JP2005536922A - 高出力ドハティ増幅器 - Google Patents
高出力ドハティ増幅器 Download PDFInfo
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- JP2005536922A JP2005536922A JP2004528734A JP2004528734A JP2005536922A JP 2005536922 A JP2005536922 A JP 2005536922A JP 2004528734 A JP2004528734 A JP 2004528734A JP 2004528734 A JP2004528734 A JP 2004528734A JP 2005536922 A JP2005536922 A JP 2005536922A
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Abstract
Description
4、6、10 インダクタンス
8 出力端子
14 入力端子
16 インダクタンス
18 出力端子
20、22 キャパシタンス
24、26 グラウンド
27 線
28 入力端子
29 ゲート端子
30 トランジスタ
34 ゲート抵抗
36 ドレインゲートキャパシタンス
40 電流源
42 抵抗
44 出力キャパシタンス
46 ソース抵抗
56 出力端子
64 抵抗
66 キャパシタンス
70 電流源
80 インダクタンス
82 キャパシタンス
84 インダクタンス
92 メイン増幅器トランジスタダイ
94 コンデンサ
98 ピーク増幅器トランジスタ
100 コンデンサ
102 入力リード
104 支持層
106、108、110、112、114、116 ボンドワイヤ
118 メイン増幅器トランジスタダイ
120 補償回路
124 出力リード
292 メイン増幅器トランジスタダイ
298 ピーク増幅器トランジスタ
300 コンデンサ
400、402、404 インダクタンス
404 インダクタンス
406 キャパシタンス
Claims (18)
- 少なくとも1つの入力端子および少なくとも1つの出力端子を有する高出力ドハティ増幅器回路であって、
メイン増幅器段を構成する少なくとも1つのキャリヤトランジスタと、
ピーク増幅器段を構成する少なくとも1つのピークトランジスタと、
入力端子をキャリヤトランジスタの入力に接続する第1の入力線と、
入力端子をピークトランジスタの入力に接続する第2の入力線と、
出力端子をキャリヤトランジスタの出力に接続する第1の出力線と、
出力端子をピークトランジスタの出力に接続する第2の出力線と、
を備えた、高出力ドハティ増幅器回路。 - 第1の入力線が、インダクタを含む、請求項1に記載の高出力ドハティ増幅器回路。
- 第2の入力線が、少なくとも1つのキャパシタンスおよび/または少なくとも1つのインダクタンスからなる直列回路および/または並列回路を備えた、請求項1に記載の高出力ドハティ増幅器回路。
- 第2の入力線がインダクタを備えた、請求項3に記載の高出力ドハティ増幅器回路。
- 第1の出力線が、少なくとも1つのキャパシタンスおよび/または少なくとも1つのインダクタンスからなる直列回路および/または並列回路を備えた、請求項1に記載の高出力ドハティ増幅器回路。
- 第1の出力線がインダクタを備えた、請求項5に記載の高出力ドハティ増幅器回路。
- 第2の出力線がインダクタを備えた、請求項1に記載の高出力ドハティ増幅器回路。
- キャリヤトランジスタとピークトランジスタとが、個々の相互コンダクタンスパラメータおよびしきい電圧値を有する、請求項1に記載の高出力ドハティ増幅器回路。
- キャリヤトランジスタ出力およびピークトランジスタ出力が、それぞれ、補償回路に接続された、請求項1に記載の高出力ドハティ増幅器回路。
- インピーダンス変換回路が、入力端子/出力端子と入力線/出力線との間に接続された、請求項1に記載の高出力ドハティ増幅器回路。
- キャリヤトランジスタおよびピークトランジスタが、トランジスタの増幅クラスパラメータを所望される通りに動的に制御する制御回路に接続された、請求項1に記載の高出力ドハティ増幅器回路。
- 高出力ドハティ増幅器回路パッケージであって、
ドハティ増幅器回路の回路構成要素を支持する支持構造体と、
少なくとも1つの入力端子および少なくとも1つの出力端子であり、それらの端子の両方が、支持構造体上に支持された、前記少なくとも1つの入力端子および少なくとも1つの出力端子と、
メイン増幅器段を構成する少なくとも1つのキャリヤトランジスタおよびピーク増幅器段を構成する少なくとも1つのピークトランジスタであり、それらのトランジスタの両方が、支持構造体上に支持された、前記少なくとも1つのキャリヤトランジスタおよび少なくとも1つのピークトランジスタと、
入力端子をキャリヤトランジスタの入力に接続する第1の入力線と、
入力端子をピークトランジスタの入力に接続する第2の入力線と、
出力端子をキャリヤトランジスタの出力に接続する第1の出力線と、
出力端子をピークトランジスタの出力に接続する第2の出力線と、
を備えた、高出力ドハティ増幅器回路パッケージ。 - 入力線および出力線が、少なくとも1つのキャパシタンスおよび/または少なくとも1つのインダクタンスからなる直列回路および/または並列回路を備えた擬似伝送線である、請求項12に記載の高出力ドハティ増幅器回路パッケージ。
- 補償回路が、トランジスタの出力に接続された、請求項12に記載の高出力ドハティ増幅器回路パッケージ。
- 補償回路が、少なくとも1つのインダクタンスおよび/または少なくとも1つのキャパシタンスからなる直列回路および/または並列回路を備えた、請求項12に記載の高出力ドハティ増幅器回路パッケージ。
- インダクタンスが、トランジスタと入力端子および出力端子との間にそれぞれ提供されたボンドワイヤによって構成された、請求項12に記載の高出力ドハティ増幅器回路パッケージ。
- 入力線が、所定の長さを有する平行なボンドワイヤからなる、請求項12に記載の高出力ドハティ増幅器回路パッケージ。
