JP2001202515A - Lighting device for image processing system - Google Patents
Lighting device for image processing systemInfo
- Publication number
- JP2001202515A JP2001202515A JP2000010248A JP2000010248A JP2001202515A JP 2001202515 A JP2001202515 A JP 2001202515A JP 2000010248 A JP2000010248 A JP 2000010248A JP 2000010248 A JP2000010248 A JP 2000010248A JP 2001202515 A JP2001202515 A JP 2001202515A
- Authority
- JP
- Japan
- Prior art keywords
- light
- component
- reflected
- recognition
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Facsimile Scanning Arrangements (AREA)
Abstract
(57)【要約】
【課題】認識対象物の素材の如何に拘わらず、この認識
対象物と背景とのコントラストを確実に高く出すことの
できるように光照射できる画像処理システム用照明装置
を提供する。
【解決手段】認識対象物9A〜9Cに白色光を照射した
ときに反射してくる光の波長成分を含む光を出射する光
源7A〜7Cと、認識対象物9A〜9Cの成分を主成分
として含んだ光反射面を有する反射板8A〜8Cとを備
える。光源7A〜7Cからの出射光L1を光反射面で反
射させた反射光L2を認識対象物9A〜9Cに照射する
よう構成する。
(57) [Summary] [Problem] To provide an illumination device for an image processing system capable of irradiating light so that the contrast between the recognition target object and the background can be reliably increased regardless of the material of the recognition target object. I do. A light source (7A to 7C) that emits light including a wavelength component of light reflected when white light is applied to a recognition target (9A to 9C), and components of the recognition target (9A to 9C) as main components. And reflecting plates 8A to 8C each having a light reflecting surface. A configuration is such that reflected light L2 obtained by reflecting light L1 emitted from light sources 7A to 7C on a light reflecting surface is applied to recognition targets 9A to 9C.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、各種部品などを画
像認識する用途などに広く用いられている画像処理シス
テムにおける撮像対象物に光照射するための照明装置に
関するものであり、特に、電子部品実装装置のアライメ
ントとしての用途に好適な照明装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illuminating device for irradiating an object to be imaged with light in an image processing system widely used for image recognition of various parts and the like, and more particularly, to an electronic component. The present invention relates to a lighting device suitable for use as alignment of a mounting device.
【0002】[0002]
【従来の技術】近年、様々な分野で広く用いられている
画像処理システムでは、高精度の画像認識を行うため
に、カメラの撮像対象物つまり認識対象物と背景とに高
いコントラストを得ることのできる照明装置が要求され
ている。従来の画像処理システムに用いられている照明
装置は、その概略構成の斜視図を示す図9のように、光
源1からの出射光(一般にハロゲン光が用いられてい
る)を、スライドガイド2を通じて認識対象物3の表面
に照射するよう構成されている。このように認識対象物
3に光を照射すると、認識対象物3とこれの背景とのコ
ントラストを高くすることができ、認識対象物3を画像
的に容易、且つ正確に認識することが可能となる。認識
対象物3と背景とのコントラストが高くならない場合に
は、光源1とスライドガイド2との間に、複種類の色フ
ィルタ4を順次交換しながら介挿して、この色フィルタ
4を通した光を順次替えながら照射することにより、認
識対象物3と背景とのコントラストが高くなるように調
整している。2. Description of the Related Art In recent years, in image processing systems widely used in various fields, in order to perform high-precision image recognition, it is necessary to obtain a high contrast between an object to be imaged by a camera, that is, an object to be recognized and a background. There is a need for a lighting device that can. As shown in FIG. 9, which is a perspective view of a schematic configuration of an illumination device used in a conventional image processing system, light emitted from a light source 1 (generally halogen light is used) is passed through a slide guide 2. It is configured to irradiate the surface of the recognition target 3. By irradiating the recognition target 3 with light in this way, the contrast between the recognition target 3 and the background thereof can be increased, and the recognition target 3 can be easily and accurately recognized as an image. Become. When the contrast between the recognition target 3 and the background does not increase, a plurality of types of color filters 4 are interposed between the light source 1 and the slide guide 2 while being sequentially exchanged, and light passing through the color filters 4 is interposed. Are adjusted in order to increase the contrast between the recognition target 3 and the background.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記構
成の照明装置では、認識対象物3の種類によっては背景
とのコントラストをどうしても高くできない場合があっ
た。例えば、白いセラミック製の回路基板の本体面(背
景)上に金めっきを施して形成された回路パターン(認
識対象物)を画像認識する場合には、金めっきの回路パ
ターンおよび回路基板の本体面の双方の光反射率が共に
高いので、色フィルタ4を種々変更しながらコントラス
トの調整を行っても、撮像された画像における回路パタ
ーンと基板本体面とのコントラストがどうしても高くな
らず、高精度の画像認識を行えないという問題があっ
た。そのため、白いセラミック製の回路基板上の金めっ
きによる回路パターンを画像認識しようとする電子部品
実装装置では、パターン認識に失敗して装置の作動が自
動停止することがあった。However, in the illumination device having the above configuration, the contrast with the background may not be increased depending on the type of the object 3 to be recognized. For example, when performing image recognition of a circuit pattern (recognition target) formed by applying gold plating on the main body surface (background) of a white ceramic circuit board, the gold-plated circuit pattern and the main body surface of the circuit board are used. Since both light reflectances are high, even if the contrast is adjusted while variously changing the color filter 4, the contrast between the circuit pattern and the substrate main body surface in the captured image does not necessarily increase, resulting in high precision. There was a problem that image recognition could not be performed. Therefore, in an electronic component mounting apparatus that attempts to image-recognize a circuit pattern formed by gold plating on a white ceramic circuit board, the pattern recognition fails and the operation of the apparatus is automatically stopped in some cases.
【0004】そこで、本発明は、上記従来の課題に鑑み
てなされたもので、認識対象物の素材の如何に拘わら
ず、この認識対象物と背景とのコントラストを確実に高
く出すことのできるように光照射できる画像処理システ
ム用照明装置を提供することを目的とするものである。Accordingly, the present invention has been made in view of the above-mentioned conventional problems, and it is possible to reliably increase the contrast between the recognition target and the background regardless of the material of the recognition target. It is an object of the present invention to provide an illuminating device for an image processing system that can irradiate light to a light source.
