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JP2001098107A - Method for decomposition treatment of thermosetting resin - Google Patents

Method for decomposition treatment of thermosetting resin

Info

Publication number
JP2001098107A
JP2001098107A JP28044699A JP28044699A JP2001098107A JP 2001098107 A JP2001098107 A JP 2001098107A JP 28044699 A JP28044699 A JP 28044699A JP 28044699 A JP28044699 A JP 28044699A JP 2001098107 A JP2001098107 A JP 2001098107A
Authority
JP
Japan
Prior art keywords
phenol
salt
thermosetting resin
phenol compound
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28044699A
Other languages
Japanese (ja)
Other versions
JP4090645B2 (en
Inventor
Junya Goto
純也 後藤
Kunio Arai
邦夫 新井
Masafumi Ajiri
雅文 阿尻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP28044699A priority Critical patent/JP4090645B2/en
Publication of JP2001098107A publication Critical patent/JP2001098107A/en
Application granted granted Critical
Publication of JP4090645B2 publication Critical patent/JP4090645B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/50Improvements relating to the production of bulk chemicals
    • Y02P20/54Improvements relating to the production of bulk chemicals using solvents, e.g. supercritical solvents or ionic liquids
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/62Plastics recycling; Rubber recycling

Landscapes

  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Catalysts (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for the high-speed and mass-decomposition treatment of thermosetting resins contained in large quantities in industrial wastes and general wastes so as to recycle them. SOLUTION: This method comprises the hydrolysis and/or pyrolysis of thermosetting resins in supercritical or subcritical water as solvent into low- to medium-molecular weight compounds containing >=50 wt.% of mono- to binuclear phenolic compounds; wherein a salt made from an alkali (alkaline earth) metal and a phenolic compound is added as catalyst to the system.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、工場などから大量
に廃棄されている産業廃棄物や、一般廃棄物中に大量に
含まれていながら、これまでリサイクルが実現できてい
ない熱硬化性樹脂を、高速に大量に分解処理して、再利
用可能な1〜2核体フェノール類化合物を50wt%以
上含む低〜中分子化合物として、回収・再利用する方法
に関するものである。
[0001] The present invention relates to a thermosetting resin which has not been able to be recycled until now, although it is contained in a large amount in industrial waste or general waste which is disposed in large quantities from factories and the like. The present invention relates to a method of recovering and reusing as a low to medium molecular compound containing 50 wt% or more of a reusable 1-2 dinuclear phenol compound which is decomposed in a large amount at a high speed.

【0002】[0002]

【従来の技術】プラスチックの中でも熱硬化性樹脂は、
優れた電気絶縁性・耐熱性・機械的強度を示すため、電
気・電子部品、自動車部品等の材料として広く用いられ
ている。しかし、熱硬化性樹脂は、一旦、硬化すると、
熱により軟化・融解せず、溶剤にも溶解しないため、そ
の硬化物をプラスチック原料として再生することは、技
術的に困難であった。
2. Description of the Related Art Among plastics, thermosetting resins are:
Because of its excellent electrical insulation, heat resistance and mechanical strength, it is widely used as a material for electric / electronic parts, automobile parts and the like. However, thermosetting resin, once cured,
Since it does not soften and melt by heat and does not dissolve in a solvent, it is technically difficult to regenerate the cured product as a plastic raw material.

【0003】近年、熱硬化性樹脂を、超臨界状態あるい
は亜臨界状態の水を用いて加水分解し、有用化合物を選
択的に回収する方法が検討されているが、例えば、特開
平10−24274号公報に開示されている方法を用い
れば、エポキシ樹脂のように、構造中にエーテル結合、
エステル結合、酸アミド結合を有する熱硬化性樹脂を、
酸触媒や、アルカリ触媒を添加することなく、400
℃、37MPa、10分間程度の条件で、完全にテトラ
ヒドロフラン(THF)可溶までに分解することが可能
である。しかし、フェノール樹脂は超臨界水中でも非常
に難分解性であり、400℃、37MPa、10分間の
条件では、20wt%程度しかTHF可溶まで分解しな
い。
[0003] In recent years, a method of hydrolyzing a thermosetting resin using water in a supercritical state or a subcritical state to selectively recover useful compounds has been studied. If the method disclosed in the publication is used, like an epoxy resin, an ether bond in the structure,
An ester bond, a thermosetting resin having an acid amide bond,
Without adding acid catalyst or alkali catalyst, 400
Under conditions of 10 ° C., 37 MPa, and about 10 minutes, it is possible to completely decompose the compound until it is completely soluble in tetrahydrofuran (THF). However, the phenol resin is very hard to decompose even in supercritical water, and decomposes only to about 20 wt% in THF under the conditions of 400 ° C., 37 MPa, and 10 minutes.

