JP2006085729A - Mounting method of electronic circuit chip - Google Patents

Abstract

【Task】
The electronic circuit chip is mounted on a soft material such as paper so that the electronic circuit chip is not damaged by bending or bending the material.
The circuit is mounted on the paper in such an arrangement that the electronic circuit chip is not located at a position where the paper may be folded when the paper is folded. Further, like the circuit arrangement example 210a, the circuit is arranged such that the electronic circuit chip 1 is located at a position close to the side of the paper and the antenna 3 is parallel to the side of the paper. The circuit has a structure in which the electronic circuit chip 1 is disposed on the capacitor 2.
[Selection] Figure 1

Description

  The present invention relates to a technique for mounting an electronic circuit chip such as an integrated circuit chip on a soft material such as paper.

  In recent years, with the progress of miniaturization and thinning of electronic circuit chips such as integrated circuit chips, electronic circuit chips have been used in various usage forms.

  As one of the usage forms of such an electronic circuit chip, for example, as described in Patent Document 1, a small electronic circuit chip for storing information is read out from the electronic circuit chip without contact. In addition to these elements, there is known a utilization form in which the element is embedded in a portable plastic card. For example, such a plastic card, in which personal identification information is stored in advance in an electronic circuit chip, can be used as an electronic ID card that can confirm the personal identification information without contact.

JP-A-3-38396

  As described above, the use forms of the electronic circuit chip are widened, but conventionally, the material on which the electronic circuit chip is mounted is limited to a material such as a plastic card that is hard and cannot be bent or bent greatly. This is because if the force for bending or bending the material is also applied to the electronic circuit chip mounted on the material, the electronic circuit chip may be damaged for reasons of strength.

  However, if the electronic circuit chip can be attached to a soft material such as paper that can be bent or bent greatly, the usage form of the electronic circuit chip can be expanded, which provides further convenience to people. Will be able to.

  Accordingly, an object of the present invention is to provide a mounting method for mounting an electronic circuit chip on a soft material such as paper so that the electronic circuit chip is not damaged by bending or bending the material.

  It is another object of the present invention to provide an electronic circuit chip that is not damaged by bending or bending of the material even when attached to a soft material such as paper.

  In order to achieve the above object, the present invention provides, for example, that the electronic circuit chip is positioned at a position that becomes a fold when the electronic circuit chip is mounted on a foldable sheet according to a predetermined folding method. There is provided a method of mounting the electronic circuit chip on the sheet. With such a mounting method, the electronic circuit chip can be prevented from being damaged due to the folding of the sheet by arranging the electronic circuit chip while avoiding the crease position where a strong moment force is applied when the sheet is folded. .

  In addition, using the parameters required for the electronic circuit chip to be mounted on the sheet, the specification of the electronic circuit chip that is not damaged even when the sheet is bent is obtained.

  As described above, according to the present invention, the electronic circuit chip can be mounted on a soft material such as paper so as not to be damaged by bending or bending the material.

  In addition, according to the present invention, it is possible to easily mount the electronic circuit chip at an arbitrary place.

  Hereinafter, embodiments of the present invention will be described.

  In the following, an embodiment of the present invention will be described by taking an example in which an electronic circuit chip for storing information is mounted on paper together with an element for reading information from the electronic circuit chip in a non-contact manner. However, the electronic circuit chip to be mounted may be other than this, and the material of the sheet on which the electronic circuit chip is mounted may be a soft material that can be largely bent or bent other than paper. .

  Further, the sheet may be a sheet other than a plate, such as a tape, which is thin and has a very long lateral direction. The shape which can be wound up may be sufficient.

  Hereinafter, a first embodiment of the present invention will be described.

  First, FIG. 1 shows a circuit composed of an electronic circuit chip mounted on paper in this embodiment and an element for reading information from the electronic circuit chip in a non-contact manner.

  In the figure, reference numeral 1 denotes an electronic circuit chip storing information, which is an electronic circuit integrated on a silicon chip. The capacitor 2 and the antenna 3 are elements for reading information from the electronic circuit chip 1 in a non-contact manner.

  When a radio wave is applied to such a circuit from the outside, a current is induced in the antenna 3 by the radio wave, and electric power is stored in the capacitor 2. The electronic circuit chip 1 operates with the electric power stored in the capacitor, and transmits information stored in advance from the antenna 1 by radio waves. Therefore, information stored in the electronic circuit chip can be read from the outside in a non-contact manner by applying radio waves.

