JP2001077001A - Scanning projection exposure apparatus and device manufacturing method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To accurately adjust the position of an exposure light source. A scanning projection exposure apparatus that scans and exposes a pattern of an original onto a substrate via a projection optical system while moving the original and a substrate in synchronization with a projection optical system. An integrated exposure amount measuring unit 14 for measuring the exposure amount and light source position adjusting units 17 and 20 for adjusting the position of the exposure light source 1 based on the measurement result are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a scanning projection exposure apparatus and a device manufacturing method using the same. The scanning projection exposure apparatus includes, for example, an illumination device that performs illumination using a light source that emits light from a specific range with a specific distribution, such as a high-pressure mercury lamp, and particularly includes a semiconductor element, a liquid crystal display element, and an imaging element. (CCD, etc.), used in the lithography process for manufacturing thin-film magnetic heads, etc., in which a part of the pattern on a mask is projected on a photosensitive substrate, and the mask and the substrate are projected to a projection optical system. There is a step-and-scan type in which the mask pattern is sequentially transferred and exposed to each shot area on the substrate by synchronously scanning.

[0002]

2. Description of the Related Art In general, a projection exposure apparatus is used in a lithography process for manufacturing a semiconductor device, a liquid crystal display device, an imaging device (such as a CCD), a thin film magnetic head, and the like. Among projection exposure apparatuses, in a projection exposure apparatus using a divergent light source such as an ultra-high pressure mercury lamp as an exposure light source, in order to maximize the performance of the projection exposure apparatus, the position between the light source and the optical system of the projection exposure apparatus is required. The relationship needs to be adjusted.

As a conventional method of adjusting the position of a light source, a method of adjusting the illuminance of a surface to be illuminated to be maximum, and a method of increasing the uniformity of illuminance on the surface to be illuminated, which is proposed in Japanese Patent No. 2809081, is disclosed. And a method for adjusting the position of a light source so that the average illuminance is the highest.
No. 5123, a method of adjusting a light source position from a light intensity distribution at a position having a relationship between an illuminated surface and a pupil, and a method using a plurality of light sources proposed in Japanese Patent Application Laid-Open No. 10-284400. In an exposure apparatus, a method of measuring the illuminance of each illumination system unit and adjusting the position of each light source is known. These focus on the illuminance to adjust the position of the light source, and the reason is as follows.

In a projection exposure apparatus called a stepper in which a mask and a photosensitive substrate are placed at conjugate positions and transfer is performed by batch exposure, an exposure amount R at each point in an exposure area is set on the substrate. Using the illuminance W and the exposure time T, it can be expressed as the following equation.

[0005]

(Equation 1) In order to transfer a pattern to a photosensitive substrate, it is necessary to perform exposure so that the sensitivity of the photosensitive agent on the photosensitive substrate is equal to R. Therefore, if the illuminance W on the substrate is high, the exposure time T
Will be small. Therefore, in the stepper, chip production per unit time (throughput)
In order to increase the illuminance, the illuminance W on the substrate may be increased.
On the other hand, in the stepper, since the mask position and the photosensitive substrate are exposed while being stationary, if the illuminance W on the substrate varies in the illumination region, the exposure amount varies in the exposure region, and the chip productivity is reduced. (Yield). Therefore, in order to increase the yield, it is necessary to make the illuminance W on the substrate uniform within the illumination area. From such a background, in the conventional light source position adjusting method, the light source position is adjusted by focusing on the illuminance on the substrate.

[0006]

However, in recent years, in a state where a part of a pattern on a mask used in a lithography process is projected on a photosensitive substrate, the mask and the substrate are moved to a projection optical system. In a scanning exposure type projection exposure apparatus such as a step-and-scan method, in which a mask pattern is sequentially transferred and exposed to each shot area on a substrate by scanning in synchronization, the exposure amount on the photosensitive substrate is reduced by a stepper. Unlike that of, it is not directly related to the illuminance on the substrate. Therefore, in the scanning projection exposure apparatus, the conventional light source position adjusting method has no direct relation to the improvement of the throughput and the improvement of the yield. Therefore, the conventional light source position adjusting method cannot maximize the performance of the apparatus. There is a problem that.