【0004】一方、アルカリ触媒を過剰に加えてアルカ
リ加水分解によって、硬化したフェノール樹脂からノボ
ラックを回収できることを、Summersが報告している。
(R.M.Summers:j.Polym.Sci.,Poym.Chem.Ed.,16,1669
(1978))この方法で生成したノボラックは、フェノール
性水酸基を有するために添加したアルカリ触媒と塩を形
成して、ノボラックのアルカリ塩として回収される。こ
のノボラックのアルカリ塩から、遊離のノボラックを分
離、精製して再利用するためには、ノボラックよりも強
い酸(例えば、塩酸、硫酸、酢酸、炭酸)で中和処理を
行う必要が生じる。また、中和処理により、触媒として
添加したアルカリは、塩となるため、アルカリ触媒とし
て、そのまま再利用することはできず、廃棄物として処
理しなければならない。このような分離、精製工程での
問題から、アルカリ加水分解による分解処理は、有用な
方法とは、言い難い。
On the other hand, Summers reports that novolak can be recovered from a cured phenolic resin by adding an excess amount of an alkali catalyst and alkali hydrolysis.
(RM. Summers: j. Polym. Sci., Poym. Chem. Ed., 16, 1669
(1978)) The novolak produced by this method forms a salt with an alkali catalyst added because it has a phenolic hydroxyl group, and is recovered as an alkali salt of novolak. In order to separate, purify, and reuse free novolak from the alkali salt of novolak, it is necessary to perform a neutralization treatment with a stronger acid (for example, hydrochloric acid, sulfuric acid, acetic acid, or carbonic acid) than novolak. Further, the alkali added as a catalyst by the neutralization treatment becomes a salt, so that it cannot be reused as an alkali catalyst as it is, but must be treated as waste. Due to such problems in the separation and purification steps, the decomposition treatment by alkali hydrolysis is hardly a useful method.

【0005】このように、熱硬化性樹脂を短時間で効率
的に分解して、有用な低〜中分子化合物として回収、分
離、精製して再利用することは、広く望まれているが実
現できていない。
As described above, although it is widely desired to efficiently decompose a thermosetting resin in a short period of time and recover, separate, purify, and reuse it as a useful low to medium molecular compound, it has been widely realized. Not done.

【0006】[0006]

【発明が解決しようとする課題】本発明は、熱硬化性樹
脂のリサイクルが極めて困難であるという問題点を解決
するため、種々の検討を行った結果なされたものであ
る。その目的とするところは、主として、工場などから
排出される産業廃棄物や、一般廃棄物中に大量に含まれ
ていながら、これまでリサイクルが実現できていない熱
硬化性樹脂を、高速に大量に分解処理し、再利用する方
法を提供するものである。
SUMMARY OF THE INVENTION The present invention has been made as a result of various studies to solve the problem that recycling of thermosetting resin is extremely difficult. Its main purpose is to rapidly produce large quantities of thermosetting resins that have not been able to be recycled yet are contained in large amounts in industrial waste and general waste discharged from factories and the like. It provides a method of disassembling and reusing.

【0007】[0007]

【課題を解決するための手段】本発明は、超臨界水又は
亜臨界水を溶媒として、熱硬化性樹脂を加水分解及び/
又は熱分解により、1〜2核体フェノール類化合物を5
0wt%以上含む低〜中分子化合物まで分解するに際
し、触媒としてアルカリ金属とフェノール類化合物から
なる塩又はアルカリ土類金属とフェノール類化合物から
なる塩を添加することを特徴とする熱硬化性樹脂の分解
処理方法であり、上記で用いたアルカリ金属とフェノー
ル類化合物からなる塩又はアルカリ土類金属とフェノー
ル類化合物からなる塩を、回収、分離して、再度、分解
処理工程に利用することを特徴とする熱硬化性樹脂の分
解処理方法である。また、回収、分離したアルカリ金属
とフェノール類化合物からなる塩又はアルカリ土類金属
とフェノール類化合物からなる塩は、更に、精製して再
利用しても良い。
According to the present invention, a thermosetting resin is hydrolyzed and / or supercritical water or subcritical water is used as a solvent.
Or, by thermal decomposition, 5 to 1 core dinuclear phenol compounds
A thermosetting resin characterized by adding a salt composed of an alkali metal and a phenolic compound or a salt composed of an alkaline earth metal and a phenolic compound as a catalyst when decomposing to low to medium molecular compounds containing 0 wt% or more; A decomposition treatment method, characterized in that the salt composed of an alkali metal and a phenol compound or the salt composed of an alkaline earth metal and a phenol compound used above is recovered, separated, and reused in the decomposition treatment step. This is a method for decomposing a thermosetting resin. The recovered and separated salt of an alkali metal and a phenol compound or the salt of an alkaline earth metal and a phenol compound may be further purified and reused.

【0008】[0008]

【発明の実施の形態】本発明の方法で分解される熱硬化
性樹脂は、硬化した樹脂、未硬化の樹脂、樹脂を含有す
るワニスを含むものとする。また、単独の熱硬化性樹脂
の他に、シリカ微粒子、ガラス繊維等の無機質系や、木
粉等の有機質系の充填剤を含む成形材料もしくは成型
品、ガラス布のような無機質系や、紙、布等の有機質系
基材を用いた積層板、これに銅箔等の金属箔を張り合わ
せた金属張り積層板、さらには、銅張り積層板などを加
工して得られるプリント回路板のような熱硬化性樹脂製
品も含むものとする。また、熱硬化性樹脂の種類として
は、特に限定されるものではないが、本発明は、フェノ
ール樹脂、エポキシ樹脂、フェノール変性メラミン樹脂
について、特に効果的に適応できる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The thermosetting resin decomposed by the method of the present invention includes a cured resin, an uncured resin, and a varnish containing a resin. Also, in addition to a single thermosetting resin, inorganic materials such as silica fine particles and glass fibers, molding materials or molded products containing organic fillers such as wood powder, inorganic materials such as glass cloth, paper, etc. , Such as a laminated board using an organic base material such as cloth, a metal-clad laminate obtained by laminating a metal foil such as a copper foil thereto, and a printed circuit board obtained by processing a copper-clad laminate or the like. It shall include thermosetting resin products. The type of the thermosetting resin is not particularly limited, but the present invention can be particularly effectively applied to a phenol resin, an epoxy resin, and a phenol-modified melamine resin.

