JP2003078174A - Light source unit mounting structure - Google Patents
Light source unit mounting structureInfo
- Publication number
- JP2003078174A JP2003078174A JP2001268477A JP2001268477A JP2003078174A JP 2003078174 A JP2003078174 A JP 2003078174A JP 2001268477 A JP2001268477 A JP 2001268477A JP 2001268477 A JP2001268477 A JP 2001268477A JP 2003078174 A JP2003078174 A JP 2003078174A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- light source
- source unit
- sleeve
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
(57)【要約】
【課題】 半導体発光素子の放熱を促し大電流印加によ
る高輝度化が可能な光源ユニットの装着構造を提供す
る。
【解決手段】 内側に第１の電極になる放熱ブロック３
を設け、放熱ブロック３の先部外側に絶縁膜を挟んで第
２の電極になるスリーブ５を熱伝達可能に設け、取り付
けられた半導体発光素子１に通電可能な光源ユニットの
装着構造であって、金属製の壁部１２に絶縁体１３を介
して設けられ、スリーブ５が嵌入可能な取付孔１４が形
成された取付板１５と、壁部１２に形成され取付孔１４
に連通する取付凹部１６と、取付凹部１６の周壁に設け
られ、嵌入する放熱ブロック３を半径方向内側に付勢し
て固定する付勢部材１８と、取付孔１４の周壁に設けら
れ、嵌入するスリーブを固定する固定部１７とを有す
る。
(57) [Problem] To provide a mounting structure of a light source unit capable of promoting heat radiation of a semiconductor light emitting element and increasing brightness by applying a large current. SOLUTION: A heat radiation block 3 which becomes a first electrode inside.
And a light source unit that is capable of conducting electricity to the attached semiconductor light emitting element 1 by providing a sleeve 5 serving as a second electrode on the outer side of the front end of the heat radiation block 3 with an insulating film interposed therebetween so as to be able to conduct heat. A mounting plate 15 provided on a metal wall 12 via an insulator 13 and having a mounting hole 14 into which the sleeve 5 can be fitted; and a mounting hole 14 formed on the wall 12.
And a biasing member 18 provided on the peripheral wall of the mounting recess 16 for biasing the fitted heat radiation block 3 inward in the radial direction to be fixed, and provided on the peripheral wall of the mounting hole 14 and fitted. And a fixing portion 17 for fixing the sleeve.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＬＥＤを利用した
半導体発光による照明装置に係り、特に放熱性をよくし
大電流の印加を可能として高輝度の発光が得られるよう
にした光源ユニットの装着構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor light-emitting illuminating device using LEDs, and more particularly to mounting a light source unit capable of improving heat dissipation and applying a large current to obtain high-luminance light emission. Regarding the structure.
【０００２】[0002]
【従来の技術】従来から発光ダイオード（ＬＥＤ）を利
用したさまざまな半導体発光装置が開発されている。こ
の半導体発光装置の中で最も典型的なものは砲弾型のラ
ンプ状としたものと表面実装用のチップ型としたもので
あり、図４にランプ状の半導体発光装置の従来例を示
す。2. Description of the Related Art Conventionally, various semiconductor light emitting devices utilizing light emitting diodes (LEDs) have been developed. The most typical of these semiconductor light emitting devices are a bullet-shaped lamp type and a surface mounting chip type, and FIG. 4 shows a conventional example of a lamp type semiconductor light emitting device.
【０００３】図４において、二股状のリードフレーム５
１の一方のリード５１ａの上端にマウント部５１ｂを形
成し、このマウント部５１ｂの上にサブマウント素子５
２を介してフリップチップ型の半導体発光素子５３が導
通接続されている。サブマウント素子５２はたとえば静
電気保護素子であり、下面にマウント部５１ｂに導通さ
せるための電極５２ａを形成し、上面の電極にはワイヤ
５４をリード５１ｃとの間にボンディングしている。そ
して、ワイヤ５４を含めてリードフレーム５１の上端は
エポキシの樹脂パッケージ５５によって封止されてい
る。In FIG. 4, a forked lead frame 5 is provided.
The mount portion 51b is formed on the upper end of the one lead 51a, and the submount element 5 is formed on the mount portion 51b.
The flip-chip type semiconductor light emitting element 53 is electrically connected via the line 2. The submount element 52 is, for example, an electrostatic protection element, and has an electrode 52a for conducting to the mount portion 51b formed on the lower surface, and a wire 54 is bonded to the lead 51c on the electrode on the upper surface. The upper end of the lead frame 51 including the wires 54 is sealed with an epoxy resin package 55.
