JP2001267627A - Infrared data communication module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cover the whole module with a shielding case and to reduce the size and weight of the module. SOLUTION: Conductive patterns formed on the top and bottom surfaces of a resin substrate 1 are electrically connected to each other through the through hole electrode 2a of a through hole 2. A circuit substrate 1A, on which electrodes 6a, 6b for external connection to be connected to the wiring pattern of a printed substrate or the like are formed, is mounted on one side of the substrate 1, and a light emitting device 3 and a photodetector 4 are mounted on the top surface of the substrate 1A, and an IC chip 5 is mounted on the bottom side of the substrate 1A. The top surfaces of the light emitting device 3 and the photodetector 4 are sealed with a transparent sealing resin 7 to cover the semispherical lens portions 7a, 7b. An IC chip 5 on the bottom side is sealed with the resin 7, a mold frame 9 is fixed to the bottom surface of the substrate 1A to surround the IC chip 5, the opening 9a of the mold frame 9 is closed with a magnetic shielding plate 10 to cover the top surface of the IC chip 5, and the shielding plate 10 is connected to the GND terminal 11 of the module with solder or the like. By making the shielding case of a plate, the module can be reduced in size and weight.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an infrared data communication module used for electronic equipment such as a personal computer, a printer, a PDA, a facsimile, a pager, and a mobile phone.

[0002]

2. Description of the Related Art In recent years, there has been a strong demand for miniaturization of infrared data communication modules in portable devices such as notebook computers, PDAs, and mobile phones equipped with an optical communication function. L
A light-emitting element consisting of an ED, a light-receiving element consisting of a photodiode, a circuit part consisting of an IC chip that incorporates an amplifier, a drive circuit, etc., are directly die-bonded and wire-bonded to a lead frame, and a lens-integrated resin mold made of visible light cut epoxy resin Thus, an infrared data communication module in which a transmitting unit and a receiving unit are integrated into one package has been developed. A schematic structure of a conventional general infrared data communication module will be described.

In the infrared data communication module, a light emitting element, a light receiving element, and an IC chip are connected only to the upper surface side of a lead frame by die bonding and wire bonding. A hemispherical lens portion having a function of irradiating and condensing infrared light with a transparent resin such as an epoxy resin containing a visible light-cutting agent is formed on the upper surfaces of the light emitting element and the light receiving element while protecting the electronic components. Resin sealing.
The terminals of the lead frame protrude outside from the main body of the infrared data communication module to be mounted on a wiring pattern of a mother board such as a Punlit board. Also,
There is an infrared data communication module having a structure in which a capacitor is mounted on the upper surface side of the lead frame in addition to the light emitting element, the light receiving element, and the IC chip.

A light emitting element and a light receiving element are mounted on an upper surface of a circuit board in a substrate type, and the IC is mounted on a lower surface thereof.
Japanese Patent Application Laid-Open No. Hei 10-233471 discloses a technology of an infrared data communication module in which a chip is mounted and the entire module is covered with a shield case to provide a shielding effect. The outline will be described below with reference to the drawings (FIGS. 4 to 8).

In FIG. 4 to FIG. 8, reference numeral 1 denotes an insulating resin substrate made of a glass epoxy resin or the like and having a substantially rectangular flat surface, and a conductive pattern (not shown) formed on the upper and lower surfaces of the resin substrate. Electrical connection is made through the through-hole electrode 2a of the through-hole 2 formed on the plane of the substrate 1. In addition, the through-hole electrodes of the plurality of through-holes 6 formed on one side surface of the resin substrate 1 serve as external connection electrodes 6a that are connected to a wiring pattern of a mother board (not shown) such as a printed circuit board. A circuit board 1A in which a conductive pattern is formed on the resin substrate 1 is configured.
A part of the external connection electrode 6a, which is a through hole electrode of the through hole 6, extends to the lower surface of the circuit board 1A to form an external connection electrode 6b, thereby enabling side mounting. Although a glass epoxy substrate is used as the circuit board 1A, an alumina ceramic substrate, a plastic film substrate such as polyester or polyimide may be used.

Further, reference numeral 3 denotes a light emitting element comprising a high-speed infrared LED, and reference numeral 4 denotes a light receiving element comprising a photodiode. Both are mounted on the upper surface side of the circuit board 1A, and are connected to the conductive pattern by die bonding and wire bonding. Reference numeral 5 denotes an IC chip having a circuit portion in which a high-speed amplifier, a drive circuit, and the like are incorporated. Have been.