【0009】本発明で熱硬化性樹脂から分解回収できる
1〜2核体フェノール類化合物は、フェノール、クレゾ
ール類、キシレノール類等の単核体フェノール、ジヒド
ロキシジフェニルメタン、および2,2−ビスヒドロキ
シフェニルプロパン等の2核体フェノールなどに代表さ
れるが、上記のフェノール類化合物に限定されるもので
はない。
The mononuclear phenol compounds which can be decomposed and recovered from the thermosetting resin in the present invention include mononuclear phenols such as phenol, cresols and xylenols, dihydroxydiphenylmethane, and 2,2-bishydroxyphenylpropane. And the like, but are not limited to the above-mentioned phenol compounds.

【0010】本発明で用いるアルカリ金属とフェノール
類化合物からなる塩は、アルカリ金属として、リチウ
ム、ナトリウム、カリウム、ルビジウム、またはセシウ
ム等と、フェノール類化合物として、フェノール、クレ
ゾール類、キシレノール類等の単核体フェノール、また
はジヒドロキシジフェニルメタン、2,2−ビスヒドロ
キシフェニルプロパン等の2核体フェノールフェノール
類化合物とから形成されるものである。例えば、リチウ
ムフェノキシド、ナトリウムフェノキシド、カリウムフ
ェノキシド等が挙げられるが、コスト面および触媒とし
ての効果から、ナトリウムフェノキシド、カリウムフェ
ノキシドが好ましい。
The salt composed of an alkali metal and a phenol compound used in the present invention includes lithium, sodium, potassium, rubidium or cesium as the alkali metal and phenol, cresols, xylenols and the like as the phenol compound. It is formed from a core phenol or a binuclear phenol phenol compound such as dihydroxydiphenylmethane and 2,2-bishydroxyphenylpropane. For example, lithium phenoxide, sodium phenoxide, potassium phenoxide and the like can be mentioned, and sodium phenoxide and potassium phenoxide are preferable from the viewpoint of cost and effect as a catalyst.

【0011】本発明で用いるアルカリ土類金属とフェノ
ール類化合物からなる塩は、アルカリ土類金属として、
ベリリウム、マグネシウム、カルシウム、ストロンチウ
ムまたはバリウム等と、フェノール類化合物として、フ
ェノール、クレゾール類、キシレノール等の単核体フェ
ノール、またはジヒドロキシジフェニルメタン、2,2
−ビスヒドロキシフェニルプロパン等の2核体フェノー
ルとから形成されるものである。例えば、カルシウムフ
ェノキシド、マグネシウムフェノキシド、バリウムフェ
ノキシド等が挙げられるが、コスト面および触媒として
の効果から、カルシウムフェノキシド、マグネシウムフ
ェノキシドが好ましい。
The salt composed of an alkaline earth metal and a phenol compound used in the present invention is, as an alkaline earth metal,
Beryllium, magnesium, calcium, strontium or barium and the like, and phenolic compounds such as phenols, cresols, mononuclear phenols such as xylenol, or dihydroxydiphenylmethane, 2,2
And a binuclear phenol such as bishydroxyphenylpropane. For example, calcium phenoxide, magnesium phenoxide, barium phenoxide and the like can be mentioned, but calcium phenoxide and magnesium phenoxide are preferable in terms of cost and effect as a catalyst.

【0012】これらのアルカリ金属とフェノール類化合
物からなる塩又はアルカリ土類金属とフェノール類化合
物からなる塩は、単独または混合物の形で用いられ、高
純度である必要はない。また、これらの塩は、分解処理
工程で触媒として用いたのち、分解反応後の回収液から
蒸発操作などにより、分離、回収し、必要に応じて、精
製を行い、再度触媒として利用してもよい。
These salts composed of an alkali metal and a phenol compound or salts composed of an alkaline earth metal and a phenol compound are used alone or in the form of a mixture, and do not need to be of high purity. In addition, after these salts are used as a catalyst in the decomposition treatment step, they can be separated and recovered from the recovered liquid after the decomposition reaction by an evaporation operation or the like, and if necessary, purified and used again as a catalyst. Good.

【0013】超臨界水又は亜臨界水に添加するアルカリ
金属とフェノール類化合物からなる塩又はアルカリ土類
金属とフェノール類化合物からなる塩の使用割合は、水
100重量部に対して、0.1〜100重量部、望まし
くは5〜50重量部の割合である。
The proportion of the salt composed of an alkali metal and a phenol compound or the salt composed of an alkaline earth metal and a phenol compound added to supercritical water or subcritical water is 0.1 parts by weight with respect to 100 parts by weight of water. -100 parts by weight, preferably 5 to 50 parts by weight.