【０００４】リードフレーム５１を介して半導体発光素
子５３に通電すると、半導体発光素子５３の基板に積層
した化合物半導体の活性層から発光する。この通電の際
には、半導体発光素子５３が発熱する。When the semiconductor light emitting element 53 is energized via the lead frame 51, light is emitted from the active layer of the compound semiconductor laminated on the substrate of the semiconductor light emitting element 53. The semiconductor light emitting element 53 generates heat during this energization.
【０００５】[0005]
【発明が解決しようとする課題】ところが、半導体発光
素子５３からの発熱は樹脂パッケージ５５やリードフレ
ーム５１側に熱伝達されるが、樹脂パッケージ５５の放
熱性は低く、半導体発光素子５３を搭載しているリード
５１ａへの熱伝達量も少ない。特に、半導体発光素子５
３がサファイアを基板としてＧａＮ系化合物半導体を積
層した青色発光のものでは、サファイアの基板の熱伝導
率が低いので放熱性は格段に低い。また、サブマウント
素子５２にＳｉを用いることにより、これを経由した熱
の流れはよくなるが、リードフレーム５１が細いので結
果的に放熱性は悪くなる。However, the heat generated from the semiconductor light emitting element 53 is transferred to the resin package 55 and the lead frame 51 side, but the heat dissipation of the resin package 55 is low and the semiconductor light emitting element 53 is mounted. The amount of heat transfer to the reed 51a is also small. In particular, the semiconductor light emitting device 5
In the case of blue light emission 3 in which GaN-based compound semiconductors are stacked using sapphire as a substrate, the heat dissipation of the substrate is remarkably low because the substrate has a low thermal conductivity. Further, by using Si for the submount element 52, the flow of heat through the submount element 52 is improved, but since the lead frame 51 is thin, the heat dissipation is deteriorated as a result.
【０００６】このように従来の半導体発光装置では、半
導体発光素子５３から発生する熱の放熱性が低いので、
現状では２０ｍＡ程度の電流しか印加できない。これよ
りも大きな電流を印加すると半導体発光素子５３の温度
が上昇し、流す電流に比例して発光輝度が増加せず飽和
してしまうし、特性が劣化して発光輝度が低下してしま
う。したがって、半導体発光素子５３には小さな電流し
か印加できず、その発光輝度にも限界がある。このた
め、たとえば植物栽培用の光源や照明用の光源として利
用しようとする場合では、多数の半導体発光装置を備え
る必要があり、光源装置が複雑になるとともにコストも
高くなるという問題がある。また、半導体発光素子の発
熱をリードフレームに移動できたとしても、リードフレ
ームから電源側に放熱する必要がある。As described above, in the conventional semiconductor light emitting device, the heat radiation of the heat generated from the semiconductor light emitting element 53 is low.
At present, only a current of about 20 mA can be applied. When a current larger than this is applied, the temperature of the semiconductor light emitting element 53 rises, and the light emission luminance is saturated in proportion to the flowing current without being increased, and the characteristics deteriorate and the light emission luminance decreases. Therefore, only a small current can be applied to the semiconductor light emitting element 53, and its light emission brightness is limited. For this reason, for example, when it is intended to be used as a light source for plant cultivation or a light source for illumination, it is necessary to provide a large number of semiconductor light emitting devices, which causes a problem that the light source device becomes complicated and the cost becomes high. Further, even if the heat generated by the semiconductor light emitting element can be transferred to the lead frame, it is necessary to radiate the heat from the lead frame to the power supply side.
【０００７】そこで、本発明は、半導体発光素子の放熱
を促し大電流印加による高輝度化が可能な光源ユニット
の装着構造を提供することを目的とする。Therefore, it is an object of the present invention to provide a mounting structure of a light source unit that promotes heat dissipation of a semiconductor light emitting element and can achieve high brightness by applying a large current.
【０００８】[0008]
【課題を解決するための手段】本発明は、内側に放熱ブ
ロックを、外側にスリーブを熱伝達可能に設けた光源ユ
ニットの装着構造であって、嵌入する放熱ブロックを半
径方向内側に付勢して固定する付勢部材を有しているの
で、放熱ブロックの軸方向位置によって付勢力が変わら
ないので、放熱ブロックを壁部に安定して保持し、熱の
流れがスムーズになる。SUMMARY OF THE INVENTION The present invention is a mounting structure of a light source unit having a heat radiation block on the inner side and a sleeve on the outer side for heat transfer, wherein the heat radiation block to be fitted is biased radially inward. Since it has a biasing member that fixes the heat radiation block, the biasing force does not change depending on the axial position of the heat radiation block, so that the heat radiation block is stably held on the wall portion and the heat flow becomes smooth.
