JP2005039114A - Semiconductor wafer transfer equipment - Google Patents

Abstract

When a semiconductor wafer is transferred from a support substrate to a dicing frame, the transfer is easily and efficiently performed.
A semiconductor wafer having a back surface ground while being fixed to a support substrate made of a magnetizable metal is attached to a dicing tape to which a dicing frame is attached, and is integrated with the dicing frame. In a semiconductor wafer transfer apparatus for removing a support substrate from a surface of a semiconductor wafer and transferring the semiconductor wafer to a dicing frame, the support substrate is provided from the surface of the semiconductor wafer disposed adjacent to the holding means 25 and attached to a dicing tape. The support substrate removing means 26 is provided to remove the support substrate from the surface of the semiconductor wafer by magnetic adhesion.
[Selection] Figure 1

Description

  The present invention relates to a semiconductor wafer transfer apparatus for transferring a semiconductor wafer whose back surface has been ground with its front surface fixed to a support substrate to a dicing frame integrated with a dicing tape.

  A semiconductor wafer having a plurality of circuits formed on the front surface is ground to have a predetermined thickness after being ground, and then diced by a dicing device and divided into semiconductor chips for each circuit, and used for various electronic devices. .

  Since the rigidity of the semiconductor wafer after being thinly formed by grinding is remarkably low, there may be inconveniences in conveyance to the subsequent dicing process in the state as it is.

  Then, grinding is performed in a state where the semiconductor wafer is fixed to a support substrate made of a highly rigid metal or the like, and thereafter, it is attempted to replace the wafer with a dicing tape integrated with a dicing frame (for example, see Patent Document 1). ).

Japanese Patent Laid-Open No. 2003-77869

  However, an apparatus for transferring a semiconductor wafer fixed to a support substrate to a dicing frame has not been developed. At present, such transfer is performed manually, and there is a problem that productivity is remarkably low. In addition, a semiconductor wafer that has become extremely thin by grinding such as a thickness of 100 μm or less or 50 μm or less has a problem that it is not easy to handle and easily breaks by manual transfer.

  Therefore, when the semiconductor wafer is transferred from the support substrate to the dicing frame, there is a problem in performing the transfer easily and efficiently.

  As a specific means for solving the above-mentioned problems, the present invention dices a semiconductor wafer whose back surface is ground with the top surface of the support substrate made of a magnetizable metal being fixed via an adhesive. A semiconductor wafer transfer device that is attached to a tape and integrated with a dicing frame, removes the support substrate from the surface of the semiconductor wafer, and transfers the semiconductor wafer to a dicing frame, and a frame holding unit that holds the dicing frame And a holding means having a holding table for holding a dicing tape attached to the dicing frame, and a surface of the semiconductor wafer disposed adjacent to the holding means and attached to the dicing tape. Supporting substrate removing means for removing the supporting substrate, and the supporting substrate removing means magnetizes the supporting substrate. At least a rotating arm that rotates in a direction to peel the support substrate that is attached and magnetized and is attached to the surface of the semiconductor wafer, and a fulcrum that rotatably supports the rotating arm. A semiconductor wafer transfer device is provided.

  In this semiconductor wafer transfer device, the rotating arm extends from the fulcrum portion toward the diameter direction of the semiconductor wafer held on the chuck table, and the magnet portion extends from the fulcrum portion of the support substrate attached to the semiconductor wafer. Attach to the tip of the rotating arm so that the outer peripheral part of the far side is magnetically attached, the fulcrum part is disposed at a position lower than the holding surface of the chuck table, the dicing frame and the dicing tape It is additionally provided with a dicing tape adhering means for adhering and a semiconductor wafer adhering means for adhering the back surface of the semiconductor wafer supported by the support substrate to the dicing tape and integrating the semiconductor wafer with the dicing frame. As a requirement.

