JP2000351635A - Apparatus for producing formed glass substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus capable of producing a formed glass substrate having large area and holding a fine pattern formed by surface unevenness in high forming accuracy and productivity. SOLUTION: The production apparatus is composed of a heating chamber 10, a forming chamber 20 and a cooling chamber 30 connected in series. The heating chamber 10 and the cooling chamber 30 are filled with an inert gas and the forming chamber 20 is evacuated prior to the press-forming of a glass substrate. The heating chamber 10 is connected to the forming chamber 20 via a 1st preparatory chamber 60 and the forming chamber 20 is connected to the cooling chamber 30 via a 2nd preparatory chamber 70. A 3rd preparatory chamber 80 is placed at the inlet side of the heating chamber 10 and a 4th preparatory chamber 90 is placed at the outlet side of the cooling chamber 30. Non-contact suction floating transfer devices 65, 75 using electrostatic force are placed in the 1st preparatory chamber 60 and the 2nd preparatory chamber 70 and the hot glass substrate 1 and the forming substrate 2 are transferred by using the transfer devices.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a molded substrate, such as a rear panel of a plasma display panel, in which a fine pattern is formed on a surface of a glass substrate by unevenness.

[0002]

2. Description of the Related Art With the development of multimedia, display devices have become increasingly important as interfaces for connecting people and information. There is a strong demand for small and space-saving display devices, and various thin displays have been developed and put to practical use.

[0003] Among thin displays, a plasma display panel (PDP) has features such as a large screen and a wide viewing angle, and is mainly noted as a display device for a wall-mounted television or a personal computer. I'm taking a bath. 2. Description of the Related Art Conventionally, in a plasma display panel manufacturing process, a screen printing method or a sand blast method has been mainly used as a method of forming a partition (hereinafter, referred to as a rib) on a surface of a rear panel.

In the screen printing method, paste-like ink is laminated and printed on a glass substrate to form ribs. In the screen printing method, the steps of printing, baking, and drying are repeated about 10 times, so the number of steps is large, it is difficult to keep the height of the ribs constant, and it is difficult to respond to high definition. There is a point.

On the other hand, in the sand blast method, a glass substrate is covered with a rib material, a photoresist is further applied thereon, and the photoresist is exposed and developed. Then, the sand blast is applied to the rib material using the photoresist pattern as a mask. To form a rib having a predetermined pattern. The sand blast method has problems such as poor surface roughness of the blast surface, generation of a large amount of dust during sand blast, and relatively high cost of photoresist and rib material.

As described above, the screen printing method or the sand blast method has a problem that high definition is not easy and the manufacturing cost is high.

[0007] Plasma display panels are currently limited to special applications such as televisions for sightseeing buses, quick boards of financial institutions, and displays for industrial machines. In the near future, they will be widely used in televisions for general households and personal computers. It is thought that as the screen size increases, the screen size will further increase. To achieve this, it is necessary to reduce the cost per diagonal inch to a fraction of the current level, and it is hoped that a new rib formation method that takes into account the reduction in the number of steps and the simplification of processing will be considered. It is rare.

As one of such rib forming methods, a method of forming a rib on the surface of a glass substrate by press molding has been proposed. The glass press forming technology itself is widely used in manufacturing glass optical elements, and various optical elements are manufactured by pressing a heated glass substrate between a pair of forming dies. Have been.

[0009] The press forming method of glass is roughly classified into two methods, a direct press method and a reheat press method.

[0010] The direct press method is a method in which a mold usually flows in a rotary manner, and molten glass heated to about 1500 ° C is poured into the mold as needed to perform press molding. This method does not require the accuracy of submicron order such as optical glass lens, for example,
It is used for molding cathode-ray tubes for TVs and headlights for automobiles. According to this method, (a) since the temperature of the glass is high, the transfer of the fine shape can be performed with a small pressing force, and (b) since the temperature difference between the mold and the glass is large, the two can be fused or reacted. There are various advantages such as not being present, (c) the type of material is not limited to special materials such as carbide, and (2) being able to realize high throughput. However, since the molding is completed in a state where the temperature of the glass is high, it is not suitable for a case where high precision is required such as a rear panel of a plasma display panel.

On the other hand, the reheat press method is a method in which a mold and a glass substrate are heated to the same temperature to press-mold the glass substrate. For example, by terminating the molding at a temperature near the glass transition point, high-precision molding on the order of submicrons is possible. However, this method requires (a) a large pressing force and a balance with the molding temperature, but it is difficult to transfer a fine shape to a large-area glass substrate. Since the molding is performed at a temperature, there is a concern that the molding die and the glass are fused, and the material of the molding die is limited.
(C) There is a problem that high throughput cannot be realized because batch processing is generally performed.

As described above, both the direct press method and the reheat press method have advantages and disadvantages, and both methods have a large area and a high fine pattern like a rear panel of a plasma display panel as they are. It cannot be applied when it is required to form with precision.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems when manufacturing a large-sized glass-made substrate having a fine pattern formed on the surface by unevenness. An object of the present invention is to be able to manufacture a glass molded substrate as described above by press molding,
An object of the present invention is to provide an apparatus for manufacturing a glass-made molded substrate having high molding accuracy and having relatively few steps and high productivity.

[0014]

According to the present invention, there is provided an apparatus for manufacturing a molded glass substrate, comprising: a heating chamber for heating a flat glass substrate to a predetermined temperature; a heating chamber disposed adjacent to the heating chamber; A molding chamber for accommodating a molding die and transforming the glass substrate into a molded substrate having a fine pattern formed on a surface thereof; and a molding chamber disposed adjacent to the molding chamber and heating the molded substrate at a predetermined temperature. A cooling chamber that cools the glass substrate, a first transfer machine that transfers the glass substrate from the heating chamber to the molding chamber, and a second transfer that transfers the molded substrate from the molding chamber to the cooling chamber. And a machine.

Preferably, the apparatus for manufacturing a glass molded substrate according to the present invention contains a first transport apparatus which is maintained in an inert gas atmosphere and continuously or intermittently transports a flat glass substrate. A heating chamber for heating the substrate to a predetermined temperature while transporting the substrate, a vacuum exhaust means, a molding apparatus using a molding die including an upper die and a lower die are housed, and the heated glass substrate is molded to form a surface. A molding chamber for changing to a molded substrate having a fine pattern formed thereon, and a second transfer device that is maintained in an inert gas atmosphere and continuously or intermittently conveys the formed molded substrate is housed therein. A cooling chamber that cools to a predetermined temperature while transporting, a gate valve is provided before and after, connected to a rear stage of the heating chamber via a front gate valve, and upstream of the molding chamber via a rear gate valve. And a first preliminary chamber accommodating a first transfer machine for transferring the glass substrate from the heating chamber to the molding chamber, and a gate valve at the front and rear, and the molding is performed via a front gate valve. Connected to the back of the room,
A second preparatory chamber connected to a front stage of the cooling chamber via a rear gate valve and accommodating a second transfer machine for transferring the molded substrate from the molding chamber to the cooling chamber. It is characterized by the following.