【０００９】この発明によれば、半導体発光素子の放熱
を促し大電流印加による高輝度化が可能な光源ユニット
の装着構造が得られる。According to the present invention, it is possible to obtain the mounting structure of the light source unit which promotes the heat radiation of the semiconductor light emitting element and can achieve the high brightness by applying the large current.
【００１０】[0010]
【発明の実施の形態】請求項１記載の発明は、内側に第
１の電極になる放熱ブロックを設け、前記放熱ブロック
の先部外側に絶縁膜を挟んで第２の電極になるスリーブ
を熱伝達可能に設け、取り付けられた半導体発光素子に
通電可能な光源ユニットの装着構造であって、金属製の
壁部に絶縁体を介して設けられ、前記スリーブが嵌入可
能な取付孔が形成された取付板と、前記壁部に形成され
前記取付孔に連通する取付凹部と、前記取付凹部の周壁
に設けられ、嵌入する前記放熱ブロックを半径方向内側
に付勢して固定する付勢部材と、前記取付孔の周壁に設
けられ、嵌入する前記スリーブを固定する固定部とを有
することを特徴とする光源ユニットの装着構造なので、
付勢部材が放熱ブロックを側方から押圧することにな
り、付勢部材の軸方向位置によらず均一な力で放熱ブロ
ックを保持することができる。According to a first aspect of the present invention, a heat dissipation block to be a first electrode is provided inside, and a sleeve to be a second electrode is heat-treated with an insulating film sandwiched outside a front portion of the heat dissipation block. A mounting structure of a light source unit which is provided so as to be capable of transmitting and which can energize a mounted semiconductor light emitting element, wherein a mounting hole is formed in a metal wall portion through an insulator and into which the sleeve can be fitted. A mounting plate, a mounting recess formed in the wall portion and communicating with the mounting hole, and a biasing member that is provided on the peripheral wall of the mounting recess and biases and fixes the fitted heat radiation block inward in the radial direction, The mounting structure of the light source unit is characterized in that the mounting structure is provided on the peripheral wall of the mounting hole, and has a fixing portion that fixes the sleeve to be fitted.
The biasing member presses the heat dissipation block from the side, and the heat dissipation block can be held with a uniform force regardless of the axial position of the biasing member.
【００１１】請求項２記載の発明は、前記スリーブの外
周には雄ねじが形成され、前記固定部は前記雄ねじに螺
合する雌ねじであることを特徴とする請求項１記載の光
源ユニットの装着構造なので、光源ユニットの抜け落ち
を防止して、確実に固定することができる。According to a second aspect of the present invention, a male screw is formed on the outer circumference of the sleeve, and the fixing portion is a female screw that is screwed into the male screw. Therefore, it is possible to prevent the light source unit from falling off and securely fix it.
【００１２】請求項３記載の発明は、前記付勢部材は、
屈曲した中間部が先側に突出する板ばねであって、複数
設けられていることを特徴とする請求項１又は２記載の
光源ユニットの装着構造であり、光源ユニットを先側か
ら嵌入させようとすると、放熱ブロックの先端が板ばね
に当接、摺動しながら徐々に大きな力を受けるので、取
付時に必要な力の変化を小さくして容易に取り付けるこ
とができる。According to a third aspect of the present invention, the biasing member is
The mounting structure of a light source unit according to claim 1 or 2, wherein the bent middle portion is a leaf spring projecting to the front side, and a plurality of leaf springs are provided, and the light source unit is fitted from the front side. In this case, the tip of the heat dissipation block gradually receives a large force while coming into contact with and sliding on the leaf spring, so that the change in the force required at the time of attachment can be reduced and the attachment can be easily performed.
【００１３】請求項４記載の発明は、前記固定部は嵌入
する前記スリーブを半径方向内側に付勢して固定する先
部付勢部材であることを特徴とする請求項１記載の光源
ユニットの装着構造であり、光源ユニットの軸方向の２
カ所を半径方向に固定して容易に着脱することができ
る。According to a fourth aspect of the present invention, in the light source unit according to the first aspect, the fixing portion is a front portion urging member that urges and fixes the fitted sleeve by radially inwardly. It is a mounting structure, and is 2 in the axial direction of the light source unit.
It can be easily attached and detached by fixing the location in the radial direction.
【００１４】（第１実施形態）図１は本発明の第１の実
施の形態に係る光源ユニットの装着構造の縦断面図であ
る。まず、光源ユニット１１について説明する。(First Embodiment) FIG. 1 is a longitudinal sectional view of a mounting structure of a light source unit according to a first embodiment of the present invention. First, the light source unit 11 will be described.