- キャパシタンスが、第1の導電層、絶縁層、および、グラウンドに接続された第2の導電層によって実現された、請求項12に記載の高出力ドハティ増幅器回路パッケージ。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02078421 | 2002-08-19 | ||
| PCT/IB2003/003278 WO2004017512A1 (en) | 2002-08-19 | 2003-07-18 | High power doherty amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2005536922A true JP2005536922A (ja) | 2005-12-02 |
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ID=31725472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004528734A Pending JP2005536922A (ja) | 2002-08-19 | 2003-07-18 | 高出力ドハティ増幅器 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7078976B2 (ja) |
| EP (1) | EP1532731B1 (ja) |
| JP (1) | JP2005536922A (ja) |
| KR (1) | KR20050046731A (ja) |
| CN (1) | CN100477494C (ja) |
| AT (1) | ATE525800T1 (ja) |
| AU (1) | AU2003247109A1 (ja) |
| WO (1) | WO2004017512A1 (ja) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008099488A1 (ja) * | 2007-02-15 | 2008-08-21 | Panasonic Corporation | 電力増幅器 |
| JP2010536224A (ja) * | 2007-08-06 | 2010-11-25 | ウィパム,インコーポレイテッド | 広帯域増幅装置 |
| JP2010273117A (ja) * | 2009-05-21 | 2010-12-02 | Nec Corp | 増幅器 |
| JP2013141291A (ja) * | 2007-06-22 | 2013-07-18 | Cree Inc | 内部における高調波周波数低減を伴うrfパワートランジスタパッケージ、及び内部における高調波周波数低減を伴うrfパワートランジスタパッケージを形成する方法 |
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Families Citing this family (98)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1853343B (zh) | 2003-09-17 | 2012-01-11 | 日本电气株式会社 | 放大器 |
| US7710202B2 (en) | 2003-09-17 | 2010-05-04 | Nec Corporation | Amplifier |
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| KR100756041B1 (ko) * | 2005-06-27 | 2007-09-07 | 삼성전자주식회사 | 믹서를 이용한 도허티 증폭장치 및 송신기 |
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| US9106316B2 (en) | 2005-10-24 | 2015-08-11 | Parkervision, Inc. | Systems and methods of RF power transmission, modulation, and amplification |
| US7800448B2 (en) * | 2006-04-14 | 2010-09-21 | Nxp B.V. | Doherty amplifier |
| US8031804B2 (en) | 2006-04-24 | 2011-10-04 | Parkervision, Inc. | Systems and methods of RF tower transmission, modulation, and amplification, including embodiments for compensating for waveform distortion |
| US7937106B2 (en) | 2006-04-24 | 2011-05-03 | ParkerVision, Inc, | Systems and methods of RF power transmission, modulation, and amplification, including architectural embodiments of same |
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| US8315336B2 (en) | 2007-05-18 | 2012-11-20 | Parkervision, Inc. | Systems and methods of RF power transmission, modulation, and amplification, including a switching stage embodiment |
| US20100026387A1 (en) * | 2006-11-23 | 2010-02-04 | Nxp, B.V. | Integrated doherty type amplifier arrangement with high power efficiency |
