JP2003258174A - Ebullient cooler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ebullient cooler capable of providing an appropriate refrigerant liquid face with a small quantity of refrigerant in both working attitudes of side heat and bottom heat. <P>SOLUTION: A refrigerant container 2 being fixed with a heat generating body, and a header tank communicating with the refrigerant container 2 through a tube 3 are arranged such that the inner volume below the center of the ebullient region becomes smaller than the inner volume above the center of the ebullient region. A liquid face 62b covering the majority of the ebullient region can thereby be formed with a small quantity of refrigerant at the time of side heat. A sufficient heat dissipation area for condensing the refrigerant can be ensured at the time of bottom heat. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boiling cooling device for cooling a heating element by transferring latent heat due to boiling and condensation of a refrigerant.

[0002]

2. Description of the Related Art Conventionally, a heating element such as a heat-generating electronic component is attached to the bottom surface, and the refrigerant stored therein receives heat from the heating element and is boiled to vaporize, and the latent heat of the refrigerant vapor is released from the heat radiating portion. There is a boiling cooling device that cools the heating element. And, as such a boiling cooling device, for example,
Japanese Patent Application No. 2001-32744 filed by the present applicant
There is a boiling cooling device described in No. 4 and the like.

In this boiling cooling apparatus, a refrigerant container that contacts the bottom surface of a heating element such as a heat-generating electronic component to receive heat, and a plurality of refrigerant containers that are in communication with the inside of the refrigerant container and are installed upright on the upper surface of the refrigerant container. A tube and a header tank that connects the plurality of tubes to each other are provided. An example of the structure of such a boiling cooling device is shown in FIG. 10 as a sectional view.

A boiling cooling device 101 shown in FIG. 10 is provided between a refrigerant container 102, a header tank 104, a tube 103 provided so as to connect the insides of the refrigerant container 102 and the header tank 104, and between the tubes 103. And the radiation fins 105. In FIG. 10, the radiation fins 105 are shown only at one location between the tubes 103, and the radiation fins between the other tubes 103 are omitted.

As shown in FIG. 10, the refrigerant container 102 is
The outer plate 121 on which the heating element 6 is attached
And an outer plate 125 to which the tube 103 is attached in the insertion hole, and an intermediate plate 123 and an intermediate plate 124 each having an opening penetrating in the plate thickness direction between the outer plate 121 and the outer plate 125. A total of four sheets are stacked one by one.

As shown in FIG. 12A, the intermediate plate 123 is provided with a plurality of slit-shaped openings 123a extending in the left-right direction in the drawing. Further, as shown in FIG. 12B, the intermediate plate 124 is provided with a plurality of slit-shaped openings 124a extending in the vertical direction in the drawing.

And, these intermediate plates 123, 1
When stacking 24 between the outer plates 121 and 125, the slit-shaped opening 123a and the opening 124 are formed.
It is arranged so that it is orthogonal to a. In addition, the same intermediate plates 123 and the intermediate plates 124 are
The openings are overlapped so that the openings are aligned in the same direction. As a result, the opening 123a and the opening 124a are all in communication with each other, and a space for storing the refrigerant is formed in the refrigerant container 102.

Here, the portion where the mounting range of the heating element is projected inside the refrigerant container 102 in the direction perpendicular to the mounting surface is the boiling region, and the refrigerant evaporates and vaporizes by receiving the heat of the heating element in this boiling region. . In the intermediate plate, the boiling region is the range indicated by reference numeral 161 surrounded by the alternate long and short dash line shown in FIGS. 12 (a) and 12 (b). Also, the header tank 104
Is the outer plates 121, 12 as shown in FIG.
5, intermediate plates 123 and 124 are laminated in the reverse order of the refrigerant container 102.

Each plate 121, 123, 124, 12
As shown in FIG. 10, the evaporative cooling device 101 including the refrigerant container 102 and the header tank 104 configured by stacking 5 is arranged so that the refrigerant container 102 is on the lower side, and on the outer bottom surface of the refrigerant container 102. When cooling the attached heating element 6 (when using so-called bottom heat)
The refrigerant stored in the refrigerant container 102 (the liquid surface is shown by reference numeral 162a) receives the heat of the heating element 6 and the refrigerant container 2
It boils in the boiling region inside.

