JP2003198171A - Heat sinks and radiators - Google Patents

Abstract

(57) [abstract] (with correction) [PROBLEMS] To reduce the contact thermal resistance between a metal block and a heat radiation fin, and to ensure that there is no variation in cooling performance between products.
Further, the present invention provides a heat sink and a radiator for cooling electronic components and the like, which have less unnecessary radiation and excellent cooling performance. A plurality of heat dissipating fins formed of an elastic member having at least a bottom portion forming a heat receiving surface that is thermally connected to a heat generating electronic component mounted on a printed board are arranged in parallel, and serve as a heat receiving surface. A radiator 70 including a heat dissipating fin group forming the planar bottom portion 74 and a pressing member for pressing the upper end portion 75 of the heat dissipating fin group to thermally adhere the flat bottom portion 74 as a heat receiving surface. .

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cooling heat-generating electronic components, and more particularly to a heat sink and a radiator for cooling various electronic components such as semiconductor elements.

[0002]

2. Description of the Related Art Electronic components such as semiconductor elements mounted on various equipment such as personal computers and game machines and electric and electronic equipment such as electronic equipment are inevitable to generate a certain amount of heat due to their use. Is becoming an important technical issue. As a method for cooling an electric / electronic element that requires cooling, for example, a method of attaching a fan to a device to lower the temperature of air in the device housing, or a method of attaching a cooling body to a heat generating element, for example, a heat generating electronic component, A method of cooling the cooling element is typically known.

As the above-mentioned cooling body, there is a heat conductive metal material such as a plate or a block. The heat from the heating element is received by the metal block, and further radiated by the radiation fins attached to the metal block. . Due to the limited envelope volume, corrugated fin (mountain type) caulking fin is effective in order to reduce the weight and increase the heat radiation area.
Widely used. A heat conductive rubber or the like is used between the heat generating element and the metal material in order to enhance the heat conductivity. Furthermore, as a method of attaching the heat radiation fin to the above-mentioned metal block, brazing, soldering, caulking, or
Adhesives, double-sided tapes, and screws are used. Further, an extruded heat sink in which a fin portion and a bottom portion are integrated by using an extruded material is used. FIG. 7 is a sectional view showing a conventional radiator. FIG. 8 is a schematic perspective view showing a radiator including a conventional fan. As shown in FIGS. 7 and 8, in the conventional radiator, the fin portion and the bottom portion, which are formed of the extruded material, are integrally formed on the heating element 104 mounted on the printed circuit board 105 via the heat transfer sheet 103. The bottom portion of the extruded heat sink 101 is pressed and thermally connected, and the extruded heat sink 101 is fixed by a fixing screw or the like 102.
Is fixed. Furthermore, in order to form a wind flow in a predetermined direction, a shield material 107 is attached so as to cover the extruded heat sink 101, and an end portion thereof is fixed with a screw 106 or the like.
It is fixed to the printed circuit board 105 to form a duct. A fan 108 is mounted to direct air into the duct.

[0004]

The heat from the heat generating element is first received by the heat conductive metal block or the like, and is radiated to a predetermined place or the atmosphere by the heat radiation fins attached to the metal block or the like. According to how
Since a metal plate, block, etc. are present in the heat path between the heat-generating element, which is the heat source, and the heat radiation fin, and contact thermal resistance occurs between the metal plate, block, etc. and the heat radiation fin, heat radiation of the entire heat sink There is a problem that performance deteriorates.
Further, the cost for preparing other members other than the heat radiation fins and assembling the heat radiation fins and other members becomes high.
Further, contact resistance occurs when the other members other than the heat radiation fin and the heat radiation fin and the other member are assembled, but there is a problem that the contact resistance value varies among products. Further, there is a problem that unnecessary radiation occurs due to the heat sink, and the heat cooling efficiency is reduced.

