JP2004106540A - Composite, method for manufacturing the same, and method for manufacturing ceramic substrate - Google Patents

Abstract

A composite which is preferably used for manufacturing a ceramic substrate having a void, a method of manufacturing the same, and a ceramic substrate having a void without delamination or deformation are obtained using the composite.
A step of producing a ceramic green sheet and a burnable sheet having substantially the same thickness, a step of forming a through hole in a predetermined portion of the ceramic green sheet, and a step of forming a ceramic having the through hole. A part of the burnable sheet 2 is embedded in the through hole 3 by laminating the burnable sheet 2 on the green sheet 1 and pressing the through hole 3 forming portion of the ceramic green sheet 1 from the burnable sheet 2 side. A composite is formed by integrating the ceramic green sheet 1 and the burnable sheet 2, and the composite is laminated with another ceramic green sheet and / or another composite to produce a laminate, which is then fired. By removing the burnable sheet by thermal decomposition, the ceramic substrate D having the voids 7 formed in the burnable sheet portion is obtained.
[Selection diagram] Fig. 1

Description

The present invention relates to a method for manufacturing a composite in which a ceramic green sheet and a burnable sheet are integrated, and a method for manufacturing a ceramic substrate using the same. Specifically, the present invention relates to a void for accommodating electronic components and the like. The present invention relates to a manufacturing method suitable for forming a part.

Conventionally, a wiring board using ceramic as an insulating substrate material has a structure in which a metallized wiring layer is disposed on or in a surface of an insulating substrate in which ceramic insulating layers are laminated in multiple layers. A package containing a semiconductor element or the like can be given. As such a package, a material made of ceramics such as alumina has been widely used as an insulating substrate material, and more recently, a low-temperature sintering type sintering such as glass ceramics capable of co-firing with a copper metallized wiring layer has been used. Those using a body as an insulating substrate have also been put to practical use.

In order to manufacture a ceramic substrate having voids for accommodating such electronic components such as semiconductor elements, generally, an appropriate organic binder is added to a ceramic raw material powder prepared at a predetermined ratio, and an organic solvent is added. The slurry is dispersed therein to prepare a slurry, and a ceramic green sheet having a predetermined thickness is formed by a conventionally known casting method such as a doctor blade method or a lip coater method.

Then, a metal paste obtained by adding and mixing an organic binder, a solvent, and a plasticizer to an appropriate metal powder is printed and applied on the green sheet to a predetermined wiring pattern by a well-known screen printing method, and a micro drill or a laser is used. A via conductor is formed by forming a hole and filling the through-hole with a metal paste.

Then, a through hole is punched out at a predetermined position of the green sheet in order to form a cavity for housing the electronic component.

Thereafter, as shown in FIG. 4A in the process chart of the conventional method, the green sheets 21a and 21b in which the through holes 20 are formed are used together with the other green sheets 21c, 21d and 21e using an appropriate adhesion liquid. By laminating a plurality of ceramic laminate molded bodies under predetermined conditions, a substrate 23 having a cavity 22 for accommodating electronic components as shown in FIG. 4B is obtained.
JP-A-10-12345

(4) In such a ceramic substrate 23, in order to reduce the size of the substrate, it is necessary to miniaturize the wiring pattern and the via hole, and it is essential to improve the accuracy at the time of lamination.

However, when the green sheet 21a, 21b in which the through hole 20 forming the gap 22 is formed is laminated with other green sheets 21c, 21d, 21e, the substrate having the gap 22 has the gap 22 and other green sheets. There is a problem in that the pressure is uneven between the above-mentioned portions and deformation is likely to occur during lamination, and when the pressure is reduced to prevent this deformation, poor adhesion between the green sheets occurs. The deformation referred to here is, as shown in FIG. 4, a horizontal deformation that occurs in the green sheets 21 a and 21 b around the gap 22 due to a vertical pressing of the stack of the green sheets 21 a to 21 e. Deformation in which the bottom of the cavity 22 in the green sheet 21c swells may be mentioned. Among them, the bulging at the bottom of the cavity 22 has a problem that a bonding failure occurs when an electronic component such as an LSI chip is mounted.

The bulge at the bottom of the cavity 22 is reduced by lowering the lamination pressure, but in this case, there is a problem that delamination 24 occurs around the cavity 22.

Accordingly, the present invention provides a composite in which a ceramic green sheet and a burnable sheet that are suitably used for manufacturing a ceramic substrate having such a void portion are integrated, a method for manufacturing the same, and a method using the same. An object of the present invention is to provide a method for manufacturing a ceramic substrate having a void portion without delamination or deformation.

