JP2003238911A - Moisture-proof transparent adhesive tape - Google Patents
Moisture-proof transparent adhesive tapeInfo
- Publication number
- JP2003238911A JP2003238911A JP2002038064A JP2002038064A JP2003238911A JP 2003238911 A JP2003238911 A JP 2003238911A JP 2002038064 A JP2002038064 A JP 2002038064A JP 2002038064 A JP2002038064 A JP 2002038064A JP 2003238911 A JP2003238911 A JP 2003238911A
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- layer
- sensitive adhesive
- proof
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
(57)【要約】
【課題】 透明性が高くかつ防湿性にも優れた防湿透明
粘着テープ、特に電子部品の密封かつ部品内部の品質検
査並びに貼付位置の確認にも適した防湿透明粘着テープ
を提供する。
【解決手段】 ポリエチレンテレフタレートなどからな
る透明な熱可塑性樹脂フィルム層の少なくとも片面に酸
化ケイ素等からなるセラミックコート処理層、エポキシ
系樹脂などによるコーティング処理層などの防湿処理層
を備えた基材層の何れか片面に粘着剤層を備える。当該
粘着剤層は、好ましくは前記熱可塑性樹脂フィルム層に
備えるのがよい。このとき、粘着テープの透湿度を１.
０g/ｍ2・２４hr以下、全光線透過率を７０.０％以上に
する。当該粘着テープは、好ましくは電子部品の筐体に
形成された開口部に貼着して用いられる。
PROBLEM TO BE SOLVED: To provide a moisture-proof transparent adhesive tape having high transparency and excellent moisture-proof property, and particularly suitable for sealing electronic components, inspecting the quality inside the components, and confirming a sticking position. provide. SOLUTION: A transparent thermoplastic resin film layer made of polyethylene terephthalate or the like is provided on at least one surface thereof with a moisture-proof treatment layer such as a ceramic coat treatment layer made of silicon oxide or the like or a coating treatment layer made of an epoxy resin or the like. Either side is provided with an adhesive layer. The pressure-sensitive adhesive layer is preferably provided on the thermoplastic resin film layer. At this time, set the moisture permeability of the adhesive tape to 1.
0 g / m 2 · 24 hr or less, and the total light transmittance is 70.0% or more. The pressure-sensitive adhesive tape is preferably used by being attached to an opening formed in a housing of an electronic component.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は防湿透明粘着テープ
に関する。具体的には、防湿性と透明性に優れ、タック
ラベルや両面テープなどとしても用いられる防湿透明粘
着テープに関する。TECHNICAL FIELD The present invention relates to a moisture-proof transparent adhesive tape. Specifically, it relates to a moisture-proof transparent pressure-sensitive adhesive tape which is excellent in moisture-proof property and transparency and is also used as a tack label, a double-sided tape or the like.
【０００２】[0002]
【従来の技術】防湿粘着テープとして、従来より、プラ
スチックフィルムにアルミニウム蒸着をしたアルミニウ
ム蒸着フィルムやアルミニウム箔と紙を積層したアルミ
ニウム積層フィルム、支持性のあるプラスチックフィル
ムにポリ塩化ビニリデンやエチレン−ビニルアルコール
共重合体等をコーティングしたガスバリア性を有する積
層フィルムを基材としたものがある。2. Description of the Related Art Conventionally, as a moisture-proof adhesive tape, an aluminum vapor-deposited film obtained by vapor-depositing aluminum on a plastic film, an aluminum laminated film obtained by laminating an aluminum foil and paper, and polyvinylidene chloride or ethylene-vinyl alcohol on a supportive plastic film. There is a base material which is a laminated film having a gas barrier property coated with a copolymer or the like.
【０００３】これらのうちアルミニウムを用いたもので
は不透明であるために、粘着テープの切断・巻き取り等
の工程において視覚による異物検査を行うことができな
かった。また、被着体に貼付されると被着体の内容物や
被着体表面に付着した傷、印字された表示、被着体の貼
付位置が確認できないという問題点があった。特に、例
えばハードディスク装置などの一部の電子部品において
は、被着体内部の防湿性を確保しながら、被着体開口部
から被着体内部の確認を行う必要があるが、当該粘着テ
ープを開口部に貼付すれば内部の確認を行えなかった。
また、開口部の位置が把握できないため、粘着テープの
端が開口部近郊に貼付され、充分な密封性を確保できな
いというおそれもあった。Among these, the one using aluminum cannot be visually inspected for foreign matter in the steps of cutting and winding the adhesive tape because it is opaque. In addition, there is a problem in that when it is attached to an adherend, the contents of the adherend, the scratches attached to the surface of the adherend, the printed display, and the sticking position of the adherend cannot be confirmed. In particular, for some electronic components such as a hard disk device, it is necessary to check the inside of the adherend through the opening of the adherend while ensuring moisture resistance inside the adherend. If it was attached to the opening, the inside could not be confirmed.
Further, since the position of the opening cannot be grasped, the end of the adhesive tape may be attached to the vicinity of the opening, and sufficient sealing performance may not be ensured.
