JP2002175906A - Resistance element and nonreversible circuit element and communications equipment using the - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistance element which can be joined to external circuit electrodes, arranged on the upper and lower surfaces of the element with high stability and high junction reliability, and to provide a nonreversible circuit element and communications equipment using the element. SOLUTION: This resistance element 1 has an insulation substrate 17, terminal electrodes 18 and 19 for junction respectively provided on the facing main surfaces of the substrate 17, and a resistor R which is provided on one side face of the substrate 17 and electrically connects the electrodes 18 and 19 to each other. The area of the terminal electrode 19 on the mounting side of the element 1 is almost equal to the areas of the main surfaces of the substrate 17. The terminal electrode 18 is electrically connected to one of the external circuit electrodes, arranged on the top face of the element 1, and the electrode 19 is electrically connected to the other external circuit electrode arranged on the bottom face of the element 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resistance element, a non-reciprocal circuit element using the same, and a communication device.

[0002]

2. Description of the Related Art As shown in FIG.
0 denotes an insulating substrate 201 and bonding terminal electrodes 202 and 20
3 and a resistor R. The resistance element 200 includes a pair of bonding terminal electrodes 202 and 20 on both ends of the insulating substrate 201.
3 is formed, and a resistor R is formed on the surface of the insulating substrate 201 so as to electrically connect the joining terminal electrodes 202 and 203.

[0003]

SUMMARY OF THE INVENTION
Has a structure that is convenient for joining the bonding terminal electrodes 202 and 203 to an electrode pattern formed on the same surface (on a horizontal plane) of a printed circuit board or the like and mounting it on a printed circuit board or the like. That is, the resistance element 200 can be mounted with good stability in a horizontal state.

However, a resistance element 200 is arranged between external circuit electrodes arranged one above the other (in the vertical direction),
When the joining terminal electrodes 202 and 203 are electrically joined to the external circuit electrodes, it is necessary to mount the resistance element 200 in a vertically installed state. However, since the resistance element 200 mounted vertically has a high center of gravity and a small junction area with the upper external circuit electrode and the lower external circuit electrode, the stability is poor.
Poor joint reliability. Therefore, the conventional resistance element 200 is
This structure is inconvenient for mounting between external circuit electrodes arranged vertically.

Accordingly, an object of the present invention is to provide a resistance element having excellent stability and bonding reliability in bonding with external circuit electrodes arranged above and below, a non-reciprocal circuit element using the same, and a communication device. It is in.

[0006]

In order to achieve the above object, a resistive element according to the present invention is provided on each of (a) an insulating substrate and (b) opposing main surfaces of the insulating substrate. A terminal electrode for bonding, and (c) a resistor provided on a side surface of the insulating substrate and electrically connected to each of the terminal electrodes for bonding.

[0007] With the above configuration, since the joining terminal electrodes are provided on the opposing main surfaces of the insulating substrate, when the resistive elements are mounted between the external circuit electrodes arranged above and below, the resistive elements need to be arranged vertically. And is electrically connected to the external circuit electrodes on the upper and lower surfaces of the resistance element with good stability.

Further, by making the area of the bonding terminal electrode on the mounting side substantially the same as the area of the main surface of the insulating substrate, a sufficient bonding area is ensured, so that the bonding reliability is further improved.

Further, the non-reciprocal circuit device and the communication device according to the present invention have improved reliability by including the resistive element having the above-described characteristics.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a resistance element, a non-reciprocal circuit element, and a communication device according to the present invention will be described with reference to the accompanying drawings. In each embodiment, the same components and the same portions are denoted by the same reference numerals, and a duplicate description will be omitted.

[First Embodiment, FIG. 1] FIG. 1 shows an external perspective view of a resistance element according to the present invention. The resistance element 1 is formed on both main surfaces of an insulating substrate 17 by thick film printing or the like by using bonding terminal electrodes 18,
19, a resistor R of a cermet-based, carbon-based, ruthenium-based or other thick film or metal thin film is formed on one side surface of the insulating substrate 17.

