JP2007253372A - Mold for molding disk substrate, method for producing disk, and disk - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold for molding a disk substrate which can form an annular groove for inserting an electronic tag into the disk substrate. <P>SOLUTION: In the mold 11 for molding the disk substrate D1 in a cavity 14 formed between a first mold 12 and a second mold 13, a stamper 16 and an inner peripheral stamper holder 17 holding the vicinity of the central hole 16a of the stamper 16 by a claw part 18 are set in the first mold 12. An annular projection 24 for forming the annular groove D3 into which the electronic tag T is inserted is formed on the cavity forming surface 17c of the inner peripheral stamper holder 17 including the upper surface 18b of the claw part 18. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a disk substrate molding die, a disk manufacturing method, and a disk, and more particularly, to a disk substrate molding metal provided with an annular protrusion for forming an annular groove into which an electronic tag is inserted. The present invention relates to a mold, a disk manufacturing method using a disk substrate formed by the mold, and a disk manufactured by the manufacturing method.

Conventionally, a disk shown in Patent Document 1 to Patent Document 4 is known as a disk into which an electronic tag called a wireless IC tag or RFID tag is inserted. Patent Documents 1 to 3 disclose a technique for attaching or embedding an electronic tag on one side of a disk substrate. Patent Document 1 describes that an electronic tag is embedded in a card-shaped information recording medium.

Patent Document 4 discloses a disk in which a coil part and a circuit part are sandwiched between two disk substrates of a bonded disk. However, Patent Documents 1 to 4 do not disclose what kind of disk substrate molding die is used to mold the disk substrate.

JP 2003-58850 A (Claim 1, FIG. 1, FIG. 2, FIG. 12) Japanese Patent Laying-Open No. 2005-209323 (Claim 1, FIG. 1) JP-A-11-86347 (Claim 1, FIG. 1) JP-A-9-245381 (Claims 1, 0014, FIG. 3)

The present invention has been made in view of the above problems, and an object thereof is to provide a disk substrate molding die capable of forming an annular groove for inserting an electronic tag into the disk substrate. It is another object of the present invention to provide a disk substrate molding die in which an electronic tag can be inserted into only one disk substrate. It is another object of the present invention to provide a disk manufacturing method using a disk substrate formed by the disk substrate molding die and a disk manufactured by the manufacturing method.

The disk substrate molding die according to claim 1 of the present invention is a disk substrate molding die for molding a disk substrate in a cavity formed between a first mold and a second mold. The first mold is provided with a stamper and an inner peripheral stamper holder that holds the vicinity of the center hole of the stamper with a claw portion, and an electronic tag is inserted into the cavity forming surface of the inner peripheral stamper holder including the upper surface of the claw portion. An annular protrusion for forming the annular groove is provided.

According to a second aspect of the present invention, there is provided a molding die for a disk substrate comprising a dummy disk substrate to be bonded to a disk substrate having an information area in a cavity formed between a third die and a fourth die. In the molding die for the disk substrate to be molded, the third die is provided with a mirror surface plate for forming a blank area, and a cylindrical member is provided inside the mirror surface plate, and an electronic tag is inserted into the cavity forming surface of the cylindrical member. An annular projection for forming an annular groove is provided.

According to a third aspect of the present invention, there is provided a disc manufacturing method comprising: an annular groove formed on one of the disk substrates formed by the annular protrusion provided on the molding die for the disk substrate according to the first or second aspect; An electronic tag is inserted and bonded to the other disk substrate.

According to a fourth aspect of the present invention, there is provided a disk having an electronic tag in an annular groove of one of the disk substrates formed by the annular protrusion provided in the molding die for the disk substrate according to the first or second aspect. It is inserted and bonded to the other disk substrate.

The disk substrate molding die of the present invention is a disk substrate molding die for molding a disk substrate in a cavity formed between a first mold and a second mold. Is provided with a stamper and an inner peripheral stamper holder for holding the vicinity of the center hole of the stamper by a claw portion, and an annular groove for inserting an electronic tag is formed on the cavity forming surface of the inner peripheral stamper holder including the upper surface of the claw portion. Therefore, the annular groove into which the electronic tag is inserted can be formed only by the injection molding process.

A molding die for a disk substrate according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view of an essential part of a molding die for a disk substrate according to the present embodiment.

