JP2001260024A - Washing device for dresser device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a washing device for a dresser device, for removing deposits stuck to a polishing body of the dresser device. SOLUTION: A wiping body driving mechanism is constituted of a rotatably supported shaft body 20, and a driving device 40 for rotationally driving the shaft body 20. A removing means is provided for removing deposits on the polishing body 8 by a deposit wiping body 30 supported on the shaft body 20, capable of being brought in contact with the polishing body 8, and for wiping the deposits on the polishing body 8; and a washing liquid supplying mechanism 50 for supplying washing liquid to a contact part when the deposit wiping body 30 is brought into contact with the polishing body 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to chemical mechanical polishing for polishing, for example, semiconductor wafers and the like.
The present invention relates to a dressing device cleaning device used in a (CMP) device.

[0002]

2. Description of the Related Art A semiconductor wafer (hereinafter, referred to as a semiconductor wafer) cut from, for example, a silicon ingot on which semiconductor devices are formed.
The wafer is simply required to be mirror-polished so that its surface becomes a highly accurate and defect-free surface with miniaturization of devices. As a method for chemically and mechanically polishing the surface of a wafer that requires such precise polishing accuracy, a method called a chemical mechanical polishing method (CMP method) is known.

[0003] The CMP method is, for example, an algorithm using silica.
There are potash slurry and neutral slurry using selenium.
Or acidic slurry using alumina, etc.
Chemically and mechanically by using abrasive materials)
This is a method of polishing and flattening the wafer surface. And C
As a device for polishing the surface of a wafer using the MP method
For example, there is one shown in FIG. 9 as an example.

In this CMP apparatus 1, a polishing pad 4 made of, for example, hard urethane is provided on a disk-shaped rotary table 3 attached to a center shaft 2, and is opposed to the polishing pad 4; A wafer carrier 5 is disposed at a position eccentric from the center axis 2 of the polishing pad 4. The wafer carrier 5 has a disk shape smaller in diameter than the polishing pad 4 and is capable of rotating, and holds the wafer 6. The wafer carrier 5 is provided with a vertical movement mechanism for bringing the wafer 6 into contact with the polishing pad 4. .

At the time of polishing, the wafer carrier 5 contacts the polishing pad 4 while rotating the wafer 6, and at the same time, the polishing pad 4 rotates about the central axis 2 so that both slide on the contact surface. Then, when the above-mentioned abrasive material S is supplied onto the polishing pad 4, when the abrasive material S flows between the wafer 6 and the polishing pad 4 due to both slidings, the surface of the wafer 6 is polished and flattened. Be transformed into

The polishing pad 4 is made of, for example, hard urethane, and has a large number of fine foam layers for holding the abrasive S on its surface. Wafer 6 and polishing pad 4
The abrasive material S flowing during this time is also held in these foamed layers, and is supplied at the time of polishing. However, if the polishing of the wafer 6 is repeated, and this foamed layer causes clogging or blinding by polishing the wafer 6, the polishing efficiency of the wafer 6 decreases.

For this reason, a conventional CMP apparatus 1 is provided with, for example, a dresser device 7 as shown in FIG. 9 as an example, and the surface of the polishing pad 4 is cut and polished by an operation called dressing, and the porous material is formed again. The foam layer is exposed on the surface.

The dresser device 7 includes a polishing body 8 having a disk-like shape and a grinding action portion (not shown in FIG. 9) formed on one end surface, and a rotation driving mechanism (rotation driving mechanism for rotating the polishing body 8 about a central axis). (Not shown) and an arm 9 for holding the polishing body 8. Further, the polishing body 8 is carried on the polishing pad 4 and is brought into contact with the polishing pad 4 on the surface of the grinding action portion. A moving mechanism 10 is provided that moves the polishing pad 4 in parallel with the polishing pad 4 while being pressed against the polishing pad 4.

Here, the moving mechanism 10 includes, for example, the arm 9
An X-axis rotation drive mechanism 11 for rotating the X-axis around the X-axis;
And a Y-axis rotation drive mechanism 12 that rotates around an axis. Further, although not shown, when the polishing body 8 is pressed against the polishing pad 4 on the surface of the grinding section, the polishing body 8 is moved to the moving mechanism 10 so that the polishing body 8 is parallel to the polishing pad 4.
A mechanism is provided for adjusting the angle of inclination of the arm 9 with respect to the arm 9.

In the dresser device 7 shown as an example in FIG. 9, when the polishing pad 4 is dressed, first, the surface of the grinding portion of the polishing body 8 is pressed against the surface of the polishing pad 4 by the moving mechanism 10. Then, the polishing body 8 rotating around the central axis is rotated by the X-axis rotation driving mechanism 11.
Oscillates reciprocally on the rotating polishing pad 4. Thus, the grinding section of the polishing body 8 cuts and polishes the surface of the polishing pad 4 to expose the porous foamed layer without clogging or blinding to the surface again.

