JP2006037032A - Polycarbonate resin composition - Google Patents
Polycarbonate resin composition Download PDFInfo
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- JP2006037032A JP2006037032A JP2004222754A JP2004222754A JP2006037032A JP 2006037032 A JP2006037032 A JP 2006037032A JP 2004222754 A JP2004222754 A JP 2004222754A JP 2004222754 A JP2004222754 A JP 2004222754A JP 2006037032 A JP2006037032 A JP 2006037032A
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- polycarbonate resin
- resin composition
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- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 40
- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 40
- 239000000203 mixture Substances 0.000 title claims abstract description 20
- -1 amide compound Chemical class 0.000 claims abstract description 21
- 150000007524 organic acids Chemical class 0.000 claims abstract description 18
- 238000002156 mixing Methods 0.000 claims description 13
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 claims description 10
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 claims description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims description 4
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 claims description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 claims description 4
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- PFBWBEXCUGKYKO-UHFFFAOYSA-N ethene;n-octadecyloctadecan-1-amine Chemical compound C=C.CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC PFBWBEXCUGKYKO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 claims description 2
- 239000005639 Lauric acid Substances 0.000 claims description 2
- 235000021314 Palmitic acid Nutrition 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 150000002688 maleic acid derivatives Chemical class 0.000 claims description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- 229960002446 octanoic acid Drugs 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005469 granulation Methods 0.000 description 3
- 230000003179 granulation Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005027 hydroxyaryl group Chemical group 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- OXDXXMDEEFOVHR-CLFAGFIQSA-N (z)-n-[2-[[(z)-octadec-9-enoyl]amino]ethyl]octadec-9-enamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)NCCNC(=O)CCCCCCC\C=C/CCCCCCCC OXDXXMDEEFOVHR-CLFAGFIQSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- FDLFMPKQBNPIER-UHFFFAOYSA-N 1-methyl-3-(3-methylphenoxy)benzene Chemical compound CC1=CC=CC(OC=2C=C(C)C=CC=2)=C1 FDLFMPKQBNPIER-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- CKNCVRMXCLUOJI-UHFFFAOYSA-N 3,3'-dibromobisphenol A Chemical compound C=1C=C(O)C(Br)=CC=1C(C)(C)C1=CC=C(O)C(Br)=C1 CKNCVRMXCLUOJI-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- RSSGMIIGVQRGDS-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-phenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=CC=C1 RSSGMIIGVQRGDS-UHFFFAOYSA-N 0.000 description 1
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 1
- QHJPJZROUNGTRJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)octan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCCCC)C1=CC=C(O)C=C1 QHJPJZROUNGTRJ-UHFFFAOYSA-N 0.000 description 1
- GRCXOICCGCYITB-UHFFFAOYSA-N 4-[2-[2-[2-(4-hydroxyphenyl)-3-methylphenyl]propan-2-yl]-6-methylphenyl]phenol Chemical compound CC1=CC=CC(C(C)(C)C=2C(=C(C)C=CC=2)C=2C=CC(O)=CC=2)=C1C1=CC=C(O)C=C1 GRCXOICCGCYITB-UHFFFAOYSA-N 0.000 description 1
- RQTDWDATSAVLOR-UHFFFAOYSA-N 4-[3,5-bis(4-hydroxyphenyl)phenyl]phenol Chemical compound C1=CC(O)=CC=C1C1=CC(C=2C=CC(O)=CC=2)=CC(C=2C=CC(O)=CC=2)=C1 RQTDWDATSAVLOR-UHFFFAOYSA-N 0.000 description 1
- XHDKBYRAWKLXGE-UHFFFAOYSA-N 4-[4,6-bis(4-hydroxyphenyl)-4,6-dimethylhept-1-en-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)CC(C)(C=1C=CC(O)=CC=1)CC(=C)C1=CC=C(O)C=C1 XHDKBYRAWKLXGE-UHFFFAOYSA-N 0.000 description 1
- CIEGINNQDIULCT-UHFFFAOYSA-N 4-[4,6-bis(4-hydroxyphenyl)-4,6-dimethylheptan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC(C)(C=1C=CC(O)=CC=1)CC(C)(C)C1=CC=C(O)C=C1 CIEGINNQDIULCT-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 150000004790 diaryl sulfoxides Chemical class 0.000 description 1
- 150000001987 diarylethers Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明は、高流動性ポリカーボネート樹脂組成物ならびにそれからなる成形品に関する。更に詳しくは、ポリカーボネート樹脂の特徴である耐衝撃性、透明性、耐熱性、熱安定性等を保持したまま、優れた流動性を有するポリカーボネート樹脂組成物およびそれからなる成形品を提供するものである。 The present invention relates to a highly fluid polycarbonate resin composition and a molded article comprising the same. More specifically, the present invention provides a polycarbonate resin composition having excellent fluidity while maintaining the impact resistance, transparency, heat resistance, thermal stability, etc., which are the characteristics of polycarbonate resin, and a molded product comprising the same. .
