JP2005352434A - Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce manufacturing steps.
A plurality of independent antennas (120, 122) are arranged on an array substrate (102) provided with a pixel electrode (110) serving as a display portion and display portion drive wiring. Simultaneously with the step of forming the pixel electrode 110 or the display portion drive wiring, the layers of the antennas 120 and 122 are formed using the same conductive material or semiconductor material as the pixel electrode 110 or the display portion drive wiring.
[Selection] FIG.

Description

  The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus.

  Various electronic devices having a function of communicating with other devices wirelessly have been widely used. For example, under a technology using RFID (Radio Frequency Identification) for identifying a user or an article, an IC tag (RFID) in which various data is stored and the IC tag are contactless. A device for writing and reading data (hereinafter referred to as “reader / writer”) is used. Each of the RFID and the reader / writer is provided with an antenna and a communication chip that modulates and demodulates electromagnetic waves.

  In the RFID and the reader / writer, the antenna is usually a loop antenna, and only one antenna is provided for each device. These antennas communicate reliably even when the distance from the communication partner device is long, or even if an object that shields or obstructs radio waves, such as metal or liquid, exists between the antenna and the communication partner device. It is hoped that. In general, since each device has only a single communication chip, only a single type of information can be used even if the usable frequency band of the antenna is wide.

  On the other hand, in the technical field of mobile communication terminals, a proposal is made to use a helical antenna with a high gain to increase reception sensitivity and transmission radio wave intensity, and a plurality of communication control processing units are used so that a plurality of communication modes can be executed. Proposals have already been made (for example, Patent Document 1).

JP 11-215022 (FIGS. 7 and 8)

  Many electronic devices that perform communication have a display device. For example, most mobile communication terminals are now equipped with a display device, and the same applies to RFID reader / writers. An RFID that is read and written by a reader / writer may be provided with a display device for providing information to humans. In these technologies, the antenna is manufactured separately from the display device. In order to reduce the manufacturing cost, it is necessary to simplify the process.

  The present invention provides an electro-optical device, a method of manufacturing an electro-optical device, and an electronic apparatus that can reduce manufacturing steps.

The electro-optical device according to the present invention includes at least one substrate provided with a display unit and a display unit drive wiring for driving the display unit, and a plurality of independent antennas each of which is disposed on the substrate. And a plurality of communication circuits that are electrically connected to the plurality of antennas and control transmission / reception of data via the connected antennas. And the part arrange | positioned at the said board | substrate among each of these antennas exists in the same layer as the electrically conductive material or semiconductor material which comprises the said display part or the said display part drive wiring.
As described above, the antenna portion disposed on the substrate is in the same layer as the conductive material or the semiconductor material constituting the display unit or the display unit driving wiring. It becomes possible to manufacture in the process. Therefore, the manufacturing process can be simplified. Further, since the plurality of antennas arranged on the substrate are independent from each other and are electrically connected to the plurality of communication circuits, respectively, different frequencies can be used. For example, reception and transmission of a plurality of types of information using different frequency channels can be realized.

From another point of view, in the electro-optical device according to the invention, a portion of each of the plurality of antennas disposed on the substrate is the same as the conductive material or the semiconductor material constituting the display unit or the display unit drive wiring. It may be formed from a conductive material or a semiconductor material.
As described above, the antenna portion arranged on the substrate is formed of the same conductive material or semiconductor material as the conductive material or semiconductor material constituting the display portion or the display portion drive wiring. It can be manufactured in the same process as the drive wiring or in a continuous process. Therefore, the manufacturing process can be simplified. Further, since the plurality of antennas arranged on the substrate are independent from each other and are electrically connected to the plurality of communication circuits, respectively, different frequencies can be used. For example, reception and transmission of a plurality of types of information using different frequency channels can be realized. Examples of the electro-optical device according to the present invention include a liquid crystal display device, an OLED (Organic Light Emitting Diode) display device, a plasma display device, and electrophoresis.

