JP2001196523A - Mounting structure and radiating structure for surface mount semiconductor switching element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure of a surface-mount semiconductor switching element, which reduces radiation noise, prevents malfunction of a circuit and miniaturizes a printed board, and to provided a radiation structure of the surface-mount semiconductor switching element, which miniaturizes a radiating member, reduces cost, improves fitting work and improves radiation efficiency. SOLUTION: In surface-mount switching element Q2 and Q3, which are provided for the DC-AC conversion of a power unit and are connected in series, the source terminal S of the switching element Q2 is connected to the drain terminal D of the switching element Q3 at a neutral point pattern M and the mounting directions of the switching element Q2 and Q3 on the printed board differ. The switching element Q2 is mounted, so that the forming direction of the source terminal S (or a gate terminal G) matches the direction of an arrow F2. The switching element Q3 is mounted so that the forming direction of the source terminal S (or the gate terminal G) matches the direction of the arrow F3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure and a heat radiating structure of a surface mount type semiconductor switch element.

[0002]

2. Description of the Related Art A mounting structure of a conventional surface mount type semiconductor switch element will be described. 24 and 25 show a power supply device using a surface-mounted semiconductor switch element. FIG. 24 shows its block configuration, and FIG. 25 shows its detailed circuit configuration. 24 and 25, the power supply device includes an AC power supply AC and an AC-DC
Converter 1 and DC-DC converter 2 which is a DC-DC converter
, A DC-AC converter 3 which is a DC / AC converter, and a load unit 4.

The AC-DC converter 1 is composed of a filter circuit (for reducing power supply feedback noise) composed of a line filter LF1, a capacitor C1, and a rectifier circuit composed of diodes D1 to D4, and converts an AC voltage from an AC power supply AC. Input, convert to DC voltage and output.

The DC-DC converter 2 includes a switch element Q
1. Control circuit 5 for controlling on / off of choke coil L1, diode D5, capacitor C2, and switch element Q1
, And a smoothing circuit including a smoothing capacitor C3 which is a voltage smoothing element.
DC voltage output from the AC-DC converter 1 is input,
The voltage is increased to a DC voltage having a predetermined voltage value and output.

[0005] The DC-AC converter 3 includes switch elements Q12 and Q13 connected in series and switch elements Q12 and Q13.
13, a driver circuit 7 that receives a signal from the control circuit 6 and alternately drives the switching elements Q12 and Q13 on and off, and a switching element Q1.
2, a capacitor C4 for converting a high-frequency DC voltage generated by the on / off operation of Q13 into a high-frequency AC voltage
The DC voltage output from the DC-DC converter 2 is input, and a high-frequency AC voltage is output (half-bridge type inverter circuit). In FIG. 25, D, S, and G attached to the switch elements Q12 and Q13 represent a drain terminal, a source terminal, and a gate terminal, respectively.

The load section 4 comprises a DC resonance circuit including a choke coil L2 and a capacitor C5, and a fluorescent lamp load LAMP connected in parallel to the capacitor C5.
The high-frequency AC voltage output from the AC converter 3 is input, and the high-frequency high voltage generated by the resonance action of the DC resonance circuit is output to the fluorescent lamp load LAMP.
The MP is turned on.

The switching elements Q1, Q12, Q13
In general, a field effect transistor (FET) as a semiconductor switch element is used. When the field effect transistor (FET) is used for the switch elements Q12 and Q13 of the DC-AC converter 3, a parasitic diode between the drain terminal and the source terminal of the FET is positively used. , The number of parts can be reduced.

In the series circuit of the switching elements Q12 and Q13, the drain terminal D of the switching element Q12 is connected to the output VDC of the smoothing capacitor C3, and the source terminal S of the switching element Q13 is connected to the ground GND.
Source terminal S of switch element Q12 and switch element Q1
3 are connected to the drain terminal D. Switch element Q1
2 and Q13 are turned on and off alternately, so that a high-frequency DC pulse voltage is generated in the connection path between the source terminal S of the switching element Q12 and the drain terminal D of the switching element Q13.

This connection path is called a neutral point, and is a path through which a large high-frequency current flows in accordance with a high-frequency voltage change, and causes radiation noise. Further, since this high-frequency high current causes a malfunction of the weak current circuit section such as the control circuits 5 and 6, when designing the mounting of the switch elements Q12 and Q13 on the printed circuit board, the pattern of the neutral point is required. It is known that it is effective to make the wiring as short as possible.

The switch elements Q12 and Q13 are of a surface mount type as shown in the top view of FIG. 26A and the side view of FIG. (Chip mounting type) is used. As shown in FIG. 26, each of the switching elements Q12 and Q13 has a drain terminal D at one end and a source terminal S and a gate terminal G at the other end.

FIG. 27 shows a mounting state when the switch elements Q12 and Q13 are mounted on a printed circuit board. The direction in which the gate terminal G (or the source terminal S) is formed in each of the switch elements Q12 and Q13 (arrow P)
Are the same, that is, each switching element Q12,
The mounting direction of Q13 is mounted so as to be the same, and the switching elements Q12 and Q13 are mounted side by side in a direction orthogonal to the P direction. In FIG. 27, the drain terminal D of the switch element Q12 is connected to the power supply pattern VD, and the source terminal S of the switch element Q13.
Is connected to the ground pattern GD, and the source terminal S of the switch element Q12 and the drain terminal D of the switch element Q13 are connected by a neutral point pattern M.

As another conventional example, FIGS. 30 and 31 show a state in which a surface-mount type semiconductor switch element is mounted on a printed circuit board and disposed in a case and a case lid. FIG.
In FIG. 31, the surface mount type switch element Q10 (chip FE) is provided on the back side (the lower side in the figure) of the printed circuit board 50.
T) is mounted, and the printed circuit board 50 is a case 51
And is provided in the case lid 52.

In FIG. 30, this switching element Q1
The heat dissipating member 5 extends over the entire space between the mounting side of the
3 and the heat generated by the switching element Q10 is
3 and dissipates heat. Also, in FIG. 31, the surface of the switch element Q10 and the case 51 are brought into contact with each other via the heat radiating member 54, so that the heat generated by the switch element Q10 is
Dissipates heat to

[0014]

However, FIG.
In the case where the switch elements Q12 and Q13 are mounted so that their mounting directions are the same, and each of the switch elements Q12 and Q13 is mounted side by side in the direction orthogonal to the P direction as shown in FIG. From the source terminal S of the element Q12 to the drain terminal D of the switch element Q13
It is necessary to route the neutral point pattern M, and the distance becomes long, which causes radiation noise and malfunctions of the weak electric circuit portion.

As shown in FIG. 28, the switching elements Q12 and Q13 are mounted so that their mounting directions are the same, and each of the switching elements Q12 and Q13 is connected to the gate terminal G (or the source terminal S). ) Are mounted side by side in the direction (arrow P1) in which
Although the routing of the neutral pattern M can be avoided, since the switch elements Q12 and Q13 are mounted side by side in the direction in which the terminals are formed, the length in the direction in which the terminals are arranged (arrow P1) increases. Printed board PT
51 in the width direction (E11), the printed circuit board PT
51 in the width direction increases, and the printed circuit board PT5
1 is large. On the other hand, as shown in FIG. 29, when the direction in which the switch elements Q12 and Q13 are arranged is the longitudinal direction (the E12 direction) of the printed circuit board PT51,
There is a problem that the size in the longitudinal direction becomes large and the printed circuit board PT51 also becomes large.

Japanese Patent Application Laid-Open No. 9-148079 discloses an invention relating to a mounting position when a switch element of a chopper circuit and a switch element of an inverter circuit are mounted on a printed circuit board. Is not listed.

In another conventional example, in FIG. 30, the entire space between the case 51 and the side on which the switching element Q10 of the printed circuit board 50 is mounted is filled with the heat radiation member 53. The heat dissipation effect is high,
There is a problem that the heat dissipating member 53 is increased in size and cost is increased, and the filling workability (mounting workability) of the heat dissipating member 53 is deteriorated.

