JP2007103844A - Electronic circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit board which reinforces a return current passage on a printed board, and is provided with a method for suppressing a secondary effect expected to occur due to addition of a conductor component for the reinforcement. <P>SOLUTION: The electronic circuit board has a wiring board carrying electronic components to compose an electronic circuitry. To suppress unnecessary electromagnetic radiation from the electronic circuit board, a conductor component 1a is mounted across integrated circuits 2, 3. Further, the conductor component 1a is connected to the conductor 21 of the integrated circuit 2 and to the conductor 31 of the integrated circuit 3 in high-frequency connection, using a capacity 22 generated between the conductor component 1a and the conductor 21 of the integrated circuit 2 and a capacity 32 generated between the conductor component 1a and the conductor 31 of the integrated circuit 3, to reinforce a return passage for a high-frequency current 41. To suppress a secondary effect expected to occur due to addition of the conductor component 1a; a control material 82, such as an insulator and a magnetic material, is interposed between the integrated circuits 2, 3 and the conductor component 1a mounted thereon to control the capacity. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic circuit board, and more particularly to an electronic circuit board subjected to an EMI countermeasure technique for suppressing electromagnetic radiation.

  When a current loop composed of the output current of the integrated circuit and its return current is large, a strong electromagnetic wave is radiated. Therefore, as a countermeasure against EMI (electromagnetic interference), the electromagnetic wave radiated by making this loop as small as possible is reduced. It is generally done to suppress.

  In the conventional example, for example, a component or board wiring in which electromagnetic radiation is a problem is covered and shielded with a conductor, but the conductor provided for shielding needs to be in contact with the ground on the board. For this reason, there is a problem that the pattern design of the substrate is restricted.

In the multilayer printed wiring board disclosed in Patent Document 1, a return current path is secured by using a ground plane in a layer adjacent to a signal line through which a high-frequency current flows. Further, in the electronic circuit board disclosed in Patent Document 2, a radiation noise countermeasure board for preventing the generation of radiation noise from the wiring board is soldered and mounted on the wiring board constituting the electronic circuit, and the radiation noise countermeasure board is mounted on the circuit board. Is provided with a capacitor for noise removal.
JP 2001-53454 A JP 2000-40859 A

Regarding the intensity of electromagnetic waves radiated when an electronic device is operated, there is a restriction on the electric field strength for each country, and it is required to keep it below a certain level. In recent years, measures for ensuring a return current path corresponding to a high-frequency current flowing through wiring on a substrate and efficiently returning noise to a signal source have become mainstream. On the other hand, due to miniaturization of equipment and cost reduction, there are many cases where the path of the return current cannot be secured sufficiently on the printed circuit board. The return current path is divided and the number of layers of the multilayer board is reduced to reduce costs, so that the return current path is wide enough to secure the return current path in the layer adjacent to the high-frequency current circuit. As a result, the return current path is bypassed and a large loop is formed to increase the radiation of unnecessary electromagnetic waves in many cases.

  In order to solve this problem, there is a need for reinforcing a return current path when a sufficient return current path cannot be secured on a printed circuit board, and a method for suppressing side effects that are expected to occur due to the reinforcement.

  An object of the present invention is to provide an electronic circuit board provided with a method for suppressing a secondary action that is supposed to be generated by adding a conductor part for reinforcement, in which a return current path on the printed board is reinforced. There is to do.

The electronic circuit board of the present invention is
In an electronic circuit board having an electronic component having a conductor portion and a wiring board on which the electronic component is mounted and connected to the electronic component via the conductor portion, at least one electronic component is disposed between the electronic components. Is characterized in that it has a conductor component that is connected in a high-frequency manner by using a capacitance generated between the electronic component and the conductor portion.

  Any of the electronic components may be an integrated circuit, may be an integrated circuit and a terminal component, and the conductor component may be fixed to the outer surface of the integrated circuit. It may be connected directly or indirectly.

  The conductor part may be provided directly on the surface of the integrated circuit where the conductor part is attached, or a control material may be provided between the conductor part and the surface of the integrated circuit where the conductor part is attached. May be an insulator or may contain a magnetic material.

  A sealing material having a dielectric constant higher than that of a normal sealing material may be used as the entire sealing material of the conductor portion of the integrated circuit or only as the material of the upper portion of the conductor portion.