Preferably, at least one of the plurality of antennas is formed of a plurality of conductive layers made of a conductive material or a semiconductor material.
There may be a plurality of forms in which the antenna is formed of a plurality of conductive layers. One is that the antenna is formed in a spiral (each conductive layer does not form a completely closed loop, and one end of one conductive layer is connected to another adjacent conductive layer. The other end is not connected to the other conductive layer. In this case, each antenna is essentially a multi-turn helical antenna, and has higher communication reliability, that is, reception sensitivity and transmission radio wave intensity than a single-turn antenna.
In another embodiment, the antennas are formed in a lattice shape (the conductive layers are electrically connected to each other at a plurality of locations separated from each other). In this case, each antenna has a plurality of conductive layers connected in parallel, but is essentially equivalent to a single turn antenna. Therefore, although its reception sensitivity and transmission radio wave intensity are not high, the function of the antenna is maintained as long as the other conductive layer is effectively connected even if one conductive layer is disconnected because the conductive layers are parallel. Is done.

  In any case, it is more preferable that the conductive layers adjacent to each other are electrically connected to each other through a plurality of connecting portions. According to this, even if one connection part is disconnected, as long as another connection part is effectively connected, conduction between the conductive layers is maintained.

The method of manufacturing the electro-optical device according to the invention includes a step of forming the display unit driving wiring on the substrate, a step of forming the display unit on the substrate, and forming the display unit or the display unit driving wiring. And a step of forming a portion of the antenna disposed on the substrate with the same conductive material or semiconductor material as the conductive material or semiconductor material constituting the display portion or the display portion drive wiring.
Thus, the manufacturing process can be simplified by forming the portion of the antenna arranged on the substrate using the same conductive material or semiconductor material in the same process as the display portion or the display portion drive wiring.

  In this method, at the same time as the step of forming the display unit or the display unit drive wiring, the plurality of communications is performed using the same conductive material or semiconductor material as the conductive material or semiconductor material constituting the display unit or the display unit drive wiring. At least one of the circuits may be formed. According to this, it is possible to further simplify the manufacturing process.

  The electro-optical device according to the invention can be provided in various electronic apparatuses. For example, the electronic device may be an RFID reader / writer or an RFID read / written by the reader / writer.

  Embodiments according to the present invention will be described below with reference to the accompanying drawings. In the drawings shown below, the dimensions and ratios of the respective parts are appropriately changed from the actual ones.

<1. Electro-optical device>
In the following description, a liquid crystal display panel is taken as an example of the electro-optical device according to the embodiment of the invention. As shown in FIG. 1, a liquid crystal display panel (electro-optical device) 100 includes an array substrate 102 and a counter substrate 104 that face each other. A peripheral sealing material 106 is disposed between the peripheral edge of the array substrate 102 and the peripheral edge of the counter substrate 104, and the peripheral sealing material 106 bonds the substrates 102 and 104 together. A large number of spherical spacers 108 are arranged between the substrates 102 and 104, and both are kept parallel by the spacers 108. A space defined by the substrates 102 and 104 and the peripheral sealing material 106 is filled with a liquid crystal 105 as an electro-optical material.

  A transparent pixel electrode 110 and a thin film transistor (hereinafter referred to as TFT as appropriate) for driving the pixel electrode are formed on one surface of the array substrate 102 (surface facing the counter substrate 104). A transparent common electrode 112 is formed on one surface of the counter substrate 104 (the surface facing the array substrate 102). The array substrate 102 and the counter substrate 104 including these electrodes can be manufactured from materials known in the technical field of liquid crystal display panels. That is, the substrates 102 and 104 can be manufactured by depositing a semiconductor forming a transparent electrode driving TFT and ITO (indium tin oxide) forming a transparent electrode on a transparent substrate as a support substrate. The pixel electrode 110 and the common electrode 112 are covered with alignment films 114 and 116, respectively. Although not illustrated, the counter substrate 104 may be provided with a plurality of color filters and a black matrix.

  Two antennas, that is, a first antenna 120 and a second antenna 122 are arranged on the array substrate 102 so as to overlap each other. The first antenna 120 is completely embedded in the array substrate 102. On the other hand, the lower portion of the second antenna 122 is embedded in the array substrate 102, and the uppermost portion is at the same height as the pixel electrode 110 and is joined to the array substrate 102.