複合 The composite of the present invention is characterized in that a burnable sheet having substantially the same thickness as the green sheet is embedded in a through hole formed at a predetermined position of the ceramic green sheet.

Further, according to the first method for producing a composite of the composite, a step of producing a ceramic green sheet and a burnable sheet; a step of forming a through hole in a predetermined portion of the ceramic green sheet; Laminating the burnable sheet on the formed ceramic green sheet, and pressing a through-hole forming portion of the ceramic green sheet from the burnable sheet side, thereby partially disposing the burnable sheet in the through-hole. Embedding, and a step of producing a composite integrated with the ceramic green sheet and the burnable sheet.

According to the second method of manufacturing a composite, a step of producing a ceramic green sheet and a burnable sheet; a step of laminating the ceramic green sheet and a burnable sheet; Pressing the burnable sheet side to shift the pressed portion of the burnable sheet to the ceramic green sheet side to produce a composite body integrally formed with the ceramic green sheet and the burnable sheet. It is assumed that.

Further, according to the present invention, a step of laminating the composite in the first and second composite production methods with another ceramic green sheet and / or another composite to form a laminated structure; Is provided, a composite applied to a substrate having a multilayer structure can be formed.

Further, according to the present invention, it is possible to manufacture a ceramic substrate having voids that are not deformed in a laminated sintered body by firing the laminated structure and thermally removing the burnable sheet. it can.

Further, according to the present invention, a multilayer circuit board having a gap can be manufactured by forming a circuit pattern on the surface of the ceramic green sheet with a conductive material, and the gap includes an IC element, By housing electronic components such as SAW elements, a package substrate can be formed.

In the present invention, the burnable sheet contains resin beads having an average particle diameter of 1 to 10 μm, or the burnable sheet is made of a carbon sheet made of carbon powder, and the carbon sheet is By suitably using a sheet containing 20 to 80% by mass of the thermally decomposable resin and at least 20 to 80% by mass of carbon, it is possible to embed the burnable sheet into the ceramic green sheet by punching and to fill the bottom of the void portion with the burnable sheet. Pressurization can be improved.

According to the present invention, a composite in which a ceramic green sheet and a burnable sheet are partially integrated can be easily formed by one or two punching treatments.

In addition, since the burnable sheet is integrally compounded in the through-hole of the ceramic green sheet, it is easy to handle the ceramic green sheet alone, and in the gap when a plurality of green sheets are laminated. Since the burnable sheet is embedded in the gap, even when a high pressure is applied during lamination, the bottom of the gap is pressed, thereby preventing the bottom of the gap from swelling, thereby achieving delamination. It is possible to apply a high laminating pressure that does not cause the occurrence of the lamination. As a result, occurrence, deformation, and prevention of delamination in the laminate can be achieved.

Further, using such a composite, laminated with other ceramic green sheets and other composites, and heat-treated and fired, by burning out the burnable sheet, the voids with improved flatness are formed. As a result, the mounting reliability of the electronic component on the bottom surface of the gap can be improved.

The first method for producing a composite according to the present invention will be described with reference to the process chart of FIG. First, a ceramic green sheet 1 and a burnable sheet 2 are prepared. The thickness of the ceramic green sheet 1 may be any thickness depending on the intended use, but the thickness of the ceramic green sheet is suitably from 20 to 400 μm in order to form a composite with the burnable sheet 2. Desirably, the burnable sheet 2 has a thickness substantially similar to that of the ceramic green sheet 1, and the thickness t ₂ of the burnable sheet ₂ is equal to 0.1 mm with respect to the thickness t ₁ of the green sheet 1. it is desirable that 9t ₁ ~1.1t _1.

{Circle over (1)} First, a through hole 3 for forming a void portion in the ceramic green sheet 1 is formed. This through hole 3 can be formed by, for example, one of punching, slitting, and laser processing. In particular, punching with a punch is best from the viewpoint of the flowability of a series of operations described later.

FIG. 1 shows the result of forming the through holes 3 by punching. As shown in FIG. 1A, this through hole 3 prepares a punching press constituted by an upper press 4 which is a driving unit and a lower press 6 having an opening 5 while supporting the green sheet 1. Then, the green sheet 1 is placed on the lower press 6 and the upper press 4 is driven downward as shown in FIG. 1 (b), thereby forming the green sheet 1 as shown in FIG. 1 (c). On the other hand, a through hole 3 is formed.