【０００４】一方、ガスバリア性を有する積層フィルム
を用いたものでは、基材そのものは透明であるため、こ
のような問題点を有しない。ところが、このような積層
フィルムは、水蒸気や酸素等のガスバリア性が十分では
ない場合があった。On the other hand, the one using a laminated film having a gas barrier property does not have such a problem because the substrate itself is transparent. However, such a laminated film may not have sufficient gas barrier properties against water vapor, oxygen and the like.
【０００５】このような問題点を解決するものとして、
例えば特開２００１−１９９０１０号公報や特開２００
１−６４４２４号公報には、プラスチックフィルムに酸
化アルミニウムやセラミックスの薄膜からなる防湿層を
備えたガスバリア性フィルムが開示されている。これら
のガスバリア性フィルムは、透明性が高く、なおかつ水
蒸気や酸素等のガスバリア性に優れたものである。As a means for solving such a problem,
For example, JP 2001-199010 A and JP 200
Japanese Patent Laid-Open No. 1-64424 discloses a gas barrier film in which a plastic film is provided with a moisture-proof layer made of a thin film of aluminum oxide or ceramics. These gas barrier films have high transparency and excellent gas barrier properties against water vapor, oxygen and the like.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、当該ガ
スバリア性フィルムの防湿層に粘着剤層を設けた場合に
は、粘着剤層に含む成分により防湿層が劣化しやすく、
ガスバリア性が低下するおそれがあった。これを防止す
るため、例えば特開平１１−１３８６８４号公報には、
金属酸化物蒸着層と粘着剤層との間に水性コーティング
剤からなる被覆層を形成した防湿粘着テープが開示され
ているが、この防湿粘着テープでは被覆層を設けなけれ
ばならず、工程数の増加を招いていた。However, when the pressure-sensitive adhesive layer is provided on the moisture-proof layer of the gas barrier film, the moisture-proof layer is likely to deteriorate due to the components contained in the pressure-sensitive adhesive layer,
There was a risk that the gas barrier properties would deteriorate. In order to prevent this, for example, in Japanese Patent Laid-Open No. 11-138684,
Disclosed is a moisture-proof pressure-sensitive adhesive tape in which a coating layer made of a water-based coating agent is formed between the metal oxide vapor-deposition layer and the pressure-sensitive adhesive layer. Was inviting an increase.
【０００７】本発明は上記従来技術の問題点に鑑みてな
されたものであって、至極簡単な方法によって、透明性
が高くかつ防湿性にも優れた防湿透明粘着テープ、特に
電子部品の密封かつ内部の品質検査並びに貼付位置の確
認にも適した防湿透明粘着テープを提供することを目的
とする。The present invention has been made in view of the above-mentioned problems of the prior art, and a moisture-proof transparent pressure-sensitive adhesive tape having high transparency and excellent moisture-proofness, particularly for sealing electronic parts by a very simple method. It is an object of the present invention to provide a moisture-proof transparent pressure-sensitive adhesive tape suitable for internal quality inspection and confirmation of the sticking position.
【０００８】[0008]
【課題を解決するための手段】本発明に係る防湿透明粘
着テープは、透明な熱可塑性樹脂フィルム層の少なくと
も片面に防湿処理層を備えた基材層に、粘着剤層が備え
られたことを特徴としている。The moisture-proof transparent pressure-sensitive adhesive tape according to the present invention comprises a transparent thermoplastic resin film layer having a moisture-proof treatment layer on at least one surface thereof, and a pressure-sensitive adhesive layer provided on the substrate layer. It has a feature.
【０００９】この防湿透明粘着テープにおいては、前記
粘着剤層を前記熱可塑性樹脂フィルム層に備えるのが好
ましい。In this moisture-proof transparent pressure-sensitive adhesive tape, it is preferable that the pressure-sensitive adhesive layer is provided on the thermoplastic resin film layer.
【００１０】また、前記基材層は、前記防湿処理層にさ
らに別な熱可塑性樹脂フィルム層を備え、当該熱可塑性
樹脂フィルム層にも粘着剤層を備え、いわゆる両面テー
プとすることもできる。Further, the base material layer may be a so-called double-sided tape in which the moisture-proof treated layer is further provided with another thermoplastic resin film layer, and the thermoplastic resin film layer is also provided with an adhesive layer.
【００１１】上記本発明における防湿透明粘着テープに
おいては、全光線透過率を７０.０％以上とするのがよ
く、透湿度を１.０g/ｍ2・２４hr以下とすることが望ま
しい。In the moisture-proof transparent pressure-sensitive adhesive tape of the present invention, the total light transmittance is preferably 70.0% or more, and the moisture permeability is preferably 1.0 g / m 2 · 24 hr or less.
【００１２】これらの防湿透明粘着テープは、例えば電
子部品に貼着されることを目的とされ、筐体に開口部が
形成された電子部品における前記開口部に貼着されるこ
とを特徴とする。These moisture-proof transparent pressure-sensitive adhesive tapes are intended to be adhered to, for example, electronic parts and are characterized in that they are adhered to the opening of the electronic part having an opening formed in the housing. .
