JP2002190697A - Surface mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface mounting device, capable of surely grasping the state of the nozzle of a mounting head, and surely urging an operator to execute correctional processings, when a defective state such as foreign matter adhesion is detected. SOLUTION: A component absorbed by a merchandise supply part 4 is mounted at the prescribed position of a printed circuit board 3, by driving a head unit 5 on which a mounting head having a nozzle is mounted. After the component is mounted, the head unit 5 is moved to a first camera 21 so that the top end face of the nozzle from which the component is separated is imaged, and the presence of the absence of adhering foreign matter such as solder to the top end face of the nozzle is determined, based on the imaged picture. For example, the luminance of the imaged picture of the component absorbing part is checked, and when the changing area of the luminance exceeds a prescribed set rate to the picture area of the component attracting part, it is determined that the component attracting part is turned into a defective state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter configured to adsorb an electronic component by a mounting head having a component adsorption portion and mount the electronic component at a predetermined position on a substrate such as a printed circuit board. .

[0002]

2. Description of the Related Art Conventionally, a mounting unit is mounted on a head unit movable between a component suction unit and a component mounting unit, and components such as ICs are suctioned from a component supply unit by the mounting head to mount components. 2. Description of the Related Art There is generally known a surface mounter configured to be transferred onto a printed circuit board arranged in a unit and mounted on a predetermined position of the printed circuit board.

In such a surface mounter, a nozzle for picking up components is attached to the tip of the mounting head.
The component is sucked by applying a negative pressure supplied to the component suction portion at the tip of the nozzle to the component.

After the component is sucked by the nozzle of the mounting head in the component supply unit, a component recognition process is performed while the component is transferred to the printed circuit board. After the component recognition process, the component recognition process is performed on the printed circuit board. Mounting is performed. In the component recognition process, a component in a state where the component is sucked by the nozzle is imaged by a component recognition camera, and the quality of the component and the component suction state is determined and position correction data is obtained. Based on this component recognition processing, if it is determined that the component is defective or the component suction state is defective, the suction component is discarded. If the component and the component suction state are good, the component is corrected by the position correction data. The component is mounted at the mounting position.

[0005]

When mounting the components adsorbed on the nozzle on a printed circuit board, foreign matter such as solder or chip electrode residue for mounting the components on the printed circuit board is attached to the tip of the nozzle. May adhere. In particular, when the suction target component is a small component that is smaller than the suction surface at the tip of the nozzle, it is considered that the above-mentioned solder adhesion is likely to occur. Then, if the mounting operation is continued while such foreign matter is attached to the suction surface of the nozzle, there is a possibility that components are not mounted or mounting failure occurs. In other words, if the component fails to be picked up during component suction and the component recognition process is performed with the component not picked up, there is a possibility that the component is erroneously recognized as being present due to the foreign matter attached to the nozzle,
In this case, as a result of the mounting operation being performed as it is, non-mounting may occur. Further, even if the component is sucked, if the component is sucked in a state where the foreign matter adheres, the identification becomes inaccurate in the component recognition process, and the displacement of the component mounting position or the like is reduced. There is a possibility that it will occur. Furthermore, even after the component mounting process due to the above-mentioned solder attachment, if the next component suction operation is performed while the component remains attached to the nozzle without leaving the nozzle, new component suction becomes impossible. There is also a possibility that the components of the next process may not be mounted.

The present invention has been made in view of such circumstances, and an object of the present invention is to make it possible to reliably grasp the state of a component suction portion of a mounting head, and to detect a defect such as adhesion of a foreign substance. An object of the present invention is to provide a surface mounter that can surely prompt an operator to take corrective action when a situation occurs.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, according to the present invention, a component in a component supply section is suctioned by a mounting head having a component suction section, and the mounting head is moved to a component mounting section. In the surface mounter that mounts the mounting head on the printed circuit board of the component mounting section after the mounting, the component suction section of the head is mounted within a period from the mounting or disposal of the component by the head to the next suction of the component. And a determination unit that determines whether the state of the component suction unit after mounting or disposal of the component is good or bad based on an imaging result of the component suction unit captured by the image capturing unit. (Claim 1).

