JP2003276034A - Manufacturing method of resin plate - Google Patents
Manufacturing method of resin plateInfo
- Publication number
- JP2003276034A JP2003276034A JP2002079330A JP2002079330A JP2003276034A JP 2003276034 A JP2003276034 A JP 2003276034A JP 2002079330 A JP2002079330 A JP 2002079330A JP 2002079330 A JP2002079330 A JP 2002079330A JP 2003276034 A JP2003276034 A JP 2003276034A
- Authority
- JP
- Japan
- Prior art keywords
- plates
- mold
- plate
- resin plate
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000011347 resin Substances 0.000 title abstract description 24
- 229920005989 resin Polymers 0.000 title abstract description 24
- 239000002994 raw material Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 abstract description 8
- 230000000379 polymerizing effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 3
- 238000010030 laminating Methods 0.000 abstract 2
- 238000005259 measurement Methods 0.000 description 12
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000005341 toughened glass Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 2,3-dimethylbutane Chemical group CC(C)C(C)C ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- RTANHMOFHGSZQO-UHFFFAOYSA-N 4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)C#N RTANHMOFHGSZQO-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007869 azo polymerization initiator Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- WVIIMZNLDWSIRH-UHFFFAOYSA-N cyclohexylcyclohexane Chemical compound C1CCCCC1C1CCCCC1 WVIIMZNLDWSIRH-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- -1 ethyl methacrylate Chemical compound 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
(57)【要約】
【課題】 ガスケットを介して2枚の板を積層して鋳型
を形成し、その鋳型内で重合性原料を重合硬化させて樹
脂板を製造する際に、均一な厚みの樹脂板を製造する方
法を提供する。
【解決手段】 同じ大きさである3枚以上の鋳型形成用
の板から、板を積層したときの板と板との隙間の最大値
が1.0mm以下である2枚の板を選択して、ガスケッ
トを介してそれらの板を積層して鋳型を形成し、その鋳
型に重合性原料を注入して、その重合性原料を重合硬化
させる樹脂板の製造方法。
(57) [Problem] To form a mold by laminating two plates via a gasket, and polymerize and cure the polymerizable material in the mold to produce a resin plate. Provided is a method for manufacturing a resin plate. SOLUTION: From three or more mold forming plates having the same size, two plates having a maximum value of a gap between the plates when the plates are laminated of 1.0 mm or less are selected. A method of manufacturing a resin plate by laminating the plates via a gasket to form a mold, injecting a polymerizable material into the mold, and polymerizing and curing the polymerizable material.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、樹脂板の製造方法
に関する。TECHNICAL FIELD The present invention relates to a method for manufacturing a resin plate.
【0002】[0002]
【従来の技術】アクリル樹脂板等の樹脂板を製造する方
法として、ガスケットを介して2枚の板を積層して鋳型
を形成し、その鋳型に重合性原料を注入して、その鋳型
を温水等に浸漬することによって重合性原料を重合硬化
させて樹脂板を製造する方法が広く用いられている。2. Description of the Related Art As a method for producing a resin plate such as an acrylic resin plate, two plates are laminated via a gasket to form a mold, a polymerizable raw material is injected into the mold, and the mold is heated with hot water. A method of producing a resin plate by polymerizing and curing a polymerizable raw material by immersing the resin plate in a sheet or the like is widely used.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、その製
造方法においては、鋳型を形成する板に、それぞれ微小
なうねりがあり、鋳型を形成する2枚の板のうねりの差
によって、得られた樹脂板の厚みが不均一となることが
あった。However, in the manufacturing method thereof, the plates forming the mold each have minute undulations, and the resin plate obtained by the difference in the undulations of the two plates forming the mold is obtained. Sometimes had a non-uniform thickness.
【0004】本発明の目的は、鋳型を形成する2枚の板
を特定の条件で選択することによって、均一な厚みの樹
脂板を製造する方法を提供することにある。An object of the present invention is to provide a method for producing a resin plate having a uniform thickness by selecting two plates forming a mold under specific conditions.