【００１５】光源ユニット１１は、ＧａＮ系化合物半導
体をサファイア基板に積層した青色発光の４台の半導体
発光素子１の表面をたとえば（Ｙ，Ｇｄ）3（Ａｌ，Ｇ
ａ）5Ｏ12：Ｃｅ等の蛍光物質を含む樹脂パッケージで
封止した光源を備えたものである。このように青色発光
の半導体発光素子１を蛍光物質を含む樹脂パッケージで
封止することにより、半導体発光素子１からの光が波長
変換されて白色発光として取り出される。The light source unit 11 includes, for example, (Y, Gd) 3 (Al, G) on the surfaces of four blue light emitting semiconductor light emitting devices 1 each having a GaN compound semiconductor laminated on a sapphire substrate.
a) A light source sealed with a resin package containing a fluorescent substance such as 5 O 12 : Ce. By thus sealing the blue light emitting semiconductor light emitting device 1 with the resin package containing the fluorescent substance, the light from the semiconductor light emitting device 1 is wavelength-converted and extracted as white light emission.
【００１６】４台の半導体発光素子１は静電気保護用の
ツェナーダイオードなどを利用したサブマウント素子２
にそれぞれ導通搭載されている。このサブマウント素子
２は熱伝導のよいＳｉから成り、図示のように放熱ブロ
ック３の上端にＡｇペーストを介して導通搭載されてい
る。この放熱ブロック３はＡｌやＡｇやＣｕまたはこれ
らの金属を少なくとも１つ含む合金等のように熱伝導率
の高い金属を素材としたもので、下端部を除く外周には
絶縁膜４を介して円筒状の金属のスリーブ５を放熱ブロ
ック３に対して熱伝達可能に外挿している。このスリー
ブ５は外周に雄ねじ５ａを形成したもので、各サブマウ
ント素子２との間をワイヤ２ａによってボンディングし
ている。なお、放熱ブロック３は半導体発光素子１のｐ
側電極と導通する第１の電極になり、スリーブ５は半導
体発光素子１のｎ側電極と導通する第２の電極になる。The four semiconductor light emitting devices 1 are submount devices 2 using a Zener diode or the like for electrostatic protection.
Each is equipped with conduction. The submount element 2 is made of Si having good heat conduction, and is conductively mounted on the upper end of the heat dissipation block 3 via Ag paste as shown in the figure. The heat dissipation block 3 is made of a metal having a high thermal conductivity such as Al, Ag, Cu or an alloy containing at least one of these metals, and an insulating film 4 is provided on the outer periphery except the lower end. A cylindrical metal sleeve 5 is externally attached to the heat dissipation block 3 so as to be able to transfer heat. The sleeve 5 is formed with a male screw 5a on the outer circumference, and is bonded to each submount element 2 by a wire 2a. In addition, the heat dissipation block 3 is p of the semiconductor light emitting device 1.
The sleeve 5 serves as a first electrode that conducts with the side electrode, and the sleeve 5 serves as a second electrode that conducts with the n-side electrode of the semiconductor light emitting element 1.
【００１７】また、放熱ブロック３及びスリーブ５の上
端には、半導体発光素子１及びワイヤ２ａを含んで封止
するエポキシの樹脂パッケージ６が一体化されている。An epoxy resin package 6 for encapsulating the semiconductor light emitting element 1 and the wire 2a is integrated with the upper ends of the heat dissipation block 3 and the sleeve 5.
【００１８】次に光源ユニットの装着構造Ａについて説
明する。Next, the mounting structure A of the light source unit will be described.
【００１９】光源ユニット１１は金属製の壁部１２に取
り付けられる。壁部１２は導電性を有し、少なくとも一
部（例えば上部）に平面を備え、平面には放熱ブロック
３より外径が大きい取付凹部１６が形成されている。The light source unit 11 is attached to the metal wall 12. The wall portion 12 has conductivity, and at least a part (for example, an upper portion) thereof has a flat surface, and a mounting recess 16 having an outer diameter larger than that of the heat dissipation block 3 is formed on the flat surface.
【００２０】壁部１２の上部には、取付凹部１６に重合
する孔部を備えた絶縁体１３が設けられ、絶縁体１３の
上部には、取付凹部１６に連通する取付孔１４を備え、
導電性を有する取付板１５が設けられている。取付孔１
４の周壁には、スリーブ５の雄ねじ５ａに螺合する固定
部の一例である雌ねじ１７が形成されている。An insulator 13 having a hole that overlaps with the mounting recess 16 is provided on the upper portion of the wall 12, and a mounting hole 14 communicating with the mounting recess 16 is provided on the upper portion of the insulator 13.