The boiling and gasifying refrigerant mainly passes through the tube 103 above the boiling region, and passes through the header tank 10
4 and returns to the outer peripheral portion in the refrigerant container 102 mainly through the tube 103 above the outside of the boiling region. At this time, in the tube 103, the refrigerant releases latent heat to the outside and condenses into a liquid refrigerant.

[0011]

However, in the above-mentioned boiling cooling apparatus, the refrigerant container 102 is arranged so as to be on the side as shown in FIG.
When cooling the heating element 6 attached to the outer side surface of the refrigerant (when used in so-called side heat), the liquid level of the refrigerant is at the position indicated by reference numeral 162b in FIG. 11, and most of the boiling region is the liquid level 162b. Exposed above. When the boiling region is exposed, the heat of the heating element 6 cannot be sufficiently supplied to the refrigerant, and the boiling vaporization of the refrigerant cannot be performed well. As a result, there is a problem that the boiling cooling device cannot exhibit good cooling performance.

On the other hand, the boiling cooling device 101 is shown in FIG.
In the side heat posture as shown in FIG. 1, if the inside of the boiling region is filled with the refrigerant up to a position where most of the boiling region is not exposed, the boiling cooling device 101, when in the bottom heat posture shown in FIG. The liquid surface 162a is located at the upper part in the tube 103. In such a case, the heat dissipation area of the gasified refrigerant is reduced, and the refrigerant is not condensed well. As a result, there is a problem that the boiling cooling device cannot exhibit good cooling performance.

The present invention has been made in view of the above points, and is attached to the outer bottom surface even when it is used in a side heat posture for cooling a heating element attached to the outer side surface. An object of the present invention is to provide a boiling cooling device capable of obtaining an appropriate refrigerant liquid level even when used in a bottom heat posture for cooling a heating element.

[0014]

In order to achieve the above-mentioned object, in the invention described in claim 1, the heating element (6) is attached to one surface, and the refrigerant stored in the inside is transferred from the heating element (6). In a boiling cooling device that receives heat to evaporate to a boil and releases the latent heat of the refrigerant vapor from the heat radiating portion (3, 5) to cool the heating element (6), the refrigerant is provided inside the inside by the heating element (6). When a boiling region (61) for evaporating and evaporating is formed and the mounting surface of the heating element (6) is arranged laterally, the internal volume below the center of the boiling region (61) It is characterized in that it has a structure smaller than the internal volume above the center of the region (61).

According to this, when the mounting surface is arranged on the lateral side, even if the refrigerant is charged to a level (appropriate level) at which most of the boiling region is not exposed above the liquid surface, When the mounting surface is arranged on the lower side, it is possible to prevent the liquid level of the refrigerant from being too high and reducing the heat radiation area.

According to the second aspect of the invention, the heating element (6) is mounted on one surface, and the refrigerant container (2) for storing the refrigerant that boils when receiving the heat of the heating element (6) is provided inside the heating element (6). A heat dissipating portion having a plurality of tubes (3) which are in communication with the inside of the refrigerant container (2) and are installed substantially upright on a surface of the refrigerant container (2) facing the mounting surface of the heating element (6) ( 3,
5) and a header tank (4) that connects the plurality of tubes (3) to each other, and the refrigerant stored in the refrigerant container (2) receives heat from the heating element (6) and is vaporized to boil. A boiling cooling device (1) that cools a heating element (6) by releasing latent heat of refrigerant vapor from a heat radiating portion (3, 5), wherein the heating element (6) is inside a refrigerant container (2). Forms a boiling region (61) where the refrigerant evaporates and vaporizes, and the heating element (6)
When the mounting surface of the refrigerant container is arranged on the side, the boiling region (6) out of the internal volume of the refrigerant container (2), the tube (3) and the header tank (4).
It is characterized in that the internal volume below the center of 1) is smaller than the internal volume above the center of the boiling region (61).