【００１３】[0013]
【発明の実施の形態】図１は本発明の防湿透明粘着テー
プの一例を示す構造図である。防湿透明粘着テープは、
熱可塑性樹脂フィルム層１１の少なくとも片面に防湿処
理層１２を備えた基材層１０と粘着剤層２０とを備え、
該粘着剤層２０が前記熱可塑性樹脂フィルム層１１に備
えられたものである。1 is a structural diagram showing an example of a moisture-proof transparent pressure-sensitive adhesive tape of the present invention. The moisture-proof transparent adhesive tape is
A thermoplastic resin film layer 11 is provided with a base material layer 10 having a moisture-proof treatment layer 12 on at least one surface and an adhesive layer 20,
The pressure-sensitive adhesive layer 20 is provided on the thermoplastic resin film layer 11.
【００１４】当該基材層１０としては、防湿処理層１２
が備えられ、透明かつ防湿性を有するテープ用基材であ
れば特に限定されるものではないが、熱可塑性樹脂フィ
ルム層１１に防湿処理が施されたものが用いられる。当
該熱可塑性樹脂フィルム層１１には、ポリエチレンテレ
フタレートなどのポリエステルやポリプロピレン、ポリ
エチレン、ポリエチレン−ポリプロピレンのブレンド
物、ポリアミド、ナイロンなど各種の熱可塑性樹脂が用
いられる。これらの中でも、透明性やフィルム物性、粘
着剤との投錨性を考慮すると、ポリエチレンテレフタレ
ート樹脂を用いるのが好ましい。As the base material layer 10, a moisture-proof treatment layer 12 is used.
Is not particularly limited as long as it is a transparent and moisture-proof tape substrate, and a thermoplastic resin film layer 11 that has been subjected to a moisture-proof treatment is used. For the thermoplastic resin film layer 11, various thermoplastic resins such as polyesters such as polyethylene terephthalate, polypropylene, polyethylene, blends of polyethylene-polypropylene, polyamide, nylon are used. Among these, it is preferable to use a polyethylene terephthalate resin in consideration of transparency, physical properties of the film, and anchorability with an adhesive.
【００１５】防湿処理層１２としては、酸化ケイ素、ア
ルミナ、酸化マグネシウム等からなるセラミックコート
処理層、エポキシ系樹脂やポリエステル系樹脂、ウレタ
ン系樹脂などによる樹脂処理層が挙げられる。これらの
防湿処理も水蒸気や気体等のガスバリア性を付与できる
ものであり、透明性を確保できれば特に制限されるもの
ではない。Examples of the moisture-proof treatment layer 12 include a ceramic coat treatment layer made of silicon oxide, alumina, magnesium oxide, etc., and a resin treatment layer made of epoxy resin, polyester resin, urethane resin or the like. These moisture-proof treatments can also impart a gas barrier property against water vapor or gas, and are not particularly limited as long as the transparency can be secured.
【００１６】これらの防湿処理層１２を備えた基材層１
０を具体的に挙げれば、前者のセラミックコート処理層
を備えたものとして、上記の特開２００１−６４４２４
号公報や特開２００１−１９９０１０号公報に開示され
た透明ガスバリアフィルムが挙げられる。また、後者の
樹脂処理層を備えたものとしては、特開平９−１５１２
６５号公報や特開２００１−９８０４７号公報に開示さ
れたガスバリアフィルムが挙げられる。A base material layer 1 provided with these moisture-proof treatment layers 12
0 is specifically mentioned, the above-mentioned Japanese Patent Laid-Open No. 2001-64424 is assumed to have the ceramic coating layer.
The transparent gas barrier film disclosed in JP-A No. 2001-199010 and JP-A No. 2001-199010 can be used. Further, as the one provided with the latter resin treatment layer, there is disclosed in Japanese Patent Application Laid-Open No. 9-1512.
Examples of the gas barrier film are disclosed in Japanese Patent Laid-Open No. 65 and Japanese Patent Laid-Open No. 2001-98047.
【００１７】用いる基材層１０としては、平均膜厚が１
２〜７５μｍであり、フィルム強度が１００Ｍｐａ以上
のものを用いるのが好ましい。平均膜厚が１２μｍ未満
であれば粘着剤層２０の形成が困難になり、場合によっ
ては以下に述べるような所望する透湿度を得られなくお
それがある。一方、７５μｍを越えると柔軟性に欠け、
ハードディスクなどの電子部品への貼着が困難になる。
また、フィルム強度が１００Ｍｐａを下回る場合には、
剥離時にフィルムが破断するおそれが強くなり、被着体
から良好に剥がせなくなる場合がある。The substrate layer 10 used has an average film thickness of 1
It is preferable to use a film having a thickness of 2 to 75 μm and a film strength of 100 Mpa or more. If the average film thickness is less than 12 μm, it will be difficult to form the pressure-sensitive adhesive layer 20, and in some cases, it may not be possible to obtain the desired moisture permeability as described below. On the other hand, if it exceeds 75 μm, it lacks flexibility,
It becomes difficult to attach to electronic components such as hard disks.
If the film strength is less than 100 MPa,
There is a strong possibility that the film will break during peeling, and it may not be able to be peeled off well from the adherend.