[0011]

By the way, as described above,
In a dresser device like this, the grinding action mainly
On the surface of the part, the cutting debris of the polishing pad and the polishing debris of the wafer
A substance such as a modified abrasive material adheres. Such deposits
Is solidified or gelled on the surface of the grinding section and deteriorates
The next time you dress the polishing pad,
The kimono is left on the polishing pad and remains for polishing the wafer.
When this occurs, scratches and the like on the wafer surface
There was a problem of scratching. Also, the grinding action part table
Even if the surface is immersed in the cleaning solution, the deposits
Not removed with stickiness, causing similar problems
Was.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a dressing device cleaning apparatus capable of effectively removing deposits from a polishing body.

[0013]

Means for Solving the Problems The invention according to claim 1
Is a substantially disk-shaped abrasive body having a grinding action portion,
A rotation drive mechanism for rotating the body, and the grinding action portion is polished
Place the polishing body on the polishing pad so that it comes into contact with the pad
Having a moving mechanism for carrying in and out, wherein the polishing body and the
The polishing pad is moved by relatively moving the polishing pad.
A cleaning device for a dresser device for polishing, wherein the polishing body
Installed in the moving area of the polishing body to remove the deposits on the polishing body
Removing means, which is free to abut on the abrasive body
An adhering substance wiping body installed on the surface for wiping off the adhering substance of the abrasive body
And when the adhering substance wiping body contacts the abrasive body.
A cleaning liquid supply mechanism for supplying the cleaning liquid to the contacted part.
It is characterized by becoming.

With this configuration, the polishing
Grinding at least a part of the abrasive body carried out from the pad
The surface of the part and its vicinity are
Contacting the adhering substance wiping body, for example,
The surface of the grinding section slides on the adhering substance wiping body,
Is mechanically removed from the abrasive body and wiped. Soshi
Cleaning fluid is applied to the area where the abrasive body and
The cleaning liquid supplied from the supply mechanism is present,
Is diffused into the cleaning solution and the cleaning solution flows,
It is separated from the abutting portion while being contained in the cleaning liquid.
In this way, the deposit is removed from the polishing body.

[0015] The invention according to claim 2 provides the invention according to claim 1.
What is claimed is: 1. A cleaning device for a dresser device, comprising:
Is in contact with the abrasive body, the adhering substance wiping body is
The adhering substance wiping body is moved so as to slide on the grinding action surface.
And a wiping body drive mechanism for driving.
You.

With such a structure, the polishing body
Grinding machine surface and its vicinity is a polishing body
When the abutment is brought into contact with the adhering substance wiping body,
Is driven to slide on the grinding action surface,
It is mechanically removed from the body and wiped. That is,
In the state where at least a part of the grinding action part surface and its vicinity in the circumferential direction are in contact with the attached matter wiping body, the attached matter wiping body is driven so as to slide on the entire grinding action part surface, or the abrasive body is By rotating around the central axis and driving the attached matter wiping body, the attached matter is efficiently wiped from the abrasive body.

[0017] The invention according to claim 3 provides the invention according to claim 2.
A cleaning device for a dresser device, wherein the wiping body driving machine
The structure includes a shaft that supports the attached matter wiping body, and a shaft that supports the body.
And a driving device for rotationally driving.
You.

With this configuration, the grinding work
Adhesion removal with the surface of the part and its vicinity supported by the shaft
Abuts on the wipe, and in this state the shaft is
Therefore, by rotating, wiping off the adhered matter supported by the shaft
From the center of rotation drive at the part where the body contacts the abrasive body
Is driven at a speed proportional to the distance of
It is slid continuously against the action part. In this way,
The adhering substance wiping body makes sliding movement on the surface of the grinding action section,
It is effectively wiped off from the abrasive body.

The invention according to claim 4 is the invention according to claim 3.
What is claimed is: 1. A cleaning device for a dresser device, comprising:
Is formed of a member in which the cleaning liquid is permeated and held,
The cleaning liquid supply mechanism includes a cleaning liquid storage tank and the cleaning liquid storage tank.
At least a part of the adhered substance wiping body is immersed in the tank.
And the washing liquid stored as described above.
And

[0020] By adopting such a structure, the attached matter
Part of the wiping body is immersed in the cleaning liquid, and the cleaning liquid
The cleaning liquid penetrates and is retained, and the retained adhesion of the cleaning liquid
The wiping body part contacts the abrasive body by the wiping body drive mechanism.
Cleaning liquid is supplied to the contact area with the polishing body
Is done. Examples of such an adhering substance wiping body include a bra
A hair-like body or sponge-like spongy material
Can be used. Also, on the wiping body
After wiping off the adhering material,
Quickly separates from polishing body by rotating motion and adheres to polishing body
Prevents reattachment of substances and spreads them efficiently into the cleaning solution.
Be scattered. Thus, the adhered substance is effectively removed from the abrasive body.
Left.