According to this, like the invention according to claim 1, when the mounting surface is arranged so as to be on the side,
Even if most of the boiling region is filled with the refrigerant to a level where it is not exposed above the liquid level (appropriate level), the liquid level of the refrigerant is too high when the mounting surface is arranged at the lower side. It is possible to prevent the heat dissipation area from decreasing.

Further, as in the invention described in claim 3, in the invention described in claim 2, when the heating element (6) is arranged so that the mounting surface is on the side, 2)
Is the case where the mounting surface is arranged laterally by forming the internal volume below the center of the boiling area (61) smaller than the internal volume above the center of the boiling area (61). In the internal volume consisting of the refrigerant container (2), the tube (3) and the header tank (4), the internal volume below the center of the boiling region (61) is
The internal volume above the center of the boiling region (61) may be smaller than the internal volume.

Further, in the invention described in claim 4, the refrigerant container (2) includes a plurality of plate members (21, 22, 23,
24, 25) are laminated and formed.

According to this, a plurality of plate members (2
1, 22, 23, 24, 25) are stacked so that the internal volume below the center of the boiling region (61) is smaller than the internal volume above the center of the boiling region (61). ) Can be easily configured.

Further, as in the invention described in claim 5, in the invention described in any one of claims 2 to 4, the heating element (6) is arranged such that the mounting surface is on the side. If the header tank (4) has a boiling area (61)
Since the internal volume below the center of the boiling area (61) is formed smaller than the internal volume above the center of the boiling area (61),
When the mounting surface is arranged on the side, the boiling region (6) out of the internal volume composed of the inside of the refrigerant container (2), the inside of the tube (3) and the inside of the header tank (4).
The internal volume below the center of 1) may be smaller than the internal volume above the center of the boiling region (61).

In the sixth aspect of the invention, the header tank (4) includes a plurality of plate members (21, 42, 2).
3, 24, 25) are stacked and arranged.

According to this, a plurality of plate members (2
1, 42, 23, 24, 25) are stacked so that the internal volume below the center of the boiling area (61) is smaller than the internal volume above the center of the boiling area (61). ) Can be easily configured.

Further, as in the invention described in claim 7, in the invention described in any one of claims 2 to 6, the heating element (6) is arranged so that the mounting surface is on the side. The tubes (3a, 3b), the boiling region (6
The internal volume below the center of 1) is formed smaller than the internal volume above the center of the boiling region (61), so that when the mounting surface is arranged laterally, 2) Of the internal volume consisting of the inside, the tubes (3a, 3b) and the inside of the header tank (4), the internal volume below the center of the boiling region (61) is above the center of the boiling region (61). The structure may be smaller than the internal volume.

Further, the invention according to claim 8 is characterized in that a radiation fin (5) is formed between the plurality of tubes (3).

According to this, it is possible to improve the heat dissipation performance of the heat dissipation parts (3, 5).

The reference numerals in parentheses attached to the above-mentioned respective means show the correspondence with the concrete means described in the embodiments described later.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a schematic structure of a boiling cooling apparatus of this embodiment, (a) is a schematic side view and (b) is a schematic side view.
[Fig. 1] is a view of the boiling cooling device as viewed from the left side of Fig. 1 (a).

As shown in FIG. 1 (a), a boiling cooling device 1
Is for cooling the heating element 6 such as a semiconductor element, for example, a refrigerant container 2 for storing a refrigerant in the internal space, and a plurality of (7 in this example) tubes communicating with the internal space of the refrigerant container 2. 3, a header tank 4 that connects the plurality of tubes 3 to each other, and a radiation fin 5 that is provided between the plurality of tubes 3. Here, the configuration including the tube 3 and the heat radiation fin 5 is the heat radiation portion in the present embodiment.