A mounting plate 15 having conductivity is provided. Mounting hole 1
A female screw 17, which is an example of a fixing portion that is screwed into the male screw 5 a of the sleeve 5, is formed on the peripheral wall of the sleeve 4.
【００２１】取付凹部１６の周壁の対向する２箇所以上
には、付勢部材の一例である板ばね１８が設けられてい
る。それぞれの板ばね１８は、屈曲した中間部が先側に
突出する逆Ｖ字状又は逆Ｕ字状に形成され、嵌入する放
熱ブロック３を半径方向内側に付勢して固定することが
できる。Leaf springs 18, which are an example of a biasing member, are provided at two or more opposing locations on the peripheral wall of the mounting recess 16. Each of the leaf springs 18 is formed in an inverted V-shape or an inverted U-shape in which a bent middle portion protrudes to the front side, and the fitted heat radiation block 3 can be biased and fixed inward in the radial direction.
【００２２】光源ユニット１１を壁部１２に取り付ける
時には、まず、放熱ブロック３を取付孔１４に挿通さ
せ、取付凹部１６に少し嵌入させる。次いで、スリーブ
５の雄ねじ５ａを取付孔１４の雌ねじ１７に螺合させ
る。このとき、放熱ブロック３は、回転しながら取付凹
部１６の底部に向かって徐々に移動し、当接する板ばね
１８から半径方向内側に向かって付勢される。このよう
にして取付を行うことによって、壁部１２は、板ばね１
８を介して放熱ブロック３に通電可能に接続し、取付板
１５は、スリーブ５に通電可能に接続される。When the light source unit 11 is attached to the wall portion 12, first, the heat radiation block 3 is inserted into the attachment hole 14 and slightly inserted into the attachment recess 16. Next, the male screw 5 a of the sleeve 5 is screwed into the female screw 17 of the mounting hole 14. At this time, the heat dissipation block 3 gradually moves toward the bottom of the mounting recess 16 while rotating, and is biased radially inward from the abutting leaf spring 18. By mounting in this way, the wall portion 12 becomes the leaf spring 1.
The heat dissipation block 3 is connected to the heat dissipating block 3 via 8 and the mounting plate 15 is connected to the sleeve 5 so as to be conductive.
【００２３】板ばね１８は放熱ブロック３を半径方向内
側に付勢するので、放熱ブロック３が所定位置より取付
凹部１６の底側に移動しすぎても、塑性変形することが
なく、付勢力を一定にして通電状態を安定的に保持する
と共に板ばねの寿命を長くすることができる。また、放
熱ブロック３を取付凹部１６の底部に当接させることが
できるので、放熱ブロック３から壁部１２への放熱を効
率よく行うことができる。Since the leaf spring 18 urges the heat radiating block 3 inward in the radial direction, even if the heat radiating block 3 moves too much from the predetermined position to the bottom side of the mounting recess 16, it will not be plastically deformed and will exert an urging force. It is possible to keep the energized state stable by keeping it constant and to extend the life of the leaf spring. Further, since the heat dissipation block 3 can be brought into contact with the bottom of the mounting recess 16, heat dissipation from the heat dissipation block 3 to the wall 12 can be efficiently performed.
【００２４】（第２実施形態）図２は本発明の第２の実
施の形態に係る光源ユニットの装着構造の縦断面図であ
る。装着構造Ｂは、前述した装着構造Ａで用いたねじ結
合の代わりに付勢手段による結合方式を用いたもので、
その他の同一部材については同一番号を付して説明は省
略する。(Second Embodiment) FIG. 2 is a vertical sectional view of a mounting structure of a light source unit according to a second embodiment of the present invention. The mounting structure B uses a coupling method using biasing means instead of the screw coupling used in the mounting structure A described above.
The other same members are denoted by the same reference numerals and the description thereof will be omitted.
【００２５】光源ユニット１９は、スリーブ５の雄ねじ
５ａを省略した円筒形のスリーブ２０を有している。ま
た、取付板２１の取付孔２２には雌ねじ１７が形成され
ておらず、スリーブ２０の外径より大きな周壁には、板
ばね１８と同形状の先部付勢部材の一例である板ばね２
３が設けられている。The light source unit 19 has a cylindrical sleeve 20 in which the male screw 5a of the sleeve 5 is omitted. Further, the female screw 17 is not formed in the mounting hole 22 of the mounting plate 21, and the leaf spring 2 which is an example of the tip biasing member having the same shape as the leaf spring 18 is formed on the peripheral wall larger than the outer diameter of the sleeve 20.
