JP2000202718A - Manufacturing method and processing method of electrode for processing tool - Google Patents

Abstract

(57) [Problem] To provide a manufacturing tool electrode and a manufacturing method of a processing tool electrode capable of creating a target shape with high speed and high accuracy even if the target shape to be processed is a high aspect ratio structure of a fine pattern. . SOLUTION: A pattern of a mask 4 is exposed to a thick photosensitive material 3 on an electroformed base 2 formed on a surface of a silicon substrate 1, and is exposed in a high aspect fine pattern of the photosensitive material 3 obtained by development. The electroforming is performed on the electroformed base 2 and the photosensitive material 3 is removed to obtain a tool electrode 6, and a discharge is generated between the electroformed base 2 and a workpiece 7 of an arbitrary conductive material using the tool electrode 6. The workpiece 7 is fed to the workpiece 7 while electric discharge machining is performed to perform electric discharge machining, and the high aspect fine pattern structure of the tool electrode 6 is transferred to the workpiece 7 with high accuracy and high speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a machining tool electrode and a machining method.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of electronic and mechanical devices, there has been a demand for a processing technique capable of processing micro components having a high aspect ratio structure with high accuracy and high speed.

[0003] As a method for creating a highly accurate micro-sized shape, a fine electric discharge machining technique (reference: supervised by Shunichi Gonda,
"Thin Film Application Handbook", NTT Corporation, P1098-1105). According to this processing method, any conductor can be processed, and for example, a high-precision micro-sized shape can be formed with high accuracy even for a high-hardness material such as a mold material. It is used for various purposes because of its size.

[0004] This machining includes wire electric discharge grinding (WE).
A tool electrode formed into a simple shaft shape by the DG) method (reference: Takahisa Masuzawa et al., "Paper Collection of Academic Lecture Meetings of the Autumn Meeting of the Japan Society of Precision Engineering, 1985", P379) is used.
The tool electrode is sequentially formed in accordance with the processing content, and is used to create a target shape while scanning along the processing shape contour. In the case of such a contour processing method in which a shape is created by scanning a simple electrode, the processing time is almost the time required for scanning, and the processing time becomes longer as the processing shape becomes more complicated.

[0005] On the other hand, in ordinary electric discharge machining, a method of transferring a target shape by feeding a shaped electrode having an inverted shape of the target shape into a workpiece is generally used.
Processing can be performed in a shorter time than the above-described contour processing method. This shaped electrode is manufactured by machining such as cutting or lapping.

Therefore, if such a shaped electrode can be produced also for a micro-sized tool electrode used for micro electric discharge machining, it is not necessary to scan the electrode, so that a reduction in machining time can be expected.

[0007] For forming such a micro-form electrode which is extremely difficult to form by machining or electric discharge machining, a pattern mold of an insulating material is produced by using photolithography technology, and a metal is embedded therein. For example, a method of manufacturing with high accuracy is described in Japanese Patent No. 2547319.

Referring to FIG. 9, first, in step (a), a photosensitive portion 202 supported by a resin plate 201 is exposed, and then, in step (b), development is performed to form a relief 203 of a fine tooth pattern. Then, in step (c), a metal plate 204 is closely attached to the relief 203 of the fine tooth pattern and plated to transfer a metal relief 205 onto the metal plate 204, and finally, in step (d). A method of using this as an electrode for electric discharge machining is disclosed.

[0009] Another example is disclosed in Japanese Patent Application Laid-Open No. Hei 6-37047. It is a method of using a photoresist pattern formed by photolithography as a mask, embedding a metal in a pattern of an insulating film on a metal plate formed by etching, and using the metal as an electrode for dry etching or electric discharge machining.