ポリカーボネート樹脂は、耐衝撃性、透明性、耐熱性、熱安定性等に優れた熱可塑性樹脂であり、電気、電子、ITE、機械、自動車などの分野で広く用いられている。しかしながら、近年では製品の軽量・薄肉化の傾向が著しく、また意匠面やデザイン上の要求を満足するため、上述の優れた性能に加えて高度な流動性(成形性)を具備した材料が求められている。 Polycarbonate resin is a thermoplastic resin excellent in impact resistance, transparency, heat resistance, thermal stability and the like, and is widely used in fields such as electricity, electronics, ITE, machinery, and automobiles. However, in recent years, there has been a remarkable trend toward lighter and thinner products, and in order to satisfy design and design requirements, materials that have high fluidity (formability) in addition to the above-mentioned excellent performance are required. It has been.
一般に、ポリカーボネート樹脂組成物の流動性を改善させる手法として、低分子量化合物や流動性の高いポリマー等を配合する方法が提案されている。
しかしながら、低分子量化合物や流動性の高いポリマー等を配合すると、ポリカーボネート樹脂が有する耐衝撃性、透明性、耐熱性、熱安定性等といった特徴のいずれかが大きく損なわれてしまうという問題を有しており、従来からその改善が強く望まれてきた。 However, when a low molecular weight compound or a polymer having high fluidity is blended, there is a problem that any of the characteristics such as impact resistance, transparency, heat resistance, and thermal stability of the polycarbonate resin is greatly impaired. The improvement has been strongly desired.
本発明者らは、かかる問題点に鑑み鋭意検討を行った結果、ポリカーボネート樹脂組成物に、有機酸とアミド化合物からなる混合物を高流動化剤として特定量配合することにより、ポリカーボネート樹脂が有する種々の優れた特徴を損なうことなく、有機酸あるいはアミド化合物を単独で使用するよりも顕著に流動性を向上させるという相乗効果を見出し、本発明に到達したものである。 As a result of intensive studies in view of such problems, the present inventors have found that various kinds of polycarbonate resins have a polycarbonate resin composition by blending a specific amount of a mixture of an organic acid and an amide compound as a high fluidizing agent. Thus, the present inventors have found a synergistic effect that the fluidity is remarkably improved as compared with the case of using an organic acid or an amide compound alone without impairing the excellent characteristics of the present invention.
すなわち、本発明は、ポリカーボネート樹脂(A)100重量部に対し、有機酸(B)0.01〜0.6重量部およびアミド化合物(C)0.4〜1.0重量部配合してなることを特徴とするポリカーボネート樹脂組成物、およびそれから成形されてなる成形品を提供するものである。 That is, the present invention comprises 0.01 to 0.6 parts by weight of an organic acid (B) and 0.4 to 1.0 parts by weight of an amide compound (C) with respect to 100 parts by weight of a polycarbonate resin (A). It is an object of the present invention to provide a polycarbonate resin composition characterized by the above, and a molded article formed therefrom.