Preferably, the apparatus for manufacturing a molded glass substrate of the present invention further comprises a third preparatory chamber provided with front and rear gate valves and connected to a preceding stage of the heating chamber via a rear gate valve. A fourth preliminary chamber connected to a rear stage of the cooling chamber via a front gate valve.

According to the glass substrate manufacturing apparatus of the present invention, since the surface of the glass substrate is molded in the vacuum-evacuated molding chamber, the occurrence of air pockets on the surface of the molded product is prevented, A molded substrate in which a pattern is formed by fine irregularities on the surface of a flat glass can be manufactured with high accuracy and high yield.

Further, since the respective steps of heating, forming and cooling can be carried out in each room in parallel,
High throughput can be realized. Since the temperatures and atmospheres of the heating chamber, the molding chamber and the cooling chamber can be controlled independently of each other, by controlling the temperature difference between the molding die and the glass substrate to appropriate conditions, the glass on the mold surface can be controlled. In addition to preventing fusion, the load of press molding is reduced, and further, there is an effect of increasing the degree of freedom in selecting a material of the molding die, extending the life of the molding die, and the like.

The glass substrate is heated to at least the vicinity of the softening point in the heating chamber, and the temperature of the formed substrate after forming is higher than the transition point. Accordingly, the first transfer machine for transferring the glass substrate from the heating chamber to the molding chamber, and the second transfer machine for transferring the molded substrate from the molding chamber to the cooling chamber, are clean and have a high temperature. It is necessary to adopt a method that does not cause deformation of the glass in the state. As such a transfer machine, the following system can be exemplified.

In the first method, the first transfer machine holds the glass substrate from the upper surface by a non-contact suction floating method using electrostatic force, and transfers the glass substrate from the heating chamber to the molding chamber.

Similarly, the second transfer machine holds the molded substrate from the upper surface by a non-contact suction floating method using electrostatic force, and moves the molded substrate from the molding chamber to the cooling chamber.

It is to be noted that a contact-type vacuum chuck system or a non-contact vacuum chuck system (so-called Bernoulli chuck) may be used instead of the non-contact suction floating system using electrostatic force.

In the second method, the first transfer device transfers the glass substrate placed on a pallet, and the first transfer device first moves from the forming device in the forming chamber. After removing the lower mold, then, after turning the lower mold upside down, move into the heating chamber, after placing the lower mold on the glass substrate placed on the pallet, the pallet and the lower By holding the glass substrate sandwiched between them by holding the molds, and then turning the glass substrate upside down, returning to the molding chamber, and attaching the lower mold to the molding device, ,
It is configured to return only the pallet to the heating device.

Similarly, the second transfer device is of a type in which the formed substrate is transferred on a pallet, and the second transfer device first moves the pallet from the second transfer device in the cooling chamber. Then, after turning the pallet upside down, move into the molding chamber, place the pallet on the molding substrate on the lower mold, and then grip the lower mold and the pallet, Holding the molded substrate sandwiched between, then, while turning the molded substrate upside down, returning to the cooling chamber, mounting the pallet on the second transfer device, then molding only the lower mold It is configured to return to the device.

In a third method, the first transfer device transfers the glass substrate on a pallet, and the first transfer device first sets the second transfer device in the heating chamber. Remove the pallet on which the glass substrate is placed from, and then move into the molding chamber, stop above the lower mold attached to the molding device, and hold down the glass substrate with a stopper from the side. By pulling out only the pallet, the glass substrate is transferred onto the lower mold, the empty pallet is returned to the heating chamber, and is mounted on the first transfer device.

Similarly, the second transfer device is of a type in which the glass substrate is transferred on a pallet, and the second transfer device firstly transfers the formed substrate from the forming device in the forming chamber. Remove the lower die placed, then move into the cooling chamber, stop above the pallet mounted on the second transfer device, while holding the molded substrate from the side with a stopper, the lower By extracting only the mold, the molded substrate is transferred onto a pallet, the empty lower mold is returned to the molding chamber, and is mounted on the molding apparatus.

In a fourth method, the first transfer device and the second transfer device transfer an object to be transferred on a pallet, and each pallet also serves as a lower die of the molding die. The first transfer device transfers the glass substrate from the heating chamber to the molding chamber in a state where the glass substrate is mounted on each pallet, and the second transfer device controls each pallet (also serving as a lower die). The substrate is transferred from the molding chamber to the cooling chamber with the molded substrate placed thereon.

Preferably, the capacity of the heating chamber is such that the number of the glass substrates that can be accommodated therein is obtained by dividing the required heating time in the heating chamber by the required molding time per molded substrate in the molding chamber. It is set to have a value equal to or greater than the quotient.

Similarly, the capacity of the cooling chamber is obtained by dividing the required cooling time in the cooling chamber by the required molding time per one molded substrate in the forming chamber. It is set to have a value equal to or greater than the quotient.

Preferably, the molding apparatus is provided with temperature control means having a function of heating and cooling the mold.

Preferably, a heating means is provided in the molding chamber, and the glass substrate carried in from the heating chamber is further heated to a temperature at which the glass substrate can be molded, and then the glass substrate is molded.

[0032]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Example 1) FIG. 1 shows a first example of an apparatus for producing a molded glass substrate according to the present invention. In addition,
In this example, a non-contact suction floating type transfer device using electrostatic force is used to transfer a high-temperature glass substrate and a molded substrate after press molding.

This manufacturing apparatus comprises a heating chamber 10, a molding chamber 20
And the cooling chambers 30 are connected in series. The interior of the heating chamber 10 and the interior of the cooling chamber 30 are maintained in an inert gas atmosphere, and the interior of the molding chamber 20 is evacuated to a vacuum state before press molding of the glass substrate. For this reason, the heating chamber 10 and the molding chamber 20 are connected via the first preliminary chamber 60, and the molding chamber 20 and the heating chamber 30 are connected via the second preliminary chamber 70. Further, a third preliminary chamber 8 is provided at the entrance side of the heating chamber 10.
0 is provided, and a fourth preliminary chamber 90 is provided at the outlet side of the cooling chamber 30.
Is provided.

A third preparatory chamber 80 is arranged at the most upstream side of the apparatus. Gate valves 51 and 52 are provided before and after the third preliminary chamber 80. The third preliminary chamber 80 is separated from the outside world by a gate valve 51, and is connected to the inlet side of the heating chamber 10 via the gate valve 52. An inert gas inflow port 81 and an exhaust port 82 are connected to the third preliminary chamber 80.