【0014】本発明の分解処理方法は、高温高圧の条件
下で実施されるが、温度が200〜600℃、圧力が2
〜60Mpaの範囲で、温度および圧力を超臨界又は亜
臨界の条件に調製すれば良いが、望ましくは、温度が3
60〜500℃、圧力が20〜50MPa範囲で、温度
および圧力を設定すれば良い。反応時間は、1〜60分
の範囲で調製できるが、通常は3〜30分で分解処理が
終了する。水の使用割合は、熱硬化性樹脂1重量部に対
して、1〜20重量部の範囲であり、望ましくは2〜1
0重量部の範囲である。
The decomposition treatment method of the present invention is carried out under the conditions of high temperature and high pressure.
The temperature and pressure may be adjusted to supercritical or subcritical conditions within the range of M60 Mpa.
The temperature and pressure may be set at a temperature of 60 to 500 ° C. and a pressure of 20 to 50 MPa. The reaction time can be adjusted in the range of 1 to 60 minutes, but usually the decomposition treatment is completed in 3 to 30 minutes. The proportion of water used is in the range of 1 to 20 parts by weight, preferably 2 to 1 part by weight, per 1 part by weight of the thermosetting resin.
The range is 0 parts by weight.

【0015】また、分解処理に供する熱硬化性樹脂ある
いは熱硬化性樹脂製品の大きさは、特に限定されるもの
ではないが、分解反応が、より短時間で進行するよう
に、あらかじめ0.1〜10mm程度に粉砕しておくこ
とが好ましい。
[0015] The size of the thermosetting resin or the thermosetting resin product to be subjected to the decomposition treatment is not particularly limited, but is set in advance so that the decomposition reaction proceeds in a shorter time. It is preferable to pulverize to about 10 mm.

【0016】本発明において、超臨界水又は亜臨界水を
反応溶媒として熱硬化性樹脂を加水分解及び/又は熱分
解するに際し、触媒としてアルカリ金属とフェノール類
化合物からなる塩又はアルカリ土類金属とフェノール類
化合物からなる塩を添加することで、特に分解が困難で
あった熱硬化性樹脂を、容易に分解し、1〜2核体フェ
ノール類化合物を50wt%以上含む低〜中分子化合物
として回収することができる。また、本発明で得られる
1〜2核体フェノール類化合物は、遊離のフェノール類
化合物として回収できるため、中和処理を行うことなく
分離・精製を行うことができる。
In the present invention, when a thermosetting resin is hydrolyzed and / or thermally decomposed using supercritical water or subcritical water as a reaction solvent, a salt or an alkaline earth metal comprising an alkali metal and a phenol compound is used as a catalyst. By adding a salt composed of a phenol compound, the thermosetting resin, which was particularly difficult to decompose, can be easily decomposed and recovered as a low to medium molecular compound containing 50% by weight or more of a 1- or 2-nuclear phenol compound. can do. Moreover, since the 1- or 2-nuclear phenol compound obtained in the present invention can be recovered as a free phenol compound, it can be separated and purified without performing a neutralization treatment.

【0017】[0017]

【実施例】以下、実施例を挙げて本発明を詳細に説明す
るが、本発明は、これによって何ら限定されるものでは
ない。
EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited thereto.