| US7620129B2 (en) | 2007-01-16 | 2009-11-17 | Parkervision, Inc. | RF power transmission, modulation, and amplification, including embodiments for generating vector modulation control signals |
| WO2008156800A1 (en) | 2007-06-19 | 2008-12-24 | Parkervision, Inc. | Combiner-less multiple input single output (miso) amplification with blended control |
| US8228123B2 (en) * | 2007-08-29 | 2012-07-24 | Nxp B.V. | Integrated Doherty amplifier |
| US9325280B2 (en) * | 2007-09-03 | 2016-04-26 | Ampleon Netherlands B.V. | Multi-way doherty amplifier |
| US7764120B2 (en) | 2008-08-19 | 2010-07-27 | Cree, Inc. | Integrated circuit with parallel sets of transistor amplifiers having different turn on power levels |
| ITRM20080480A1 (it) * | 2008-09-04 | 2010-03-05 | Univ Roma | Amplificatore di tipo doherty |
| US8547176B2 (en) * | 2009-06-11 | 2013-10-01 | Saab Ab | Distributed power amplifier with active matching |
| US8410853B2 (en) | 2010-06-01 | 2013-04-02 | Nxp B.V. | Inductive circuit arrangement |
| EP2393201A1 (en) | 2010-06-02 | 2011-12-07 | Nxp B.V. | Two stage doherty amplifier |
| EP2413498A1 (en) * | 2010-07-30 | 2012-02-01 | Nxp B.V. | Doherty amplifier |
| KR101128486B1 (ko) * | 2010-11-23 | 2012-03-27 | 포항공과대학교 산학협력단 | 전력 증폭 장치 |
| EP2458730B8 (en) | 2010-11-29 | 2015-08-05 | Nxp B.V. | Radiofrequency amplifier |
| EP2463905B1 (en) | 2010-12-10 | 2014-10-01 | Nxp B.V. | Packaged RF transistor with special supply voltage leads |
| US8749306B2 (en) | 2011-03-16 | 2014-06-10 | Cree, Inc. | Enhanced Doherty amplifier |
| WO2012139126A1 (en) | 2011-04-08 | 2012-10-11 | Parkervision, Inc. | Systems and methods of rf power transmission, modulation, and amplification |
| JP6025820B2 (ja) * | 2011-04-20 | 2016-11-16 | フリースケール セミコンダクター インコーポレイテッド | 増幅器及び関連する集積回路 |
| CN102158184A (zh) * | 2011-04-29 | 2011-08-17 | 中兴通讯股份有限公司 | 一种功率放大管以及功率放大方法 |
| EP2521257B1 (en) | 2011-05-06 | 2014-11-12 | Nxp B.V. | Doherty amplifier circuit |
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| WO2012167111A2 (en) | 2011-06-02 | 2012-12-06 | Parkervision, Inc. | Antenna control |
| US8514007B1 (en) * | 2012-01-27 | 2013-08-20 | Freescale Semiconductor, Inc. | Adjustable power splitter and corresponding methods and apparatus |
| US9203348B2 (en) | 2012-01-27 | 2015-12-01 | Freescale Semiconductor, Inc. | Adjustable power splitters and corresponding methods and apparatus |
| US9077285B2 (en) | 2012-04-06 | 2015-07-07 | Freescale Semiconductor, Inc. | Electronic devices with multiple amplifier stages and methods of their manufacture |
| EP2665181B1 (en) * | 2012-05-17 | 2014-12-17 | Nxp B.V. | Amplifier circuit |
| EP2698918A1 (en) * | 2012-08-14 | 2014-02-19 | Nxp B.V. | Amplifier circuit |
| WO2014068351A2 (en) | 2012-10-31 | 2014-05-08 | Freescale Semiconductor, Inc. | Amplification stage and wideband power amplifier |