【0005】[0005]
【課題を解決するための手段】上記目的を達成するため
に、第1の発明に係る画像処理システム用照明装置は、
認識対象物に白色光を照射したときに反射してくる光の
波長成分を含む光を出射する光源と、前記認識対象物の
成分を主成分として含んだ光反射面を有する反射板とを
備えてなり、前記光源からの出射光を前記光反射面で反
射させた反射光を前記認識対象物に照射するよう構成さ
れていることを特徴としている。In order to achieve the above object, a lighting device for an image processing system according to a first aspect of the present invention comprises:
A light source that emits light including a wavelength component of light that is reflected when white light is applied to the recognition target, and a reflection plate having a light reflection surface including the component of the recognition target as a main component Wherein the reflected light obtained by reflecting the light emitted from the light source on the light reflecting surface is applied to the object to be recognized.
【0006】この画像処理システム用照明装置では、光
源の出射光は、認識対象物に白色光を照射したときに反
射してくる光の波長成分を有しているが、この出射光が
反射板の光反射面で反射された反射光は、認識対象物に
白色光を照射したときに反射してくる光の波長成分のみ
が残り、それ以外の波長成分を含む光が減衰された分光
分布となる。すなわち、反射板からの反射光は、認識対
象物以外の背景に白色光を照射したときに反射してくる
波長成分が減衰された光となるので、この反射光を認識
対象物に照射しながらカメラで撮像することにより、認
識対象物と背景とのコントラストが高い画像を得ること
ができる。In this illuminating device for an image processing system, the emitted light of the light source has a wavelength component of light reflected when white light is applied to the object to be recognized. In the reflected light reflected by the light reflecting surface, only the wavelength component of the light reflected when illuminating the object to be recognized with white light remains, and the spectral distribution in which the light containing other wavelength components is attenuated. Become. In other words, the reflected light from the reflection plate is light in which the wavelength component reflected when white light is applied to the background other than the object to be recognized is attenuated. By taking an image with a camera, an image having a high contrast between the recognition target object and the background can be obtained.
【0007】上記発明において、複数の認識対象物の各
々の成分をそれぞれ主成分として含んだ光反射面を有す
る複種類の反射板を備え、前記各反射板が、光照射すべ
き前記各認識対象物の相違に対応して入れ換え可能に具
備されている構成とすることができる。In the above invention, there are provided a plurality of types of reflectors each having a light reflecting surface containing, as a main component, a component of each of the plurality of recognition objects, wherein each of the reflectors is to be irradiated with light. Can be interchangeably provided in response to the difference.
【0008】これにより、各反射板における各々の光反
射面からの反射光は、各反射板に適応する認識対象物以
外の背景に白色光を照射したときに反射してくる波長成
分が減衰された光となる。したがって、互いに異なる成
分を有する複種類の認識対象物が存在する場合には、そ
れら各認識対象物に適応する反射板を選択して設置し
て、それら反射板からの反射光を認識対象物に照射しな
がら撮像することにより、各認識対象物に応じて背景と
のコントラストが高い画像を得ることが可能となる。Accordingly, the wavelength component reflected when the white light is applied to the background other than the object to be recognized which is adapted to each reflector is attenuated in the light reflected from each light reflecting surface of each reflector. Light. Therefore, when there are multiple types of recognition targets having components different from each other, a reflection plate suitable for each of the recognition targets is selected and installed, and reflected light from the reflection plates is reflected on the recognition target. By imaging while irradiating, it is possible to obtain an image having a high contrast with the background according to each recognition target.
【0009】また、上記発明において、光源からの出射
光を、反射板における金を主成分として含んだ光反射面
で反射させて、金を主成分とする認識対象物に照射する
よう構成することもできる。これにより、主成分が金で
ある認識対象物と主成分が金でない背景との間でのコン
トラストの高い画像を得ることが可能となり、特に、電
子部品実装装置において使用されることの多い金めっき
による回路パターンと基板本体部とのコントラストが高
い画像を得るのに適している。Further, in the above invention, the light emitted from the light source is reflected by a light reflecting surface of the reflecting plate containing gold as a main component, and is irradiated on a recognition target containing gold as a main component. Can also. This makes it possible to obtain a high-contrast image between a recognition target whose main component is gold and a background whose main component is not gold, and in particular, gold plating often used in electronic component mounting apparatuses. This is suitable for obtaining an image having a high contrast between the circuit pattern and the substrate main body.
【0010】第2の発明に係る画像処理システム用照明
装置は、回路基板の回路パターンに白色光を照射したと
きに反射してくる光の波長成分を含む光を出射する光源
と、前記回路パターンの形成成分を主成分として含んだ
光反射面を有する反射板とを備え、電子部品実装装置の
基板認識部に組み込んで、前記光源からの出射光を前記
光反射面で反射させた反射光を前記回路基板に照射する
よう構成された第1の照明部と、電子部品に白色光を照
射したときに反射してくる光の波長成分を含む光を出射
する光源と、前記電子部品の外装形成成分を主成分とし
て含んだ光反射面を有する反射板とを備え、前記電子部
品実装装置の部品認識部に組み込んで、前記光源からの
出射光を前記光反射面で反射させた反射光を前記電子部
品に照射するよう構成された第2の照明部とを有してい
ることを特徴としている。According to a second aspect of the present invention, there is provided an illumination device for an image processing system, comprising: a light source that emits light including a wavelength component of light reflected when white light is applied to a circuit pattern on a circuit board; A reflecting plate having a light reflecting surface containing a forming component as a main component, and incorporating the light reflected from the light reflecting surface with the light emitted from the light source by incorporating the light into the substrate recognition unit of the electronic component mounting apparatus. A first illuminator configured to irradiate the circuit board, a light source that emits light including a wavelength component of light reflected when the electronic component is irradiated with white light, and an outer package of the electronic component A reflection plate having a light reflection surface containing a component as a main component, incorporated in a component recognition unit of the electronic component mounting apparatus, the reflected light reflected from the light reflection surface emitted light from the light source, To irradiate electronic components It is characterized in that a second illumination unit has been made.
【0011】この画像処理システム用照明装置では、電
子部品実装装置に適用して、回路基板と電子部品との各
々の位置を共に高精度に認識することが可能となり、コ
ントラスト不足の画像による認識不能に起因して電子部
品実装装置が停止してしまうといったトラブルの発生を
確実に防止することができる。In this illumination device for an image processing system, when applied to an electronic component mounting device, it is possible to recognize both the positions of the circuit board and the electronic component with high accuracy, and it is not possible to recognize the image due to an image having insufficient contrast. Therefore, it is possible to reliably prevent a trouble that the electronic component mounting apparatus stops due to the above.