According to the present invention, after the head unit mounts, for example, the picked-up component to the board, the head unit moves from the board position to the component supply unit in order to pick up the next component. Is picked up by the image pickup means, and based on the image pickup result of the picked-up part suction part, the quality of the state of the part suction part is judged by the judgment means. For this reason, the state of the component suction portion of the head is reliably grasped, and the mounting of components by the head unit is repeatedly performed while maintaining a good state.

In the present invention, a notification means may be provided for notifying that the component suction section is in a defective state when the component suction section is determined to be in a defective state by the determination means. ). Thus, when the determination unit determines that the component suction unit is in the defective state, the notification unit notifies the worker that the correction process of the component suction unit is necessary, and performs the correction process. Execution can be encouraged without fail. Note that the imaging means may be arranged in a movement path between the suction by the component supply unit of the head unit and the mounting on the substrate.

The determining means checks the luminance of the picked-up image of the component suction portion, and determines that foreign matter has adhered to the component suction portion when there is a luminance change area. (Claim 3) is preferred.

[0011] By doing so, it is possible to specifically determine the quality of the component suction section. That is,
If a foreign matter such as a solder residue adheres to the component suction part, the image area of the foreign matter becomes dark when the illumination light is applied to the component suction part from the facing direction or the orthogonal direction for imaging by the imaging unit. Thus, the image area can be distinguished from the image area of the component suction unit in a normal state in which no foreign matter is adhered. For this reason, by judging the captured image based on the change in luminance, it is possible to specifically determine the quality of the component suction unit based on the presence or absence of foreign matter adhesion.

Further, if the determining means is configured to determine that the component suction unit is in a defective state when the luminance change area exceeds a predetermined set ratio with respect to the image area of the component suction unit. Item 4), even if foreign matter is attached, it is possible to determine whether the mounting operation is not hindered or the mounting operation is defective.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view schematically showing a first embodiment of the surface mounter according to the present invention, and FIG. 2 is a partially omitted side view thereof. 1 and 2, on a base 1, a conveyor 2 for transporting substrates is arranged.
A printed board (indicated by a dashed line) 3 serving as a board is conveyed and stopped at a predetermined mounting position.

A component supply section 4 is arranged on the side of the conveyor 2. The component supply unit 4 includes, for example, a plurality of rows of tape feeders 4a.

A head unit 5 for mounting components is provided above the base 1 so that the head unit 5 can pick up (suck) components from the component supply unit 4 and mount them on the printed circuit board 3. In addition, it is driven so as to be movable in an X-axis direction (a direction in which the conveyor 2 extends) and a Y-axis direction (a direction orthogonal to the X-axis on a horizontal plane).

More specifically, a pair of guide rails 6 extending in the Y-axis direction are provided on the base 1, and a head unit support member 7 is mounted on the guide rails 6. The head unit support member 7 is connected to the Y
The ball screw shaft 9 is screwed with the ball screw shaft 9 in the axial direction, and the ball screw shaft 9 is connected to the rotation shaft of the Y-axis servo motor 10.

The head unit supporting member 7 has a guide member 11 (see FIG. 2) extending in the X-axis direction and a ball screw shaft 12 in the X-axis direction, so that the head unit 5 can be moved by the guide member 11. While being supported, a nut portion 13 provided on the head unit 5 is screwed to the ball screw shaft 12. The ball screw shaft 12 is supported by a proximal bearing member 18 provided at the right end of the guide member 11 in FIG. 2 and a distal bearing member 19 provided at the left end of the guide member 11 in FIG. The X-axis servo motor 14 rotates around the axis by being connected to the 14 rotation shafts.

Thus, the head unit supporting member 7 is driven in the Y-axis direction by the Y-axis servo motor 10 via the ball screw shaft 9, and the head unit 5 is driven by the X-axis servo motor 14 via the ball screw shaft 12. Driving in the X-axis direction is performed.

A component mounting head 15 (see FIG. 2) for picking up components is mounted on the head unit 5, and the head 15 is mounted on the Z-axis servo motor 1.
6 up and down direction (Z axis direction)
, And is driven in the rotation direction (R-axis direction) by a rotation drive mechanism using the R-axis servo motor 17 as a drive source. FIG. 2 shows the head 1
Reference numeral 5 denotes an example of a multiple head in which three units are successively installed in the X-axis direction, and each head 15 can be individually driven in the Z-axis direction and the R-axis direction. Then, each of the heads 15
A suction nozzle 15a as a component suction portion is detachably mounted at the tip of the component. The component suctions the component based on the negative pressure supplied to each nozzle 15a, while the component suctions the component based on the supply of the positive pressure. Is to be released.