【0005】[0005]
【課題を解決するための手段】本発明の要旨は、同じ大
きさである3枚以上の鋳型形成用の板から、板を積層し
たときの板と板との隙間の最大値が1.0mm以下であ
る2枚の板を選択して、ガスケットを介してそれらの板
を積層して鋳型を形成し、その鋳型に重合性原料を注入
して、その重合性原料を重合硬化させる樹脂板の製造方
法にある。Means for Solving the Problems The gist of the present invention is that the maximum value of the gap between the plates is 1.0 mm when the plates are laminated from three or more mold forming plates of the same size. The following two plates are selected, the plates are laminated through a gasket to form a mold, and a polymerizable raw material is injected into the mold to polymerize and cure the polymerizable raw material. There is a manufacturing method.
【0006】鋳型形成用の板はガラス板であることが好
ましい。The plate for forming the mold is preferably a glass plate.
【0007】[0007]
【発明の実施の形態】本発明の製法で用いる鋳型は、同
じ大きさである3枚以上の鋳型形成用の板から、板を積
層したときの板と板との隙間の最大値が1.0mm以下
である2枚の板を選択して、ガスケットを介してそれら
の板を積層して形成する。BEST MODE FOR CARRYING OUT THE INVENTION The mold used in the manufacturing method of the present invention has three or more mold-forming plates of the same size, and the maximum value of the gap between the plates when the plates are laminated is 1. Two plates having a size of 0 mm or less are selected, and the plates are laminated with a gasket interposed therebetween.
【0008】隙間の最大値が1.0mmよりも大きい
と、得られる樹脂板の厚みが不均一となる。If the maximum value of the gap is larger than 1.0 mm, the thickness of the resin plate obtained will be uneven.
【0009】隙間の最大値は0.8mm以下であること
が好ましく、0.7mmであることがさらに好ましい。
隙間がないことが最も好ましい。The maximum value of the gap is preferably 0.8 mm or less, more preferably 0.7 mm.
Most preferably, there are no gaps.
【0010】隙間の測定方法としては、例えば、以下の
方法が挙げられる。Examples of the method of measuring the gap include the following methods.
【0011】2本のレール上を走行できる走行台に、2
00mm間隔で、測定精度0.01mmのダイヤルゲー
ジを取り付ける。走行台の下に、鋳型形成用の1枚の板
を置いて、その板と走行台との距離を各々のダイヤルゲ
ージで測定する。測定後、2本のレールに沿って、走行
台を200mm移動させてから、再び、その板と走行台
との距離を各々のダイヤルゲージで測定する。これを繰
り返すことによって、1枚の板における各測定場所のう
ねりを測定する。A pedestal that can run on two rails
A dial gauge with a measurement accuracy of 0.01 mm is attached at intervals of 00 mm. One plate for forming a mold is placed under the traveling table, and the distance between the plate and the traveling table is measured with each dial gauge. After the measurement, the traveling base is moved by 200 mm along the two rails, and then the distance between the plate and the traveling base is measured again with each dial gauge. By repeating this, the waviness of each measurement place on one plate is measured.
【0012】同様にして、他の鋳型形成用の板について
もそのうねりを測定する。それらの測定結果から、一方
の板をひっくり返して、他の板と積層した際の各測定場
所における隙間を計算によって求めることができる。2
00mm間隔よりも、さらに細かく測定場所を増やすこ
とができるし、測定場所を少なくすることもできる。In the same manner, the waviness of other mold forming plates is measured. From those measurement results, it is possible to turn over one plate and calculate the gap at each measurement location when laminated with another plate. Two
It is possible to further increase the number of measurement locations and to reduce the number of measurement locations than the interval of 00 mm.
【0013】この隙間の最大値が1.0mm以下となる
2枚の板を選択して、ガスケットを介して鋳型を形成す
る。Two plates having a maximum gap value of 1.0 mm or less are selected and a mold is formed through a gasket.
【0014】同じ大きさの鋳型形成用の板の枚数は、3
枚以上であることが好ましく、5枚以上であることがよ
り好ましい。板の厚みは異なっていてもよい。The number of mold forming plates of the same size is 3
The number of sheets is preferably at least 5 and more preferably 5 or more. The plates may have different thicknesses.
