JP2007039779A - Method and apparatus for plating inner surface of hollow shaped article - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively form a nobel metal plated layer stable in property on a required area of the inner surface of a hollow shaped article with a small quantity of a plating solution. <P>SOLUTION: In the method and apparatus for plating the inner surface of the hollow shaped article, an insulating spacer 5, into which anodic electrode 4 is inserted, is arranged on the inner surface 2 of the hollow shaped article 1. A through hole 7 for the plating solution which is formed on a cylindrical main body 5a of the insulating spacer 5 is perforated at a position corresponding to the required inner surface area A of the noble metal plated layer 3. In the insulating space 5, the noble metal plated layer 3 is deposited and formed on the required inner surface area A by injecting the plating solution through the through hole 7. The injection of the plating solution is carried out with an adequate method such as a syringe and further, but by providing an injection pipe 8 and an overflow reservoir 9 the plating solution can be easily managed, which contribute to resource saving. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for plating an inner surface of a hollow article, and in particular, a noble metal plating layer is effectively applied to a required inner surface area on the inner surface of the hollow article, and the workability and safety are ensured respectively. The present invention relates to a plating processing technique.

Conventionally, when a noble metal plating is performed on a conductive material such as copper, generally, a method of immersing the entire material as it is in a plating solution is known. According to this method, even when there is an unnecessary portion for plating, the inner surface of the hollow article is plated as it is. That is, there is a problem that a necessary noble metal plating cannot be effectively applied to a necessary portion.
Further, although it is known to mask an unnecessary portion of plating with an electrical insulator in advance, there is a basic problem that a pretreatment process is required.
Furthermore, the conventional method has a disadvantage that a large amount of plating solution must be supplied into the bath.

The problem to be solved is that the inner surface plating method and apparatus for hollow-shaped articles use a small amount of plating solution and do not have a pretreatment process such as masking, and effectively attach a noble metal plating layer to the required inner surface area. It can be formed, and its workability and safety are ensured.
For this reason, in the inner surface plating method and apparatus therefor according to the present invention, the object is to basically eliminate these problems, and the purpose is to efficiently perform a plating process with good quality properties. It is said.

  In the inner surface plating method for a hollow article according to claim 1 of the present invention, a required inner surface area of the noble metal plating layer is set on the inner surface of the hollow article made of a conductive material such as copper, and the plating solution passes therethrough. The inner surface plating of the hollow shaped article in which the noble metal plating layer is formed in the required inner surface area by using the hollow shaped article as the negative electrode with respect to the positive electrode inserted in the cylindrical insulating spacer having the hole. In the method, the precious metal plating layer is formed by being charged through a through hole of an insulating spacer corresponding to the required inner surface area by injecting a plating solution into the insulating spacer after being charged. It is characterized by that.

According to the above-described configuration, the noble metal plating layer has a necessary inner surface area, so that it is only necessary to perform plating on only a necessary portion, which is efficient.
In addition, since the plating solution is injected into the hollow article through the insulating spacer, it can be used in a small amount, and since it is injected after being charged, premature precipitation of precious metal ions based on the ionization tendency between metals is prevented. Is done. For this reason, a noble metal plating layer is formed as what has the stable quality property.
Further, the plating solution injected into the insulating spacer deposits and forms a noble metal plating layer on the required inner surface area through the passage hole of the insulating spacer. For this reason, there is no attenuation of the current density seen in the insulating spacer portion which is not opened, and a stable plating process is possible.

  According to a second aspect of the present invention, there is provided an inner surface plating apparatus for a hollow article, wherein a cylindrical insulating spacer is arranged on the inner face of a hollow article made of a conductive material such as copper, and plating is performed in the insulating spacer. An inner surface plating apparatus for a hollow article in which a noble metal plating layer is formed in a necessary inner surface area by injecting a liquid, wherein the insulating spacer has a positive electrode inserted into a cylindrical body, and The cylindrical body is characterized in that a passage hole for the plating solution injected therein is formed at a position corresponding to the required inner surface area.

According to the above configuration, the cylindrical insulating spacer with the positive electrode inserted is arranged on the inner surface of the hollow article, and the plating solution is injected into the insulating spacer, so that the noble metal plating layer is provided in the required inner surface area. It is formed. Therefore, this apparatus is inevitably miniaturized, and a small amount of the plating solution to be injected is used.
Moreover, since the positive electrode inserted in the insulating spacer is configured to be energized with the hollow article as the negative electrode, the operability of the plating process is facilitated.
Further, the plating solution passage hole provided with the insulating spacer is formed at a position corresponding to the required inner surface area of the noble metal plating layer. For this reason, a noble metal plating layer having stable quality characteristics without attenuation of current density even during charging can be obtained.

According to a third aspect of the present invention, there is provided an apparatus for plating an inner surface of a hollow article, wherein the insulating spacer is provided with a plating solution injection pipe, and the injection end is provided with an overflow receiver for overflow of the plating solution. The device for plating an inner surface of a hollow article according to claim 2, wherein
According to the above configuration, since the plating solution injection pipe and the overflow receiver are provided, the supply and management of the plating solution are reliably performed, which contributes to resource saving.