In FIG. 1 (a), the radiation fins 5 are shown only between the tubes 3 at one place, and not shown between the tubes at other places (the same applies to FIGS. 6 to 8 described later). (Only one location is shown). Further, in the following description, a portion where the mounting range of the heating element 6 with respect to the refrigerant container 2 is projected in the refrigerant container 2 in the direction perpendicular to the mounting surface (the horizontal direction in FIG. 1A) is the boiling region, and this boiling occurs. In the area, the refrigerant receives the heat of the heating element 6 to evaporate and vaporize. Note that, in some cases where the range of the boiling region is clearly indicated, it is surrounded by a one-dot chain line and is denoted by reference numeral 61.

As shown in FIG. 1A, the refrigerant container 2 is
The outer plate 21, which is a plate member on the mounting surface side, the outer plate 25, which is the outermost plate member on the opposite side of the mounting surface, and the four plates stacked between the outer plate 21 and the outer plate 25. It is constituted by the intermediate plates 22, 23 and 24 which are plate members.
The outer plate 25 is formed with an insertion hole into which the tube 3 described later is assembled.

As shown in FIG. 2, the intermediate plate 23 is provided with a plurality of slit-shaped openings 231 extending in the vertical direction (corresponding to the vertical direction in FIG. 1A) in the drawing. In addition, as shown in FIG.
A plurality of slit-shaped openings 221 extending in the vertical direction in the figure (corresponding to the vertical direction in FIG. 1A) are arranged in parallel. The opening 221 is formed at a position corresponding to the opening 231 of the intermediate plate 23, but is not formed near the end below the boiling region 61 and becomes shorter than the opening 231. There is.

As shown in FIG. 3, the intermediate plate 2
4, a plurality of slit-shaped openings 241 extending in the left-right direction in the drawing (corresponding to the front-back direction of the paper surface of FIG. 1A) are arranged in parallel. The opening 241 corresponds to the outer plate 25 described above.
Is formed at a position corresponding to the insertion hole, and is also formed above the boiling region 61 in the middle of the position corresponding to the insertion hole.

Then, these intermediate plates 22, 2
3, 24 are overlapped with the outer plates 21, 25, and the slit-shaped openings 221 and 231 are arranged such that the openings are lined up in the same direction (the same as the vertical relationship in the figure). In addition, two intermediate plates 24
Are overlapped in the same direction, and the slit-shaped opening 24
1 are arranged so that they are at the same position (the upper and lower relationships in the figure are the same).

The opening 231 and the opening 241 are arranged so as to be orthogonal to each other. As a result, the opening 2
21, the opening 231, and the opening 241 all communicate with each other to form a space for storing the refrigerant in the refrigerant container 2. Here, the space formed in the refrigerant container 2 has an internal volume below the center of the boiling region 61 when the mounting surface of the heating element 6 is arranged laterally (that is, in the side heat posture). It is smaller than the internal volume above the center of the boiling region 61.

Further, as shown in FIG. 1A, the header tank 4 includes six plates 21 to 21 constituting the refrigerant container 2.
25 in the reverse order of the refrigerant container 2 (assuming the same vertical relationship)
It is constructed by stacking. However, the intermediate plate 22 is not used for the header tank 4, and the intermediate plate 4 is arranged at the position where the intermediate plate 22 was arranged in the refrigerant container 2.
2 are arranged.

As shown in FIG. 5, the intermediate plate 42 has a plurality of slit-shaped openings 421 extending in the vertical direction (corresponding to the vertical direction in FIG. 1A) in the drawing. The opening 421 is the opening 231 of the intermediate plate 23.
It is formed at a position corresponding to
It is formed only in a portion substantially above 1 (including the upper portion of the boiling region 61) and is shorter than the opening 231.

By stacking the outer plates 21, 25 and the intermediate plates 23, 24, 42, the opening 23
1, the opening 241, and the opening 421 all communicate with each other to form a space in the header tank 4. Here, the space formed in the header tank 4 has an internal volume below the center of the boiling region 61 when the mounting surface of the heating element 6 is arranged laterally (that is, in the side heat posture). It is smaller than the internal volume above the center of the boiling region 61.