【0012】[0012]
【発明の実施の形態】以下、本発明の好ましい実施の形
態について図面を参照しながら説明する。図1は、本発
明の第1の実施の形態に係る画像処理システム用照明装
置の概略構成を示す斜視図である。同図において、光源
7Aからの出射光L1には、認識対象物9Aに白色光を
照射したときに反射してくる光の波長成分を含んでい
る。この出射光L1を反射させて認識対象物9Aに照射
する反射板8Aは、認識対象物9Aの形成成分を主成分
として含んで形成された光反射面を有している。この光
反射面による反射光L2は認識対象物9Aに照射するよ
う構成されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of an illumination device for an image processing system according to a first embodiment of the present invention. In the figure, the emitted light L1 from the light source 7A contains the wavelength component of the light reflected when the recognition target 9A is irradiated with white light. The reflection plate 8A that reflects the emitted light L1 and irradiates the recognition target 9A with a light has a light reflection surface formed mainly containing the components forming the recognition target 9A. The light L2 reflected by the light reflecting surface is configured to irradiate the recognition target 9A.
【0013】図2は、上記照明装置における光源7Aか
らの出射光L1と反射板8Aでの反射光L2との波長と
相対放射強度との関係をそれぞれ示す分光特性図であ
る。同図において、C1は光源8Aの出射光L1の分光
分布を示す特性曲線、C2は出射光L1が反射板8Aで
反射した反射光L2の分光分布を示す特性曲線、W1は
光源7Aの出射光の波長成分、W2は認識対象物9Aに
白色光を照射したときに反射してくる光の波長成分をそ
れぞれ示す。FIG. 2 is a spectral characteristic diagram showing the relationship between the wavelength and the relative radiation intensity of the light L1 emitted from the light source 7A and the light L2 reflected by the reflector 8A in the illumination device. In the figure, C1 is a characteristic curve showing the spectral distribution of the emitted light L1 of the light source 8A, C2 is a characteristic curve showing the spectral distribution of the reflected light L2 reflected by the reflector 8A, and W1 is the emitted light of the light source 7A. And W2 indicate the wavelength components of light reflected when white light is applied to the recognition target 9A.
【0014】同図から明らかなように、光源7Aの出射
光L1は、図2の波長成分W1を有しているが、この出
射光L1が反射板8Aの光反射面で反射された反射光L
2は、認識対象物9Aに白色光を照射したときに反射し
てくる光の波長成分W2のみが残り、それ以外の波長成
分を含む光が減衰された分光分布となる。すなわち、反
射板8Aからの反射光L2は、認識対象物9A以外の背
景に白色光を照射したときに反射してくる波長成分が減
衰された光となるので、この反射光L2を認識対象物9
Aに照射しながら撮像することにより、認識対象物9A
と背景とのコントラストが高い画像を得ることができ
る。As is apparent from FIG. 2, the emitted light L1 of the light source 7A has the wavelength component W1 of FIG. 2, and the emitted light L1 is reflected by the light reflecting surface of the reflector 8A. L
Reference numeral 2 indicates a spectral distribution in which only the wavelength component W2 of the light reflected when the recognition target 9A is irradiated with white light remains, and light containing other wavelength components is attenuated. That is, the reflected light L2 from the reflecting plate 8A is light in which the wavelength component reflected when white light is applied to the background other than the recognition target 9A is attenuated. 9
By imaging while irradiating A, the recognition target object 9A
An image having a high contrast between the image and the background can be obtained.
【0015】図3は本発明の第2の実施の形態に係る画
像処理システム用照明装置の概略構成を示す斜視図であ
る。同図において、図1と同一若しくは同等のものには
同一の符号を付して、その説明を省略する。この実施の
形態では、互いに異なる成分で形成された2種の認識対
象物9A,9Bにそれぞれ光照射する場合を示す。光源
7Bからの出射光L1には、認識対象物9A,9Bに白
色光を照射したときに反射してくる光の波長成分を含ん
でいる。FIG. 3 is a perspective view showing a schematic configuration of an illumination device for an image processing system according to a second embodiment of the present invention. In the figure, the same or equivalent components as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, a case is shown in which two types of recognition targets 9A and 9B formed of different components are irradiated with light. The emitted light L1 from the light source 7B includes a wavelength component of light reflected when white light is applied to the recognition targets 9A and 9B.
【0016】上記出射光L1を反射させて認識対象物9
Aに照射するための反射板8Aは、図1で説明したよう
に、認識対象物9Aの形成成分を主成分として含んだ光
反射面を有している。一方、出射光L1を反射させて認
識対象物9Bに照射するための反射板8Bは、認識対象
物9Bの形成成分を主成分として含んだ光反射面を有し
ている。したがって、一方の認識対象物9Aの画像認識
を行う場合には、光源7Bからの出射光L1を、認識対
象物9Aに適応する一方の反射板8Aで反射させて認識
対象物9Aに光照射し、他方の認識対象物9Bの画像認
識を行う場合には、光源7Bからの出射光L1を、認識
対象物9Bに対応する他方の反射板8Bで反射させて認
識対象物9Bに光照射する。したがって、上記反射板8
A,8Bの切り替えは認識対象物9A,9Bに応じて行
われる。なお、図3では、2枚の反射板8A,8Bを設
ける場合について例示しているが、この反射板の枚数は
3枚以上であってもよい。The object light 9 is reflected by reflecting the emitted light L1.
As described with reference to FIG. 1, the reflector 8A for irradiating A has a light reflecting surface containing a component of the recognition target 9A as a main component. On the other hand, the reflection plate 8B for reflecting the emitted light L1 and irradiating the recognition object 9B with a light has a light reflection surface containing a component of the recognition object 9B as a main component. Therefore, when performing image recognition of one recognition target 9A, the light L1 emitted from the light source 7B is reflected by the one reflecting plate 8A adapted to the recognition target 9A, and is irradiated on the recognition target 9A. When performing image recognition of the other recognition target 9B, the light L1 emitted from the light source 7B is reflected by the other reflector 8B corresponding to the recognition target 9B, and is irradiated on the recognition target 9B. Therefore, the reflection plate 8
Switching between A and 8B is performed according to the recognition objects 9A and 9B. Although FIG. 3 illustrates a case where two reflectors 8A and 8B are provided, the number of reflectors may be three or more.