  Next, FIG. 2 (a) shows a circuit mounted on paper.

  In FIG. 2A, reference numeral 200 is a top view showing the front side of the paper on which the circuit is mounted. In the figure, 210a to 210d represent examples of arrangement of circuits mounted on paper.

  Here, the circuit is mounted on the paper by being sandwiched between the two sheets of bonded paper 400 and 401 as shown in the circuit arrangement example 210d in the cross-sectional views of the paper 201 and 203. Alternatively, as shown in the example of circuit arrangement 210d in the cross-sectional views of 202 and 204, it is attached to the paper by adhering to the back surface of the paper 500.

  Now, as in the arrangement example of 210a to 210d, the circuit has the electronic circuit chip 1 at a position where there is a possibility of a crease when the paper indicated by the alternate long and short dashed lines in the top view 200 is folded. Place it on the paper so that it is not positioned. The figure shows that this paper may be folded 1/2, 1/3, 1/4 in the horizontal direction of the paper, and 1/2, 1/3 in the vertical direction of the paper This is an example in the case where there is, and a one-dot chain line and a two-dot chain line in the figure represent a fold when folded as described above.

  The position where the electronic circuit chip 1 may not be positioned is a position corresponding to the form when the form in which the paper is folded is known in advance. When the form in which the paper is folded is not known in advance, the position is set according to one or a plurality of forms that are usually used as a folding method of the paper according to the type and use of the paper. In other words, except for special types and uses of paper, in general, the position of (1 / integer n) of the length in each of the vertical and horizontal directions of the paper is regarded as a position that can be a crease. Generally, as the integer n, 2, 3, 4, 5, 6, 8, 16 may be used. That is, there is a possibility that the position of 1/2, 1/3, 1/4, 1/6, 1/8, 1/16 of the length of each of the vertical and horizontal directions of the paper may be a crease. It may be the position.

  Thus, by arranging the electronic circuit chip while avoiding the crease position where a strong moment force is applied when the paper is bent, the electronic circuit chip can be prevented from being damaged due to the folding of the paper.

  The circuit is desirably arranged so that the electronic circuit chip 1 is located at a position close to the edge of the paper as in the circuit arrangement example 210a. Usually, since a strong force is not applied to the edge of the paper by bending or bending, it can be expected that the magnitude of the force applied to the electronic circuit chip 1 and the frequency at which the force is applied to the electronic circuit chip 1 are reduced. . Alternatively, for example, when a concave / convex mark for a blind person is printed on paper and the portion is stiff, even if the electronic circuit chip 1 is arranged there, the force applied to the electronic circuit chip 1 may be reduced. I can expect.

  Further, when the antenna 3 having a linear shape as a whole is used as the antenna 3 as in the present embodiment, the antenna 3 is parallel to the side of the paper as in the arrangement example of 210a to 210d. Arrange as follows. Usually, since paper is bent or bent in parallel with the side of the paper, it can be expected that the magnitude of the force applied to the antenna 3 and the frequency of the force applied to the antenna 3 are reduced.

  Further, the electronic circuit chip 1 that is weak against the force in the bending direction is formed so that the upper bottom surface (surface parallel to the paper surface) is small so that a large bending moment is not applied.

  Then, as shown in the enlarged view of the circuit in FIG. 2 (b), the electronic circuit chip 1 is placed on the capacitor 2 having a larger upper bottom surface (a surface parallel to the paper surface) than the electronic circuit chip 1. The electronic circuit chip 1 is arranged so that the upper bottom surface of the electronic circuit chip 1 is within the upper bottom surface of the capacitor 2 when viewed from the direction perpendicular to the paper surface. Thereby, the electronic circuit chip 1 can be protected from the external force applied by the capacitor 2. However, if the electronic circuit chip 1 is arranged so that the upper bottom surface of the electronic circuit chip 1 fits within the upper bottom surface of the capacitor 2 when viewed from the direction perpendicular to the paper surface, the circuit is connected to the capacitor 2. You may have a structure where the antenna 3 is located between the electronic circuit chips 1.

  Hereinafter, a second embodiment of the present invention will be described.

  FIG. 3A shows a circuit mounted on paper according to the second embodiment.