  Although not shown in FIG. 1, each of the antennas 120 and 122 is connected to a separate IC chip. Each IC chip includes a communication circuit, which can modulate and demodulate electromagnetic waves and controls data transmission / reception via a connected antenna. Therefore, the antenna and the IC chip constitute a communication device that performs non-contact communication. In addition to electromagnetic communication, the antennas 120 and 122 may be used for charging using the principle of electromagnetic induction. Each IC chip may include a storage circuit for storing the communicated data and a control circuit for generating the data to be communicated.

  These antennas 120 and 122 are manufactured when the array substrate 102 is manufactured. More specifically, the pixel electrode 110 or the drive wiring for driving the pixel electrode is configured simultaneously with the step of forming the pixel electrode 110 as the display unit or the drive wiring (including TFT) for driving the pixel electrode on the array substrate 102. The conductive material or semiconductor material is the same as the conductive material or semiconductor material. Hereinafter, a method for manufacturing the array substrate 102 will be described. The specific configuration of the TFT and the drive wiring will also be clarified through the description of the manufacturing method.

  First, as shown in FIG. 2, an alloy antenna bottom layer 12 and a light shielding layer (black matrix) 14 are simultaneously formed from the same conductive material on a support substrate 10 made of, for example, glass or quartz. Specifically, a film of a simple metal, an alloy, or a silicide including at least one of Ti, Cr, W, Ta, Mo, and Pb, which is preferably an opaque refractory metal, is formed on the entire surface of the support substrate 10. And deposited by sputtering. The antenna bottom layer 12 and the light shielding layer 14 are patterned by etching this film.

  Next, as shown in FIG. 3, a base insulating layer 16 made of a silicon nitride film, a silicon oxide film, or the like is deposited on the antenna bottom layer 12 and the light shielding layer 14. Further, as shown in FIG. 4, a hole reaching the antenna lowermost layer 12, that is, an antenna contact hole 18 is formed in the base insulating layer 16.

  Next, as shown in FIG. 5, the transistor active layer 22 and the antenna intermediate layer 20 are simultaneously formed on the base insulating layer 16 from the same semiconductor material. At this time, the antenna contact hole 18 is also filled with the semiconductor material of the antenna intermediate layer 20. The antenna intermediate layer 20 is formed above and in contact with the lowermost antenna layer 12, and the transistor active layer 22 is formed above the light shielding layer 14 at a distance.

  This semiconductor material is preferably a semiconductor having a low resistance value, such as a polysilicon film. Specifically, the polysilicon film may be formed by, for example, depositing an amorphous silicon film on the base insulating layer 16 and then annealing the amorphous silicon film. Instead of depositing the amorphous silicon film, a polysilicon film may be deposited directly on the base insulating layer 16 by a low pressure CVD method or the like. Then, the transistor active layer 22 and the antenna intermediate layer 20 are patterned by etching this film. Preferably, the antenna intermediate layer 20 is further subjected to a process for reducing its resistance. For example, it can be made conductive by diffusing P ions inside.

  Next, as shown in FIG. 6, a gate insulating film 23 covering the transistor active layer 22 and the antenna intermediate layer 20 is formed. The gate insulating film 23 includes a thermal silicon oxide film 24 and a high temperature silicon oxide film (HTO film) 26. The thermally oxidized silicon film 24 is obtained by oxidizing the surface of the polysilicon film of the transistor active layer 22 and the antenna intermediate layer 20 at a temperature of about 900 to 1300 ° C. The HTO film 26 is obtained by being deposited by a low pressure CVD method or the like. Further, as shown in FIG. 7, a hole reaching the antenna intermediate layer 20, that is, an antenna contact hole 28 is formed in the gate insulating film 23.

  Next, as shown in FIG. 8, the gate electrode (scanning line) 32 and the antenna uppermost layer 30 are simultaneously formed on the gate insulating film 23 from the same conductive material or semiconductor material. At this time, the antenna contact hole 28 is also filled with a conductive material or a semiconductor material of the antenna uppermost layer 30. The antenna top layer 30 is formed above and in contact with the antenna intermediate layer 20, and the gate electrode (scanning line) 32 is formed above and spaced from the transistor active layer 22 and extends in a direction perpendicular to the paper surface. .