According to a fifth aspect of the present invention, there is provided the third aspect of the present invention.
A washing device for a dresser device, wherein the shaft body is
It has a hollow portion inside and outward from the hollow portion to the outer peripheral surface
It is provided with a plurality of communicating holes, the adhering substance wiping body,
The cleaning liquid is formed of a member that penetrates and is retained,
The cleaning liquid supply mechanism is provided in front of the hollow portion and the plurality of holes.
Cleaning liquid supply for supplying the cleaning liquid to the surface of the attached object wiping body
It is characterized by comprising a device.

With such a configuration, the cleaning liquid
The cleaning liquid is sent to the hollow part inside the shaft by the supply mechanism,
The cleaning liquid is supplied from a plurality of holes communicating from the void to the outer peripheral surface.
Be paid.

The invention according to claim 6 is the invention according to claim 1.
A cleaning device for a dresser device, wherein the removing unit includes:
Instead of the adhering substance wiping body and the cleaning liquid supply mechanism,
High-pressure cleaning liquid supply mechanism that jets high-pressure cleaning liquid to the polishing body
It is characterized by having.

With such a configuration, the polishing body
Deposits are washed away from the abrasive body by the high-pressure cleaning solution.
To be removed.

[0025] The invention according to claim 7 is the invention according to claim 1.
A cleaning device for a dresser device, wherein the removing unit includes:
Instead of the adhering substance wiping body and the cleaning liquid supply mechanism,
It has an ultrasonic application mechanism that applies ultrasonic vibration to the purified liquid.
It is characterized by that.

With such a structure, the polishing body
Is removed by ultrasonic cleaning.

[0027] The invention according to claim 8 is the invention according to claims 1 to 7.
A washing device for a dresser device according to any of the above,
The cleaning liquid containing the deposit used for cleaning the abrasive body
Is collected, and the deposits and other contaminants are removed from the cleaning solution.
Characterized in that it is provided with a cleaning liquid regenerating means for removing objects.
I do.

With such a structure, the polishing body
Cleaning liquid regenerating means from cleaning liquid containing deposits used for cleaning
This removes deposits and other contaminants.
As the washing liquid regenerating means, for example, washing with a filter or the like
Neutralizes the filtering function of the purified liquid and the acid or alkali of the abrasive.
Means or the like is used.

[0029]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a dressing device cleaning apparatus according to an embodiment of the present invention.

[First Embodiment] FIGS. 1 and 2 show a first embodiment of a cleaning apparatus for a dresser apparatus according to the present invention. Cleaning device A for dresser device shown in FIGS. 1 and 2
For example, when used in the dresser device 7 shown in FIG. 9, it is installed on the side of the CMP device 1 in the moving area of the polishing body 8 by the moving mechanism 10 of the dresser device 7. Then, the cleaning device A for the dresser device includes the adhering substance wiping body 30, the cleaning liquid supply mechanism 50, and the cleaning liquid regeneration mechanism 6.
0 (cleaning liquid regenerating means), and is provided with a wiping body driving mechanism including a shaft body 20 having a horizontal axis W as a center axis and a driving device 40 for driving the shaft body 20 to rotate.
Here, the adhering substance wiping body 30 and the cleaning liquid supply mechanism 50 cooperate with each other to constitute a removing unit for removing the adhering substance on the abrasive body.

The shaft body 20 includes a center body 21 which is axially symmetric about the center axis, and a wiping body holding cylinder 22 which is fitted to the center body 21 and holds the wiping body 30. Centrosome 21
At one end of the wiping body holding cylinder 22, a contact disk 21a that comes into contact when the wiping body holding cylinder 22 is fitted is provided.
2 is provided with a screw portion 21b projecting at the time of fitting.
The outer diameter of the wiping body holding cylinder 22 is smaller than the outer diameter of the wiping body holding cylinder 22 when the wiping body holding cylinder 22 is externally fitted to the center body 21 and is in contact with the abutting disk 21a. It is fixed to the center body 21 by a nut 23.

The adhering substance wiping body 30 includes a wiping body holding cylinder 22.
Hairs 31, 3 of approximately equal length implanted on the outer surface of the
1, a brush-like one. Here, the hair 3
Are formed of, for example, a synthetic resin.