Further, as shown in FIG. 31, the surface of the switch element Q10 is brought into contact with the case 51 via the heat radiating member 54, so that the heat generated by the switch element Q10 is radiated to the case 51 through the heat radiating member 54. In this case, the heat radiation member 54 can be reduced in size and cost, and the workability of mounting the heat radiation member 54 is good.
Has a small surface area, the heat transfer through the heat radiating member 54 is poor, and the heat radiation efficiency is poor.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to reduce radiation noise by avoiding routing of wiring patterns on a printed circuit board, prevent malfunction of a weak electric circuit portion, and reduce the size of a printed circuit board. To provide a mounting structure for a surface-mounted semiconductor switch element, and to provide a heat-dissipating structure for a surface-mounted semiconductor switch element that achieves downsizing of the heat radiation member, cost reduction, improvement in mounting workability, and improvement in heat radiation efficiency. It is in.

[0020]

According to a first aspect of the present invention, there is provided an AC power supply, an AC / DC converter for converting an AC voltage from the AC power supply into a DC voltage, and an AC / DC converter. A DC-DC converter for converting the DC voltage from the converter to a DC voltage having a predetermined voltage value; a DC-AC converter for converting the DC voltage from the DC-DC converter to a high-frequency AC voltage; and the high-frequency AC voltage. And a load unit that operates according to the following. The DC-AC converter of the power supply device has a mounting structure of at least two surface-mounted semiconductor switch elements, each of which is connected in series. It is characterized in that the mounting direction on one of the printed circuit boards is different from the mounting direction on the other.

According to the first aspect of the present invention, it is possible to avoid the routing of the wiring pattern between the respective surface-mounted semiconductor switch elements, to reduce the radiation noise, and to prevent the malfunction of the weak electric circuit portion. In addition, in order to avoid the routing of the wiring pattern, it is not necessary to arrange the respective surface-mounted semiconductor switch elements in the direction in which the terminals are formed, so that the size of the printed circuit board can be reduced.

According to a second aspect of the present invention, in the first aspect, the at least two surface-mounted semiconductor switch elements connected in series are provided on the printed circuit board. The power supply pattern and the ground pattern are mounted on a printed circuit board at an interval in a direction orthogonal to the forming direction.

According to the second aspect of the present invention, since the space between the power supply pattern and the ground pattern is widened, it is possible to avoid the routing of the pattern connecting the mounted components mounted between the respective patterns to the respective patterns, and to reduce the radiation noise. Can be reduced, and malfunction of the weak current circuit portion can be prevented.

According to a third aspect of the present invention, in the first or second aspect, at least one of the at least two surface-mounted semiconductor switch elements connected in series has a radiation noise reduction circuit. Are connected in parallel, and the radiation noise reduction circuit is mounted between the surface-mounted semiconductor switch elements on the printed circuit board. According to the third aspect of the present invention, it is possible to shorten the wiring pattern for connecting each surface-mounted semiconductor switch element and the radiation noise reduction circuit, to reduce the radiation noise, and to prevent the malfunction of the weak electric circuit portion. can do.

Further, according to the invention of claim 4, according to claim 1,
The invention according to any one of claims 1 to 3, wherein the surface mount type semiconductor switch element is mounted on a printed circuit board such that a terminal forming direction is perpendicular to a longitudinal direction of the printed circuit board. Features. According to the fourth aspect of the present invention, it is possible to reduce wiring of a power supply pattern and a ground pattern, which are usually formed in a longitudinal direction of a printed circuit board, and a wiring pattern for connecting a surface-mount type semiconductor switch element, thereby reducing radiation noise. And the malfunction of the weak electric circuit portion can be prevented.

According to the invention of claim 5, according to claim 1,
5. The DC-DC converter according to claim 1, wherein the DC-DC converter includes at least one surface-mounted semiconductor switch element, and a mounting direction of the DC-DC converter on the printed circuit board is included in the DC-AC converter. The mounting direction of one of the surface mounted semiconductor switch elements on the printed circuit board is the same.

According to the fifth aspect of the present invention, one of the surface mount type semiconductor switch elements of the DC / AC converter is mounted such that the wiring pattern for connecting to the power supply pattern or the ground pattern of the power supply device is reduced. Then, it is possible to reduce the wiring of the wiring pattern connected to the power supply pattern or the ground pattern also for the surface mount type semiconductor switch element of the DC / DC converter, thereby reducing the radiated noise and the power supply circuit section. Malfunction can be prevented.

According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the mounting interval on the printed circuit board of each of the surface mount semiconductor switching elements provided in the DC / AC converter is changed to the DC / DC conversion. The mounting interval on the printed circuit board between the surface-mounted semiconductor switch element provided in the unit and the surface-mounted semiconductor switch element provided in the DC / AC converter is shorter than the DC / DC converter. A voltage-smoothing element, the voltage-smoothing element, and the mounting interval on the printed circuit board between the surface-mount type semiconductor switch element provided in the DC / AC converter, and the voltage-smoothing element; It is characterized in that it is shorter than the mounting interval on the printed circuit board with the surface mount type semiconductor switch element provided in the conversion section. According to the invention of claim 6, the surface mount type semiconductor switch element provided in the DC / AC converter from the surface mount type semiconductor switch element provided in the DC / DC converter in which the amount of flowing current is increased, and the voltage smoothing are usually performed. The thermal effect on the element for use can be suppressed low.

According to a seventh aspect of the present invention, in the first aspect of the present invention, the DC / AC converter includes at least two surface-mounted semiconductor switch elements connected in series. At least two or more sets are provided, and at least one set is mounted such that the mounting direction on one of the printed circuit boards is different from the other mounting direction. According to the invention of claim 7, the DC / AC converter includes:
Even when at least two sets of at least two surface-mounted semiconductor switch elements connected in series are provided, effects similar to those of the first to sixth aspects can be obtained.

The invention of claim 8 is an AC power source, an AC / DC converter for converting an AC voltage from the AC power source into a DC voltage, and a DC voltage of a predetermined voltage value from the AC / DC converter. A DC-DC converter for converting the DC voltage to a voltage, a DC-AC converter for converting the DC voltage from the DC-DC converter to a high-frequency AC voltage, and a load unit that operates with the high-frequency AC voltage. It is a mounting structure of a surface-mount type semiconductor switch element provided at least one each in the DC-DC converter and the DC-AC converter, and each terminal is formed in a direction perpendicular to the longitudinal direction of the printed circuit board. And are mounted on a printed circuit board so that their mounting directions are the same. According to the invention of claim 8, a surface-mounted semiconductor switch element provided at least in each of the DC-DC converter and the DC-AC converter,
Wiring patterns for connecting a power supply pattern and a ground pattern formed in the longitudinal direction of the printed circuit board can be reduced, radiation noise can be reduced, and malfunction of the weak electric circuit can be prevented.

According to a ninth aspect of the present invention, in the invention according to any one of the first to eighth aspects, the surface-mounted semiconductor switch element has a voltage of 100 V or more at both ends and an inflow current of 0.1 V. It is a field-effect transistor having a rated value of 5 A or more. According to the ninth aspect, the same effects as those of the first to eighth aspects can be obtained.

According to a tenth aspect of the present invention, in any one of the first to ninth aspects, the load section includes a fluorescent lamp load. According to the tenth aspect, the same effects as those of the first to ninth aspects can be obtained even when the load section has a fluorescent lamp load.

According to an eleventh aspect of the present invention, in accordance with the tenth aspect of the present invention, the printed circuit board is disposed in the lighting fixture so that the surface-mounted semiconductor switch element is located at a peripheral portion of the lighting fixture. It is characterized by. According to the eleventh aspect of the present invention, since the surface-mount type semiconductor switch element is located at the periphery of the lighting fixture having a low temperature, the heat radiation effect of the surface-mount type semiconductor switch element is improved.

According to a twelfth aspect of the present invention, in accordance with the eleventh aspect of the present invention, the printed circuit board is arranged in the lighting fixture such that a board surface of the printed board contacts a part of the lighting fixture main body. It is characterized in that it is installed. According to the twelfth aspect of the present invention, heat generated from the surface-mounted semiconductor switch element is radiated from the printed circuit board to a part of the main body of the lighting fixture, so that the heat-dissipating effect of the surface-mounted semiconductor switch element is improved.

According to a thirteenth aspect of the present invention, a heat radiating member is disposed on the surface of the printed circuit board on which the surface-mounted semiconductor switch element is mounted, near the surface-mounted semiconductor switch element. And According to the thirteenth aspect of the present invention, the contact area between the heat radiating member and the printed board can be ensured, so that the heat generated from the surface mount type semiconductor switch element can be sufficiently generated from the printed board via the heat radiating member disposed on the board surface. It is not necessary to adopt a structure in which the heat radiating member fills the entire space between the printed circuit board and the case accommodating the same, so that the cost of the heat radiating member is reduced and the heat radiating member is provided. Workability is also improved.