【0015】板としては、ガラス板、強化ガラス板、表
面を研磨したステンレス板等が挙げられる。ガラス板は
衝撃により割れやすく、また、ステンレス板は重く取り
扱いが困難なため、強化ガラス板が好ましい。Examples of the plate include a glass plate, a tempered glass plate, and a stainless plate whose surface is polished. A tempered glass plate is preferred because the glass plate is easily broken by impact and the stainless plate is heavy and difficult to handle.
【0016】ガスケットとしては、塩化ビニル樹脂製の
ガスケットが挙げられる。As the gasket, a vinyl chloride resin gasket may be used.
【0017】ガスケットの形状としては、断面が中空円
形状、角状、丸状、台形状等の形状が挙げられる。その
太さ及び長さは特に限定されるものではなく、製造され
る樹脂板の厚み及び面積に応じて適宜変更することがで
きる。Examples of the shape of the gasket include a hollow circular shape, a square shape, a round shape, a trapezoidal shape, and the like. The thickness and length are not particularly limited, and can be appropriately changed depending on the thickness and area of the resin plate to be manufactured.
【0018】鋳型に注入される重合性原料は、メタクリ
ル酸メチル(以下、適宜「MMA」という)を70質量
%以上含有するものが好ましい。その他の重合性原料と
してはアクリル酸メチル、アクリル酸エチル等のアクリ
ル酸エステルや、メタクリル酸エチル等のMMA以外の
メタクリル酸エステルや、メタクリル酸等が挙げられ
る。重合性原料はMMA等の重合体とMMA等とからな
るシラップ状の重合性原料であってもよい。The polymerizable raw material to be injected into the mold preferably contains methyl methacrylate (hereinafter appropriately referred to as "MMA") in an amount of 70% by mass or more. Other polymerizable raw materials include acrylic acid esters such as methyl acrylate and ethyl acrylate, methacrylic acid esters other than MMA such as ethyl methacrylate, and methacrylic acid. The polymerizable raw material may be a syrup-shaped polymerizable raw material composed of a polymer such as MMA and MMA.
【0019】重合性原料を重合させるためには、重合性
原料に2,2’−アゾビスイソブチロニトリル、2,
2’−(2,4−ジメチルバレロニトリル)、2,2’
−アゾビス(4−メトキシ2,4−ジメチルバレロニト
リル)、1,1’−アゾビス(シクロヘキサン−1−カ
ルボニトリル)等のアゾ系重合開始剤や、ラウロイルパ
ーオキサイド、メチルエチルケトンパーオキサイド、ジ
イソプロピルパーオキシジカーボネート、ジシクロヘキ
サンパーオキシジカーボネート等の過酸化物系重合開始
剤等を含有させることが好ましい。In order to polymerize the polymerizable raw material, the polymerizable raw material is 2,2'-azobisisobutyronitrile,
2 '-(2,4-dimethylvaleronitrile), 2,2'
-Azo polymerization initiators such as azobis (4-methoxy2,4-dimethylvaleronitrile) and 1,1'-azobis (cyclohexane-1-carbonitrile), lauroyl peroxide, methyl ethyl ketone peroxide, diisopropyl peroxydiene It is preferable to add a peroxide type polymerization initiator such as carbonate or dicyclohexane peroxydicarbonate.
【0020】また、本発明の樹脂板の製造方法において
は、必要に応じて重合性原料中に紫外線吸収剤、酸化防
止剤、離型剤等の種々の公知の添加剤を含有させること
ができる。Further, in the method for producing a resin plate of the present invention, various known additives such as an ultraviolet absorber, an antioxidant and a release agent may be contained in the polymerizable raw material, if necessary. .
【0021】重合性原料を重合硬化させるには、熱媒と
して水を用いて20℃〜80℃、好ましくは30℃〜6
5℃の温度範囲で重合硬化させることが好ましい。重合
時間は0.5〜200時間であることが好ましい。To polymerize and cure the polymerizable raw material, water is used as a heat medium at 20 ° C. to 80 ° C., preferably 30 ° C. to 6 ° C.
It is preferable to polymerize and cure in a temperature range of 5 ° C. The polymerization time is preferably 0.5 to 200 hours.