The cleaning liquid supply mechanism 50 includes a cleaning liquid storage tank 51.
And a cleaning liquid supply device 54 for supplying a cleaning liquid to the cleaning liquid storage tank 51 via a supply pipe 52. Inside the storage tank 51, an overflow wall 55 whose height is smaller than the outer wall 51a of the storage tank 51 is provided so as to form a double outer wall of the storage tank 51 in cooperation with the outer wall 51a. The supply pipe 52 has an opening 52 a inside the storage tank 51 with respect to the overflow wall 55 and at the bottom of the storage tank 51.

The washing liquid regenerating mechanism 60 collects used washing liquid containing adhering matter through an outflow pipe 53 having an opening 53a below the outer wall 51a. And a means for neutralizing the acid or alkali contained in the abrasive material.

The driving device 40 for rotating and driving the shaft body 20 includes:
It is fixed to the outer wall 51a of the storage tank 51. In addition, the rotating rotating shaft 41 protruding from the driving device 40 has an outer wall 51.
a. The rotation transmission shaft 4 is attached to the rotation shaft 41.
2 is fixed with the same central axis (rotation axis), and is further fixed with the same center axis on the abutting disk 21 a so as to transmit the rotation of the rotation shaft 41 to the shaft body 20.
The end of the rotation transmission shaft 42 on the side opposite to the contact disk 21a is
It is inserted through the outer wall 51a, and between the outer peripheral surface of the rotation transmission shaft 42 and the outer wall 51a, the space between them is sealed in a liquid-tight manner,
And a packing 43 enabling rotation of the rotation transmission shaft 42
Is provided. Here, the driving device 40 is connected to the shaft body 20.
Is fixed so that the uppermost portion of the attached matter wiping body 30 provided outside the upper side of the overflow wall 55 is higher than the upper end portion of the overflow wall 55.

Further, in order to stabilize the rotation axis W of the shaft body 20, a supporting cylindrical portion 24 having an outer diameter smaller than that of the screw portion 21b is provided on the screw portion 21b of the center body 21 so that the center body 21 and the center axis are aligned. It is provided similarly, and is rotatably supported by a support 25 fixed to the bottom of the storage tank 51.

FIG . 5 shows a dress having such a configuration.
The uppermost part of the adhering substance wiping body 30 of the cleaning device A for the
The surface of the grinding action portion 13 abuts evenly on the adhering substance wiping body 30
In order to make it easier, the height of the polishing pad 4 was set to be almost the same as the surface height.
An example is shown.

As one example, FIG. 1 shows the polishing body 8 held by the arm 9 in a state in which the polishing body 8 is in contact with the attached matter wiping body 30. Here, the substantially disc-shaped polishing body 8
A convex portion 8b extending annularly with a predetermined width at a peripheral end of the bottom surface 8a of the polishing body 8 and protruding from the bottom surface 8a;
There is a grinding action portion 13 formed on the tip end surface of the projection 8b.

In the cleaning device A for a dresser device shown in FIGS. 1, 2 and 5, first, the polishing body 8 is moved by the moving mechanism 10 of the dresser device 7, for example, by arrows (a) and (b) in FIG. The part is moved in the direction shown, and a part of the surface of the grinding action part 13 is brought into contact with the attached matter wiping body 30. At this time, the synthetic resin hairs 31, 31,... Constituting the attached matter wiping body 30 are each made of thin hairy synthetic resin and therefore have flexibility, and the grinding action portion 13 is attached to the attached matter wiping body. 3
0, the entire surface of the grinding action portion 13 such as the protrusion 8b protruding from the polishing body 8 and the peripheral edge of the bottom surface 8a as well as the surface of the grinding action portion 13 are deformed. Contacted.

The driving body 40 rotates the shaft body 20 around the horizontal rotation axis W in the direction shown by the arrow (c) in FIG. 1, and the polishing body 8 rotates around the vertical center axis Z in FIG. When rotated in the direction shown in (d), the adhering substance wiping body 3
Numeral 0 slides on the surface of the polishing body 8 including the surface of the grinding action portion 13 and the vicinity thereof, and wipes off the attached matter from the polishing body 8. Here, the direction indicated by the arrow (c) and the direction indicated by the arrow (d) are different directions in the contact portion,
The relative speed of the deposit wiping body 30 to the deposit is increased.