  The conductor component may have a skirt portion provided so as to shield an electromagnetic wave radiated from a circuit of a high-frequency current flowing on the wiring board between the electronic components when attached to the electronic component.

  When a large loop is formed by bypassing the high-frequency current circuit and the return current path by providing a conductor component to reinforce the return current path of the high-frequency current flowing on the wiring board between the electronic components However, unnecessary electromagnetic radiation can be reduced.

  Occurrence occurs by providing a control material between the conductor component and the mounting surface of the integrated circuit of the integrated circuit, and connecting the conductor component and the conductor portion of the integrated circuit at a high frequency using the capacitance generated therebetween. The assumed secondary effect can be suppressed, and the transmittance with respect to the frequency can be controlled by using an insulator or a magnetic material as the control material. Further, by using a material having a high dielectric constant as the sealing material for the conductor portion of the integrated circuit, the secondary action can be similarly suppressed.

  Radiation of unnecessary electromagnetic waves can be reduced by providing a skirt on the conductor parts to shield the electromagnetic waves radiated from the high-frequency current circuit flowing on the wiring board.

  The present invention makes use of a capacitance generated between a conductor part of an integrated circuit by placing a plate-like conductor part on the integrated circuit even if it is difficult to directly connect the electronic part with the conductor part. By connecting in high frequency, the return current path of the high frequency current is reinforced, so the return current of the high frequency current flowing through the high frequency current loop can be reduced, and even if a detour occurs in the return path, There is an effect that radiation of electromagnetic waves is suppressed.

  In addition, an insulator is sandwiched between the integrated circuit and the conductor component mounted on it, and the capacitance between the integrated circuit conductor and the conductor component is controlled by changing the thickness and dielectric constant, thereby improving the impedance to high-frequency current. Since the frequency characteristics can be provided, for example, there is an effect that noises existing in the integrated circuit or in the vicinity thereof can be transmitted to an unnecessary place, or a side effect that a conductive component becomes an antenna to generate unnecessary radiation can be suppressed. . Further, the same effect can be obtained by changing all of the sealing material for sealing the integrated circuit or only the upper material of the conductor portion of the integrated circuit to one having a higher dielectric constant. In addition, when an insulator including a magnetic material is sandwiched, it is possible to control the frequency characteristics opposite to the above-described capacitance control by controlling the amount and material of the magnetic material.

  Moreover, since the conductor on the substrate can be covered by providing the skirt portion on the conductor component, a shielding effect can be obtained against electromagnetic waves radiated by the high-frequency current flowing through the conductor on the substrate.

  In the present invention, in order to suppress unnecessary electromagnetic radiation from an electronic circuit board having a wiring board on which an electronic component is mounted and which constitutes an electronic circuit, between integrated circuits in which a high-frequency current flows on a printed board or between the integrated circuit and the terminal The return path of the high-frequency current flowing on the board between the components is reinforced, and the secondary effects that are expected to occur due to the addition of the conductor components for reinforcement are suppressed. To reinforce the return path of the high-frequency current, in an integrated circuit where it is difficult to connect both parts directly with a conductor part, a plate-like conductor part is placed on top of the integrated circuit, and the capacitance generated between the conductor part of the integrated circuit is reduced. It is used to connect at high frequency, and as a secondary action suppression, the capacity can be controlled by inserting an insulator between the integrated circuit and the conductor part attached on it, By using a material such as a magnetic material that converts electromagnetic waves into heat for the insulator, it is possible to give frequency characteristics opposite to the capacity control by the insulator, or to the electromagnetic waves radiated by the high-frequency current flowing through the conductor on the substrate. On the other hand, the shielding effect by the member provided in the conductor component is obtained.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view of an electronic circuit board to which an EMI countermeasure technique for suppressing electromagnetic wave radiation according to the first embodiment of the present invention is applied. Here, an example in which the integrated circuit 2 and the integrated circuit 3 are connected by the conductor component 1a to enhance the securement of the return current path of the high-frequency current is shown in a schematic sectional view of the component mounted on the substrate. Yes.

  When the signal wiring 4 and the return wiring 5 are arranged on any two wiring layers of the printed circuit board 7, the high-speed signal output from the integrated circuit 2 is input to the integrated circuit 3 through the signal wiring 4 on the printed circuit board 7. The high frequency current 41 reaches the integrated circuit 3 from the integrated circuit 2 through the signal wiring 4 on the printed circuit board 7. Further, the return current 51 of the high frequency current 41 returns from the integrated circuit 3 to the integrated circuit 2 through the through hole 61, the return wiring 5, and the through hole 62.