  The conductive material or semiconductor material forming the gate electrode 32 and the antenna uppermost layer 30 may be a single metal, alloy or silicide film, or a polysilicon film. For example, the antenna top layer 30 and the gate electrode 32 may be patterned by depositing a film of a simple metal, an alloy, or a silicide by sputtering and etching the film. It is also possible to obtain the antenna uppermost layer 30 and the gate electrode 32 which are made conductive by diffusing P ions inside the polysilicon film. At this point, the first antenna 120 having three conductive layers of the antenna bottom layer 12, the antenna intermediate layer 20, and the antenna top layer 30 is formed.

  Next, as shown in FIG. 9, an interlayer insulating film 34 that covers the gate electrode 32 and the antenna uppermost layer 30 is formed. The interlayer insulating film 34 can be formed by depositing silicon oxide or silicon nitride by, for example, CVD. Further, a pair of holes reaching the transistor active layer 22 is formed in the interlayer insulating film 34 and the gate insulating film 23, and a source electrode 36 and a drain electrode 37 filling the holes are formed from a conductive material. Simultaneously with the formation of the source electrode 36 and the drain electrode 37, the antenna bottom layer 38 of another antenna (second antenna 122) can be formed of the same conductive material. In the illustrated form, the antenna bottom layer 38 is formed above the already formed first antenna 120, but may be formed at another location.

  Further, an interlayer insulating film 40 that covers the source electrode 36, the drain electrode 37, and the antenna bottom layer 38 is formed. The interlayer insulating film 40 can be formed in the same manner as the interlayer insulating film 34. In addition, a hole reaching the antenna bottom layer 38, that is, an antenna contact hole 42 is formed in the interlayer insulating film 40.

  Next, as shown in FIG. 10, a capacitor electrode (capacitor electrode line) 46 and an antenna intermediate layer 48 are simultaneously formed on the interlayer insulating film 40 from the same conductive material or semiconductor material. At this time, the antenna contact hole 42 is also filled with the conductive material or semiconductor material of the antenna intermediate layer 48. The antenna intermediate layer 48 is formed above and in contact with the lowermost antenna layer 38, and the capacitor electrode 46 is formed above and spaced from the gate electrode (scanning line) 32, and extends in a direction perpendicular to the paper surface. The conductive material or semiconductor material forming the capacitor electrode 46 and the antenna intermediate layer 48 may be the same as or similar to the conductive material or semiconductor material forming the gate electrode 32 and the antenna uppermost layer 30 described above.

  Next, as shown in FIG. 11, an interlayer insulating film 50 that covers the capacitor electrode 46 and the antenna intermediate layer 48 is formed. The interlayer insulating film 50 can also be formed by depositing silicon oxide or silicon nitride by, for example, the CVD method. Further, a pair of holes reaching the source electrode 36 and the drain electrode 37 are formed in the interlayer insulating films 50 and 40, and a hole reaching the antenna intermediate layer 48 (antenna contact hole) is formed in the interlayer insulating film 50. . Then, the antenna intermediate layer 52, the source electrode (data line) 54, and the drain electrode 55 are formed by filling these holes with a conductive material. In this way, the antenna intermediate layer 52, the source electrode 54, and the drain electrode 55 are simultaneously formed of the same conductive material. The antenna intermediate layer 52 is formed above and in contact with the antenna intermediate layer 48, the source electrode 54 is formed above and in contact with the source electrode 36, and the drain electrode 55 is in contact with and above the drain electrode 37. Is formed.

  Further, an interlayer insulating film 56 covering the source electrode 54, the drain electrode 55, and the antenna intermediate layer 52 is formed. The interlayer insulating film 56 can be formed in the same manner as the interlayer insulating film 34. Also, a hole reaching the drain electrode 55 and the antenna lowermost layer 38, that is, an antenna contact hole 42 is formed in the interlayer insulating film 56. Thereafter, these holes are filled with ITO (Indium Tin Oxide) to form the pixel electrode 110 and the antenna uppermost layer 58. In this way, the pixel electrode 110 and the antenna uppermost layer 58 are simultaneously formed of the same conductive material. The pixel electrode 110 is formed on and above the drain electrode 55, the source electrode 54 is formed on and above the source electrode 36, and the drain electrode 55 is formed on and above the drain electrode 37. ing. At this point, the second antenna 122 having four conductive layers of the antenna bottom layer 38, the antenna intermediate layers 48 and 52, and the antenna top layer 58 is formed.