Further, when using an extruded heat sink having a fin portion and a bottom portion integrated with each other, it is difficult to control the screw fixing order and fixing torque when fixing the extruded heat sink to a heating element such as an MPU. Further, if a spacer or the like is used for facilitating fixing with screws, stable fixing is possible, but there is a problem in that an extra step is required and the cost is increased.

Therefore, an object of the present invention is to solve the above-mentioned conventional problems, reduce the contact thermal resistance between the metal block and the radiation fin, and to eliminate the variation in cooling performance between products, and further to eliminate the need. (EN) It is possible to provide a heat sink and a radiator for cooling electronic parts and the like, which emits little radiation and is excellent in cooling performance.

[0007]

The present inventor has conducted extensive studies to solve the above-mentioned conventional problems. as a result,
Without using a metal block that receives heat from the heat-generating electronic components, the heat-radiating fins made of an elastic member are directly attached to the heat-generating electronic components and the like, and the upper ends of the heat-radiating fins are pressed.
By thermally adhering the flat bottom part as the heat receiving surface, the contact thermal resistance between the metal block and the radiation fins is reduced, there is no variation in cooling performance between products, and there is less unnecessary radiation, cooling performance It has been found that it is possible to obtain a heat sink and a radiator that are excellent in cooling electronic parts and the like.

The present invention has been made on the basis of the above findings, and the first aspect of the heat sink of the present invention is to provide a heat receiving surface thermally connected to a heat generating electronic component mounted on a printed circuit board. A heat sink in which a plurality of heat radiation fins made of an elastic member having at least a bottom portion to be formed are arranged in parallel to form a flat bottom portion as a heat receiving surface.

A second aspect of the heat sink of the present invention is
A radiating fin portion formed of an elastic member having at least a bottom portion thermally connected to the heat-generating electronic component mounted on the printed circuit board is a heat sink forming a flat bottom portion as a heat receiving surface.

According to a third aspect of the heat sink of the present invention,
It is a heat sink in which each of the radiating fins has a corresponding recess and protrusion, and adjacent radiating fins are connected by the recess and protrusion.

According to a fourth aspect of the heat sink of the present invention,
A plurality of radiating fins made of an elastic member having at least a bottom portion forming a heat receiving surface thermally connected to the heat-generating electronic component mounted on the printed circuit board are arranged in parallel to form a flat bottom portion as the heat receiving surface. A radiating fin group and each of the plurality of radiating fins arranged in parallel are penetrated to form the planar bottom portion as a heat receiving surface,
The heat sink includes a connecting rod-shaped body that connects the plurality of heat radiation fins.

A fifth aspect of the heat sink of the present invention is
The elastic member is a heat sink in which the material of the radiation fin has elasticity.

According to a sixth aspect of the heat sink of the present invention,
The elastic member is a heat sink that has elasticity due to the shape of the radiation fins.

According to a seventh aspect of the heat sink of the present invention,
At least two different heights mounted on the printed circuit board
A plurality of radiating fins made of an elastic member having at least a bottom portion forming a heat receiving surface, which are thermally connected to the individual heat-generating electronic components, are arranged in parallel to form at least two planar bottom portions having different heights. It is a heat sink provided with a radiation fin group.

An eighth aspect of the heat sink of the present invention is
At least two different heights mounted on the printed circuit board
A plurality of radiating fins made of an elastic member having at least a bottom portion forming a heat receiving surface, which are thermally connected to the individual heat-generating electronic components, are arranged in parallel to form at least two planar bottom portions having different heights. A radiating fin group, and a connecting rod-like member that connects the plurality of radiating fins so as to penetrate each of the plurality of radiating fins arranged in parallel to form at least two planar bottom portions; It is a heat sink equipped with.

A first aspect of the heat radiator of the present invention is a plurality of heat radiation fins made of an elastic member having at least a bottom portion forming a heat receiving surface thermally connected to a heat generating electronic component mounted on a printed circuit board. A heat dissipating fin group that is arranged in parallel and forms a flat bottom portion as a heat receiving surface, and a pressing member that presses the upper end portion of the heat dissipating fin group to bring the flat bottom portion as a heat receiving surface into thermal contact. It is a radiator equipped with.