  In the present invention, since the support substrate is formed of metal and the support substrate removing means is provided with the magnet portion, the support substrate can be detached from the semiconductor wafer by magnetic attachment, and therefore, from the support substrate of the semiconductor wafer to the dicing frame. Can be easily and efficiently performed, and even a semiconductor wafer thinned by grinding can be reliably transferred without being damaged.

  In addition, since the outermost portion of the support substrate that is farthest from the fulcrum portion can be magnetically attached, the support substrate can be removed reliably and smoothly.

  Further, since the fulcrum portion that is a fulcrum of rotation of the rotation arm is located at a position lower than the holding surface of the chuck table that holds the dicing tape, the support substrate can be reliably magnetized.

  Also, a dicing tape adhering means for adhering the dicing frame and the dicing tape, and a semiconductor wafer adhering in which the back surface of the semiconductor wafer supported by the support substrate is adhered to the dicing tape and the semiconductor wafer is integrated with the dicing frame. This means that the dicing tape can be automatically attached to the dicing frame and the semiconductor wafer can be integrated into the dicing frame automatically. Can be done.

  As an embodiment of the present invention, a semiconductor wafer transfer apparatus 10 shown in FIG. 1 will be described with reference to other drawings as appropriate. In this semiconductor wafer transfer apparatus 10, a plurality of dicing frames 101 shown in FIG. 2 are accommodated in the frame accommodating means 100 and placed in the frame accommodating means placement region 11. The dicing frame 101 is formed in a ring shape with a highly rigid member, and an opening 102 is formed at the center.

  The frame accommodating means placement region 11 shown in FIG. 1 can position the frame accommodating means 100 at an appropriate height by moving up and down with respect to the base 12.

  The dicing frame 101 housed in the frame housing means 100 shown in FIG. 1 is formed at the tip of the frame carrying-in / out means 13 that can move in the X-axis direction and approaches the frame housing means 100 by moving in the + X direction. The sandwiching portion 13a sandwiches the dicing frame 101 and is unloaded by moving in the −X direction as it is. The dicing frame 101 is placed in the frame placement area 14 by releasing the clamping state in the frame placement area 14.

  In the frame mounting area 14, a pair of position adjusting means 15 that protrude upward from the base 12 and are movable in the Y-axis direction are disposed opposite to each other, and the pair of position adjusting means 15 are in a direction toward each other. By moving, the dicing frame 101 is aligned at a certain position.

  The dicing frame 101 thus aligned is adsorbed and held by the frame adsorbing portion 16a constituting the frame conveying means 16. The frame conveying means 16 includes a frame adsorbing portion 16a that holds the dicing frame 101, a rail 16b that extends in the X-axis direction, a horizontal moving portion 16c that is guided by the rail 16b and moves horizontally in the X-axis direction, It is comprised from the raising / lowering drive part 16d connected with the moving part 16c, and raising / lowering the flame | frame adsorption | suction part 16a.

  When the frame adsorbing part 16a descends and is held by adsorbing and holding the dicing frame 101 by being driven by the elevating drive unit 16d, the horizontal moving part 16c moves in the −X direction after the frame adsorbing part 16a rises, and the dicing frame 101 is moved to the dicing tape. Position and stop just above the sticking means 24. Then, when the frame adsorbing portion 16a is lowered and the adsorbing is released, the dicing frame 101 is placed and held on the frame holding table 24a constituting the dicing tape adhering means 24.

  On the other hand, the semiconductor wafer W after the back grinding is fixed to the upper surface of the support substrate 103 as shown in FIG. 3, and an adhesive is provided between the support substrate 103 and the semiconductor wafer W as shown in FIG. 106 is interposed. The support substrate 103 is formed of a metal that can be magnetized such as iron or stainless steel having a thickness of 0.3 to 1.0 mm, and even a semiconductor wafer having a thickness of 100 μm or less and 50 μm or less can be stably formed. Can be supported.