【００１８】本発明においてはこのような基材層１０に
粘着剤層２０が設けられる。この粘着剤層２０は、基材
層１０の熱可塑性樹脂フィルム層１１あるいは防湿処理
層１２のいずれにでも設けることができるが、セラミッ
クコート処理層に粘着剤層２０を設ける場合には、防湿
処理層１２に応じて粘着剤組成の改良、防湿処理層１２
の表面処理を工夫しなければならず、粘着剤組成の設計
が面倒になる。また、防湿処理層１２によっては当該処
理層が劣化し、バリア性の低下を引き起こすおそれが強
くなる。このため、粘着剤層２０は基材層１０のうち熱
可塑性フィルム層に積層するのが望ましい。また、両面
テープとする場合には、図２に示すように防湿処理層１
２に別な熱可塑性樹脂フィルム層１１を形成した後、粘
着剤層２０を形成するのがよい。In the present invention, the pressure-sensitive adhesive layer 20 is provided on such a base material layer 10. The pressure-sensitive adhesive layer 20 can be provided on either the thermoplastic resin film layer 11 or the moisture-proof treatment layer 12 of the base material layer 10. However, when the pressure-sensitive adhesive layer 20 is provided on the ceramic coat treatment layer, the moisture-proof treatment is required. Improvement of pressure-sensitive adhesive composition according to layer 12, moisture-proof treatment layer 12
It is necessary to devise the surface treatment of the above, and the design of the adhesive composition becomes troublesome. Further, depending on the moisture-proof treatment layer 12, there is a strong possibility that the treatment layer will deteriorate and the barrier property will deteriorate. Therefore, it is desirable that the adhesive layer 20 be laminated on the thermoplastic film layer of the base material layer 10. Further, when the double-sided tape is used, as shown in FIG.
After forming another thermoplastic resin film layer 11 on 2, the pressure-sensitive adhesive layer 20 may be formed.
【００１９】このように熱可塑性フィルム層に粘着剤層
２０を形成することで、防湿処理層１２に適した特殊な
処理を施すことなく粘着テープを作製でき、今までの粘
着テープと同様の製造工程、粘着剤組成等によって防湿
透明性に優れた粘着テープを提供できる。こうして極め
て簡便な方法にて本願発明の目的を達成できる。By thus forming the pressure-sensitive adhesive layer 20 on the thermoplastic film layer, a pressure-sensitive adhesive tape can be produced without performing a special treatment suitable for the moisture-proof treatment layer 12, and the same production as the conventional pressure-sensitive adhesive tapes can be manufactured. A pressure-sensitive adhesive tape having excellent moisture-proof transparency can be provided depending on the process, pressure-sensitive adhesive composition and the like. Thus, the object of the present invention can be achieved by an extremely simple method.
【００２０】当該粘着剤層２０には、アクリル系粘着
剤、ウレタン系粘着剤、ポリエステル系粘着剤など公知
である種々の粘着剤が用いられる。これらの粘着剤層２
０は、公知の方法により熱可塑性樹脂フィルム層１１に
積層できる。このとき、粘着剤層２０の投錨力を向上す
るため、樹脂フィルム層表面にコロナ処理やプラズマ処
理を施してもよい。また、必要に応じて透明性を低下さ
せない範囲で、架橋剤や粘着付与剤、老化防止剤、安定
剤、充填剤、顔料など公知の添加物を配合してもよい。For the pressure-sensitive adhesive layer 20, various known pressure-sensitive adhesives such as acrylic pressure-sensitive adhesive, urethane pressure-sensitive adhesive, polyester pressure-sensitive adhesive are used. These adhesive layers 2
0 can be laminated on the thermoplastic resin film layer 11 by a known method. At this time, in order to improve the anchoring force of the pressure-sensitive adhesive layer 20, the surface of the resin film layer may be subjected to corona treatment or plasma treatment. Further, if necessary, known additives such as a crosslinking agent, a tackifier, an antioxidant, a stabilizer, a filler, and a pigment may be blended within a range that does not reduce the transparency.
【００２１】また、粘着剤層２０の厚みは５〜５０μｍ
とするのがよく、粘着力が少なくとも５Ｎ／２０ｍｍ以
上となるようにするのがよい。５μｍ未満では十分な貼
着力を得ることができず、５０μｍ以上では粘着剤層２
０が厚くなりすぎ、電子部品用としては好ましくない。
なお、この粘着力は、実施例記載の方法により得られた
ものである。The thickness of the adhesive layer 20 is 5 to 50 μm.
The adhesive strength is preferably at least 5 N / 20 mm or more. If it is less than 5 μm, sufficient adhesive force cannot be obtained, and if it is 50 μm or more, the pressure-sensitive adhesive layer 2
0 is too thick, which is not preferable for electronic parts.
The adhesive force was obtained by the method described in the examples.
【００２２】本発明においては、少なくとも粘着テープ
として透湿度（ＪＩＳ Ｚ０２０８カップ法Ｂ法によ
る）が１.０g/ｍ2・２４hr以下、望ましくは０.５g/ｍ2
・２４hr以下に設定するのが好ましい。１.０g/ｍ2・２
４hrを越えた場合には、電子部品に対する防湿性が十分
に確保することができず、実用性に欠けることになる。
この観点からすれば、上記基材層１０として、その透湿
度が０.５g/ｍ2・２４hr以下のものを使用するのが好ま
しい。In the present invention, at least the pressure-sensitive adhesive tape has a moisture permeability (according to JIS Z0208 cup method B method) of 1.0 g / m 2 · 24 hr or less, preferably 0.5 g / m 2.