【0018】[実施例1]フェノール樹脂硬化物の分解 熱硬化性樹脂として、フェノール樹脂100重量部に対
しヘキサメチレンテトラミン15重量部を配合して、1
50℃で15分間加圧成形して、さらに180℃で4時
間の熱処理を加えたフェノール樹脂硬化物を用いた。小
型回分式反応器(内容積5cm3、Hasteroy
C−276製)に、粒径0.5−1.0mmに粉砕した
上記フェノール樹脂硬化物0.25g、水1.8g、触
媒としてカリウムフェノキシド0.25gを仕込み、内
部をアルゴンで置換して封入した。反応器を流動砂浴に
投入して、急速に加熱して内温を400℃とすること
で、反応器内圧を30MPaまで上昇させ、高温高圧状
態とした。400℃、30MPaで10分間保った後、
反応器をエアーガンで冷却して、常温常圧に戻した。分
解反応後の回収液は、1.0μmのフィルターでろ過
し、ろ液を水可溶分とした。ろ過した後のフィルターに
残った水不溶分は、テトラヒドロフラン(以下THFと
略す)で溶解させたのち、1.0μmのフィルターでろ
過し、ろ液をTHF可溶分とした。フィルターに残った
THF不溶残渣は、100℃で12時間乾燥させたのち
秤量した。その結果、フェノール樹脂硬化物の約85w
t%が分解して、水可溶分、およびTHF可溶分となっ
た。水可溶分、THF可溶分を、ガスクロマトグラフィ
ー(検出器FID)(以下、GC−FIDと略す)によ
り分析を行ったところ、遊離したフェノール、クレゾー
ル等のフェノール類化合物として約50wt%を回収で
きたことを確認した。回収量に対して、その主な内訳
は、フェノールが38wt%、o−クレゾールが23w
t%、p−クレゾールが26wt%、その他(キシレノ
ール等)が13wt%であった。
Example 1 Decomposition of a cured phenolic resin As a thermosetting resin, 15 parts by weight of hexamethylenetetramine was mixed with 100 parts by weight of a phenolic resin.
A phenol resin cured product which was subjected to pressure molding at 50 ° C. for 15 minutes and further subjected to heat treatment at 180 ° C. for 4 hours was used. Small batch type reactor (Internal volume 5cm 3 , Hasteroy
C-276) was charged with 0.25 g of the cured phenolic resin, 1.8 g of water, and 0.25 g of potassium phenoxide as a catalyst pulverized to a particle size of 0.5 to 1.0 mm, and the inside was replaced with argon. Enclosed. The reactor was put into a fluidized sand bath and rapidly heated to 400 ° C. to raise the internal pressure of the reactor to 30 MPa, thereby bringing the reactor to a high-temperature and high-pressure state. After holding at 400 ° C and 30 MPa for 10 minutes,
The reactor was cooled with an air gun and returned to normal temperature and normal pressure. The recovered solution after the decomposition reaction was filtered through a 1.0 μm filter, and the filtrate was used as a water-soluble component. The water-insoluble matter remaining in the filter after the filtration was dissolved in tetrahydrofuran (hereinafter abbreviated as THF), and then filtered through a 1.0 μm filter to obtain a filtrate as a THF-soluble matter. The THF-insoluble residue remaining on the filter was dried at 100 ° C. for 12 hours and then weighed. As a result, about 85 w
The t% was decomposed into a water-soluble component and a THF-soluble component. The water-soluble matter and the THF-soluble matter were analyzed by gas chromatography (detector FID) (hereinafter abbreviated as GC-FID). It was confirmed that it could be collected. The main breakdown of the amount recovered is that phenol is 38 wt% and o-cresol is 23 w%.
t%, 26 wt% of p-cresol, and 13 wt% of others (such as xylenol).

【0019】[実施例2]フェノール樹脂硬化物の分解 実施例1において、反応温度を440℃に設定した他
は、実施例1と同様な操作を行い、分解反応を行った。
その結果、フェノール樹脂硬化物は約90wt%が分解
して、水可溶分、およびTHF可溶分となった。水可溶
分、THF可溶分を、GC−FIDにより分析を行った
ところ、遊離したフェノール、クレゾール等のフェノー
ル類化合物として約60wt%を回収できたことを確認
した。回収量に対して、その主な内訳は、フェノールが
41wt%、o−クレゾールが29wt%、p−クレゾ
ールが17wt%、その他(キシレノール等)が14w
t%であった。
Example 2 Decomposition of Cured Phenolic Resin A decomposition reaction was carried out in the same manner as in Example 1 except that the reaction temperature was set to 440 ° C.
As a result, about 90 wt% of the phenol resin cured product was decomposed into a water-soluble component and a THF-soluble component. Analysis of the water-soluble component and the THF-soluble component by GC-FID confirmed that about 60% by weight of phenol compounds such as released phenol and cresol could be recovered. The main breakdown of the amount recovered was that phenol was 41 wt%, o-cresol was 29 wt%, p-cresol was 17 wt%, and other (xylenol etc.) was 14 w%.
t%.

【0020】[実施例3]フェノール樹脂成形材料の分
解 実施例1において、フェノール樹脂硬化物の代わりに、
フェノール樹脂成形材料(樹脂:44wt%、有機フィ
ラー:42wt%、無機フィラー:14wt%含有)約
0.57gを用いた他は、実施例1と同様な操作を行
い、分解反応を行った。その結果、樹脂成分、有機フィ
ラーは、ほとんど完全に分解して水可溶分、およびTH
F可溶分となった。水可溶分、THF可溶分を、GC−
FIDにより分析を行ったところ、樹脂成分(全体に対
する割合:44wt%)の約55wt%を遊離したフェ
ノール、クレゾール等のフェノール類化合物として回収
できたことを確認した。回収量に対して、その内訳は、
フェノールが38wt%、o−クレゾールが23wt
%、p−クレゾールが26wt%、その他(キシレノー
ル等)が13wt%であった。また、無機フィラーは、
THF不溶残渣として回収し、樹脂、有機フィラーと完
全に分離できた。
[Example 3] Decomposition of phenolic resin molding material In Example 1, instead of the cured phenolic resin,
A decomposition reaction was performed by performing the same operation as in Example 1 except that about 0.57 g of a phenolic resin molding material (resin: 44 wt%, organic filler: 42 wt%, inorganic filler: 14 wt%) was used. As a result, the resin component and the organic filler are almost completely decomposed into water-soluble components and TH.
It became F soluble. Water-soluble and THF-soluble components were analyzed by GC-
Analysis by FID confirmed that about 55 wt% of the resin component (ratio to the whole: 44 wt%) could be recovered as phenol compounds such as phenol and cresol, which were liberated. The breakdown is as follows:
Phenol 38wt%, o-cresol 23wt%
%, P-cresol was 26 wt%, and others (xylenol and the like) were 13 wt%. In addition, the inorganic filler,
It was recovered as a THF-insoluble residue, and was completely separated from the resin and the organic filler.