  The radiation of electromagnetic waves generated when the high-frequency current 41 and the return current 51 flow through this loop increases as the area of the portion surrounded by the loop increases, and decreases as the flowing high-frequency current decreases. In the high-frequency current loop formed by the integrated circuit 2 → signal wiring 4 → integrated circuit 3 → through hole 61 → return wiring 5 → through hole 62 → integrated circuit 2 in FIG. If wiring is not possible in the immediate vicinity, and if the circuit is largely detoured, the loop area of the current increases and unnecessary radiation increases.

  In the first embodiment, the conductor component 1a is provided across the integrated circuit 2 and the integrated circuit 3, and a part of the return current 51 is caused to flow as the current 11 in the conductor component 1a to flow through the above-described high-frequency current loop. The return current 51 of the high-frequency current is reduced, thereby suppressing the radiation of electromagnetic waves from the loop. The current 11 flowing through the conductor part 1a is generated between the conductor part 31 of the integrated circuit 3 → the capacitance 32 generated between the conductor part 31 and the conductor part 1a → the conductor part 1a → the conductor part 21 of the integrated circuit 2 and the conductor part 1. It flows toward the integrated circuit 2 through a path of the capacitance 22 → the conductor portion 21 generated between them. The conductor component 1a is only required to be physically fixed to the upper parts of the integrated circuits 2 and 3, and may be affixed with, for example, an adhesive or a double-sided tape.

  Further, since the conductor component 1a is outside the board, it can be attached near the signal wiring 4 connecting the integrated circuit 2 and the integrated circuit 3 regardless of the board design. The integrated circuit 2 → signal wiring 4 → Since the current loop area of the conductor part 31 of the integrated circuit 3 → the capacitor 32 → the conductor part 1a → the capacitor 22 → the conductor part 21 of the integrated circuit 2 can be minimized, the radiation of electromagnetic waves from the loop is small, and the electronic circuit board 10 The electromagnetic radiation as a whole is suppressed.

  Next, an electronic circuit board to which an EMI countermeasure technique for suppressing electromagnetic wave emission according to the second embodiment of the present invention is described will be described. FIG. 2 is a schematic cross-sectional view of an electronic circuit board to which an EMI countermeasure technique for suppressing electromagnetic wave radiation according to the second embodiment of the present invention is applied. Here, an example in which the integrated circuit 2 and the terminal component 9 are connected by the conductor component 1b to enhance the return current path of the high-frequency current is shown in a schematic cross-sectional view of the component mounted on the substrate. Yes. The first embodiment is the same as the first embodiment except that the integrated circuit 3 of the first embodiment is replaced with the terminal component 9 and the shape of the mounting portion of the conductor component 1a is replaced with the conductor component 1b. Since it is the same as the embodiment, the same components are denoted by the same reference numerals as those in the first embodiment, and detailed description thereof is omitted.

  In the first embodiment, the high-frequency current 41 flows between the two integrated circuits 2 and 3. However, in the second embodiment, the high-frequency current 41 flows from the integrated circuit 2 to the terminal component 9. . In the case of the second embodiment, when a high-speed signal output from the integrated circuit 2 is input to the terminal component 9 via the signal wiring 4 on the printed circuit board 7, the high-frequency current 41 is transferred from the integrated circuit 2 to the printed circuit board 7. The terminal component 9 is reached through the signal wiring 4. Further, the return current 51 of the high-frequency current 41 returns from the terminal component 9 to the integrated circuit 2 through the through hole 61, the return wiring 5, and the through hole 62.

  Also, the conductor component 1b is provided across the integrated circuit 2 and the terminal component 9, and the conductor component 1b is different from the first embodiment in that it is connected to the return wiring 5 from the terminal component 9. Normally, there are many metal parts connected to the ground where the return wiring 5 is formed around the terminal component 9 and its surroundings, so the metal parts are directly contacted by various methods such as screwing, soldering, spring contact, etc. And conduction can be obtained. Further, even in the terminal component 9 that does not have a metal portion connected to the ground, high-frequency conduction can be obtained with the conductor portion using the capacitance (not shown) of the terminal component 9 as in the first embodiment. it can.