A first camera as an image pickup means of the present invention for picking up an image of the nozzle 15a at a side position of the conveyor 2 and at an intermediate position between the printed board 3 and the component supply section 4 at the mounting position. 21 (see FIG. 1) and the nozzle 1
A second camera 22 for picking up an image of the component sucked by 5a and a nozzle replacement station 23 in which a replacement nozzle is accommodated are provided.

As the first camera 21, a line sensor camera may be used when each of the multiple heads 15 is imaged as one image. When taking an image for each head 15, an area sensor camera constituted by a CCD may be used. As the line sensor camera, CCD solid-state imaging devices are arranged in the arrangement direction (X-axis direction) of the heads 15 so that images of all the heads 15, 15,. It is configured. Each of the first and second cameras 21 and 22 has an illuminating unit (not shown). The nozzles 15a or components that have been irradiated with illumination light from the corresponding illuminating unit at the time of imaging are used. The image is picked up and the picked-up image signal is output to the controller 31.

The controller 31 has a microcomputer as a main component, and includes a system control unit, a component recognition unit for performing component recognition and the like, and a nozzle state determination unit as a determination unit. The controller 31 is connected to a monitor 32 serving also as a notifying means. In addition to the status display and command display of each step of the mounting operation, the monitor 32 determines an abnormal state by the nozzle state determination unit or the like. In such a case, an abnormal display or the like is performed under the control of the controller 31.

The system control section controls the operation of the surface mounter as a whole, and picks up components, moves the picked-up components to an image pickup position by the second camera 22, and transfers the components to the printed circuit board 3. In order to perform each operation such as mounting and moving the nozzle 15a after mounting to the imaging position by the first camera 21, each of the Y-axis, X-axis, Z-axis and R-axis servo motors 1
0, 14, 16, and 17 are controlled. In addition, at the time of component mounting, a correction amount for the target mounting position of the component is obtained in accordance with the result of component recognition by the component recognition unit, and drive control of the head unit 5 and the like is performed in consideration of the correction amount.

The component recognizing unit, based on an imaging command signal output from the system control unit when the suction component is moved to the second camera 22, recognizes the component sucked by the nozzle 15a in the second camera 22. And performs predetermined image processing on the captured image data to perform component recognition. Then, based on the product recognition, it is determined whether there is a defect of the component itself or a component suction failure by the nozzle 15a. If there is no defect, the deviation of the component suction position is further examined, and correction data of the mounting position corresponding thereto is obtained. It has become.

The above-mentioned nozzle judging section determines whether or not the component is mounted on the printed circuit board 3 or the defective component is discarded.
After the nozzle 15a is separated from the first camera 2
When the nozzle 15a is moved to 1, the first camera 21 takes an image of the tip end surface of the nozzle 15a based on the imaging command signal output from the system control unit. The quality of the state is determined.

Hereinafter, each processing by the surface mounter will be described with reference to the flowchart of FIG. 3. First, the head unit 5 is moved to the component supply unit 4 and a predetermined nozzle 15a is moved.
A predetermined part is sucked (step S1). On this occasion,
It is determined based on the vacuum pressure whether or not the component has been normally sucked (step S2).
(OK), the process proceeds to the next component recognition operation, and in the case of abnormal suction (non-suction) (NG in step S2), component recognition and mounting are omitted, and the process proceeds to the nozzle recognition operation described later.

In the component recognition operation, after moving the head unit 5 to which the component has been sucked by the component supply unit 4 to the second camera 22, an imaging command signal is output to the component recognition unit (step S3). Component recognition such as component shape recognition is performed based on the image captured by the second camera 22 (Step S)
4) If the component recognition is performed normally (OK in step S4), the process proceeds to the next component mounting operation (component mounting operation), and if it is recognized as a defective component (NG in step S4).
After discarding the component at a predetermined location, the process proceeds to a nozzle recognition operation described later.