【0021】[実施例4]フェノール樹脂積層板端材の
分解 実施例1において、フェノール樹脂硬化物の代わりに、
フェノール樹脂積層板端材(紙:51wt%、樹脂:4
9wt%含有)約0.5gを用いた他は、実施例1と同
様な操作を行い分解反応を行った。その結果、樹脂成
分、紙成分はほとんど完全に分解して水可溶分、および
THF可溶分となった。水可溶分、THF可溶分を、G
C−FIDにより分析を行ったところ、樹脂成分(全体
に対する割合:49wt%)の約60wt%を、遊離し
たフェノール、クレゾール等のフェノール類化合物とし
て回収できたことを確認した。回収量に対して、その内
訳は、フェノールが50wt%、o−クレゾールが20
wt%、p−クレゾールが15wt%、その他(キシレ
ノール等)が15wt%であった。
[Example 4] Decomposition of phenolic resin laminate scraps In Example 1, instead of the cured phenolic resin,
Phenolic resin laminate scrap (paper: 51 wt%, resin: 4
A decomposition reaction was carried out by performing the same operation as in Example 1 except that about 0.5 g (containing 9 wt%) was used. As a result, the resin component and the paper component were almost completely decomposed into a water-soluble component and a THF-soluble component. Water soluble and THF soluble
Analysis by C-FID confirmed that about 60% by weight of the resin component (proportion to the whole: 49% by weight) could be recovered as phenolic compounds such as free phenol and cresol. The amount of phenol was 50 wt% and o-cresol was 20%
wt%, 15 wt% of p-cresol, and 15 wt% of others (such as xylenol).

【0022】[実施例5]エポキシ樹脂積層板端材の分
解 実施例1において、フェノール樹脂積層板端材の代わり
に、エポキシ樹脂積層板端材(銅箔:10.9wt%、
ガラスクロス:21.7wt%、フィラー:28.2w
t%、樹脂:39.2wt%含有)0.5gを用いた他
は、実施例1と同様な操作を行い、分解反応を行った。
その結果、樹脂成分は、ほとんど完全に分解して水可溶
分、およびTHF可溶分となった。水可溶分、THF可
溶分を、GC−FIDにより分析を行ったところ、樹脂
成分(全体に対する割合:39.2wt%)の約67w
t%を、遊離したフェノール、クレゾール等のフェノー
ル類化合物として回収できたことを確認した。回収量に
対して、その主な内訳は、フェノールが30wt%、O-
クレゾールが6wt%、p-クレゾールが7wt%、イ
ソプロピルフェノールが27wt%であった。また、銅
箔成分、ガラスクロスはTHF不溶残渣として回収し
て、樹脂成分と完全に分離できた。
Example 5 Decomposition of Epoxy Resin Laminated Pieces In Example 1, the epoxy resin laminated board remnants (copper foil: 10.9 wt%,
Glass cloth: 21.7 wt%, filler: 28.2 w
(t%, resin: 39.2 wt%) 0.5 g was used in the same manner as in Example 1 to perform a decomposition reaction.
As a result, the resin component was almost completely decomposed into a water-soluble component and a THF-soluble component. When the water-soluble component and the THF-soluble component were analyzed by GC-FID, about 67 w of the resin component (the ratio to the whole: 39.2 wt%) was obtained.
It was confirmed that t% could be recovered as phenol compounds such as free phenol and cresol. The main breakdown is 30% by weight of phenol and O-
Cresol was 6 wt%, p-cresol was 7 wt%, and isopropyl phenol was 27 wt%. In addition, the copper foil component and the glass cloth were recovered as THF-insoluble residues, and were completely separated from the resin component.

【0023】[実施例6]実施例1において、分解後に
回収した水可溶分の水分を蒸発させて、カリウムフェノ
キシド0.20gを分離・回収した。続いて、実施例1
において、触媒として、分離・回収して得たカリウムフ
ェノキシド0.20gを用いた以外は、実施例1と同様
な操作を行い、分解反応を行った。その結果、フェノー
ル樹脂硬化物の約80wt%が分解して、水可溶分、お
よびTHF可溶分となった。水可溶分、THF可溶分
を、GC−FIDにより分析を行ったところ、遊離した
フェノール、クレゾール等のフェノール類化合物とし
て、約50wt%を回収できたことを確認した。回収量
に対して、その主な内訳は、フェノールが38wt%、
o−クレゾールが23wt%、p−クレゾールが26w
t%、その他(キシレノール等)が13wt%であっ
た。
Example 6 In Example 1, 0.20 g of potassium phenoxide was separated and recovered by evaporating the water-soluble component recovered after decomposition. Subsequently, Example 1
, A decomposition reaction was carried out in the same manner as in Example 1, except that 0.20 g of potassium phenoxide obtained by separation and recovery was used as a catalyst. As a result, about 80% by weight of the cured phenolic resin was decomposed into water-soluble matter and THF-soluble matter. When the water-soluble component and the THF-soluble component were analyzed by GC-FID, it was confirmed that about 50% by weight of phenol compounds such as released phenol and cresol could be recovered. The main breakdown is 38% by weight of phenol,
23 wt% o-cresol, 26 w p-cresol
t% and others (xylenol etc.) were 13 wt%.