Next, as shown in FIG. 1D, the burnable sheet 2 is placed on the surface of the green sheet 1 in which the through holes 3 are formed. Then, as shown in FIG. 1E, the upper press 4 is driven. At this time, the drive amount of the upper press 4 is adjusted, and the drive stop position is set on the upper surface side of the green sheet 1. Thereby, simultaneously with the punching of the burnable sheet 2, the punched portion 2 a of the burnable sheet 2 can be embedded in the gap 3 formed in the green sheet 1 in advance.

Thereafter, by removing the upper punch 4 and the burnable sheet 2, the burnable sheet 2 is embedded in a through hole 3 formed at a predetermined position of the green sheet 1 as shown in FIG. Complex A can be prepared.

{Circle around (2)} The second manufacturing method of the present invention will be described with reference to FIG. According to the method of FIG. 2, similarly to FIG. 1, a ceramic green sheet 1 and a burnable sheet 2 having substantially the same thickness are produced.

Then, as shown in FIG. 2A, the green sheet 1 is placed on the lower press 6, and as shown in FIG. 2B, the burnable sheet 2 is laminated on the upper side of the ceramic green sheet 1. . At this time, it is desirable that the green sheet 1 and the green sheet 1 are temporarily lightly temporarily fixed with an adhesive or the like in order to peel and remove the burnable sheet 2 as described later.

Then, as shown in FIG. 2C, the upper press 4 is driven, and the drive stop position of the upper press 4 is set on the upper surface side of the green sheet 1 as described above. Thereby, the green sheet 1 and the burnable sheet 2 are simultaneously punched.

Thereafter, the upper punch 4 and the burnable sheet 2 are peeled and removed, and the green sheet 1 is peeled from the lower punch 6, as shown in FIG. The burnable sheet 2 is embedded in the hole 3, and an integrated composite A can be manufactured.

As described above, according to the present invention, one or more composites in which the burnable sheet 2 having substantially the same thickness as the green sheet 1 is embedded in the through hole 3 of the ceramic green sheet 1 by using a punch, or It can be easily formed by two pressing processes.

In the first and second manufacturing methods, the second method with one press processing is more effective in simplifying the steps than the first method with two press processings, from the viewpoint of the number of steps. It is. Further, in the second method, after forming a through hole in the ceramic green sheet 1 in advance and embedding a part of the burnable sheet, the boundary between the burnable sheet and the ceramic green sheet in the composite is smoothed. An embedding process having excellent properties, high accuracy, and good appearance can be performed.

Next, according to the present invention, such a composite is suitably used for producing a ceramic substrate having a multilayer structure having voids. Therefore, a method for manufacturing the ceramic substrate will be described with reference to the process chart of FIG.

As shown in FIGS. 3A and 3B, a composite A2 produced in the same manner as the composite A1 produced in FIG. 1 or FIG. 2 or another green sheet B1 not composited with a burnable sheet. , B2, and B3 are laminated and integrated using a contact liquid or the like to produce a laminate C.

Then, the burnable sheet 2 is fired so that the ceramic green sheet is fired and densified while the burnable sheet 2 is thermally decomposed and removed, as shown in FIG. The embedded portion is thermally decomposed and removed to form the ceramic substrate D having the voids 7.

In such a method, in stacking and integrating, since there is no large void in the sheet itself as in the related art, handling of individual sheets is very easy, and a large through hole as in the related art is formed. No deformation or breakage of the sheet occurs during the handling of the sheet.

In the present invention, it is preferable to apply a pressure of 3 to 7 MPa in laminating and unifying the green sheets in order to prevent lamination failure or delamination after firing.

In addition, according to the method of the present invention, even when a high pressure is applied, the through holes are filled with the burnable sheet, so that the burnable sheet 2 is formed on the bottom of the portion where the void is formed. Sufficient pressure is applied through. As a result, it is also possible to suppress deformation of the bottom green sheet forming the void and occurrence of delamination after firing.

In order to apply the green sheet 1 to a ceramic wiring board or the like, a metallized wiring layer 8 can be appropriately formed on the green sheet 1 as shown in FIG. Before the metallized wiring layer 8 is laminated and integrated with a metal paste obtained by adding and mixing an organic binder, a solvent, and a plasticizer to the metal powder, the green sheet 1 is printed in a predetermined pattern by a well-known screen printing method. Apply. In addition, a via conductor 9 can be formed by forming a through hole in the green sheet by microdrilling or laser processing, and filling the through hole with a metal paste. The via conductor 9 is formed between different layers by the via conductor 9. The metallized wiring layers 8 can be electrically connected to each other.