In the component mounting operation, the head unit 5 is moved to a predetermined mounting position on the printed circuit board, a component mounting operation is performed at this mounting position, and the component is detached from the nozzle 15a (step S5). Also at this time, it is determined whether or not the component is normally mounted (mounted) by the vacuum pressure (step S6). If the component is normally removed (OK in step S6), the next nozzle is used. The operation shifts to the recognition operation. If the operation is abnormal (NG in step S6), the process proceeds to the next nozzle recognition operation after performing appropriate processing such as discarding of components.

In the nozzle recognition operation, after the head unit 5 after the mounting operation is moved to the first camera 21, an imaging command signal is output to the nozzle determination unit (step S7).
The nozzle 1 based on the image captured by the first camera 21
The quality of the state 5a is determined (step S8). If the state is determined to be good (OK in step S8), the process returns to the suction operation in step S1 and the subsequent processes are repeated to determine that the state is defective. (No in step S8)
, An error stop process of step S9 is performed.

The determination of the state of the nozzle 15a by the above-described nozzle determination unit is performed as follows. For example, nozzle 15
When the illumination light from the illumination unit is irradiated from the side to the front end surface of the point a, the reflected light is reflected in a direction other than the first camera 21. For this reason, the nozzle 15
If a substantially flat surface is maintained without any foreign matter adhering to the front end surface of a, the image of the front end surface captured by the first camera 21 is dark except for the bright portion along the periphery. Become. Conversely, if a foreign object is attached, the reflected light from the foreign object is captured by the first camera 21 and appears bright in the image. An example of such a case will be described below.

That is, the image 5 obtained as shown in FIG.
1 is binarized and the center position 52 of the nozzle 15a is determined by shape recognition by edge search.
A predetermined area corresponding to the tip end surface of the nozzle 15a centered at 2 is set as the determination area 53. The nozzle 15
The determination area 53 corresponding to the type of a is stored in advance,
This may be read.

Next, the luminance of each pixel constituting the determination area 53 is measured, and the number of pixels having a luminance equal to or higher than the set threshold value is detected. Then, it is determined whether or not the ratio of the number of pixels equal to or greater than the set threshold value to the total number of pixels in the determination region 53 is equal to or less than the set ratio. On the other hand, if the ratio exceeds the set ratio, the nozzle 15a is determined to be in a defective state because foreign matter is attached to the nozzle 15a. That is, assuming that the number of pixels equal to or greater than the set threshold is Nbp, the total number of pixels is Ntp, and the set ratio is Ta (%), then (Nbp / Ntp) × 100> Ta (%) Is determined to be in a defective state.

The above-mentioned threshold value may be set based on the luminance when the tip end surface of the nozzle 15a is in a normal state with no foreign matter attached. Further, the setting ratio may be set based on a measurement error or the like.

According to the above determination, if the nozzle 15a
If the solder adheres to a part of the front end surface (regions indicated by 53 and 54 in FIG. 4), each pixel in the regions 53 and 54 becomes brighter with the luminance equal to or higher than the set threshold value. The adhesion of the solder can be determined. In FIG. 4, pixels constituting the image 51 are illustrated as images by dotted lines.

If it is determined that the state is defective,
In step S9, the mounting process by the surface mounter is stopped, and an error is displayed on the monitor 32. This error display is performed by specifying the nozzle 15a and displaying a character or an error code indicating that foreign matter has adhered to the nozzle 15a and cleaning needs to be performed. Will be.

In the above-described embodiment, separate cameras 21 and 22 are provided for the imaging means for nozzle determination for checking the state of the nozzle after mounting or discarding of the component and the imaging means for component recognition after the component is sucked. However, a single camera may also serve as these image pickup means.

FIG. 5 is a plan view schematically showing a second embodiment of the surface mounter according to the present invention. The second embodiment shows a surface mounter that can reduce the tact time required for the mounting operation as compared with the first embodiment. Note that, in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals as in the first embodiment, and detailed description thereof will be omitted.

In FIG. 5, an entrance conveyor 2a is arranged on one side (right side in FIG. 5) of the base 1 as a conveyor for transporting the printed circuit board 3 in the X-axis direction.
The outlet side conveyor 2b is arranged at the other side (the left side in FIG. 5). In addition, between the conveyors 2a and 2b on both sides, a position connecting the conveyors 2a and 2b is Y.
Two sets of Y-axis guide rails 2c and 2d that extend in the axial direction (a direction orthogonal to the X-axis direction) and support the transfer stage 20 so as to be movable in the Y-axis direction are arranged. FIG.
2 shows two sets, but at least one set of Y-axis direction guide rails may be provided.