【0024】[比較例1]実施例1において、触媒とし
て用いたカリウムフェノキシドを加えずに、実施例1と
同様な操作を行い、分解反応を行った。その結果、フェ
ノール樹脂硬化物の分解率は、約15wt%と非常に低
い値であった。また、分解生成物を、GC−FIDで分
析を行ったところ、遊離したフェノール、クレゾール等
のフェノール類化合物としての回収率は、約5wt%で
あった。回収量に対して、その主な内訳は、フェノール
が41wt%、o−クレゾールが29wt%、p−クレ
ゾールが17wt%、その他(キシレノール等)が14
wt%であった。
Comparative Example 1 A decomposition reaction was carried out in the same manner as in Example 1 except that potassium phenoxide used as a catalyst was not added. As a result, the decomposition rate of the cured phenol resin was a very low value of about 15 wt%. When the decomposition products were analyzed by GC-FID, the recovery rate as phenol compounds such as liberated phenol and cresol was about 5 wt%. The main breakdown of the recovered amount was that phenol was 41 wt%, o-cresol was 29 wt%, p-cresol was 17 wt%, and other (xylenol etc.) was 14 wt%.
wt%.

【0025】[比較例2]実施例1において、触媒とし
てカリウムフェノキシド 0.25gに代えて、水酸化
カリウム0.25gを用いた以外は実施例1と同様な操
作を行い、分解反応を行った。その結果、フェノール樹
脂硬化物は約90wt%が分解して、水可溶分、および
THF可溶分となり、フェノール、クレゾール等のフェ
ノール類化合物のカリウム塩が生成した。これらのフェ
ノール類化合物のカリウム塩に、中和剤として硫酸0.
22gを添加し、GC−FIDで分析を行ったところ、
遊離のフェノール類化合物を、約50wt%回収できた
ことを確認した。回収量に対して、その主な内訳は、フ
ェノールが41wt%、o−クレゾールが29wt%、
p−クレゾールが17wt%、その他(キシレノール
等)が14wt%であった。その際、約0.39gの硫
酸カリウムが副生成物として発生した。
Comparative Example 2 A decomposition reaction was carried out in the same manner as in Example 1 except that 0.25 g of potassium hydroxide was used instead of 0.25 g of potassium phenoxide as a catalyst. . As a result, about 90% by weight of the cured phenolic resin was decomposed into water-soluble components and THF-soluble components, and potassium salts of phenolic compounds such as phenol and cresol were produced. To the potassium salt of these phenolic compounds, sulfuric acid as a neutralizing agent was added in an amount of 0.1%.
When 22 g was added and analyzed by GC-FID,
It was confirmed that about 50 wt% of the free phenolic compounds could be recovered. The main breakdown of the amount recovered was that phenol was 41 wt%, o-cresol was 29 wt%,
The content of p-cresol was 17% by weight, and that of others (xylenol and the like) was 14% by weight. At that time, about 0.39 g of potassium sulfate was generated as a by-product.

【0026】[0026]

【発明の効果】本発明において、超臨界水又は亜臨界水
を反応溶媒として熱硬化性樹脂を加水分解及び/又は熱
分解するに際し、触媒としてアルカリ金属とフェノール
類化合物からなる塩又はアルカリ土類金属とフェノール
類化合物からなる塩を添加することで、特に分解が困難
であった熱硬化性樹脂を容易に分解し、1〜2核体フェ
ノール類化合物を50wt%以上含む低〜中分子化合物
を回収することができる。得られる1〜2核体フェノー
ル類化合物は、遊離のフェノール類化合物として回収で
きるため、後工程で中和処理を行うことなく分離・精製
を行うことができる。
In the present invention, when a thermosetting resin is hydrolyzed and / or thermally decomposed using supercritical water or subcritical water as a reaction solvent, a salt or alkaline earth composed of an alkali metal and a phenol compound is used as a catalyst. By adding a salt composed of a metal and a phenol compound, the thermosetting resin, which was particularly difficult to decompose, is easily decomposed, and a low to medium molecular compound containing 50% by weight or more of a 1- or 2-nuclear phenol compound is obtained. Can be recovered. The obtained mononuclear phenol compound can be recovered as a free phenol compound, and can be separated and purified without performing a neutralization treatment in a subsequent step.

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F301 AA22 AA23 AA24 CA07 CA23 CA24 CA34 CA41 CA51 CA65 CA72 CA73 4G069 AA15 BA27A BA27B BC01A BC02A BC03A BC03B BC05A BC06A BE06A BE37A CD10 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F301 AA22 AA23 AA24 CA07 CA23 CA24 CA34 CA41 CA51 CA65 CA72 CA73 4G069 AA15 BA27A BA27B BC01A BC02A BC03A BC03B BC05A BC06A BE06A BE37A CD10