本発明のポリカーボネート樹脂組成物は、耐衝撃性、透明性、耐熱性、熱安定性等を損なうことなく流動性を顕著に向上させていることから、電気、電子、ITE等各種分野における軽量・薄肉化や意匠性などが要求される製品に対して好適に使用することが可能であり、工業的利用価値が高い。 Since the polycarbonate resin composition of the present invention significantly improves fluidity without impairing impact resistance, transparency, heat resistance, thermal stability, etc., it is lightweight in various fields such as electricity, electronics, and ITE. It can be suitably used for products that require thinning and design, and has high industrial utility value.
本発明にて使用されるポリカーボネート樹脂(A)とは、種々のジヒドロキシジアリール化合物とホスゲンとを反応させるホスゲン法、またはジヒドロキシジアリール化合物とジフェニルカーボネートなどの炭酸エステルとを反応させるエステル交換法によって得られる重合体であり、代表的なものとしては、2,2−ビス(4−ヒドロキシフェニル)プロパン(通称ビスフェノールA)から製造されたポリカーボネート樹脂が挙げられる。 The polycarbonate resin (A) used in the present invention is obtained by a phosgene method in which various dihydroxydiaryl compounds and phosgene are reacted, or a transesterification method in which a dihydroxydiaryl compound and a carbonate such as diphenyl carbonate are reacted. A typical example of the polymer is a polycarbonate resin produced from 2,2-bis (4-hydroxyphenyl) propane (commonly referred to as bisphenol A).
上記ジヒドロキシジアリール化合物としては、ビスフェノールAの他に、ビス(4−ヒドロキシフェニル)メタン、1,1−ビス(4−ヒドロキシフェニル)エタン、2,2−ビス(4−ヒドロキシフェニル)ブタン、2,2−ビス(4−ヒドロキシフェニル)オクタン、ビス(4−ヒドロキシフェニル)フェニルメタン、2,2−ビス(4−ヒドロキシフェニル−3−メチルフェニル)プロパン、1,1−ビス(4−ヒドロキシ−3−第三ブチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−ブロモフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジブロモフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジクロロフェニル)プロパンのようなビス(ヒドロキシアリール)アルカン類、1,1−ビス(4−ヒドロキシフェニル)シクロペンタン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサンのようなビス(ヒドロキシアリール)シクロアルカン類、4,4′−ジヒドロキシジフェニルエーテル、4,4′−ジヒドロキシ−3,3′−ジメチルジフェニルエーテルのようなジヒドロキシジアリールエーテル類、4,4′−ジヒドロキシジフェニルスルフィドのようなジヒドロキシジアリールスルフィド類、4,4′−ジヒドロキシジフェニルスルホキシド、4,4′−ジヒドロキシ−3,3′−ジメチルジフェニルスルホキシドのようなジヒドロキシジアリールスルホキシド類、4,4′−ジヒドロキシジフェニルスルホン、4,4′−ジヒドロキシ−3,3′−ジメチルジフェニルスルホンのようなジヒドロキシジアリールスルホン類等が挙げられる。 Examples of the dihydroxydiaryl compound include bisphenol 4-, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) butane, 2, 2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane, 2,2-bis (4-hydroxyphenyl-3-methylphenyl) propane, 1,1-bis (4-hydroxy-3) -Tert-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 2,2-bis ( Bis (hydroxyaryl) alkanes such as 4-hydroxy-3,5-dichlorophenyl) propane, 1,1- (4-hydroxyphenyl) cyclopentane, bis (hydroxyaryl) cycloalkanes such as 1,1-bis (4-hydroxyphenyl) cyclohexane, 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-3 Dihydroxy diaryl ethers such as 3,3'-dimethyldiphenyl ether, dihydroxy diaryl sulfides such as 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl sulfoxide, 4,4'-dihydroxy-3,3 ' Dihydroxy diaryl sulfoxides such as dimethyldiphenyl sulfoxide, dihydroxy diary such as 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfone Sulfone, and the like.