3 is provided.
【００２６】光源ユニット１９を壁部１２に取り付ける
時には、まず、放熱ブロック３を取付孔２２に挿通さ
せ、取付凹部１６に少し嵌入させる。このとき、放熱ブ
ロック３は、板ばね１８に当接し、スリーブ２０は板ば
ね２３に当接する。次に、光源ユニット１９を取付凹部
１６の底部に向けて押圧すると、放熱ブロック３及びス
リーブ２０は、当接する板ばね１８，２３から半径方向
内側に向かって付勢される。When mounting the light source unit 19 on the wall portion 12, first, the heat radiation block 3 is inserted into the mounting hole 22 and slightly fitted into the mounting recess 16. At this time, the heat dissipation block 3 contacts the plate spring 18, and the sleeve 20 contacts the plate spring 23. Next, when the light source unit 19 is pressed toward the bottom of the mounting recess 16, the heat dissipation block 3 and the sleeve 20 are biased inward in the radial direction from the leaf springs 18 and 23 that abut.
【００２７】このようにして取付を行うことによって、
壁部１２は、板ばね１８を介して放熱ブロック３に通電
可能に接続し、取付板２１は、板ばね２３を介してスリ
ーブ２０に通電可能に接続される。光源ユニット１９を
回転させずに軸方向に移動することができるので、放熱
ブロック及びスリーブの外形を断面円形に限らず任意の
形状に形成することができ、例えば、正方形や六角形に
形成することができ、また、外周に突起部等を設けて取
付の向きを規制することもできる。また、取付凹部１６
及び取付孔２２の周壁には、放熱ブロック３及びスリー
ブ５の半径方向への位置ずれを防止する板状突起を設け
ることも可能である。さらに絶縁体２４を硬質の板状部
材で形成し、取付凹部１６及び取付孔２２に連通する貫
通孔の大きさを、放熱ブロック３を位置決めしながら嵌
入可能な大きさに形成することも可能である。By mounting in this way,
The wall portion 12 is electrically connected to the heat dissipation block 3 via a leaf spring 18, and the mounting plate 21 is electrically connected to the sleeve 20 via a leaf spring 23. Since the light source unit 19 can be moved in the axial direction without rotating, the outer shape of the heat dissipation block and the sleeve can be formed in any shape without being limited to a circular cross section, for example, formed in a square or a hexagon. Further, it is possible to regulate the mounting direction by providing a protrusion or the like on the outer circumference. In addition, the mounting recess 16
It is also possible to provide plate-shaped projections on the peripheral wall of the mounting hole 22 to prevent the radial displacement of the heat dissipation block 3 and the sleeve 5. Further, the insulator 24 may be formed of a hard plate-like member, and the size of the through hole communicating with the mounting recess 16 and the mounting hole 22 may be set to a size that can be fitted while positioning the heat dissipation block 3. is there.
【００２８】（第３実施形態）図３は本発明の第３の実
施の形態に係る光源ユニットの装着構造の縦断面図であ
る。装着構造Ｃは、前述した装着構造Ｂの放熱ブロック
と壁部の固定に用いた付勢手段の代わりにねじ結合を用
いたもので、その他の同一部材については同一番号を付
して説明は省略する。(Third Embodiment) FIG. 3 is a vertical sectional view of a mounting structure of a light source unit according to a third embodiment of the present invention. The mounting structure C uses screw coupling instead of the biasing means used for fixing the heat dissipation block and the wall portion of the mounting structure B described above, and other same members are denoted by the same reference numerals and description thereof is omitted. To do.
【００２９】光源ユニット２９の放熱ブロック２５の基
部には雄ねじ２６が形成され、壁部２７には雄ねじ２６
に螺合する雌ねじ２８が形成されている。A male screw 26 is formed on the base of the heat dissipation block 25 of the light source unit 29, and a male screw 26 is formed on the wall 27.
A female screw 28 that is screwed into the is formed.
【００３０】かかる構成によって、放熱ブロック２５と
壁部２７の接触面積が広くなり、放熱がさらに大きくな
る。With this structure, the contact area between the heat dissipation block 25 and the wall portion 27 is increased, and heat dissipation is further increased.