  The substrate 103 to which the semiconductor wafer W is thus fixed is accommodated in the substrate accommodation means 200 shown in FIG. 1, and this substrate accommodation means 200 is placed in the substrate accommodation means placement region 20 that can be raised and lowered relative to the base 12. It is placed. Then, the semiconductor wafer W fixed to the support substrate 103 is carried out by the substrate carry-in / out means 21.

  The substrate carry-in / out means 21 includes an arm portion 21a that can be vertically moved and bent, and a holding portion 21b that can be rotated in a direction perpendicular to the tip of the arm portion 21a. Then, the rear surface 103a (see FIG. 4) of the support substrate 103 is sucked and carried out, and is conveyed to the substrate position adjusting means 22. In the middle of this conveyance, the holding portion 21b rotates 180 degrees in the vertical direction to reverse the front and back of the semiconductor wafer W and the support substrate 103, and as shown in FIG. 5, the back surface 103a of the substrate 103 faces upward, It is assumed that the back surface of the semiconductor wafer W faces downward.

  Continuing the description with reference to FIG. 1, the substrate position adjusting means 22 includes a mounting unit 22 a on which the semiconductor wafer W and the substrate 103 are mounted, and the semiconductor wafer W and the substrate 103 mounted on the mounting unit 22 a. A plurality of projecting alignment members 22b that are arranged on the outer peripheral side of the base plate and are movable in a direction approaching the center of the mounting portion 22a or in a direction away from the center, and is held by the mounting portion 22a. The substrate 103 on which the semiconductor wafer W is fixed is aligned at a fixed position by moving the same amount in the direction in which all the alignment members 22b approach.

  In the vicinity of the substrate position adjusting means 22, a semiconductor wafer adhering means comprising an arm portion 23a that can be moved up and down and a holding portion 23b that sucks and holds the support substrate 103 at the tip of the arm portion 23a. 23, and the substrate 103 is held by the holding portion 23 b and the arm portion 23 a is moved up and down and rotated, whereby the semiconductor wafer W and the support substrate 103 aligned by the substrate position adjusting means 22 are attached with a dicing tape. It is conveyed to the landing means 24.

  The dicing tape attaching means 24 includes a frame holding table 24a for holding the dicing frame 101, a tape feeding portion 24b for sending out the dicing tape 104 to be attached, a tape take-up portion 24c for taking up the dicing tape 104, and a rotation. The pressure roller 24d is movable and movable in the X-axis direction, and the tape cutter 24e cuts the dicing tape 104 along the outer periphery of the dicing frame 101.

  The strip-shaped dicing tape 104 is laid from the tape feeding section 24b to the tape winding section 24c with the adhesive surface facing upward above the frame holding table 24a. The frame 101 is placed on the dicing tape 104 as shown in FIG. 6A when the frame adsorbing portion 16 a is lowered, and the dicing frame 101 is held via the dicing tape 104.

  On the other hand, the semiconductor wafer W and the support substrate 103 conveyed from the substrate position adjusting unit 22 by the semiconductor wafer adhering unit 23 are as shown in FIG. 6B with the back surface of the semiconductor wafer W facing down. Then, it is placed on the dicing tape 104 in the opening 102 of the dicing frame 101.

  Then, as shown in FIG. 6C, the back surface of the semiconductor wafer W is applied to the adhesive surface of the dicing tape 104 by applying a pressing force downward with the pressing roller 24d rotating and moving in the X-axis direction. In addition, the dicing frame 101 is also attached to the adhesive surface, and the tape cutter 24e acts along the outer periphery of the dicing frame 101 to cut into a circle and is separated from the belt-like dicing tape 104, as shown in FIG. As shown, the semiconductor wafer W, the substrate 103, and the dicing frame 101 are integrated through a dicing tape 104 cut into a circle. The integrated unit is hereinafter referred to as a wafer unit 105.