[0007] In the figure, reference numeral 7 denotes an epoxy-based translucent resin containing a visible light cutting agent for sealing the light emitting element 3 and the light receiving element 4 with resin. The translucent resin 7 forms hemispherical lens portions 7a and 7b on the upper surface of the light emitting element 3 and the light receiving element 4 to provide the function of irradiating and condensing infrared light and at the same time protect both elements. . I mounted on the lower surface of the circuit board 1A
The sealing of the C chip 5 is not limited to the translucent resin 7 and may be sealed with another thermosetting resin.

As shown in FIGS. 4 to 8, the above-described infrared data communication module has a through hole 8a at a position corresponding to the hemispherical lens portions 7a and 7b formed on the upper surface of the light emitting element 3 and the light receiving element 4. However, in the case of side mounting on a motherboard, a shield case 8 made of a member made of stainless steel, aluminum, copper or the like having an opening 8b at a position corresponding to the external connection electrode surface 6a formed on the side surface of the circuit board 1A, Since the circuit section and the like are surrounded by covering the module main body, it is possible to take measures against electromagnetic shielding, which is extremely effective in preventing the influence of external noise and the like. Therefore, surfaces other than those mounted on the hemispherical lens portions 7a and 7b and the motherboard are covered by the shield case 8.

[0009]

However, the above-mentioned substrate type infrared data communication module has a structure in which the entire module is covered with a shield case in order to provide a shielding effect. There was a limit. In addition, there is a problem that the weight is increased due to the metal case. The challenge is to realize a small and especially lightweight infrared data communication module.

The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a high-speed infrared LE on the front side of a circuit board.
An object of the present invention is to provide a small, thin, and especially lightweight infrared data communication module having a light-emitting element made of D and a light-receiving element made of a photodiode and having a magnetic shielding function in which an IC chip on the back side is mounted.

[0011]

In order to achieve the above object, an infrared data communication module according to the present invention comprises a conductive pattern formed on an upper surface and a lower surface of a substrate having a substantially rectangular shape on a plane of the substrate. While electrically connected through the through-hole electrode of the formed through-hole,
A circuit board having an external connection electrode connected to a wiring pattern such as a printed board on at least one side surface of the board; and an electronic device such as a light emitting element, a light receiving element, an IC chip and a capacitor provided on an upper surface side of the circuit board. Among the components, at least the light emitting element and the light receiving element are mounted, the IC chip is mounted on the lower surface side, and the upper surface side of the light emitting element and the light receiving element is resin-sealed with a translucent resin so as to cover the upper surface with the hemispherical lens portion. The IC chip on the lower side is sealed with a resin, and a magnetic shield plate is fixed so as to cover the upper part of the IC chip, and the shield plate is connected to the GND terminal of the module by a fixing means such as soldering. Is what you do.

Further, a mold frame is fixed to the lower surface of the circuit board so as to surround the IC chip resin-sealed under the circuit board, and an opening of the mold frame is closed with a magnetic shield plate so as to cover the IC chip. The shield plate is connected to the GND terminal of the module by a fixing means such as soldering.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an infrared data communication module according to the present invention will be described with reference to the drawings. 1 to 3 relate to an infrared data communication module according to an embodiment of the present invention. FIG. 1 is a front view of the infrared data communication module, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG.
FIG. In the drawings, the same members as those of the prior art are denoted by the same reference numerals.

In FIG. 1 to FIG. 3, reference numeral 1 denotes an insulating resin substrate made of glass epoxy resin or the like, and conductive patterns (not shown) formed on the upper and lower surfaces thereof are formed on the plane of the resin substrate 1. The plurality of formed through holes 2 are electrically connected through the through hole electrodes 2a. The through-hole electrodes of the plurality of through-holes 6 for external connection formed on one side surface of the resin substrate 1 become the external connection electrodes 6a to be connected to a wiring pattern of a mother board such as a printed board (not shown). A circuit board 1A in which a conductive pattern is formed on the resin substrate 1 is configured.
A part of the external connection electrode 6a, which is a through hole electrode of the through hole 6, extends to the lower surface of the circuit board 1A to form an external connection electrode 6b, thereby enabling side mounting.

In FIG. 1, reference numeral 3 denotes a light emitting element comprising a high-speed infrared LED, and reference numeral 4 denotes a light receiving element comprising a photodiode. Both are mounted on the upper surface side of the circuit board 1A, and are connected to the conductive pattern by die bonding and wire bonding. Reference numeral 5 denotes an IC chip having a circuit unit in which a high-speed amplifier, a drive circuit, and the like are incorporated.
It is die-bonded and wire-bonded to the conductive pattern on the lower surface side of the circuit board 1A, and is connected via the through-hole electrode 2a of the through-hole 2.