The green sheet 1 used in the present invention is prepared by adding a suitable organic binder to a ceramic raw material powder prepared in a predetermined ratio and dispersing the mixture in an organic solvent to prepare a slurry. A green sheet 1 having a predetermined thickness is produced by a casting method such as a coater method. The appropriate thickness of the green sheet is usually 20 to 400 μm.

On the other hand, the burnable sheet 2 used in the present invention desirably has excellent punching workability by press and thermal decomposition property in a firing stage. It is desirable to add a filler component.

This filler has good thermal decomposability during firing, and resin beads and carbon powder are particularly effective. Therefore, as the burnable sheet, a sheet containing resin beads having an average particle size of 1 to 10 μm or a carbon sheet formed from carbon powder is preferably used.

樹脂 The resin beads in the resin bead-containing sheet preferably have an average particle size of 1 to 20 µm in order to prevent aggregation between the beads and to enhance the smoothness of the surface of the burnable sheet. The resin beads are desirably made of at least one selected from the group consisting of acrylic, styrene, and butyral, and are particularly desirably made of a cross-linked acrylic resin. This is to prevent the acrylic resin beads from being dissolved in the organic solvent.

作 製 In order to prepare a sheet containing the above resin beads, it is desirable to add 40 to 80 parts by weight of a thermally decomposable resin to 100 parts by weight of the resin beads.

On the other hand, the carbon sheet desirably has a ratio of 20 to 80% by mass of carbon powder and 20 to 80% by mass of an organic binder as a thermally decomposable resin. The average particle size of the carbon powder to be used is suitably from 3 to 100 μm, especially from 5 to 50 μm.

As the thermally decomposable resin to be incorporated in the burnable sheet of the present invention, a butyral-based resin obtained by polymerizing polyvinyl alcohol and butyraldehyde, or a monomer composition such as methyl methacrylate, ethyl methacrylate, and methyl acrylate is an alkyl methacrylate. And an alkyl acrylate, or an acrylic resin made of a polymer comprising a mixture thereof. In particular, an acrylic resin into which a hydroxyl group or a carboxyl group is introduced is suitably used.

To prepare a burnable sheet by applying the slurry prepared with the above-mentioned predetermined composition onto a carrier sheet that has been subjected to a release agent treatment by a coating method such as a conventionally known roll coater, gravure coater, blade coater, etc., and drying. Can be. In addition, it is also possible to form a sheet using the above composition using a press molding method, an extrusion molding method, or the like.

100 parts by mass of a ceramic composition composed of 60% by volume of glass having an average particle size of 1.8 μm and 40% by volume of alumina powder having an average particle size of 2.4 μm, 12 parts by mass of polyisobutyl methacrylate as an organic binder, and a solvent Was mixed at a ratio of 54 parts by mass of toluene, and mixed with a ball mill for 24 hours to prepare a slurry. Using this slurry, a green sheet A having a length of 20 mm × a width of 20 mm × a thickness of 120 μm was prepared by a doctor blade method.

Further, a metal paste obtained by mixing 100 parts by mass of copper powder having an average particle size of 1.5 μm, 12 parts by mass of an acrylic resin as an organic binder, and 10 parts by mass of terpineol as a solvent was used for the green sheet A. It is prepared and printed in a predetermined pattern on the surface of the green sheet A by a screen printing method. Also, a through-hole having a diameter of 70 μm was formed in the green sheet by pin processing, and a via conductor was formed by filling the through-hole with the metal paste.

On the other hand, as the burnable sheet, 100 parts by mass of acrylic resin beads having an average particle size of 5 μm, 60 parts by mass of an acrylic resin having a hydroxyl group introduced as an organic binder, and 220 parts by mass of toluene as a solvent, After mixing to prepare a slurry, a burnable sheet having a thickness of 120 μm was prepared by a doctor blade method.

Next, a through hole having a size of 2.2 mm long × 3 mm wide was formed in the center of the green sheet A by a punching device as shown in FIG.

Next, on the green sheet A in which the through holes are formed, the burnable sheet B is laminated on the green sheet A using an adhesive and a plasticizer added using an adsorption transfer device, The upper punch in the punching device was lowered, and was lowered until the lower surface of the upper punch became flush with the surface of the green sheet A.

(5) As a result of raising the upper punch and confirming the green sheet A, a composite C1 having a structure in which the burnable sheet was embedded was formed in the through hole of the green sheet A.