In the inner surface plating method for a hollow article according to the present invention, the inner surface region is attached and formed after charging by a plating solution into which a noble metal plating layer is injected. Therefore, the plating solution is injected in a small amount, and the deposition of metal ions based on the ionization tendency is prevented by the injection while energized.
The inner surface plating apparatus for a hollow article according to the present invention is provided with a noble metal plating layer by arranging a cylindrical insulating spacer on the inner surface of the hollow article and injecting a plating solution into the insulating spacer. Can be formed in the area. For this reason, in the device of the present invention, it is reduced in size and has the advantage of saving resources by using a small amount of plating solution.
Further, the hollow surface article inner surface plating apparatus according to the present invention is formed such that the passage hole of the insulating spacer corresponds to the required inner surface area of the noble metal plating layer. For this reason, the injected plating solution can maintain an appropriate current density in the required inner surface area of the noble metal plating layer, and a noble metal plating layer having a stable quality can be formed.

Hereinafter, an inner surface plating method for a hollow article according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is an explanatory view conceptually showing the inner surface plating method for a hollow article according to the first embodiment of the present invention.
In FIG. 1, in the inner surface plating method for a hollow article according to the first embodiment, the obtained hollow article 1 is made of an electrically conductive material such as copper as shown in FIGS. 2 (a) and 2 (b). A required inner surface area A of the noble metal plating layer 3 is set on the inner surface 2.
The required inner surface area A is intended for all or a part of the inner surface 2, and in the case of FIG. 2 (a), the lower inner surface is the required inner surface area A, and in the case of FIG. 2 (b). The upper half is different from the required inner surface area A. In addition, although illustration is abbreviate | omitted in this invention, naturally the case where the said required inner surface area A is formed in the whole inner surface 2 is also included.
Moreover, the noble metal plating layer 3 is intended for a plating layer of gold, silver or the like, and the material of the positive electrode 4 is selected according to this.
The plating solution may be a commonly used one. For example, in the case of a silver plating layer, a suitable composition such as silver cyanide, potassium cyanide, or potassium carbonate is applied. The temperature is about 25 ° C. and the current density is about 2.0 A / dm ² . For example, in gold plating, an appropriate composition such as gold cyanide or potassium cyanide is applied, but it is desirable to provide a base plating layer from the viewpoint of adhesion strength. The temperature is around 45 ° C. and the current density is about 1.2 A / dm ² .

By the way, the hollow article 1 is applied to, for example, an electrical component. When the noble metal plating layer 3 is formed, a cylindrical insulating spacer in which the positive electrode 4 is inserted in the inner surface 2 is used. 5 is arranged.
The positive electrode 4 is wired so that energization is possible with the hollow product 1 as the negative electrode 6. In this case, the material of the positive electrode 4 is selected according to the target metal of the noble metal plating layer 3 as described above.
In addition, a gap B is present between the insertion end of the positive electrode 4 and the bottom surface of the insulating spacer 5 so as not to directly contact the hollow article serving as the negative electrode 6. This is to prevent a short circuit due to contact with the negative electrode 6, thereby ensuring safety for electricity in the plating process.

The insulating spacer 5 is made of an electrical insulator such as rubber or a latch, and a plating solution passage hole 7 is formed in the cylindrical main body 5a. The passage hole 7 is provided at a position corresponding to the required inner surface area A of the noble metal plating layer 3 of the hollow article 1.
After the insulating spacers 5 arranged in this way are charged, a plating solution suitable for the noble metal plating layer 3 is injected into the cylindrical main body 5a as indicated by an arrow C. Then, by injecting the plating solution, the noble metal plating layer 3 is adhered and formed on the required inner surface area A through the passage hole 7. In this case, the plating solution is injected by an appropriate method such as a dropper. The plating solution to be injected can maintain an appropriate current density due to the presence of the passage holes 7, whereby the noble metal plating layer 3 is formed on the required inner surface area A.

Next, an inner surface plating apparatus for a hollow article according to the present invention will be described with reference to FIGS. 3 (a) and 3 (b). The same or overlapping part as the inner surface plating method for the hollow article described above. The description will be omitted or simplified. FIGS. 3A and 3B are conceptual explanatory views showing main components of the inner surface plating apparatus for a hollow article according to the second embodiment of the present invention.
3 (a) and 3 (b), the insulating spacer 5 is made of an insulating material such as rubber or plastic as described above, and the positive electrode 4 is inserted into the cylindrical main body 5a, as described above. In addition, the positive electrode 4 is configured to be energized between the hollow shaped articles 1 that become the negative electrodes 6. 3 (a) shows an insulating spacer 5 applied to the inner surface plating method of the hollow article 1 shown in FIG. 2 (a), and FIG. 3 (b) has a bottomed cylindrical shape. It is the insulating spacer 5 applied to the inner surface plating method of the hollow article 1 seen in 2 (b).
Further, as described above, the through hole 7 for the plating solution to be injected after charging is formed in the cylindrical main body 5a of the insulating spacer 5. And this passage hole 7 exists in the position corresponding to the required inner surface area A of the noble metal plating layer 3 in the hollow article 1 so that the current density of the plating solution injected into the insulating spacer 5 is appropriately maintained. Function. On the other hand, in the portion of the insulating spacer 5 that is not open, current attenuation is observed due to the insulating function, and the amount of adhesion of the noble metal plating layer 3 is reduced.
The shape and number of the through holes 7 are not specified, but in the case of the illustrated round holes, the circumferential direction is 90 ° apart, and the axial direction is 4 and 5 adjacent. Is formed.