The outer plates 21, 25 and the intermediate plates 22, 23, 24, 42 are made of metal plates (for example, aluminum plate or aluminum alloy plate) which can be brazed and have excellent thermal conductivity, and each has a planar shape. Are formed in the same rectangle. Specifically, an aluminum plate is used for the outer plate 21 due to its thermal conductivity, and the other plates 22 to 25, 42 are made of a clad material having a brazing material layer formed on the surface of an aluminum alloy plate serving as a base material. I'm using it.

A tube 3 is provided between the refrigerant container 2 and the header tank 4, and both ends of the tube 3 are assembled in the above-mentioned insertion holes provided in the outer plate 25 so that the inside of the refrigerant container 2 and the inside of the header tank 4 are connected to each other. Are in communication. Tube 3
It is a perforated flat tube having a plurality of tubular passages formed by extruding an aluminum material.

The radiating fin 5 is formed by corrugating a thin plate material of aluminum having excellent thermal conductivity.
The thin plate material forming the heat radiation fins 5 has a brazing material layer formed on the surface thereof. Then, each of the plates 21 to 21 constituting the refrigerant container 2 and the header tank 4
The boiling cooling device 1 is formed by integrally brazing the tubes 25, 42, the tube 3 and the radiation fins 5.

In this embodiment, each of the plates 22 to
The slits provided in 25 and 42 were formed by press working. It is also possible to form by cutting, etching, etc. other than pressing. Although illustration is omitted, the refrigerant container 2 is provided with an injection pipe communicating with the internal space thereof, and a predetermined amount of the refrigerant is injected into the internal space through the injection pipe, and after injection, the tip of the injection pipe. It is completely sealed. Also, as a refrigerant,
Freon is used in this example.

Next, the operation of the boiling cooling device 1 having the above structure will be described.

First, as shown in FIG. 6, when the boiling cooling device 1 is arranged so that the mounting surface of the heating element 6 of the refrigerant container 2 is lateral (when used in so-called side heat).
Will be described. In addition, FIG. 6 shows A-A of FIG.
It is a line sectional view.

The refrigerant stored in the refrigerant container 2 so as to cover most of the boiling region (the liquid level is indicated by reference numeral 62 in FIG. 6).
(shown by b) receives the heat of the heating element 6 and is boiled to vaporize in the boiling region to become a gas refrigerant and flow from the refrigerant container 2 into the tube 3 arranged above. The refrigerant flowing from the refrigerant container 2 into the upper tube 3 passes through the inside of the header tank 4 and returns to the inside of the refrigerant container 2 from the tube 3 arranged below.

At this time, the refrigerant is condensed by being cooled by the heat exchange with the outside air when flowing through the upper tube 3.
Then, the condensed liquid refrigerant passes through the inside of the header tank 4 and cools the inside of the lower tube 3 while the refrigerant container 2 is being cooled.
Reflux to. The heating element 6 is cooled by repeating the above cycle (boiling-condensing liquefaction). In addition, tube 3
Since the radiating fins 5 are arranged in between, the refrigerant can be condensed well.

Next, regarding the case where the boiling cooling device 1 is arranged so that the mounting surface of the heating element 6 of the refrigerant container 2 faces downward (as shown in FIG. 7) (when used in so-called bottom heating). explain.

The refrigerant stored in the refrigerant container 2 (the liquid surface is shown by reference numeral 62a in FIG. 7) receives the heat of the heating element 6 and evaporates in the boiling region to become a gas refrigerant. It flows into the tube 3 provided in the boiling region and in the vicinity thereof (provided in the substantially central portion near the boiling region). The refrigerant flowing from the refrigerant container 2 into the central tube 3 passes through the header tank 4 and returns from the outer peripheral tube 3 into the refrigerant container 2.

At this time, the refrigerant, when flowing through the tube 3, is cooled by heat exchange with the outside air and condensed,
Reflux into the refrigerant container 2. The heating element 6 is cooled by repeating the above cycle (boiling-condensing liquefaction).