The role of the third preliminary chamber 80 is to prevent the air from flowing into the heating chamber 10 when the glass substrate 1 is carried into the heating chamber 10. That is, the glass substrate 1
Is carried into the heating chamber 10 from the outside through the third preliminary chamber 80 in the following procedure. First, open the gate valve 51,
The glass substrate 1 is carried into the third preliminary chamber 80 from outside, and is placed on the table 85. Next, the gate valve 51 is closed, and the inside of the third preliminary chamber 80 is exhausted through the exhaust port 82.
Next, an inert gas is introduced from the inflow port 81 and exhausted through the exhaust port 82 to make the inside of the third preliminary chamber 80 an inert gas atmosphere. Next, the gate valve 52 is opened, the glass substrate 1 is lifted from above the table 85 by a suction pad type transfer device (not shown), and is carried into the heating chamber 10. Next, the gate valve 52 is closed.

The heating chamber 10 is disposed downstream of the third preliminary chamber 80. The inside of the heating chamber 10 is maintained in an inert gas atmosphere, and the inert gas is introduced from the inflow port 11 and discharged from the exhaust port 12. In the heating chamber 10, a conveyor 15 is provided. A plurality of pallets 16 are mounted on the conveyor 15 in a row in the traveling direction. The glass substrate 1 carried into the heating chamber 10 is placed on a pallet 16 on a conveyor 15. In addition, as shown in FIG.
A return transport line is provided to return the emptied pallet 16 from the exit side of the heating chamber 10 to the entrance side.

A special coating is applied to the surface of the pallet 16 in order to prevent fusion with glass and chemical reaction. As described above, the inside of the heating chamber 10 is maintained in an inert gas atmosphere to prevent oxidation of the coating. An infrared lamp 17 is arranged on the ceiling of the heating chamber 10, and a gold-plated reflection mirror 18 is arranged on the back of the infrared lamp 17.

The glass substrate 1 is gradually heated according to a predetermined heating pattern while being conveyed in the heating chamber 10 on the conveyor 15 toward the outlet.

A first preliminary chamber 60 is disposed downstream of the heating chamber 10. Gate valves 53 and 54 are provided before and after the first preliminary chamber 60. The first spare room 60
It is connected to the outlet side of the heating chamber 10 via a gate valve 53, and connected to the inlet side of the molding chamber 20 via a gate valve 54. In the first spare room 60, a first transfer machine 65 is provided.
Is installed. The first transfer device 65 is a transfer robot, and its hand section 66 is provided with a non-contact suction and floating mechanism (described later) using electrostatic force.

The glass substrate 1 is placed in the heating chamber 10 in the following procedure.
It is carried into the molding chamber 20 from the inside through the first preliminary chamber 60. First, the gate valve 53 is opened, and the hand unit 66 is sent into the heating chamber 10. The hand unit 66 is stopped on the glass substrate 1 placed on the pallet 16 on the conveyor 15. The glass substrate 1 is suction-floated and held from above the pallet 16 and carried into the first preliminary chamber 60. Next, the gate valve 53 is closed. Next, the gate valve 54 is opened, and the glass substrate 1 held by the hand unit 66 is carried into the molding chamber 20. Next, after only the hand part 66 is returned into the first preliminary chamber 60, the gate valve 54 is closed.

The molding chamber 20 is disposed downstream of the first preliminary chamber 60. A vacuum exhaust pipe 21 is connected to the molding chamber 20. A press forming device 40 is provided in the forming chamber 20.
The upper die 41 and the lower die 42 are accommodated. The upper die 40 is mounted on the lower end of the fixed shaft 43, and the lower die 42 is mounted on the upper end of the moving shaft 44. The fixed shaft 43 is provided in the molding chamber 20.
The moving shaft 44 penetrates the floor of the molding chamber 20 via a sealing member (not shown). The inside of the molding chamber 20 is isolated from the outside by the seal member.

The lower end of the moving shaft 44 is connected to a screw jack 46 via a load cell 45. The screw jack 46 is driven by a servomotor 47. The servo motor 47 is controlled by the control device 49. The position of the lower mold 42, the press forming load applied to the lower mold 42, the press speed, and the like are controlled by feedback control based on an instruction program previously input to the control device 49, an actual measured value of the press load detected by the load cell 45, and the like. Is done.

Glass substrate 1 carried in from heating chamber 10
Is placed on the lower mold 42. Gate valves 53, 54
Is closed, the inside of the molding chamber 20 is evacuated through the vacuum exhaust pipe 21. After the inside of the molding chamber 20 is evacuated, a fine pattern is formed on the surface of the glass substrate 1 by press molding. Since the press molding is performed in a vacuum, it is possible to prevent the molding accuracy from being impaired by the air pool generated on the surface of the molded product.

A second preparatory chamber 70 is disposed downstream of the molding chamber 20. Gate valves 55 and 56 are provided before and after the second preliminary chamber 70. The second spare room 70
It is connected to the outlet side of the molding chamber 20 via a gate valve 55 and connected to the inlet side of the cooling chamber 30 via a gate valve 56. In the second spare room 70, a second transfer machine 75
Is installed. The second transfer machine 75 is a first transfer machine 65.
The hand unit 76 is provided with a non-contact suction and floating mechanism (described later) using electrostatic force.

The molded substrate 2 is carried into the cooling chamber 30 from the molding chamber 20 through the second preliminary chamber 70 in the following procedure.
First, the gate valve 55 is opened, and the hand unit 76 is sent into the molding chamber 20. The hand unit 76 is stopped on the molded substrate 2 placed on the lower mold 42 on the moving shaft 44. The molded substrate 2 is sucked and floated from above the lower mold 42, held, and carried into the second preliminary chamber 70. Next, close the gate valve 55, and then open the gate valve 56,
The molded substrate 2 held by the hand unit 76 is moved to the cooling chamber 3
Carry in 0. Next, after only the hand part 66 is returned into the first preliminary chamber 60, the gate valve 56 is closed.

The cooling chamber 30 is disposed downstream of the second preliminary chamber 70. The interior of the cooling chamber 30 is maintained in an inert gas atmosphere, and the inert gas is introduced from the inflow port 31 and discharged from the exhaust port 32. A transport conveyor 35 is provided in the cooling chamber 30 as in the heating chamber 10. On the conveyor 35, a plurality of pallets 36 are mounted side by side in the traveling direction. The molded substrate 2 carried into the cooling chamber 30 is placed on a pallet 36 on a conveyor 35.
On top of. In addition, as shown in FIG. 1C, the empty pallet 36 is further placed in the cooling chamber 30 in the cooling chamber 30.
A return transport line is provided for returning from the exit side of the zero to the entrance side.

A special coating is applied to the surface of the pallet 36 in order to prevent fusion with glass and a chemical reaction. As described above, the inside of the cooling chamber 20 is maintained in an inert gas atmosphere, and the oxidation of the coating is prevented. Similarly to the heating chamber 10, an infrared lamp 37 is disposed on the ceiling of the cooling chamber 30, and a reflection mirror 38 subjected to a gold plating process is disposed on a rear surface thereof.

The molded substrate 2 is gradually cooled according to a predetermined temperature decreasing pattern while being transported on the transport conveyor 35 in the cooling chamber 30 toward the exit direction.