【0022】この重合の後、熱風炉内において100℃
〜140℃、好ましくは120℃〜135℃の温度範囲
で後重合させることが好ましい。後重合時間は1時間以
上であることが好ましい。After this polymerization, 100 ° C. in a hot air oven.
It is preferable to carry out post-polymerization in a temperature range of ˜140 ° C., preferably 120 ° C. to 135 ° C. The post-polymerization time is preferably 1 hour or more.
【0023】重合性原料を重合硬化させた後に、鋳型か
ら板状重合体を剥離させて樹脂板を取り出すことができ
る。After the polymerizable raw material is polymerized and cured, the plate polymer can be peeled from the mold to take out the resin plate.
【0024】樹脂板の厚みは、1〜50mmであること
が好ましい。The resin plate preferably has a thickness of 1 to 50 mm.
【0025】この方法で得られた樹脂板は、板厚が均一
であるため、精密機械の部品や導光板等の用途に適して
いる。これらの用途に供する樹脂板の板厚精度は平均板
厚に対し+10%以内、−10%以内であることが好ま
しく、厚みが均一である方がより好ましい。Since the resin plate obtained by this method has a uniform plate thickness, it is suitable for applications such as parts for precision machines and light guide plates. The plate thickness accuracy of the resin plate used for these purposes is preferably within + 10% and -10% of the average plate thickness, and more preferably uniform.
【0026】[0026]
【実施例】(1)隙間の測定方法
2本のレール上を走行できる走行台に、200mm間隔
で、測定精度0.01mmのダイヤルゲージを取り付け
た。走行台の下に、大きさ1200mm×1200mm
で、厚み10mmの鋳型形成用の強化ガラス板1枚を置
いて、そのガラス板と走行台との距離を各々のダイヤル
ゲージで測定した。測定後、2本のレールに沿って、走
行台を200mm移動させてから、再び、そのガラス板
と走行台との距離を各々のダイヤルゲージで測定した。
これを繰り返すことによって、1枚のガラス板における
各測定場所のうねりを測定した。[Examples] (1) Method for measuring gap A dial gauge having a measurement accuracy of 0.01 mm was attached at intervals of 200 mm to a traveling platform that can travel on two rails. Under the platform, the size is 1200mm x 1200mm
Then, one tempered glass plate for forming a mold having a thickness of 10 mm was placed, and the distance between the glass plate and the traveling table was measured with each dial gauge. After the measurement, the traveling table was moved by 200 mm along the two rails, and then the distance between the glass plate and the traveling table was measured again with each dial gauge.
By repeating this, the waviness of each measurement place on one glass plate was measured.
【0027】同様にして、同一の大きさ、同一の厚みの
他の9枚のガラス板についてもそのうねりを測定した。
それらの測定結果から、一方のガラス板をひっくり返し
て、他のガラス板と積層した際の各測定場所における隙
間を計算によって求めた。Similarly, the waviness of the other nine glass plates having the same size and the same thickness was measured.
From those measurement results, one of the glass plates was turned over, and the gap at each measurement location when laminated with the other glass plate was calculated.
【0028】(2)樹脂板の厚みの測定方法
得られた樹脂板の厚みは、KRAUTKRAMER−B
RANSON社製の超音波厚味計:型式2L204を用
いて、樹脂板の全面について縦、横20cmの間隔で測
定した。このときの最も薄い板厚の値を最小値とし、最
も厚い板厚の値を最大値とした。(2) Method for measuring the thickness of the resin plate The thickness of the resin plate obtained is KRAUTKRAMER-B.
An ultrasonic thickness meter manufactured by RANSON: Model 2L204 was used to measure the entire surface of the resin plate at intervals of 20 cm in length and width. The value of the thinnest plate thickness at this time was made into the minimum value, and the value of the thickest plate thickness was made into the maximum value.
【0029】[実施例1]隙間の最大値が0.9mmで
あった2枚の強化ガラス板を選択して、その断面が外径
10mm、内径5mmの中空円形状のガスケットを介し
て積層することによって鋳型を形成した。[Example 1] Two tempered glass plates having a maximum gap of 0.9 mm were selected and laminated through a hollow circular gasket having a cross section of 10 mm outer diameter and 5 mm inner diameter. To form a mold.