Next, the composite C1 prepared as described above and the composite C2 in which the burnable sheet is embedded in the through-holes prepared in the same manner as described above are laminated, and a normal non-combustible sheet is formed. A total of five layers of green sheets D1, D2, and D3 on which a wiring pattern was formed were laminated using a contact liquid. In addition, when laminating, a pressure of 5 MPa was applied to the laminate while heating to a temperature of 60 ° C.

に つ い て As for one sample laminated under the pressure, deformation of the green sheet side was observed in a portion in which the burnable sheet was embedded, and no deformation was recognized in the green sheet.

Next, the laminate is heated and heated in a nitrogen atmosphere at 250 to 450 ° C. for 2 hours to thermally decompose and remove the burnable sheet and the organic binder. Then, the temperature is further increased to 900 ° C. to sinter the green sheet. did.

As a result, a ceramic wiring board was obtained in which the burnable sheet was embedded and the portions were thermally decomposed and removed to form voids.

The flatness of the bottom surface of the void was measured by the stylus method on the manufactured ceramic wiring board, and as a result, it was 0.8 μm. A bottom with high flatness was formed, and it was confirmed that there was almost no deformation of the board. Was done. In addition, as a result of cutting the void forming portion and observing the state of the laminated portion with a binocular microscope, no occurrence of delamination or the like was observed at all.

After laminating the green sheet A and the burnable sheet B produced in Example 1 as shown in FIG. 2, the upper punch in the punching device is lowered, and the lower surface of the upper punch is flush with the surface of the green sheet A. I lowered it.

(5) As a result of raising the upper punch and confirming the green sheet A, a composite C3 having a structure in which the burnable sheet B was embedded was formed in the through hole of the green sheet A.

Then, in the same manner as in Example 1, the green sheet C3 and the green sheets D1, D2, and D3 on which normal wiring patterns not formed with the burnable sheet are formed are formed into a total of five green layers. The sheets were laminated using a contact liquid, and a pressure of 5 MPa was applied while heating the sheet to a temperature of 60 ° C.

に つ い て As for one sample laminated under the pressure, deformation of the green sheet side was observed in a portion in which the burnable sheet was embedded, and no deformation was recognized in the green sheet.

Thereafter, the laminate was heated and heated in a nitrogen atmosphere at 250 to 450 ° C. for 2 hours to thermally decompose and remove the burnable sheet and the organic binder. The ceramic wiring board in which the voids were formed by removing the portion in which the conductive sheet was embedded by thermal decomposition was obtained.

The flatness of the bottom surface of the void was measured by a stylus method with respect to the manufactured ceramic wiring substrate. As a result, it was confirmed that the bottom surface having a high flatness of 1 μm was formed and the substrate was hardly deformed. . In addition, as a result of cutting the void forming portion and observing the state of the laminated portion with a binocular microscope, no occurrence of delamination or the like was observed at all.

Comparative Example 1

(4) After forming through holes in the green sheets A1 and A2 produced in the same manner as in Example 1, the through holes were respectively formed without embedding the burnable sheet.

Then, together with the green sheets D1, D2, and D3 used in Examples 1 and 2 having no through hole, the green sheets of the green sheets A1 and A2 were heated to a temperature of 60 ° C. by using a contact liquid. While heating, a pressure of 5 MPa was applied.

に つ い て As for one sample laminated under pressure, the deformation of the green sheet side was observed at the portion where the burnable sheet was embedded, and as a result, a bulge was confirmed on the bottom surface of the void portion of the green sheet.

Next, the laminate was heated and heated in a nitrogen atmosphere at 250 to 450 ° C. for 2 hours to thermally decompose and remove the organic binder. Was obtained on which a ceramic wiring board was formed.

(4) The flatness of the bottom surface of the void was measured by a stylus method on the manufactured ceramic wiring substrate, and as a result, it was 6 μm, and a bottom surface having poor flatness was formed, and deformation of the substrate was recognized. In addition, as a result of cutting the gap forming portion and observing the state of the laminated portion with a binocular microscope, no occurrence of delamination or the like was observed at all.

Comparative Example 2

In Comparative Example 1, the green sheets D1, D2, and D3 used in Examples 1 and 2 in which the through holes were not formed, and the green sheets A1 and A2 in which only the through holes were formed were adhered together with the green sheets of five layers in total. A ceramic wiring board having a void portion was produced in exactly the same manner as described above, except that the liquid was used and heated at a temperature of 60 ° C. while applying a pressure lower than that of Comparative Example 1 of 2 MPa to perform lamination.