A fourth preparatory chamber 90 is disposed downstream of the cooling chamber 30. Gate valves 57 and 58 are provided before and after the fourth preliminary chamber 90. The fourth spare room 90
It is connected to the outlet side of the cooling chamber 30 through a gate valve 57, and is separated from the outside by a gate valve 58.
An inert gas inflow port 91 and an exhaust port 92 are connected to the fourth preliminary chamber 90.

The role of the fourth preparatory chamber 90 is to allow the air to flow into the cooling chamber 30 as in the third preparatory chamber 80 when the cooled substrate 2 is carried out of the cooling chamber 30 to the outside. Is to prevent it. That is, the molded substrate 2 is carried out of the cooling chamber 30 to the outside via the fourth preliminary chamber 90 in the following procedure. First, the inside of the fourth preliminary chamber 90 is exhausted through the exhaust port 92. Next, an inert gas is introduced from the inflow port 91 and exhausted through the exhaust pipe 92, so that the
The inside of 0 is an inert gas atmosphere. Next, the gate valve 5
7, the molded substrate 2 is lifted from above the pallet 36 by a suction pad type transfer device (not shown), carried into the fourth preliminary chamber 90 from the cooling chamber 30, and placed on the table 95. Put. Next, the gate valve 57 is closed. Next, the gate valve 58 is opened, and the molded substrate 2 is carried out of the fourth preliminary chamber 90. Next, the gate valve 5
Close 8.

Here, referring to FIG. 2, a non-contact suction floating method using electrostatic force used in the hand section 66 of the first transfer machine 65 and the hand section 76 of the second transfer machine 75 will be described. explain. In this method, a flat object to be conveyed is levitated by electrostatic force, and at the same time, the gap between the suction electrode and the object to be conveyed is detected and the electrostatic force is controlled, so that the object is not in contact with the suction electrode. Levitation transporting the transport object while maintaining the same (for example, Journal of Precision Engineering, Vol.
63, No. 7, 1997, p. 943).

However, in the case of the device according to the present invention, the electrode substrate 112 of the suction electrode 111 is formed of a ceramic plate (Si ₃ N ₄₎ in consideration of use for non-contact suction floating of a glass substrate or the like in a high temperature state. ). Electrode substrate 11
2, a plurality of copper electrode patterns 113 are formed by etching, so that the voltage applied to each copper electrode pattern 113 can be individually controlled. By configuring the suction electrode 111 in this way, it is possible to stably carry out non-contact conveyance of a glass plate in a high temperature state.

The opening and closing of each gate valve 51-58,
Atmosphere and temperature adjustment in each of the chambers 10, 20, 30, 60, 70, 80, and 90, the movement of each of the conveyors 15, 35 and each of the transfer machines 65 and 75, and the movement of the press forming apparatus 40 are controlled. It is controlled collectively by the device 49.

Example 2 FIG. 3 shows a second example of the apparatus for manufacturing a molded glass substrate according to the present invention. The difference from the previous example (FIG. 1) is that the heated glass substrate 1 is transferred from the heating chamber 10 to the molding chamber 20, and the molded substrate 2 after molding is removed from the molding chamber 20. Only the structure and function of the second transfer machine to be transferred to the cooling chamber 30, and the return line of the empty pallet, and other parts, that is, the heating chamber 10,
Molding chamber 20, cooling chamber 30, each preliminary chamber 60, 70, 80,
The configuration of 90 is similar to the previous example. Therefore, here, only the portions related to the structures and functions of the first transfer machine and the second transfer machine will be described.

As shown in FIG. 3, the first preliminary chamber 60 is connected to the outlet of the heating chamber 10 via a gate valve 53 and connected to the inlet of the molding chamber 20 via a gate valve 54. . In the first spare room 60, the first transfer machine 13 is provided.
0 is set. The first transfer device 130 is a transfer robot, and its hand section 131 is provided with a mechanism for gripping the pallet 16 and the lower mold 42 as described later.

The molding chamber 20 is disposed downstream of the first preliminary chamber 60. A press forming apparatus 4 is provided in the forming chamber 20.
The upper die 41 and the lower die 42 are accommodated. The upper die 40 is mounted on the lower end of the fixed shaft 43, and the lower die 42 is mounted on the upper end of the moving shaft 44. The fixed shaft 43 is in the molding chamber 2
The moving shaft 44 is fixed to the ceiling of the molding chamber 20 and penetrates the floor of the molding chamber 20 via a sealing member (not shown).

A second preparatory chamber 70 is disposed downstream of the molding chamber 20. The second preliminary chamber 70 is provided with the gate valve 55
Is connected to the outlet side of the molding chamber 20 via a gate valve 56 and is connected to the inlet side of the cooling chamber 30 via a gate valve 56. In the second spare room 70, a second transfer machine 140 is installed. The second transfer device 140 is a transfer robot similar to the first transfer device 130, and has a mechanism for gripping the pallet 36 and the lower mold 42 in the hand portion 141 thereof.

FIG. 4 shows the structure of the first transfer machine 130.
Note that the second transfer machine 140 also has an equivalent structure. The first transfer machine 130 is an articulated robot, and includes a chuck 132 at the tip of a hand 131.
The chuck part 132 is composed of upper and lower two-stage chucks 132.
a, b, and the opening and closing of the chucks 132a, 132b can be independently controlled. The first transfer machine 130 moves the hand unit 131 forward and backward (arrow 135) and turns (arrow 13).
6), opening and closing of the chucks 132a and 132b (arrow 137), and rotation of the chuck 132 (arrow 138) are possible.

In addition, corresponding to the chucks 132a and 132b, the end surface of the lower mold 42, the end surface of the pallet 16 mounted on the conveyor 15 and the conveyor 35
A groove for chucking is formed on each of the end faces of the pallet 36 mounted thereon. By inserting the chucks 132a and 132b into these grooves, the lower mold 42 or the pallets 16 and 36 can be securely grasped and transported accurately.

Further, a positioning hole is provided on the bottom surface of the lower mold 42, and the position thereof is accurately determined by fitting with a positioning pin (not shown) at the upper end of the moving shaft 44 of the press forming apparatus 40. Can be reproduced.

Next, the operation of the first transfer machine 130 will be described with reference to FIGS. The heated glass substrate 1 is carried into the molding chamber 20 from the heating chamber 10 through the first preliminary chamber 60 in the following procedure.

First, from the state where the gate valves 53 and 54 are closed, the gate valve 54 is opened, and the hand portion 131 is advanced and fed into the molding chamber 20. As shown in FIG. 5A, the lower mold 42 is gripped by the hand unit 131. Lower mold 4
2 is removed from the moving shaft 44 of the press forming apparatus 40. The hand part 131 is retracted, and the lower mold 42 is moved to the first preliminary chamber 60.
After being carried in, the gate valve 54 is closed.

In the first spare room 60, the hand unit 131
Turn 80 degrees. Further, the lower mold 42 is turned upside down by rotating the chuck part 132 by 180 degrees. That is, the mold surface of the lower mold 42 is directed downward.