これらは単独または2種類以上混合して使用されるが、これらの他に、ピペラジン、ジピペリジルハイドロキノン、レゾルシン、4,4′−ジヒドロキシジフェニル等を混合して使用してもよい。 These may be used alone or in combination of two or more. In addition to these, piperazine, dipiperidyl hydroquinone, resorcin, 4,4′-dihydroxydiphenyl, and the like may be used in combination.
さらに、上記のジヒドロキシアリール化合物と以下に示すような3価以上のフェノール化合物を混合使用してもよい。3価以上のフェノールとしてはフロログルシン、4,6−ジメチル−2,4,6−トリ−(4−ヒドロキシフェニル)−ヘプテン、2,4,6−ジメチル−2,4,6−トリ−(4−ヒドロキシフェニル)−ヘプタン、1,3,5−トリ−(4−ヒドロキシフェニル)−ベンゾール、1,1,1−トリ−(4−ヒドロキシフェニル)−エタンおよび2,2−ビス−〔4,4−(4,4′−ジヒドロキシジフェニル)−シクロヘキシル〕−プロパンなどが挙げられる。 Furthermore, the above dihydroxyaryl compound and a trivalent or higher phenol compound as shown below may be used in combination. Trihydric or higher phenols include phloroglucin, 4,6-dimethyl-2,4,6-tri- (4-hydroxyphenyl) -heptene, 2,4,6-dimethyl-2,4,6-tri- (4 -Hydroxyphenyl) -heptane, 1,3,5-tri- (4-hydroxyphenyl) -benzol, 1,1,1-tri- (4-hydroxyphenyl) -ethane and 2,2-bis- [4 4- (4,4'-dihydroxydiphenyl) -cyclohexyl] -propane and the like.
ポリカーボネート樹脂(A)の粘度平均分子量には特に制限はないが、成形加工性、強度の面より通常10000〜100000、より好ましくは15000〜30000、さらに好ましくは17000〜26000である。また、かかるポリカーボネート樹脂を製造するに際し、分子量調整剤、触媒等を必要に応じて使用することができる。 Although there is no restriction | limiting in particular in the viscosity average molecular weight of polycarbonate resin (A), Usually, it is 10,000-100000, More preferably, it is 15000-30000, More preferably, it is 17000-26000 from the surface of moldability and intensity | strength. Moreover, when manufacturing this polycarbonate resin, a molecular weight modifier, a catalyst, etc. can be used as needed.
有機酸(B)には種々のタイプのものを使用することができる。例えば、炭素数6〜30の脂肪酸が挙げられ、カプリル酸、カプリン酸、ラウリル酸、パルミチン酸、ステアリン酸、アラキジン酸、無水マレイン酸、酸変性のシロキサンなどが代表的な化合物として例示される。とりわけカプリン酸が好適に用いられる。 Various types of organic acids (B) can be used. Examples thereof include fatty acids having 6 to 30 carbon atoms, and typical examples include caprylic acid, capric acid, lauric acid, palmitic acid, stearic acid, arachidic acid, maleic anhydride, and acid-modified siloxane. In particular, capric acid is preferably used.
有機酸(B)の配合量は、ポリカーボネート樹脂(A)100重量部あたり、0.01〜0.6重量部である。配合量が0.01重量部未満では流動性が劣り、また0.6重量部を超えると衝撃強度が低下するので好ましくない。より好適な配合量としては、0.05〜 0.2重量部の範囲である。 The compounding quantity of organic acid (B) is 0.01-0.6 weight part per 100 weight part of polycarbonate resin (A). If the blending amount is less than 0.01 parts by weight, the fluidity is inferior, and if it exceeds 0.6 parts by weight, the impact strength decreases, which is not preferable. A more preferable blending amount is in the range of 0.05 to 0.2 parts by weight.
アミド化合物(C)は、下記一般式(1)で示される化合物である。
一般式(1)
R1−CONH−(CH2)n−NHCO−R2
ただし、R1およびR2は炭素数6〜30である直鎖または分岐鎖アルキル基であり、nは2〜6の整数である。具体的には、エチレンビスステアリルアミド、エチレンビスオレイルアミド等が挙げられ、とりわけエチレンビスステアリルアミドが好適に使用される。
The amide compound (C) is a compound represented by the following general formula (1).