As shown in FIG. 1, a disk substrate molding die 11 includes a movable die 12 as a first die and a fixed die 13 as a second die. A cavity 14 having a variable volume is formed between the molds 12 and 13. A movable mold 12 attached to a movable platen of an injection molding machine (not shown) includes a movable mirror plate 15 fixed to a movable back plate (not shown), and an information area which is a signal surface provided on the surface of the mirror plate 15. A stamper 16 that forms D2, an inner peripheral stamper holder 17 that is disposed in an inner peripheral hole of the mirror plate 15 and holds the stamper 16, and a fixed sleeve 19 that is disposed in an inner peripheral hole of the inner peripheral stamper holder 17. An ejector sleeve 20 disposed in the inner peripheral hole of the fixed sleeve 19, a cylindrical male cutter 21 disposed in the inner peripheral hole of the ejector sleeve 20, and a protrusion fitted into the inner peripheral hole of the male cutter 21. It consists of a pin 22 and an outer stamper holder (not shown) that holds the outer periphery of the stamper 16.

Describing each part of the movable mold 12 as the first mold in detail, the mirror plate 15 is a thin cylindrical member, and the surface 15a on the cavity 14 side is mirror-finished. In addition, a cooling medium flow path 15b for flowing a cooling medium is formed on the back surface of the mirror plate 15 (the side fixed to the movable back plate). In the present embodiment, the inner peripheral stamper holder 17 includes an inner peripheral cylindrical member 17a and an outer peripheral cylindrical member 17b. A claw portion 18 for pressing the stamper 16 is provided at the outer peripheral end of the cavity forming surface of the outer cylindrical member 17b. The inner peripheral stamper holder 17 may be formed from a single member.

In the present embodiment, the center hole 16a of the stamper 16 has an inner diameter of 34 mm, and the inner diameter is greatly different from that of a standard stamper having an inner diameter of about 22 mm. And the outer peripheral end 18a of the nail | claw part 18 of the inner peripheral stamper holder 17 is provided in the part of diameter 34.4mm. Accordingly, the width of the protruding portion of the claw portion 18 that presses the vicinity of the center hole 16a of the stamper 16 (the protruding dimension toward the outer peripheral side) is 0.2 mm. The diameter of the outer peripheral end 18a of the claw portion 18 is characterized in that the outer diameter is much larger than that of a typical DVD disk substrate molding die (diameter of about 22.3 mm). .

The cavity forming surface 17c of the inner peripheral stamper holder 17 including the upper surface 18b of the claw portion 18 is provided with an annular convex portion 24 for forming an annular groove D3 into which the wireless IC tag T as an electronic tag is inserted in the disk substrate D1. It has been. And the upper surface (including the upper surface 18b of the claw part 18) of the said annular convex part 24 consists of a plane, and is provided in 0.35 mm in height. In the present embodiment, the radial width of the annular protrusion 24 is 7.0 mm at the base and 6.9 mm at the top. Therefore, it is preferable that the majority of the cavity forming surface 17c of the inner peripheral stamper holder 17 includes the annular convex portion 24 in the area ratio including the cavity forming surface 17c of the inner peripheral cylindrical member 17a. In the present embodiment, the inner circumferential stamper holder 17 has a portion close to the inner circumferential surface that is flush with the fixed sleeve 19, but the entire inner circumferential stamper holder may be an annular convex portion.

In the above description, the diameter (outer diameter) of the annular convex portion 24 is preferably set to 20 mm to 36 mm, and this is adjusted by the diameters of the inner peripheral stamper holder 17 and the outer peripheral end 18 a of the claw 18. Further, it is preferable that the inner diameter of the annular convex portion is 18 mm to 30 mm. The radial width of the annular protrusion 24 is preferably set to 3.0 mm to 8.0 mm. In the above, the height of the annular protrusion 24 is set so that the wireless IC tag T is inserted without protruding from the annular groove D3 formed by the annular protrusion 24, and is 0.2 mm to 0.5 mm. Is preferred. This is because when the height of the annular convex portion 24 is lower than 0.2 mm, the claw portion 18 becomes thin and easily breaks, and the wireless IC tag T does not fit in the annular groove D3. On the other hand, when the height of the annular convex portion 24 is higher than 0.5 mm, the flow path becomes narrow when the molten resin is injected and filled into the cavity 14, which hinders molding. The width of the base portion of the annular convex portion 24 is desirably 3.0 mm to 8.0 mm, and the inner peripheral end and the outer peripheral end may be formed by a curved surface in section when connected to the upper surface, and are provided in a tapered shape. May be good. In addition, the said annular convex part may be a part from which some height differs, or the part which is not continuous, and it does not necessarily envisage providing double.