  In FIG. 3A, reference numeral 300 is a top view showing the front side of the paper on which the circuit is mounted. In the figure, 310a to 310h represent examples of arrangement of circuits mounted on paper.

  Here, as in the first embodiment, the circuit is shown in the cross-sectional view of the paper 301 and 303 as shown in the circuit arrangement example 310d as an example. The paper is attached by being sandwiched, or is attached to the paper by adhering to the back surface of the paper 500 as shown in the cross-sectional views of 302 and 304 as an example of circuit arrangement 310d.

  Here, in the second embodiment, the capacitor 2 is formed with strength to such an extent that it cannot be bent. And, as shown in the figure, the upper bottom surface of the capacitor 2 (the surface parallel to the paper surface) is divided by a dividing line (dotted line in the figure) and a side of the paper to divide the paper vertically and horizontally (1 / integer n). The circuit is arranged so that the capacitor 2 is positioned at the center of one of the grids, which is slightly smaller than the size of each grid (the shape is not limited to a square).

  In the illustrated example, as the lattice, a lattice composed of a dividing line (indicated by a one-dot chain line in the figure) and a paper edge that divides the paper into 1/2 in the vertical direction and 1/4 in the horizontal direction is set. An example is shown. When the form in which the paper is folded is known in advance, the dividing line that defines the lattice is set so that the fold generated in the form becomes the dividing line. Also, when the form in which the paper is folded is not known in advance, the fold line that is normally used as one of the forms of folding the paper according to the type and use of the paper is set to be a separator. In other words, except for special types and papers, in general, in the vertical and horizontal directions of the paper, the position of 1/2 of the length, the position of 1/3, and the position of 1/4 respectively. Any one of the position, the position every 1/6, the position every 1/8, and the position every 1/16 may be set as the position of the dividing line that defines the lattice.

  Further, in the second embodiment, as shown in the enlarged view of the circuit of FIG. 3B, on the capacitor 2 having a larger upper bottom surface (a surface parallel to the paper surface) than the electronic circuit chip 1, By disposing the electronic circuit chip 1 so that the upper bottom surface of the electronic circuit chip 1 is within the upper bottom surface of the capacitor 2 when viewed from the direction perpendicular to the paper surface, the electronic circuit chip 1 is formed by the capacitor 2. Be protected from external forces. However, if the electronic circuit chip 1 is arranged so that the upper bottom surface of the electronic circuit chip 1 fits within the upper bottom surface of the capacitor 2 when viewed from the direction perpendicular to the paper surface, the circuit is connected to the capacitor 2. You may have a structure where the antenna 3 is located between the electronic circuit chips 1.

  According to the second embodiment, since the portion occupied by the capacitor 2 is difficult to bend the paper, it can be expected that the paper is not bent at the portion occupied by the capacitor 2. Therefore, the portion occupied by the capacitor 2 is arranged. It can be expected that a strong force is not applied to the electronic circuit chip 1 from the outside. Further, since the capacitor 2 is disposed at a position that does not hinder the folding of the paper according to the normal form, the usability of the paper is not greatly deteriorated.

  Hereinafter, a third embodiment of the present invention will be described.

  When an electronic circuit chip is mounted on paper, if a force is applied from the outside during use of the paper, the force is also applied to the electronic circuit chip when the paper is bent. In the present embodiment, when the electronic circuit chip has a plate shape (a shape close to a rectangular parallelepiped), a condition that the electronic circuit chip is not damaged by a force applied from the outside is obtained, and the electronic circuit designed according to the obtained condition Place the chip on the paper.

  First, FIG. 4 shows a cross-sectional view of the electronic circuit chip mounted on paper.

  In the figure, 41 is an electronic circuit chip, and 42 and 43 are paper. 4A and 4C are diagrams in the case where the electronic circuit chip 41 is sandwiched and attached between the adhered papers 42 and 43, and FIG. 4A is a force applied to the paper. FIG. 4C shows a state in which the paper is bent due to a force applied thereto. 4B and 4D are diagrams in the case where the electronic circuit chip 41 is attached by being attached to the upper surface of the paper 43, and FIG. 4B shows a state in which no force is applied to the paper. FIG. 4D shows a state in which the paper is bent due to the force.