The bonding terminal electrode 19 on the mounting side has the same surface area as the lower main surface of the insulating substrate 17. That is, the bonding terminal electrode 19 is formed on the entire lower main surface of the insulating substrate 17. Similarly, the upper bonding terminal electrode 18 is also formed on the entire upper main surface of the insulating substrate 17.

As a material of the insulating substrate 17, for example, a dielectric ceramic such as alumina is used. Also, the resistor R
A film such as glass may be formed on the surface of the substrate.

Since the resistance element 1 is provided with bonding terminal electrodes 18 and 19 on the upper and lower main surfaces of the insulating substrate 17, it is convenient when the upper and lower surfaces of the resistance element 1 are electrically connected to external circuit electrodes. It becomes a good structure. That is, when the resistance element 1 is mounted between the external circuit electrodes arranged above and below, the resistance element 1
Is mounted horizontally between the upper and lower external circuit electrodes,
The upper and lower surfaces of the resistance element 1 can be electrically connected to the external circuit electrodes with good stability.

Further, since the resistance element 1 has a symmetric structure in the vertical direction of the insulating substrate 17 (in other words, in the thickness direction of the insulating substrate 17), there is no vertical direction. Therefore, when joining the resistance element 1 to the external circuit electrode, mounting errors of the resistance element 1 in the vertical direction are eliminated, and the manufacturing cost can be reduced. Also, the joining terminal electrode 1
Since the areas 8 and 19 are made equal to the areas of the main surfaces of the insulating substrate 17 which are vertically opposed to each other, the bonding area of the resistance element 1 can be sufficiently secured, and the bonding reliability can be further improved.

[Second Embodiment, FIGS. 2 to 6] In a second embodiment, a non-reciprocal circuit device incorporating the resistance element 1 described in the first embodiment will be described. FIG. 2 is an exploded perspective view showing the configuration of the nonreciprocal circuit device. 3 is a plan view showing the inside of the non-reciprocal circuit device 2 shown in FIG. 2, FIG. 4 is a partial cross-sectional view of the non-reciprocal circuit device 2 shown in FIG. 3, and FIG. The external perspective views after completion of the assembly of the reversible circuit element 2 are shown. The non-reciprocal circuit device 2 is a lumped constant type isolator.

As shown in FIG. 2, the lumped-constant isolator 2 generally includes an upper case 8 made of a magnetic metal, a lower case 4 made of a magnetic metal, a resin case 3, a center electrode assembly 13, , The permanent magnet 9, the resistance element 1 described in the first embodiment, and the matching capacitor elements C1 to C
3 and so on.

The lower case 4 includes left and right side walls 4 a and a bottom wall 4.
b. The upper case 8 has a rectangular shape in plan view, and has an upper wall 8a and left and right side walls 8b. The lower case 4 and the upper case 8 are formed by punching and bending a plate made of a high magnetic permeability such as Fe or silicon steel, and then plating the surfaces with Cu or Ag.

The center electrode assembly 13 is formed by arranging center electrodes 21 to 23 on the upper surface of a disk-shaped microwave ferrite 20 at approximately 120 degrees with an insulating sheet (not shown) interposed therebetween. I have. These center electrodes 21 to 23
The port portions P1 to P3 on one end side are led out horizontally, and the common ground electrode 25 of the center electrodes 21 to 23 on the other end side is brought into contact with the lower surface of the ferrite 20. The common ground electrode 25 substantially covers the lower surface of the ferrite 20, is connected to the bottom wall 4b of the lower case 4 by a method such as soldering through a window 3c of the resin case 3 described later, and is grounded. Center electrodes 21 to 23 and earth electrode 25
Is made of a conductive material such as Ag, Cu, Au, Al, and Be, and is integrally formed by punching or etching a thin metal plate.