  Continuing the description with reference to FIG. 1, the wafer unit 105 is then held by the frame suction portion 16 a and is positioned immediately above the holding means 25 by moving the frame suction portion 16 a in the −X direction. The holding means 25 includes a plurality of frame holding portions 25a for holding the dicing frame 101, and a chuck table 25c having a holding surface 25b for holding the dicing tape 104 attached to the dicing frame 101. When 16a is lowered and the holding of the wafer unit 105 is released, the semiconductor wafer W and the support substrate 103 are placed and held on the holding surface 25b of the chuck table 25c, as shown in FIG. 8A. The dicing frame 101 is held by the frame holding unit 25a.

  At a position adjacent to the holding means 25, support substrate removing means 26 for removing the support substrate 103 from the surface of the semiconductor wafer W adhered to the dicing tape 104 is disposed. The support substrate removing means 26 includes a magnet portion 26a for magnetically attaching the support substrate 103, and a rotation arm 26b for peeling the support substrate 103 attached to the tip portion and magnetized by rotation from the surface of the semiconductor wafer W. And a fulcrum portion 26c that rotatably supports the rotating arm 26b in the horizontal direction and the vertical direction.

  The rotating arm 26b extends from the fulcrum portion 26c in the diameter direction of the semiconductor wafer W held on the chuck table 25c, and the magnet portion 26a is the fulcrum portion 26c of the support substrate 103 attached to the semiconductor wafer W. It attaches to the front-end | tip part of the rotation arm 26b so that the outer peripheral part on the side far from may be magnetically attached. The magnet part 26a is composed of an electromagnet or a permanent magnet, and when an electromagnet is used, the action / non-action of magnetic force can be freely controlled. The magnet part 26a is preferably formed in an arc shape along the outer periphery of the support substrate 103 to be magnetically attached. Further, it is desirable that the fulcrum portion 26c is disposed at a position lower than the holding surface 25b of the chuck table 25c. In the illustrated example, an air ejection nozzle 26d that blows air toward the lower portion of the magnet portion 26a is also provided.

  In the illustrated example, an external stimulus applying means 27 is disposed in the vicinity of the support substrate removing means 26. The external stimulus applying means 27 includes an action portion 27a that acts on an adhesive interposed between the semiconductor wafer W and the support substrate 103, and a rotation angle of the action portion 27a by a predetermined angle between an action position and a non-action position. It is comprised from the drive part 27b to position.

  When the adhesive 106 interposed between the semiconductor wafer W and the support substrate 103 shown in FIG. 4 is of a type in which the adhesive force is reduced by an external stimulus, the magnet part 26 a is attached to the support substrate 103. Before magnetic removal and removal from the semiconductor wafer W, as shown in FIG. 8 (B), the action portion 27a constituting the external stimulus applying means 27 is moved immediately above the substrate 103 so as to be removed from above the support substrate 103. By giving a mechanical stimulus, the adhesive force of the adhesive interposed between the support substrate 103 and the semiconductor wafer W can be reduced. For example, when the pressure-sensitive adhesive 106 shown in FIG. 4 is composed of a pressure-sensitive adhesive whose heat-sensitive adhesive strength is reduced, the pressure-sensitive adhesive force can be reduced by heating from the action portion 27a as an external stimulus.

  When the pressure-sensitive adhesive 106 is a pressure-sensitive adhesive that dissolves in a solvent and has a reduced adhesive strength, the external stimulus is supply of the solvent, and the solvent is supplied to the pressure-sensitive adhesive 106 from the action portion 27a. In this case, a plurality of pores penetrating the front and back of the support substrate 103 are provided, and the solvent is supplied to the adhesive 106 through the pores. Even when the adhesive is of a type whose adhesive strength is reduced by water, such as glue, pores are formed in the support substrate 103 in order to supply water from the action portion 27a to the adhesive 106.