| US9692361B2 (en) | 2013-01-10 | 2017-06-27 | Nxp Usa, Inc. | Doherty amplifier |
| US20150080063A1 (en) | 2013-09-17 | 2015-03-19 | Parkervision, Inc. | Method, apparatus and system for rendering an information bearing function of time |
| US9225291B2 (en) | 2013-10-29 | 2015-12-29 | Freescale Semiconductor, Inc. | Adaptive adjustment of power splitter |
| EP2869463B1 (en) * | 2013-10-31 | 2016-01-06 | Samba Holdco Netherlands B.V. | Doherty amplifier structure |
| US9337183B2 (en) * | 2013-11-01 | 2016-05-10 | Infineon Technologies Ag | Transformer input matched transistor |
| WO2015127610A1 (zh) * | 2014-02-26 | 2015-09-03 | 华为技术有限公司 | 一种功率放大的方法及功率放大器 |
| US9438191B2 (en) | 2014-05-15 | 2016-09-06 | Freescale Semiconductor, Inc. | Radio frequency power amplifier circuit |
| EP2983291B1 (en) * | 2014-08-07 | 2017-12-06 | Ampleon Netherlands B.V. | Integrated 3-way doherty amplifier |
| JP6383224B2 (ja) * | 2014-09-08 | 2018-08-29 | 株式会社東芝 | 半導体増幅器 |
| US9774299B2 (en) | 2014-09-29 | 2017-09-26 | Nxp Usa, Inc. | Modifiable signal adjustment devices for power amplifiers and corresponding methods and apparatus |
| US9503030B2 (en) | 2014-10-17 | 2016-11-22 | Freescale Semiconductor, Inc. | Radio frequency power amplifier |
| US9853603B2 (en) | 2014-11-14 | 2017-12-26 | Microsoft Technology Licensing, Llc | Power amplifier for amplifying radio frequency signal |
| US9843255B1 (en) | 2014-12-08 | 2017-12-12 | Nxp Usa, Inc. | Charge pump apparatus, phase-locked loop, and method of operating a charge pump apparatus |
| US9589916B2 (en) | 2015-02-10 | 2017-03-07 | Infineon Technologies Ag | Inductively coupled transformer with tunable impedance match network |
| US10171039B2 (en) | 2015-08-31 | 2019-01-01 | Infineon Technologies Ag | Devices and methods that facilitate power amplifier off state performance |
| US9647611B1 (en) | 2015-10-28 | 2017-05-09 | Nxp Usa, Inc. | Reconfigurable power splitters and amplifiers, and corresponding methods |
| US9621115B1 (en) | 2015-12-11 | 2017-04-11 | Nxp Usa, Inc. | Amplifier devices with in-package transmission line combiner |
| EP3255796B1 (en) | 2016-06-08 | 2020-01-08 | NXP USA, Inc. | Method and apparatus for generating a charge pump control signal |
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| EP3312990B1 (en) | 2016-10-24 | 2019-12-11 | NXP USA, Inc. | Amplifier devices with input line termination circuits |
| US10211784B2 (en) * | 2016-11-03 | 2019-02-19 | Nxp Usa, Inc. | Amplifier architecture reconfiguration |
| US10284146B2 (en) | 2016-12-01 | 2019-05-07 | Nxp Usa, Inc. | Amplifier die with elongated side pads, and amplifier modules that incorporate such amplifier die |