SUMMARY OF THE INVENTION An object of the present invention is to provide a scanning projection exposure apparatus capable of more accurately adjusting the position of a light source in view of the problems of the prior art.

[0008]

In order to achieve this object, a first scanning type projection exposure apparatus according to the present invention is to move a pattern of an original plate while moving the original plate and a substrate in synchronization with a projection optical system. In a scanning projection exposure apparatus that performs scanning exposure on the substrate via the projection optical system, an integrated exposure amount measuring unit that measures an integrated exposure amount on the substrate, and a position of an exposure light source based on the measurement result. And a light source position adjusting means for adjusting.

According to a second scanning projection exposure apparatus of the present invention, in the first scanning projection exposure apparatus, the light source position adjusting means moves the exposure light source in three axial directions orthogonal to each other. The position of the exposure light source is adjusted.

A third scanning projection exposure apparatus according to the present invention, in the first or second scanning projection exposure apparatus, can perform the scanning exposure under a plurality of illumination conditions. An adjustment position recording unit that records an adjustment position of the exposure light source based on the measurement result of the integrated exposure amount,
The light source position adjusting means adjusts the position of the exposure light source based on the illumination condition and the recorded adjustment position at the time of the scanning exposure.

According to a fourth aspect of the present invention, in the scanning projection exposure apparatus according to any one of the first to third aspects, the light source position adjusting means is provided at a specific point of an exposure area on the substrate. The position of the light source for exposure is adjusted so that the integrated exposure amount becomes maximum.

A fifth scanning projection exposure apparatus according to the present invention is the scanning projection exposure apparatus according to any one of the first to third aspects, wherein the light source position adjusting means comprises two different points within an exposure area on the substrate. The position of the light source for exposure is adjusted so that the difference between the integrated exposure amounts described above is minimized.

The device manufacturing method of the present invention uses any one of the first to fifth scanning projection exposure apparatuses of the present invention, and the light source position adjusting means adjusts the position of the exposure light source as necessary. And a step of performing scanning exposure while performing.

In such a scanning exposure type projection exposure apparatus, a part of the exposure area is sequentially transferred while the mask, which is the original plate, and the photosensitive substrate are synchronously scanned, and the entire exposure area is exposed. Exposure cannot be completed until scanning is completed for the entire exposure area of the mask and the substrate. Therefore, the integrated scanning exposure amount R to be exposed by the time the scanning is completed at a certain point on the photosensitive substrate is such that the point is at the position x (t) of the illumination area at time t, and the illuminance at that point is W
If (x (t)), the following equation is obtained.

[0015]

(Equation 2) Here, t ₀ and t ₁ are the time when a certain point on the photosensitive substrate enters the illumination area and the time when it exits the illumination area, respectively.
That is, the integrated scanning exposure amount at a certain point on the photosensitive substrate is a temporal (spatial) integrated value of the illuminance in the scanning direction, and the exposure is adjusted such that the integrated scanning exposure amount is equal to the sensitivity of the photosensitive agent on the photosensitive substrate. Need to be done. If the scanning speed is constant υ in the illumination area, the above-described integrated scanning exposure amount R is given by the following equation, where s is the width of the illumination area.

[0016]

(Equation 3) From this, it can be seen that even if there is illuminance variation in the scanning direction, it does not affect the exposure amount on the photosensitive substrate, and the yield does not deteriorate. Also, even if the position of the light source is determined so that the illuminance is maximized by focusing on the illuminance at one point in the illumination area, if the illuminance is low in other areas, the integrated scanning exposure does not increase and the throughput does not improve. I understand. For this reason, when adjusting the light source position of the scanning exposure type projection exposure apparatus, it is not sufficient to adjust the light source while paying attention to the illuminance, and the performance of the scanning exposure type projection exposure apparatus cannot be maximized. Understand.

Therefore, in the present invention, the scanning exposure amount is measured, and the position of the light source is adjusted based on the measurement result, thereby maximizing the performance of the scanning projection type projection exposure apparatus.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to examples.