The resin case 3 has a bottom portion 3a and four side portions 3a.
b. A rectangular window 3c is formed at the center of the bottom 3a, and storage portions 3d for storing the matching capacitor elements C1 to C3 and the resistance element 1 are formed at the periphery of the window 3c. ing. The bottom wall 4b of the lower case 4 is exposed at the window 3c. An input terminal 14, an output terminal 15 (see FIG. 3) and a ground terminal 16 are insert-molded in the resin case 3. One end of each of the input terminal 14, the output terminal 15, and the ground terminal 16 is exposed on the outer surface of the resin case 3, and the other end is exposed on the bottom 3a of the resin case 3 so that the input lead electrode 14a (FIG.
Output extraction electrode 15a and ground extraction electrode 16a
It has been. Each of the ground terminals 16 extends outward from the opposite outer surface of the resin case 3. The material of the resin case 3 is preferably a liquid crystal polymer or PPS (polyphenylene sulfide resin).
This is because liquid crystal polymers and PPS are excellent in heat resistance and low loss.

The matching capacitor elements C1 to C3 are shown in FIG.
As shown in FIG. 7, a hot-side capacitor electrode 26 is formed on the upper surface of a dielectric ceramic substrate 28, and a cold-side (earth-side) capacitor electrode 27 is formed on the lower surface.

As shown in FIG. 3, a resin case 3 is incorporated in a lower case 4 and a center electrode assembly 13 and a matching capacitor element C are provided in the resin case 3.
1 to C3, the resistance element 1 described in the first embodiment, and the like are accommodated.

The hot-side capacitor electrodes 26 (see FIG. 4) located on the upper surfaces of the matching capacitor elements C1 to C3 are electrically connected to the ports P1 to P3, respectively, and the cold-side (earth-side) capacitors located on the lower surface. Electrode 27
4 (see FIG. 4) are soldered to the ground lead electrodes 16a of the ground terminals 16 exposed in the housing portion 3d of the resin case 3, respectively.

As shown in FIG. 4, the isolator 2 is configured such that the joining terminal electrode 18 of the resistance element 1 is connected to the hot side terminal electrode 18.
, And the joining terminal electrode 19 of the resistance element 1 is used as the ground-side terminal electrode 19. The hot-side terminal electrode 18 of the resistance element 1 is soldered to the port portion P3 of the center electrode 22, and the ground-side terminal electrode 19 is soldered to the ground lead electrode 16a of the ground terminal 16 exposed in the housing 3d of the resin case 3. Attached. That is, the resistance element 1
Is stably disposed in a horizontal state between the port portion P3 corresponding to the upper external circuit electrode and the ground extraction electrode 16a corresponding to the lower external circuit electrode.
8 and 19 are electrically connected to the port portion P3 and the ground lead electrode 16a with high reliability. Resistance element 1
Are formed in parallel with the matching capacitor element C3 between the port P3 of the center electrode 23 and the ground terminal 16 (see FIG. 6).

Further, after the permanent magnets 9 are stacked thereon, the upper case 8 is mounted. The permanent magnet 9 applies a DC magnetic field to the center electrode assembly 13. The lower case 4 and the upper case 8 are joined to form a metal case, form a magnetic circuit, and also function as a yoke.

Thus, the lumped-constant isolator 2 shown in FIG. 5 is obtained. This lumped constant type isolator 2
The size is 4.0 × 4.0 × 2.0 mm.
FIG. 6 is an electrical equivalent circuit diagram of the lumped-constant isolator 2.

Since the isolator 2 includes the resistance element 1 described in the first embodiment, the junction area between the hot-side terminal electrode 18 of the resistance element 1 and the port P3 of the center electrode 23 and the resistance element 1 The bonding area between the ground-side terminal electrode 19 and the ground extraction electrode 16a of the ground terminal 16 can be sufficiently secured, and the bonding reliability is further improved. Further, since the ground-side terminal electrode 19 and the ground lead-out electrode 16a are directly joined to each other in a wide area, heat dissipation is also good.

Further, the resistance element 1 has no directionality in the vertical direction, and when mounted on the isolator 2, there is no mounting error in the vertical direction, and the productivity can be improved.

The resistance element 1 is, as shown in FIG.
Since the width W of the resistor R is large and the length L is short, a resistance value of low impedance (several Ω to several tens Ω) is obtained, and the resistor R is suitable for being incorporated in the isolator 2.

[Third Embodiment, FIG. 7]
A mobile phone will be described as an example of the communication device according to the present invention.