  After the wafer unit 105 is held by the holding unit 25 as shown in FIG. 8A, or after the wafer unit 105 is held by the holding unit 25, as shown in FIG. After the external stimulus is applied, the magnet portion 26a is lowered by the rotation of the rotation arm 26b and the support substrate 103 is magnetically attached. As shown in FIG. 8C, the rotation of the rotation arm 26b is performed. As a result, the magnet portion 26 a is raised, whereby the support substrate 103 is lifted and removed from the semiconductor wafer W. In this way, the transfer to the dicing frame 101 of the semiconductor wafer W is performed.

  Since the support substrate 103 is made of metal and can be detached from the semiconductor wafer W by magnetic attachment by the magnet portion 26a, the transfer of the semiconductor wafer W from the support substrate 103 to the dicing frame F is easy and efficient. To be done. Further, even a semiconductor wafer thinned by grinding can be reliably transferred without being damaged.

  Further, as shown in FIG. 8C, the rotating arm 26b extends from the fulcrum portion 26c in the diameter direction of the semiconductor wafer W held on the chuck table 25c, and the magnet portion 26a extends to the semiconductor wafer W. Since the outer peripheral portion far from the fulcrum portion 26c of the attached support substrate 103 is magnetically attached, the support substrate 103 is removed reliably and smoothly.

  Furthermore, if the fulcrum portion 26c is disposed at a position lower than the holding surface 25b of the chuck table 25c, the support substrate 103 can be reliably magnetically attached.

  When the support substrate 103 is lifted, as shown in FIG. 8C, air is ejected from the air ejection nozzle 26d between the support substrate 103 and the semiconductor wafer W, thereby removing the support substrate 103 from the semiconductor wafer W. It can be done easily.

  In the example of FIG. 8C, since the magnet portion 26a holds the end portion of the support substrate 103, the support substrate 103 rises from the end portion by the rotation of the rotation arm 26b in the hanging direction. The support substrate 103 made of metal is gradually separated from the semiconductor wafer W. When the entire surface of the support substrate 103 is magnetically attached, the support substrate 103 is difficult to separate from the semiconductor wafer W, but the magnet portion 26a holds the end of the support substrate 103, so that the support substrate 103 made of metal is formed. Since it is gradually peeled from the semiconductor wafer W while being bent, the support substrate 103 can be removed smoothly.

  The support substrate 103 thus removed from the semiconductor wafer W and held by the magnet portion 26a is positioned on the temporary table 28 with the rotating arm 26b rotating in the horizontal direction, and the rotating arm 26b in the vertical direction. It is placed on the temporary table 28 by rotating and releasing the magnetic attachment.

  Then, the support substrate 103 is conveyed to the substrate position adjusting means 22 by the semiconductor wafer adhering means 23, and is placed on the placing portion 22a and aligned at a certain position by the aligning portion 22b. It is accommodated in the substrate accommodating means 200 by the carry-in / out means 21. The support substrate 103 thus accommodated in the substrate accommodating means 200 can be used repeatedly when the back surface of the semiconductor wafer is ground later.

  On the other hand, the dicing frame 101 that supports the semiconductor wafer W after the support substrate 103 is removed via the dicing tape 104 is held by the frame holding means 16a that constitutes the frame conveying means 16, and moves in the + X direction to move the frame. After being transported to and placed on the placement area 14, it is accommodated in the frame accommodation means 100 by the frame carry-in / out means 13. Then, the frame accommodating means 100 is transported to the next dicing process.

  In carrying out a semiconductor wafer having a front surface fixed to a support substrate and a back surface ground to a dicing process, the present invention removes the support substrate from the semiconductor wafer and attaches the semiconductor wafer to a dicing tape so as to be integrated with the dicing frame. Since it can be performed easily and efficiently, it can be used for reattachment when a semiconductor wafer thinned by grinding is transported to a dicing process.