According to a fourteenth aspect of the present invention, a heat dissipating member is disposed near the surface-mounted semiconductor switch element on a surface of the printed circuit board on which the surface-mounted semiconductor switch element is mounted, opposite to the substrate surface. It is characterized by the following. According to the invention of claim 14, since the contact area between the heat radiating member and the printed board can be ensured, the heat generated from the surface mount type semiconductor switch element is transferred from the printed board to the heat radiating member provided on the surface opposite to the board surface. Through the printed circuit board and the case for accommodating the printed circuit board, it is not necessary to fill the entire space between the printed circuit board and the case. The workability of disposing is also improved.

According to a fifteenth aspect of the present invention, in the thirteenth or fourteenth aspect of the present invention, the surface-mount type semiconductor switch element includes an AC power supply and an AC voltage from the AC power supply converted to a DC voltage. An AC / DC converter, a DC / DC converter for converting the DC voltage from the AC / DC converter to a DC voltage having a predetermined voltage value, and a DC for converting the DC voltage from the DC / DC converter to a high-frequency AC voltage. The DC-DC converter and the DC-AC converter of a power supply device having an AC converter and a load unit that operates by the high-frequency AC voltage are provided at least one each in the DC-DC converter and the surface-mount type. A heat dissipating member is provided between the surface mounting type semiconductor switch elements on the mounting surface on which the semiconductor switch elements are mounted on the printed circuit board or on the opposite surface. That.

According to the fifteenth aspect, at least one of each of the DC / DC converter and the DC / AC converter is provided.
Heat generated from each of the surface-mounted semiconductor switch elements provided can be dissipated by the heat dissipating member disposed therebetween, and it is not necessary to provide a heat dissipating member for each of them, thereby reducing costs. The workability of disposing the heat radiating member is also improved.

According to a sixteenth aspect, in the fifteenth aspect, the DC / DC converter has a voltage smoothing element, and the heat radiating member holds the voltage smoothing element on the printed circuit board. It is characterized in that the member is also used. According to the sixteenth aspect, cost reduction can be achieved by using the heat radiating member also as the holding member for the voltage smoothing element.

According to a seventeenth aspect of the present invention, in the invention according to any one of the thirteenth to sixteenth aspects, the surface mount type semiconductor switch element has a voltage between both ends of 100 V or more and an inflow current of 0.1 V or more. It is a field-effect transistor having a rated value of 5 A or more. Claim 17
According to the invention, the same effects as the inventions of claims 13 to 16 can be obtained.

The invention of claim 18 is the invention according to any one of claims 13 to 17, characterized in that the load section has a fluorescent lamp load. According to the eighteenth aspect, even when the load section has a fluorescent lamp load, the same effects as those of the thirteenth to seventeenth aspects can be obtained.

According to a nineteenth aspect of the present invention, in the invention according to the eighteenth aspect, the printed circuit board is provided in the lighting fixture such that the surface-mount type semiconductor switch element is located at a peripheral portion of the lighting fixture. It is characterized by. According to the nineteenth aspect of the present invention, since the surface-mounted semiconductor switch element is located at the peripheral portion of the lighting fixture having a low temperature, the heat radiation effect of the surface-mounted semiconductor switch element is improved.

According to a twentieth aspect of the present invention, in accordance with the nineteenth aspect of the present invention, the printed circuit board is arranged in the lighting fixture so that the board surface of the printed board and a part of the main body of the lighting fixture are in contact with each other. It is characterized in that it is installed. According to the twentieth aspect, heat generated from the surface-mounted semiconductor switch element is radiated from the printed circuit board to a part of the main body of the lighting fixture, so that the heat-dissipating effect of the surface-mounted semiconductor switch element is improved.

[0044]

(Embodiment 1) A mounting structure of a surface mount type semiconductor switch element will be described with reference to the drawings. FIG.
25 is a circuit diagram showing a configuration of a power supply device using a surface-mount type semiconductor switch element. The same components as those in the conventional example shown in FIG. In the conventional example, the switching elements Q12 and Q13 connected in series of the DC-AC converter 3 shown in FIG. 25 have the same mounting orientation on the printed circuit board. In the present embodiment, the DC-AC converter shown in FIG. The switching elements Q2 and Q3 of the converter 3 connected in series have different mounting directions on the printed circuit board.

In this embodiment, as shown in FIG. 1, one of the switching elements Q2 and Q3 is rotated by 180 degrees with respect to the other, and mounted on a printed circuit board so that the mounting directions are different. . That is, the direction in which the source terminal S and the ground terminal G of the switch element Q2 are formed (arrow F2) is opposite to the direction in which the source terminal S and the ground terminal G of the switch element Q3 are formed (arrow F3) by 180 degrees. It is implemented to be on the side.
The switching elements Q2 and Q3 are arranged close to each other in the direction (C direction) orthogonal to the direction in which each terminal is formed. The drain terminal D of the switch element Q2 is connected to a power supply pattern VD provided in a direction perpendicular to the direction in which the terminals are formed, and the source terminal S of the switch element Q3 is provided in a direction perpendicular to the direction in which the terminals are formed. Ground pattern GD
Is connected to

As described above, since the switching elements Q2 and Q3 are mounted on the printed circuit board so that the mounting directions thereof are different from each other, the neutral point connecting the source terminal S of the switching element Q2 and the drain terminal of the switching element Q3. Pattern M
Becomes straight without being routed, and the distance becomes shorter.
Therefore, it is possible to reduce the radiation noise and prevent the malfunction of the weak electric circuit units such as the control circuits 5 and 6. Further, in order to avoid routing of the neutral point pattern M, unlike the conventional example shown in FIGS. 28 and 29, it is not necessary to arrange the switch elements Q12 and Q13 side by side in the terminal forming direction. The printed board does not become large in the width direction or the longitudinal direction of the board.

In FIG. 1, the switching elements Q2, Q
Each of the switches 3 is mounted at a position where one of them is rotated by 180 degrees with respect to the other, but if the mounting directions are different from each other and the neutral point patterns M are arranged close to each other, each switch The mounting orientation of the devices Q2 and Q3 is not limited to this, and for example, as shown in FIG.
2 is set to 9 clockwise with respect to the mounting direction of the switch element Q3.
The same effect can be obtained even if the arrangement is rotated by 0 degrees.

In FIG. 1, the switching elements Q2 and Q3 are mounted side by side in the direction (C direction) orthogonal to the direction in which the terminals are formed. However, as shown in FIG. Even if Q3 is not arranged in the C direction and is mounted with an interval in a direction (F4 direction) orthogonal to the forming direction of the power supply pattern VD and the ground pattern GD, there is no need to route the neutral point pattern M. , It is possible to shorten the distance.

Further, by providing such an interval, the interval between the power supply pattern VD connected to the drain terminal D of the switch element Q2 and the ground pattern GD connected to the source terminal S of the switch element Q3 can be increased. A component disposed between the power supply pattern VD and the ground pattern GD, for example, the smoothing capacitor C shown in FIG.
3, the power supply pattern VD and the ground pattern G
There is no need to run a pattern connected to D. Therefore, the radiation noise can be further reduced, and malfunction of the weak electric circuit units such as the control circuits 5 and 6 can be prevented.

In each of the examples shown in FIGS. 1, 3 and 4, as shown in FIG. 5, the direction in which the terminals of each switch element Q6 are formed with respect to the longitudinal direction (E1 direction) of the elongated printed circuit board PT. (F direction) are orthogonal so that each switch element Q6
Is desirably mounted on the printed circuit board PT. In FIG. 3, one switch element Q3 is mounted such that the terminal formation direction is orthogonal to the longitudinal direction of the printed circuit board PT. By mounting in this manner, it is possible to reduce the length of the connection pattern between the power supply pattern and the ground pattern formed along the longitudinal direction of the printed circuit board PT and each switch element.

Note that, as shown in FIG.
Is long and slender,
Each switch element Q6 is preferably mounted so that the terminal directions (F, G directions) are orthogonal to the longitudinal directions (E1, E2 directions).