| US10284147B2 (en) | 2016-12-15 | 2019-05-07 | Nxp Usa, Inc. | Doherty amplifiers and amplifier modules with shunt inductance circuits that affect transmission line length between carrier and peaking amplifier outputs |
| US10381984B2 (en) | 2016-12-15 | 2019-08-13 | Nxp Usa, Inc. | Amplifiers and amplifier modules with shunt inductance circuits that include high-Q capacitors |
| EP3574581A4 (en) * | 2017-01-26 | 2020-12-30 | Telefonaktiebolaget LM Ericsson (PUBL) | APPARATUS AND METHOD FOR IMPROVING THE EFFICIENCY OF A POWER AMPLIFIER |
| EP3577757B1 (en) * | 2017-02-02 | 2024-12-18 | MACOM Technology Solutions Holdings, Inc. | 90-degree lumped and distributed doherty impedance inverter |
| US11233483B2 (en) | 2017-02-02 | 2022-01-25 | Macom Technology Solutions Holdings, Inc. | 90-degree lumped and distributed Doherty impedance inverter |
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| WO2018197918A1 (en) | 2017-04-24 | 2018-11-01 | Macom Technology Solutions Holdings, Inc. | Improved efficiency, symmetrical doherty power amplifier |
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| CN107453713B (zh) * | 2017-07-12 | 2021-01-26 | 杭州电子科技大学 | 一种改善栅源寄生效应的功率放大器 |
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| FR3070100A1 (fr) | 2017-08-14 | 2019-02-15 | Macom Technology Solutions Holdings, Inc. | Architecture d'amplificateur de puissance sans modulation, a large bande et a haut rendement |
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| JP2019092009A (ja) * | 2017-11-13 | 2019-06-13 | 住友電気工業株式会社 | 半導体増幅素子及び半導体増幅装置 |
| US10594266B2 (en) | 2017-12-04 | 2020-03-17 | Nxp Usa, Inc. | Multiple-path amplifier with series component along inverter between amplifier outputs |
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| CN112640298A (zh) | 2018-10-05 | 2021-04-09 | 镁可微波技术有限公司 | 低负载调制功率放大器 |
| US11223336B2 (en) | 2018-12-05 | 2022-01-11 | Nxp Usa, Inc. | Power amplifier integrated circuit with integrated shunt-l circuit at amplifier output |
| EP3664287A1 (en) | 2018-12-05 | 2020-06-10 | NXP USA, Inc. | Integrally-formed multiple-path power amplifier with on-die combining node structure |
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| US11018629B2 (en) | 2019-06-24 | 2021-05-25 | Nxp Usa, Inc. | Integrated multiple-path power amplifier |
| KR102097532B1 (ko) * | 2019-08-26 | 2020-04-06 | 한화시스템(주) | 소형 전력증폭기 |
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Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5739723A (en) * | 1995-12-04 | 1998-04-14 | Motorola, Inc. | Linear power amplifier using active bias for high efficiency and method thereof |
| JP3296482B2 (ja) * | 1998-08-13 | 2002-07-02 | 富士写真フイルム株式会社 | 熱現像装置 |
| US6329877B1 (en) | 1999-06-25 | 2001-12-11 | Agere Systems Guardian Corp. | Efficient power amplifier |