It is a perspective view which shows an example of the semiconductor wafer transfer apparatus which concerns on this invention. It is a perspective view which shows a dicing frame. It is a perspective view which shows the semiconductor wafer fixed to the support substrate. It is sectional drawing which shows the adhesion layer interposed between a support substrate and a semiconductor wafer. It is a perspective view which shows the state which turned over the support substrate to which the semiconductor wafer was fixed. (A) is schematic sectional drawing which shows the state by which the dicing frame was mounted in the dicing tape, (B) is the abbreviation which shows a mode that the semiconductor wafer fixed to the support substrate is mounted in a dicing tape. (C) is a schematic cross-sectional view showing a state in which a semiconductor wafer and a dicing frame are pressed against a dicing tape using a pressing roller. It is a perspective view which shows the state with which the semiconductor wafer fixed to the support substrate was united with the dicing frame via the dicing tape. (A) is a schematic cross-sectional view showing a state where the semiconductor wafer is held by the holding means, (B) is a schematic cross-sectional view showing a state in which an external stimulus is applied to the adhesive layer, ( C) is a schematic cross-sectional view showing a state where the support substrate is removed from the semiconductor wafer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10: Semiconductor wafer transfer apparatus 11: Frame accommodation means mounting area 12: Base 13: Frame carrying in / out means 13a: Holding part 14: Frame mounting area 15: Position adjustment means 16: Frame conveyance means 16a: Frame adsorption | suction part 16b: Rail 16c: Horizontal moving part 16d: Lifting drive part
20: Substrate accommodating means placement area 21: Substrate carry-in / out means 21a: Arm portion 21b: Holding portion 22: Substrate position adjusting means 22a: Placement portion 22b: Positioning member 23: Semiconductor wafer attaching means 23a: Arm portion 23b : Holding part 24: Dicing tape sticking means 24a: Frame holding table 24b: Tape feeding part 24c: Tape winding part 24d: Pressing roller 24e: Tape cutter 25: Holding means 25a: Frame holding part 25b: Holding surface 25c: Chuck Table 26: Support substrate removal means 26a: Magnet part 26b: Rotating arm 26c: Support point part 26d: Air ejection nozzle 27: External stimulus applying means 27a: Action part 27b: Drive part 28: Temporary placement table 100: Frame accommodation means 101: Dicing frame 102: Opening 103 : Support substrate 104: Dicing tape 105: Wafer unit 106: Adhesive 200: Substrate accommodation means

Claims (4)

A semiconductor wafer whose back surface is ground with an adhesive attached to the upper surface of a support substrate made of a magnetizable metal is adhered to a dicing tape and integrated with the dicing frame, and the semiconductor wafer A semiconductor wafer transfer apparatus for removing the support substrate from the surface of the semiconductor wafer and transferring the semiconductor wafer to a dicing frame,
A holding means comprising: a frame holding unit for holding a dicing frame; and a chuck table having a holding surface for holding a dicing tape attached to the dicing frame;
A support substrate removing means that is disposed adjacent to the holding means and removes the support substrate from the surface of the semiconductor wafer attached to the dicing tape;
The support substrate removing means includes a magnet portion for magnetizing the support substrate, a pivot arm for pivoting in a direction to peel the support substrate on which the magnet portion is attached and magnetized from the surface of the semiconductor wafer, and the pivot A semiconductor wafer transfer device comprising at least a fulcrum portion that rotatably supports an arm. The rotating arm extends from the fulcrum part in the diameter direction of the semiconductor wafer held on the chuck table,
The semiconductor wafer transfer according to claim 1, wherein the magnet portion is attached to a tip portion of the rotating arm so as to magnetically attach an outer peripheral portion on a side far from a fulcrum portion of the support substrate attached to the semiconductor wafer. apparatus.   The semiconductor wafer transfer device according to claim 1, wherein the fulcrum portion is disposed at a position lower than the holding surface of the chuck table.   A dicing tape adhering means for adhering the dicing frame and the dicing tape, and a semiconductor wafer adhering unit in which the back surface of the semiconductor wafer supported by the support substrate is adhered to the dicing tape and the semiconductor wafer is integrated with the dicing frame. 4. The semiconductor wafer transfer apparatus according to claim 1, 2 or 3, further comprising an attaching means.

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