JP2006335608A - Iii族窒化物結晶およびその成長方法 - Google Patents
Iii族窒化物結晶およびその成長方法 Download PDFInfo
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- JP2006335608A JP2006335608A JP2005162654A JP2005162654A JP2006335608A JP 2006335608 A JP2006335608 A JP 2006335608A JP 2005162654 A JP2005162654 A JP 2005162654A JP 2005162654 A JP2005162654 A JP 2005162654A JP 2006335608 A JP2006335608 A JP 2006335608A
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- iii nitride
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- 239000013078 crystal Substances 0.000 title claims abstract description 243
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims abstract description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000007789 gas Substances 0.000 claims abstract description 44
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 40
- 239000002994 raw material Substances 0.000 claims abstract description 26
- 239000011261 inert gas Substances 0.000 claims abstract description 17
- 238000005092 sublimation method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 abstract description 19
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 238000002109 crystal growth method Methods 0.000 abstract description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 19
- 229910052786 argon Inorganic materials 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- 238000000859 sublimation Methods 0.000 description 11
- 230000008022 sublimation Effects 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000005192 partition Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- -1 TaC Chemical class 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
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Abstract
【解決手段】 開口部12hを有する結晶成長容器12の内部にIII族窒化物原料1を配置し、結晶成長容器12の外部に窒素ガスと不活性ガスとの混合ガスを供給して、結晶成長容器12の外部と内部とのガス交換を行ないながら、結晶成長容器12の内部でIII族窒化物結晶3を成長させる工程を含むIII族窒化物結晶の成長方法。
【選択図】 図1
Description
B. Liu,他8名,"The Durability of Various Crucible Materials for Aluminum Nitride Crystal Growth by Sublimation",MRS Internet J. Nitride Semicond. Res. 9,6 (2004) V. Noveski, 他4名,"Growth of AlN crystals on AlN/SiC seeds by AlN powder sublimation in nitrogen atmosphere",MRS Internet J. Nitride Semicond. Res. 9,2 (2004)
(V/III比)=pN2/pIII=(pN2)1.5/(K(T))0.5 (1)
K(T)=exp{54.11−(151576/T)}
(式(1)において、Tは絶対温度(単位:K)を示す)
(出典:Journal of Crystal Growth 220 (2000) 243)
で定義されるV/III比を100以下にすることが大型で良好な結晶性を有するIII族窒化物結晶成長に好ましい。具体的には、針状ではなく塊状のAlN単結晶成長が可能になる。ただし、V/III比を5未満にすると、多結晶化しやすくなるのであまり好ましくない。
比較例1,2および実施例1は、昇華法により種結晶を用いることなくIII族窒化物結晶であるAlN結晶を成長させた例である。
比較例3および実施例2は、昇華法により種結晶を用いてIII族窒化物結晶であるAlN結晶を成長させた例である。
比較例4および実施例3は、昇華法により種結晶を用いてIII族窒化物結晶であるAlN結晶を成長させた例であって、AlN結晶のc軸に垂直な方向への結晶成長の有無について比較検討した例である。
Claims (4)
- 昇華法によるIII族窒化物結晶の成長方法であって、
開口部を有する結晶成長容器の内部にIII族窒化物原料を配置し、前記結晶成長容器の外部に窒素ガスと不活性ガスとの混合ガスを供給して、前記結晶成長容器の外部と内部とのガス交換を行ないながら、前記結晶成長容器の内部でIII族窒化物結晶を成長させる工程を含むIII族窒化物結晶の成長方法。 - 前記混合ガスは、前記窒素ガスの分圧に対する前記不活性ガスの分圧の比が0.1以上であることを特徴とする請求項1に記載のIII族窒化物結晶の成長方法。
- 結晶成長温度を2000℃以上とすることを特徴とする請求項1または請求項2に記載のIII族窒化物結晶の成長方法。
- 請求項1から請求項3までのいずれかに記載の成長方法により得られたIII族窒化物結晶。
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| Application Number | Priority Date | Filing Date | Title |
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| JP2005162654A JP4600160B2 (ja) | 2005-06-02 | 2005-06-02 | Iii族窒化物結晶の成長方法 |
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| JP2005162654A JP4600160B2 (ja) | 2005-06-02 | 2005-06-02 | Iii族窒化物結晶の成長方法 |
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| JP2006335608A true JP2006335608A (ja) | 2006-12-14 |