【００３１】[0031]
【発明の効果】本発明では、取付凹部の周壁に設けら
れ、嵌入する前記放熱ブロックを半径方向内側に付勢し
て固定する付勢部材を有しているので、付勢部材が放熱
ブロックを側方から押圧することになり、付勢部材の軸
方向位置によらず均一な力で放熱ブロックを保持するこ
とができ、また、付勢部材の大きな変形を防止して装置
寿命を長くすることができる。According to the present invention, since there is a biasing member which is provided on the peripheral wall of the mounting recess and biases and fixes the fitted heat radiation block inward in the radial direction, the biasing member acts as the heat radiation block. Since the pressure is applied from the side, the heat dissipation block can be held with a uniform force regardless of the axial position of the biasing member, and the deformation of the biasing member can be prevented to prolong the life of the device. You can
【００３２】前記取付凹部の底部に放熱ブロックを当接
させることにより、放熱効率を向上させることができ
る。The heat dissipation efficiency can be improved by bringing the heat dissipation block into contact with the bottom of the mounting recess.
【００３３】また、スリーブの外周に雄ねじを形成し、
固定部を雌ねじにすることにより、光源ユニットの抜け
落ちを防止し確実に固定することができる。A male screw is formed on the outer circumference of the sleeve,
By using a female screw for the fixing portion, the light source unit can be prevented from coming off and can be securely fixed.
【００３４】前記付勢部材を板ばねで構成することによ
り構造を簡単にし、取付時に必要な力の変化を小さくし
て容易に取り付けることができる。By constructing the biasing member with a leaf spring, the structure can be simplified, and the change in force required at the time of mounting can be reduced, so that the mounting can be easily performed.
【００３５】前記固定部を先部付勢部材にして、光源ユ
ニットの軸方向の２カ所を半径方向に固定することによ
り、着脱を容易にすることができる。By using the fixing portion as the front biasing member and fixing the two positions in the axial direction of the light source unit in the radial direction, the attachment / detachment can be facilitated.
【図１】本発明の第１実施の形態における光源ユニット
の装着構造の縦断面図FIG. 1 is a vertical sectional view of a mounting structure of a light source unit according to a first embodiment of the present invention.
【図２】本発明の第２実施の形態における光源ユニット
の装着構造の縦断面図FIG. 2 is a vertical cross-sectional view of a light source unit mounting structure according to a second embodiment of the present invention.
【図３】本発明の第３実施の形態における光源ユニット
の装着構造の縦断面図FIG. 3 is a vertical cross-sectional view of a light source unit mounting structure according to a third embodiment of the present invention.
【図４】従来の半導体発光装置の縦断面図FIG. 4 is a vertical sectional view of a conventional semiconductor light emitting device.
１ 半導体発光素子 ２ サブマウント素子 ２ａ ワイヤ ３ 放熱ブロック ４ 絶縁膜 ５ スリーブ ５ａ 雄ねじ ６ 樹脂パッケージ １１ 光源ユニット １２ 壁部 １３ 絶縁体 １４ 取付孔 １５ 取付板 １６ 取付凹部 １７ 雌ねじ（固定部） １８ 板ばね（先部付勢部材） １９ 光源ユニット ２０ スリーブ ２１ 取付板 ２２ 取付孔 ２３ 板ばね（先部付勢部材） ２４ 絶縁体 ２５ 放熱ブロック ２６ 雄ねじ ２７ 壁部 ２８ 雌ねじ ２９ 光源ユニット Ａ 装着構造 Ｂ 装着構造 Ｃ 装着構造 1 Semiconductor light emitting element 2 Submount element 2a wire 3 heat dissipation block 4 insulating film 5 sleeve 5a male screw 6 resin package 11 Light source unit 12 walls 13 Insulator 14 mounting holes 15 Mounting plate 16 Mounting recess 17 Female screw (fixed part) 18 Leaf spring (tip biasing member) 19 Light source unit 20 sleeve 21 Mounting plate 22 Mounting hole 23 Leaf spring (tip biasing member) 24 insulator 25 heat dissipation block 26 Male screw 27 wall 28 female screw 29 Light source unit A mounting structure B mounting structure C mounting structure
Claims (4)
設け、前記放熱ブロックの先部外側に絶縁膜を挟んで第
２の電極になるスリーブを熱伝達可能に設け、取り付け
られた半導体発光素子に通電可能な光源ユニットの装着
構造であって、 金属製の壁部に絶縁体を介して設けられ、前記スリーブ
が嵌入可能な取付孔が形成された取付板と、 前記壁部に形成され前記取付孔に連通する取付凹部と、 前記取付凹部の周壁に設けられ、嵌入する前記放熱ブロ
ックを半径方向内側に付勢して固定する付勢部材と、 前記取付孔の周壁に設けられ、嵌入する前記スリーブを
固定する固定部とを有することを特徴とする光源ユニッ
トの装着構造。1. A semiconductor light emitting device provided with a heat radiation block serving as a first electrode provided inside and a sleeve serving as a second electrode provided outside the front portion of the heat radiation block with an insulating film interposed therebetween for heat transfer. A mounting structure of a light source unit capable of energizing an element, the mounting plate being provided in a metal wall portion via an insulator and having a mounting hole into which the sleeve can be fitted, and a mounting plate formed in the wall portion. A mounting recess that communicates with the mounting hole, a biasing member that is provided on a peripheral wall of the mounting recess and biases and fixes the fitted heat radiation block inward in the radial direction, and a mounting wall provided on the peripheral wall of the mounting hole. And a fixing portion for fixing the sleeve.