General formula (1)
R1-CONH- (CH 2) n -NHCO-R2
However, R1 and R2 are linear or branched alkyl groups having 6 to 30 carbon atoms, and n is an integer of 2 to 6. Specific examples include ethylene bisstearyl amide and ethylene bis oleyl amide, and ethylene bisstearyl amide is particularly preferably used.
アミド化合物(C)の配合量は、ポリカーボネート樹脂(A)100重量部あたり、0.4〜1.0重量部である。配合量が0.4重量部未満では流動性が劣り、また1.0重量部を超えると衝撃強度が低下するので好ましくない。より好適な配合量としては、0.5〜0.8重量部の範囲である。 The compounding quantity of an amide compound (C) is 0.4-1.0 weight part per 100 weight part of polycarbonate resin (A). If the blending amount is less than 0.4 parts by weight, the fluidity is inferior. A more preferable blending amount is in the range of 0.5 to 0.8 parts by weight.
ポリカーボネート樹脂(A)、有機酸(B)およびアミド化合物(C)の配合方法には特に制限はなく、例えば有機酸(B)とアミド化合物(C)を予め調合したものをポリカーボネート樹脂(A)に配合してもよいし、有機酸(B)とアミド化合物(C)を別々に計量し、ポリカーボネート樹脂(A)に配合してもよい。 There is no restriction | limiting in particular in the compounding method of polycarbonate resin (A), organic acid (B), and amide compound (C), For example, what prepared organic acid (B) and amide compound (C) previously prepared polycarbonate resin (A) The organic acid (B) and the amide compound (C) may be separately metered and blended with the polycarbonate resin (A).
ポリカーボネート樹脂(A)、有機酸(B)およびアミド化合物(C)を混合する方法には特に制限はなく、任意の混合機、例えばタンブラー、リボンブレンダー、高速ミキサー等で混合し、通常の一軸または二軸押出機等で容易に溶融混練することができる。 The method for mixing the polycarbonate resin (A), the organic acid (B) and the amide compound (C) is not particularly limited, and is mixed with an arbitrary mixer such as a tumbler, ribbon blender, high-speed mixer, etc. It can be easily melt-kneaded with a twin screw extruder or the like.
また、混合時、必要に応じて他の公知の添加剤、例えば離型剤、紫外線吸収剤、充填剤、衝撃改良剤、帯電防止剤、酸化防止剤、熱安定剤、難燃剤、難燃助剤、染顔料、展着剤(エポキシ大豆油、流動パラフィン等)等を配合することができる。 When mixing, other known additives such as mold release agents, UV absorbers, fillers, impact modifiers, antistatic agents, antioxidants, thermal stabilizers, flame retardants, flame retardant aids, if necessary. Agents, dyes and pigments, spreading agents (epoxy soybean oil, liquid paraffin, etc.) can be blended.
充填剤としては、例えばガラス繊維、ガラスビーズ、ガラスフレーク、炭素繊維、タルク、クレー、マイカ、チタン酸カリウムウィスカー、ホウ酸アルミウィスカー、ワラストナイト、シリカ等が挙げられる。 Examples of the filler include glass fiber, glass bead, glass flake, carbon fiber, talc, clay, mica, potassium titanate whisker, aluminum borate whisker, wollastonite, silica and the like.
以下に本発明を実施例により具体的に説明するが、本発明はこれら実施例により何ら制限されるものではない。なお、特に断りのない限り「部」は重量基準に基づく。 EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. “Parts” are based on weight unless otherwise specified.
使用した配合成分の詳細は、以下のとおりである。
ポリカーボネート樹脂(以下、PCと略記)
住友ダウ社製 カリバー 200−20(分子量:18600)
有機酸
日本油脂社製 カプリン酸 NAA−102
アミド化合物
日本油脂社製 エチレンビスステアリルアミド アルフロー H−50TF
The details of the used blending components are as follows.