In the cleaning liquid supply mechanism 50, the cleaning liquid supply
The cleaning liquid is supplied to the storage tank 5 through the supply pipe 52 by the supply device 54.
1 and hairs 31 and 3 on the upper part of the adhering substance wiping body 30.
Cleaning so that the tip of 1 ... is higher than the level of the cleaning liquid
In the adhering substance wiping body 30 partially immersed in the liquid,
The cleaning liquid is permeated and held between 31, 31,.
When the 0 rotates, the hairs 31, 31,...
While holding the polishing body 8 in contact with the polishing body 8 above the shaft body 20.
, And at the same time held between the hairs 31, 31,.
Washing liquid is transferred to the tips of the hairs 31, 31 ... by centrifugal force.
And the cleaning liquid is supplied to the contact portion with the polishing body 8.
It is. Thus, the surface of the grinding section 13 and the adhering substance wiping body 3
The cleaning liquid supplied from the cleaning liquid supply mechanism 50 is present in the portion where the cleaning liquid supply mechanism 50 contacts, and the adhered substance diffuses into the cleaning liquid and flows through the cleaning liquid. Discrete. Thus, the deposit is removed from the polishing body 8.

With the cleaning of the surface of the grinding section 13, the cleaning liquid stored in the storage tank 51 gradually becomes smaller.
Although the substance adhering to the surface is mixed, the cleaning liquid is always supplied to the storage tank 51 by the cleaning liquid supply device 54, and when the liquid level reaches the upper end of the overflow wall 55,
The used cleaning liquid containing the adhering substance overflows into the space between the overflow wall 55 and the outer wall 51a together with the adhering substance, whereby the cleaning liquid is replaced. The cleaning liquid containing extraneous matter that has overflowed beyond the overflow wall 55 is collected by the cleaning liquid regeneration mechanism 60 through the outflow pipe 53 and purified. The cleaning liquid regenerated so as to be reusable by the cleaning liquid regeneration mechanism 60 is sent to the cleaning liquid supply device 54 by a cleaning liquid transport mechanism (not shown).

According to the cleaning device A for the dresser device shown in FIG. 1, the adhered matter adhering to the surface of the grinding action portion 13 of the polishing body 8 and the vicinity thereof is wiped off by the brush-like adhered substance wiping body 30, and the cleaning liquid is used. It can be removed by washing away.

In the above embodiment, the attached matter wiping member 3 is used.
The remaining portion is immersed in the cleaning liquid except for the uppermost portion of the zero, but the point is that the cleaning liquid is sufficiently held between the hairs 31, 31 and supplied to the contact portion with the grinding action portion 13. Alternatively, a configuration may be employed in which a part of the adhered substance wiping body 30 is slightly immersed in the cleaning liquid.

Alternatively, on the contrary, the height of the overflow wall 55 may be increased so that the attached matter wiping body 30 is completely immersed in the cleaning liquid. According to such a configuration, the cleaning liquid can always be present around the hairs 31, 31,.... That is, the entire surface of the grinding section 13 is
Since it is always immersed in the cleaning liquid, it is possible to sufficiently soften the deposits and to supply a large amount of the cleaning liquid in which the deposits are diffused to the surroundings, thereby more effectively wiping off the deposits. it can.

When the installation location is restricted, the size of the storage tank 51 is reduced, and the height of the outer wall 51a is set to be the same as that of the overflow wall 55 so that the surface of the grinding section 13 does not interfere with the outer wall 51a. It is good also as a structure which performs.

[Second Embodiment] Next, a second embodiment of the cleaning device for a dresser device according to the present invention will be described with reference to FIGS. The dressing device cleaning device B shown in FIGS. 3 and 4 is, for example, a dresser device 7 shown in FIG.
In the case where the moving mechanism 10 of the dresser device 7 is used for
The polishing body 8 is set on the side of the CMP apparatus 1 within the moving area of the polishing body 8. And the cleaning device B for the dresser device
Has an adhering substance wiping body 30, a cleaning liquid supply mechanism 50, and a cleaning liquid regenerating mechanism 60 (cleaning liquid regenerating means). The shaft 20 has a central axis set to a horizontal rotation axis W, and the shaft 20 is rotated. A wiping body driving mechanism including a driving device 40 to be driven is provided. Here, the adhering substance wiping body 30 and the cleaning liquid supply mechanism 50 cooperate with each other to constitute a removing unit for removing the adhering substance on the abrasive body.

The shaft body 20 has a hollow portion 26 therein and a plurality of fine holes 27 communicating from the hollow portion 26 to the outside of the outer peripheral surface. Screw portion 28a provided on the inner peripheral surface of open end 28
And a lid 29 which is screwed liquid-tight.

The adhering substance wiping member 30 is a brush-like member composed of hairs 31, 31... Here, the hairs 31, 31
Are formed of, for example, a synthetic resin.