[0010]

However, the method disclosed in the specification of Japanese Patent No. 2547319 is not applicable to the metal plate 2.
04 is required to be in close contact with the relief 203 of the photosensitive portion 202 and to be plated in the gap. Therefore, it is difficult to evenly supply the plating bath over the entire pattern of the relief 203 and uneven metal growth occurs. There is a problem that a tool electrode having a uniform height in the direction cannot be obtained. In addition, with the progress of plating in a gap that becomes a closed space in the close contact portion, the state shifts to a state where metal ions in the plating bath are insufficient, and metal embedding becomes insufficient. There is a problem that a tool electrode having a remarkably low tool electrode must be formed, and a tool electrode having a substantially high aspect ratio cannot be manufactured. Therefore, it can also be said that it is impossible to perform a high aspect transfer process on a workpiece with high accuracy using a tool electrode manufactured by this method.

In the case of the method disclosed in Japanese Patent Application Laid-Open No. Hei 6-37047, the metal pattern obtained as the tool electrode has a planar structure in which the insulating film material is mixed. There is a problem that not only transfer processing with a high aspect ratio but also three-dimensional processing cannot be performed by electric discharge machining or electrolytic machining that needs to be maintained at a fixed distance.

On the other hand, in the case of electric discharge machining in which the tool electrode is consumed, or in the case of using differently shaped tool electrodes in rough machining or finishing, etc., it is necessary to replace the tool electrode. This leads to various problems such as a reduction in productivity, a non-uniform shape between a plurality of tool electrodes that are sequentially formed, and a processing shape error due to a mounting error at the time of replacement.

In view of the above-mentioned conventional problems, the present invention enables high-precision and high-speed creation even when the target shape has a high aspect ratio fine pattern structure, and also enables quick and high-precision tool change. It is an object of the present invention to provide a method for manufacturing a machining tool electrode and a machining method which can achieve both high degree of freedom in shape and high productivity.

[0014]

According to the present invention, there is provided a method for manufacturing a working tool electrode, comprising the steps of: forming an insulating material in a predetermined pattern on a conductive surface of a substrate; It has a process of growing and embedding metal and a process of removing insulating material from the substrate. Since the opening side of the pattern can be opened at all times during electroforming, an abundant plating bath is evenly supplied over the entire pattern. It is possible to embed metal evenly even if the pattern to be electroformed has a high aspect ratio fine structure, because it does not shift to a state where metal ions in the plating bath are insufficient.
It is possible to manufacture highly accurate and fine processing tool electrodes.

Preferably, if the insulating material is a photosensitive material and the pattern is formed by photolithography, a fine and highly accurate pattern can be easily formed.

Further, a pattern of a photosensitive material that is in close contact with the conductive surface of the substrate is formed by photolithography, and a metal is grown from the conductive surface into the gap between the patterns by electroforming, and the photosensitive material is removed from the substrate. By forming a fine metal structure in the same manner, even if the mold of the photosensitive material to be subjected to electroforming has a high aspect ratio fine structure, the fine metal structure is formed uniformly and precisely as described above. An electrode for a processing tool can be formed.

Further, a pattern of an insulating material is formed by anisotropic etching using a mask formed by photolithography, and a metal is buried in a gap of the pattern by electroforming on a conductive surface which is in close contact with the insulating material. By forming a fine metal structure by removing the metal, a fine metal structure can be obtained in the same way, and special ultra-short X-rays and the like for high aspect ratio exposure using a thick photosensitive material can be obtained. Electrodes for processing tools can be manufactured with a simple device configuration that does not require a wavelength light source.

Alternatively, by forming a fine metal structure by anisotropic etching of the metal using a mask formed by photolithography, a fine metal structure can be similarly obtained and an electroforming process is required. It is possible to manufacture a machining tool electrode with a more suitable material as a machining tool electrode which cannot be formed by electroforming with a simple process.

Further, the working tool electrode can be composed of a plurality of materials. In this case, a structural material for forming the working tool electrode structure by electroforming and a surface material which affects workability are selectively used. This makes it possible to obtain a machining tool electrode having excellent wear resistance, which cannot be achieved with a machining tool electrode made only of a structural material.