A second aspect of the heat radiator of the present invention is a heat radiation fin portion made of an elastic member having at least a flat bottom portion as a heat receiving surface to be thermally connected to a heat generating electronic component mounted on a printed circuit board. A radiator provided with a pressing member that presses an upper end portion of the radiation fin portion to bring the planar bottom portion serving as a heat receiving surface into thermal contact. According to a third aspect of the radiator of the present invention, a plurality of heat radiation fins made of an elastic member having at least a bottom portion forming a heat receiving surface thermally connected to a heat generating electronic component mounted on a printed circuit board are arranged in parallel. A plurality of heat dissipating fins forming a flat bottom portion as a heat receiving surface and a plurality of heat dissipating fins arranged in parallel to each other to form the flat bottom portion as a heat receiving surface. A radiator including a connecting rod-shaped body for connecting the individual radiation fins, and a pressing member that presses the upper end portions of the radiation fin groups to thermally bring the planar bottom portion as a heat receiving surface into close contact. .

A fourth aspect of the radiator of the present invention is the radiator further comprising a fan for sending air to the radiation fin group.

A fifth aspect of the radiator of the present invention has at least a bottom portion forming a heat receiving surface, which is thermally connected to at least two heat generating electronic components mounted on a printed circuit board and having different heights. A plurality of heat dissipating fins made of elastic members are arranged in parallel to form a heat dissipating fin group that forms at least two planar bottoms having different heights, and an upper end of the heat dissipating fin group is pressed to serve as the heat receiving surface. It is a radiator provided with a pressing member for thermally adhering a flat bottom portion.

A sixth aspect of the radiator of the present invention has at least a bottom portion forming a heat receiving surface, which is thermally connected to at least two heat generating electronic components mounted on a printed board and having different heights. A plurality of heat dissipating fins made of an elastic member are arranged in parallel, and a heat dissipating fin group forming at least two planar bottom portions having different heights and a plurality of heat dissipating fins arranged in parallel are respectively penetrated, The connecting rod-shaped body that connects the plurality of radiating fins and the upper end portion of the radiating fin group are pressed to form at least two planar bottom portions, and the planar bottom portion as a heat receiving surface is formed. It is a radiator provided with a pressing member that is brought into close thermal contact.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a heat sink and a radiator of the present invention will be described in detail with reference to the drawings. The heat sink of the present invention has a plurality of heat dissipating fins in parallel, each of which is composed of an elastic member having at least a bottom portion forming a heat receiving surface thermally connected to a heat generating electronic component mounted on a printed circuit board via a heat conductive inclusion. It is a heat sink which is arranged and forms a planar bottom as a heat receiving surface.
That is, each of the radiating fins described above is provided with a corresponding recess and protrusion, and adjacent radiating fins are connected by the recess and protrusion.

Further, the heat sink according to the present invention is a heat dissipation member made of an elastic member having at least a bottom portion forming a heat receiving surface which is thermally connected to the heat generating electronic component mounted on the printed circuit board via a heat conductive inclusion. A plurality of fins are arranged in parallel to form a flat bottom portion serving as a heat receiving surface, and a plurality of heat dissipating fins arranged in parallel penetrate each of the fins to form the flat bottom portion serving as a heat receiving surface. As described above, the heat sink includes a connecting rod-shaped body that connects the plurality of heat radiation fins.

Each of the plurality of heat radiation fins is made of an elastic member and has at least the lower portion as described above. When the plurality of heat radiation fins are arranged in parallel, the bottom portion is printed. It is important to form a heat receiving surface that is thermally connected to the heat generating electronic components mounted on the substrate. That is, the heat receiving surface formed by the bottom portion is directly connected to the heat generating electronic component. Further, the heat receiving surface formed by the bottom portion may be directly thermally connected to the heat generating electronic component via the heat conductive inclusion.