The cleaning liquid supply mechanism 50 includes a cylindrical cleaning liquid introduction pipe 56 having a central axis which is inserted into the lid 29 and communicates with the hollow portion 26 and whose central axis is the same as the axis of the central body 21, a supply pipe 52 and a cleaning liquid introduction pipe 56. A cleaning liquid replenishing mechanism 60 is provided for supplying the cleaning liquid to the hollow portion 26 of the central body 21 through the outlet pipe 53 and recovering and regenerating the used cleaning liquid including the deposits accumulated in the cleaning liquid recovery tray 57 via the outflow pipe 53. Further, a packing 58 is provided between the lid 29 through which the cleaning liquid introduction tube 56 is inserted and the cleaning liquid introduction tube 56 to enable rotation of the shaft body 20 while sealing the space between the lid 29 and the cleaning liquid introduction tube 56 in a liquid-tight manner.

A dresser having such a configuration
The uppermost part of the attached matter wiping body 30 of the apparatus cleaning device B is, for example,
In this case, the surface of the grinding action portion 13 evenly contacts the adhered substance wiping body 30.
Aligned with the height of the surface of the polishing pad 4 for easy contact
Have been.

As an example of this, FIG. 3 shows that the polishing body 8 held by the arm 9 is further in contact with the surface of the grinding action portion 13 formed on the polishing body 8 against the attached matter wiping body 30. Shown in state. In addition, in the cleaning device B for the dresser device shown in FIGS. 3 and 4, portions corresponding to those shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted here. I do.

In the dressing device cleaning apparatus B shown in FIGS. 3 and 4, similarly to the dressing apparatus cleaning apparatus A shown in FIGS. When the shaft body 20 and the polishing body 8 rotate, the adhered material is wiped off from the surface of the grinding portion 13 and the vicinity thereof by the rotation of the shaft body 20 and the polishing body 8. At this time, the cleaning liquid supplied from the cleaning liquid supply mechanism 50 exists in a portion where the surface of the grinding action section 13 and the adhered substance wiping body 30 are in contact with each other, and the adhered substance is diffused into the cleaning liquid and the cleaning liquid flows. By doing
Discrete from the part that comes in contact with the cleaning liquid. Thus, the deposit is removed from the polishing body 8. Less than,
The cleaning liquid supply mechanism 50 which is a feature of the cleaning device B for a dresser device will be described in detail.

In the cleaning liquid supply mechanism 50, the cleaning liquid is supplied to the hollow portion 26 in the central body 21, and the adhering substance wiping body 30 is formed from a plurality of fine holes 27 communicating outside the outer peripheral surface. Are sent to the hairs 31, 31... Thus, the cleaning liquid is supplied to the portion where the surface of the grinding action section 13 and the adhering substance wiping body 30 are in contact with each other.

The used cleaning liquid containing the adhering substance flows down from the adhering substance wiping body 30, is stored in the cleaning liquid collecting tray 57, is collected by the cleaning liquid regenerating mechanism 60 through the outflow pipe 53, and is regenerated.

According to the dressing apparatus cleaning apparatus B shown in FIGS. 3 and 4, the adhered matter adhering to the surface of the grinding portion 13 of the polishing body 8 and its vicinity is wiped by the brush-like adhered matter wiping body 30. , Can be washed away with a cleaning solution. Further, the cleaning liquid containing no attached matter is directly supplied to the surface of the grinding section 13 from which the attached matter is wiped, and the used cleaning liquid containing the attached matter flows out as it is. Therefore, it is possible to effectively prevent the deposit from being attached to the polishing body again. In this way, the deposit can be removed from the polishing body 8.

In the above embodiment, the attached matter wiping member 3 is used.
The washing liquid containing the adhered substance that has flowed down from 0
It is configured to be collected once at 57, but as shown in FIG.
A structure using a storage tank 51 and an overflow wall 55 is used.
It is good also as a result. That is, in FIG.
52, but instead in the shaft 20
The cleaning liquid is supplied through the hollow portion 26 provided.
You. Attach the inlet where the cleaning liquid is supplied to the grinding action part 13
Deposits are more effective by approaching the wiping body 30
Can be removed. Because, as mentioned above, the abrasive body
The cleaning liquid is directly supplied to the contact portion between the
This is because the reattachment of the adhered substance hardly occurs.

In the above- described embodiments, the substantially circular
An attached matter wiping body 30 is provided on the outer periphery of the cylindrical shaft body 20.
As shown in FIG. 6, the center axis is
Disk having a rotation axis V substantially parallel to and perpendicular to the rotation axis Z
Shaft 20 and a driving device 4 for rotating and driving the shaft 20
And a wiping body drive mechanism comprising:
May be provided on the upper surface of the shaft body 20. Washing
In this embodiment, the liquid supply mechanism 50 supplies the cleaning liquid to the supply pipe 5.
Abutment between the adhering substance wiping body 30 and the grinding action section 13 through
It is configured to inject directly to the part to be heated. Also
Of course, the cleaning liquid supply mechanism 50 is as shown in FIGS.
Such a configuration may be adopted.

