JP2005347770A5 - - Google Patents
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- Publication number
- JP2005347770A5 JP2005347770A5 JP2005212721A JP2005212721A JP2005347770A5 JP 2005347770 A5 JP2005347770 A5 JP 2005347770A5 JP 2005212721 A JP2005212721 A JP 2005212721A JP 2005212721 A JP2005212721 A JP 2005212721A JP 2005347770 A5 JP2005347770 A5 JP 2005347770A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- conductive film
- film tape
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000011521 glass Substances 0.000 claims 5
- 238000002788 crimping Methods 0.000 claims 1
- 208000024891 symptom Diseases 0.000 claims 1
Claims (1)
この第１の実装装置に連続接続され、
第２のプリント基板を供給する第３の供給手段と、前記第１の圧着手段で前記第１のプリント基板に貼付された異方性導電膜テープがタブに圧着された液晶ガラス基板を供給する第４の供給手段と、前記第３の供給手段により供給された第２のプリント基板に異方性導電膜テープを貼付する第２の貼付手段と、前記第４の供給手段により供給されたタブ付き液晶ガラス基板の所定箇所と前記第２の貼付手段により異方性導電膜テープが貼付された第２のプリント基板の所定箇所とを位置合せする第２の位置合せ手段と、該第２の位置合せ手段により位置合せされた液晶ガラス基板のタブと前記第２の貼付手段により異方性導電膜テープが貼付された第２のプリント基板とを圧着する第２の圧着手段とからなる第２の実装装置と
を備えたことを特徴とする部品実装装置。 Supplied by a first supply means for supplying a first printed circuit board, a second supply means for supplying a liquid crystal glass substrate to which a tab previously mounted with a liquid crystal driving element is connected, and the first supply means. first attaching means and, wherein the second predetermined portion of the LCD panel with supplied tabs by supply means of the first foreign by sticking means for sticking the first print anisotropic conductive film tape substrate first and first alignment means for aligning a predetermined portion of the printed circuit board, the first liquid crystal glass substrate, which is aligned by the alignment means of the tab and anisotropically for anisotropic conductive film tape is attached a first mounting device comprising a first pressing means for crimping the first printed circuit board sex conductive film tape is attached,
Continuously connected to the first mounting device,
Third supply means for supplying a second printed circuit board, and a liquid crystal glass substrate in which an anisotropic conductive film tape attached to the first printed circuit board by the first pressure bonding means is pressure-bonded to a tab are supplied. 4th supply means, 2nd sticking means to stick an anisotropic conductive film tape to the 2nd printed circuit board supplied by the 3rd supply means, and tab supplied by the 4th supply means A second alignment means for aligning a predetermined position of the attached liquid crystal glass substrate and a predetermined position of the second printed circuit board to which the anisotropic conductive film tape is adhered by the second adhesion means; A second pressure-bonding means for pressing the tab of the liquid crystal glass substrate aligned by the alignment means and the second printed circuit board having the anisotropic conductive film tape affixed by the second affixing means; further comprising a mounting device Component mounting apparatus according to symptoms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005212721A JP4150033B2 (en) | 2005-07-22 | 2005-07-22 | Component mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005212721A JP4150033B2 (en) | 2005-07-22 | 2005-07-22 | Component mounting equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35369695A Division JP3734548B2 (en) | 1995-12-29 | 1995-12-29 | Component mounting equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005347770A JP2005347770A (en) | 2005-12-15 |
| JP2005347770A5 true JP2005347770A5 (en) | 2006-02-23 |
| JP4150033B2 JP4150033B2 (en) | 2008-09-17 |
Family
ID=35499796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005212721A Expired - Fee Related JP4150033B2 (en) | 2005-07-22 | 2005-07-22 | Component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4150033B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004001837A2 (en) | 2002-06-25 | 2003-12-31 | Unitive International Limited | Methods of forming electronic structures including conductive shunt layers and related structures |
| US7547623B2 (en) | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
| US7049216B2 (en) | 2003-10-14 | 2006-05-23 | Unitive International Limited | Methods of providing solder structures for out plane connections |
| US7932615B2 (en) | 2006-02-08 | 2011-04-26 | Amkor Technology, Inc. | Electronic devices including solder bumps on compliant dielectric layers |
| US7674701B2 (en) | 2006-02-08 | 2010-03-09 | Amkor Technology, Inc. | Methods of forming metal layers using multi-layer lift-off patterns |
| KR101774938B1 (en) | 2011-08-31 | 2017-09-06 | 삼성전자 주식회사 | Semiconductor package having supporting plate and method of forming the same |
| CN111132468A (en) * | 2019-12-04 | 2020-05-08 | 深圳市东向同人科技有限公司 | Method for connecting flexible film electrode and mainboard and electronic circuit board |
-
2005
- 2005-07-22 JP JP2005212721A patent/JP4150033B2/en not_active Expired - Fee Related
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