In the figure, reference numeral 7 denotes a light emitting element 3 as in the prior art.
And an epoxy-based translucent resin containing a visible light cutting agent for sealing the light receiving element 4 with a resin. The translucent resin 7 forms hemispherical lens portions 7a and 7b on the upper surface of the light emitting element 3 and the light receiving element 4 to provide the function of irradiating and condensing infrared light and at the same time protect both elements. . The sealing of the IC chip 5 mounted on the lower surface of the circuit board 1A is performed using the light-transmitting resin
The present invention is not limited to this, and may be sealed with another thermosetting resin.

The resin-sealed I under the circuit board 1A
Mold frame 9 surrounds C chip 5 with circuit board 1A.
Then, the opening 9 a of the mold frame 9 is fixed to the magnetic shield plate 1 so as to cover the upper surface of the IC chip 5.
Close at 0. First, the opening 9a of the mold frame 9 may be closed with the magnetic shield plate 10, and the mold frame 9 may be fixed to the lower surface of the circuit board 1A with an adhesive or the like. The shield plate 10 is made of a plate-like metal, such as stainless steel, aluminum, or copper, which provides a shielding effect.
Is connected to the GND terminal 11 of the module. The connection is performed by a fixing means such as soldering at the time of module mounting described later.

In order to mount the infrared data communication module 20 having the above configuration on a motherboard such as a printed circuit board of various devices, an external connection electrode 6a (through-hole electrode) on the infrared data communication module 20 side is connected to the motherboard. After alignment with the wiring pattern, the shield plate 10 is connected to the GND terminal 11 of the module by a fixing means such as reflow soldering. The light emitting element 3 and the light receiving element 4 can be side mounted so that the direction of light emission and light reception is parallel to the surface of the motherboard.

With the configuration of the infrared data communication module described above, a small and lightweight infrared data communication module can be electromagnetically shielded by a plate-shaped shield plate above the IC chip mounted on the back side of the circuit board. Can be.

[0020]

As described above, according to the present invention,
At least a light emitting element and a light receiving element are mounted on the upper side of the circuit board, an IC chip is mounted on the lower side, and the upper side and the lower side are connected through through-hole electrodes. By using a plate-shaped member that shields the upper surface of the IC chip, it is possible to provide an infrared data communication module in which a small, particularly thin and lightweight module body can be side-mounted on a motherboard.

[Brief description of the drawings]

FIG. 1 is a front view of an infrared data communication module according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a rear view of FIG. 1;

FIG. 4 is an external perspective view of a conventional infrared data communication module as viewed from the front.

FIG. 5 is a perspective view of FIG. 4 as viewed from the back.

FIG. 6 is a sectional view illustrating the structure of the infrared data communication module of FIG. 4;

FIG. 7 is a sectional view of a main part of FIG. 6;

FIG. 8 is a rear view of FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resin board 1A Circuit board 2 Through hole 2a Through hole electrode 3 Light emitting element 4 Light receiving element 5 IC chip 6 External connection through hole 6a, 6b External connection electrode 7 Translucent resin 9 Mold frame 9a Opening 10 Shield plate 11 GND terminal 20 Infrared data communication module

Claims (2)

[Claims] A conductive pattern formed on an upper surface and a lower surface of a substrate having a substantially rectangular shape is electrically connected through a through-hole electrode of a through-hole formed on the surface of the substrate, and at least the substrate is formed. On one side of
A circuit board on which an external connection electrode connected to a wiring pattern such as a printed board is formed; and an electronic component such as a light emitting element, a light receiving element, an IC chip, and a capacitor on the upper surface side of the circuit board. Mount the element,
The IC chip is mounted on the lower surface side, and the upper surface of the light emitting element and the light receiving element on the upper surface side is resin-sealed with a translucent resin so as to cover the upper surface with a hemispherical lens portion, and the IC chip on the lower surface side is resin-sealed. An infrared data communication module, wherein a magnetic shield plate is fixed so as to cover an upper portion of the IC chip, and the shield plate is connected to a GND terminal of the module by a fixing means such as soldering. 2. An IC resin-sealed under the circuit board.
A mold frame is fixed to the lower surface of the circuit board so as to surround the chip, and the opening of the mold frame is closed with a magnetic shield plate so as to cover the IC chip.
2. The infrared data communication module according to claim 1, wherein the infrared data communication module is connected to the ND terminal by a fixing means such as soldering.