[0019]

FIG. 1 shows a scanning projection type projection exposure apparatus according to an embodiment of the present invention. This projection exposure apparatus is an illumination device that uniformly illuminates a pattern using a light source that emits light from a specific range with a specific distribution, such as an ultra-high pressure mercury lamp, and a projection optics that projects the illuminated pattern onto a substrate. System. In the figure, 1 is a light source, 2 is a light source 1
It is a condensing mirror for condensing the light beam radiated from. Light rays emitted from the light source 1 are condensed by the condenser mirror 2, pass through the optical system 3, and enter the internal reflection member 4. The relative position of the light source 1 with respect to the condenser mirror 2 is adjusted based on the integrated scanning exposure measured by the integrated exposure sensor located at the same position as the substrate described later.

The inner reflecting member 4 has a function of reflecting the light rays incident thereon a plurality of times on the side surface, thereby making the light intensity, which was not uniform on the inclined surface, uniform on the emitting surface. The internal reflection member 4 may be, for example, a mirror disposed to face each other, or may be a simple rod-shaped glass material.
In the case of a rod-shaped glass material, it is necessary to design so that when an incident light beam strikes the side surface of the rod-shaped glass material, it is totally reflected by a difference in refractive index between the glass material and air.

Reference numeral 5 denotes an optical system for projecting a uniform light intensity distribution formed on the exit surface of the internal reflection member 4 onto the entrance slope of the fly-eye lens 6. The fly-eye lens 6 is a bundle of rod lenses whose entrance and exit surfaces are the focal points of the power of each other, and the light beam incident on the rod lens at the same angle is condensed on the exit surface of the rod lens. Thus, a large number of converging points are formed on the exit surface of the fly-eye lens 6 as a whole.

Reference numeral 7 denotes an optical system for uniformly illuminating an illumination area by using a condensing point group formed on the exit surface of the fly-eye lens 6 as a secondary light source. In the case of a projection exposure apparatus, it is necessary to control an illumination area, and therefore, a uniform light intensity distribution is realized once at a position conjugate with the mask surface without directly illuminating the illumination area. Reference numeral 8 denotes a stop for controlling the illumination area, the position of which is conjugate with the mask surface. By projecting a uniform light intensity distribution at this position by the relay optical system 9, the mask 10 as an illumination area is illuminated. The aperture 8 for controlling the illumination area is movable, and can be moved in accordance with the exposure area of the mask 10.

Reference numeral 11 denotes a pattern on the mask 10
This is a projection optical system for forming an image on the upper surface. A pattern on the mask 10 illuminated by uniform illumination light realized by the above-described illumination system is exposed to a photosensitive agent applied to the substrate 12 and transferred. . The projection optical system 11 is a telecentric system so that the projection magnification does not change even if the position of the mask 10 or the position of the substrate 12 is shifted in the optical axis direction. Since this exposure apparatus is a scanning projection exposure apparatus, the mask 10 and the substrate 12 are scanned synchronously. Also, since the mask 10 moves, the illumination area changes accordingly, so that the stop 8 for controlling the illumination area also moves in synchronization.

Reference numeral 13 denotes a movable stage on which the substrate 12 and the integrated exposure amount sensor 14 are mounted. The stage 13 performs a scanning movement for scanning exposure on the substrate 12 and a step movement for exposing a plurality of shots.
Further, in order to measure the integrated scanning exposure amount at the same position as the substrate 12, the integrated exposure amount sensor 14 can be moved to the same position as the position where the substrate 12 is present at the time of exposure.

In such a projection exposure apparatus used for manufacturing a semiconductor device or the like, in order to transfer a pattern on a mask onto a substrate well, the pattern depends on a photosensitive agent applied on the substrate and the pattern on the mask. It is necessary to expose the substrate with an appropriate exposure amount. For example, in the case of using a positive pattern and a negative resist, if exposure is performed at an appropriate exposure amount or less, the exposure becomes insufficient, and the pattern lines become thin or the lines are cut off halfway. Conversely, if the exposure is more than the appropriate exposure amount, the exposure becomes excessive, and the lines of the pattern become thicker and may be connected to adjacent lines. On the other hand, when a negative pattern and a positive resist are used, if exposure is performed at an appropriate exposure amount or less, exposure becomes insufficient, and the pattern line becomes thicker and may be connected to an adjacent line. Conversely, if the exposure is more than the appropriate exposure amount, the exposure becomes excessive, and the lines of the pattern become thin or the lines are cut off in the middle. In any case, if the exposure is not performed at an appropriate exposure amount, an appropriate pattern cannot be formed on the substrate, and the yield is reduced.