【0017】図4は、上記照明装置における光源7Bか
らの出射光L1と各反射板8A,8Bでの反射光L2と
の波長と相対放射強度との関係をそれぞれ示す分光特性
図である。同図において、C2は、図2で説明したよう
に、出射光L1が一方の反射板8Aで反射した反射光L
2の分光分布を示す特性曲線、C3は光源7Bからの出
射光L1を反射板8Bで反射した反射光L2の分光分布
を示す特性曲線、C4は光源7Bからの出射光L1の分
光分布を示す特性曲線、W2は、図2で説明したよう
に、認識対象物9Aに白色光を照射したときに反射して
くる光の波長成分、W3は認識対象物9Bに白色光を照
射したときに反射してくる光の波長成分、W4は光源7
Bからの出射光L1の波長成分をそれぞれ示す。FIG. 4 is a spectral characteristic diagram showing the relationship between the wavelength of the light L1 emitted from the light source 7B and the light L2 reflected by each of the reflectors 8A and 8B and the relative radiant intensity in the above-mentioned illumination device. In the figure, C2 is the reflected light L that the outgoing light L1 is reflected by one reflector 8A as described in FIG.
2, a characteristic curve indicating the spectral distribution of the reflected light L2 obtained by reflecting the light L1 emitted from the light source 7B on the reflector 8B, and C4 indicating a spectral distribution of the light L1 emitted from the light source 7B. The characteristic curve, W2, is the wavelength component of light reflected when illuminating the recognition target 9A with white light, as described in FIG. 2, and W3 is the reflection component when illuminating the recognition target 9B with white light. The wavelength component of the incoming light, W4 is the light source 7
The wavelength components of the light L1 emitted from B are shown.
【0018】同図から明らかなように、光源7Bの出射
光L1は、図4の波長成分W4を有しているが、この出
射光L1が反射板8Aの光反射面で反射された反射光L
2は、認識対象物9Aに白色光を照射したときに反射し
てくる光の波長成分W2のみが残り、それ以外の波長成
分を含む光が減衰された分光分布となり、同様に、出射
光L1が反射板8Bの光反射面で反射された反射光L2
は、認識対象物9Bに白色光を照射したときに反射して
くる光の波長成分W3のみが残り、それ以外の波長成分
を含む光が減衰された分光分布となる。すなわち、反射
板8A,8Bからの反射光L2は、適応する認識対象物
9A,9B以外の背景に白色光を照射したときに反射し
てくる波長成分が減衰された光となる。したがって、互
いに異なる成分を有する複種類の認識対象物9A,9B
が存在する場合には、それら各認識対象物9A,9Bに
適応する反射板8A,8Bを選択して設置して、それら
反射板8A,8Bからの反射光L2を認識対象物9A,
9Bに照射しながら撮像することにより、各認識対象物
9A,9Bに応じて背景とのコントラストが高い画像を
得ることが可能となる。As is apparent from FIG. 1, the emitted light L1 of the light source 7B has the wavelength component W4 of FIG. 4, and this emitted light L1 is reflected by the light reflecting surface of the reflector 8A. L
Reference numeral 2 shows a spectral distribution in which only the wavelength component W2 of light reflected when the recognition target 9A is irradiated with white light remains, and light containing other wavelength components is attenuated. Is reflected light L2 reflected by the light reflecting surface of the reflecting plate 8B.
Has a spectral distribution in which only the wavelength component W3 of the light reflected when the recognition object 9B is irradiated with white light remains, and the light containing other wavelength components is attenuated. That is, the reflected light L2 from the reflectors 8A and 8B is light in which the wavelength component reflected when white light is applied to the background other than the applicable recognition target 9A or 9B is attenuated. Therefore, multiple types of recognition target objects 9A and 9B having different components from each other.
Exists, the reflectors 8A and 8B adapted to the respective recognition objects 9A and 9B are selected and installed, and the reflected light L2 from the reflectors 8A and 8B is reflected by the recognition objects 9A and 9B.
By imaging while irradiating 9B, it is possible to obtain an image having a high contrast with the background according to each of the recognition targets 9A and 9B.
【0019】図5は本発明の第3の実施の形態に係る画
像処理システム用照明装置の概略構成を示す斜視図であ
る。この実施の形態では、金を主成分とする認識対象物
9Cに対し光照射するものであり、光源7Cからの出射
光L1には、認識対象物9Cに白色光を照射したときに
反射してくる光の波長成分を含んでいる。この出射光L
1を反射させて認識対象物9Cに光照射する反射板8C
は、金めっきを施された光反射面を有している。この光
反射面による反射光L2は認識対象物9Cに照射するよ
う構成されている。FIG. 5 is a perspective view showing a schematic configuration of an illumination device for an image processing system according to a third embodiment of the present invention. In this embodiment, light is irradiated to the recognition target 9C mainly composed of gold, and the emitted light L1 from the light source 7C is reflected when the recognition target 9C is irradiated with white light. Includes wavelength components of incoming light. This emitted light L
Reflector 8C that reflects 1 and irradiates light to recognition object 9C
Has a gold-plated light reflecting surface. The light L2 reflected by the light reflecting surface is configured to irradiate the recognition target 9C.
【0020】図6は、上記照明装置における光源7Cか
らの出射光L1と反射板8Cでの反射光L2との波長と
相対放射強度との関係をそれぞれ示す分光特性図であ
る。同図において、C5は光源7Cからの出射光L1の
分光分布を示す特性曲線、C6は出射光L1が反射板8
Cで反射した反射光L2の分光分布を示す特性曲線、W
5は光源7Cからの出射光L1の波長成分、W6は認識
対象物9Cに白色光を照射したときに反射してくる光の
波長成分をそれぞれ示す。FIG. 6 is a spectral characteristic diagram showing the relationship between the wavelength and the relative radiant intensity of the light L1 emitted from the light source 7C and the light L2 reflected by the reflector 8C in the illumination device. In the same figure, C5 is a characteristic curve showing the spectral distribution of the light L1 emitted from the light source 7C, and C6 is the light reflected from the reflector 8
A characteristic curve indicating the spectral distribution of the reflected light L2 reflected by C, W
Reference numeral 5 denotes a wavelength component of the light L1 emitted from the light source 7C, and W6 denotes a wavelength component of light reflected when the recognition target 9C is irradiated with white light.