The electronic tag (wireless IC tag) T used in the present invention is also called an RFID tag or the like, and includes a circuit portion T1 and a ring-shaped antenna portion T2 connected to the circuit portion T1. The wireless IC tag T has a thickness of 0.3 mm in the circuit portion T1, and the antenna portion T2 has a thickness of 0.05 mm. The wireless IC tag T has a diameter (outer diameter) of 32 mm and an inner diameter of 21 mm. In this embodiment, the wireless IC tag T used in a disk such as a DVD having a diameter of 120 mm has a thickness of the thickest portion of 0.2 mm to 0.4 mm, a diameter (outer diameter) of 20 mm to 34 mm, and an inner diameter of 18 mm or more. Are planning things. This is because if the inner diameter is smaller than the above, it becomes difficult to form the annular convex portion 24 by a member such as an ejector, and if the diameter (outer diameter) is larger than the above, it will be applied to the information area D2 (signal surface). . The antenna of the wireless IC tag T is not limited to a complete ring shape, and other label type antennas may be used. In the present embodiment, the wireless IC tag is a battery-less read-only type, but a battery built-in type or a read / write type may also be used. Further, the electromagnetic wave method, the microwave communication method, and the like may be used for the radio wave method.

On the other hand, a fixed mold 13 as a second mold attached to a fixed plate of an injection molding machine (not shown) includes a fixed mirror plate 25 fixed to a fixed back plate (not shown) and an inner peripheral hole of the mirror plate 25. A gate insert 26, a mescutter 27 disposed in an inner peripheral hole of the gate insert 26, a sprue bush 28 disposed in an inner peripheral hole of the mescutter 27, and the like. The mirror plate 25 is a thin cylindrical member, and the cavity forming surface 25a is mirror-finished. Further, a cooling medium flow path 25b for flowing a cooling medium is formed on the back surface (the side fixed to the fixed back plate) of the mirror plate 25. A sprue bush 28 is disposed in the inner peripheral hole of the mescutter 27, and the front end surface of the sprue bush 28 is disposed so as to recede from the movable mold facing surface of the mescutter 27. Note that the mescutter may be provided so that the inner peripheral hole side of the movable mold facing surface slightly protrudes as a countermeasure against burrs formed in the center hole D7 of the disk substrate D1. In addition, when using the wireless IC tag having a ring diameter that is even smaller than the above, it is assumed that an annular convex portion is provided only on the mescutter or on the mescutter and the gate insert. Further, although not shown in the present embodiment, the fixed mold 13 may be formed with an annular groove for forming a stack rib.

In the positional relationship between the movable mold 12 and the fixed mold 13, a fixed-side mirror plate 25 is disposed substantially opposite to the movable-side stamper 16. A cavity forming surface of the gate insert 26 is disposed substantially opposite to the annular convex portion 24 of the inner stamper holder 17. Further, a mescutter 27 is disposed substantially opposite to the ejector sleeve 20. Further, a sprue bush 28 is disposed substantially opposite to the male cutter 21, and the tip of the male cutter 21 provided so as to be able to move forward is fitted into the mescutter 27.

Next, a disk substrate D1 formed by the disk substrate molding die 11 of the present embodiment and a method of manufacturing a DVD disk D (DVD is a registered trademark) manufactured using the disk substrate D1 will be described with reference to FIGS. Will be described. FIG. 2 is an enlarged cross-sectional view of the DVD disk of this embodiment.

First, a procedure for forming the disc substrate D1 having one information area of the DVD disc D shown in FIG. 2 will be described. A mold clamping device of an injection molding machine (not shown) is operated to move the movable mold 12 attached to the movable platen, thereby closing the mold. When the mold is closed, the movable mold 12 is fitted to the fixed mold 13 attached to the fixed platen, and the distance between the stamper 16 and the cavity forming surface 25a of the mirror plate 25 on the fixed side is approximately 0.65 mm. In this position, the movable mold 12 is stopped, and a variable volume cavity 14 is formed. In addition, the space | interval of the upper surface of the cyclic | annular convex part 24 and the cavity formation surface of a gate insert in that case is 0.30 mm.

