electronic components are stored in one carrier tape can be easily manufactured. At this time, by adjusting the number of electronic components in the taping component 1 to, for example, the number of electronic components in other taping components, it is possible to reduce the number of taping component replacements during production. It is possible to prevent a reduction in the operating rate of the mounting device.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

It is the figure which showed the structure of the taping component which concerns on the 1st Embodiment of this invention. It is the figure which showed the general tape structure of taping components. It is the figure which showed the structure of the taping component which concerns on the 2nd Embodiment of this invention. It is the figure which showed the structural example of the reference | standard mark. It is the figure which showed the main structures of the electronic component data creation system which can create the taping data etc. of this embodiment. It is the figure which showed an example of the various information used in the taping data creation part shown in FIG. It is the flowchart which showed the taping data creation process of this Embodiment. It is the flowchart which showed the 1st Example of the taping data creation process. It is the flowchart which showed the 2nd Example of the taping data creation process. It is the figure which showed schematic structure of the processing apparatus of taping components. It is the figure which showed schematic structure of the processing apparatus of taping components. It is the figure which showed schematic structure of the storage device which stores an electronic component. It is the figure which showed the structure of the conventional taping component.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Taping component, 2 ... Carrier tape, 2a ... Rib part, 3 ... Cover tape, 4 ... Hole, 4, 4a-4c ... Storage part, 5 ... Reference mark, 5a ... Hole, 5b ... Slit, 5c ... Print mark 5 ... Bar code, 6 ... Feeding hole, 7 ... Unwinding roll, 8 ... Fixed chuck, 10 ... Moving chuck, 12 ... Hot plate, 13 ... Molding die, 14 ... Punching die, 15 ... Roll, 17 ... Heating plate elevating device, 21 ... Lower die lifting device, 22 ... Lower die, 23 ... Upper die fixing seat, 24 ... Upper die lifting device, 25 ... Upper die, 30 ... Carrier tape roll, 31 ... Reel, 33 ... Iron, 34 ... marker, 35 ... component mounting head, 50a-50c ... electronic component

Claims (15)

  A taping component set in an electronic component mounting apparatus for mounting an electronic component on a printed wiring board, and a plurality of types of electronic components, a carrier tape having a storage portion for storing each of the electronic components, and covering the carrier tape A taping component comprising: a cover tape to be used.   The taping component according to claim 1, wherein the carrier tape is configured to be wound together with the cover tape.   The taping component according to claim 1 or 2, wherein a plurality of types of electronic components mounted on the printed circuit board are stored in the storage portion.   The taping component according to any one of claims 1 to 3, wherein the storage portion has a different shape for each electronic component to be stored.   The taping component according to any one of claims 1 to 4, wherein the storage portion of the carrier tape is formed at equal intervals in the tape longitudinal direction.   5. The carrier tape according to claim 1, wherein a plurality of the storage portions are arranged at different intervals in the longitudinal direction of the tape, and the plurality of the storage portions are formed at equal intervals as a set. The taping component as described in any one item.   7. The carrier tape according to claim 1, wherein a plurality of types of electronic parts are repeatedly stored as a set, and a reference mark indicating a reference position is provided for each set. Taping parts described in   The taping component according to claim 7, wherein the reference mark is a bar code in which information of the electronic component is recorded. A taping data creation method for taping components set in an electronic component mounting apparatus for mounting electronic components on a printed wiring board,
Extracting electronic components according to predetermined selection conditions;
Combining the extracted electronic components based on predetermined conditions;
Determining whether the combined electronic component satisfies the equipment conditions of the electronic component mounting device; and
Creating taping data when the combined electronic components satisfy the equipment conditions of the electronic component mounting device; and
Changing the selection condition when the combined electronic component does not satisfy the equipment conditions of the electronic component mounting device; and
A taping data creation method for taping parts, comprising:   10. The taping component taping data creation method according to claim 9, wherein the selection condition is information on the number of electronic components used mounted on the printed circuit board.   11. The taping component taping data creation method according to claim 9 or 10, wherein the selection condition is tape width information when the electronic component is taped.   12. The taping component taping data creation method according to claim 9, wherein the selection condition is mounting position information of an electronic component to be mounted on the printed wiring board.   The taping component taping data creation method according to any one of claims 9 to 12, wherein the selection condition is nozzle information used when mounting an electronic component on the printed circuit board.   The taping component taping data creation method according to any one of claims 9 to 13, wherein the selection condition is mold information for forming a storage portion for storing the electronic component on the carrier tape. .   A method for producing a taping component, comprising producing the taping component based on taping data created by the taping data creation method for a taping component according to any one of claims 9 to 14.

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