FIG. 7 is an electric circuit block diagram of the RF portion of the mobile phone 120. In FIG. 7, 122 is an antenna element, 123 is a duplexer, 131 is a transmitting isolator, 132 is a transmitting amplifier, 133 is a band-pass filter for transmitting stages, 134 is a transmitting mixer, 135 is a receiving amplifier, and 136 is a receiving amplifier. Bandpass filter for interstage on the receiving side, 1
37 is a mixer on the receiving side, 138 is a voltage controlled oscillator (VC
O) 139 is a local band-pass filter.

Here, as the transmitting side isolator 131, the lumped constant type isolator 2 of the second embodiment can be used. By mounting this isolator 2, a highly reliable mobile phone 120 can be realized.

[Other Embodiments] The present invention is not limited to the above-described embodiment, but can be modified into various configurations within the scope of the present invention. For example, the shape of the center electrode assembly of the non-reciprocal circuit device is not limited to a columnar shape, but may be any shape such as a rectangular shape or a deformed square shape. Further, the shape of the permanent magnet may be, for example, a circular shape, a triangular shape with rounded corners, or the like, in addition to the rectangular shape. The center electrode can be formed by providing a pattern electrode on a substrate (such as a dielectric substrate, a magnetic substrate, or a laminated substrate) in addition to the one formed by punching and bending a metal plate. Further, the intersection angle of each center electrode may be in the range of 110 to 140 degrees.

In the second embodiment, an isolator has been described as an example, but the resistance element according to the present invention can be applied not only to a circulator but also to other high-frequency components and electronic equipment.

[0035]

As is apparent from the above description, according to the present invention, the connecting terminal electrodes are provided on the opposing main surfaces of the insulating substrate, so that the external circuit electrodes disposed above and below each other are connected to each other. And a structure that is convenient when the resistance element is electrically connected to the external circuit electrode.

Further, by making the area of the bonding terminal electrode on the mounting side substantially the same as the area of the main surface of the insulating substrate, the resistance element can be stably mounted on the external circuit electrode. Since the area is sufficiently secured, the joining reliability can be further improved.

Further, the nonreciprocal circuit device and the communication device according to the present invention can improve the reliability by including the resistance element having the above-described characteristics.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing one embodiment of a resistance element according to the present invention.

FIG. 2 is an exploded perspective view showing one embodiment of the non-reciprocal circuit device according to the present invention.

FIG. 3 is a plan view showing the inside of the non-reciprocal circuit device shown in FIG. 2;

4 is a cross-sectional view of the non-reciprocal circuit device shown in FIG. 3 taken along line IV-IV.

5 is an external perspective view of the non-reciprocal circuit device shown in FIG. 2 after assembly is completed.

6 is an electrical equivalent circuit diagram of the non-reciprocal circuit device shown in FIG.

FIG. 7 is a block diagram showing an embodiment of a communication device according to the present invention.

FIG. 8 is an external perspective view showing a conventional resistance element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Resistance element 2 ... Lumped constant type isolator (non-reciprocal circuit element) 4 ... Lower case 8 ... Upper case 9 ... Permanent magnet 13 ... Center electrode assembly 17 ... Insulating substrate 18, 19 ... Joining terminal electrode 20 ... Microwave ferrite 21 to 23 Central electrode 120 Cellular phone R Resistor

Claims (4)

[Claims] An insulating substrate; bonding terminal electrodes provided on opposing main surfaces of the insulating substrate; and electrically connected to each of the bonding terminal electrodes provided on side surfaces of the insulating substrate. A resistance element comprising: a connected resistor; and 2. The resistance element according to claim 1, wherein an area of the bonding terminal electrode on the mounting side is substantially equal to an area of a main surface of the insulating substrate. 3. A permanent magnet, a ferrite to which a DC magnetic field is applied by the permanent magnet, a plurality of center electrodes disposed on the ferrite, and electrically connected to any one of the center electrodes. 3. A non-reciprocal circuit device comprising: the resistance element according to claim 2; and a metal case that houses the permanent magnet, the ferrite, and the center electrode. 4. A communication device comprising the non-reciprocal circuit device according to claim 3.