In the machining method of the present invention, a workpiece is subjected to electric discharge machining or electrolytic machining using the machining tool electrode manufactured as described above, and the fine structure is subjected to electric discharge machining or electrolytic machining. By using it as a tool electrode, a high aspect ratio fine structure can be transferred to workpieces of various materials. The energization for supplying machining energy to the machining tool electrode is easily achieved by executing the machining tool electrode from a substrate that is electrically connected to the machining tool electrode.

Further, when a plurality of machining tool electrodes are formed on electrically conductive surfaces, each of which is electrically divided, a different power is supplied to each tool electrode in the machining process, so that a fine shape is created by electric discharge machining. When performing machining, it is possible to perform machining by generating an independent pulse discharge in each of the separated metal structures, that is, the machining tool electrodes, and the machining speed at the time of parallel machining in which machining is performed simultaneously in each machining tool electrode. Can be significantly improved.

Further, the working tool electrode is formed in an insulating material pattern obtained by electroforming until the metal is covered with a sufficient thickness on the surface of the insulating material including the photosensitive material on the plating bath side. When supported by a metal lump other than the tool electrode portion to be formed, since the processing tool electrode is integrated with the metal lump as a support, the structure formed on the conductive surface of the substrate as the support The problem of adhesion between the working tool electrode and its support due to contamination on the conductive surface or material difference from the electroformed metal, etc., which occurs in the case of Even if it is a body, high resistance to external force can be obtained.

When a plurality of machining tool electrodes are arranged in the direction of the exposure surface in photolithography, the machining tool electrodes are exchanged by positioning the machining tool and each machining tool electrode in the direction of the exposure surface. It is possible to use a plurality of processing tool electrodes uniformly manufactured by photolithography as a replacement tool electrode, and perform tool replacement using the high-precision arrangement of these processing tool electrodes. Tool electrode handling is not required, and in addition to quick replacement, there is no mounting error due to replacement, without reducing productivity.
High-precision processing can be continued.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method for manufacturing a working tool electrode (hereinafter abbreviated as a tool electrode) of the present invention and a working method using the tool electrode will be described with reference to FIGS. I will explain.

(First Embodiment) First, a fine shape processing method according to a first embodiment of the present invention will be described with reference to FIG. In FIG. 1, an electroformed base 2 made of a metal thin film is formed on the surface of a silicon substrate 1 for use in electroforming a tool electrode material, and a photosensitive material 3 is adhered onto the electroformed base 2. (1)). Next, the short-wavelength light 5 is irradiated through the fine pattern mask 4 to expose the photosensitive material 3 (step (2)). By converting this short-wavelength light 5 into X-rays such as synchrotron radiation,
Exposure with a high aspect ratio can be performed with high precision on the photosensitive material 3 having a thickness of 0 μm to several mm.

Next, the exposed photosensitive material 3 is developed to obtain a tool electrode mold made of the same material (step (3)). Next, electroforming is performed on the electroformed base 2 exposed on the substrate surface of the mold (step (4)). Thus, by electroforming from the opening side of the mold, a plating bath having a uniform composition can always be supplied.
Even if the mold has a high aspect ratio or a large electroformed area, the tool electrode material can be embedded with high accuracy and uniformity. After electroforming, the photosensitive material 3 is removed to obtain a tool electrode 6 having a high aspect fine pattern structure supported on the silicon substrate 1 (step (5)).
).

When the tool electrode 6 manufactured in this manner is installed in a machining machine such as an electric discharge machine, it is extremely difficult to handle a fine tool electrode itself having a micro size, and it is difficult to handle the tool electrode 6 with dirt or damage during handling. May be given, which is not preferable. The tool electrode having a high aspect structure used in the present embodiment has extremely high perpendicularity to the substrate by photolithography. Therefore, by using this silicon substrate 1 as a jig for installation, high precision and high accuracy can be achieved. It can be easily installed on a processing machine. Here, when performing electric discharge machining using the tool electrode 6, the electric discharge control means 8 generates the pulse discharge between the tool electrode 6 and the workpiece 7, which are energized through the electroforming base 2, and discharges the tool electrode 6. This is carried out by feeding the workpiece 7 (step (6)).