れ、前記固定部は前記雄ねじに螺合する雌ねじであるこ
とを特徴とする請求項１記載の光源ユニットの装着構
造。2. The mounting structure for a light source unit according to claim 1, wherein a male screw is formed on the outer circumference of the sleeve, and the fixing portion is a female screw screwed to the male screw.
に突出する板ばねであって、複数設けられていることを
特徴とする請求項１又は２記載の光源ユニットの装着構
造。3. The mounting structure for a light source unit according to claim 1, wherein the urging member is a leaf spring having a bent intermediate portion protruding forward and is provided in plural.
径方向内側に付勢して固定する先部付勢部材であること
を特徴とする請求項１記載の光源ユニットの装着構造。4. The mounting structure for a light source unit according to claim 1, wherein the fixing portion is a front portion biasing member that biases and fixes the fitted sleeve by radially inwardly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001268477A JP4701565B2 (en) | 2001-09-05 | 2001-09-05 | Light source unit mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001268477A JP4701565B2 (en) | 2001-09-05 | 2001-09-05 | Light source unit mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003078174A true JP2003078174A (en) | 2003-03-14 |
| JP4701565B2 JP4701565B2 (en) | 2011-06-15 |
Family
ID=19094453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001268477A Expired - Fee Related JP4701565B2 (en) | 2001-09-05 | 2001-09-05 | Light source unit mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4701565B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136224A (en) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | Light emitting diode lighting module |
| WO2005091390A1 (en) * | 2004-03-18 | 2005-09-29 | Showa Denko K.K. | Group iii nitride semiconductor light-emitting device and producing method thereof |
| JP2006032804A (en) * | 2004-07-20 | 2006-02-02 | Koha Co Ltd | Light emitting device and manufacturing method thereof |
| JP2010506410A (en) * | 2006-10-10 | 2010-02-25 | ネオバルブ テクノロジーズ，インコーポレイテッド | Powerful semiconductor light-emitting module with thermal separation |
| JP2011519148A (en) * | 2007-12-13 | 2011-06-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Light emitting diode attached to heat sink |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5038476B1 (en) * | 1969-04-23 | 1975-12-10 | ||
| JPS61137376A (en) * | 1984-12-07 | 1986-06-25 | エヌ・ベー・フイリツプス・フルーイランペンフアブリケン | Light emitting element matrix and manufacture thereof |
| WO2001057937A1 (en) * | 2000-02-04 | 2001-08-09 | Lumileds Lighting, U.S., Llc | Concentrically leaded power semiconductor device package |
-
2001
- 2001-09-05 JP JP2001268477A patent/JP4701565B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5038476B1 (en) * | 1969-04-23 | 1975-12-10 | ||
| JPS61137376A (en) * | 1984-12-07 | 1986-06-25 | エヌ・ベー・フイリツプス・フルーイランペンフアブリケン | Light emitting element matrix and manufacture thereof |
| WO2001057937A1 (en) * | 2000-02-04 | 2001-08-09 | Lumileds Lighting, U.S., Llc | Concentrically leaded power semiconductor device package |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136224A (en) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | Light emitting diode lighting module |
| WO2005091390A1 (en) * | 2004-03-18 | 2005-09-29 | Showa Denko K.K. | Group iii nitride semiconductor light-emitting device and producing method thereof |
| JP2006032804A (en) * | 2004-07-20 | 2006-02-02 | Koha Co Ltd | Light emitting device and manufacturing method thereof |
| JP2010506410A (en) * | 2006-10-10 | 2010-02-25 | ネオバルブ テクノロジーズ，インコーポレイテッド | Powerful semiconductor light-emitting module with thermal separation |
| US8193553B2 (en) | 2006-10-10 | 2012-06-05 | Neobulb Technologies, Inc. | Semiconductor high-power light-emitting module with heat isolation |
| JP2011519148A (en) * | 2007-12-13 | 2011-06-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Light emitting diode attached to heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4701565B2 (en) | 2011-06-15 |
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