-It is preferable to set it to 24 hours or less. 1.0g / m 2 · 2
If it exceeds 4 hours, sufficient moisture resistance to electronic parts cannot be ensured, resulting in lack of practicality.
From this point of view, it is preferable to use, as the base material layer 10, one having a water vapor transmission rate of 0.5 g / m 2 · 24 hr or less.
【００２３】また、粘着テープとして全光線透過率（Ｊ
ＩＳ Ｋ−７１０５ 測定法Ａによる）を７０.０％以
上確保することが望ましい。これよりも少ない場合に
は、光源を用いた異物検査器による品質検査ができない
ことになる。また、基材層１０の全光線透過率は７０.
０％以上、好ましくは７５％以上、望ましくは８０％以
上のものが用いられる。The total light transmittance (J
It is desirable to secure at least 70.0% according to IS K-7105 measurement method A). If the amount is less than this, the quality inspection by the foreign substance inspection device using the light source cannot be performed. The total light transmittance of the base material layer 10 is 70.
0% or more, preferably 75% or more, desirably 80% or more is used.
【００２４】得られた防湿透明粘着テープは、例えばハ
ードディスク装置の筐体に開設された検査用開口を塞ぐ
ようにして筐体自体に貼着される。この場合でも、粘着
テープの貼付位置の確認を行えると同時に、検査時には
当該粘着テープを貼着した状態で光源を用いた異物検出
器により筐体内の異物検査や筐体内の内容検査を行うこ
とができる。また、使用中においては、湿気やホコリな
どの侵入を防ぐことができる。このように本発明の防湿
透明粘着テープは筐体に開口部を有する電子部品などに
好適なものである。もちろん、これ以外にも種々の使い
方ができるのは言うまでもない。The obtained moisture-proof transparent pressure-sensitive adhesive tape is attached to the housing itself so as to close the inspection opening formed in the housing of the hard disk device, for example. Even in this case, it is possible to confirm the sticking position of the adhesive tape, and at the same time, at the time of inspection, the foreign material detector using the light source can be used to inspect the foreign material inside the housing and the content inside the housing while the adhesive tape is stuck. it can. In addition, it is possible to prevent intrusion of moisture and dust during use. As described above, the moisture-proof transparent pressure-sensitive adhesive tape of the present invention is suitable for an electronic component having an opening in the housing. Needless to say, it can be used in various ways other than this.
【００２５】[0025]
【実施例】次に本発明の実施例に基づき、より具体的に
説明するが、本発明は何ら以下の実施例に限定されるも
のではない。また、実施例及び比較例の何れにおいても
図１に示す構成のものである。EXAMPLES The present invention will be described more specifically based on examples of the present invention, but the present invention is not limited to the following examples. Further, both the examples and the comparative examples have the configuration shown in FIG.
【００２６】（実施例１）基材層にポリエチレンテレフ
タレートからなるフィルム層に酸化ケイ素を主体とする
防湿処理層が形成された防湿透明フィルム（東洋紡績株
式会社製、厚さ５０μｍ）を用いた。このフィルム層に
アクリル系粘着剤を塗布し、１２０℃×３分の条件で硬
化させ、厚さ３０μｍの粘着剤層を形成した防湿透明粘
着テープを作製した。なお、前記防湿透明フィルムの透
湿度は０.０４g/ｍ2・２４hr、全光線透過率は８７％で
あった（測定方法は下記方法による。以下の比較例にお
いても同じ。）。Example 1 A moisture-proof transparent film (manufactured by Toyobo Co., Ltd., thickness: 50 μm) was used in which a moisture-proof treatment layer mainly composed of silicon oxide was formed on a film layer made of polyethylene terephthalate as a base material layer. An acrylic pressure-sensitive adhesive was applied to this film layer and cured under the conditions of 120 ° C. for 3 minutes to prepare a moisture-proof transparent pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer having a thickness of 30 μm. The moisture-proof transparent film had a moisture permeability of 0.04 g / m 2 · 24 hr and a total light transmittance of 87% (the measuring method is based on the following method. The same applies to the following comparative examples).
【００２７】（比較例１）基材層にポリエチレンテレフ
タレートからなるフィルム層にアルミニウムを蒸着した
防湿フィルム（東洋メタライジング株式会社製、商品名
「メタルミ−Ｓ」、厚さ５０μｍ）を用いた他は、実施
例１と同様にして、防湿粘着テープを作製した。なお、
防湿フィルムの透湿度は０.０５g/ｍ2・２４hr、全光線
透過率は０.１％であった。(Comparative Example 1) Except for using a moisture-proof film (manufactured by Toyo Metallizing Co., Ltd., trade name "Metalmi-S", thickness 50 μm) in which aluminum is vapor-deposited on a film layer made of polyethylene terephthalate as a base material layer. A moisture-proof pressure-sensitive adhesive tape was produced in the same manner as in Example 1. In addition,
The moisture proof film had a water vapor transmission rate of 0.05 g / m 2 · 24 hr and a total light transmittance of 0.1%.