【0021】同図から明らかなように、光源7Cの出射
光L1は、図6の波長成分W5を有しているが、この出
射光L1が反射板8Cの光反射面で反射された反射光L
2は、認識対象物9Cに白色光を照射したときに反射し
てくる光の波長成分W6のみが残り、それ以外の波長成
分を含む光が減衰された分光分布となる。すなわち、反
射板8Cからの反射光L2は、認識対象物9C以外の背
景に白色光を照射したときに反射してくる波長成分が減
衰された光となるので、この反射光L2を認識対象物9
Cに照射しながら撮像することにより、認識対象物9C
と背景とのコントラストが高い画像を得ることができ
る。したがって、この実施の形態の照明装置を用いれ
ば、主成分が金である認識対象物9Cと主成分が金でな
い背景との間でのコントラストの高い画像を得ることが
可能となる。As is apparent from FIG. 2, the emitted light L1 of the light source 7C has the wavelength component W5 shown in FIG. 6, and the emitted light L1 is reflected by the light reflecting surface of the reflector 8C. L
Reference numeral 2 shows a spectral distribution in which only the wavelength component W6 of light reflected when the recognition target 9C is irradiated with white light remains, and light containing other wavelength components is attenuated. That is, the reflected light L2 from the reflecting plate 8C is light in which the wavelength component reflected when white light is applied to the background other than the recognition target 9C is attenuated. 9
By imaging while irradiating C, the recognition target 9C
An image having a high contrast between the image and the background can be obtained. Therefore, by using the illumination device of this embodiment, it is possible to obtain an image with high contrast between the recognition target 9C whose main component is gold and a background whose main component is not gold.
【0022】図7は、本発明の第4の実施の形態に係る
画像処理システム用照明装置が適用された電子部品実装
装置10を示す斜視図である。先ず、この電子部品実装
装置10の概略について説明する。各種の電子部品を実
装すべき回路基板11は、基板搬送部12により搬送さ
れて、基板位置決めステージ13に位置決め保持され
る。FIG. 7 is a perspective view showing an electronic component mounting apparatus 10 to which an illumination device for an image processing system according to a fourth embodiment of the present invention is applied. First, an outline of the electronic component mounting apparatus 10 will be described. The circuit board 11 on which various electronic components are to be mounted is transported by the substrate transport unit 12 and is positioned and held on the substrate positioning stage 13.
【0023】一方、回路基板11に実装するための各種
の電子部品17は、部品供給部18に収納されており、
この部品供給部18内の電子部品17は、これらのうち
の所要のものを部品受渡し用ヘッド19によって順次取
り出される。この部品受渡し用ヘッド19によって取り
出された電子部品17は、一対の部品装着用ヘッド14
の何れかに受け渡される。電子部品17を吸着保持した
部品装着用ヘッド14は、基板位置決めステージ13に
位置決め保持されている回路基板11における所定の装
着位置に電子部品17を移送して装着する。On the other hand, various electronic components 17 to be mounted on the circuit board 11 are housed in a component supply unit 18.
The electronic components 17 in the component supply unit 18 are sequentially taken out of the required components by the component delivery head 19. The electronic component 17 taken out by the component delivery head 19 is used as a pair of component mounting heads 14.
Passed to any of The component mounting head 14 holding the electronic component 17 by suction holds the electronic component 17 at a predetermined mounting position on the circuit board 11 positioned and held on the board positioning stage 13 and mounts the electronic component 17.
【0024】部品装着用ヘッド14が吸着保持する電子
部品17と回路基板11との位置合わせは基板位置決め
ステージ13において行われるのであるが、それに先立
って、基板位置決めステージ13に位置決め保持されて
いる回路基板11の回路パターンに対する画像認識に基
づく所定の部品装着部の位置認識と、部品装着用ヘッド
14が吸着保持している電子部品17の画像認識に基づ
く吸着位置および吸着姿勢などの認識が行われる。回路
基板11の画像認識は、回路基板11を撮像するカメラ
とその回路基板11に光照射する照明装置とが一体とな
った基板認識部20が行う。電子部品17の画像認識
は、電子部品17を撮像するカメラ(図示せず)とその
電子部品17に光照射する照明装置とが一体となった部
品認識部21が行う。上記の基板認識部20および部品
認識部21には、それぞれ第4の実施の形態に係る照明
装置が組み込まれている。この照明装置は、基板認識部
20および部品認識部21の何れにも同一構成のものが
用いられる。The positioning between the electronic component 17 held by the component mounting head 14 and the circuit board 11 and the circuit board 11 is performed on the board positioning stage 13. Prior to this, the circuit held on the board positioning stage 13 is held. Recognition of a position of a predetermined component mounting portion based on image recognition with respect to a circuit pattern of the substrate 11 and recognition of a suction position, a suction posture, and the like based on image recognition of the electronic component 17 held by the component mounting head 14 are performed. . The image recognition of the circuit board 11 is performed by a board recognition unit 20 in which a camera for imaging the circuit board 11 and an illumination device for irradiating the circuit board 11 with light are integrated. Image recognition of the electronic component 17 is performed by a component recognition unit 21 in which a camera (not shown) that captures an image of the electronic component 17 and a lighting device that irradiates the electronic component 17 with light are integrated. The above-described board recognition unit 20 and component recognition unit 21 each incorporate the lighting device according to the fourth embodiment. This illumination device has the same configuration for both the board recognition unit 20 and the component recognition unit 21.
【0025】図8は、上記の基板認識部20または部品
認識部21に用いられる照明装置の概略構成を示し、
(a)は平面図、(b)は縦断面図である。この照明装
置は、ライトガイド22の中央部に平面視円形の反射板
23が組付けられた構造になっている。基板認識部20
用の照明装置における反射板23は、回路基板11上に
印刷配線手段などにより形成された回路パターンの形成
成分を主成分として含んだ光反射面23aを有してい
る。一方、部品認識部21用の照明装置における反射板
23は、電子部品17の成分を主成分として含んだ光反
射面23aを有している。何れの装置20,21に用い
る照明装置においても、上記の光反射面23aは、ライ
トガイド22における下部に円周面に形成された光導出
面22aからの光を真下に反射させることのできる傾斜
角度を有するほぼ逆円錐台形状になっている。ライトガ
イド22には、光源24からの出射光が光ファイバ27
を通じて導光される。FIG. 8 shows a schematic configuration of a lighting device used for the board recognition unit 20 or the component recognition unit 21 described above.
(A) is a plan view and (b) is a longitudinal sectional view. This lighting device has a structure in which a reflective plate 23 having a circular shape in a plan view is attached to a central portion of a light guide 22. Board recognition unit 20
The reflection plate 23 in the lighting device for use has a light reflection surface 23a containing, as a main component, a component for forming a circuit pattern formed on the circuit board 11 by printed wiring means or the like. On the other hand, the reflection plate 23 in the illumination device for the component recognition unit 21 has a light reflection surface 23a containing the component of the electronic component 17 as a main component. In the lighting device used for any of the devices 20 and 21, the light reflecting surface 23a has an inclination angle at which the light from the light guide surface 22a formed on the lower surface of the light guide 22 and formed on the circumferential surface can be reflected directly below. And has a substantially inverted truncated cone shape. The light emitted from the light source 24 is transmitted through the optical fiber 27 to the light guide 22.