  As described above, the array substrate 102 including the pixel electrode 110 serving as a display portion, pixel electrode driving wiring (including TFTs), the first antenna 120, and the second antenna 122 is formed. The Thus, the manufacturing process can be simplified by forming the antenna portion arranged on the array substrate 102 with the same conductive material or semiconductor material in the same process as the display portion or the display portion drive wiring. .

  FIG. 12 is a perspective view of an example of the array substrate 102. In this figure, the first antenna 120 and the second antenna 122 are emphasized, and illustration of pixel electrodes and drive wirings that form an image range is omitted. The first antenna 120 includes three conductive layers of an antenna lowermost layer 12, an antenna intermediate layer 20, and an antenna uppermost layer 30, and is formed in a lattice shape. That is, the conductive layers are electrically connected to each other at a plurality of locations separated from each other. A non-conductive gap S <b> 1 is provided in each of the antenna bottom layer 12, the antenna intermediate layer 20, and the antenna top layer 30.

  The first antenna 120 is connected to an IC chip 124 that includes the communication circuit described above. Connection lines 125 extending from both terminals of the IC chip 124 are connected to both ends of the antenna uppermost layer 30 across the gap S1.

  The second antenna 122 includes four conductive layers of an antenna bottom layer 38, an antenna intermediate layer 48, an antenna intermediate layer 52, and an antenna top layer 58, which are also formed in a lattice shape. A non-conductive gap S <b> 2 is provided in the antenna bottom layer 38, the antenna intermediate layer 48, the antenna intermediate layer 52, and the antenna top layer 58.

  The second antenna 122 is connected to an IC chip 126 that includes the communication circuit described above. Both terminals of the IC chip 126 are connected to both ends of the antenna top layer 58 across the gap S2.

  In this example, each of the antennas 120 and 122 formed in a lattice shape has a plurality of conductive layers connected in parallel, but is essentially equivalent to a single-turn antenna. Therefore, although its reception sensitivity and transmission radio wave intensity are not high, the function of the antenna is maintained as long as the other conductive layer is effectively connected even if one conductive layer is disconnected because the conductive layers are parallel. Is done. In addition, since the conductive layers adjacent to each other are electrically connected to each other at a plurality of connection portions, even if one connection portion is disconnected, as long as the other connection portions are effectively connected, the conductive layers The continuity between them is maintained.

  FIG. 13 is a perspective view of another example of the array substrate 102. In this figure as well, as in FIG. 13, the first antenna 120 and the second antenna 122 are emphasized, and the illustration of the pixel electrode and the drive wiring that become the image range is omitted. The first antenna 120 includes three conductive layers of an antenna lowermost layer 12, an antenna intermediate layer 20, and an antenna uppermost layer 30, and is formed in a spiral shape. That is, each conductive layer does not form a completely closed loop, and one end of one conductive layer is connected to another adjacent conductive layer, but the other end is connected to the other conductive layer. Not. A connection line 125 extending from both terminals of the IC chip 124 is connected to one end of the antenna uppermost layer 30 and one end of the antenna lowermost layer 12.

  The second antenna 122 includes four conductive layers of an antenna lowermost layer 38, an antenna intermediate layer 48, an antenna intermediate layer 52, and an antenna uppermost layer 58, and is also formed in a spiral shape. The IC chip 126 is connected to one end of the antenna uppermost layer 58 and one end of the antenna lowermost layer 38. In this example, each of the antennas 120 and 122 is essentially a multi-turn helical antenna, and has higher communication reliability, that is, reception sensitivity and transmission radio wave intensity than a single-turn antenna. Also in this example, as shown in the figure, the end portions of the conductive layer are electrically connected to each other through a plurality of connection portions, so that even if one connection portion is disconnected, the other connection portions are effectively connected. As long as it is present, conduction between the conductive layers is maintained.

  12 and 13, the plurality of antennas 120 and 122 arranged on the array substrate 102 are independent from each other and are electrically connected to the IC chips 124 and 126, respectively. A frequency band can be used. Therefore, as an electronic apparatus having this liquid crystal display panel, for example, reception and transmission of a plurality of types of information using different frequency channels can be realized.