Next, the gate valve 53 is opened, the hand part 131 is advanced, and the lower mold 42 is sent into the heating chamber 10. Pallet 16 on conveyor 15 in heating chamber 10
A high-temperature glass substrate 1 heated to a predetermined temperature is placed on the substrate. As shown in FIG. 5 (b), the lower mold 42 is lowered onto the glass substrate 1 on the pallet 16 and overlapped. Next, as shown in FIG. 5C, the pallet 16 and the lower mold 42 are gripped again by the hand unit 131 in a state where the glass substrate 1 is sandwiched between the pallet 16 and the lower mold 42. The pallet 16 is removed from the conveyor 15. After the hand unit 131 is retracted and the pallet 6, the glass substrate 1, and the lower mold 42 are carried into the first preliminary chamber 60, the gate valve 53 is closed.

In the first spare room 60,
Turn 80 degrees. Furthermore, the pallet 16, the glass substrate 1, and the lower mold 42 are rotated by rotating the chuck 132 by 180 degrees.
Is inverted up and down. That is, the front side of the pallet 16 faces downward, and the mold surface of the lower mold 42 returns upward.

Next, the gate valve 54 is opened, the hand 131 is advanced, and the lower mold 42, the glass substrate 1 and the pallet 16 are fed into the molding chamber 20. As shown in FIG. 5D, the lower mold 42 is mounted on the moving shaft 44 of the press forming device 40. Next, as shown in FIG. 5E, the hand unit 131 grips only the pallet 16 again. The hand pallet 131 is retracted to remove the empty pallet 16 from the first transfer chamber 60
After being carried in, the gate valve 54 is closed. Next, the inside of the molding chamber 20 is evacuated through the vacuum exhaust pipe 21 to start press molding of the surface of the glass substrate 1.

In parallel, the hand unit 131 is turned by 90 degrees in the first transfer chamber 60. Further, the pallet 16 is turned upside down by rotating the chuck portion 132 by 180 degrees. That is, the front side of the pallet 16 is returned upward. Next, the pallet 16 is moved from the gate valve 59 to the first preliminary chamber 6.
Take it out of 0. The unloaded pallet 16 is returned to the front of the third preliminary chamber 80 through a return transport line (broken line in FIG. 3).

Next, the operation of the second transfer device 140 will be described with reference to FIGS. The molded substrate 2 after the press molding is carried into the cooling chamber 30 from the molding chamber 20 through the second preliminary chamber 70 in the following procedure.

First, from the state where the gate valves 55 and 56 are closed, the gate valve 56 is opened, and the hand portion 141 is advanced and sent into the cooling chamber 30. As shown in FIG. 6A, the pallet 36 is gripped by the hand unit 141. The pallet 36 is removed from the conveyor 35. After the hand unit 141 is moved backward to carry the pallet 36 into the second preliminary chamber 70, the gate valve 56 is closed.

In the second spare room 70, the hand unit 141
Turn 80 degrees. Further, the pallet 36 is turned upside down by rotating the chuck 142 by 180 degrees. That is,
The front side of the pallet 36 faces downward.

Next, the gate valve 55 is opened, and the hand portion 141 is advanced to feed the pallet 36 into the molding chamber 20. On the lower mold 42 in the molding chamber 20, the high-temperature molded substrate 2 immediately after the press molding is completed is placed. As shown in FIG. 6B, the pallet 36 is lowered onto the molded substrate 2 on the lower mold 42 and is stacked. Then, FIG.
As shown in (c), in a state where the molded substrate 2 is sandwiched between the lower die 42 and the pallet 36, the lower die 42 is
Then, the pallet 36 is gripped again. The lower mold 42 is removed from above the moving shaft 44 of the press forming device 40. Hand part 14
1, the lower mold 42, the molded substrate 2, and the pallet 36.
After being brought into the second spare room 70, the gate valve 55
Close.

In the second spare room 70, the hand unit 141
Turn 80 degrees. Further, the chuck 142 is rotated by 180 degrees, and the lower die 42, the molded substrate 2 and the pallet 36 are turned upside down. That is, the mold surface of the lower mold 42 is turned downward, and the front side of the pallet 36 is turned upward.

Next, the gate valve 56 is opened, the hand portion 141 is advanced, and the pallet 36, the molded substrate 2 and the lower mold 42 are sent into the cooling chamber 30. As shown in FIG. 6D, the pallet 36 is mounted on the conveyor 35.
Next, as shown in FIG.
Only the lower mold 42 is gripped again. After retreating the hand part 141 and carrying only the lower mold 42 into the second transfer chamber 70,
The gate valve 56 is closed.

In the second spare room 70, the hand unit 141
Turn 80 degrees. Further, the chuck 142 is rotated by 180 degrees to turn the lower mold 42 up and down. That is, the mold surface of the lower mold 42 is returned to the upward posture.

Next, the gate valve 55 is opened, the hand part 141 is advanced, and the lower mold 42 is returned into the molding chamber 20, and as shown in FIG.
4 on top. Next, after the hand part 141 is moved backward and only the hand part 141 is returned into the second preliminary chamber 70, the gate valve 55 is closed.

(Example 3) FIG. 7 shows a third example of an apparatus for manufacturing a molded glass substrate according to the present invention. The difference from the previous example (FIG. 3) is that the heated glass substrate 1 is transferred from the heating chamber 10 to the molding chamber 20, and the molded substrate 2 after molding is removed from the molding chamber 20. It is only the structure and function of the second transfer machine to be transferred to the cooling chamber 30, and the other parts, that is, the heating chamber 10, the molding chamber 20, the cooling chamber 30, and each spare chamber 6
The configuration of 0, 70, 80, 90 is the same as in the previous example.
Therefore, here, only the portions related to the structures and functions of the first transfer machine and the second transfer machine will be described.

As shown in FIG. 7, the first preliminary chamber 60 is connected to the outlet side of the heating chamber 10 via a gate valve 53 and connected to the inlet side of the molding chamber 20 via a gate valve 54. . In the first preliminary room 60, the first transfer machine 15 is provided.
0 is set. The first transfer device 150 is a transfer robot, and its hand section 151 is provided with a mechanism for holding the pallet 16.

The molding chamber 20 is disposed downstream of the first preliminary chamber 60. A press forming apparatus 4 is provided in the forming chamber 20.
The upper die 41 and the lower die 42 are accommodated. The upper die 40 is mounted on the lower end of the fixed shaft 43, and the lower die 42 is mounted on the upper end of the moving shaft 44.

A second preparatory chamber 70 is disposed downstream of the molding chamber 20. The second preliminary chamber 70 is provided with the gate valve 55
Is connected to the outlet side of the molding chamber 20 via a gate valve 56 and is connected to the inlet side of the cooling chamber 30 via a gate valve 56. In the second spare room 70, a second transfer machine 160 is installed. The second transfer device 160 is a transfer robot similar to the first transfer device 150, and has a lower die 4
2 is provided.