  Assuming that forces and moments act so as to bend the long sides of the plate surface of the electronic circuit chip, the forces and moments actually act at various positions of the electronic circuit chip. Uniform load acting on the entire plate surface, concentrated load acting on the free end and moment acting on the free end when one of the short sides of the chip surface is a fixed end and the other side is a free end It is replaced with Whether the electronic circuit chip is sandwiched between papers or adhered to the upper surface, it can be approximated in the same manner.

  FIG. 5 is a diagram schematically showing forces and moments acting to bend the electronic circuit chip.

In the figure, the diagonally upward slanting line portion represents a cross section parallel to the long side of the plate surface of the electronic circuit chip 41. The short side of the plate surface of the electronic circuit chip 41 corresponds to both ends of the cross section of the electronic circuit chip 41 in FIG. Of these, the left end is a free end and the right end is a fixed end. In FIG. 4, the fixed portion is indicated by a diagonally downward sloping line. H is the thickness (m) of the electronic circuit chip 41, and L is the length (m) of the long side of the electronic circuit chip. P is an evenly distributed load per unit area (N / m ² ) acting on the entire surface of the electronic circuit chip, W is a concentrated load per unit length (N / m) acting on the free end, and M is acting on the free end Bending moment (N) per unit length.

  The forces P, W, and moment M that cause the electronic circuit chip 41 to bend are assumed to work in this cross section, and the direction that causes the electronic circuit chip 41 to be bent downward in the figure is positive. In this embodiment, the forces P and W and the moment M are positive values.

The free end is the origin and the x-axis is taken to the right. Moment per unit length acting on the position x (m) by a uniformly distributed load P is ^Px 2/2 (N). The moment per unit length acting on the position x (m) due to the concentrated load W is Wx (N). The moment per unit length acting by the bending moment M becomes a constant value M (N) regardless of the value of x. Therefore, the sum _{M SUM} of moment per unit length acting on the position x (m) is expressed as ^{Px 2/2 + Wx + M} (N). Since x takes a value between 0 and L,
M _SUM takes a maximum value when x = L, the value _{M MAX} is a ^{PL 2/2 + WL + M} (N).

In this embodiment, since the electronic circuit chip 41 can be approximated to a rectangular parallelepiped, the bending stress acting on the electronic circuit chip 41 takes the maximum value at the place where the maximum bending moment works, and the value σ _MAX is 6M _MAX / H ² (N / M ² ).

Here, when the bending strength of the electronic circuit chip 41 is σ (N / m ² ), the condition that the electronic circuit chip 41 is not damaged is σ ≧ σ _MAX .
3PL ² + 6WL + 6M−σH ² ≦ 0 (Expression 1)
Get.

When (Equation 1) is solved for L, H, and σ, L ≦ {−W + (W ² −PA) ^1/2 } / P (Equation 2)
H ≧ {3 (PL ² + 2WL + 2M) / σ} ^1/2 (Expression 3)
σ ≧ (3PL ² + 6WL + 6M) / H ² (Formula 4)
Get. It is A = 2M-σH ^2/3 in (Equation 2).

As a condition that the electronic circuit chip is not damaged, the maximum value of the side length L (m) from (Equation 2), the minimum value of the thickness H (m) from (Equation 3), and the bending strength σ from (Equation 4). A minimum value of (N / m ² ) is obtained.

For example, when it is necessary to mount the electronic circuit chip in paper and make the thickness so as not to be understood even if it is traced with a finger from the outside, the maximum value of the thickness H (m) of the electronic circuit chip is determined. To do. Bending strength σ (N / m ² ) required from the material and shape of the electronic circuit chip, evenly distributed load P (N / m ² ) per unit area expected to be applied in the use of paper, per unit length When the concentrated load W (N / m) and the moment M (N) per unit length are substituted into (Equation 2), the maximum side length L (m) for preventing damage to the electronic circuit chip is obtained.

As another example, when the electronic circuit chip needs to be multifunctional, the circuit scale becomes large, and therefore the minimum value of the length L (m) of the long side of the electronic circuit chip is determined. The bending strength σ (N / m ² ) of the electronic circuit chip, the uniformly distributed load P (N / m ² ) per unit area, and the concentrated load W (N / m) obtained per the unit length were obtained in the same manner as in the above example. By substituting m) and the moment M (N) per unit length into (Equation 3), the minimum thickness H (m) for preventing the electronic circuit chip from being damaged is obtained.