  By flowing a part of the return current 51 as the current 11 through the conductor component 1b, the return current 51 of the high frequency current can be reduced, and the electromagnetic wave from the electronic circuit board 10 can be reduced as described in the first embodiment. Radiation is suppressed. The current 11 flowing through the conductor part 1b flows toward the conductor part 21 of the integrated circuit 2 through a path of a capacitor 22 generated between the terminal part 9 → the conductor part 1b → the conductor part 21 of the integrated circuit 2 and the conductor part 1b.

  Next, an electronic circuit board to which an EMI countermeasure technique for suppressing electromagnetic wave emission according to a third embodiment of the present invention is described. FIG. 3 is a schematic cross-sectional view of an electronic circuit board to which an EMI countermeasure technique for suppressing electromagnetic wave radiation according to the third embodiment of the present invention is applied. Here, as shown in the first and second embodiments, the integrated circuit 2 and the integrated circuit 3 or the terminal component 9 are connected by the conductor component 1a or 1b, and a high-frequency current is generated using the capacitance generated between the conductors. A method for controlling the frequency characteristics of the high-frequency current generated as a secondary effect on the transmitted high-frequency current when the return path is secured is shown in a schematic cross-sectional view with components mounted on the board. Yes. The first embodiment is the same as the first embodiment except that the control material 81 and the control material 82 are provided between the conductor component 1a of the first embodiment and the integrated circuit 2 and the integrated circuit 3. Since the same components are the same as those in the first embodiment, the same reference numerals as those in the first embodiment are given, and detailed description thereof is omitted. Also in the second embodiment, the object can be achieved by providing the control material 81 between the integrated circuit 2 and the conductor component 1b.

  Various high-frequency currents flow on the substrate. By attaching the conductor component 1, for example, noise existing in the integrated circuit 2 or in the vicinity thereof is transmitted to an unnecessary place, or the conductor component 1 serves as an antenna to generate unnecessary radiation. Possible side effects may occur.

  In order to avoid this problem, it is necessary to suppress conduction as much as possible for the high-frequency current having a frequency at which a side effect occurs for the high-frequency current having a frequency causing unwanted radiation while allowing the current 11 to sufficiently flow to enhance the return current. is there. For this reason, in the third embodiment, control materials 81 and 82 are provided between the conductor component 1 and the integrated circuit 2 and the integrated circuit 3.

The capacitance C between the two conductors is a general formula indicating the capacitance of the capacitor,
C = ε * (S / d)
(Ε is the dielectric constant specific to the substance between the two conductors, S is the area of the conductor, and d is the distance between the conductors)
As shown by the above, since it is proportional to the dielectric constant and area of the substance existing between the conductors and inversely proportional to the distance between the conductors, the control material 81 attached between the integrated circuit 2 and the integrated circuit 3 and the conductor component 1 The capacitor 22 and the capacitor 23 can be controlled by changing the thickness and dielectric constant of the control material 82. In this case, for example, if the capacity is reduced, current easily flows at a high frequency, but current at a low frequency hardly flows. Conversely, when a magnetic material or the like is used as the control material 81 and the control material 82, the transmittance decreases as the frequency increases, so that the current easily flows for a low frequency current. It becomes difficult to flow. Furthermore, it is possible to obtain characteristics that facilitate conduction only to a specific frequency by combining these. Next, an electronic circuit board on which an EMI countermeasure technique for suppressing electromagnetic wave emission according to the fourth embodiment of the present invention is applied. Will be described. FIG. 4 is a schematic cross-sectional view of an integrated circuit on an electronic circuit board to which an EMI countermeasure technique for suppressing electromagnetic wave radiation according to the fourth embodiment of the present invention is applied. Here, when the integrated circuit 2 and the integrated circuit 3 are connected by the conductor component 1 and the securing of the return path of the high-frequency current is strengthened by using the capacitance generated between the conductors, the frequency characteristic of the transmitted high-frequency current is controlled. Is shown in a schematic sectional view showing the configuration of the integrated circuit. In the first embodiment, all of the sealing material of the conductor portion 21 of the integrated circuit 2 of the first embodiment or the material 24 only on the top of the conductor portion 21 is changed to a material having a higher dielectric constant. Since this is the same as that of the first embodiment, only the vicinity of the integrated circuit 2 is shown, and the same components are denoted by the same reference numerals as those of the first embodiment and detailed description thereof is omitted.