【００２８】（比較例２）基材層にポリエチレンテレフ
タレートからなる白色のフィルム（三菱化学ポリエステ
ルフィルム株式会社製、商品名「ダイアホイルＷ１０
０」、厚さ５０μｍ）を用いた他は、実施例１と同様に
した。なお、前記フィルムの透湿度は０.１５g/ｍ2・２
４hr、全光線透過率は４１％であった。(Comparative Example 2) A white film made of polyethylene terephthalate as a base material layer (manufactured by Mitsubishi Kagaku Polyester Film Co., Ltd., trade name "DIAFOIL W10").
0 ”, thickness 50 μm) was used, and the same procedure as in Example 1 was performed. The water vapor transmission rate of the film is 0.15 g / m 2 · 2.
The total light transmittance was 41% for 4 hours.
【００２９】次いで、これら実施例及び比較例の粘着テ
ープを用いて、透湿度及び全光線透過率並びに粘着力を
測定し、その結果を表１に示した。透湿度の測定は、Ｊ
ＩＳ Ｚ０２０８に基づき、温度４０±０.５℃、相対
湿度９０±２％の条件下で行った。全光線透過率は、Ｊ
ＩＳ Ｋ−７１０５に基づき、市販の積分球式光線透過
率測定装置計（Hazemeter NDH-20D Nippon Denshoku Ky
ogo 社製）を用いて測定した。粘着力は、温度２３℃、
湿度６０％の条件下、各粘着シートをステンレス板（Ｓ
ＵＳ３０４）に２ｋｇのローラを１往復で圧着し、圧着
後３０分後に１８０°ピール、引張速度３００mm/minで
粘着シートを引き剥がし、その時の剥離力を粘着力とし
た。Next, the moisture vapor transmission rate, the total light transmittance and the adhesive force were measured using the adhesive tapes of these Examples and Comparative Examples, and the results are shown in Table 1. For the measurement of moisture permeability, see J
Based on IS Z0208, it was carried out under the conditions of a temperature of 40 ± 0.5 ° C. and a relative humidity of 90 ± 2%. The total light transmittance is J
Based on IS K-7105, a commercially available integrating sphere type light transmittance measuring device (Hazemeter NDH-20D Nippon Denshoku Ky
It was measured using a product manufactured by Ogo. The adhesive strength is 23 ° C,
Under the condition of a humidity of 60%, attach each adhesive sheet to a stainless steel plate (S
A US Pat. No. 304) was pressure-bonded with a 2 kg roller in one reciprocation, and 30 minutes after the pressure-bonding, the pressure-sensitive adhesive sheet was peeled off at 180 ° peel and a pulling speed of 300 mm / min, and the peeling force at that time was taken as the adhesive force.
【００３０】[0030]
【表１】 [Table 1]
【００３１】[0031]
【発明の効果】本発明の透明防湿粘着シートによれば、
透明な熱可塑性樹脂フィルム層の少なくとも片面に防湿
処理層を備えた基材層に粘着剤層が備えられているの
で、被着体に貼付した場合でも粘着テープを通して被着
体表面や被着体内部並び貼付位置を容易に観察すること
ができる。従って、例えば電子部品であるハードディス
ク装置に貼付した場合、筐体に形成された検査用の開口
部を塞いだ状態でも筐体内部の検査及び貼付位置の確認
を行なうことができる。しかも保存中には、筐体内部に
湿気が入り込まず、製品の劣化を防止できる。According to the transparent moisture-proof pressure-sensitive adhesive sheet of the present invention,
Since the adhesive layer is provided on the base material layer having the moisture-proof treatment layer on at least one surface of the transparent thermoplastic resin film layer, the surface of the adherend or the adherend is adhered through the adhesive tape even when it is attached to the adherend. It is possible to easily observe the internal alignment position. Therefore, for example, when it is attached to a hard disk device which is an electronic component, the inside of the housing can be inspected and the attachment position can be confirmed even when the inspection opening formed in the housing is closed. Moreover, during storage, moisture does not enter the inside of the housing, which prevents deterioration of the product.
【００３２】このとき、粘着剤層は樹脂フィルム層に備
えるのがよく、この場合、樹脂フィルム層に直接粘着剤
層を備えることになるので、防湿処理層の種類に関係な
くほとんど同じ製造条件の下で粘着剤層を形成できる。
しかも、実績のある熱可塑性樹脂フィルム層にあった粘
着剤層をそのまま適用できる。このため、製造工程の管
理が簡便になり、至極簡単に防湿性及び透明性に優れた
粘着テープを提供できる。また、防湿処理層に粘着剤層
を備える時のように特別な工程を経る必要がない。At this time, the pressure-sensitive adhesive layer is preferably provided on the resin film layer. In this case, since the resin film layer is directly provided with the pressure-sensitive adhesive layer, almost the same manufacturing conditions are used regardless of the type of the moisture-proof treatment layer. An adhesive layer can be formed below.
Moreover, the pressure-sensitive adhesive layer suitable for the proven thermoplastic resin film layer can be applied as it is. Therefore, the management of the manufacturing process is simplified, and a pressure-sensitive adhesive tape having excellent moisture resistance and transparency can be provided very simply. Moreover, it is not necessary to perform a special process as in the case where the moisture-proof treatment layer is provided with the pressure-sensitive adhesive layer.