(Embodiment 2) FIG. 7 is a circuit diagram showing the configuration of another power supply device using a surface-mount type semiconductor switching element. The difference from FIG. 2 is that the switching elements Q2 and Q3 in FIG. Is that snubber capacitors C6 and C7 corresponding to snubber circuits which are radiation noise reduction circuits (switching noise reduction circuits) are connected in parallel between the respective drain terminals and source terminals.

This snubber circuit includes switch elements Q2 and Q
3 suppresses a steep current fluctuation occurring at the time of switching, and effectively works to reduce radiation noise. However, since a steep current flows through the loop of each switch element and the snubber circuit, the loop becomes a source of radiation noise when the loop becomes large. Therefore, in this embodiment,
The mounting position of each switch element Q2, Q3 is the same as that of FIG. 4, but as shown in FIG.
Snubber capacitors C6 and C7 are mounted in the portion between Q3 in the direction C.

As a result, the loop composed of each of the switch elements Q2 and Q3 and the snubber capacitors C6 and C7, which are snubber circuits, can be reduced, so that radiation noise can be reduced and malfunction of the weak current circuit can be prevented. Also, the point that the neutral point pattern M can be shortened to reduce radiation noise, and that the malfunction of the weak electric circuit units such as the control circuits 5 and 6 can be prevented.
The point that the printed circuit board can be reduced in size is the same as in the first embodiment.

In this embodiment, the snubber circuit is constituted by the snubber capacitors C6 and C7. However, if the snubber circuit is mounted between the switch elements Q2 and Q3, the structure and the number of the snubber circuits may be changed. Not as long.

(Embodiment 3) Next, Embodiment 3 of the present invention.
Will be described. FIG. 9 is a circuit diagram showing a configuration of still another power supply device using a surface-mounted semiconductor switch element. FIG. 10 shows a mounted state of the surface-mounted semiconductor switch element.

FIG. 9 differs from FIG. 2 in the configuration of the DC-AC converter 3 and the load 4. That is, in FIG.
A DC-connector provided at both ends of the conversion unit 2 with a full-bridge circuit to which a total of two sets of series circuits including a series circuit of switch elements Q2 and Q3 and a series circuit of switch elements Q4 and Q5 are connected.
An AC converter 3A is provided. Then, the newly added switch elements Q4 and Q5 are turned on / off by a driver circuit 7A which receives and drives a signal from the control circuit 6. Further, in FIG. 2, the load unit 4 is connected between the capacitor C4 connected to the neutral point of the switch elements Q2 and Q3 and the source terminal of the switch element Q3. A load C connected to a neutral point between the switching element Q2 and the switching element Q3;
And a connection point (neutral point) between the switch element Q4 and the switch element Q5.

In the power supply device thus configured, the switching elements Q2 and Q3 are alternately turned on and off by the driver circuit 7 in response to the signal from the control circuit 6, and the switching elements Q4 and Q5 are driven by the driver circuit 7A. They are alternately turned on and off. The switching elements Q2 and Q5, and the switching elements Q3 and Q4 are turned on and off in synchronization with each other, and a high frequency voltage is generated at both ends of the load section 4 by this operation.

FIG. 10 shows a state in which the surface-mounted switch elements Q2, Q3, Q4, and Q5 are mounted on a printed circuit board. In the figure, a drain terminal D of a switch element Q2 is shown.
Are connected to the power supply pattern VD, the source terminal S is connected to the drain terminal D of the switch element Q3 by a neutral point pattern M, and the source terminal S of the switch element Q3 is connected to the ground pattern GD. On the other hand, the drain terminal D of the switch element Q4 is connected to the power supply pattern VD, the source terminal S is connected to the drain terminal D of the switch element Q5 by a neutral point pattern M, and the source terminal S of the switch element Q5 is connected to the ground terminal. Connected to GD. Further, the separated power supply patterns VD are connected by a jumper line J.

The switching elements Q2 and Q3, and the switching elements Q4 and Q5 are respectively shown in FIG.
As shown in FIG. 4, the terminals are formed in directions opposite to each other by 180 degrees. Therefore, each neutral point pattern M can be shortened, and the same effect as that described in the first embodiment can be obtained. Further, in the present embodiment, the number of switch elements is increased as compared with the first embodiment, so that the radiation noise and the malfunction of the weak electric circuit unit increase. However, the effect is further enhanced by adopting the above configuration. Be demonstrated.

(Embodiment 4) Next, Embodiment 4 of the present invention.
Will be described. FIG. 11 is a diagram illustrating a mounting state when the power supply device illustrated in FIG. 2 is mounted on a printed circuit board.
In FIG. 11, a power supply pattern VD and a ground pattern GD formed in parallel with each other are connected to the AC-DC converter 1. A diode D5 and a choke coil L1 are connected to the power supply pattern VD so as to be parallel to the direction in which the power supply pattern VD is formed. A capacitor C2 and a smoothing capacitor C3 provided in a direction orthogonal to the power pattern VD and the ground pattern GD are connected between the power pattern VD and the ground pattern GD. Has been implemented.

Further, the drain terminal D of the switch element Q1 of the DC-DC converter 2 is connected to the power supply pattern VD, and the source terminal S is connected to the ground pattern GD. Further, the switching element Q2 is connected to the power supply pattern VD.
Is connected to the ground terminal GD.
Is connected to the source terminal S of the switch element Q3 and to the load section 4. The source terminal S of the switch element Q2 and the drain terminal D of the switch element Q3 are connected by a neutral point pattern M, and further connected to the load section 4.

Here, the mounting positions of the switching elements Q2 and Q3 of the DC-AC converter 3 are the same as those in FIG. 4, and the switching elements Q2 and Q3 are mounted at positions rotated by 180 degrees from each other. Further, the switch elements Q2 and Q3 are mounted so that the direction in which the terminals are formed is orthogonal to the direction in which the power supply pattern VD and the ground pattern GD are formed.
The arrangement of the power supply pattern VD and the ground pattern GD for connection with the switch elements Q2 and Q3 is reduced.

The switching elements Q1 and Q
3 are mounted so as to be in the same direction as each other, that is, the switching element Q2 is mounted so as to be rotated by 180 degrees with respect to the switching elements Q1 and Q3. Here, the mounting direction refers to each of the switch elements Q1, Q
2, Q3, the direction in which the source terminal S (or the gate terminal G) is formed. In the switch elements Q1, Q3, the arrow F10 indicates the direction in which the switch element Q2 is formed.
Is indicated by an arrow F11.

As described above, since the switching element Q1 is mounted so as to be in the same direction as the switching element Q3, the direction in which the terminals of the switching element Q1 are formed is orthogonal to the power supply pattern VD and the ground pattern GD. The layout of the power supply pattern VD and the ground pattern GD for connection to the element Q1 can be reduced.

Generally, switch element Q1 of DC-DC converter 2 is connected to switch elements Q2, Q
3, the amount of current flowing therethrough is large, and therefore the amount of heat generated by switching loss is large. Therefore, each mounting interval L11 between the switching elements Q2 and Q3 of the DC-AC converting section 3 and the switching element Q1 of the DC-DC converting section 2 is set to be larger than the mounting interval L12 between the switching elements Q2 and Q3. By mounting the switching elements Q1, Q2, and Q3, the thermal effect of the switching element Q1 on the switching elements Q2 and Q3 is suppressed, and the neutral point pattern M of the switching elements Q2 and Q3 is shortened to radiate. The noise is reduced and the malfunction of the weak electric circuit is prevented.

The smoothing capacitor C3, which is a voltage smoothing element, is mounted between the switching element Q1 and the switching element Q2, and includes the switching element Q1 and the smoothing capacitor C3.
Is mounted at a position where the mounting interval L13 is larger than the mounting interval L14 between the switch element Q2 and the smoothing capacitor C3. As a result, the thermal effect on the smoothing capacitor C3 from the switch element Q1, which generates a particularly large amount of heat, among the switch elements Q1, Q2, Q3 is reduced.

Since the mounting positions of the switching elements Q2 and Q3 are the same as those in FIG. 4, it goes without saying that the same effects can be obtained.

(Embodiment 5) Next, Embodiment 5 of the present invention
Will be described. FIG. 12 is a diagram illustrating a mounting state when the power supply device illustrated in FIG. 9 is mounted on a printed circuit board.
The mounting states of the AC-DC converter 1, the capacitor C2, the choke coil L1, the diode D5, the smoothing capacitor C3, and the switch element Q1 are reversed left and right, but are the same as in FIG. 11, and the switch elements Q2 to Q5 and the load 4 is the same as the mounting state shown in FIG.
Has the same effect as in the case of.