The light is guided through.
【0026】基板認識部20は、基板位置決めステージ
13が保持している回路基板11における認識対象箇所
に対し照明装置から光照射し、且つカメラで撮像した画
像に基づき基板位置を認識する。一方、部品認識部21
は、部品装着用ヘッド14が吸着保持している電子部品
17に対し照明装置から光照射し、且つカメラで撮像し
た画像に基づき電子部品17の位置などを認識する。そ
して、両認識部20,21の各々の認識結果に基づいて
電子部品17の回路基板11に対する位置決めを行っ
て、その電子部品17を部品装着用ヘッド14が回路基
板11に装着する。The board recognizing section 20 illuminates a recognition target portion on the circuit board 11 held by the board positioning stage 13 from a lighting device, and recognizes a board position based on an image taken by a camera. On the other hand, the component recognition unit 21
The illumination device irradiates the electronic component 17 held by the component mounting head 14 with light from an illumination device, and recognizes the position of the electronic component 17 based on an image captured by a camera. Then, the electronic component 17 is positioned with respect to the circuit board 11 based on the recognition results of the two recognition units 20 and 21, and the component mounting head 14 mounts the electronic component 17 on the circuit board 11.
【0027】基板認識部20では、ライトガイド22の
光導出面22aからの光が、反射板23における回路基
板11の認識対象物の成分を主成分として形成された光
反射面23aで反射されて、回路基板11上の認識対象
物に照射される。上記光導出面22aからの光は、光反
射面23aで反射されることにより、回路基板11上に
白色光を照射したときに反射してくる光の波長成分だけ
が残り、それ以外の波長成分を含む光が減衰された分光
分布となる。すなわち、光反射面23aでの反射光は、
回路基板11上の認識対象物以外の基板背景に白色光を
照射したときに反射してくる光の波長成分が減衰された
光となるので、この反射光を回路基板11の認識対象物
に照射することによって回路基板11上の認識対象物と
基板背景とのコントラストが高い画像を得ることができ
る。したがって、回路基板11の位置を認識する際の認
識率は、認識対象物と基板背景とのコントラストの高い
画像によって向上し、高い信頼性で回路基板11の位置
を認識できる。In the board recognizing section 20, the light from the light guide surface 22a of the light guide 22 is reflected by the light reflecting surface 23a of the reflecting plate 23 formed mainly of the component of the object to be recognized of the circuit board 11, and The object to be recognized on the circuit board 11 is irradiated. The light from the light output surface 22a is reflected by the light reflecting surface 23a, so that only the wavelength component of the light reflected when white light is irradiated onto the circuit board 11 remains, and the other wavelength components are removed. Included light has an attenuated spectral distribution. That is, the light reflected on the light reflecting surface 23a is
Since the wavelength component of light reflected when white light is applied to the substrate background other than the object to be recognized on the circuit board 11 is attenuated, the reflected light is applied to the object to be recognized on the circuit board 11. By doing so, an image having a high contrast between the recognition target on the circuit board 11 and the substrate background can be obtained. Therefore, the recognition rate at the time of recognizing the position of the circuit board 11 is improved by a high contrast image between the recognition target and the substrate background, and the position of the circuit board 11 can be recognized with high reliability.
【0028】一方、部品認識部21では、上記の基板認
識部20と同様に、ライトガイド22の光導出面22a
からの光が、反射板23における電子部品17の成分を
主成分として形成された光反射面23aで反射されて、
部品装着用ヘッド14に吸着保持されている電子部品1
7に照射される。上記光導出面22aからの光は、光反
射面23aで反射されることにより、電子部品17に白
色光を照射したときに反射してくる光の波長成分だけが
残り、それ以外の波長成分を含む光が減衰された分光分
布となる。すなわち、光反射面23aでの反射光は、電
子部品17以外の周囲背景に白色光を照射したときに反
射してくる光の波長成分が減衰された光となるので、こ
の反射光を電子部品17に照射することによって電子部
品17と周囲背景とのコントラストが高い画像を得るこ
とができる。したがって、電子部品17の位置や吸着姿
勢を認識する際の認識率は、電子部品17と周囲背景と
のコントラストが高い画像によって向上し、高い信頼性
で電子部品17の位置などを認識できる。On the other hand, in the component recognizing section 21, similarly to the board recognizing section 20, the light guide surface 22a of the light guide 22 is provided.
Is reflected by the light reflecting surface 23a formed mainly of the component of the electronic component 17 in the reflecting plate 23,
Electronic component 1 sucked and held by component mounting head 14
7 is irradiated. The light from the light output surface 22a is reflected by the light reflecting surface 23a, so that only the wavelength component of the light reflected when the electronic component 17 is irradiated with white light remains, and includes other wavelength components. The light has an attenuated spectral distribution. That is, the reflected light from the light reflecting surface 23a is light in which the wavelength component of light reflected when white light is applied to the surrounding background other than the electronic component 17 is attenuated. By irradiating the electronic component 17, an image having a high contrast between the electronic component 17 and the surrounding background can be obtained. Therefore, the recognition rate at the time of recognizing the position and the suction attitude of the electronic component 17 is improved by an image having a high contrast between the electronic component 17 and the surrounding background, and the position and the like of the electronic component 17 can be recognized with high reliability.
【0029】したがって、図8の第4の実施の形態に係
る照明装置と撮像用カメラとを組み合わせて電子部品実
装装置10における基板認識部20および部品認識部2
1をそれぞれ構成すれば、回路基板11と電子部品17
との各々の位置を共に高精度に認識することが可能とな
り、コントラスト不足の画像による認識不能に起因して
電子部品実装装置10が停止してしまうといったトラブ
ルの発生を確実に防止することができる。上記とは別
に、電子部品17の接合時に高温を必要とする電子部品
実装装置10においては、電子部品17または回路基板
11が熱に対する耐性を有しているため、それら電子部
品17または回路基板11の成分を主成分として含んだ
光反射面23aを有する反射板23を用いることによ
り、高温での使用にも耐えうる照明装置を構成すること
が可能となる。Therefore, by combining the illumination device according to the fourth embodiment of FIG. 8 and the imaging camera, the board recognition unit 20 and the component recognition unit 2 in the electronic component mounting apparatus 10 are combined.