  Normally, the integrated circuit 2 is sealed with a mold or the like, but by changing the whole sealing material or only the upper material 24 of the conductor portion 21 of the integrated circuit to a higher dielectric constant as shown in FIG. The capacity 22 between the conductor component 1 can be increased. The same applies to the integrated circuit 3, and the material of either or both of the integrated circuit 2 and the integrated circuit 3 or only the upper portion of the conductor portion 21 may be changed in accordance with the target frequency characteristics. You may use together with the method of this form.

  Next, an electronic circuit board to which an EMI countermeasure technique for suppressing electromagnetic wave emission according to a fifth embodiment of the present invention is described will be described. FIG. 5 is a schematic cross-sectional view of an electronic circuit board to which an EMI countermeasure technique for suppressing electromagnetic wave radiation according to the fifth embodiment of the present invention is applied. Here, as shown in the first to fourth embodiments, the integrated circuit 2 and the integrated circuit 3 or the terminal component 9 are connected to each other by the conductor component 1a or 1b, and a high-frequency current is generated using the capacitance generated between the conductors. When the securing of the return path is strengthened, when the control member 81 is provided between the conductor parts 1a, 1b and the integrated circuit 2, the whole sealing material of the integrated circuit 2, or the material only on the conductor portion 21 In the case where 24 is changed to one having a higher dielectric constant, a method for further suppressing leakage of electromagnetic waves in the lateral direction from the signal wiring 4 is shown in a schematic cross-sectional view in a state where components are mounted on the substrate. Yes. The first embodiment is the same as the first embodiment except that the skirt portion 1d is provided on the conductor component 1a of the first embodiment, so the same components are the same as the first embodiment. The same reference numerals are assigned and detailed description is omitted. Although FIG. 5 has been described with respect to the first embodiment, the present invention can also be applied to the second to fourth embodiments.

  The conductor component 1c according to the fifth embodiment includes a skirt portion orthogonal to the conductor components 1a and 1b on the side walls on both sides parallel to the signal wiring 4 of the conductor components 1a and 1b according to the first and second embodiments. 1d is provided and has a U-shape that covers the signal wiring 4. By attaching the conductor component 1c so as to cover the signal wiring 4, a shielding effect against electromagnetic waves radiated from the signal wiring 4 can be obtained. Here, both sides of the conductor component are bent at the time of the U, but the shape is not limited to this, and a shape that can suppress the radiation of the electromagnetic wave from the signal wiring 4 corresponding to the arrangement of the components on the electronic circuit board 10. If it is.

  In the embodiments described so far, an integrated circuit that inputs and outputs a high-frequency signal is taken as an example. However, the present invention is not limited to this. For example, a high-frequency signal other than the integrated circuit such as a crystal oscillator and a high-frequency circuit is input and output. It can be applied as an EMI countermeasure technique for suppressing electromagnetic radiation of components and circuits.

  Next, examples of the effect of suppressing electromagnetic wave radiation according to the embodiments described so far will be specifically described. FIG. 6 is a graph showing the electric field strength with respect to the frequency of the radiated data in the state where the EMI countermeasure is not taken for the electronic circuit board having the integrated circuit and the terminal component used as an example, and FIG. 7 is the electronic circuit board of FIG. FIG. 8 is a graph showing the electric field strength with respect to the frequency of the radiation data when the countermeasure of the second embodiment is performed, and FIG. 8 is a graph when the countermeasure of the third embodiment is performed on the electronic circuit board of FIG. It is a graph which shows the electric field strength with respect to the frequency of radiation | emission data.

  In FIG. 6, the electric field intensity of the radiation 101 near 950 MHz is strong and a countermeasure is required. This is because the noise of the integrated circuit 2 for signal processing is radiated through the terminal component 9 for signal input. On the other hand, the conductor component 1 is placed on the upper portion of the integrated circuit 2 as in the second embodiment. When one end of the conductor component 1 was connected to the ground metal portion of the terminal component 9 in question, the electric field intensity of the radiation 101 near 950 MHz decreased as shown in FIG.

  Although the radiation 101 which has been a problem in the data of FIG. 6 is greatly improved by the execution of the second embodiment, a new radiation 102 is generated between 650 MHz and 750 MHz as a side effect. The generation of the radiation 102 is due to the fact that the noise in the vicinity of the integrated circuit 2 is transmitted to the terminal component 9 and the new radiation is generated by connecting the conductor component 1.