  As described above, according to this embodiment, it is possible to provide an electronic circuit chip that is not damaged even when attached to a soft material such as paper. In addition, a sheet on which the electronic circuit chip designed in this way is mounted can be provided.

  Next, a fourth embodiment of the present invention will be described.

  In the present embodiment, a tape-shaped sheet is used as a sheet on which the electronic circuit chip is mounted.

  By using a tape-like sheet that can be wound up as illustrated in FIG. 6, it is possible to provide not only a state in which the sheet is separated like a plate-like sheet but also a state in which a continuous sheet is wound. It becomes possible.

  A plurality of electronic circuit chips 41 are mounted on the adhesive tape 61 at regular intervals. The adhesive tape 61 is stored in a wound state, and is used by being pulled out as much as necessary. The adhesive tape 61 has a sewing hole 62 for cutting out with only one electronic circuit chip 41 mounted.

  According to the present embodiment, even if the electronic circuit chip is not previously mounted on a desired object, the adhesive tape of the portion where the electronic circuit chip 41 is mounted can be separated and pasted to the object, Electronic circuit chips can be installed.

  According to the present embodiment, an arbitrary number of electronic circuit chips 41 can be attached to an arbitrary object to which the adhesive tape 61 can be attached.

  In addition, although this embodiment demonstrated using the adhesive tape 61, you may use a plate-shaped adhesive sheet like a seal | sticker instead of a tape-shaped thing.

  Moreover, if the tape 61 cut | disconnected by other means can be mounted | worn on a desired object, it does not need to have adhesiveness.

  The same electronic circuit chip 41 is not limited to the same type, and a plurality of types may be mixedly mounted.

Moreover, you may be comprised so that it may isolate | separate for every several electronic circuit chip 41 which consists of the same kind or multiple types.

It is a circuit diagram of the circuit using the electronic circuit chip with which paper is mounted in the embodiment of the present invention. FIG. 3 is a diagram showing a circuit using an electronic circuit chip mounted on paper according to the first embodiment of the present invention. FIG. 6 is a diagram showing a circuit using an electronic circuit chip mounted on paper according to a second embodiment of the present invention. It is sectional drawing of the state which mounted | wore paper with the electronic circuit chip in 3rd Embodiment of this invention. It is the figure which represented approximately the force and moment which act so that an electronic circuit chip might bend in 3rd Embodiment of this invention. It is a figure of the tape with which the electronic circuit chip was mounted | worn in 4th Embodiment of this invention.

Explanation of symbols

1: electronic circuit chip, 2: capacitor, 3: antenna, 210, 310: circuit, 400, 401, 500: paper, 41: electronic circuit chip, 42, 43: paper

Claims (14)