FIG. 1 is a diagram showing one embodiment of the heat sink of the present invention. As shown in FIG. 1, this heat sink 1 has a plurality of C-shaped heat radiation fins composed of an upper portion 5, a side wall surface portion 2 and a bottom portion 4 arranged in parallel, and a connecting rod-shaped member at the center portion of the side wall portion. The body 3 is attached. When a plurality of C-shaped heat radiation fins are arranged in parallel, the bottom portions 4 arranged in parallel form a heat receiving surface composed of a planar lower portion. In the heat sink shown in FIG. 1, the C-shaped heat radiation fin has elasticity depending on its shape, so that the heat sink itself has elasticity.

FIG. 2 shows another example of the heat sink of the present invention.
It is a figure which shows one aspect. As shown in FIG. 2, this heat sink 20 has a plurality of C-shaped heat radiation fins, which are composed of an upper portion 25, a side wall surface portion 21 and a bottom portion 24, arranged in parallel as in FIG. A convex portion 22 is provided on the front surface of the central portion and a concave portion corresponding to the rear surface of the central portion, and the convex portion and the concave portion are connected. In this aspect, FIG.
A plurality of radiating fins are connected in parallel by the convex portion and the concave portion provided on the radiating fin without providing the connecting rod-shaped body as in the aspect shown in FIG. The heat sink shown in FIG. 2 also has elasticity because the C-shaped heat radiation fins have elasticity due to the shape thereof.

FIG. 3 is a diagram showing another embodiment of the heat sink of the present invention. As shown in FIG. 3, in the heat sink of this aspect, a plurality of elastic, substantially L-shaped radiating fins are arranged in parallel, each of the plurality of radiating fins arranged in parallel is penetrated, and the bottom is A connecting rod-shaped body that connects a plurality of heat radiation fins is provided so as to form a heat receiving surface. As shown in FIG. 3, substantially L-shaped heat radiation fins including an upper portion 35, a side wall portion 31, and a bottom portion 34 are arranged in parallel, and a connecting rod-shaped body 33 for connecting a plurality of substantially L-shaped heat radiation fins is provided. Has been. In the heat sink thus formed, the bottoms of the plurality of heat radiation fins arranged in parallel form a flat bottom as a heat receiving surface. Furthermore, the side wall of the substantially L-shaped heat dissipating fin is slightly curved and has elasticity. The heat sink shown in FIG. 3 also has elasticity because the substantially L-shaped heat dissipation fins have elasticity due to the shape thereof.

FIGS. 4A to 4D are views showing another embodiment of the heat radiation fins of the heat sink of the present invention. Figure 4
The radiating fin shown in (a) is composed of a flat upper portion 45, a side wall surface portion 41 having three flat portions (that is, a vertical surface at the center and inclined surfaces above and below the flat surface), and a flat bottom portion 44. ing. In FIG. 4A, the upper front surface may have a convex portion and the rear surface may have a concave portion. Alternatively, a hole for the connecting rod-shaped body may be provided in the center of the side wall portion, and a plurality of heat radiation fins may be fixed by the connecting rod-shaped body to form a flat bottom portion as a heat receiving surface. Further, in the radiating fin of this aspect, the side wall surface portion including the central vertical surface and the upper and lower inclined surfaces has elasticity.

The radiating fin shown in FIG. 4 (b) is a C-shaped radiating fin having a curved portion. All the parts of the heat dissipation fin of this aspect are curved, and the upper part 55 and the side wall part 5 are
1 and a bottom portion 54. Also in FIG. 4B,
The upper front surface may have a convex portion and the rear surface may have a concave portion. Alternatively, a hole for the connecting rod-shaped body may be provided in the center of the side wall portion, and a plurality of heat radiation fins may be fixed by the connecting rod-shaped body to form a flat bottom portion as a heat receiving surface. Further, the heat dissipation fin of this aspect has elasticity due to the shape of the C-shaped heat dissipation fin.