According to the above-described structure and operation, the boiling cooling device 1 is filled with the refrigerant to such a level that most of the boiling region is not exposed above the liquid surface 62b when used in the side heat posture. However, when used in the bottom heat posture, the liquid surface 62a of the refrigerant does not become too high. Therefore, when used in the bottom heat posture, it is possible to prevent the heat radiation area for condensing the refrigerant from becoming insufficient. Like this, side heat,
Regardless of whether it is used for bottom heat, an appropriate refrigerant liquid level can be obtained and good cooling performance can be exhibited.

The above effects are obtained by the intermediate plates 22, 24,
This is due to the shape of the openings 221, 241, 421 formed in 42, but since the refrigerant container 2 and the header tank 4 are formed by laminating a plurality of plates, the internal volume below the center of the boiling region is It is possible to easily form a configuration that is smaller than the internal volume above the boiling region.

Further, since the lower end of the opening 241 of the intermediate plate 24 where the opening density is high and the lower end of the opening 421 of the intermediate plate 42 are provided near the liquid surface 62b during the side heat, the side heat Regardless of whether it is used for bottom heat, it is possible to reliably obtain an appropriate refrigerant liquid level with a small amount of refrigerant. Further, the opening 221 of the intermediate plate 22 is also formed for the above effect, but the lower end is formed below the boiling region 61.
This prevents the distance between the heating element 6 and the refrigerant in the boiling region from increasing and suppresses the decrease in heat conduction.

(Other Embodiments) In the above embodiment, in the refrigerant container 2 and the header tank 4, the internal volume below the center of the boiling region is smaller than the internal volume above the center of the boiling region during side heating. However, if the internal volume below the center of the boiling region at the time of side heating is smaller than the internal volume above the center of the boiling region, the internal volume of the boiling cooling device 1 is limited to this. It is not something that will be done.

For example, as shown in FIG. 9, of the tubes communicating the refrigerant container and the header tank, the inner size of the hole of the lower tube 3b is made smaller than the inner size of the hole of the upper tube 3a. The internal volume of the tube below the center of the boiling area may be smaller than the internal volume of the tube above the center of the boiling area. Note that FIG. 9 is a cross-sectional view taken along the line BB of the boiling cooling device 1a shown in FIG. Further, in FIG. 9, the illustration of the radiation fins 5 is omitted.

The structure of the refrigerant container 2 of the above embodiment, the structure of the header tank 4, and the tube 3 of the above example.
The configurations of a and 3b may be independently adopted, or may be appropriately combined and adopted.

Further, in the above-mentioned one embodiment, the heat radiating portion is composed of the tube 3 and the heat radiating fin 5.
It may be provided with a heat dissipation portion that does not circulate the refrigerant.
Even in a boil cooling device that includes a refrigerant container and a heat radiating portion that does not circulate the refrigerant, the refrigerant container has an internal volume below the center of the boiling region at the time of side heating, and an internal volume above the center of the boiling region. By adopting a smaller configuration, it is possible to obtain almost the same effect.

Further, in the above-described embodiment, the so-called corrugated type heat radiation fins 5 are provided between the tubes 3, but other types of fins may be used. Further, the fins may be eliminated as long as sufficient heat dissipation performance can be secured.

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic structure of a boiling cooling device according to an embodiment of the present invention, in which (a) is a schematic side view and (b) is a schematic side view.
[Fig. 6] is a view seen from the left side of (a).

FIG. 2 is an intermediate plate 23 according to an embodiment of the present invention.
FIG.

FIG. 3 is an intermediate plate 24 according to an embodiment of the present invention.
FIG.

FIG. 4 is an intermediate plate 22 according to an embodiment of the present invention.
FIG.

FIG. 5 is an intermediate plate 42 according to an embodiment of the present invention.
FIG.

FIG. 6 is a cross-sectional view taken along the line AA of FIG. 1 (b) of the boiling cooling device according to the embodiment of the present invention, and is a cross-sectional view when the boiling cooling device is used in a side heat posture.

FIG. 7 is a cross-sectional view when the boiling cooling device according to the embodiment of the present invention is used in a bottom heat posture.

FIG. 8 is a schematic side view of a boiling cooling device according to another embodiment of the present invention.