Polycarbonate resin (hereinafter abbreviated as PC)
Caliber 200-20 (molecular weight: 18600) manufactured by Sumitomo Dow
Organic acid Capric acid NAA-102 manufactured by NOF Corporation
Amide compound Nippon Oil & Fats Co., Ltd. Ethylenebisstearylamide Alfro H-50TF
各種原料を表1および2に示す配合比率にて一括してタンブラーに投入し、10分間乾式混合した後、二軸押出機(神戸製鋼所製KTX37)を用いて、溶融温度280℃にて混練し、ポリカーボネート樹脂組成物のペレットを得た。得られたペレットから、以下の評価を行った。 Various raw materials are collectively put into a tumbler at the blending ratios shown in Tables 1 and 2, and after dry mixing for 10 minutes, they are kneaded at a melting temperature of 280 ° C. using a twin screw extruder (KTX37 manufactured by Kobe Steel). As a result, pellets of the polycarbonate resin composition were obtained. The following evaluation was performed from the obtained pellets.
(1)アルキメデススパイラルフロー流動性
溶融温度280℃、射出圧力1600kg/cm2の条件下、アルキメデススパイラルフロー金型を使用して、流路厚み1mmでの流動長さを測定した。流動長さが130mm以上を合格とした。
(1) Archimedes spiral flow fluidity The flow length at a channel thickness of 1 mm was measured using an Archimedes spiral flow mold under the conditions of a melting temperature of 280 ° C. and an injection pressure of 1600 kg / cm 2 . A flow length of 130 mm or more was regarded as acceptable.
(2)アイゾット衝撃試験
溶融温度280℃の条件下、アイゾット衝撃試験用試験片を加工し、ASTM D256に準拠し、アイゾット衝撃強度を測定した。測定温度は23℃、試験片の厚みは3.2mmである。衝撃値が30Kg・cm/cm以上を合格とした。
(2) Izod Impact Test A test piece for Izod impact test was processed under a melting temperature of 280 ° C., and Izod impact strength was measured according to ASTM D256. The measurement temperature is 23 ° C., and the thickness of the test piece is 3.2 mm. An impact value of 30 kg / cm / cm or more was considered acceptable.
(3)耐熱性(荷重たわみ温度:HDT)
溶融温度280℃の条件下、耐熱性試験用試験片を加工し、ASTM D648に準拠し、荷重たわみ温度(HDT)を測定した。ファイバーストレスは18.5Kg/cm2に設定し、測定用試験片のアニール処理は行わなかった。試験片の厚みは6.4mmである。HDTが120℃以上を合格とした。
(3) Heat resistance (deflection temperature under load: HDT)
A test piece for a heat resistance test was processed under a melting temperature of 280 ° C., and a deflection temperature under load (HDT) was measured in accordance with ASTM D648. The fiber stress was set to 18.5 kg / cm 2 , and the measurement test piece was not annealed. The thickness of the test piece is 6.4 mm. HDT passed 120 degreeC or more as the pass.
(4)透明性評価
溶融温度280℃の条件下、3段厚みのカラーチップを作成し、これを目視判定した。
(4) Transparency Evaluation Under the conditions of a melting temperature of 280 ° C., a three-stage thickness color chip was prepared and visually judged.
(5)造粒性評価
造粒性は造粒中のストランドの状態を目視にて観察し、良/不良の判定を行った。
(5) Evaluation of granulation property The granulation property was determined by observing the state of the strand during granulation with the naked eye to determine good / bad.
表1のとおり、ポリカーボネート樹脂組成物が本発明の構成を満足する場合(実施例1〜4)にあっては、全ての評価項目にわたりその規格を満足していた。 As shown in Table 1, when the polycarbonate resin composition satisfied the configuration of the present invention (Examples 1 to 4), the standard was satisfied over all evaluation items.