Then, the printed circuit boards 3 successively conveyed by the entrance side conveyor 2a are transferred to the transfer stages 20, and mounted on the transfer boards 20 while being mounted on the transfer stages 20. After the mounting operation is completed, the printed board 3 is conveyed to the next process by the outlet side conveyor 2b.

One of the guide rails 2c in the Y-axis direction is extended so as to protrude from the line connecting the inlet and outlet conveyors 2a and 2b to one side in the Y-axis direction (upper side in FIG. 5). To the side, a camera 21 ′ that also serves as an imaging unit for nozzle determination and an imaging unit for component recognition, and a component supply unit 4
Are arranged side by side in the X-axis direction. And the above Y
A head unit 5 is disposed at an upper position across the axial guide rail 2c, the camera 21 'and the component supply unit 4 so as to be movable only in the X-axis direction.

Further, the other Y-axis direction guide rail 2d is connected to a line connecting the entrance side and exit side conveyors 2a and 2b.
It is extended so as to protrude to the other side in the axial direction (the lower side in FIG. 5),
On the side of the protruding portion, a camera 21 'serving as an imaging unit for nozzle determination and an imaging unit for component recognition, and a component supply unit 4 are arranged side by side in the X-axis direction. And
The head unit 5 is positioned above the Y-axis direction guide rail 2d, the camera 21 ', and the
It is arranged to be movable only in the axial direction.

Then, for each of the printed circuit boards 3 on the two transfer stages 20, the X of the head unit 5 is
The components sucked from the component supply unit 4 are moved to the printed circuit board 3 by the axial movement and the movement of the transfer stage 20 in the Y-axis direction.
It can be mounted on the desired mounting position above.

More specifically, each Y-axis direction guide rail 2c,
The 2d transfer stage 20 is screwed via a nut 8a to a ball screw shaft 9a extending in the Y-axis direction, and the ball screw shaft 9a is connected to the rotation shaft of the Y-axis servomotor 10a. Then, it is driven in the Y-axis direction by being rotationally driven around the axis.

Further, as shown in FIG. 6, each head unit 5 is supported by a head unit supporting member 7a which extends so as to extend in the X-axis direction. The head unit support member 7a has a guide member 11a and a ball screw shaft 12a extending in the X-axis direction. The head unit 5 is movably supported by the guide member 11a and is provided on the head unit 5. A nut 13a is screwed onto the ball screw shaft 12a. The ball screw shaft 12a is connected to the rotating shaft of the X-axis servo motor 14a, so that the ball screw shaft 12a rotates around the axis by driving of the X-axis servo motor 14a.

In this manner, the printed circuit board 3 on each transfer stage 20 is rotated by the Y-axis
While being driven in the axial direction, each head unit 5 is driven in the X-axis direction by the rotational drive of the X-axis servo motor 14a.

It should be noted that each of the head units 5 has the nozzle 1
5a is mounted on the component mounting head 15 (see FIG. 6), the head 15 is driven vertically by a Z-axis driving means such as a Z-axis servo motor, and an R-axis driving means such as an R-axis servo motor. , Thereby driving in the rotation direction (R-axis direction).

As in the first embodiment, the surface mounter of the second embodiment also has a controller 31 including a system control unit, a nozzle state determination unit as a determination unit, and a component recognition unit for performing component recognition and the like. Is controlled by the That is, the operation of the surface mounter is totally controlled by the system control unit, and the suction of the component, the movement of the suction component to the imaging position by the second camera, the mounting of the component on the printed circuit board 3, and the first after the mounting, are performed. Y to perform each operation such as moving the nozzle 15a to the imaging position of the camera 21
The control of each axis, X axis, Z axis and R axis servomotor is performed. In addition, at the time of component mounting, a correction amount for the target mounting position of the component is obtained in accordance with the result of component recognition by the component recognition unit, and drive control of the head unit 5 and the like is performed in consideration of the correction amount.

Then, according to the flow chart shown in FIG. 3, the components are picked up from the component supply unit 4 and the suction is confirmed (steps S1 and S2), the components are moved onto the camera 21 'for component recognition, and the components are recognized by the component recognition unit. (Step S3
6 and S4), component mounting on the printed circuit board 3 and confirmation of mounting (steps S5 and S6), movement onto the camera 21 'for nozzle state determination, and state determination by the nozzle state determination unit (steps S7 and S8) ) And the nozzle 15a
The error stop process and the notification by the monitor 32 (step S9) when it is determined that foreign matter has adhered to the camera are repeated in the same manner as in the first embodiment.