  12 and 13, similarly to the antennas 120 and 122, the connection lines (for example, the connection lines 125) that connect the IC chips 124 and 126 and the antennas 120 and 122 are displayed or displayed. Simultaneously with the step of forming the portion drive wiring, the display portion or the display portion drive wiring may be formed of the same conductive material or semiconductor material as the conductive material or semiconductor material.

  The IC chips 124 and 126 can be separately manufactured and mounted on the array substrate 102 without being arranged inside the array substrate 102. However, the same conductive material or semiconductor material as the conductive material or semiconductor material constituting the display unit or display unit drive wiring is formed simultaneously with the step of forming the display unit or display unit drive wiring for the communication circuit equivalent to the IC chips 124, 126. May be formed. According to this, it is possible to further simplify the manufacturing process. In this case, the position (height) where the communication circuit in the array substrate 102 is arranged is arbitrary.

  14 to 17 are arrangement examples of the antennas 120 and 122 provided around the pixel region 130. As described above, the antennas 120 and 122 can be arranged in various patterns. Other patterns can be employed. Note that in the liquid crystal display panel, the scanning lines, the data lines, and the like are connected to a driving circuit outside the pixel region 130, so that the conductive layers constituting the antennas 120 and 122 are arranged so as not to be in contact with these lines. Must. If the antennas are arranged so as not to overlap each other, the reception state and the like are further improved. If the individual antennas are arranged so as not to overlap with a shielding object such as a pattern of a layer not forming the antenna portion, the reception state and the like are further improved. Arranging the antenna so that it does not overlap the display drive wiring prevents the deterioration of the panel characteristics such as the contrast due to the delay of the drive signal of the display drive wiring due to the increase of the coupling capacity, etc. You can also.

  As described above, the liquid crystal display panel is exemplified as the electro-optical device 100, but the configuration of the electro-optical device 100 is not limited. For example, the present invention can be applied to various display panels such as OLED (Organic Light Emitting Diode) display panels such as organic EL (Electroluminescent) display panels, plasma display panels, and electrophoretic display panels.

<2. Electronic equipment>
FIG. 18 shows a portable electronic device 140 including the electro-optical device according to the invention. The portable electronic device 140 may be an RFID reader / writer or an RFID read / written by the reader / writer. As illustrated, in the portable electronic device 140, antennas 120 and 122 are disposed around the pixel region 142 of the electro-optical device. The portable electronic device 140 is provided with various buttons and keys as input devices. Among these buttons 144, the button 144 includes a non-contact communication device having the first antenna 120 and the IC chip 124, and a second one. It is pushed down to selectively switch which non-contact communication device having the antenna 122 and the IC chip 126 is used.

  In short, the portable electronic device 140 uses a first communication mode in which certain information is received or transmitted by the first antenna 120 and the IC chip 124 using a certain frequency band, and another frequency band. The second antenna 122 and the IC chip 126 can operate in a second communication mode in which other types of information are received or transmitted. The button 144 switches between the first communication mode and the second communication mode.

  FIG. 19 shows another portable electronic device 150 including the electro-optical device according to the invention. The portable electronic device 150 may also be an RFID reader / writer, or an RFID read / written by the reader / writer. As illustrated, the portable electronic device 150 includes a display unit casing 156 and an operation unit casing 158.

  The display unit housing 156 and the operation unit housing 158 are connected by a hinge unit 160. The display unit housing 156 rotates relative to the operation unit housing 158 around the hinge unit 160. That is, the portable electronic device 150 is a foldable type, and can take an open posture illustrated in FIG. 19A and a closed posture illustrated in FIG. 19B (a posture in which the housings 156 and 158 overlap). it can.

  The operation unit housing 158 is provided with various buttons and keys as input devices, and the display unit housing 156 is provided with a main screen 152 and a sub screen 154. The main screen 152 is exposed on the inner surface of the display unit casing 156. This inner surface is a surface that appears in the open posture shown in FIG. 19A and is covered and hidden by the operation unit housing 158 in the closed posture shown in FIG. 19B. On the other hand, the sub screen 154 is exposed on the outer surface of the display unit housing 156. The outer surface is a surface that is on the back side of the inner surface and always appears regardless of the posture of the portable electronic device 150.