Therefore, in order to perform exposure with an appropriate exposure amount, it is necessary to control the exposure amount on the substrate 12, but during the transfer of the pattern on the mask 10 onto the substrate 12, Exposure cannot be measured directly. Further, when the exposure amount is measured in the optical path of the exposure light, the shadow of the exposure amount sensor has an effect when the pattern on the mask 10 is transferred onto the substrate 12. Therefore, the exposure amount is measured at a position conjugate with the substrate 12 and branched from the optical path of the exposure light,
Exposure control is performed.

Reference numeral 15 denotes a half mirror having a very low reflectance, which is inserted in the optical path to create a position conjugate with the substrate 12 and branched from the optical path of the exposure light. The half mirror 15 is disposed obliquely with respect to the optical axis of the exposure light,
Exposure sensor 16 for branching the exposure light and measuring the exposure
At the position, a position conjugate with the substrate 12 and branched from the optical path of the exposure light is formed. A control device 17 controls the voltage input to the lamp 1 based on the output of the exposure amount sensor 16 so that the output of the lamp does not vary.

Reference numeral 18 denotes a dimming device which is placed in the optical path of the exposure light and has a variable transmittance. Even when the scanning speed of the stage is set to the maximum value of the performance of the device, it is higher than the sensitivity of the photosensitive agent on the photosensitive substrate 12. When exposure is performed, the exposure light is reduced. As the light reducing device 18, for example, several kinds of optical members having different transmittances are arranged on a turret, and the transmittance is varied by selecting the optical members, or the reflectance varies depending on the angle formed with the light beam. A dimming device that changes the transmittance by changing the angle of a mirror can be considered. Dimming device 1
The extinction ratio of 8 is controlled by the controller 17 based on the output of the exposure sensor 16.

Reference numeral 19 denotes a shutter for opening and closing the optical path of the exposure light from the condenser mirror 2. In a batch exposure type projection exposure apparatus, such a shutter has a role of controlling the exposure amount by closing when the exposure amount on the substrate reaches an appropriate exposure amount. However, in a scanning type projection exposure apparatus, since the exposure cannot be completed until the scanning is completed, the exposure amount cannot be controlled by opening and closing the shutter. The shutter 19 in the present scanning projection exposure apparatus is used to suppress the deterioration of the glass material of the illumination system at the time of step movement between shots or when the exposure operation is not performed. Reference numeral 20 denotes a lamp stage that can be driven in three axes, and is capable of moving the light source 1 in an optical axis direction and a direction perpendicular thereto. Movable stage 20
Is a controller 17 based on the output of the integrated exposure amount sensor 14.
Is controlled by

FIG. 2 shows a method of measuring the integrated scanning exposure amount by the integrated exposure sensor 14. (A) of FIG.
A method of measuring a scanning integrated exposure amount using a pinhole-shaped integrated exposure amount sensor 14a as the integrated exposure amount sensor 14 mounted on the upper surface 3 will be described. In this case, the integrated integrated exposure amount can be measured by initializing the integrated value of the integrated exposure amount sensor 14a to 0, scanning at a desired scanning speed, and taking in the integrated value from the sensor 14a after the scanning is completed.

FIG. 2B shows a method of measuring the scanning integrated exposure amount using the line integrated exposure amount sensor 14b as the integrated exposure amount sensor 14. Line integrated exposure sensor 14b
Is an integrated exposure amount sensor arranged in a line, and can simultaneously measure the integrated exposure amount at multiple points. In this case, the integrated value of the line integrated exposure amount sensor 14b, which has been calibrated in advance such as sensitivity correction, is initialized to 0, scanning is performed at a desired scanning speed, and after the scanning is completed, the integrated value is fetched from the sensor 14b. This makes it possible to measure the scanning integral exposure amounts of a plurality of exposure regions arranged in the scanning direction at a time.