| JP4600160B2 JP4600160B2 (ja) | 2010-12-15 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009155125A (ja) * | 2007-12-25 | 2009-07-16 | Sumitomo Electric Ind Ltd | Iii族窒化物半導体結晶の成長方法およびiii族窒化物半導体結晶の成長装置 |
| WO2009096123A1 (ja) * | 2008-01-31 | 2009-08-06 | Sumitomo Electric Industries, Ltd. | AlxGa1-xN単結晶の成長方法 |
| WO2012003304A1 (en) * | 2010-06-30 | 2012-01-05 | Crystal Is, Inc. | Growth of large aluminum nitride single crystals with thermal-gradient control |
| JP2012140325A (ja) * | 2012-03-21 | 2012-07-26 | Sumitomo Electric Ind Ltd | Iii族窒化物半導体結晶の成長方法およびiii族窒化物半導体結晶の成長装置 |
| US9299880B2 (en) | 2013-03-15 | 2016-03-29 | Crystal Is, Inc. | Pseudomorphic electronic and optoelectronic devices having planar contacts |
| US9447521B2 (en) | 2001-12-24 | 2016-09-20 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
| US9447519B2 (en) | 2006-03-30 | 2016-09-20 | Crystal Is, Inc. | Aluminum nitride bulk crystals having high transparency to untraviolet light and methods of forming them |
| US9771666B2 (en) | 2007-01-17 | 2017-09-26 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| US10074784B2 (en) | 2011-07-19 | 2018-09-11 | Crystal Is, Inc. | Photon extraction from nitride ultraviolet light-emitting devices |
| JP2023501774A (ja) * | 2019-10-01 | 2023-01-19 | フラウンホーファー・ゲゼルシャフト・ツール・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファウ | 単結晶窒化アルミニウム基板の表面の構造的損傷を低減させる方法およびその方法によって製造される単結晶窒化アルミニウム基板 |
-
2005
- 2005-06-02 JP JP2005162654A patent/JP4600160B2/ja not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9447521B2 (en) | 2001-12-24 | 2016-09-20 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
| US9447519B2 (en) | 2006-03-30 | 2016-09-20 | Crystal Is, Inc. | Aluminum nitride bulk crystals having high transparency to untraviolet light and methods of forming them |
| US9771666B2 (en) | 2007-01-17 | 2017-09-26 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| JP2009155125A (ja) * | 2007-12-25 | 2009-07-16 | Sumitomo Electric Ind Ltd | Iii族窒化物半導体結晶の成長方法およびiii族窒化物半導体結晶の成長装置 |
| US8293011B2 (en) | 2007-12-25 | 2012-10-23 | Sumitomo Electric Industries, Ltd. | Method for growing group III nitride semiconductor crystal and growing device for group III nitride semiconductor crystal |
| WO2009096123A1 (ja) * | 2008-01-31 | 2009-08-06 | Sumitomo Electric Industries, Ltd. | AlxGa1-xN単結晶の成長方法 |
| JP2009179533A (ja) * | 2008-01-31 | 2009-08-13 | Sumitomo Electric Ind Ltd | AlxGa1−xN単結晶の成長方法 |
| US9580833B2 (en) | 2010-06-30 | 2017-02-28 | Crystal Is, Inc. | Growth of large aluminum nitride single crystals with thermal-gradient control |
| WO2012003304A1 (en) * | 2010-06-30 | 2012-01-05 | Crystal Is, Inc. | Growth of large aluminum nitride single crystals with thermal-gradient control |
| US10074784B2 (en) | 2011-07-19 | 2018-09-11 | Crystal Is, Inc. | Photon extraction from nitride ultraviolet light-emitting devices |
| JP2012140325A (ja) * | 2012-03-21 | 2012-07-26 | Sumitomo Electric Ind Ltd | Iii族窒化物半導体結晶の成長方法およびiii族窒化物半導体結晶の成長装置 |
| US9299880B2 (en) | 2013-03-15 | 2016-03-29 | Crystal Is, Inc. | Pseudomorphic electronic and optoelectronic devices having planar contacts |
| JP2023501774A (ja) * | 2019-10-01 | 2023-01-19 | フラウンホーファー・ゲゼルシャフト・ツール・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファウ | 単結晶窒化アルミニウム基板の表面の構造的損傷を低減させる方法およびその方法によって製造される単結晶窒化アルミニウム基板 |
| JP7569850B2 (ja) | 2019-10-01 | 2024-10-18 | フラウンホーファー・ゲゼルシャフト・ツール・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファウ | 単結晶窒化アルミニウム基板の表面の構造的損傷を低減させる方法およびその方法によって製造される単結晶窒化アルミニウム基板 |
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| JP4600160B2 (ja) | 2010-12-15 |
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