| US6320462B1 (en) * | 2000-04-12 | 2001-11-20 | Raytheon Company | Amplifier circuit |
| US6731173B1 (en) * | 2000-10-23 | 2004-05-04 | Skyworks Solutions, Inc. | Doherty bias circuit to dynamically compensate for process and environmental variations |
| US6359513B1 (en) | 2001-01-31 | 2002-03-19 | U.S. Philips Corporation | CMOS power amplifier with reduced harmonics and improved efficiency |
| US6469581B1 (en) * | 2001-06-08 | 2002-10-22 | Trw Inc. | HEMT-HBT doherty microwave amplifier |
| KR100450744B1 (ko) * | 2002-08-29 | 2004-10-01 | 학교법인 포항공과대학교 | 도허티 증폭기 |
-
2003
- 2003-07-18 AT AT03787936T patent/ATE525800T1/de not_active IP Right Cessation
- 2003-07-18 EP EP03787936A patent/EP1532731B1/en not_active Expired - Lifetime
- 2003-07-18 US US10/524,571 patent/US7078976B2/en not_active Expired - Lifetime
- 2003-07-18 CN CNB038193744A patent/CN100477494C/zh not_active Expired - Lifetime
- 2003-07-18 AU AU2003247109A patent/AU2003247109A1/en not_active Abandoned
- 2003-07-18 WO PCT/IB2003/003278 patent/WO2004017512A1/en not_active Ceased
- 2003-07-18 KR KR1020057002709A patent/KR20050046731A/ko not_active Ceased
- 2003-07-18 JP JP2004528734A patent/JP2005536922A/ja active Pending
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| JP2013141291A (ja) * | 2007-06-22 | 2013-07-18 | Cree Inc | 内部における高調波周波数低減を伴うrfパワートランジスタパッケージ、及び内部における高調波周波数低減を伴うrfパワートランジスタパッケージを形成する方法 |
| JP2010536224A (ja) * | 2007-08-06 | 2010-11-25 | ウィパム,インコーポレイテッド | 広帯域増幅装置 |
| US8198938B2 (en) | 2007-08-06 | 2012-06-12 | Wipam, Inc. | Broadband power amplifier |
| JP2010273117A (ja) * | 2009-05-21 | 2010-12-02 | Nec Corp | 増幅器 |
| JP2013232871A (ja) * | 2012-05-02 | 2013-11-14 | Toshiba Corp | ドハティ回路 |
| JP2017501662A (ja) * | 2014-01-06 | 2017-01-12 | ホアウェイ・テクノロジーズ・カンパニー・リミテッド | Doherty電力増幅器、通信デバイス、およびシステム |
| US9876474B2 (en) | 2014-01-06 | 2018-01-23 | Huawei Technologies Co., Ltd | Doherty power amplifier, communications device, and system |
| JP2018023043A (ja) * | 2016-08-04 | 2018-02-08 | 富士通株式会社 | 電力増幅装置、半導体集積回路および電力増幅装置の制御方法 |
| US11496102B2 (en) | 2018-05-28 | 2022-11-08 | Mitsubishi Electric Corporation | Amplifier |
| JPWO2020217319A1 (ja) * | 2019-04-23 | 2021-10-21 | 三菱電機株式会社 | ドハティ増幅器及び通信装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004017512A1 (en) | 2004-02-26 |
| ATE525800T1 (de) | 2011-10-15 |
| EP1532731A2 (en) | 2005-05-25 |
| WO2004017512A9 (en) | 2005-02-17 |
| US20050231278A1 (en) | 2005-10-20 |
| CN100477494C (zh) | 2009-04-08 |
| CN1675826A (zh) | 2005-09-28 |
| EP1532731B1 (en) | 2011-09-21 |
| AU2003247109A1 (en) | 2004-03-03 |
| US7078976B2 (en) | 2006-07-18 |
| KR20050046731A (ko) | 2005-05-18 |
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