Through the above steps, high-speed transfer processing of a high aspect fine pattern structure is possible.

In the above-mentioned electric discharge machining, when the electric discharge control means 8 is an energy storage type RC circuit, the applied voltage is 80 to 100.
V, the capacitor capacity is 10 to 100 μF, and the feeding speed of the tool electrode 6 to the workpiece 7 is 1 to 5 μm / sec.
By setting to c, high-precision micro-size micro-electric discharge machining can be performed.
In order to prevent processing stagnation due to a short circuit between them, a vibration having a frequency of 100 Hz and an amplitude of about 10 μm is applied to any of them, whereby smooth high aspect ratio processing can be realized.

For example, by using the tool electrode 6 in which a columnar structure having a diameter of 50 μm and a height of 1000 μm, ie, an aspect ratio of 20, manufactured by electroforming copper by the method described in the present embodiment on a substrate is arranged in an array. By performing the electric discharge machining under the above-mentioned machining conditions until the workpiece 7 having a thickness of 500 μm is penetrated, it is possible to uniformly and collectively form a microhole array having an aspect ratio of 10 arranged with high precision. This processing can be repeated until the height of the tool electrode 6 is reduced to 500 μm by wear. Even if the tool electrode 6 needs to be replaced due to wear, the method of the present invention makes it easy to mass-produce the above-mentioned tool electrode 6 having a high aspect ratio uniformly and collectively. There is no shortage.

Since any material can be selected as the work 7 as long as it is a conductor, the present processing method is applied to a material having advantageous characteristics according to the purpose of use, and the processed product is applied to various uses. can do. For example, a high-aspect-ratio microhole array as described above is processed into a corrosion-resistant material such as stainless steel and used as a multi-channel micro-transport channel for chemical liquids, or processed into a material with a low coefficient of thermal expansion. Thus, it can be used as a high-precision parallel fixing guide for a small-diameter optical fiber array having almost no hole position drift due to environmental temperature change. As described above, according to the processing method of the present invention, an extremely practical device can be realized.

In the present embodiment, the thin film structure supported on the silicon substrate 1 is used as the electroformed base 2, but it is also possible to use a metal plate instead of the silicon substrate and use the electroformed base on the surface of the metal plate. It can be implemented similarly.

(Second Embodiment) Next, a fine shape processing method according to a second embodiment of the present invention will be described with reference to FIG. In FIG. 2, first, an insulating material 10 is brought into close contact with a conductive plate 9, and a photosensitive material 3 is applied on a surface of the insulating material 10, and the photosensitive material 3 is patterned by exposure (step (1)). ). The photosensitive material 3 required for this exposure is of the order of a few μm, so that exposure can be carried out with ultraviolet light and no special light source such as synchrotron radiation is required.

Next, using the patterned photosensitive material 3 as a mask, anisotropic etching is performed on the insulating material 10 until the conductive plate 9 is exposed (step (2)). As the anisotropic etching, for example, reactive ion etching (R
By using the IE) method, high aspect ratio processing can be performed on a material such as silicon oxide or polyimide as an insulating material. Alternatively, S which can perform similar processing
The insulating material 10 may be formed by forming an oxide film on the surface of i by a thermal oxidation method or the like.

Next, using the etched insulating material 10 as a mold, electroforming is performed on the conductive plate 9 (step (3)), and the insulating material 10 of the mold is removed by etching. The electroformed metal tool electrode 6 supported by the above is obtained (step (4)).

Using this tool electrode 6, high-speed transfer processing of a high-aspect fine pattern structure by electric discharge machining or the like can be performed in the same manner as in step (6) of the first embodiment. Note that, instead of the conductive plate 9, the silicon substrate 1 on which the electroformed base 2 as shown in FIG. 1 is formed may be used. As shown in this embodiment, a tool electrode can be manufactured with a simple device configuration that does not require a special exposure light source, and it is possible to provide inexpensive and highly practical fine shape processing.