  The main screen 152 and the sub screen 154 may be the display surfaces of each of the two electro-optical devices, or the light emission of both electro-optical devices of a dual emission type (double-sided emission type: a type that emits light in the opposite two directions). In terms of surface. An organic EL display panel is known as a dual emission type electro-optical device that has been realized. Some dual-emission type electro-optical devices have a function that allows the image to be displayed to be instantaneously reversed, and the same image can be simultaneously displayed on both the main screen and the sub-screen. An optical device may be used.

  In the display unit housing 156, antennas 120 and 122 are arranged around the pixel region (the main screen 152 and the sub screen 154). The first antenna 120 is provided in a layer near the inner surface where the main screen 152 is exposed, and the second antenna 122 is provided in a layer near the outer surface where the sub-screen 154 is exposed.

  A protrusion 164 is formed on the display unit housing 156, and a button 166 is provided on the operation unit housing 158. The button 166 is provided to selectively switch between a non-contact communication device having the first antenna 120 and the IC chip 124 and a non-contact communication device having the second antenna 122 and the IC chip 126. ing.

  In short, the portable electronic device 150 uses a first communication mode in which certain information is received or transmitted by the first antenna 120 and the IC chip 124 using a certain frequency band, and another frequency band. The second antenna 122 and the IC chip 126 can operate in a second communication mode in which other types of information are received or transmitted. The button 166 switches between the first communication mode and the second communication mode. Specifically, in the closed posture shown in FIG. 19B, the button 166 is pushed down by the protrusion 164, and the operation mode of the portable electronic device 150 becomes the second communication mode. In the open posture shown in FIG. 19A, the protrusion 164 moves away from the button 166, and the operation mode of the portable electronic device 150 becomes the first communication mode.

<3. Modification>
Various modifications are made to the above embodiment. Specific modes of deformation are as follows. The following aspects may be appropriately combined.

(1) In the above embodiment, the entire antennas 120 and 122 are formed at the same time as the manufacture of the array substrate 102. However, only a part of the antenna is manufactured at the same time as the array substrate 102, and the other part of the antenna is an array. It may be manufactured separately from the substrate 102 and connected to a portion of the antenna on the array substrate 102 (for example, it may be formed on another film or plate).

(2) The portable electronic devices 140 and 150 shown in FIGS. 18 and 19 are provided with buttons for switching between the first communication mode and the second communication mode. However, both the non-contact communication apparatus having the first antenna 120 and the IC chip 124 and the non-contact communication apparatus having the second antenna 122 and the IC chip 126 are continuously and simultaneously performed without switching the communication mode. It may be used. That is, separate types of communication may be continuously performed using both frequency bands.

(3) In the above embodiment, one electro-optical device has the two antennas 120 and 122 and the IC chips 124 and 126, but the number of antennas and IC chips is not intended to be limited to the embodiment. It is also possible to provide more than two antennas and IC chips. Whether the conductive material or the semiconductor material constituting the display unit of the electro-optical device or the display unit drive wiring is made the same layer as the conductive layer of the antenna is not limited to the embodiment and may be changed.