In the case of the second embodiment described above, the movement of the head unit 5 is only in the X-axis direction.
Even when the state of the nozzle 15a is determined by 1 ', the tact time can be reduced as compared with the first embodiment in which the nozzle 15a is moved in both the X-axis direction and the Y-axis direction.

In the illustrated example of the second embodiment, one camera 21 'serves both as an image pickup means for nozzle determination and an image pickup means for component recognition. However, these image pickup means are provided by separate cameras. And these cameras may be arranged side by side between the component supply unit 4 and the transfer stage 20.

The present invention is not limited to the first and second embodiments, but includes various other embodiments. That is, in the above-described first and second embodiments, the notification by the display using characters or symbols is performed using the monitor 32 as the notification means. However, the present invention is not limited to this. For example, a speaker or a warning light may be provided as the notification means. It is also possible to use a voice notification by a speaker or a notification by lighting / flashing of a warning lamp.

When the nozzle 15a is irradiated with illuminating light from the directly facing direction during imaging for nozzle determination, foreign matter adheres to the tip end surface of the nozzle 15a in the image acquired by the first camera 21. The normal part without the image becomes brighter, and the part with the foreign matter attached (for example, the areas 54 and 55 in FIG. 4) becomes darker. In this case, if the ratio of the number of pixels having a luminance smaller than the set threshold value to the total number of pixels is larger than the set tolerance, it may be determined that a defective state exists.

Further, the nozzle 1 by the nozzle state determination unit
The state determination of 5a is performed by picking up the parts by the head unit 5.
It is performed every time it is attached, but it is not limited to this.
The mounting operation may be performed each time the mounting operation is repeated a predetermined number of times, or may be performed at a desired timing based on a manual operation command.

[0055]

As described above, in the surface mounter of the present invention, the component suction portion of the head is imaged by the head within the period from the mounting or disposal of the component by the head to the subsequent suction of the component. And the state of the component suction unit after mounting or disposal of the component is determined based on the image. Therefore, the state of the component suction unit of the head can be reliably grasped, and the component of the head can be grasped. It is possible to appropriately mount the component repeatedly by the head unit while maintaining the suction unit in a good state.

[Brief description of the drawings]

FIG. 1 is a plan view of a surface mounter according to a first embodiment of the present invention.

FIG. 2 is a partially omitted side view of FIG. 1;

FIG. 3 is a flowchart of a mounting process.

FIG. 4 is an explanatory diagram illustrating an example of an image of a nozzle tip surface.

FIG. 5 is a plan view of a surface mounter according to a second embodiment.

FIG. 6 is a partially omitted arrow view taken along line AA of FIG. 5;

[Explanation of symbols]

 REFERENCE SIGNS LIST 3 printed board 4 component supply unit 5 head unit 15 head 21 first camera (imaging means) 31 controller (judgment means) 32 monitor (notification means)

Claims (4)

[Claims] 1. A mounting head having a component sucking unit sucks a component of a component supply unit, moves the mounting head to a component mounting unit, and then mounts the mounting head on a printed circuit board of the component mounting unit. In the surface mounter, an image pickup means for picking up an image of a component suction portion of the head during a period after mounting or discarding of the component by the head until the next suction of the component, and the component picked up by the image pickup means A surface mounter, comprising: a determination unit configured to determine whether the state of the component suction unit after mounting or discarding the component is good based on an imaging result of the suction unit. 2. The apparatus according to claim 1, further comprising a notifying unit for notifying that the component suction unit is in the defective state when the determination unit determines that the component suction unit is in the defective state. Surface mounting machine. 3. The judging means is configured to check the brightness of the picked-up image of the component suction unit, and to determine that foreign matter has adhered to the component suction unit when there is a luminance change area. The surface mounter according to claim 1 or 2, wherein: 4. The method according to claim 1, wherein the determining unit determines that the component suction unit is in a defective state when the brightness change area exceeds a predetermined ratio with respect to the image area of the component suction unit. The surface mounting machine according to claim 3, wherein