Next, the screw of the injection device (not shown) is moved forward, and the molten resin in the heating cylinder of the injection device passes through the nozzle of the injection device and the sprue bush 28 of the fixed mold 13 in contact with the nozzle. 14 is injected and filled. In this embodiment, polycarbonate is used as the thermoplastic transparent resin, and is injected and filled into the cavity 14 at a nozzle temperature of 350 ° C. to 380 ° C. Then, when the molten resin is injected and filled into the cavity 14, the mold clamping device is restarted at the same time or slightly back and forth to advance the movable mold 12 toward the fixed mold 13, and the molten resin in the cavity 14 is moved forward. So that a good transfer can be performed.

The molten resin injected and filled into the cavity 14 is cooled and solidified by the cooled disk substrate molding die 11 in parallel with the formation of the center hole D7 by the compression and advancement of the male cutter 21. When the molten resin is cooled and solidified in the cavity 14, the movable mold 12 is moved backward while the mold release air is applied between the cavity forming surface of the mold and the disk substrate D1, and the mold is opened.

The disk substrate D1 (one disk substrate) formed according to the present embodiment has a thickness of 0.6 mm, a diameter of 120 mm, and a diameter of the center hole D7 of 15 mm (all including the allowable forming error range). . The disk substrate D1 has a claw portion 18 of the inner peripheral stamper holder 17 in a portion having a diameter of 20 mm to 34 mm concentric with the center hole D7 on one surface (the same surface as the information area D2 transferred by the stamper 16). An annular groove D <b> 3 is formed by the annular protrusion 24. In the present invention, the annular groove D3 is formed only by the injection molding process, and there is no need for subsequent cutting or the like.

Thereafter, the wireless IC tag T is inserted into the annular groove D3 by a robot (not shown) on the disk substrate D1 after cooling, aluminum vapor deposition and the like are completed. In the present embodiment, the wireless IC tag T does not use a metal-compatible long wave band, and the aluminum vapor deposition portion is provided so as not to contact the wireless IC tag T. However, it is not completely assumed that the present invention uses a metal-compatible wireless IC tag using a long wave band. In the present embodiment, the height of the annular groove D3 is 0.35 mm, and the thickness of the circuit portion T1 of the wireless IC tag T is 0.3 mm. Therefore, the wireless IC tag T does not protrude from the annular groove D3. Place and fix using an adhesive. The wireless IC tag T may be inserted sequentially when the center hole of the disk substrate is inserted through the insertion rod during cooling.

Separately from the disk substrate D1, the other disk substrate D4 is formed by a disk substrate molding die. In this embodiment, since the DVD disk D is DVD-9, the other disk substrate D4 also has an information area D2. The other disk substrate D4 may or may not have the annular groove D3. Then, after placing the other disk substrate D4 on a turntable (not shown), the adhesive D5 is applied to the surface, and one surface of the one disk substrate D1 into which the wireless IC tag T is inserted (the side of the information area D2). Are placed on the other disk substrate D4, and the rotating table is rotated to spread the adhesive D5.

At this time, since the wireless IC tag T does not protrude downward from the surface around the annular groove D3 of the one disk substrate D1, the adhesive D5 can be easily extended to the lower surface of the wireless IC tag T. Further, since the bonding is performed with one disk substrate D1 having the wireless IC tag T on the upper side, the wireless IC tag T does not interfere with the spread of the adhesive. Further, when manufacturing the DVD disk D to which the disk substrate D1 and the like are bonded, the wireless IC tag T is completely inserted into the annular groove D3, so that there is no influence when the thickness of the DVD disk is defined. Note that the adhesive D5 may extend from the wireless IC tag T to the inside, or may extend only to a part of the wireless IC tag.

In this embodiment, the other disk substrate to be bonded to one disk substrate D1 in which the annular groove D3 is formed is the disk substrate D4 having the information area D2, but it may be a dummy disk substrate. Further, a dummy stamper may be attached to the molding die 11 of the disk substrate to form one dummy disk substrate provided with the annular groove D3 and bonded to the disk substrate having the other information area. In addition, the present embodiment does not require the formation of the annular groove in the disk substrate formed by the mold for forming the other disk substrate, so that the conventional one can be used as it is and almost no modification is required. It is. However, the present invention does not completely exclude the case where the wireless IC tag T is inserted in a state of slightly protruding from the annular groove D3.