1 is a cross-sectional view illustrating a liquid crystal display panel that is an electro-optical device according to an embodiment of the invention. In embodiment of this invention, it is sectional drawing which shows the 1st process of the method of manufacturing the array board | substrate of a liquid crystal display panel, forming an antenna. FIG. 3 is a cross-sectional view showing a step subsequent to FIG. 2. FIG. 4 is a cross-sectional view showing a step subsequent to FIG. 3. FIG. 5 is a cross-sectional view showing a step subsequent to FIG. 4. FIG. 6 is a cross-sectional view showing a step subsequent to FIG. 5. FIG. 7 is a cross-sectional view showing a step subsequent to FIG. 6. FIG. 8 is a cross-sectional view showing a step subsequent to FIG. 7. FIG. 9 is a cross-sectional view showing the next step of FIG. 8. FIG. 10 is a cross-sectional view showing a step subsequent to FIG. 9. FIG. 11 is a cross-sectional view showing a step subsequent to FIG. 10. It is a see-through | perspective perspective view of an example of the array substrate manufactured by the said method. It is a see-through | perspective perspective view of the other example of the array substrate manufactured by the said method. It is a top view which shows an example of the pattern of the antenna which can be manufactured by this invention. It is a top view which shows the other example of the pattern of the antenna which can be manufactured by this invention. It is a top view which shows the other example of the pattern of the antenna which can be manufactured by this invention. It is a top view which shows the other example of the pattern of the antenna which can be manufactured by this invention. 1 is a front view illustrating a portable electronic device including an electro-optical device according to an embodiment of the invention. (A) is a front view which shows the open state of the other portable electronic device provided with the electro-optical apparatus which concerns on embodiment of this invention, (B) is a rear view which shows the closed state of this portable electronic device. It is.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Support substrate, 12 ... Antenna bottom layer, 14 ... Light shielding layer, 16 ... Underlayer insulating layer, 18 ... Antenna contact hole, 20 ... Antenna intermediate layer, 22 ... Transistor active layer, 23 ... Gate insulating film, 24 ... Thermal oxidation Silicon film, 26 ... high temperature silicon oxide film (HTO film), 28 ... antenna contact hole, 30 ... antenna top layer, 32 ... gate electrode (scanning line), 34 ... interlayer insulating film, 36 ... source electrode, 37 ... drain electrode 38 ... antenna bottom layer, 40 ... interlayer insulating film, 42 ... antenna contact hole, 46 ... capacitive electrode, 48 ... antenna intermediate layer, 50 ... interlayer insulating film, 52 ... antenna intermediate layer, 54 ... source electrode (data line) 55 ... Drain electrode, 56 ... Interlayer insulating film, 58 ... Antenna top layer, 100 ... Electro-optical device, 102 ... Array substrate, 104 ... Opposing group 110 ... Pixel electrode, 112 ... Common electrode, 120 ... First antenna, 122 ... Second antenna, 124,126 ... IC chip, 140 ... Portable electronic device, 150 ... Portable electronic device, 152 ... Main screen 154 ... Sub-screen.

Claims (10)

At least one substrate provided with a display unit and a display unit drive wiring for driving the display unit;
A plurality of independent antennas each at least a portion of which is disposed on the substrate;
A plurality of communication circuits that are electrically connected to the plurality of antennas and control transmission / reception of data via the connected antennas;
An electro-optical device in which a portion of each of the plurality of antennas arranged on the substrate is in the same layer as a conductive material or a semiconductor material constituting the display portion or the display portion drive wiring. At least one substrate provided with a display unit and a display unit drive wiring for driving the display unit;
A plurality of independent antennas each at least a portion of which is disposed on the substrate;
A plurality of communication circuits that are electrically connected to the plurality of antennas and control transmission / reception of data via the connected antennas;
An electro-optical device in which a portion of each of the plurality of antennas arranged on the substrate is formed of the same conductive material or semiconductor material as that of the display portion or the display portion drive wiring.   The electro-optical device according to claim 1, wherein at least one of the plurality of antennas is formed from a plurality of conductive layers made of a conductor or a semiconductor material.   The electro-optical device according to claim 3, wherein the conductive layers adjacent to each other are electrically connected to each other through a plurality of connecting portions. A method for manufacturing the electro-optical device according to claim 1, comprising:
Forming the display unit drive wiring on the substrate;
Forming the display on the substrate;
Simultaneously with the step of forming the display portion or the display portion drive wiring, the substrate of the antenna is made of the same conductive material or semiconductor material as the conductive material or semiconductive material constituting the display portion or the display portion drive wiring. Forming a portion disposed in the electro-optical device.   Simultaneously with the step of forming the display unit or the display unit drive wiring, at least of the plurality of communication circuits by the same conductive material or semiconductor material as the conductive material or semiconductor material constituting the display unit or the display unit drive wiring. The method of manufacturing an electro-optical device according to claim 5, further comprising a step of forming one.   5. The electro-optical device according to claim 1, wherein at least one of each of the plurality of antennas is formed at a position that does not overlap with a layer that does not constitute each part of the antenna.   5. The electro-optical device according to claim 1, wherein at least one of the plurality of antennas is formed at a position that does not overlap the display unit or the display unit drive wiring.   5. The electro-optical device according to claim 1, wherein at least one of the plurality of antennas is formed at a position that does not overlap with another antenna of the plurality of antennas. An electronic apparatus comprising the electro-optical device according to claim 1.

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