The radiating fin shown in FIG. 4 (c) is substantially L-shaped, and the side wall is bent. In the radiating fin of this aspect, the upper portion is formed of the end portion of the radiating fin, and the side wall portion is formed of two flat portions bent at a predetermined angle. In FIG. 4C, a hole for a connecting rod is provided in the center of the side wall, and a plurality of heat radiation fins are fixed by the connecting rod to form a flat bottom as a heat receiving surface. You can The heat dissipation fin of this aspect has elasticity due to the shape of the bent side wall of the substantially L-shaped heat dissipation fin.

Further, according to another aspect of the heat sink of the present invention, the heat radiating fin portion made of an elastic member having at least a bottom portion thermally connected to the heat generating electronic component mounted on the printed circuit board is a flat surface as a heat receiving surface. Is a heat sink that forms a bottom. That is, it is not a heat sink in which a plurality of heat radiation fins are arranged in parallel as shown in FIGS. 1 to 3, but a heat sink composed of continuous heat radiation fins in the shape of corrugated fins.

FIG. 4 (d) shows a radiation fin made of a corrugated fin. In the radiation fin of this aspect,
The flat top 95 and two flat sidewalls 91 or the bottom and two flat sidewalls form a continuous triangle. The radiating fin of this aspect has elasticity due to the shape of the two inclined flat side wall portions. As described above, the radiating fin has elasticity depending on its shape, but the radiating fin may be formed of a material made of an elastic member. Further, in the heat sink of the present invention, the above-mentioned connecting rod-shaped body may be composed of a heat pipe.

Furthermore, the heat sink of the present invention forms a heat receiving surface which is thermally connected to at least two heat generating electronic components mounted on the printed circuit board and having different heights through the heat conductive inclusions. The heat sink may be a heat sink including a plurality of radiation fins made of an elastic member having at least a bottom portion and arranged in parallel to form a radiation fin group that forms at least two planar bottom portions having different heights. That is, for example, the heights H1 and H2 of the two heat-generating electronic components having the two planar bottom portions A and B mounted on the printed circuit board and having different heights.
It is provided corresponding to. In this aspect, a convex portion and a concave portion corresponding to the rear surface of the central portion are provided on the front surface of the central portion of the upper portion of the heat dissipation fin, and the convex portion and the concave portion are connected. As the individual shape of the heat radiation fin, the shape of the fin shown in FIGS. 2 and 4A to 4D can be used.

Further, the heat sink of the present invention forms a heat receiving surface that is thermally connected to at least two heat generating electronic components mounted on the printed circuit board and having different heights through the heat conductive inclusions. A plurality of heat radiation fins made of an elastic member having at least a bottom portion are arranged in parallel to form a heat radiation fin group forming at least two planar bottom portions having different heights, and a plurality of the heat radiation fins arranged in parallel. The heat sink may be provided with a connecting rod-shaped body that connects the plurality of heat radiation fins so as to penetrate therethrough and form at least two planar bottom portions. That is,
For example, the heights H1 of two heat-generating electronic components having two flat bottoms A and B mounted on a printed circuit board and having different heights,
It is provided corresponding to H2. In this aspect, a hole for the connecting rod-shaped body is provided in the central portion of the radiating fin, and, for example, two radiating fin groups are connected by the connecting rod-shaped body. As the individual shape of the heat radiation fin, the shape of the fin having a hole in the center in the embodiment shown in FIGS. 1, 3 and 2 and 4 (a) to 4 (d) can be used.

One aspect of the radiator of the present invention is an elastic member having at least a bottom portion forming a heat receiving surface which is thermally connected to a heat generating electronic component mounted on a printed circuit board via a heat conductive inclusion. A plurality of radiating fins consisting of are arranged in parallel and fixed to a radiating fin group forming a flat bottom as a heat receiving surface and a printed circuit board or the like, and pressing the upper end of the radiating fin group to form a heat receiving surface. It is a radiator provided with a pressing plate for thermally adhering the flat bottom portion.