The flatness of the bottom surface of the void was measured by a stylus method on the manufactured ceramic wiring board, and as a result, a relatively good bottom surface having a flatness of 2 μm was formed, and no deformation of the board was observed. As a result of cutting the gap forming portion and observing the state of the laminated portion with a binocular microscope, occurrence of delamination or the like was partially observed.

To 60% by mass of carbon powder having an average particle size of 40 μm, butyral resin having a glass transition point of 60 ° C. of 40% by mass as an organic binder is added, and 150 parts by weight of toluene is added to 100 parts by mass of the composition. After that, they were mixed by a ball mill to prepare a slurry mixture. Thereafter, this slurry was stirred and defoamed under reduced pressure, and a 200 μm-thick burnable sheet was produced by a doctor blade method.

セ ラ ミ ッ ク A ceramic wiring board having voids was produced in the same manner as in Example 1 except that this burnable sheet was used.

In this manufacturing process, deformation of the green sheet side was observed in the portion in which the burnable sheet was embedded, and no deformation was observed in the green sheet.

The flatness of the bottom surface of the void was measured by the stylus method on the manufactured ceramic wiring board. The result was 0.9 μm, a bottom with high flatness was formed, and it was confirmed that there was almost no deformation of the board. Was done. In addition, as a result of cutting the void forming portion and observing the state of the laminated portion with a binocular microscope, no occurrence of delamination or the like was observed at all.

It is a flowchart for explaining an example of a manufacturing method of a composite in the present invention. It is a flowchart for explaining another example of a manufacturing method of a composite in the present invention. It is a flowchart for explaining the manufacturing method of the ceramic substrate which has a gap using the composite of the present invention. It is a process drawing for explaining the manufacturing method of the ceramic substrate which has the conventional gap part.

Explanation of reference numerals

REFERENCE SIGNS LIST 1 ceramic green sheet 2 burnable sheet 3 through hole 4 upper punch 5 opening 6 lower punch 7 gap 8 metallized wiring layer 9 via conductors A, A1, A2 composite B green sheet C laminate D ceramic substrate

Claims (13)

A composite, wherein a burnable sheet having substantially the same thickness as the green sheet is embedded in a through hole formed in a predetermined portion of the ceramic green sheet. The composite according to claim 1, wherein the burnable sheet contains resin beads having an average particle size of 1 to 10 µm. 2. The composite according to claim 1, wherein the burnable sheet comprises a carbon sheet made of carbon powder. The composite according to claim 3, wherein the burnable sheet contains 20 to 80% by mass of a thermally decomposable resin and at least 20 to 80% by mass of carbon. Producing ceramic green sheets and burnable sheets of substantially the same thickness;
Forming a through hole at a predetermined location of the ceramic green sheet;
Laminating the burnable sheet on the ceramic green sheet having the through hole formed therein,
By pressing the through-hole forming portion of the ceramic green sheet from the burnable sheet side, a part of the burnable sheet is embedded in the through hole to produce a composite body in which the ceramic green sheet and the burnable sheet are integrated. The process of
A method for producing a composite, comprising: Producing ceramic green sheets and burnable sheets of substantially the same thickness;
Laminating the ceramic green sheet and the burnable sheet,
By pressing a predetermined portion of the laminated body from the burnable sheet side, the pressed portion of the burnable sheet is shifted to the ceramic green sheet side, and a composite is formed by integrating the ceramic green sheet and the burnable sheet. The process of
A method for producing a composite, comprising: A method for producing a composite, comprising a step of laminating the composite according to claim 5 or 6 with another ceramic green sheet and / or another composite to produce a laminate. 8. A method for manufacturing a ceramic substrate, comprising: sintering the laminate according to claim 7, and thermally decomposing and removing the burnable sheet to form a void in the burnable sheet portion. 9. The method for manufacturing a ceramic substrate according to claim 8, wherein a circuit pattern is formed of a conductive material on a surface of the ceramic green sheet. 9. The method according to claim 8, wherein an electronic component is stored in the gap. The method according to any one of claims 8 to 10, wherein the burnable sheet contains resin beads having an average particle size of 1 to 10 µm. The method for manufacturing a ceramic substrate according to claim 9, wherein the burnable sheet is formed of a carbon sheet made of carbon powder. The method for manufacturing a ceramic substrate according to claim 12, wherein the burnable sheet contains 20 to 80% by mass of a thermally decomposable resin and at least 20 to 80% by mass of carbon.

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