More simply, the configuration as shown in FIG.
It may be. That is, the adhering substance wiping body 30 is
The rectangular plate 70 is provided on the arrow (e) in FIG.
Drive device 80 for reciprocating in the direction shown by (F)
(Wiping body drive mechanism) grinds the adhering substance wiping body 30
It is good also as a structure which makes a sliding motion on the surface of the part 13.
The sliding movement of the adhered substance wiping body 30 is only for efficiently removing the adhered substance from the surface of the grinding section 13. For example, the adhered substance wiping body 30 is stopped and the polishing body 8 is rotated. The cleaning liquid may be supplied to a portion where the adhering substance wiping body 30 and the grinding action section 13 are in contact with each other to remove the adhering substance. The point is that the adhered substance wiping body 30 is brought into contact with the grinding action portion 13 and the area near the adhered substance and the abrasive body 8 or both or one of the adhered substance wiping bodies 30 is moved. What is necessary is just to set it as the structure which wipes off an attached matter.

In addition, it is used as the adhering substance wiping body 30.
Is easy to penetrate, hold,
It comes in contact with the surface of the grinding part 13
What is so long as it does not damage the surface of the polishing body 8
However, there are many possibilities for selection. For example, the hair 3
Instead of 1, 31, ..., sponge-like members (sponge-like
) May be used.

As described above, several embodiments have been described with respect to the attached matter wiping body 30 and the cleaning liquid supply mechanism 50 for the attached matter removing means. However, other configurations can be used. For example, as shown in FIG. 8, as a means for removing deposits, the cleaning liquid is supplied to the cleaning liquid
A high-pressure cleaning liquid supply mechanism 61 for sending the cleaning liquid to the polishing body 8 may be provided, and a nozzle 62 may be provided at the tip of the supply pipe 52 to blow the cleaning liquid onto the surface of the polishing body 8 vigorously. According to such a configuration, it is possible to remove the attached matter from the polishing body 8 by the pressure of the cleaning liquid and to wash away the attached matter. Also,
A high-pressure cleaning liquid supply mechanism 61 for spraying the cleaning liquid is provided.
Ultrasonic vibration is applied to the cleaning liquid to be ejected.
It is also possible to provide an ultrasonic wave applying mechanism 63 for giving.
Alternatively, the cleaning liquid is stored in a storage tank, and the grinding action portion 13 and
Immerse the area in the cleaning solution and apply ultrasonic vibration to the cleaning solution.
It is also possible to remove deposits from the polishing body 8 by giving
is there. In the above embodiment, the dresser device shown in FIG. 9 is shown as an example of a dresser device. However, in other dresser devices, the dressing device cleaning device A shown in FIGS. 1 and 2 or FIG. The cleaning device B for the dresser device shown in FIG. 4 is installed in the moving region of the polishing body, and there is no change in removing the deposits from the polishing body.

[0062]

The present invention has the following effects. As described above, the dressing according to claim 1
According to the cleaning device for the grinding machine, the surface of the grinding body of the abrasive body
Polishing pads and degraded abrasive grains attached to the area
By wiping off any deposits such as materials,
Can be removed.

A cleaning device for a dresser device according to claim 2.
According to the above, the adhering substance wiping body is brought into sliding contact with the grinding action portion.
It is driven, so it is possible to more effectively wipe off deposits than the abrasive body.
You.

A cleaning device for a dresser device according to claim 3.
According to the method, the adhered substance wiping body is provided on the shaft, and the shaft is rotated.
Grinding action of the adhering material wiping body with a simple configuration that rotates
Parts can be slid and wiped off the adhered material more effectively than the abrasive body.
You.

A cleaning device for a dresser device according to claim 4.
According to the above, the cleaning liquid can be supplied with a simple configuration.
it can.

According to the fifth aspect of the present invention, the cleaning liquid can be supplied with a simple structure, and the cleaning liquid is directly supplied to the portion where the adhered substance wiping body and the polishing body come into contact with each other, and the cleaning liquid is supplied as it is. It is possible to leave and prevent reattachment of deposits, thereby effectively removing the deposits.

According to the cleaning device for a dresser device according to the sixth aspect, it is possible to wash away and remove the deposits on the abrasive body by the high-pressure cleaning liquid flow.

According to the cleaning device for a dresser device of the present invention, it is possible to remove the deposits on the polishing body by ultrasonic cleaning with a cleaning liquid.