FIG. 2C shows a line integrated exposure amount sensor 14.
The method of measuring the integrated scanning exposure amount by arranging c perpendicular to the scanning direction will be described. In this case, the integrated value of the line integrated exposure amount sensor 14c, which has been calibrated in advance such as sensitivity correction, is initialized to 0, scanning is performed at a desired scanning speed, and after the scanning is completed, the integrated value is acquired from the sensor 14c. Thereby, the scanning integral exposure amount of a plurality of exposure regions arranged in the scanning direction and the vertical direction can be measured at once.

FIG. 2D uses the fact that the integrated scanning exposure amount when the scanning speed is constant can be expressed by the following equation.
A method of arranging a line illuminance sensor 14d in parallel with the scanning direction of the illumination area instead of the integrated exposure amount sensor 14 and obtaining a scanning integrated exposure amount at the time of performing scanning exposure without scanning will be described.

[0034]

(Equation 4) The line illuminance sensor 14d is a line of illuminance sensors arranged in a line, and can simultaneously measure illuminance at multiple points at a time. Assuming that the interval between adjacent illuminance sensors in the line illuminance sensor 14d is δx, R _{calc of} the following equation
Is the limit of δx → 0, which coincides with the integrated scanning exposure amount.

[0035]

(Equation 5) However, where, W _i is the illuminance illuminance sensor one point constituting the line illumination sensor 14d was measured. In an actual line illuminance sensor, since the interval between adjacent illuminance sensors is not 0, R _calc of Expression 5 does not exactly match the scanning integrated exposure amount, but the line illuminance sensor 14d is If the distance between the line illuminance sensors is sufficiently small, the scanning integrated exposure amount can be approximately determined by calculation without scanning from the illuminance of multiple points arranged in the scanning direction measured by the line illuminance sensor 14d. Can be.

Although not shown in FIG. 2, if a plurality of pinhole integrated exposure amount sensors are used, the integrated scanning exposure amount of the same number of exposure area points as the number of sensors is measured in one scan. be able to. In addition, if a plurality of line integrated exposure sensors are used, the number of exposure areas equal to the product of the number of line integrated exposure sensors and the number of sensors constituting each line integrated exposure sensor in one scan. Can be measured in one scan. Further, if a plurality of line illuminance sensors arranged perpendicular to the scanning direction are used, the integrated scanning exposure amount at a position arranged perpendicular to the plurality of scanning directions can be approximately obtained without scanning at a time. . Furthermore, if a planar illuminance sensor that measures the entire illumination area is used, the scanning exposure amount at each point in the scanning direction and the vertical direction can be approximately obtained without scanning.

In the present embodiment, the position of the light source 1 (lamp position) is adjusted by moving the lamp stage 20 by the controller 17 based on the integrated scanning exposure amount measured as described above. As a method of adjusting the lamp position based on the scanning integrated exposure amount, a method of adjusting the position of the light source so that the scanning integrated exposure amount is maximized, and a method of adjusting the difference of the scanning integrated exposure amount between two or more points in the exposure area. A method of adjusting the value to a minimum can be considered.

Since the optimum NA of the projection optical system and the optimum NA of the illumination optical system differ depending on the mask pattern, the projection exposure apparatus can perform exposure under a plurality of illumination conditions to correspond to each mask pattern. May be designed. When the scanning exposure type projection exposure apparatus can perform exposure under a plurality of illumination conditions, the preferable position of the light source generally differs for each illumination condition. In this case, it is preferable to perform exposure by arranging a light source at a preferable light source position under each illumination condition.

Therefore, in this embodiment, in order to perform exposure at an optimum position different for each illumination condition, at the time of replacement of the light source 1 or at a predetermined timing, the optimal position of the light source 1 under each illumination condition is determined by scanning integrated exposure amount. Determined by measuring,
This is stored in the storage means, and when the illumination condition at the time of exposure changes, the light source 1 is moved to the optimal light source position stored in the storage means under the illumination condition to start the exposure. I have to.

The present invention can be applied to any type of scanning projection exposure apparatus using a light source that requires position adjustment, and it goes without saying that it does not depend on the configuration of the apparatus. . For example, as shown in FIG. 3, a scanning projection exposure apparatus provided with an illumination system using a double fly-eye with fly-eye lenses 6 and 21, and one fly-eye lens with fly-eye lens 6 as shown in FIG. A scanning projection exposure apparatus provided with an illumination system or a scanning projection exposure apparatus provided with an illumination system using an internal reflection member 4 as shown in FIG.