Still another aspect of the heat radiator of the present invention is that the heat radiation is composed of an elastic member having at least a flat bottom portion as a heat receiving surface which is thermally connected to the heat generating electronic component mounted on the printed circuit board. A radiator including a fin portion and a pressing member that presses the upper end portion of the heat radiation fin portion to bring the planar bottom portion serving as a heat receiving surface into thermal contact. For example, a corrugated fin can be used as the heat radiation fin portion.

Further, another aspect of the heat radiator of the present invention is that the heat-dissipating electronic component mounted on the printed circuit board is provided with a bottom portion forming a heat receiving surface that is thermally connected via a heat conductive inclusion. A plurality of heat dissipating fins including at least elastic members are arranged in parallel, and a heat dissipating fin group that forms a planar bottom portion as a heat receiving surface and a plurality of heat dissipating fins that are arranged in parallel are respectively passed through to form a heat receiving surface. Is fixed to a connecting rod-shaped body that connects the plurality of radiating fins so as to form the planar bottom portion of the radiating fins and the upper end portion of the radiating fin group is pressed to serve as a heat receiving surface. It is a radiator provided with a pressing plate for thermally adhering the flat bottom portion. Further, the radiator of the present invention may further include a fan that sends air to the radiation fin group.

FIG. 5 is a sectional view showing one embodiment of the radiator of the present invention. FIG. 6 is a schematic perspective view showing a radiator of the present invention including a fan. As shown in FIG. 5 and FIG. 6, the radiator of the present invention includes an upper portion 75, a side wall portion 71,
Further, a plurality of elastic heat dissipating fins each having a bottom portion 74 forming a heat receiving surface are arranged in parallel, and a heat dissipating fin group forming a flat bottom portion as a heat receiving surface and a plurality of heat dissipating fins arranged in parallel are respectively formed. The connecting rod-shaped body 73 penetrating through the center of the side wall portion 71 of the above is fixed to the printed circuit board 78, presses the upper portion 75 of the heat radiation fin group, and the flat bottom portion as the heat receiving surface generates heat via the heat conductive sheet 79. It is provided with a pressing plate 76 that is brought into thermal contact with the body 80. In this state, the pressing plate 76 that presses the upper part of the heat radiation fin group has the end portion of the printed circuit board 78 with screws 77 or the like.
Fixed to.

Further, a fan 81 is attached so as to send air to the heat radiation fin group in a predetermined direction. Further, another aspect of the heat radiator of the present invention is a heat receiving device, which is thermally connected to at least two heat generating electronic components mounted on a printed circuit board and having different heights via a heat conductive inclusion. A plurality of heat dissipating fins made of an elastic member having at least a bottom portion forming a surface are arranged in parallel, and the heat dissipating fin group forming at least two planar bottom portions having different heights is fixed to a printed circuit board or the like to dissipate the heat. It is a radiator provided with a pressing plate that presses the upper end portions of the fin groups to bring the planar bottom portion serving as a heat receiving surface into thermal contact.

That is, for example, two planar bottom portions A and B are provided corresponding to the heights H1 and H2 of two heat generating electronic components mounted on the printed circuit board and having different heights. In this aspect, the convex portion on the front surface of the central portion of the upper portion of the heat radiation fin,
A concave portion corresponding to the rear surface of the central portion is provided, and the convex portion and the concave portion are connected. The individual shapes of the radiation fins are shown in FIGS.
The fin shapes shown in (a) to 4 (d) can be used. In either case, the upper part of the heat dissipation fin group is pressed by the pressing plate.

Furthermore, another aspect of the radiator of the present invention is thermally connected to at least two heat-generating electronic components mounted on a printed circuit board and having different heights via a heat conductive inclusion. A plurality of radiation fins made of an elastic member having at least a bottom portion forming a heat receiving surface are arranged in parallel,
A heat radiation fin group forming at least two flat bottom portions having different heights and a plurality of heat radiation fins arranged in parallel are respectively penetrated to form at least two flat bottom portions, A connecting rod-shaped body that connects the plurality of radiating fins and a printed circuit board or the like are fixed, and the upper ends of the radiating fins are pressed to thermally bring the planar bottom portion as a heat receiving surface into close contact. It is a radiator provided with a plate.