  In the general impedance expression “Z = 1 / (2πfc)” obtained from the capacity and frequency, Z represents the difficulty of the high-frequency current at the frequency f, and c corresponds to the capacity 22 of the present invention. By increasing the value of 22, the component corresponding to the radiation 102 flowing through the conductor component 1 can be reduced.

  A control member 81 is inserted between the integrated circuit 2 and the conductor member 1 of the second embodiment as in the third embodiment. Here, an insulating component is inserted as the control member 81. As a result, the distance between the conductors increased, the capacitance 22 of the second integrated circuit 2 decreased, and the radiation 102 was suppressed as shown in FIG.

  Further, in the case where the phenomenon of the secondary action is realized only by the equation of Z = 1 / (2πfc), in FIG. 8, the radiation 101 should also be worse than that in FIG. There is no change due to factors such as the presence of errors and measurement errors. In any case, it does not deteriorate beyond the value that requires the countermeasure shown in FIG.

It is typical sectional drawing of the electronic circuit board which gave the EMI countermeasure method for suppressing electromagnetic wave radiation of the 1st Embodiment of this invention. It is typical sectional drawing of the electronic circuit board which gave the EMI countermeasure method for suppressing electromagnetic wave radiation of the 2nd Embodiment of this invention. It is typical sectional drawing of the electronic circuit board which gave the EMI countermeasure method for suppressing electromagnetic wave radiation of the 3rd Embodiment of this invention. It is typical sectional drawing of the integrated circuit of the electronic circuit board which gave the EMI countermeasure method for suppressing electromagnetic wave radiation of the 4th Embodiment of this invention. It is typical sectional drawing of the electronic circuit board which gave the EMI countermeasure method for suppressing electromagnetic wave radiation of the 5th Embodiment of this invention. It is a graph which shows the electric field strength with respect to the frequency of radiation | emission data in the state where the EMI countermeasure of the electronic circuit board used as an Example is not performed. It is a graph which shows the electric field strength with respect to the frequency of radiation | emission data when the countermeasure of 2nd Embodiment is performed to the electronic circuit board of FIG. It is a graph which shows the electric field strength with respect to the frequency of radiation | emission data when the countermeasure of 3rd Embodiment is performed to the electronic circuit board of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a, 1b, 1c Conductor component 1d Skirt part 2, 3 Integrated circuit 4 Signal wiring 5 Return wiring 7 Printed circuit board 9 Terminal component 10 Electronic circuit board 11 Current 21, 31 Integrated circuit conductor part 22, 32 Capacity 24 Upper part of conductor part Material 41 High frequency current 51 Return current 61, 62 Through hole 81, 82 Control material

Claims (11)

In an electronic circuit board having an electronic component having a conductor portion, and a wiring board on which the electronic component is mounted and connected to the electronic component via the conductor portion,
The electronic component is disposed between the electronic components, and at least one of the electronic components includes a conductive component that is connected in a high frequency using a capacitance generated between the electronic component and a conductor portion of the electronic component. Electronic circuit board.   The electronic circuit board according to claim 1, wherein each of the electronic components is an integrated circuit.   The electronic circuit board according to claim 1, wherein the electronic component is an integrated circuit and a terminal component.   The electronic circuit board according to claim 2, wherein the conductor component is fixed to an outer surface of the integrated circuit.   The electronic circuit board according to claim 3, wherein the conductor component is directly or indirectly connected to a return path of a high-frequency current of the terminal component.   5. The electronic circuit board according to claim 1, wherein the conductor component is directly provided on a mounting surface of the integrated circuit. 5.   The electronic circuit board according to any one of claims 1 to 4, wherein a control material is provided between the conductor component and a mounting surface of the integrated circuit.   The electronic circuit board according to claim 7, wherein the control material is an insulator.   The electronic circuit board according to claim 7, wherein the control material includes a magnetic material.   5. The sealing material having a dielectric constant higher than that of a normal sealing material is used as all of the sealing material of the conductor portion of the integrated circuit or only as the material of the upper portion of the conductor portion. The electronic circuit board according to claim 1.   2. The conductor part has a skirt portion provided so as to shield an electromagnetic wave radiated from a circuit of a high-frequency current flowing on the wiring board between the electronic parts when attached to the electronic parts. The electronic circuit board according to claim 1.

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