【0030】次いで、メタクリル酸メチル100質量部
に対し、重合開始剤として2,2’−アゾビスイソブチ
ロニトリル0.1質量部、離型剤としてエアロゾールO
T(アメリカンシアナミド社製)0.02質量部を添加
し、均一に攪拌し重合性原料とした。Then, with respect to 100 parts by mass of methyl methacrylate, 0.1 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator and aerosol O as a releasing agent.
0.02 parts by mass of T (manufactured by American Cyanamide Co.) was added and uniformly stirred to obtain a polymerizable raw material.
【0031】鋳型の中に、重合性原料を6300g注入
した。重合初期に40℃の水浴槽において、30時間重
合し、その後130℃の空気浴槽において3時間重合
し、鋳型から板状重合体を剥離させて、板厚約4mmの
アクリル樹脂板を得た。得られた樹脂板の厚みは最大
4.15mm、最小3.86mmであった。6300 g of the polymerizable raw material was injected into the mold. Polymerization was carried out for 30 hours in a water bath of 40 ° C. at the initial stage of polymerization, and then for 3 hours in an air bath of 130 ° C., and the plate polymer was peeled from the mold to obtain an acrylic resin plate having a plate thickness of about 4 mm. The thickness of the obtained resin plate was 4.15 mm at the maximum and 3.86 mm at the minimum.
【0032】[比較例1]板と板との隙間が2.0mm
であった2枚の強化ガラスを選択したこと以外は、実施
例1と同様にして鋳型を形成し、板厚約4mmのアクリ
ル樹脂板を得た。得られた樹脂板の厚みは最大4.62
mm、最小3.51mmであった。[Comparative Example 1] The gap between the plates is 2.0 mm.
A mold was formed in the same manner as in Example 1 except that the two tempered glass sheets were selected to obtain an acrylic resin plate having a plate thickness of about 4 mm. The thickness of the obtained resin plate is 4.62 at maximum.
mm and a minimum of 3.51 mm.
【0033】[0033]
【発明の効果】本発明の製法によって、均一な厚みの樹
脂板を製造することができる。According to the manufacturing method of the present invention, a resin plate having a uniform thickness can be manufactured.
【図1】本発明において用いる隙間の測定装置の一例を
示す正面図と上面図である。FIG. 1 is a front view and a top view showing an example of a gap measuring device used in the present invention.
1 ダイヤルゲージ 2 走行台 3 滑車 4 レール 5 板支持用バー 6 鋳型形成用の板 1 dial gauge 2 platform 3 pulleys 4 rails 5 Plate support bar 6 Mold forming plate
Claims (2)
の板から、板を積層したときの板と板との隙間の最大値
が1.0mm以下である2枚の板を選択して、ガスケッ
トを介してそれらの板を積層して鋳型を形成し、その鋳
型に重合性原料を注入して、その重合性原料を重合硬化
させる樹脂板の製造方法。1. From two or more mold forming plates of the same size, two plates having a maximum gap between the plates of 1.0 mm or less when the plates are stacked are selected. Then, these plates are laminated through a gasket to form a mold, a polymerizable raw material is injected into the mold, and the polymerizable raw material is polymerized and cured.
1に記載の製造方法。2. The manufacturing method according to claim 1, wherein the template forming plate is a glass plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002079330A JP2003276034A (en) | 2002-03-20 | 2002-03-20 | Manufacturing method of resin plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002079330A JP2003276034A (en) | 2002-03-20 | 2002-03-20 | Manufacturing method of resin plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003276034A true JP2003276034A (en) | 2003-09-30 |
Family
ID=29206264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002079330A Pending JP2003276034A (en) | 2002-03-20 | 2002-03-20 | Manufacturing method of resin plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003276034A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9981410B2 (en) | 2012-05-02 | 2018-05-29 | Metamaterial Technologies Usa, Inc. | Method of fabricating cylindrical polymer mask |
-
2002
- 2002-03-20 JP JP2002079330A patent/JP2003276034A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9981410B2 (en) | 2012-05-02 | 2018-05-29 | Metamaterial Technologies Usa, Inc. | Method of fabricating cylindrical polymer mask |
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