1 respectively constitute the circuit board 11 and the electronic component 17.
Can be recognized with high precision, and it is possible to reliably prevent the occurrence of troubles such as the electronic component mounting apparatus 10 being stopped due to the inability to recognize the image due to an image with insufficient contrast. . Apart from the above, in the electronic component mounting apparatus 10 which requires a high temperature at the time of bonding the electronic component 17, since the electronic component 17 or the circuit board 11 has resistance to heat, the electronic component 17 or the circuit board 11 By using the reflection plate 23 having the light reflection surface 23a containing the component as a main component, it is possible to configure a lighting device that can withstand use at high temperatures.
【0030】[0030]
【発明の効果】以上のように、第1の発明に係る画像処
理システム用照明装置によれば、認識対象物の成分を主
成分として含んだ光反射面を有する反射板とを備えた構
成としたので、光源の出射光は、認識対象物に白色光を
照射したときに反射してくる光の波長成分を有している
にも拘わらず、この出射光が反射板の光反射面で反射さ
れた反射光は、認識対象物に白色光を照射したときに反
射してくる光の波長成分のみが残り、それ以外の波長成
分を含む光が減衰された分光分布となる。すなわち、反
射板からの反射光は、認識対象物以外の背景に白色光を
照射したときに反射してくる波長成分が減衰された光と
なるので、この反射光を認識対象物に照射しながらカメ
ラで撮像することにより、認識対象物と背景とのコント
ラストが高い画像を得ることができる。As described above, according to the illumination device for an image processing system according to the first aspect of the present invention, there is provided a configuration including a reflection plate having a light reflection surface containing a component of a recognition target as a main component. Therefore, despite the fact that the emitted light of the light source has the wavelength component of the light reflected when the recognition target object is irradiated with white light, this emitted light is reflected by the light reflecting surface of the reflector. The reflected light has a spectral distribution in which only the wavelength component of the light reflected when the recognition target object is irradiated with white light remains, and the light containing other wavelength components is attenuated. In other words, the reflected light from the reflection plate is light in which the wavelength component reflected when white light is applied to the background other than the object to be recognized is attenuated. By taking an image with a camera, an image having a high contrast between the recognition target object and the background can be obtained.
【0031】第2の発明に係る画像処理システム用照明
装置によれば、電子部品実装装置に適用して、回路基板
と電子部品との各々の位置を共に高精度に認識すること
が可能となり、コントラスト不足の画像による認識不能
に起因して電子部品実装装置が停止してしまうといった
トラブルの発生を確実に防止することができる。According to the illumination device for an image processing system according to the second aspect of the present invention, it is possible to apply the present invention to an electronic component mounting apparatus and to recognize both the positions of the circuit board and the electronic component with high accuracy. It is possible to reliably prevent a trouble that the electronic component mounting apparatus stops due to the inability to recognize the image with the insufficient contrast.
【図1】本発明の第1の実施の形態に係る画像処理シス
テム用照明装置の概略構成を示す斜視図。FIG. 1 is a perspective view showing a schematic configuration of a lighting device for an image processing system according to a first embodiment of the present invention.
【図2】同上照明装置における光源からの投射光と反射
板からの反射光との各々の波長と相対放射強度との関係
をそれぞれ示す分光特性図。FIG. 2 is a spectral characteristic diagram showing a relationship between respective wavelengths and relative radiant intensities of projection light from a light source and light reflected from a reflector in the illumination device.
【図3】本発明の第2の実施の形態に係る画像処理シス
テム用照明装置の概略構成を示す斜視図。FIG. 3 is a perspective view showing a schematic configuration of a lighting device for an image processing system according to a second embodiment of the present invention.
【図4】同上照明装置における光源からの投射光と各反
射板からの反射光との各々の波長と相対放射強度との関
係をそれぞれ示す分光特性図。FIG. 4 is a spectral characteristic diagram showing a relationship between each wavelength and relative radiant intensity of the projection light from the light source and the reflection light from each reflector in the illumination device.
【図5】本発明の第3の実施の形態に係る画像処理シス
テム用照明装置の概略構成を示す斜視図。FIG. 5 is a perspective view illustrating a schematic configuration of a lighting device for an image processing system according to a third embodiment of the present invention.
【図6】同上照明装置における光源からの投射光と反射
板からの反射光との各々の波長と相対放射強度との関係
をそれぞれ示す分光特性図。FIG. 6 is a spectral characteristic diagram showing a relationship between respective wavelengths and relative radiant intensities of the projection light from the light source and the reflection light from the reflector in the illumination device.
【図7】本発明の第4の実施の形態に係る画像処理シス
テム用照明装置が適用された電子部品実装装置を示す斜
視図。FIG. 7 is a perspective view showing an electronic component mounting apparatus to which a lighting device for an image processing system according to a fourth embodiment of the present invention is applied.
【図8】同上電子部品実装装置における基板認識部また
は部品認識部に用いられる同上画像処理システム用照明
装置の概略構成を示し、(a)は平面図、(b)は縦断
面図。8A and 8B show a schematic configuration of an illumination device for an image processing system used in a board recognition unit or a component recognition unit in the electronic component mounting apparatus, wherein FIG. 8A is a plan view and FIG.
【図9】従来の画像処理システムの照明装置の概略構成
を示す斜視図。FIG. 9 is a perspective view showing a schematic configuration of a lighting device of a conventional image processing system.
7A〜7C 光源 8A〜8C 反射板 9A〜9C 認識対象物 10 電子部品実装装置 11 回路基板 17 電子部品 20 基板認識部 21 部品認識部 23 反射板 23a 光反射面 24 光源 L1 出射光 L2 反射光 7A to 7C Light source 8A to 8C Reflector 9A to 9C Recognition target 10 Electronic component mounting device 11 Circuit board 17 Electronic component 20 Board recognition unit 21 Component recognition unit 23 Reflector 23a Light reflecting surface 24 Light source L1 Emitted light L2 Reflected light
フロントページの続き (72)発明者 大井戸 良久 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 2F065 AA01 AA16 AA37 BB02 CC25 DD09 FF01 FF04 GG24 JJ03 JJ19 JJ26 LL01 PP11 QQ31 TT02 UU01 5B057 AA03 BA02 BA15 DA06 Continued on the front page (72) Inventor Yoshihisa Oido 1006 Odakadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. AA03 BA02 BA15 DA06
Claims (4)
射してくる光の波長成分を含む光を出射する光源と、 前記認識対象物の成分を主成分として含んだ光反射面を
有する反射板とを備えてなり、 前記光源からの出射光を前記光反射面で反射させた反射
光を前記認識対象物に照射するよう構成されていること
を特徴とする画像処理システム用照明装置。1. A light source that emits light including a wavelength component of light reflected when white light is irradiated on an object to be recognized, and a light reflecting surface mainly containing the component of the object to be recognized. An illumination device for an image processing system, comprising: a reflection plate; and irradiating the recognition target with reflected light obtained by reflecting light emitted from the light source on the light reflection surface.