That is, for example, two planar bottom portions A and B are provided corresponding to the heights H1 and H2 of two heat-generating electronic components mounted on the printed circuit board and having different heights. In this aspect, a hole for the connecting rod-shaped body is provided in the central portion of the radiating fin, and, for example, two radiating fin groups are connected by the connecting rod-shaped body. The individual shape of the radiation fin is
The shape of the fin having a hole in the center of the embodiment shown in FIGS. 1, 3 and 2 and 4 (a) to 4 (d) can be used. In either case, the upper part of the heat dissipation fin group is pressed by the pressing plate.

As described above, according to the present invention, since the radiation fins have elasticity, variations in size and variations in pressing can be alleviated, and stable thermal connection with the heating element can be achieved. Further, since the thickness of the heat radiation fin can be reduced by using a metal plate or the like, the weight can be reduced. Further, the heat radiation area can be significantly increased as compared with the conventional extruded heat sink. Furthermore, the heat dissipation effect of the pressing member that is thermally connected to the heat dissipation fin can be expected.

[0043]

As described above, according to the present invention, the contact thermal resistance between the metal block and the radiation fin is reduced, the cooling performance does not vary among products, and the unnecessary radiation is reduced. It is possible to provide an excellent heat sink and radiator for cooling electronic components and the like, which has a high industrial utility value.

[Brief description of drawings]

FIG. 1 is a diagram showing one embodiment of a heat sink of the present invention.

FIG. 2 is a diagram showing another aspect of the heat sink of the present invention.

FIG. 3 is a diagram showing another aspect of the heat sink of the present invention.

4 (a) to 4 (d) are views showing another embodiment of the heat radiation fins of the heat sink of the present invention.

FIG. 5 is a cross-sectional view showing one embodiment of the radiator of the present invention.

FIG. 6 is a schematic perspective view showing a radiator of the present invention including a fan.

FIG. 7 is a cross-sectional view showing a conventional radiator.

FIG. 8 is a schematic perspective view showing a radiator including a conventional fan.

[Explanation of symbols]

1. heatsink 2. Side wall of radiating fin 3. Rod for connection 4. Bottom of radiating fin 5. Top of heat dissipation fin 20. heatsink 21. Side wall of radiating fin 22. Convex 24. Bottom of radiating fin 25. Top of heat dissipation fin 26. Recess 30. heatsink 31. Side wall of radiating fin 33. Rod for connection 34. Bottom of radiating fin 35. Top of heat dissipation fin 41. Side wall of radiating fin 44. Bottom of radiating fin 45. Top of heat dissipation fin 51. Side wall of radiating fin 54. Bottom of radiating fin 55. Top of heat dissipation fin 61. Side wall of radiating fin 64. Bottom of radiating fin 65. Top of heat dissipation fin 70. Radiator 71. Side wall of radiating fin 73. Rod for connection 74. Bottom of radiating fin 75. Top of heat dissipation fin 76. Holding plate 77. screw 78. Printed board 79. Heat transfer sheet 80. Heating element 81. fan

Continued front page    F-term (reference) 5E322 AA02 AB01 AB04 EA01 EA06                       FA04                 5F036 AA01 BA04 BA24 BB05 BC09                       BC33

Claims (14)