Next, another embodiment of the disk substrate mold 51 shown in FIG. 3 will be described. FIG. 3 is a cross-sectional view of a main part of a molding die for a disk substrate according to another embodiment. In the disk substrate molding die 51, a stamper 54 for forming a signal surface is disposed on the surface of the fixed-side mirror plate 53 in the stationary die 52 which is the first die. In the fixed mold 52, an inner peripheral stamper holder 55 is disposed in the inner peripheral hole of the mirror plate 53, and the stamper 54 is held by a claw portion 56 of the inner peripheral stamper holder 55. Further, the fixed mold 52 is provided with a mescutter 57 in an inner peripheral hole of the inner peripheral stamper holder 55, and a sprue bush 58 is disposed in the mescutter 57 at a retracted position.

The shape of the claw 56 of the inner stamper holder 55 is the same as that of the embodiment shown in FIG. Specifically, on the cavity forming surface 55a of the inner peripheral stamper holder 55 including the upper surface of the claw portion 56, an annular convex portion for forming an annular groove D3 into which the wireless IC tag T as an electronic tag is inserted in the disk substrate D1. 59 is provided. The annular convex portion 59 is provided with a height of 0.35 mm. Moreover, the width | variety of the cyclic | annular convex part 59 is provided over 7.0 mm. Therefore, most of the cavity forming surface of the inner peripheral stamper holder 55 is an annular convex portion 59. The numerical values and shapes such as the diameter (outer diameter and inner diameter), width, and height of the annular convex portion 59 are preferably the same as those in the embodiment shown in FIG.

A movable mold 61, which is the second mold of the embodiment shown in FIG. 3, is provided with a movable mirror plate 62 at a position substantially opposite to the stamper 54. A fixing sleeve 63 is disposed in the circumferential hole at a position substantially opposite to the inner circumferential stamper holder 55. In addition, an ejector sleeve 64 is disposed in the inner peripheral hole of the fixed sleeve 63 at a position facing the mescutter 57. The point that the volume-variable cavity 60 is formed between the fixed mold 52 and the movable mold 61 is the same as the disk substrate molding mold 11 shown in FIG.

Therefore, the disk substrate D1 formed by the disk substrate molding die 51 is substantially the same as the disk substrate D1 shown in FIG. Further, the forming procedure of the disk substrate D1 and the manufacturing procedure of the DVD disk D manufactured using the disk substrate D1 are also substantially the same, and thus the description thereof is omitted.

Next, a disk substrate molding die 71 of still another embodiment shown in FIG. 4 will be described. It is principal part sectional drawing of the shaping | molding die of the disc substrate of another embodiment. FIG. 5 is an enlarged cross-sectional view of a DVD disc according to still another embodiment. Still another embodiment shown in FIG. 4 corresponds to claim 2 and is for molding the dummy disk substrate D1a provided with the annular groove D3a shown in FIG. In the disk substrate molding die 71, the movable die 72, which is the third die, is not provided with a stamper on the surface 74 a of the mirror plate 74. The mirror surface plate 74 is for forming a blank area D6a on the disk substrate D1a. The surface 74a of the mirror surface plate 74 may be roughened in addition to the mirror surface processing, and is coated with a different material. May be good. A fixed sleeve 75 that is a cylindrical member is disposed on the inner periphery of the mirror plate 74. In the present embodiment, the fixed sleeve 75 includes an inner sleeve 75a and an outer sleeve 75b. Note that the fixing sleeve 75 may be composed of a single member. An ejector sleeve 76, a male cutter 77, and the like are disposed inside the fixed sleeve 75.

An annular convex portion 78 is formed near the outer peripheral end of the cavity forming surface 75c of the outer sleeve 75b. The position, height, and the like of the annular projection 78 are all the same as the annular projection 24 provided on the portion including the upper surface 18b of the claw portion 18 in FIG. 1, and the preferred range is also the same. The fixed mold 73 in the molding die 71 for the disk substrate shown in FIG. 4 is substantially the same as the embodiment shown in FIG. In addition, it is also possible to provide a mirror plate or a ring-shaped convex portion for forming a blank area on the fixed mold side of the disk substrate molding die 71 shown in FIG.