表2で示したとおり、ポリカーボネート樹脂組成物が本発明の構成を満足しない場合においては、いずれの場合も何らかの欠点を有していた。
比較例1は、アミド化合物(C)が配合されていないポリカーボネート樹脂であるため、流動性が基準を満足しなかった。
比較例2においては、アミド化合物(C)の配合量が規定範囲の上限よりさらに多く、衝撃強度が基準を満足しなかった。
比較例3においては、有機酸(B)が配合されていないポリカーボネート樹脂であるため、流動性が基準を満足しなかった。
比較例4においては、有機酸(B)の配合量が規定範囲の上限よりさらに多く、衝撃強度が基準を満足しなかった。
As shown in Table 2, when the polycarbonate resin composition did not satisfy the constitution of the present invention, it had some drawbacks in any case.
Since Comparative Example 1 is a polycarbonate resin in which the amide compound (C) is not blended, the fluidity does not satisfy the standard.
In Comparative Example 2, the compounding amount of the amide compound (C) was more than the upper limit of the specified range, and the impact strength did not satisfy the standard.
In Comparative Example 3, since the polycarbonate resin does not contain the organic acid (B), the fluidity did not satisfy the standard.
In Comparative Example 4, the blending amount of the organic acid (B) was more than the upper limit of the specified range, and the impact strength did not satisfy the standard.
Claims (7)
一般式(1)
R1−CONH−(CH2)n−NHCO−R2
ここで、R1、R2は炭素数6〜30の(直鎖または分岐鎖)アルキル基であり、nは2〜6の整数である。 The polycarbonate resin composition according to claim 1 or 2, wherein the amide compound (C) is a compound represented by the following general formula (1).
General formula (1)
R 1 —CONH— (CH 2 ) n —NHCO—R 2
Wherein, R 1, R 2 is (straight or branched chain) alkyl group having 6 to 30 carbon atoms, n represents an integer from 2 to 6.
A molded article formed from the polycarbonate resin composition according to any one of claims 1 to 6.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008115249A (en) * | 2006-11-02 | 2008-05-22 | Sumitomo Dow Ltd | High-fluidity polycarbonate resin composition |
| US12371564B2 (en) | 2018-04-12 | 2025-07-29 | Sony Corporation | Resin composition and method of producing resin composition, and method of producing resin molding |
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| JPH06122820A (en) * | 1992-10-13 | 1994-05-06 | Toray Ind Inc | Polyamide resin composition |
| JPH11310711A (en) * | 1998-04-27 | 1999-11-09 | Toray Ind Inc | Thermoplastic resin composition |
| JP2002121345A (en) * | 2000-10-02 | 2002-04-23 | Qimei Industry Co Ltd | Polystyrene resin composition excellent in transparency |
| JP2003003023A (en) * | 2001-03-29 | 2003-01-08 | Mitsui Chemicals Inc | Thermoplastic elastomer composition and its use |
| JP2003049077A (en) * | 2001-08-03 | 2003-02-21 | Asahi Kasei Corp | Filler-containing flame-retardant resin composition and manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06122820A (en) * | 1992-10-13 | 1994-05-06 | Toray Ind Inc | Polyamide resin composition |
| JPH11310711A (en) * | 1998-04-27 | 1999-11-09 | Toray Ind Inc | Thermoplastic resin composition |
| JP2002121345A (en) * | 2000-10-02 | 2002-04-23 | Qimei Industry Co Ltd | Polystyrene resin composition excellent in transparency |
| JP2003003023A (en) * | 2001-03-29 | 2003-01-08 | Mitsui Chemicals Inc | Thermoplastic elastomer composition and its use |
| JP2003049077A (en) * | 2001-08-03 | 2003-02-21 | Asahi Kasei Corp | Filler-containing flame-retardant resin composition and manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008115249A (en) * | 2006-11-02 | 2008-05-22 | Sumitomo Dow Ltd | High-fluidity polycarbonate resin composition |
| US12371564B2 (en) | 2018-04-12 | 2025-07-29 | Sony Corporation | Resin composition and method of producing resin composition, and method of producing resin molding |
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