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 超臨界水又は亜臨界水を溶媒として、熱
硬化性樹脂を加水分解及び/又は熱分解により、1〜2
核体フェノール類化合物を50wt%以上含む低〜中分
子化合物まで分解するに際し、触媒として、アルカリ金
属とフェノール類化合物からなる塩又はアルカリ土類金
属とフェノール類化合物からなる塩を添加することを特
徴とする熱硬化性樹脂の分解処理方法。
1. A thermosetting resin is hydrolyzed and / or thermally decomposed by using supercritical water or subcritical water as a solvent to form 1-2.
When decomposing into low to medium molecular compounds containing 50% by weight or more of a core phenol compound, a salt composed of an alkali metal and a phenol compound or a salt composed of an alkaline earth metal and a phenol compound is added as a catalyst. Method for decomposing a thermosetting resin.
【請求項2】 熱硬化性樹脂が、フェノール樹脂、エポ
キシ樹脂、フェノール変性メラミン樹脂からなる群より
選択された1種又は2種以上であることを特徴とする、
請求項1に記載の熱硬化性樹脂の分解処理方法。
2. The thermosetting resin is one or more selected from the group consisting of a phenolic resin, an epoxy resin, and a phenol-modified melamine resin,
A method for decomposing a thermosetting resin according to claim 1.
【請求項3】 アルカリ金属とフェノール類化合物から
なる塩が、リチウム、ナトリウム、カリウム、ルビジウ
ムおよびセシウムからなる群より選ばれるアルカリ金属
と、フェノール、クレゾール、キシレノール、レゾルシ
ン、ジヒドロキシジフェニルメタンおよび2,2−ビス
ヒドロキシフェニルプロパンからなる群より選ばれるフ
ェノール類化合物とから形成される塩であることを特徴
とする、請求項1に記載の熱硬化性樹脂の分解処理方
法。
3. A salt comprising an alkali metal and a phenolic compound, wherein the salt comprising an alkali metal selected from the group consisting of lithium, sodium, potassium, rubidium and cesium, phenol, cresol, xylenol, resorcinol, dihydroxydiphenylmethane and 2,2- The method for decomposing a thermosetting resin according to claim 1, wherein the salt is a salt formed with a phenol compound selected from the group consisting of bishydroxyphenylpropane.
【請求項4】 アルカリ土類金属とフェノール類化合物
からなる塩が、ベリリウム、マグネシウム、カルシウ
ム、ストロンチウムおよびバリウムからなる群より選ば
れるアルカリ土類金属と、フェノール、クレゾール、キ
シレノール、レゾルシン、ジヒドロキシジフェニルメタ
ンおよび2,2−ビスヒドロキシフェニルプロパンから
なる群より選ばれるフェノール類化合物とから形成され
る塩であることを特徴とする、請求項1に記載の熱硬化
性樹脂の分解処理方法。
4. A salt comprising an alkaline earth metal and a phenolic compound, wherein the salt comprising an alkaline earth metal selected from the group consisting of beryllium, magnesium, calcium, strontium and barium, phenol, cresol, xylenol, resorcinol, dihydroxydiphenylmethane and The method for decomposing a thermosetting resin according to claim 1, wherein the salt is a salt formed with a phenol compound selected from the group consisting of 2,2-bishydroxyphenylpropane.
【請求項5】 分解処理工程で用いたアルカリ金属とフ
ェノール類化合物からなる塩又はアルカリ土類金属とフ
ェノール類化合物からなる塩を、回収、分離し、再び触
媒として分解処理工程で利用することを特徴とする、請
求項1〜4のいずれか1項に記載の熱硬化性樹脂の分解
処理方法。
5. The method according to claim 1, wherein the salt composed of an alkali metal and a phenol compound or the salt composed of an alkaline earth metal and a phenol compound used in the decomposition treatment step is recovered, separated, and reused as a catalyst in the decomposition treatment step. The method for decomposing a thermosetting resin according to any one of claims 1 to 4, characterized in that it is characterized in that:
JP28044699A 1999-09-30 1999-09-30 Method for decomposing thermosetting resin Expired - Fee Related JP4090645B2 (en)

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006051663A1 (en) * 2004-11-09 2006-05-18 Sumitomo Bakelite Company Limited Decomposition reaction apparatus, system for producing raw material for recycled resin composition, method for producing raw material for recycled resin composition, raw material for recycled resin composition, and formed article
CN112608203A (en) * 2020-12-04 2021-04-06 杭州坤灵环境技术有限公司 Method for preparing liquid water-soluble fertilizer from organic residues

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006051663A1 (en) * 2004-11-09 2006-05-18 Sumitomo Bakelite Company Limited Decomposition reaction apparatus, system for producing raw material for recycled resin composition, method for producing raw material for recycled resin composition, raw material for recycled resin composition, and formed article
JPWO2006051663A1 (en) * 2004-11-09 2008-05-29 住友ベークライト株式会社 Decomposition reaction apparatus, recycled resin composition raw material manufacturing system, recycled resin composition raw material manufacturing method, recycled resin composition raw material, and molded article
US8188154B2 (en) 2004-11-09 2012-05-29 Sumitomo Bakelite Company, Ltd. Decomposition reaction apparatus, system for producing raw material for recycled resin composition, method for producing raw material for recycled resin composition, raw material for recycled resin composition, and formed article
CN112608203A (en) * 2020-12-04 2021-04-06 杭州坤灵环境技术有限公司 Method for preparing liquid water-soluble fertilizer from organic residues

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