<Embodiment of Device Manufacturing Method> Next, an embodiment of a device manufacturing method using the above-described exposure apparatus will be described. FIG. 6 shows a flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass.
Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes an assembly process (dicing and bonding).
It includes steps such as a packaging step (chip encapsulation). In step 6 (inspection), inspections such as an operation check test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, the semiconductor device is completed,
This is shipped (step 7).

FIG. 7 shows the wafer process (step 4).
The detailed flow of is shown. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a resist is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus or exposure method to align and print the circuit pattern of the mask on a plurality of shot areas of the wafer.
Step 17 (development) develops the exposed wafer.
In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps,
Multiple circuit patterns are formed on the wafer.

When the production method of this embodiment is used, the scanning type exposure apparatus can be manufactured by maximizing its performance, and the throughput or the yield is improved.

[0044]

According to the present invention, the integrated scanning exposure amount directly related to the performance of the scanning projection exposure apparatus is measured, and the position of the exposure light source is adjusted based on the measurement result. The position of the light source can be accurately adjusted, and the performance of the scanning projection exposure apparatus can be maximized.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a scanning projection exposure apparatus according to one embodiment of the present invention.

FIG. 2 is a diagram showing a method of measuring a scanning integrated exposure amount in the apparatus of FIG.

FIG. 3 is a diagram showing a scanning projection exposure apparatus provided with an illumination system using a double fly eye to which the present invention can be applied.

FIG. 4 is a diagram showing a scanning projection exposure apparatus including an illumination system using one fly eye to which the present invention can be applied.

FIG. 5 is a diagram showing a scanning projection exposure apparatus provided with an illumination system using an internal reflection member to which the present invention can be applied.

FIG. 6 is a flowchart illustrating a device manufacturing method that can use the exposure apparatus of the present invention.

FIG. 7 is a detailed flowchart of a wafer process in FIG. 6;

[Explanation of symbols]

1: light source, 2: condensing mirror, 3: optical system, 4: internal reflection member, 5: optical system, 6: fly-eye lens, 7: optical system,
8: stop for controlling illumination area, 9: relay optical system, 1
0: Mask, 11: Projection optical system, 12: Substrate, 13: Stage, 14: Exposure sensor mounted on the stage, 15: Half mirror, 16: Exposure sensor placed at a conjugate position with the substrate, 17 : Exposure control device, 18: dimming means, 19: shutter, 20: lamp stage, 21:
A fly-eye lens.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/30 518

Claims (6)

[Claims] 1. A scanning projection exposure apparatus for scanning and exposing a pattern of an original plate onto the substrate via the projection optical system while moving the original plate and the substrate in synchronization with the projection optical system. 1. A scanning projection exposure apparatus comprising: an integrated exposure amount measuring means for measuring an integrated exposure amount in the method described above; and a light source position adjusting means for adjusting a position of an exposure light source based on the measurement result. 2. The apparatus according to claim 1, wherein the light source position adjusting means adjusts the position of the exposure light source by moving the exposure light source in three axial directions orthogonal to each other. 3. The scanning projection exposure apparatus according to claim 1. 3. An adjustment position recording means which can perform the scanning exposure under a plurality of illumination conditions, and records an adjustment position of an exposure light source based on a measurement result of the integrated exposure amount under each illumination condition, The light source position adjusting means adjusts the position of the light source for exposure on the basis of the illumination condition and the recorded adjustment position at the time of the scanning exposure. 2
3. The scanning projection exposure apparatus according to claim 1. 4. The light source position adjusting means adjusts the position of the exposure light source such that the integrated exposure amount at a specific point in an exposure area on the substrate is maximized. The scanning projection exposure apparatus according to claim 1. 5. The light source position adjusting means adjusts a position of the exposure light source such that a difference between the integrated exposure amounts at two or more different points in an exposure area on the substrate is minimized. The scanning projection exposure apparatus according to claim 1, wherein: 6. A step of performing scanning exposure using the scanning projection exposure apparatus according to any one of claims 1 to 5, while adjusting the position of an exposure light source as necessary by the light source position adjusting means. A device manufacturing method characterized by the above-mentioned.