Then, a procedure for forming one dummy disk substrate D1a formed by the disk substrate molding die 71 and the dummy disk substrate D1a and the disk substrate D4a having the other information area D2a are bonded together to form a DVD disk Da (DVD-5). The procedure for producing a) is also substantially the same. That is, the wireless IC tag T is attached with an adhesive to the annular groove D3a of the dummy disk substrate D1a having the blank area D6a, and the adhesive is applied to the upper surface of the disk substrate D4a having the other information area D2a placed below, Above that, one dummy disk substrate D1a provided with the wireless IC tag T is overlapped and rotated to spread the adhesive D5a. Note that one dummy disk substrate D1a provided with a wireless IC tag may be placed below and bonded.

In the embodiment of FIG. 2 and the embodiment of FIG. 5 described above, the example in which the annular groove D3 or the annular groove D3a for inserting the wireless IC tag T is formed on one surface bonded by the adhesive is described. An annular groove into which the wireless IC tag is inserted may be formed on the other surface that becomes the outside when bonded. In that case, the height of the claw portion of the inner peripheral stamper holder should be made as low as possible or the same as the surface of the stamper, and the cavity forming surface of the member constituting the mold on the side facing the inner peripheral stamper holder An annular projection is provided. Furthermore, the present invention is not limited to a bonded disc such as a DVD, but can also be applied to a CD or a Blu-ray disc (registered trademark). In those examples, a process of applying an adhesive to the annular groove after inserting the wireless IC tag into the annular groove formed by the annular protrusion, and fixing and embedding the wireless IC tag is performed.

The disc provided with the wireless IC tag is not limited to a disc such as a DVD, CD, or Blu-ray disc having a diameter of 120 mm, and the outer diameter and the diameter of the center hole are not limited. In these disks, the diameter (inner diameter and outer diameter) of the wireless IC tag is also selected according to the inner diameter of the information area of the disk and the diameter of the center hole. The present invention can also be applied to a substantially circular disk or a card-type disk having a corrugated periphery. There are various uses of discs with these wireless IC tags inserted, such as those that also serve as admission tickets, anti-theft or price reading, as well known, along with the widespread use of wireless IC tags and the accompanying price reduction, In addition, the use is expected to expand.

The present invention is not enumerated one by one, but is not limited to the one in the above-described embodiment, and it goes without saying that the present invention is applied to those modified by a person skilled in the art based on the gist of the present invention. It is.

It is principal part sectional drawing of the shaping | molding die of the disc substrate of this embodiment. It is an expanded sectional view of the DVD disk of this embodiment. It is principal part sectional drawing of the shaping | molding die of the disc substrate of another embodiment. It is principal part sectional drawing of the shaping | molding die of the disc substrate of another embodiment. It is an expanded sectional view of the DVD disc of another embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Disc substrate shaping die 12 Movable die 13 Fixed die 14 Cavity 15, 25 Mirror plate 15a Surface 15b, 25b Cooling medium flow path 16 Stamper 17 Inner peripheral stamper holder 18 Claw part 19 Fixed sleeve 20 Ejector sleeve 21 Oscutter 22 Projection pin 24 Annular convex part 26 Gate insert 27 Mess cutter 28 Sprue bush D DVD disk D1, D4 Disc substrate D2 Information area D3 Annular groove D5 Adhesive D7 Center hole T Wireless IC tag T1 Circuit part T2 Antenna part

Claims (4)

In a disk substrate molding die for molding a disk substrate in a cavity formed between a first mold and a second mold,
The first mold is provided with a stamper and an inner periphery stamper holder that holds the vicinity of the center hole of the stamper with a claw portion,
A molding die for a disk substrate, wherein an annular convex portion for forming an annular groove into which an electronic tag is inserted is provided on a cavity forming surface of an inner peripheral stamper holder including an upper surface of the claw portion. In a molding die for a disc substrate for molding a dummy disc substrate having a blank area to be bonded to a disc substrate having an information area in a cavity formed between a third die and a fourth die,
The third mold is provided with a mirror plate that forms the blank area, and a cylindrical member is provided inside the mirror plate.
A molding die for a disk substrate, wherein an annular protrusion for forming an annular groove into which an electronic tag is inserted is provided on a cavity forming surface of the cylindrical member. An electronic tag is inserted into an annular groove of one disk substrate formed by an annular protrusion provided on the disk substrate molding die according to claim 1 or 2, and bonded to the other disk substrate. A method for manufacturing a disc. An electronic tag is inserted into an annular groove of one disk substrate formed by an annular protrusion provided on the disk substrate molding die according to claim 1 or 2, and bonded to the other disk substrate. Disc that features.

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