【００３３】また、両面テープにする場合には、前記防
湿処理層にさらに別な熱可塑性樹脂フィルム層を備える
のがよい。この結果、上記したように防湿処理層の種類
に関係なくほとんど同じ製造条件の下で粘着剤層を形成
できる。In the case of a double-sided tape, it is preferable that the moisture-proof treatment layer further comprises another thermoplastic resin film layer. As a result, as described above, the pressure-sensitive adhesive layer can be formed under almost the same manufacturing conditions regardless of the type of the moisture-proof treatment layer.
【００３４】このように本発明は、防湿性及び透明性に
優れた防湿粘着テープを簡便に提供でき、例えばハード
ディスク装置のように光源を用いた異物検査器による製
品検査を必要とし、特に検査用の開口部が形成され、か
つ密封性を必要とする電子部品用途において大きく貢献
できる。As described above, the present invention can easily provide a moisture-proof pressure-sensitive adhesive tape having excellent moisture-proof property and transparency, and requires a product inspection by a foreign substance inspecting device using a light source such as a hard disk device, especially for inspection. It is possible to make a large contribution to the use of electronic parts in which the opening is formed and sealing is required.
【図１】本発明の一実施形態に係る防湿透明粘着テープ
の構造図である。FIG. 1 is a structural diagram of a moisture-proof transparent adhesive tape according to an embodiment of the present invention.
【図２】本発明の別な実施形態に係る防湿透明粘着テー
プの構造図である。FIG. 2 is a structural diagram of a moisture-proof transparent pressure-sensitive adhesive tape according to another embodiment of the present invention.
１０ 基材層 １１ 熱可塑性樹脂フィルム層 １２ 防湿処理層 ２０ 粘着剤層 10 Base material layer 11 Thermoplastic resin film layer 12 Moisture-proof treatment layer 20 Adhesive layer
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F100 AA20 AK01E AK25 AK42 AR00B AR00C AR00D BA03 BA04 BA05 BA10B BA10C BA10E EH46 GB15 JB16A JB16E JD04 JD04B JL11C JL11D JN01 JN01A YY00 4J004 AA10 AA14 AA15 AB01 CA04 CA06 CA07 CC03 EA05 FA01 FA05 FA08 4J040 DF001 ED001 EF001 JA09 JB09 MA10 NA06 NA21 PA23 ─────────────────────────────────────────────────── ─── Continued front page F term (reference) 4F100 AA20 AK01E AK25 AK42 AR00B AR00C AR00D BA03 BA04 BA05 BA10B BA10C BA10E EH46 GB15 JB16A JB16E JD04 JD04B JL11C JL11D JN01 JN01A YY00 4J004 AA10 AA14 AA15 AB01 CA04 CA06 CA07 CC03 EA05 FA01 FA05 FA08 4J040 DF001 ED001 EF001 JA09 JB09 MA10 NA06 NA21 PA23
Claims (6)
とも片面に防湿処理層を備えた基材層に、粘着剤層が備
えられたことを特徴とする防湿透明粘着テープ。1. A moisture-proof transparent pressure-sensitive adhesive tape comprising a transparent thermoplastic resin film layer and a substrate layer having a moisture-proof treatment layer on at least one surface thereof, and a pressure-sensitive adhesive layer.
ム層に備えられたことを特徴とする請求項１に記載の防
湿透明粘着テープ。2. The moisture-proof transparent pressure-sensitive adhesive tape according to claim 1, wherein the pressure-sensitive adhesive layer is provided on the thermoplastic resin film layer.
な熱可塑性樹脂フィルム層を備え、当該熱可塑性樹脂フ
ィルム層にも粘着剤層が備えられたことを特徴とする請
求項２に記載の防湿透明粘着テープ。3. The base material layer further comprises another thermoplastic resin film layer on the moisture-proof treatment layer, and the thermoplastic resin film layer also comprises an adhesive layer. The moisture-proof transparent adhesive tape described.
とを特徴とする請求項１、２又は３のいずれかに記載の
防湿透明粘着テープ。4. The moisture-proof transparent pressure-sensitive adhesive tape according to claim 1, which has a total light transmittance of 70.0% or more.
ことを特徴とする請求項１乃至４のいずれかに記載の防
湿透明粘着テープ。5. The moisture-proof transparent pressure-sensitive adhesive tape according to claim 1, which has a moisture permeability of 1.0 g / m 2 · 24 hr or less.
ける前記開口部に貼着されることを特徴とする請求項１
乃至５のいずれかに記載の防湿透明粘着テープ。6. The electronic component having an opening formed in a casing, the electronic component being attached to the opening.