FIG. 8 shows the structure of the first transfer machine 150.
Note that the second transfer machine 160 also has an equivalent structure. The first transfer device 150 is an articulated robot, and includes a chuck 152 at the tip of a hand 151. The first transfer machine 150 moves the hand unit 151 back and forth (arrow 15).
5) and turning (arrow 156) and opening and closing (arrow 157) of the chuck 152a are possible.

In addition, chuck grooves are formed on the end surface of the pallet 16 mounted on the conveyor 15 and the end surface of the lower mold 42, respectively, corresponding to the chuck 152a. . By inserting the chuck 152a into these grooves, the pallet 16 or the lower mold 42 can be reliably gripped and accurately conveyed.

Next, the operation of the first transfer device 150 will be described with reference to FIGS. The heated glass substrate 1 is carried into the molding chamber 20 from the heating chamber 10 through the first preliminary chamber 60 in the following procedure.

First, from the state where the gate valves 53 and 54 are closed, the gate valve 53 is opened, and the hand portion 151 is advanced and sent into the heating chamber 10. On the pallet 16 on the conveyor 15 in the heating chamber 10, the high-temperature glass substrate 1 heated to a predetermined temperature is placed. As shown in FIG. 9A, the pallet 16 is
Hold with. The pallet 16 is removed from the conveyor 15. After the hand unit 151 is retracted and the pallet 16 and the glass substrate 1 are carried into the first preliminary chamber 60, the gate valve 53 is closed.

In the first preliminary room 60, the hand unit 151
After turning by 80 degrees, the gate valve 54 is opened. The hand unit 151 is advanced, and the pallet 16 on which the glass substrate 1 is placed is sent into the molding chamber 20. As shown in FIG. 9B, the pallet 1 is stopped above the lower mold 42 on the moving shaft 44. Next, the stopper 24 made of ceramics (Si ₃ N ₄ ) is lowered from the ceiling of the molding chamber 20, and brought into contact with the end face of the glass substrate 1 on the pallet 16 (the end face on the heating chamber 20 side). Next, the hand unit 1
When the 51 is retracted, the glass substrate 1 is restrained by the stopper 24, and only the hand portion 151 is pulled out from under the glass substrate 1. As a result, the glass substrate 1 is transferred onto the lower mold 42 as shown in FIG. The hand unit 151 is retracted to remove the empty pallet 16 from the first transfer chamber 60.
After being carried in, the gate valve 54 is closed. Next, the inside of the molding chamber 20 is evacuated through the vacuum exhaust pipe 21 to start press molding of the surface of the glass substrate 1.

In parallel, the hand unit 151 is turned by 90 degrees in the first transfer chamber 60. Next, the pallet 16 is carried out of the first preliminary chamber 60 through the gate valve 59. The unloaded pallet 16 is returned to the front of the third preparatory chamber 80 by the circulation transfer device (broken line in FIG. 7).

Next, the operation of the second transfer machine 160 will be described with reference to FIGS. 10 and 7. The molded substrate 2 after the molding is removed from the molding chamber 20 to the second preliminary chamber 7 in the following procedure.
After passing through 0, it is carried into the cooling chamber 30.

First, from the state where the gate valves 55 and 56 are closed, the gate valve 55 is opened, and the hand portion 161 is advanced and fed into the molding chamber 20. On the lower mold 42 in the molding chamber 20, the high-temperature molded substrate 2 immediately after the press molding is completed is placed. As shown in FIG.
The lower mold 42 is gripped by the hand unit 161. The lower mold 42 is removed from the moving shaft 44. Retract the hand part 161 and
After carrying the lower mold 42 and the molded substrate 2 into the second preliminary chamber 70, the gate valve 55 is closed.

In the second spare room 70, the hand unit 161
After turning by 80 degrees, the gate valve 56 is opened. The hand part 161 is advanced, and the lower mold 42 on which the molded substrate 2 is placed is sent into the cooling chamber 30. As shown in FIG. 10B, the lower mold 42 is stopped above the pallet 36 on the conveyor 35. Next, the stopper 34 is lowered from the ceiling of the cooling chamber 30, and the stopper 34 is brought into contact with the end surface of the molded substrate 2 on the lower mold 42 (the end surface on the molding chamber 20 side).
Next, when the hand part 161 is retracted, the molded substrate 2 is restrained by the stopper 34, and only the hand part 161 is pulled out from under the molded substrate 2. As a result, FIG.
As shown in (c), the molded substrate 2 is transferred onto the pallet 36. After the hand part 161 is retracted and only the lower mold 42 is carried into the second transfer chamber 70, the gate valve 56 is closed.

In the second spare room 70, the hand unit 161
Turn 80 degrees. Next, the gate valve 55 is opened,
The hand part 161 is advanced to return the lower mold 42 to the inside of the molding chamber 20, and as shown in FIG.
On the moving shaft 44. Next, the hand unit 161
Is retracted, only the hand part 161 is returned into the second preliminary chamber 70, and then the gate valve 55 is closed.

If the lower mold 42 is also used as the pallet 15, the glass substrate 1 can be transferred from the heating chamber 10 to the molding chamber 20 without transferring the glass substrate 1 from the pallet 15 to the lower mold 42. Similarly, if the lower mold 42 is also used as the pallet 35, the molding substrate 2 can be transferred from the molding chamber 20 to the cooling chamber 20 without moving the molding substrate 2 from the lower mold 42 to the pallet 35.

(Example 4) The rear surface of a plasma display panel was manufactured by press-forming the surface of a glass substrate using the manufacturing apparatus according to the present invention. Hereinafter, the results will be described. The first and second transfer machines used the non-contact suction levitation method (Example 1) by electrostatic force, but other methods (the method of holding and transporting the target material between the pallet and the lower mold) (Example 3), even when using the method of carrying the target material on a pallet or a lower mold (Example 2))
Other conditions such as press molding conditions are almost the same.

The glass substrate used was 20 inches (508 mm) diagonally, 1.5 mm thick, and glass type: BK-7.
(Glass transition point = 565 ° C., yield point = 624 ° C.).

(A) In the heating chamber 10 kept in an inert gas atmosphere, the glass substrate 1 was heated to 800 ° C. by the infrared lamp 17 while being transported by the transport conveyor 15 on the pallet 16. The inside of the heating chamber 10 was divided into three blocks in the transport direction, the temperature of each block was individually controlled, and the temperature of the glass substrate 1 was raised stepwise. In addition,
In this example, the temperature of each block was set to 500 ° C., 700 ° C., and 800 ° C. in order from the inlet side to the outlet side of the heating chamber 10.

(B) The glass substrate 1 heated to the target temperature in the heating chamber 10 was carried by the first transfer machine 65 onto the lower mold of the press forming apparatus 40 in the forming chamber 20. Although the temperature of the glass substrate 1 after the transfer was slightly different for each test,
All were in the range of 770 ° C to 780 ° C.