In FIG. 12, switch elements Q3 and Q5 of switch elements Q2 to Q5 of DC-AC conversion section 3A are shown.
Is mounted in the switching element Q1 of the DC-DC converter 2.
11 is mounted in the same orientation as that of FIG.
As described above, the arrangement of the power supply pattern VD and the ground pattern GD is reduced.

(Embodiment 6) Next, Embodiment 6 of the present invention.
Will be described. FIG. 13 is a circuit diagram showing a configuration of a power supply device according to the present embodiment. In FIG. 2, a series circuit of switch elements Q2 and Q3 is connected to both ends of a smoothing capacitor C3, whereas in FIG. A series circuit of a choke coil L3 and a switching element Q3 is connected to both ends of C3, and a capacitor C6 is connected in parallel to both ends of the switching element Q3 in FIG.

Referring to FIG. 13, the switching element Q3, the capacitor C4, the driver circuit 7, and the control circuit 6
The AC conversion unit 3B is configured, and the load unit 4A is configured by the capacitors C5 and C6, the choke coils L2 and L3, and the fluorescent lamp load LAMP. Then, the control circuit 6 and the driver circuit 7 control the on / off of the switch element Q3 to supply a high-frequency high voltage to the fluorescent lamp load LAMP by the resonance action of the resonance circuit including the choke coils L2, L3 and the capacitors C4, C5, C6. It has a one-stone inverter configuration.

FIG. 14 shows a state in which the power supply device shown in FIG. 13 is mounted on a printed circuit board. In FIG. 14, AC-D
C conversion unit 1, capacitor C2, choke coil L1, diode D5, smoothing capacitor C3, switch element Q
1, the mounting part 4, and the switching element Q3 are the same as in FIG. 11, but in FIG. 14, the choke coil L3 is mounted between the drain terminal D of the switching element Q3 and the diode D5. And different.

In the present embodiment, the mounting directions of the switching elements Q1 and Q3 are the same as in FIG.
The direction in which the terminal of the switch element Q1 is formed is the switch element Q3.
The power supply pattern VD and the ground pattern G formed in the longitudinal direction of the
It is orthogonal to D. Therefore, the power supply pattern VD for connecting to the switch elements Q1 and Q3
In addition, the routing of the ground pattern GD can be reduced, so that the radiation noise can be reduced and the malfunction of the weak electric circuit portion can be prevented.

(Embodiment 7) Next, the heat dissipation structure of the surface mount semiconductor switch element of the present invention will be described. FIG.
3A and 3B show a state in which the surface-mounted semiconductor switch element is mounted on a printed circuit board, wherein FIG. 3A is a plan view and FIG. 3B is a side view. FIG. 15A shows a state in which the case body is omitted.

In FIG. 15, a surface-mount type semiconductor switch element Q (hereinafter, referred to as a switch element Q) such as the switch elements Q1 to Q5 described in the first to sixth embodiments is mounted on the substrate surface A1 of the printed circuit board PT11. I have. Further, on the substrate surface (solder surface) A1 of the printed circuit board PT11, in the vicinity of the switch element Q (in FIG.
Are arranged. When the switch element Q generates heat, the heat is conducted to the printed circuit board PT11, and the conducted heat is dissipated by the heat dissipating member 15 to promote heat dissipation of the switch element Q.

The heat radiation efficiency at this time varies depending on the degree of adhesion between the heat radiating member 15 and the object to be radiated. If the object to be radiated is a flat printed circuit board as shown in FIG. In addition, as compared with the case where the heat radiating member is directly adhered to the surface mount type semiconductor switch element as in the conventional example of FIG. Since the contact area between the printed circuit board, which is a heat radiator, and the heat radiating member can be increased, a sufficiently large heat radiating effect can be obtained without using a structure in which the entire space is filled with the heat radiating member as shown in the conventional example of FIG. Obtainable. Further, by disposing a heat radiating member on the board surface of the printed board, FIGS.
The thickness can be reduced as compared with the first conventional example.

Further, as shown in FIG. 15B, when the heat radiating member 15 is further brought into close contact with the case body 16, the heat generated by the switch element Q is conducted to the case body 16, so that the heat radiating efficiency is further improved. .

Further, as shown in FIGS. 16A and 16B, the heat radiating member 15 is connected to the substrate surface A1 of the printed circuit board PT11.
It is desirable to dispose it in the place where the copper foil part (pattern part) 17 is provided. This is because the location where the copper foil portion 17 is provided has a higher thermal conductivity and a higher heat radiation effect than the location where the copper foil portion 17 is not provided.

FIG. 17 is a side view showing a heat dissipation structure when a plurality of surface-mounted semiconductor switch elements are mounted on a printed circuit board. In FIG. 17, surface-mounted semiconductor switch elements Q21, Q22, Q23 (hereinafter, referred to as switch elements Q21, Q22, Q23) are mounted on the back surface (the lower surface in the figure) of the printed circuit board PT21. Further, on the back surface of the printed circuit board PT21, near the switch elements Q21, Q22, Q23, heat radiation members 15A, 15A are disposed.
B and 15C are arranged in close contact with each other. One surface of each of the heat radiating members 15A, 15B, 15C is in close contact with the case body 18, and the heat radiating effect is further improved. Other mounting components 19 are provided on the surface of the printed circuit board PT21.
Are mounted, and the opening of the case body 18 is covered with a case lid 20.

Also in this case, switching elements Q21, Q2
By disposing the heat radiating members 15A, 15B and 15C in the vicinity of Q2 and Q23 to radiate heat,
As shown in the figure, the cost of the heat dissipating member can be reduced as compared with the case where the entire case is filled with the heat dissipating member,
The workability of attaching the heat radiating member is improved, and the same heat radiating efficiency can be obtained.

In FIGS. 15 and 16, the heat radiating member 15 is provided on the substrate surface A1 of the printed circuit board PT11 on which the switching element Q is mounted, whereas in FIG. The heat dissipating member 15 is mounted on the surface (component surface) A2 near the switch element Q. Also in this case, the heat generated from the switching element Q is conducted to the printed circuit board PT11 and is radiated through the heat radiation member 15,
The same effects as in FIGS. 15 and 16 can be obtained.

(Eighth Embodiment) Next, an eighth embodiment of the present invention will be described.
Will be described. FIG. 19 shows a heat radiation structure of the switch elements Q1, Q2, Q3 mounted as shown in FIG.
FIG. 19A is a plan view, and FIG. 19B is a side view. FIG. 19A shows a state in which the case body is omitted. As shown, the printed circuit board PT12
The switching elements Q1, Q2, Q3 are mounted on the substrate surface A11 of the substrate, and the heat dissipating member 22 is in close contact with the portions between the switching elements Q1, Q2 on the substrate surface A11.
Are arranged. Further, the heat dissipating member 22 has one surface in close contact with the case main body 23 to improve heat dissipating efficiency.

With such a heat radiating structure, the heat radiating members of the switch elements Q1 and Q2 can be used in common, so that the cost can be suppressed and the workability of mounting the heat radiating members is improved. In this embodiment, the printed circuit board PT
The heat radiating member 22 is disposed on the solder surface which is the substrate surface A11 on which the 12 surface-mounted semiconductor switch elements Q1, Q2, and Q3 are mounted. The same effect can be obtained even if the heat radiating member 22 is provided on the component surface opposite to the surface A11.

FIG. 20 shows another heat dissipation structure of the switch elements Q1, Q2, and Q3 mounted as shown in FIG. FIG. 20A is a plan view, and FIG. 20B is a side view. In FIG. 20, the switch elements Q1, Q2,
Q3 is mounted, and a smoothing capacitor C3 as a voltage smoothing element shown in FIG. 11 is mounted on the opposite surface A12 at a position corresponding to a portion between the switch elements Q1 and Q2.

The position of the smoothing capacitor C3 is fixed to the printed circuit board PT12 by the holding member 25 for preventing wobble. The holding member 25 is connected to the switch elements Q1,
The role of the heat radiating member of Q2 and Q3 is also used, and the cost is reduced.

Here, FIG. 21 shows a state where the printed circuit board on which the surface-mounted semiconductor switch element in each of the above-described embodiments is mounted is housed in a lighting fixture. FIG. 21 (a)
Shows a top view, and (b) shows a side view. A printed circuit board 30 on which a surface-mounted semiconductor switch element 36 (hereinafter, referred to as a switch element 36) is mounted on the upper surface in FIG.
The round tube fluorescent lamp 33 provided outside is covered with a shade cover 34. The round tube fluorescent lamp 33 is an example of the fluorescent lamp load LAMP of the load unit 4 described above. The lighting fixture including the fixture main body 31, the main body case 32, the round tube fluorescent lamp 33, the shade cover 34, and the printed circuit board 30 is a ceiling-mounted (ceiling-type) fixture, and requires a thinner fixture.

The luminaire thus constructed is of a pendant type, in which the fluorescent lamp load LAMP is sealed by the luminaire body 31 and the shade cover 34, so that heat is stored. In comparison, an air contact area is small or a thin type has a small internal volume of the appliance, so that there is a problem that the temperature inside the appliance becomes high due to a small heat radiation effect by air convection in the appliance.

However, since the switch element 36 has the mounting structure and the heat radiation structure described in each of the above embodiments, the printed circuit board 30 can be reduced in size and thickness. As a result, even when the temperature inside the appliance increases, the heat dissipation structure in each of the above-described embodiments can ensure the reliability and life of the components by reducing the temperature of the switch element 36. Needless to say, it has the effects described in the above embodiments.

In this embodiment, the fluorescent lamp load LAM
A round tube fluorescent lamp was used as P, and the configuration of the fixture shape of the ceiling-mounted type was shown. However, if it is a lighting fixture equipped with a printed circuit board having the configuration of each of the above embodiments, the type of load,
The shape of the device may be any.

The temperature distribution at each position of the luminaire is as shown in the top view and the side view in FIGS. 22 (a) and (b). From the central part B0 of the luminaire main body 31 to the peripheral part,
The temperature decreases in the order of the positions B1, B2, B3, B4, and B5. That is, the temperature decreases as the temperature approaches the outside air. The printed circuit board 30 is arranged in the lighting fixture such that the mounting portion 38 of the switch element 36 is located at the peripheral portion where the temperature is lowered, thereby further improving the heat radiation effect.

FIGS. 23 (a) and 23 (b) show another example of the structure when the printed circuit board is provided in the lighting equipment. FIG.
(B) is a side view. 23 differs from FIG. 21 in that the lower surface of the printed circuit board 30A on which the switch element 36 is mounted on the upper surface is in contact with the main body case 32A. As shown in FIG. 23A, the switch element 36 is mounted on the surface on the opposite side of the overlapping portion between the printed board 30A and the main body case 32A. The instrument body 31
A houses the printed circuit board 30A together with the main body case 32A. With the above-described configuration, the heat generated by the switch element 36 is generated by the device main body 31A via the main body case 32A.
Since the heat is transferred to the heat sink, the heat radiation effect can be further improved.

The switch element described in each of the above embodiments is a field-effect transistor having a voltage value of 100 V or more and an inflow current of 0.5 A or more.

[0094]

As described above, according to the first aspect of the present invention, there is provided an AC power supply, an AC / DC converter for converting an AC voltage from the AC power supply into a DC voltage, and a DC voltage from the AC / DC converter. A DC-DC converter for converting the DC voltage to a DC voltage, a DC-AC converter for converting the DC voltage from the DC-DC converter to a high-frequency AC voltage, and a load unit operated by the high-frequency AC voltage. A mounting structure of at least two surface-mounted semiconductor switch elements provided in the DC / AC converter of the power supply device, each of which is connected in series, and mounted on one of the printed circuit boards of each of the surface-mounted semiconductor switch elements. Is mounted so that the mounting direction is different from the other mounting direction, so that wiring patterns between each surface-mount type semiconductor switch element can be avoided, radiation noise can be reduced, and It is not necessary to arrange each surface-mount type semiconductor switch element in the direction in which the terminals are formed in order to prevent the malfunction of the road section and to avoid the routing of the wiring pattern, thereby reducing the size of the printed circuit board. Can be.

According to a second aspect of the present invention, in the first aspect, the at least two surface-mounted semiconductor switch elements connected in series are each provided on the printed circuit board. Since the power supply pattern and the ground pattern are mounted on the printed circuit board with an interval in the direction perpendicular to the forming direction of the power supply pattern and the ground pattern, the interval between the power supply pattern and the ground pattern is widened. It is possible to avoid the routing of the pattern connected to each pattern, reduce the radiation noise, and prevent the malfunction of the weak electric circuit portion.

According to a third aspect of the present invention, in the first or second aspect, at least one of the at least two surface-mounted semiconductor switch elements connected in series has a radiation noise reduction circuit. Are connected in parallel, and the radiated noise reduction circuit is mounted between the surface-mounted semiconductor switch elements on the printed circuit board. Therefore, wiring for connecting each surface-mounted semiconductor switch element and the radiated noise reduction circuit is provided. The pattern can be shortened, radiation noise can be reduced, and malfunction of the weak electric circuit unit can be prevented.

According to the invention of claim 4, according to claim 1,
In the invention according to any one of claims 1 to 3, the surface-mounted semiconductor switch element is mounted on a printed circuit board such that a terminal forming direction is perpendicular to a longitudinal direction of the printed circuit board. The wiring pattern for connecting the power supply pattern and the ground pattern, which are usually formed in the longitudinal direction of the printed circuit board, and the wiring pattern connecting the surface-mount type semiconductor switch element can be suppressed to a small extent, the radiation noise can be reduced, and the weak electric circuit section can be reduced. Malfunction can be prevented.

According to the invention of claim 5, according to claim 1,
5. The DC-DC converter according to claim 1, wherein the DC-DC converter includes at least one surface-mounted semiconductor switch element, and a mounting direction of the DC-DC converter on the printed circuit board is included in the DC-AC converter. The mounting direction on the printed circuit board is the same as that of any one of the surface-mounted semiconductor switch elements, so that one of the surface-mounted semiconductor switch elements of the DC / AC converter is connected to the power supply pattern of the power supply device or When mounting so that the wiring pattern connected to the ground pattern is reduced, the wiring pattern connected to the power pattern or the ground pattern can be reduced for the surface-mounted semiconductor switch element of the DC / DC converter. It can reduce radiated noise and prevent malfunction of the weak electric circuit part. Kill.

According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the mounting interval on the printed circuit board of each of the surface mount semiconductor switch elements provided in the DC / AC converter is changed to the DC / DC conversion. The mounting interval on the printed circuit board between the surface-mounted semiconductor switch element provided in the unit and the surface-mounted semiconductor switch element provided in the DC / AC converter is shorter than the DC / DC converter. A voltage-smoothing element, the voltage-smoothing element, and the mounting interval on the printed circuit board between the surface-mount type semiconductor switch element provided in the DC / AC converter, and the voltage-smoothing element; In order to shorten the mounting interval on the printed circuit board between the surface mount type semiconductor switch element provided in the conversion unit and the printed circuit board, the DC / DC conversion unit in which the amount of current flowing usually increases is provided. And the thermal influence on the surface mounting type semiconductor switch surface mounting semiconductor switching elements provided in the DC-AC converting unit of the device and the voltage smoothing elements can be suppressed.

According to a seventh aspect of the present invention, in the first aspect of the present invention, the DC / AC converter includes at least two surface-mounted semiconductor switch elements connected in series. Since at least two sets are provided, and at least one set is mounted so that the mounting direction on one of the printed circuit boards is different from the other mounting direction, at least two DC / AC converters are connected in series. Even when at least two sets of the surface mount type semiconductor switch elements are provided, the same effects as those of the first to sixth aspects can be obtained.

The invention of claim 8 provides an AC power supply, an AC / DC converter for converting an AC voltage from the AC power supply into a DC voltage, and a DC voltage of a predetermined voltage value from the AC / DC converter. A DC-DC converter for converting the DC voltage to a voltage, a DC-AC converter for converting the DC voltage from the DC-DC converter to a high-frequency AC voltage, and a load unit that operates with the high-frequency AC voltage. It is a mounting structure of a surface-mount type semiconductor switch element provided at least one each in the DC-DC converter and the DC-AC converter, and each terminal is formed in a direction perpendicular to the longitudinal direction of the printed circuit board. In addition, since the components are mounted on a printed circuit board so that their mounting directions are the same, at least one of each of the DC-DC converter and the DC-AC converter is provided. Provided surface-mount type semiconductor switch element, it is possible to reduce the routing of the wiring pattern that connects the power supply pattern and the ground pattern, which are usually formed in the longitudinal direction of the printed circuit board, and radiation noise can be reduced, Malfunction of the weak electric circuit can be prevented.