6. The moisture-proof transparent pressure-sensitive adhesive tape according to any one of 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002038064A JP2003238911A (en) | 2002-02-15 | 2002-02-15 | Moisture-proof transparent adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002038064A JP2003238911A (en) | 2002-02-15 | 2002-02-15 | Moisture-proof transparent adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003238911A true JP2003238911A (en) | 2003-08-27 |
Family
ID=27779472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002038064A Pending JP2003238911A (en) | 2002-02-15 | 2002-02-15 | Moisture-proof transparent adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003238911A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009018518A1 (en) | 2009-04-24 | 2010-10-28 | Tesa Se | Transparent barrier laminates |
| JP2011249608A (en) * | 2010-05-27 | 2011-12-08 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer surface protection |
| WO2012063343A1 (en) * | 2010-11-11 | 2012-05-18 | 古河電気工業株式会社 | Adhesive film and tape for semiconductor wafer processing |
| JPWO2013018602A1 (en) * | 2011-08-03 | 2015-03-05 | リンテック株式会社 | Gas barrier pressure-sensitive adhesive sheet, method for producing the same, electronic member, and optical member |
| WO2018181192A1 (en) * | 2017-03-30 | 2018-10-04 | リンテック株式会社 | Adhesive composition, sealing sheet and sealed body |
| JP2021101249A (en) * | 2015-09-16 | 2021-07-08 | 日東電工株式会社 | Polarizing film with adhesive layer, optical member, and image display device |
-
2002
- 2002-02-15 JP JP2002038064A patent/JP2003238911A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009018518A1 (en) | 2009-04-24 | 2010-10-28 | Tesa Se | Transparent barrier laminates |
| WO2010121905A1 (en) | 2009-04-24 | 2010-10-28 | Tesa Se | Transparent barrier laminates |
| JP2011249608A (en) * | 2010-05-27 | 2011-12-08 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer surface protection |
| KR101602025B1 (en) * | 2010-11-11 | 2016-03-17 | 후루카와 덴키 고교 가부시키가이샤 | Adhesive film and tape for semiconductor wafer processing |
| CN103189459A (en) * | 2010-11-11 | 2013-07-03 | 古河电气工业株式会社 | Adhesive film and tape for semiconductor wafer processing |
| WO2012063343A1 (en) * | 2010-11-11 | 2012-05-18 | 古河電気工業株式会社 | Adhesive film and tape for semiconductor wafer processing |
| JPWO2013018602A1 (en) * | 2011-08-03 | 2015-03-05 | リンテック株式会社 | Gas barrier pressure-sensitive adhesive sheet, method for producing the same, electronic member, and optical member |
| US9580625B2 (en) | 2011-08-03 | 2017-02-28 | Lintec Corporation | Gas barrier adhesive sheet, method for producing same, electronic member, and optical member |
| JP2018053250A (en) * | 2011-08-03 | 2018-04-05 | リンテック株式会社 | Gas barrier pressure-sensitive adhesive sheet, method for producing the same, electronic member, and optical member |
| JP2019089344A (en) * | 2011-08-03 | 2019-06-13 | リンテック株式会社 | Gas barrier pressure-sensitive adhesive sheet, production method of the same, electronic member and optical member |
| JP2021101249A (en) * | 2015-09-16 | 2021-07-08 | 日東電工株式会社 | Polarizing film with adhesive layer, optical member, and image display device |
| JP7372275B2 (en) | 2015-09-16 | 2023-10-31 | 日東電工株式会社 | Polarizing film with adhesive layer, optical member, and image display device |
| WO2018181192A1 (en) * | 2017-03-30 | 2018-10-04 | リンテック株式会社 | Adhesive composition, sealing sheet and sealed body |
| JPWO2018181192A1 (en) * | 2017-03-30 | 2020-02-06 | リンテック株式会社 | Pressure-sensitive adhesive composition, sealing sheet, and sealing body |
| JP7100622B2 (en) | 2017-03-30 | 2022-07-13 | リンテック株式会社 | Adhesive composition, encapsulation sheet, and encapsulant |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101622680B (en) | Transparent conductive film with adhesive layer, and its forming method | |
| CA2128347C (en) | Biodegradable adhesive tape and biodegradable adhesive label | |
| US8017207B2 (en) | Degradable paper with long-shelf-life adhesive backing | |
| JP5695644B2 (en) | Cover tape | |
| JP2010174239A (en) | Masking film with improved wettability | |
| WO2014208745A1 (en) | Light-transmitting laminate | |
| JPH0622962B2 (en) | Laminated film | |
| JP2001209039A (en) | Surface protective film for liquid crystal display device, liquid crystal display device protected by the surface protective film, and method for protecting surface of liquid crystal display device using the surface protective film | |
| WO2003052469A1 (en) | Preventive film for polarizer and polarizing plate using the same | |
| WO2002002312A1 (en) | Easily releasable laminate film | |
| JP2003238911A (en) | Moisture-proof transparent adhesive tape | |
| JP2016199619A (en) | Double-sided tape | |
| JPH04124601A (en) | Polarizing plate | |
| TWI276848B (en) | Protection film for polarized film and releasing protection film and the polarization plate made by using said film | |
| CN1359791A (en) | Strippable film | |
| JP3255037B2 (en) | Coating film | |
| JP2005326661A (en) | Protective sheet of liquid crystal display | |
| JPH09156024A (en) | Coating film | |
| CN111944445B (en) | A kind of high temperature resistant and low precipitation protective film and preparation method thereof | |
| JP2006133126A (en) | Radiation image conversion panel | |
| JP2004137436A (en) | Double-sided adhesive tape | |
| JP4028353B2 (en) | Method for forming laminate with gas barrier film | |
| WO2003022572A1 (en) | Releasing sheet and pressure-sensitive adhesive article | |
| JP5478600B2 (en) | Method for forming functional film and method for forming gas barrier film | |
| JPH10170707A (en) | Reflection sheet for polarizing plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041108 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071030 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071106 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071227 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080129 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080321 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080415 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080609 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20080627 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20080725 |