(C) Next, after the interior of the molding chamber 20 is evacuated, a pressing force of 10,000 kgf and a pressing time of 10 kg
In sec, the surface of the glass substrate 1 was press-formed using torque field back control.

(D) Molded substrate 2 after press molding
Was transferred onto the pallet 36 in the cooling chamber 30 by the second transfer machine 75.

(E) In the cooling chamber 30 kept in the inert gas atmosphere, the molded substrate 2 was gradually cooled while placed on the pallet 36 and transported by the transport conveyor 35. After the molded substrate 2 was cooled to the target temperature in the cooling chamber, it was carried out of the apparatus. In this example, the final temperature during cooling was set to 100 ° C., and the molded substrate 2 was cooled for about 1 hour.

One of the features of the manufacturing apparatus of the present invention is that each chamber 1
At 0, 20, and 30, each step can be performed in parallel. Therefore, when in the continuous operation state, one molded substrate can be taken out of the cooling chamber 30 at every required time interval (tact time) of the press molding process.

FIG. 11 shows a time chart during continuous operation of the manufacturing apparatus according to the present invention. In the figure, t1 is the required heating time in the heating chamber, t2 is the time required for transferring the glass substrate from the heating chamber to the molding chamber, and t3 is the time required for evacuation in the molding chamber plus the time required for press molding. ,
t4 represents a time required for transferring the molded substrate from the molding chamber to the cooling chamber, and t5 represents a required cooling time in the cooling chamber.

In the above example, the glass substrate 1 is carried into the molding chamber 20, the inside of the molding chamber 20 is evacuated, and then the glass substrate 1 is subjected to press molding. Therefore, the vacuum state in the molding chamber 20 cannot be broken during the press molding. That is, it is not possible to carry in the glass substrate and carry out the molded product unless the press molding is completed. Therefore, FIG.
As shown in FIG. 1, the unloading interval (T) of the molded substrate after cooling is “transport time of glass substrate from heating chamber to molding chamber + evacuation time + press molding time” (t2 + t3). The unloading of the molded substrate from the molding chamber to the cooling chamber (duration: t4) is performed in parallel with the transfer of the glass substrate from the heating chamber to the molding chamber (duration: t2). In this example, the carry-out interval (T) of the molded substrate was 60 to 70 sec, although there was a slight difference for each test.

Under the above conditions, parallel linear projections having a pitch of 75 μm, a width of 25 μm (top) to 35 μm (bottom), and a height of 70 μm are formed on the surface of a 20-inch diagonal glass substrate with high shape accuracy. We were able to.

[0102]

According to the apparatus for manufacturing a glass molded substrate of the present invention, since the glass substrate molding step is performed in the vacuum-evacuated molding chamber, the occurrence of air pockets on the surface of the molded article is prevented. In addition, it is possible to manufacture a molded substrate in which a pattern is formed on the surface of a flat glass plate by fine irregularities with high accuracy and high yield.

By carrying the glass substrate in a high temperature state and the molded substrate after molding without causing distortion, the respective steps of heating, molding and cooling can be respectively performed.
Since it can be performed in each room in parallel, high throughput can be realized. Since the temperatures and atmospheres of the heating chamber, the molding chamber and the cooling chamber can be controlled independently of each other, by controlling the temperature difference between the molding die and the glass substrate to appropriate conditions, the glass on the mold surface can be controlled. In addition to preventing fusion, the load of press molding is reduced, and further, there is an effect of increasing the degree of freedom in selecting a material of the molding die, extending the life of the molding die, and the like. In addition, as a result, it is possible to manufacture a molded substrate with high accuracy and high yield.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a first example of an apparatus for manufacturing a molded glass substrate of the present invention, (a) is an overall view, (b) is a plan layout view of a heating chamber, and (c) is a cooling chamber. FIG.

FIG. 2 is a front view of a suction electrode used for contact transfer by electrostatic force.

3A and 3B are diagrams showing a second example of the apparatus for manufacturing a molded glass substrate of the present invention, wherein FIG. 3A is a schematic configuration diagram of a main part, and FIG.

4A and 4B are diagrams showing a configuration of an apparatus for transferring a glass substrate and a molded substrate used in the second example, FIG.
(B) is a top view.

FIG. 5 is a diagram illustrating a method of transferring a glass substrate in a second example.

FIG. 6 is a diagram illustrating a method of transferring a molded substrate in a second example.

FIGS. 7A and 7B are diagrams showing a third example of the apparatus for manufacturing a molded glass substrate of the present invention, in which FIG. 7A is a schematic configuration diagram of a main part, and FIG.

8A and 8B are diagrams showing a configuration of an apparatus for transferring a glass substrate and a molded substrate used in the third example, FIG.
(B) is a top view.

FIG. 9 is a diagram illustrating a method for transferring a glass substrate in a third example.

FIG. 10 is a diagram illustrating a method of transferring a molded substrate in a third example.

FIG. 11 is a diagram showing an example of a time chart at the time of continuous operation of the apparatus for manufacturing a molded glass substrate of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Glass substrate, 2 ... Molding substrate, 10 ... Heating room, 20 ... Molding room, 30 ... Cooling room, 40 ...
・ Press forming device, 60 ・ ・ ・ First preliminary room, 70 ・ ・ ・
Second preliminary chamber, 80: third preliminary chamber, 90: fourth preliminary chamber, 11: inlet of inert gas, 12: exhaust port, 15: transport conveyor (first Transfer device), 16.
..Pallets, 17 infrared lamps, 18 reflecting mirrors, 21 vacuum pumping tubes, 23 vacuum pumps, 24 stoppers, 31 inlets for inert gas, 32 ... exhaust port, 34 ... stopper, 35 ...
・ Transport conveyor (second transport device), 36 ・ ・ ・ Pallet, 37 ・ ・ ・ Infrared lamp, 38 ・ ・ ・ Reflection mirror,
41 ... upper mold, 42 ... lower mold, 43 ... fixed shaft,
44: moving axis, 45: load cell, 46:
Screw jack 47 47 Servo motor 47 4
9 ... Control device, 51-59 ... Gate valve, 6
5: First transfer machine (transport robot), 66: Hand unit, 75: Second transfer machine (transport robot), 76
..Hand portion, 81... Inert gas inlet, 82.
..Exhaust port, 85 ... Table, 91 ... Inlet of inert gas, 92 ... Exhaust port, 95 ... Table,
111: electrode for suction, 112: electrode substrate, 11
3 ... copper electrode pattern, 130 ... first transfer machine, 1
31 ... hand part, 132 ... chuck part, 140
... Second transfer machine, 141 ... Hand unit, 142 ...
・ Chuck part, 150 ・ ・ ・ First transfer machine, 151 ・ ・ ・
Hand unit, 152 chuck unit, 160 second transfer machine, 161 hand unit, 162 chuck unit.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroshi Murakoshi 2068-3 Ooka, Numazu-shi, Shizuoka Toshiba Machine Co., Ltd. Numazu Office (72) Inventor Hidetoshi Kitahara 2068-3, Ooka, Numazu-shi, Shizuoka Toshiba Machine Numazu Corporation In-house F term (reference) 5C027 AA09 5C040 GF19 JA20 JA34 JA40 MA23