A cleaning device for a dresser device according to claim 8.
According to, the used cleaning solution containing the deposits is collected and reused.
It can be played back for use.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a dressing device cleaning apparatus according to a first embodiment of the present invention.

FIG. 2 is an enlarged view of a portion O in FIG. 1;

FIG. 3 is a cross-sectional view of a dressing device cleaning apparatus according to a second embodiment of the present invention.

FIG. 4 is an enlarged view of a portion P in FIG. 3;

FIG. 5 is a diagram showing a first embodiment of the present invention,
It is a figure which shows typically the positional relationship between the washing apparatus for dresser apparatuses, and the CMP apparatus which has the conventional dresser apparatus as an example.

FIG. 6 is a sectional view of a cleaning device for a dresser device according to another embodiment of the present invention.

FIG. 7 is a cross-sectional view of a cleaning device for a dresser device according to still another embodiment of the present invention.

FIG. 8 is a sectional view of a dressing device cleaning apparatus according to still another embodiment of the present invention.

FIG. 9 is a diagram schematically illustrating an example of a CMP apparatus having a dresser apparatus.

[Explanation of symbols]

 A: Cleaning device for dresser device 8: Polishing body 13: Grinding unit 20: Shaft 30: Adhering substance wiping body 31: Hair 40: Driving device 50 ... Cleaning liquid supply mechanism 60 ... Cleaning liquid regeneration mechanism (Cleaning liquid regeneration means)

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Kanji Hosoki 1-297 Kitabukuro-cho, Omiya-shi, Saitama F-term in Mitsubishi Materials Corporation Research Institute (reference) 3C047 AA34 FF08 FF19 3C058 AA07 AA19 AC01 BC02 CA01 CB01 CB03 DA12

Claims (8)

[Claims] 1. A substantially disk-shaped polishing body having a grinding action portion, a rotation drive mechanism for rotating the polishing body, and the polishing body being placed on the polishing pad such that the grinding action portion comes into contact with a polishing pad. A cleaning mechanism for a dresser device having a moving mechanism for carrying in and out, and for relatively moving the polishing body and the polishing pad to polish the polishing pad, wherein the cleaning device is provided in a moving area of the polishing body. A removing means for removing the deposits on the polishing body, the removing means being installed to be able to contact the polishing body and wiping off the deposits on the polishing body; A cleaning liquid supply mechanism for supplying a cleaning liquid to a portion of the dresser when the polishing member comes into contact with the polishing body. 2. The dressing device cleaning apparatus according to claim 1, wherein the attached matter wiping body slides on the surface of the grinding action portion when the attached matter wiping body contacts the polishing body. A cleaning device for a dresser device, comprising a wiping body drive mechanism for driving the attached matter wiping body. 3. The cleaning device for a dresser device according to claim 2, wherein the wiping body driving mechanism includes a shaft that supports the adhering substance wiping body, and a driving device that rotationally drives the shaft. A cleaning device for a dresser device, comprising: 4. The cleaning device for a dresser device according to claim 3, wherein the adhering substance wiping body is formed of a member through which the cleaning liquid permeates and is retained, wherein the cleaning liquid supply mechanism includes: a cleaning liquid storage tank; A cleaning apparatus for a dresser device, comprising: the cleaning liquid stored in the cleaning liquid storage tank so that at least a part of the adhered substance wiping body is immersed therein. 5. The cleaning device for a dresser device according to claim 3, wherein said shaft body has a hollow portion therein and said hollow portion.
A plurality of holes communicating with the outside of the outer peripheral surface from the outside, the adhering substance wiping body is formed of a member through which the cleaning liquid is permeated and held, and the cleaning liquid supply mechanism includes the hollow portion and the plurality of holes. And a cleaning liquid supply device for supplying the cleaning liquid to the surface of the adhered substance wiping body from above. 6. The cleaning device for a dresser device according to claim 1, wherein said removing means includes said adhering substance wiping body and said cleaning liquid supply.
Instead of a mechanism, a high-pressure jetting high-pressure cleaning liquid to the polishing body is used.
A pressure washing liquid supply mechanism.
Cleaning equipment for Sir equipment. 7. The cleaning device for a dresser device according to claim 1, wherein the removing unit applies ultrasonic vibration to a cleaning liquid instead of the adhered substance wiping body and the cleaning liquid supply mechanism. A cleaning device for a dresser device, comprising: 8. The cleaning device for a dresser device according to claim 1, wherein the cleaning liquid containing the deposit used for cleaning the polishing body is collected, and the deposit and the deposit are removed from the cleaning liquid. A cleaning device for a dresser device, comprising a cleaning liquid regenerating means for removing other contaminants.