れ主成分として含んだ光反射面を有する複種類の反射板
を備え、 前記各反射板が、光照射すべき前記各認識対象物の相違
に対応して入れ換え可能に具備されている請求項1に記
載の画像処理システム用照明装置。2. A method according to claim 1, further comprising the step of: providing a plurality of types of reflectors having light reflecting surfaces each of which includes, as a main component, a component of each of the plurality of recognition targets. The illumination device for an image processing system according to claim 1, wherein the illumination device is interchangeably provided in accordance with (1).
を主成分として含んだ光反射面で反射させて、金を主成
分とする認識対象物に照射するよう構成されている請求
項1に記載に画像処理システム用照明装置。3. A structure in which light emitted from a light source is reflected by a light reflecting surface of a reflecting plate containing gold as a main component and illuminates a recognition target containing gold as a main component. 3. The illumination device for an image processing system according to claim 1.
したときに反射してくる光の波長成分を含む光を出射す
る光源と、前記回路パターンの形成成分を主成分として
含んだ光反射面を有する反射板とを備え、 電子部品実装装置の基板認識部に組み込んで、前記光源
からの出射光を前記光反射面で反射させた反射光を前記
回路基板に照射するよう構成された第1の照明部と、 電子部品に白色光を照射したときに反射してくる光の波
長成分を含む光を出射する光源と、前記電子部品の外装
形成成分を主成分として含んだ光反射面を有する反射板
とを備え、 前記電子部品実装装置の部品認識部に組み込んで、前記
光源からの出射光を前記光反射面で反射させた反射光を
前記電子部品に照射するよう構成された第2の照明部と
を有していることを特徴とする画像処理システム用照明
装置。4. A light source that emits light including a wavelength component of light reflected when white light is applied to a circuit pattern on a circuit board, and a light reflecting surface mainly including a component of forming the circuit pattern. A reflection plate comprising: a reflection plate having: a reflection plate having a reflection plate, which is incorporated in a substrate recognition unit of an electronic component mounting apparatus, and configured to irradiate the circuit substrate with reflected light obtained by reflecting light emitted from the light source on the light reflection surface. An illumination unit, a light source that emits light including a wavelength component of light reflected when the electronic component is irradiated with white light, and a light reflection surface that includes a component for forming an exterior of the electronic component as a main component. A second reflector configured to incorporate the component in a component recognition unit of the electronic component mounting apparatus, and to irradiate the electronic component with reflected light obtained by reflecting light emitted from the light source on the light reflecting surface. It has a lighting section. Illumination device for image processing system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000010248A JP4430184B2 (en) | 2000-01-17 | 2000-01-17 | Illumination method, illumination apparatus, and component mounting apparatus using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000010248A JP4430184B2 (en) | 2000-01-17 | 2000-01-17 | Illumination method, illumination apparatus, and component mounting apparatus using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001202515A true JP2001202515A (en) | 2001-07-27 |
| JP2001202515A5 JP2001202515A5 (en) | 2007-01-11 |
| JP4430184B2 JP4430184B2 (en) | 2010-03-10 |
Family
ID=18538283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000010248A Expired - Fee Related JP4430184B2 (en) | 2000-01-17 | 2000-01-17 | Illumination method, illumination apparatus, and component mounting apparatus using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4430184B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130107546A (en) * | 2012-03-22 | 2013-10-02 | 삼성테크윈 주식회사 | Apparatus and method for inspect component |
-
2000
- 2000-01-17 JP JP2000010248A patent/JP4430184B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130107546A (en) * | 2012-03-22 | 2013-10-02 | 삼성테크윈 주식회사 | Apparatus and method for inspect component |
| KR101716217B1 (en) | 2012-03-22 | 2017-03-14 | 한화테크윈 주식회사 | Apparatus and Method for inspect component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4430184B2 (en) | 2010-03-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4122187B2 (en) | Illumination device, recognition device including the same, and component mounting device | |
| JP3354131B2 (en) | Lighting for surface inspection of goods | |
| CN100438745C (en) | Optical sensor device | |
| KR100880418B1 (en) | Automated optical inspection system | |
| EP1358473A2 (en) | Lcc device inspection module | |
| WO1997032180A1 (en) | Device comprising diffuse foreground illumination for detecting an electronic component, and component-mounting machine provided with such a detection device | |
| JP2001522997A (en) | Apparatus and method for detecting the position of a component and / or for detecting the position of a connection of a component, and a mounting head having a device for detecting the position of a component and / or detecting the position of a connection of a component | |
| JP2001202515A (en) | Lighting device for image processing system | |
| US7190393B2 (en) | Camera with improved illuminator | |
| JPH1197900A (en) | Electronic component mounting apparatus and electronic component mounting method | |
| JP2003124700A (en) | Imaging apparatus | |
| JP3733800B2 (en) | Electronic component recognition apparatus in electronic component mounting apparatus | |
| JP4818572B2 (en) | Image recognition apparatus and image recognition method | |
| JP5930284B2 (en) | Illumination apparatus, imaging apparatus, screen printing apparatus, alignment method, and substrate manufacturing method | |
| JP2000299599A (en) | Component recognizing apparatus | |
| JPH0652169B2 (en) | Parts position recognition method and device | |
| JPH08222896A (en) | Illuminator for mounting machine | |
| JP3750383B2 (en) | Electronic component recognition apparatus and electronic component recognition method in electronic component mounting apparatus | |
| KR19990018439A (en) | Component Inspection Device | |
| JP3827999B2 (en) | Infrared imaging device, light source device and bandpass filter | |
| JPH07174539A (en) | Image-processing apparatus | |
| KR970078812A (en) | Parts inspection device of printed circuit board | |
| CN100514046C (en) | Image recognition apparatus and image recognition method | |
| KR20030089293A (en) | Integrated x-ray and visual inspection system | |
| JPH0353503A (en) | Illumination light moving type laser trimming device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061102 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061102 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20090526 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090810 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090901 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20091026 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091030 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091124 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20091217 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121225 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121225 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131225 Year of fee payment: 4 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |