JP2001154599A - Panel type element - Google Patents

Abstract

(57) [Summary] A cross electrode of a pair of substrates is connected in a good conduction state.
Moreover, adjacent lead wires or terminal electrodes,
Alternatively, the terminal electrode is connected to a lead wire connected to another terminal electrode without short-circuiting. An upper substrate provided with a first electrode and an upper cross electrode, a second electrode and a lower cross electrode are provided.
2, and a lower substrate 20 on which a plurality of terminal electrodes 23 and 24 connected to the second electrode 21 and the lower cross electrode 22 directly or via a lead wiring 25 are formed and joined to the terminal arrangement portion 20a. A plurality of lead wires 25 and a plurality of terminal electrodes 23,
24, a plurality of rod-shaped conductive fillers 31 having a length shorter than the smallest distance in the substrate bonding region by the sealant 30 are mixed, and these rod-shaped fillers 31 are parallel to the substrate surface. The upper cross electrode 12 and the lower cross electrode 22 were electrically connected to each other by the rod-shaped filler 31 sandwiched between the substrates 10 and 20 in a state of being laid down.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel element.

[0002]

2. Description of the Related Art As a panel-type element, there are an electro-optical display panel represented by a liquid crystal display panel, a touch input panel, and the like.

[0003] A panel-type element of this type has a structure in which a pair of substrates arranged opposite to each other are joined via a frame-shaped sealing material, and electrodes are provided on inner surfaces of these substrates opposed to each other. For example, in the case of a liquid crystal display panel, a region between the pair of substrates and surrounded by the sealant is filled with liquid crystal.

Meanwhile, the panel type element has a structure in which terminal electrodes for connecting electrodes provided on inner surfaces of a pair of substrates to an external circuit are provided on each substrate, and all terminal electrodes are connected to one substrate. However, the latter panel type element is advantageous from the viewpoint of easy connection of an external circuit.

[0005] The latter panel type element generally has a first
A second substrate disposed on at least one side of the terminal array, the terminal array protruding outside the first substrate, and disposed opposite to the first substrate; and a peripheral edge of the first substrate. A frame-shaped sealing material that joins the first substrate and the second substrate in a region corresponding to the portion, and is formed on an inner surface of the first substrate in a region surrounded by the sealing material. At least one first electrode, and at least one electrode formed in a substrate bonding region with the sealant and connected to the first electrode;
A first cross electrode, a plurality of second electrodes facing the first electrode, and a second cross electrode facing the first cross electrode on an inner surface of the second substrate. And a plurality of terminal electrodes arranged and formed in the terminal arrangement portion and connected to the plurality of second electrodes and the second cross electrode directly or via a plurality of lead wires, respectively, and provided in the sealing material. By mixing a plurality of conductive fillers composed of spherical metal particles and sandwiching the spherical filler in the sealing material between the first substrate and the second substrate, The second cross electrode is electrically connected to the second cross electrode by the spherical filler sandwiched between the cross electrodes.

[0006]

However, the above-mentioned conventional panel-type element is characterized in that the first cross electrode and the second cross electrode provided on the first substrate and the second substrate, and the sealing material Are only in point contact at one point of the spherical surface of the spherical filler, the electrical resistance of the contact portion between the first cross electrode and the second cross electrode and the spherical filler is high, The first cross electrode and the second cross electrode cannot be connected in good conduction.

The present invention provides a panel-type element capable of connecting a first cross electrode and a second cross electrode provided on a first substrate and a second substrate in a good conduction state. It is intended for.

[0008]

A panel-type element according to the present invention has a first substrate, and a terminal array on at least one side protruding outside the first substrate. A second substrate disposed opposite to the first substrate, and a frame-shaped sealing material that joins the first substrate and the second substrate in a region corresponding to a peripheral portion of the first substrate; At least one first electrode formed in a region surrounded by the sealing material on an inner surface of the first substrate, among inner surfaces of the first substrate and the second substrate facing each other; And at least one first cross electrode connected to the first electrode, the first cross electrode being formed in a substrate bonding region by
On the inner surface of the second substrate, a plurality of second electrodes facing the first electrode, a second cross electrode facing the first cross electrode, and an array formed in the terminal array, A plurality of terminal electrodes respectively connected to the plurality of second electrodes and the second cross electrode directly or via a plurality of lead wirings, and the plurality of lead wirings and the plurality of Among the respective intervals of the terminal electrodes, a plurality of rod-shaped conductive fillers having a length shorter than the smallest interval in the substrate bonding region are mixed, and these rod-shaped fillers are parallel to the substrate surface. The first cross electrode and the second electrode are sandwiched between the first substrate and the second substrate in a laid state.
Are electrically connected to each other by the rod-shaped filler sandwiched between these cross electrodes.

According to the panel type element, the first element is mixed in the sealing material and falls down in parallel with the substrate surface.
The rod-shaped filler sandwiched between the first substrate and the second substrate is arranged in such a manner that the first cross electrode and the second cross electrode provided on the first substrate and the second substrate have the same rod shape. Since the linear contact is made along the length direction of the filler, the electric resistance of the contact portion between the first cross electrode and the second cross electrode and the rod-shaped filler is reduced, and the first cross electrode and the second cross electrode are connected to the second cross electrode. It can be connected to the cross electrode in a good conduction state.

Further, in this panel-type element, the length of the bar-shaped filler is shorter than the smallest interval in the substrate bonding region among the intervals between the plurality of lead wirings and the plurality of terminal electrodes. In addition, adjacent lead wires or terminal electrodes are not short-circuited, or the terminal electrode and a lead wire connected to another terminal electrode are not short-circuited via the rod-shaped filler.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, a panel-type element according to the present invention is provided with at least one first electrode, and at least connects the first electrode to a substrate bonding region formed by a frame-shaped sealing material. A first substrate on which one first cross electrode is provided, a plurality of second electrodes facing the first electrode, and a second cross electrode facing the first cross electrode; A plurality of terminal electrodes connected to the plurality of second electrodes and the second cross electrode directly or via a plurality of lead wires are formed in an array on a terminal array portion protruding outside the first substrate. The sealant for joining to the second substrate has a length shorter than a smallest interval in the substrate joining region among the intervals between the plurality of lead wires and the plurality of terminal electrodes. A plurality of rod-shaped conductive fillers are mixed, and these rod-shaped fillers are sandwiched between the first substrate and the second substrate in a state of being laid down in parallel with the substrate surface, and the first cloth By electrically connecting the electrode and the second cross electrode with the rod-shaped filler sandwiched between the cross electrodes, the first cross electrode and the second cross electrode are in a good conduction state. Moreover, adjacent lead wires or terminal electrodes, or the terminal electrode and a lead wire connected to another terminal electrode can be connected via the rod-shaped filler without being short-circuited.

In the panel-type element according to the present invention, a first cross electrode provided on the first substrate and a second cross electrode provided on the second substrate are each formed of a substrate made of the sealing material. When a plurality of rod-shaped fillers mixed in the sealing material are formed in a plurality at a predetermined position in the bonding region, the length of the plurality of rod-shaped fillers mixed in the sealing material is defined by the distance between the plurality of lead wires and the plurality of terminal electrodes. What is necessary is just to make it shorter than any of the minimum space | interval in the said board | substrate junction area | region, and the space | interval of the said several 1st and 2nd cross-electrode. Two cross electrodes or the first
The short circuit due to the rod-shaped filler between the cross electrode and the second cross electrode facing the other first cross electrode can be eliminated.

In this panel-type element, the rod-like filler mixed into the sealing material may be made of a conductive metal, but may be a resin material formed in a rod shape and a conductive metal film covering the surface of the resin material. According to the latter rod-shaped filler, cracks are generated in the conductive metal film due to crushing deformation of the rod-shaped filler due to pressurization at the time of joining the first substrate and the second substrate. Since the resin material oozes out of the crack and adheres to the first and second substrates, the rod-shaped filler can be more firmly fixed to the first and second substrates.

[0014]

1 to 4 show a first embodiment of the present invention. FIG. 1 is an exploded perspective view of a panel type element, and FIG. 2 is an enlarged view of a part of a frame-shaped sealing material in the panel type element. FIG. 3 is a plan view, and FIG. 3 is a perspective view of a conductive filler mixed in the sealing material.

The panel type device of this embodiment is used for a simple matrix type liquid crystal display panel.
As shown in FIG. 1, a pair of transparent substrates 10 and 20 made of glass or a resin such as PET (polyethylene terephthalate), PC (polycarbonate), or polyester, and a frame-shaped sealing material for joining these substrates 10 and 20 30.

Of the pair of substrates 10, 20, a lower second substrate (hereinafter, referred to as a lower substrate) 20 in FIG.
A terminal array portion 2 protruding outside a first substrate (hereinafter, referred to as an upper substrate) 10 in FIG.
0a, is disposed so as to face the upper substrate 10, and in a region corresponding to a peripheral portion of the upper substrate 10,
It is joined to the upper substrate 10 by the sealing material 30.

Among the inner surfaces of the upper substrate 10 and the lower substrate 20 facing each other, the inner surface of the upper substrate 10 has a plurality of first transparent electrodes 11 formed in a region surrounded by the sealing material 30. A plurality of first cross electrodes 12 formed in a substrate bonding region by the sealing material 30, and a plurality of second transparent electrodes facing the first electrodes 11 on an inner surface of the lower substrate 20. An electrode 21, a plurality of second cross electrodes 22 facing the plurality of first cross electrodes 12, respectively, and a plurality of terminal electrodes 23 and 24 arranged in the terminal arrangement section 20a are provided. .

Although not shown in the drawing, the inner surfaces of the upper substrate 10 and the lower substrate 20 are respectively provided with the sealing material 3.
An alignment film is provided over substantially the entire region surrounded by the first electrode 11 and the second electrode 21.
Are covered with the alignment film.

The plurality of first electrodes 11 provided on the inner surface of the upper substrate 10 are scanning electrodes formed in parallel with each other along the row direction (the horizontal direction of the screen), and provided on the inner surface of the lower substrate 20. The plurality of second electrodes 21 are signal electrodes formed in parallel with each other along the column direction (vertical direction of the screen), and the terminal arrangement portion 20a of the lower substrate 20 has both ends in the column direction. Are formed on one of the side edges.

The plurality of first cross electrodes provided on the upper substrate 10 (hereinafter, referred to as upper cross electrodes)
Reference numeral 12 denotes a predetermined portion of the substrate bonding region along the terminal array portion 20a of the lower substrate 20 in the substrate bonding region by the sealing material 30, for example, one end side of the substrate bonding region along the terminal array portion 20a. A plurality is arranged and formed on the other end side.

The upper cross electrodes 12 correspond to the plurality of scan electrodes (first electrodes) 11 formed on the inner surface of the upper substrate 10, respectively, and the plurality of scan electrodes 11 One end or the other end is connected to the corresponding upper cross electrode 12 via a plurality of lead wires 13 which are led to the arrangement region of the upper cross electrode 12 while bypassing the formation region of the scanning electrode 11. I have.

The terminal arrangement portion 20a of the lower substrate 20
Among the plurality of terminal electrodes 23 and 24 arranged in a matrix, a predetermined number of terminal electrodes 23 correspond to the signal electrodes (second electrodes) 21 formed on the inner surface of the lower substrate 20, respectively. The electrode terminal electrodes and the other terminal electrodes 24 are scanning electrode terminal electrodes respectively corresponding to the plurality of second cross electrodes (hereinafter, referred to as lower cross electrodes) 22 formed on the inner surface of the lower substrate 20. The signal electrode terminal electrodes 23 are arranged in a central region of the terminal arrangement section 20a, and the scanning electrode terminal electrodes 24 are arranged in the terminal arrangement section 20a.
A plurality is arranged in each of the regions on both end sides of a.

The plurality of signal electrode terminal electrodes 23 are formed so as to extend from the edge of the terminal arrangement portion 20a into the substrate joining region by the sealing material 30, and the plurality of signal electrodes 21 are respectively formed. Are connected to the corresponding signal electrode terminal electrodes 23 via a plurality of lead wires 25 derived from one end thereof.

The scanning electrode terminal electrode 24 is formed from the edge of the terminal array portion 20a to the area where the lower cross electrode 22 is formed. It is formed integrally with the scanning electrode terminal electrode 24 corresponding to the electrode 22, and is directly connected to these scanning electrode terminal electrodes 24.

On the other hand, the frame-shaped sealing material 30 is made of, for example, an epoxy resin or the like. In this sealing material 30, as shown in FIGS. A plurality of minute conductive fillers 31 for electrically connecting the cross electrode 12 and the plurality of lower cross electrodes 22 of the lower substrate 20 are mixed.

FIG. 1 shows only a part of the filler 31 mixed in the sealing material 30, but this filler 31
0 are almost uniformly dispersed and mixed in the entire region.

As shown in FIG. 3, the filler 31 is a very fine rod-shaped filler having a circular cross section.
It is obtained by cutting a metal wire having good conductivity, such as an aluminum alloy or silver, into a predetermined length.

The diameter (diameter) of the rod-shaped filler 31 is set to be the same as the distance (for example, several μm) between the pair of substrates 10 and 20 joined at a predetermined distance by the sealing material 30.

The length of the rod-shaped filler 31 is the most in the substrate bonding area of the sealing material 30 among the intervals between the plurality of lead wires 25 and the plurality of terminal electrodes 23 and 24 of the lower substrate 20. With small spacing,
The distance between the plurality of upper cross electrodes 12 and lower cross electrodes 22 of the upper substrate 10 and the lower substrate 20;
Of the plurality of lead wires 13 are set shorter than any of the smallest intervals in the substrate bonding region.

Although the length of the rod-shaped filler 31 is exaggerated in FIG. 1 for convenience, the length of the rod-shaped filler 31 is, as shown in FIG. The smallest interval among them, for example, a plurality of terminal electrodes 2
3 and 24, and 1/2 of the interval of the lower cross electrode 22 directly connected to the scanning electrode terminal electrode 24.
About 1/3 is preferable.

The amount of the rod-like filler 31 mixed into the sealing material 30 is, as shown in FIG.
It is desirable to select them so that they are distributed at appropriate intervals so that they do not touch each other.

In the panel-type element, a plurality of rod-shaped fillers 31 mixed in the sealing material 30 are used.
1 and 2 in parallel with the substrates 10 and 20.
The upper substrate 1 is laid down in a random direction as shown in FIG.
0 and the lower substrate 20, and a plurality of upper cross electrodes 12 of the upper substrate 10 and a plurality of lower cross electrodes 22 of the lower substrate 20 are respectively
They are electrically connected by the rod-like filler 31 sandwiched therebetween.

This panel-type element is provided with the rod-shaped filler 31 in a bonding area between one of the upper substrate 10 and the lower substrate 20, for example, the other substrate (upper substrate) 10 on the inner surface of the lower substrate 20. In order to regulate the substrate interval on the inner surface of the region surrounded by the sealant 30 of the upper substrate 10 which is the other substrate, the sealing material 30 mixed with is printed by a screen printing method to be slightly thicker than a predetermined substrate interval. After spraying the plurality of gap members, the substrates 10 and 20 are overlapped and pressed to adjust the substrate interval to an interval regulated by the gap members, and in this state, the sealing material 30 is cured. The upper substrate 1 is formed by the sealing material 30.
0 and the lower substrate 20.

In this case, the rod-like filler 31 mixed in the sealing material 30 is oriented in various directions (axial direction) before printing the sealing material 30 on the substrate 20. However, when this sealing material 30 is printed on the substrate 20 by a screen printing method, the rod-shaped filler 31 whose length direction is oriented in the direction of rising with respect to the surface of the substrate 20 is
Is pushed down by the squeegee, and all the rod-like fillers 31
Is in a state of falling down parallel to the surface of the substrate 20. However,
The length direction of the undulating rod-shaped filler 31 is random as shown in FIG.

For this reason, when the lower substrate 20 on which the sealing material 30 is printed and the other upper substrate 10 are overlapped and pressurized, all the rod-like fillers 31 in the sealing material 30 are removed from the surfaces of the substrates 10 and 20. Is sandwiched between these substrates 10 and 20 in a state of being laid down in parallel.

In the above manufacturing method, the sealing material 3
Although 0 is printed on only one substrate, for example, only the lower substrate 20, the sealant 30 may be printed on both the upper substrate 10 and the lower substrate 20, in which case, one of the substrates The rod-shaped filler 31 may be mixed in a seal material to be printed on the substrate.

As described above, the panel type device of this embodiment is used for a liquid crystal display panel.
The liquid crystal display panel has a liquid crystal injection port 31a formed by cutting off a part of the sealing material 31 when printing the sealing material 31 in a region surrounded by the sealing material 30 between the pair of substrates 10 and 20.
Liquid crystal is filled by a vacuum injection method from FIG. 1 (see FIG. 1), and then the liquid crystal injection port 31a is sealed.

FIG. 4 is an enlarged sectional view of a cross-electrode portion of the panel-type element manufactured as described above.
(A) shows a cross section along the radial direction of the rod-shaped filler 31, and (b) shows a cross section along the length direction of the rod-shaped filler 31.

As shown in FIGS. 4A and 4B,
In the panel-type element, the rod-shaped filler 31 mixed in the sealing material 30 and sandwiched between the upper substrate 10 and the lower substrate 20 in a state of falling down in parallel with the surfaces of the substrates 10 and 20 is used. The upper cross electrode 12 and the lower cross electrode 22 provided on the substrate 10 and the lower substrate 20 are in line contact along the length direction of the rod-shaped filler 31.

Therefore, according to this panel type element, the electric resistance of the contact portion between the upper cross electrode 12 and the lower cross electrode 22 and the rod-shaped filler 31 is reduced, and the upper cross electrode 12 and the lower cross electrode 22 Can be connected in a good conduction state.

Moreover, in this panel-type element, the length of the rod-shaped filler 31 is determined by the sealing material 30 in the interval between the plurality of lead wirings 25 and the plurality of terminal electrodes 23 and 24 of the lower substrate 20. The smallest distance in the substrate bonding region and the plurality of upper cross electrodes 12 and lower cross electrodes 22 of the upper substrate 10 and the lower substrate 20;
Of the plurality of lead wires 13 of the upper substrate 10 is shorter than any of the smallest intervals in the substrate bonding region of the upper substrate 10. The terminal electrodes 23 for electrodes and the terminal electrodes 24 for scanning electrodes or between the terminal electrodes 23 and 24 and the lead wires 13 connected to the other terminal electrodes 23 for signal electrodes are not short-circuited via the rod-shaped filler. In addition, the lower cross electrode 2 facing the upper cross electrodes 12 and the lower cross electrodes 22 adjacent to each other or the upper cross electrode 12 and another upper cross electrode 12 facing each other.
2 is not short-circuited by the rod-shaped filler 31.

In the above embodiment, the upper cross electrode 12 formed on the upper substrate 10 is provided in the substrate bonding region along the terminal arrangement portion 20a of the lower substrate 20 in the substrate bonding region using the sealing material 30. However, the upper cross electrode 12
The lower substrate 20 may be provided in a substrate bonding region along a side edge other than the terminal arrangement portion 20a. In this case, the lower cross electrode 22 provided on the lower substrate 20 is formed so as to face the upper cross electrode 12 and Lead wiring is provided between the lower cross electrode 22 and the scanning electrode terminal electrode 24 corresponding to the lower cross electrode 22 of the plurality of terminal electrodes 23 and 24 arranged in the terminal arrangement portion 20a of the lower substrate 20. What is necessary is just to connect via.

FIGS. 5 to 7 show a second embodiment of the present invention. FIGS. 5 and 6 are perspective views of the rod-like filler mixed into the sealing material in the initial state and in the state of being pressed radially. FIG. 7 is an enlarged cross-sectional view along the radial direction of the rod-shaped filler in the cross electrode portion of the panel-type element.

The rod-like filler 32 used in this embodiment is:
Resin material 3 formed in a very fine rod shape having a circular cross section
3 and a conductive metal film 34 covering the entire surface of the resin material 33. The resin material 33 is a resin wire obtained by stretching a thermoplastic resin or a thermosetting resin in a pre-fired state. The conductive metal film 34 is formed by cutting the surface of a resin material 33 with a metal having good conductivity such as an aluminum alloy or silver.

The diameter (diameter) of the resin material 33 of the rod-shaped filler 32 is determined by the distance (for example, several μm) between the pair of substrates 10 and 20 joined at a predetermined distance by the frame-shaped sealing material 30. ) Is set to be slightly larger than the length of the rod-shaped filler 31 made of the conductive metal used in the first embodiment (the plurality of lead wires 25 and the plurality of Of the terminal electrodes 23 and 24 in the substrate bonding region by the sealing material 30 and the plurality of upper cross electrodes 12 and lower cross electrodes 2 of the upper substrate 10 and the lower substrate 20.
2 is shorter than any of the intervals between the plurality of lead wires 13 of the upper substrate 10 and the smallest interval in the substrate bonding region.

According to this embodiment, the same effects as in the first embodiment can be obtained, and the rod-like filler 32 can be used.
Is composed of a resin material 33 formed in a rod shape and a conductive metal film 34 covering the entire surface of the resin material 33, so that the upper substrate 10 and the lower substrate 20 are subjected to pressure when they are joined. 6 and 7, a crack 34a is generated in the conductive metal film 34 by the crushing deformation of the rod-shaped filler 32, and the resin material 33 oozes out of the crack 34a as shown in FIG. Further, since the rod-shaped filler 32 is bonded to the lower substrate 20, the rod-shaped filler 32 can be more firmly fixed to the upper substrate 10 and the lower substrate 20.

When the resin material 33 is a thermoplastic resin, the resin material 33 is heated to the melting temperature of the thermoplastic resin when the substrates 10 and 20 are joined, so that the resin material 33 is in a pre-fired state. In this case, when the substrates 10 and 20 are joined, the thermosetting resin may be heated to the re-melting temperature. The heating melts the internal resin material 33, and the resin is pressed into the rod-shaped filler 32 by pressing. Of the conductive metal film 34 due to the crushing deformation, and adheres to the upper substrate 10 and the lower substrate 20.

The rod-like filler 3 used in the second embodiment
2 is particularly effective when one or both of the upper substrate 10 and the lower substrate 20 are resin substrates (resin substrates made of PET, PC, polyester, or the like).

That is, since the resin substrate expands and contracts depending on environmental conditions such as temperature and humidity, if the substrate and the filler are merely in contact with each other, the expansion of the resin substrate causes
The filler contact portion of the substrate bends and deforms away from the filler, and a conduction failure occurs between the cross electrode formed on the inner surface of the substrate and the filler.

However, according to the rod-like filler 32 used in the second embodiment, the resin material 33 oozing out from the crack 34a generated in the conductive metal film 34 by the crushing deformation due to the pressure is applied to the upper substrate 10 and the lower portion. One or both of the upper substrate 10 and the lower substrate 20 are resin substrates in order to adhere to the substrate 20 and firmly fix the rod-shaped filler 32 to the upper substrate 10 and the lower substrate 20. Even if the resin substrate elongates due to the environmental conditions described above, the filler contact portion of the substrate does not bend and deform away from the rod-shaped filler to cause conduction failure.

Although the panel type element of the above embodiment is used for a simple matrix type liquid crystal display panel, the present invention relates to an active matrix type or segment type liquid crystal display panel and an electro-optical device other than liquid crystal. The present invention can also be applied to an electro-optical display panel using a substance (for example, an electrochromic substance or an electrophoretic substance), or a panel-type element used for a contact or capacitive touch input panel.

For example, in the case of a panel type element used for an active matrix type liquid crystal display panel using a TFT (thin film transistor) as an active element, a frame-shaped sealing material is provided on the inner surface of the first substrate of the pair of substrates. A counter electrode (first electrode) formed in a region surrounded by and a at least one terminal electrode formed in a substrate bonding region formed by the sealing material and connected to the counter electrode;
On the inner surface of the second substrate, a plurality of pixel electrodes (second electrodes) arranged in a matrix, a plurality of TFTs respectively connected to the pixel electrodes, and a gate signal and a data signal are applied to these TFTs. A plurality of gate wirings and data wirings to be supplied; a second cross electrode facing the first cross electrode; and a terminal array formed at one end and one side of the second substrate. A plurality of terminal electrodes respectively connected to the gate wiring and the data wiring and the second cross electrode directly or via a plurality of lead wirings are provided.

In this panel-type element, the counter electrode formed in the region surrounded by the sealant on the first substrate is opposed to all of the plurality of pixel electrodes arranged in a matrix on the second substrate. The first cross electrode connected to the counter electrode and the second cross electrode facing the first cross electrode are 1
One or several electrodes arranged at a sufficient distance.

Therefore, in the case of this panel type element,
The length of the rod-shaped filler mixed into the frame-shaped sealing material is shorter than the smallest interval in the substrate bonding region among the intervals of the plurality of lead wirings and the plurality of terminal electrodes of the second substrate. The length (preferably, about １ ／ to の of the smallest interval), and the adjacent lead wires or terminal electrodes, or the terminal electrode and a lead wire connected to another terminal electrode are the rod-shaped filler. What is necessary is just to make it not to be short-circuited via the.

[0055]

According to the panel type device of the present invention, at least one first electrode is provided, and at least one first cross electrode connected to the first electrode is provided in a region where the frame-shaped sealing member is joined to the substrate. Is provided, a plurality of second electrodes facing the first electrode, and a second cross electrode facing the first cross electrode are provided. A second substrate on which a plurality of terminal electrodes arranged and connected to the plurality of second electrodes and the second cross electrodes directly or via a plurality of lead wires, respectively, is joined to a terminal arrangement portion protruding outward. In the sealing material, a plurality of rod-shaped conductive members each having a shorter length than the smallest interval in the substrate bonding region among the intervals between the plurality of lead wires and the plurality of terminal electrodes. A filler is mixed, and these rod-shaped fillers are sandwiched between the first substrate and the second substrate in a state where they are laid down in parallel with the substrate surface, and the first cross electrode and the second cross electrode are sandwiched. Since the electrodes are electrically connected to each other by the rod-shaped filler sandwiched between the cross electrodes, the first cross electrode and the second cross electrode are in a good conduction state, and Matching lead wires or terminal electrodes, or the terminal electrode and a lead wire connected to another terminal electrode can be connected via the rod-shaped filler without being short-circuited.

In the panel-type element according to the present invention, the first cross electrode provided on the first substrate and the second cross electrode provided on the second substrate are each formed of a substrate made of the sealing material. When a plurality of rod-shaped fillers mixed in the sealing material are formed in a plurality at a predetermined position in the bonding region, the length of the plurality of rod-shaped fillers mixed in the sealing material is defined by the distance between the plurality of lead wires and the plurality of terminal electrodes. What is necessary is just to make it shorter than any of the minimum space | interval in the said board | substrate junction area | region, and the space | interval of the said several 1st and 2nd cross-electrode. Two cross electrodes or the first
The short circuit due to the rod-shaped filler between the cross electrode and the second cross electrode facing the other first cross electrode can be eliminated.

In this panel-type element, the rod-like filler mixed in the sealing material may be made of a conductive metal, but may be a resin material formed in a rod shape and a conductive metal film covering the surface of the resin material. According to the latter rod-shaped filler, cracks are generated in the conductive metal film due to crushing deformation of the rod-shaped filler due to pressurization at the time of joining the first substrate and the second substrate. Since the resin material oozes out of the crack and adheres to the first and second substrates, the rod-shaped filler can be more firmly fixed to the first and second substrates.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a panel-type element showing a first embodiment of the present invention.

FIG. 2 is an enlarged plan view of a part of a frame-shaped sealing material in the panel-type element of the first embodiment.

FIG. 3 is a perspective view of a conductive filler mixed in the sealing material.

FIG. 4 is an enlarged cross-sectional view along a radial direction and a length direction of a rod-shaped filler in a cross electrode portion of the panel-type element according to the first embodiment.

FIG. 5 is a perspective view showing an initial state of a rod-like filler mixed in a sealing material according to a second embodiment of the present invention.

FIG. 6 is a perspective view of a state in which the rod-shaped filler is radially pressed.

FIG. 7 is an enlarged cross-sectional view along a radial direction of a rod-shaped filler at a cross electrode portion of the panel-type element of the second embodiment.

[Explanation of symbols]

 Reference Signs List 10 upper substrate (first substrate) 11 scanning electrode (first electrode) 12 upper cross electrode (first cross electrode) 13 lead wiring 20 lower substrate (second substrate) 20a terminal arrangement Part 21 ... Signal electrode (second electrode) 22 ... Lower cross electrode (second cross electrode) 23,24 ... Terminal electrode 25 ... Lead wiring 30 ... Seal material 31,32 ... Bar-shaped filler 33 ... Resin material 34 ... Conductivity Metallic film 34a ... crack

Claims (4)

[Claims] A first substrate having the first substrate on at least one side thereof;
A second substrate, which has a terminal arrangement portion protruding outside of the first substrate, and is arranged to face the first substrate; and a first substrate in a region corresponding to a peripheral portion of the first substrate. And a frame-shaped sealing material for joining the first substrate and the second substrate. Of the opposing inner surfaces of the first substrate and the second substrate, the inner surface of the first substrate is provided with the sealing material. At least one first electrode formed in the enclosed area;
The first member is formed in a substrate bonding region by the sealing material.
At least one first cross electrode connected to the first electrode is provided on the inner surface of the second substrate, and a plurality of second electrodes facing the first electrode and the first cross electrode facing the first cross electrode. And a plurality of terminal electrodes arranged and formed in the terminal arrangement portion and connected to the plurality of second electrodes and the second cross electrode directly or via a plurality of lead wires, respectively. In the sealing material, a plurality of rod-shaped conductive fillers each having a shorter length than the smallest interval in the substrate bonding region among the intervals of the plurality of lead wires and the plurality of terminal electrodes are provided. While being mixed, these rod-shaped fillers are sandwiched between the first substrate and the second substrate in a state where they are laid down in parallel with the substrate surface, and the first cross electrode and the second clamp are interposed. A panel-type element, wherein a loss electrode is electrically connected by the rod-shaped filler sandwiched between the cross electrodes. 2. A plurality of first cross electrodes provided on a first substrate and a plurality of second cross electrodes provided on a second substrate are respectively arranged at predetermined positions in a substrate joining region by a sealing material. The length of the plurality of rod-shaped fillers that are formed and mixed in the sealing material is the smallest interval in the substrate bonding region among the intervals of the plurality of lead wirings and the plurality of terminal electrodes, and The panel-type element according to claim 1, wherein the distance is shorter than any of the intervals between the plurality of first and second cross electrodes. 3. The rod-like filler mixed in the sealing material,
3. The panel-type element according to claim 1, wherein the panel-type element is made of a conductive metal. 4. A rod-like filler mixed in a sealing material,
The rod-shaped filler is made of a resin material formed in a rod shape and a conductive metal film covering the surface of the resin material, and the rod-shaped filler is crushed by pressure when joining the first substrate and the second substrate. 3. The panel-type element according to claim 1, wherein the deformation causes a crack in the conductive metal film, and the resin material oozes out of the crack and adheres to the first and second substrates. .