Furthermore, the hollow surface article inner surface plating apparatus according to the present invention will be described with reference to FIG. 4. However, the description of the same or overlapping parts as those of the first and second embodiments will be omitted or simplified. Turn into. FIG. 4 is a conceptual explanatory view showing an inner surface plating apparatus for a hollow article according to a third embodiment of the present invention.
In FIG. 4, in the inner surface plating apparatus for a hollow article according to the third embodiment, the obtained hollow article 1 is shown in FIG. 2 (a). A necessary inner surface area A of the noble metal plating layer 3 is set in about the upper half thereof.
An insulating spacer 5 having a positive electrode 4 inserted therein is disposed on the inner surface 2 of the hollow article 1, and the plating solution injected into the cylindrical body 5 a of the insulating spacer 5 reaches the required inner surface area A. The noble metal plating layer 3 is deposited and formed through the passage hole 7 provided at the corresponding position.
The insulating spacer 5 has a cylindrical body 5a in which a positive electrode 4 is inserted, and a plating solution passage hole 7 is formed in about the lower half. In this case, as described above, the passage hole 7 is located at a position corresponding to the required inner surface area A of the noble metal plating layer 3, and the current density of the plating solution injected into the insulating spacer 5 is appropriately maintained. To function.
In addition, the positive electrode 4 is configured to be able to be energized with a hollow article serving as the negative electrode 6 in the same manner as described above.

Further, as described above, the plating solution is injected after being charged, and an injection tube 8 is provided inside the insulating spacer 5 at the time of this injection. This injection tube 8 is designed so that the plating solution can be distributed to the back side of the inner surface 2 of the hollow article 1. That is, if the plating solution flows or agitates on the inner side of the inner surface 2, the plating process is effectively performed.
In addition, an overflow receiver 9 is provided on the plating solution injection end side in consideration of plating solution overflow. The overflow receiver 9 is composed of a receiving tray 11 and a drain outlet 12 whose sealing performance is improved by an O-ring 10. In this case, the recycling of the plating solution that has flowed out of the drain port 12 is considered from the viewpoint of recycling.

  It is explanatory drawing which shows notionally the inner surface plating method of the hollow shape article | item which concerns on 1st Embodiment of this invention.   It is explanatory drawing which shows the hollow-shaped article | item obtained by the inner surface plating method of the hollow-shaped article | item based on 1st Embodiment, FIG.2 (a) is sectional drawing which carried out inner surface plating of about the lower half, FIG.2 (b) It is sectional drawing which plated the upper half about about half.   FIG. 3A is a conceptual explanatory view showing main components of an inner surface plating apparatus for a hollow article according to a second embodiment of the present invention, and FIG. 3A is a front view of an insulating spacer in which a passage hole is formed in about the lower half. FIG. 3 and FIG. 3B are front views of insulating spacers having passage holes formed in about the upper half.   It is explanatory drawing which shows notionally the inner surface plating apparatus of the hollow shape article | item which concerns on 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Hollow-shaped article 2 Inner surface 3 Precious metal plating layer 4 Positive electrode 5 Insulating spacer 5a Cylindrical main body 6 Negative electrode 7 Passing hole 8 Injection pipe 9 Overflow receiving A A Necessary inner surface area B Gap

Claims (3)

The inner surface of a hollow shaped article made of a conductive material such as copper has a necessary inner surface area of the noble metal plating layer, and against the positive electrode inserted in a cylindrical insulating spacer with a plating solution passage hole. The inner surface plating method of the hollow shape article in which the noble metal plating layer is formed in the required inner surface area by using a hollow shape product as a negative electrode,
The noble metal plating layer is formed so as to be adhered through a passage hole of an insulating spacer corresponding to the required inner surface area by injecting a plating solution into the insulating spacer after being charged. An inner surface plating method for hollow-shaped products. By placing a cylindrical insulating spacer on the inner surface of a hollow article made of a conductive material such as copper and injecting a plating solution into the insulating spacer, a noble metal plating layer is formed in the required inner surface area. An inner surface plating apparatus for a hollow shaped article,
In the insulating spacer, a positive electrode is inserted in a cylindrical main body, and a passage hole for a plating solution injected into the cylindrical main body is formed at a position corresponding to the required inner surface area. An apparatus for plating an inner surface of a hollow article characterized by comprising:   3. The hollow shape according to claim 2, wherein a plating solution injection pipe is provided in the insulating spacer, and an overflow receptacle for the plating solution overflow is provided on the injection end side. Equipment for internal plating of articles.

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