[Claims] 1. A flat surface as a heat receiving surface, in which a plurality of heat radiating fins made of an elastic member having at least a bottom portion forming a heat receiving surface thermally connected to a heat generating electronic component mounted on a printed circuit board are arranged in parallel. Heat sink that forms a flat bottom. 2. A heat sink in which a radiating fin portion made of an elastic member having at least a bottom portion thermally connected to a heat generating electronic component mounted on a printed circuit board forms a flat bottom portion as a heat receiving surface. 3. The heat sink according to claim 1, wherein each of the heat radiation fins has a corresponding recess and projection, and adjacent heat radiation fins are connected by the recess and projection. 4. A flat surface as a heat receiving surface, in which a plurality of heat radiating fins made of an elastic member having at least a bottom portion forming a heat receiving surface thermally connected to a heat generating electronic component mounted on a printed circuit board are arranged in parallel. A plurality of radiating fins that form a flat bottom portion and the plurality of radiating fins that are arranged in parallel are connected to each other so as to form the planar bottom portion as a heat receiving surface. A heat sink having a connecting rod. 5. The heat sink according to claim 1, wherein the elastic member is made of a material of a radiation fin having elasticity. 6. The heat sink according to claim 1, wherein the elastic member has elasticity depending on the shape of the heat radiation fin. 7. A flat surface as a heat receiving surface, in which a plurality of heat radiating fins made of an elastic member having at least a bottom portion forming a heat receiving surface thermally connected to a heat generating electronic component mounted on a printed circuit board are arranged in parallel. A radiator including a heat radiating fin group that forms a flat bottom portion, and a pressing member that presses an upper end portion of the heat radiating fin group to bring the planar bottom portion as a heat receiving surface into thermal contact. 8. A radiating fin portion formed of an elastic member having at least a flat bottom portion as a heat receiving surface that is thermally connected to a heat generating electronic component mounted on a printed circuit board, and an upper end portion of the radiating fin portion is pressed. Then, the radiator provided with a pressing member for thermally adhering the flat bottom portion as the heat receiving surface. 9. A flat surface as a heat receiving surface, in which a plurality of heat radiating fins made of an elastic member having at least a bottom portion forming a heat receiving surface thermally connected to a heat generating electronic component mounted on a printed circuit board are arranged in parallel. A plurality of radiating fins that form a flat bottom portion and the plurality of radiating fins that are arranged in parallel are connected to each other so as to form the planar bottom portion as a heat receiving surface. A radiator comprising: a connecting rod-shaped body; and a pressing member that presses the upper end portions of the radiation fin groups to bring the planar bottom portion serving as a heat receiving surface into thermal contact. 10. The radiator according to claim 7, further comprising a fan for air-cooling the radiation fin group. 11. A thermal connection to at least two heat-generating electronic components mounted on a printed circuit board and having different heights.
A heat sink comprising a plurality of heat dissipating fins, each of which is made of an elastic member and has at least a bottom portion forming a heat receiving surface, and arranged in parallel to form at least two planar bottom portions having different heights. 12. A thermal connection to at least two heat-generating electronic components mounted on a printed circuit board and having different heights.
A plurality of heat dissipating fins formed of an elastic member having at least a bottom portion forming a heat receiving surface are arranged in parallel, and a heat dissipating fin group forming at least two planar bottom portions having different heights; A heat sink comprising: a coupling rod-shaped body that couples the plurality of radiation fins so as to penetrate each of the radiation fins to form at least two planar bottom portions. 13. A thermal connection to at least two heat-generating electronic components mounted on a printed circuit board and having different heights.
A plurality of heat dissipating fins made of an elastic member having at least a bottom portion forming a heat receiving surface are arranged in parallel to form a heat dissipating fin group forming at least two planar bottom portions having different heights, and an upper end portion of the heat dissipating fin group. A radiator provided with a pressing member that presses and brings the planar bottom portion as a heat receiving surface into close thermal contact. 14. A thermal connection to at least two heat-generating electronic components mounted on a printed circuit board and having different heights.
A plurality of heat dissipating fins formed of an elastic member having at least a bottom portion forming a heat receiving surface are arranged in parallel, and a heat dissipating fin group forming at least two planar bottom portions having different heights; By piercing each of the radiation fins, pressing a connection rod-shaped body for coupling the plurality of radiation fins and an upper end of the radiation fin group so as to form at least two planar bottoms, A radiator provided with a pressing member for thermally adhering the flat bottom portion as a heat receiving surface.