A method of mounting a plate-like electronic circuit chip together with other plate-like electric elements on a flexible sheet,
Select the other electric element and the electronic circuit chip so that the plate surface of the other electric element is larger than the plate surface of the electronic circuit chip,
When the plate surface of the other electric element and the plate surface of the electronic circuit chip are parallel to the sheet surface and viewed from a direction perpendicular to the sheet surface, the plate surface of the other electric element An electronic circuit chip mounting method comprising mounting the other electric element and the electronic circuit chip on the sheet so that a plate surface of the electronic circuit chip is contained therein. A bendable method of mounting an electronic circuit chip on a sheet,
A mounting method of an electronic circuit chip, wherein the electronic circuit chip is mounted on the sheet so that the electronic circuit chip is not positioned at a position that becomes a fold when the sheet is folded according to a predetermined folding method. A method of mounting an electronic circuit chip on a sheet having a rectangular sheet surface that can be bent,
At least the position of 1/2 of the length in the longer direction of the length and width of the sheet surface, and the position in the shorter direction of the position of every 1/3 or 1/4 and the length and width of the sheet surface A mounting method for an electronic circuit chip, wherein the electronic circuit chip is mounted on the sheet so that the electronic circuit chip is not positioned at a position including a half of the position. An electronic circuit chip mounting method according to claim 2,
An electronic circuit chip mounting method comprising mounting an electronic circuit chip at a position near an edge of a sheet surface. A method of mounting a plate-like electronic circuit chip together with other plate-like electric elements on a sheet having a quadrangular foldable sheet surface,
The plate surface of the other electric element has a size slightly smaller than the size of a quadrangle obtained by dividing the sheet surface into n × m (where n and m are integers of 2 or more),
When the plate surface of the other electric element and the plate surface of the electronic circuit chip are parallel to the sheet surface, and the plate surface of the other electric element is viewed from a direction perpendicular to the sheet surface. In addition, the sheet surface fits into one of the squares obtained by dividing the sheet surface into n × m, and when viewed from a direction perpendicular to the sheet surface, it is within the plate surface of the other electric element. A mounting method of an electronic circuit chip, wherein the other electric element and the electronic circuit chip are mounted on the sheet so that a plate surface of the electronic circuit chip is accommodated. An electronic circuit chip mounting method according to claim 2,
A mounting method of an electronic circuit chip, wherein a long bar or a long plate-like electric component is mounted on the sheet such that the longitudinal direction of the electric component coincides with the direction of the side of the sheet. An electronic circuit chip mounting method according to claim 2,
The electronic circuit chip mounting method, wherein the sheet is paper. An electronic circuit chip mounting method according to claim 2,
The method of mounting an electronic circuit chip, wherein the sheet is in a tape shape. A method for mounting an electronic circuit chip according to claim 7,
The electronic circuit chip mounting method, wherein the sheet has a two-layer structure, and the electronic circuit chip is mounted between layers of the sheet. A method for mounting an electronic circuit chip according to claim 7,
The electronic circuit chip mounting method, wherein the electronic circuit chip is mounted on one of the two sheet surfaces of the front and back of the sheet. A plate-shaped electronic circuit chip to be mounted on a flexible sheet,
The electronic circuit chip is
The force acting on the electronic circuit chip is equivalent to the case where one side of the short side of the plate surface of the electronic circuit chip is a fixed end and the other side is a free end, and is applied to the entire plate surface of the electronic circuit chip. Represented by a uniformly distributed load P (N / m ² ) per working unit area and a concentrated load W (N / m) per unit length working at the free end, and
The unit length acting on the free end corresponding to the moment acting on the electronic circuit chip is equivalent to the case where one of the short sides of the plate surface of the electronic circuit chip is a fixed end and the opposite side is a free end. Represented by the moment of contact M (N), and
The thickness of the electronic circuit chip is represented by H (m), and
L (m) represents the length of the long side of the electronic circuit chip, and
The bending strength of the stronger one of the bending strength of another electric element having a larger plate shape than the electronic circuit chip bonded to the plate surface of the electronic circuit chip and the bending strength of the electronic circuit chip is σ. when expressed in (N / ^{m 2),}
3PL ² + 6WL + 6M−σH ² ≦ 0
An electronic circuit chip comprising a thickness, a long side length and a bending strength satisfying   A sheet on which the electronic circuit chip according to claim 11 is mounted. A sheet having a quadrangular foldable sheet on which an electric circuit having a plate-like electronic circuit chip, a plate-like capacitor and an antenna is mounted,
The electronic circuit chip is attached to the sheet so that the electronic circuit chip is not positioned at a position that becomes a fold when the sheet is folded according to a predetermined folding method; and
The capacitor and the electronic circuit chip have a plate surface of the capacitor and a plate surface of the electronic circuit chip parallel to the sheet surface, and
When viewed from a direction perpendicular to the sheet surface, the electronic circuit chip is mounted on the sheet so that the plate surface of the capacitor is within the plate surface of the capacitor, and the antenna has a longitudinal direction of the antenna. The sheet is mounted on the sheet so as to coincide with the direction of the side of the sheet. A sheet having a quadrangular foldable sheet on which an electric circuit having a plate-like electronic circuit chip, a plate-like capacitor and an antenna is mounted,
The plate surface of the capacitor has a size slightly smaller than the size of a quadrangle obtained by dividing the sheet surface into n × m (where n and m are integers of 2 or more),
In the sheet, the plate surface of the capacitor and the plate surface of the electronic circuit chip are parallel to the sheet surface, and
When the plate surface of the capacitor is viewed from a direction perpendicular to the sheet surface, it fits in one of the squares obtained by dividing the sheet surface into n × m, and
When viewed from a direction perpendicular to the sheet surface, the capacitor, the electronic circuit chip, and the antenna are arranged so that the plate surface of the electronic circuit chip and the outline of the antenna are within the plate surface of the capacitor. Is mounted on the sheet.

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