Claims (15)

[Claims] 1. A heating chamber for heating a flat glass substrate to a predetermined temperature, a heating chamber disposed adjacent to the heating chamber, and a vacuum exhaust means,
A molding chamber for accommodating a molding die and transforming the glass substrate into a molded substrate having a fine pattern formed on a surface thereof; and a cooling chamber disposed adjacent to the molding chamber and cooling the molded substrate to a predetermined temperature. A cooling chamber, a first transfer machine for transferring the glass substrate from the heating chamber to the molding chamber, and a second transfer machine for transferring the molded substrate from the molding chamber to the cooling chamber, An apparatus for manufacturing a molded substrate made of glass, comprising: 2. A heating chamber which is maintained in an inert gas atmosphere and accommodates a first transfer device for transferring a flat glass substrate continuously or intermittently, and heats the glass substrate to a predetermined temperature while transferring the glass substrate. A molding apparatus that includes a vacuum mold and uses a molding die composed of an upper mold and a lower mold, and forms the heated glass substrate into a molded substrate having a fine pattern formed on the surface by molding the heated glass substrate. And a second transport device that is maintained in an inert gas atmosphere and that continuously or intermittently transports the molded substrate,
A cooling chamber that cools the molded substrate to a predetermined temperature while transporting the molded substrate; and a gate valve that is provided before and after the molding chamber. And a first spare chamber for accommodating a first transfer machine for transferring the glass substrate from the heating chamber to the molding chamber, comprising a gate valve at the front and rear, and via a front gate valve. And a second transfer machine connected to a former stage of the cooling chamber via a rear gate valve and connected to a former stage of the cooling chamber, and for transferring the molded substrate from the molding chamber to the cooling chamber. An apparatus for manufacturing a molded substrate made of glass, comprising: 3. A third preparatory chamber provided with a front and rear gate valve and connected to a preceding stage of the heating chamber via a rear gate valve, and a cooling valve provided with a front and rear gate valve and a front gate valve. The apparatus according to claim 2, further comprising: a fourth preparatory chamber connected to a rear stage of the chamber. 4. The method according to claim 2, wherein the first transfer device holds the glass substrate from an upper surface by a non-contact suction floating method using an electrostatic force, and transfers the glass substrate from the heating chamber to the molding chamber. 3. The apparatus for producing a glass molded substrate according to claim 1. 5. The method according to claim 2, wherein the second transfer device holds the formed substrate from the upper surface by a non-contact suction floating method using an electrostatic force, and transfers the formed substrate from the forming chamber to the cooling chamber. 3. The apparatus for producing a glass molded substrate according to claim 1. 6. The first transfer machine is of a contact type or a non-contact type vacuum chuck type, and holds the glass substrate from an upper surface and transfers the glass substrate from the heating chamber to the molding chamber. An apparatus for manufacturing a glass molded substrate according to claim 2. 7. The second transfer machine is of a contact type or a non-contact type vacuum chuck type, and holds the glass substrate from an upper surface and transfers the glass substrate from the molding chamber to the cooling chamber. An apparatus for manufacturing a glass molded substrate according to claim 2. 8. The method according to claim 1, wherein the first transfer device transfers the glass substrate on a pallet, and the first transfer device first transfers the lower mold from the forming device in the forming chamber. After removing, the lower mold is turned upside down, then moved into the heating chamber, and the lower mold is placed on the glass substrate placed on the pallet, and then the pallet and the lower mold are gripped. By holding the glass substrate sandwiched between them, then, while turning the glass substrate upside down, return to the molding chamber, after mounting the lower mold to the molding device, only the pallet The apparatus for manufacturing a molded glass substrate according to claim 2, wherein the apparatus is configured to return to the heating device. 9. The method according to claim 8, wherein the second transfer device transfers the formed substrate on a pallet, and the second transfer device first transfers the pallet from the second transfer device in the cooling chamber. After removing the pallet, the pallet is turned upside down, and then moved into the molding chamber. After the pallet is placed on the molding substrate on the lower mold, the lower mold and the pallet are gripped. Holding the molded substrate sandwiched therebetween, and then turning the molded substrate upside down, returning to the cooling chamber, and mounting a pallet on the second transfer device, and then moving only the lower mold to the molding device The apparatus for manufacturing a molded glass substrate according to claim 2, wherein the apparatus is configured to return to the state. 10. The method according to claim 1, wherein the first transfer device is configured to transfer the glass substrate placed on a pallet, and the first transfer device first sets the glass substrate from the second transfer device in the heating chamber. Remove the pallet on which is placed, and then move into the molding chamber, stop above the lower mold attached to the molding device, and hold the glass substrate with a stopper from the side, and remove only the pallet. 3. The apparatus according to claim 2, wherein the glass substrate is transferred onto the lower mold by extracting, and the empty pallet is returned to the heating chamber, and is mounted on the first transfer device. 3. The apparatus for producing a glass molded substrate according to claim 1. 11. The method according to claim 11, wherein the second transfer device transfers the glass substrate on a pallet, and the second transfer device first loads the formed substrate from the forming device in the forming chamber. The lower mold is removed, and then moved into the cooling chamber and stopped above a pallet mounted on the second transfer device. 3. The method according to claim 2, wherein the molding substrate is moved onto a pallet by extracting only the lower mold, and the empty lower mold is returned to the molding chamber, and is mounted on the molding apparatus. 3. The apparatus for producing a glass molded substrate according to claim 1. 12. The method according to claim 1, wherein the first transfer device and the second transfer device are configured to transfer an object to be transferred on a pallet, wherein each pallet also serves as the lower mold and the first transfer device. Is transferred from the heating chamber to the molding chamber with the glass substrate placed on each pallet, and the second transfer machine performs the molding with the molded substrate placed on each pallet. 3. The apparatus according to claim 2, wherein the apparatus is transferred from a chamber to the cooling chamber. 13. The capacity of the heating chamber is obtained by dividing the number of the glass substrates accommodated therein by the required heating time in the heating chamber by the required molding time per molded substrate in the molding chamber. The capacity of the cooling chamber, the number of the molded substrates that can be accommodated therein, the required cooling time in the cooling chamber, the required molding per molded substrate in the molding chamber The apparatus according to claim 2, wherein the value is set to be equal to or greater than a quotient divided by time. 14. The apparatus for manufacturing a glass molded substrate according to claim 2, wherein the molding apparatus is provided with a temperature control unit having a function of heating and cooling the molding die. 15. A heating means is provided in the molding chamber,
The apparatus for manufacturing a glass molded substrate according to claim 2, wherein the glass substrate is molded after the glass substrate carried in from the heating chamber is further heated to a moldable temperature.