According to a ninth aspect of the present invention, in the invention according to any one of the first to eighth aspects, the surface mounted semiconductor switch element has a voltage of 100 V or more at both ends and an inflow current of 0.1 V or more. Since the field effect transistor has a rated value of 5 A or more, the same effects as those of the first to eighth aspects can be obtained.

According to a tenth aspect of the present invention, in the invention according to any one of the first to ninth aspects, the load section has a fluorescent lamp load. In this case, the same effects as those of the first to ninth aspects can be obtained.

According to an eleventh aspect of the present invention, in accordance with the tenth aspect of the present invention, the printed circuit board is disposed in the lighting fixture so that the surface-mount type semiconductor switch element is located at a peripheral portion of the lighting fixture. In addition, since the surface-mounted semiconductor switch element is located at the periphery of the lighting fixture having a low temperature, the heat-dissipating effect of the surface-mounted semiconductor switch element is improved.

According to a twelfth aspect of the present invention, in accordance with the eleventh aspect of the present invention, the printed circuit board is arranged in the lighting fixture such that a board surface of the printed board is in contact with a part of the main body of the lighting fixture. Therefore, heat generated from the surface-mounted semiconductor switch element is radiated from the printed circuit board to a part of the main body of the lighting fixture, so that the heat-dissipating effect of the surface-mounted semiconductor switch element is improved.

According to a thirteenth aspect of the present invention, a heat dissipating member is provided on the surface of a printed circuit board on which the surface mount type semiconductor switch element is mounted, in the vicinity of the surface mount type semiconductor switch element. Since the contact area between the member and the printed circuit board can be secured, the heat generated from the surface mount type semiconductor switch element can be sufficiently dissipated from the printed circuit board via the heat dissipating member disposed on the board surface. There is no need to provide a structure that fills the entire space between the printed circuit board and the case that houses the printed circuit board, so that the cost of the heat dissipating member is reduced and the workability of disposing the heat dissipating member is improved.

According to a fourteenth aspect of the present invention, a heat dissipating member is disposed on the surface of the printed circuit board on which the surface-mounted semiconductor switch element is mounted, opposite to the surface of the printed circuit board, near the surface-mounted semiconductor switch element. Therefore, the contact area between the heat radiating member and the printed circuit board can be ensured, so that the heat generated from the surface mount type semiconductor switch element can be sufficiently radiated from the printed circuit board through the heat radiating member arranged on the surface opposite to the substrate surface, Therefore, it is not necessary to adopt a structure in which the heat dissipating member is filled in the entire space between the printed circuit board and the case for accommodating the printed circuit board, so that the cost of the heat dissipating member is reduced and the workability of disposing the heat dissipating member is also good. Become.

According to a fifteenth aspect of the present invention, in the thirteenth or fourteenth aspect of the present invention, the surface-mount type semiconductor switch element comprises an AC power supply and an AC voltage from the AC power supply converted to a DC voltage. An AC / DC converter, a DC / DC converter for converting the DC voltage from the AC / DC converter to a DC voltage having a predetermined voltage value, and a DC for converting the DC voltage from the DC / DC converter to a high-frequency AC voltage. The DC-DC converter and the DC-AC converter of a power supply device having an AC converter and a load unit that operates by the high-frequency AC voltage are provided at least one each in the DC-DC converter and the surface-mount type. Since the heat radiating member is provided between the surface mounting type semiconductor switch elements on the mounting surface on which the semiconductor switch elements are mounted on the printed circuit board or on the opposite side thereof, a direct current Heat generated from at least one surface-mounted semiconductor switch element provided in each of the conversion unit and the DC / AC conversion unit can be radiated by a heat radiating member disposed therebetween, and a heat radiating member is provided for each of the heat radiating members. It is not necessary to provide the heat dissipation member, thereby reducing the cost and improving the workability of disposing the heat radiating member.

According to a sixteenth aspect of the present invention, in the fifteenth aspect, the DC / DC converter has a voltage smoothing element, and the heat radiating member holds the voltage smoothing element on the printed circuit board. Since the heat radiating member also serves as a holding member for the voltage smoothing element, the cost can be reduced.

According to a seventeenth aspect of the present invention, in the semiconductor device according to any one of the thirteenth to sixteenth aspects, the surface mount type semiconductor switch element has a voltage between both ends of 100 V or more and an inflow current of 0.1 V or more. 13. A field effect transistor having a rated value of 5 A or more, so that it is a field effect transistor.
The same effects as those of the sixth aspect are obtained.

The invention according to claim 18 is the invention according to any one of claims 13 to 17, wherein the load section has a fluorescent lamp load, so that the load section has a fluorescent lamp load. Also in this case, the same effects as the inventions of claims 13 to 17 can be obtained.

According to a nineteenth aspect of the present invention, in the invention of the eighteenth aspect, the printed circuit board is disposed in the lighting fixture such that the surface-mount type semiconductor switch element is located at a peripheral portion of the lighting fixture. In addition, since the surface-mounted semiconductor switch element is located at the periphery of the lighting fixture having a low temperature, the heat-dissipating effect of the surface-mounted semiconductor switch element is improved.

According to a twentieth aspect of the present invention, in accordance with the nineteenth aspect, the printed circuit board is arranged in the lighting fixture such that the board surface of the printed board contacts a part of the main body of the lighting fixture. Therefore, heat generated from the surface-mounted semiconductor switch element is radiated from the printed circuit board to a part of the main body of the lighting fixture, so that the heat-dissipating effect of the surface-mounted semiconductor switch element is improved.

[Brief description of the drawings]

FIG. 1 is a structural diagram showing a mounting structure of a surface mount type semiconductor switch element according to a first embodiment of the present invention.

FIG. 2 is a circuit diagram showing a configuration of a power supply device including the same surface-mounted semiconductor switch element.

FIG. 3 is a structural diagram showing another mounting structure of the same surface mount type semiconductor switch element.

FIG. 4 is a structural diagram showing still another mounting structure of the same surface mount semiconductor switch element.

FIG. 5 is a plan view showing a mounting direction of the surface-mounted semiconductor switch element on the printed circuit board.

FIG. 6 is a plan view showing a mounting direction of the surface mount type semiconductor switch element on another printed circuit board;

FIG. 7 is a circuit diagram illustrating a configuration of a power supply device including a surface-mounted semiconductor switch element according to a second embodiment of the present invention.

FIG. 8 is a structural diagram showing a mounting structure of the same surface mount type semiconductor switch element.

FIG. 9 is a circuit diagram illustrating a configuration of a power supply device including a surface-mounted semiconductor switch element according to a third embodiment of the present invention.

FIG. 10 is a structural diagram showing a mounting structure of the same surface-mounted semiconductor switch element.

FIG. 11 is a structural diagram showing a mounting structure of a surface mount semiconductor switch element corresponding to a fourth embodiment of the present invention.

FIG. 12 is a structural diagram showing a mounting structure of a surface-mounted semiconductor switch element according to a fifth embodiment of the present invention.

FIG. 13 is a circuit diagram illustrating a configuration of a power supply device including a surface-mounted semiconductor switch element according to a sixth embodiment of the present invention.

FIG. 14 is a structural diagram showing a mounting structure of the same surface mount type semiconductor switch element.

15A and 15B are diagrams showing a heat dissipation structure of a surface mount semiconductor switch element according to a seventh embodiment of the present invention, wherein FIG. 15A is a plan view and FIG. 15B is a side view.

FIG. 16 is a view showing another heat dissipation structure according to the third embodiment;
(A) is a plan view and (b) is a side view.

FIG. 17 is a sectional view showing still another heat dissipation structure of the above.

FIG. 18 is a side view showing still another heat dissipation structure of the above.

19A and 19B are diagrams showing a heat dissipation structure of a surface mount semiconductor switch element corresponding to the eighth embodiment of the present invention, wherein FIG. 19A is a plan view and FIG. 19B is a side view.

FIG. 20 is a diagram showing another heat dissipation structure according to the first embodiment;
(A) is a plan view and (b) is a side view.