FIG. 9 is a cross-sectional view taken along the line 8B-B of a boiling cooling device according to another embodiment of the present invention.

FIG. 10 is a schematic cross-sectional view of a conventional boiling cooling device, which is a cross-sectional view when the boiling cooling device is used in a bottom heat posture.

FIG. 11 is a schematic cross-sectional view of a conventional boiling cooling device, which is a cross-sectional view when the boiling cooling device is used in a side heat posture.

FIG. 12 is a plan view of an intermediate plate of a conventional boiling cooling device, (a) is a plan view of the intermediate plate 123,
FIG. 7B is a plan view of the intermediate plate 124.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Boiling cooling device 2 Refrigerant containers 3, 3a, 3b Tube (a part of heat dissipation part) 4 Header tank 5 Heat dissipation fins (a part of heat dissipation part) 6 Heating element 21 Outer plate (plate member) 22, 23, 24, 42 Intermediate plate (plate member) 25 Outer plate (plate member) 61 Boiling area

Claims (8)

[Claims] 1. A heating element (6) is attached to one surface, and a refrigerant stored therein receives heat from the heating element (6) and is vaporized to boil, and latent heat of the refrigerant vapor is radiated by a heat radiating section (3, 5) In the boiling cooling device for discharging the refrigerant to cool the heating element (6), a boiling region (61) in which the refrigerant is evaporated and vaporized by the heating element (6) is formed inside the heating element (6). When the mounting surface of 6) is arranged so as to be lateral, the internal volume below the center of the boiling region (61) is larger than the internal volume above the center of the boiling region (61). Boiling cooling device characterized by being small. 2. A refrigerant container (2) having a heating element (6) attached to one surface thereof and storing a refrigerant that boils when receiving heat of the heating element (6), and an inside of this refrigerant container (2). A heat dissipation part (3, 5) having a plurality of tubes (3) assembled in a substantially upright manner on a surface of the refrigerant container (2) facing the mounting surface of the heating element (6) in communication with A header tank (4) that connects the plurality of tubes (3) to each other, and the refrigerant stored in the refrigerant container (2) receives heat from the heating element (6) and is boiled to vaporize the refrigerant. A boiling cooling device (1) that cools the heating element (6) by releasing latent heat of steam from the heat radiating portion (3, 5), wherein the heating element is provided inside the refrigerant container (2). (6) forms a boiling region (61) in which the refrigerant evaporates and the mounting surface is lateral Of the interior of the refrigerant container (2), the tube (3), and the header tank (4), the volume of the interior of the boiling region (61) is lower than the center of the boiling region (61). An evaporative cooling device characterized in that the internal volume is smaller than the internal volume above the center of the boiling region (61). 3. The refrigerant container (2) has the boiling region (6) when the mounting surface is arranged laterally.
The internal volume below the center of 1) is the boiling region (6
The boiling cooling device according to claim 2, wherein the boiling volume is smaller than the internal volume above the center of 1). 4. The refrigerant container (2) according to claim 2 or 3, wherein a plurality of plate members (21, 22, 23, 24, 25) are stacked and arranged. The boiling cooling device described. 5. The header tank (4) has an internal volume below the center of the boiling region (61) when the mounting surface is arranged laterally so that the boiling region (61) has a lower internal volume. 5. The evaporative cooling device according to claim 2, wherein the evaporative cooling device is formed so as to have a smaller internal volume than a center thereof. 6. The boiling cooling according to claim 5, wherein the header tank (4) is formed by stacking a plurality of plate members (21, 42, 23, 24, 25). apparatus. 7. The tube (3a, 3b) has an internal volume below the center of the boiling region (61) of the tube (3a, 3b) when the mounting surface is arranged laterally. The evaporative cooling device according to any one of claims 2 to 6, which is formed so as to have a smaller internal volume than the center of 61). 8. The heat dissipating portion (3, 5) comprises a heat dissipating fin (5) between the plurality of tubes (3), according to any one of claims 2 to 7. The boil cooling apparatus according to.