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JP2003281985A5 - - Google Patents

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Publication number
JP2003281985A5
JP2003281985A5 JP2002082687A JP2002082687A JP2003281985A5 JP 2003281985 A5 JP2003281985 A5 JP 2003281985A5 JP 2002082687 A JP2002082687 A JP 2002082687A JP 2002082687 A JP2002082687 A JP 2002082687A JP 2003281985 A5 JP2003281985 A5 JP 2003281985A5
Authority
JP
Japan
Prior art keywords
container body
lead member
hollow package
circuit element
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002082687A
Other languages
Japanese (ja)
Other versions
JP2003281985A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2002082687A priority Critical patent/JP2003281985A/en
Priority claimed from JP2002082687A external-priority patent/JP2003281985A/en
Publication of JP2003281985A publication Critical patent/JP2003281985A/en
Publication of JP2003281985A5 publication Critical patent/JP2003281985A5/ja
Withdrawn legal-status Critical Current

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Claims (4)

絶縁容器本体に一対の金属導体リード部材を貫通配置し、この容器本体内部に位置する前記リード部材の先端部に回路素子を設け、前記容器本体の開口をキャップ材で密閉封止した中空パッケージにおいて、前記リード部材が貫通する前記容器本体との接合界面に生じる微細な空隙に、含浸剤を充填して硬化させた樹脂シールを形成したことを特徴とする中空パッケージ。In a hollow package in which a pair of metal conductor lead members are disposed through an insulating container body, a circuit element is provided at the tip of the lead member located inside the container body, and the opening of the container body is hermetically sealed with a cap material A hollow package characterized in that a resin seal is formed by filling and curing an impregnating agent in a fine gap generated at a bonding interface with the container body through which the lead member passes. 前記容器本体は前記リード部材を所定位置に配置した金型に樹脂材を射出するインサート成形により一体成形品であることを特徴とする請求項１に記載の中空パッケージ。2. The hollow package according to claim 1, wherein the container body is an integrally molded product by insert molding in which a resin material is injected into a mold having the lead member disposed at a predetermined position. 前記回路素子が低融点可溶合金または水晶振動子であることを特徴とする請求項１または２に記載の中空パッケージ。The hollow package according to claim 1, wherein the circuit element is a low melting point soluble alloy or a crystal resonator. 金属導体のリード部材を所定位置に配置した成形金型に溶融した絶縁物質を射出するインサート成形により絶縁容器本体を一体成形して容器本体にリード部材を貫通状態で配置する工程、前記容器本体と前記リード部材の貫通する接合界面に生じる微細な空隙に含浸剤を注入して樹脂シールを形成する工程、前記容器本体の内部に延びた前記リード部材の先端部分に回路素子を接合する工程、および前記容器本体の開口にキャップ材を配置して密閉封止する工程を含む中空パッケージの製造方法。A step of integrally forming an insulating container body by insert molding that injects a molten insulating material into a molding die in which a lead member of a metal conductor is disposed at a predetermined position, and arranging the lead member in a penetrating state in the container body; A step of injecting an impregnating agent into a fine gap generated at a bonding interface penetrating the lead member to form a resin seal, a step of bonding a circuit element to a leading end portion of the lead member extending inside the container body, and A method for manufacturing a hollow package, comprising a step of disposing a cap material in an opening of the container body and hermetically sealing it.
JP2002082687A 2002-03-25 2002-03-25 Hollow package and manufacturing method therefor Withdrawn JP2003281985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002082687A JP2003281985A (en) 2002-03-25 2002-03-25 Hollow package and manufacturing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002082687A JP2003281985A (en) 2002-03-25 2002-03-25 Hollow package and manufacturing method therefor

Publications (2)

Publication Number Publication Date
JP2003281985A JP2003281985A (en) 2003-10-03
JP2003281985A5 true JP2003281985A5 (en) 2005-08-25

Family

ID=29230782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002082687A Withdrawn JP2003281985A (en) 2002-03-25 2002-03-25 Hollow package and manufacturing method therefor

Country Status (1)

Country Link
JP (1) JP2003281985A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5225953B2 (en) * 2009-08-27 2013-07-03 日東電工株式会社 Electronic device and membrane filtration apparatus provided with the same
DE202015101840U1 (en) * 2015-04-15 2015-04-30 Inter Control Hermann Köhler Elektrik GmbH & Co. KG Fuse component
WO2017130306A1 (en) * 2016-01-27 2017-08-03 エス・オー・シー株式会社 Chip fuse and chip fuse production method

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