FIGS. 21A and 21B are diagrams showing a structure of a lighting apparatus in which a printed circuit board on which the surface-mounted semiconductor switch element is mounted is housed, wherein FIG. 21A is a top view and FIG. 21B is a side view.

FIGS. 22A and 22B are diagrams showing a temperature distribution of the lighting fixture, wherein FIG. 22A is a top view and FIG. 22B is a side view.

23A and 23B are diagrams showing another structure of the lighting device of the above, wherein FIG. 23A is a top view and FIG. 23B is a side view.

FIG. 24 is a block diagram showing a configuration of a power supply device provided with a conventional surface mount type semiconductor switch element.

FIG. 25 is a circuit diagram showing a configuration of the above power supply device.

26A and 26B are diagrams showing a structure of a surface mount type semiconductor switch element, wherein FIG. 26A is a top view and FIG. 26B is a side view.

FIG. 27 is a structural diagram showing a mounting structure of a conventional surface mount semiconductor switch element.

FIG. 28 is a plan view showing another mounting structure of the above.

FIG. 29 is a plan view showing still another mounting structure of the above.

FIG. 30 is a cross-sectional view showing a heat dissipation structure of a conventional surface mount semiconductor switch element.

FIG. 31 is a sectional view showing another heat dissipation structure of the above.

[Explanation of symbols]

 Q2 Switch element Q3 Switch element M Neutral point pattern VD Power supply pattern GD Ground pattern S Source terminal G Gate terminal D Drain terminal

Claims (20)

[Claims] 1. An AC power supply, an AC / DC converter for converting an AC voltage from the AC power supply into a DC voltage, and a DC / DC converter for converting a DC voltage from the AC / DC converter into a DC voltage having a predetermined voltage value. A DC-AC converter for converting the DC voltage from the DC-DC converter to a high-frequency AC voltage,
A mounting structure of at least two surface-mounted semiconductor switch elements provided in the DC / AC converter of the power supply device having a load unit operated by the high-frequency AC voltage, each of which is connected in series; A mounting structure of a surface-mounted semiconductor switch element, wherein the mounting direction of one of the semiconductor switch elements on a printed circuit board is different from the mounting direction of the other. 2. The method according to claim 1, wherein each of the at least two surface-mounted semiconductor switch elements connected in series has an interval in a direction orthogonal to a direction in which a power supply pattern and a ground pattern of the power supply device provided on the printed circuit board are formed. 2. The semiconductor device according to claim 1, wherein the semiconductor device is mounted on a printed circuit board.
The mounting structure of the surface mount type semiconductor switch element described in the above. 3. A radiation noise reduction circuit is connected in parallel to at least one of the at least two surface-mounted semiconductor switch elements connected in series, and the radiation noise reduction circuit comprises:
The mounting structure of a surface-mounted semiconductor switch element according to claim 1, wherein the mounting structure is mounted between the surface-mounted semiconductor switch elements on the printed circuit board. 4. The surface mount type semiconductor switch element is mounted on a printed circuit board such that terminals are formed in a direction perpendicular to a longitudinal direction of the printed circuit board. Item 4. A mounting structure of the surface-mounted semiconductor switch element according to any one of Items 3. 5. The DC-to-DC converter includes at least one surface-mounted semiconductor switch element, and the mounting direction of the DC-DC converter on the printed circuit board is provided in the DC-AC converter. 5. The mounting structure of a surface-mounted semiconductor switch device according to claim 1, wherein the mounting direction is the same as one of the mounting directions on the printed circuit board. 6. The mounting interval on the printed circuit board of each of the surface mount semiconductor switch elements provided in the DC / AC converter is determined by the distance between the surface mount semiconductor switch element provided in the DC / DC converter and the DC. The mounting interval on the printed circuit board between the surface-mounted semiconductor switch element provided in the AC converter and shorter than the mounting interval, the DC-DC converter includes a voltage smoothing element, the voltage smoothing element, The mounting interval on the printed board between the surface-mounted semiconductor switch element provided in the DC / AC converter and the voltage smoothing element and the surface-mounted semiconductor switch element provided in the DC / DC converter 6. The mounting structure for a surface-mounted semiconductor switch device according to claim 5, wherein the mounting interval is shorter than the mounting interval on the printed board. 7. The DC / AC converter includes at least two sets of at least two surface-mounted semiconductor switch elements connected in series, and at least one set has a mounting orientation on one of the printed circuit boards. 7. The mounting structure of a surface-mounted semiconductor switch device according to claim 1, wherein the mounting structure is different from the other mounting direction. 8. An AC power supply, an AC / DC converter for converting an AC voltage from the AC power supply to a DC voltage, and a DC / DC converter for converting the DC voltage from the AC / DC converter to a DC voltage having a predetermined voltage value. A DC-AC converter for converting the DC voltage from the DC-DC converter to a high-frequency AC voltage,
The DC-DC converter and the DC-AC converter of a power supply device having a load unit that operates with the high-frequency AC voltage, and a mounting structure of at least one surface-mounted semiconductor switch element provided in each of the DC-AC converter. The terminals are formed in a direction perpendicular to the longitudinal direction of the printed circuit board, and are mounted on the printed circuit board such that their mounting directions are the same. . 9. The semiconductor device according to claim 1, wherein the surface-mount type semiconductor switching device is a field-effect transistor having a voltage value of 100 V or more and a flowing current of 0.5 A or more. 9. The mounting structure of the surface-mount type semiconductor switch element according to any one of 8. 10. The mounting structure of a surface-mounted semiconductor switch device according to claim 1, wherein the load section includes a fluorescent lamp load. 11. The surface-mounted semiconductor switching device according to claim 10, wherein the printed circuit board is disposed in the lighting device so that the surface-mounted semiconductor switching device is located at a peripheral portion of the lighting device. Mounting structure. 12. The lighting device according to claim 11, wherein the printed circuit board is disposed in the lighting device such that a substrate surface of the printed circuit board and a part of a body of the lighting device are in contact with each other.
The mounting structure of the surface mount type semiconductor switch element described in the above. 13. A surface mount type semiconductor switch, wherein a heat radiating member is provided near the surface mount type semiconductor switch element on a substrate surface of a printed circuit board on which the surface mount type semiconductor switch element is mounted. Heat dissipation structure of the element. 14. A surface mounting device, wherein a heat dissipating member is provided near the surface mounting type semiconductor switch element on a surface of the printed circuit board on which the surface mounting type semiconductor switch element is mounted, opposite to the substrate surface. Heat dissipation structure of semiconductor switch elements. 15. The surface-mounted semiconductor switch device according to claim 15,
An AC power supply, an AC / DC converter for converting an AC voltage from the AC power supply to a DC voltage, a DC / DC converter for converting the DC voltage from the AC / DC converter to a DC voltage having a predetermined voltage value, Each of the DC-DC converter and the DC-AC converter of a power supply device having a DC-AC converter that converts a DC voltage from a DC converter into a high-frequency AC voltage, and a load unit that operates with the high-frequency AC voltage And a heat radiating member is provided between the surface mounting type semiconductor switch elements on a mounting surface on which the respective surface mounting type semiconductor switch elements are mounted on a printed circuit board or on the opposite surface thereof. The heat dissipation structure for a surface-mounted semiconductor switch device according to claim 13, wherein the heat dissipation structure is provided. 16. The device according to claim 15, wherein the DC / DC converter has a voltage smoothing element, and the heat radiation member also serves as a holding member for holding the voltage smoothing element on the printed circuit board. Heat dissipation structure of surface mount type semiconductor switch element. 17. The semiconductor device according to claim 17, wherein
17. The surface-mounted semiconductor switch device according to claim 13, wherein the voltage across the terminal is 100 V or more, and the inflow current is a field-effect transistor having a rated value of 0.5 A or more. Heat dissipation structure. 18. The heat dissipation structure for a surface-mounted semiconductor switch device according to claim 13, wherein said load unit includes a fluorescent lamp load. 19. The surface-mounted semiconductor switching device according to claim 18, wherein the printed circuit board is disposed in the lighting device such that the surface-mounted semiconductor switching device is located at a peripheral portion of the lighting device. Heat dissipation structure. 20. The lighting device according to claim 19, wherein the printed circuit board is disposed in the lighting device such that a substrate surface of the printed circuit board and a part of a body of the lighting device are in contact with each other.
The heat dissipation structure of the surface mount type semiconductor switch element described in the above.