(Third Embodiment) Next, a fine shape processing method according to a third embodiment of the present invention will be described with reference to FIG. In FIG. 3, a photosensitive material 3 is applied on the surface of a metal plate 11, and the photosensitive material 3 is patterned by exposure (step (1)). here,
The required exposure can be performed with a simple apparatus configuration as in the case of the step (1) in FIG.

Next, using the patterned photosensitive material 3 as a mask, the metal plate 11 is subjected to high aspect processing by anisotropic etching using RIE or the like (step).
(2)). This anisotropic etching uses Al which can be used as a tool electrode material when processing a steel material or the like as the workpiece 7.
Is used as the material of the metal plate 11 to stably carry out.

Next, the photosensitive material 3 is removed (step (3)).
Electric discharge machining is performed on the workpiece 7 using the tool electrode 6 formed by anisotropic etching of the metal plate 11.
(3)), the same processing as step (6) in FIG. 1 can be performed by a simple process that does not require electroforming.
(Four) ).

In this embodiment, the material of the metal plate 11 serving as the tool electrode material is Al. However, the material is not limited to Al. For example, a material such as W or Mo can be selected by selecting an appropriate mask material. A suitable tool electrode material capable of forming a tool electrode by anisotropic etching and realizing a good machining state such as suppressing the consumption of the tool electrode can be selected according to the machining material.

In this embodiment, the bulk metal plate 11
Although the example of applying high aspect ratio processing to the above was shown, for example, the electric discharge machining using the tool electrode of the metal thin film material obtained by performing the same etching on the metal thin film formed on the silicon substrate It is feasible.

(Fourth Embodiment) Next, a fine shape processing method according to a fourth embodiment of the present invention will be described with reference to FIG.

The problem of electric discharge machining is that the tool electrode is consumed. In the case of electric discharge machining used for fine shape machining, it is known that good wear resistance can be obtained for various machining materials by using high melting point W as a tool electrode material. However, in the case of W, it is almost impossible to form a structure having a high aspect ratio by electroforming like Ni or Cu. Here, by forming a high aspect ratio structure from an electroformable material and forming a material having more excellent wear resistance as a tool electrode on the surface thereof, low consumption processing can be realized. The embodiment will be described below.

In FIG. 4, the state shown in the step (1) is obtained by the same steps as the steps up to the step (3) in FIG. Here, a thin film of the tool electrode surface material 6b is formed on the upper surface of the tool electrode structural material 6a formed by electroforming (step (2)). Next, the photosensitive material 3 remaining on the insulating material 10 is removed, and the surface material formed thereon is lifted off (step (3)). Next, by etching the insulating material 10, the tool electrode 6 having the tool electrode surface material 6b formed at the tip of the tool electrode structure material 6a is obtained (step (4)).

The workpiece 7 is subjected to electrical discharge machining using the tool electrode 6 (step (5)). This electric discharge machining proceeds by sending the tool electrode to the workpiece 7 in a direction perpendicular to the conductive plate 9 supporting the tool electrode, and electric discharge mainly occurs on the tool electrode surface material 6b at the tip of the tool electrode. . By using a high melting point material such as W for the tool electrode surface material 6b, it is possible to perform low-consumption processing in which the consumption by melting on the discharge surface on the tool electrode side is suppressed.

As shown in the above embodiment, by using a tool electrode having a material different from the material of the tool electrode formed by electroforming on the surface, the tool electrode formed only by electroforming is used. Better processing characteristics than in the case are realized.

(Fifth Embodiment) Next, a fine shape processing method according to a fifth embodiment of the present invention will be described with reference to FIG.

In the case of forming a hole by electrolytic machining, an electrolytic phenomenon between a tool electrode side surface and a workpiece causes problems such as edge drooping at a machining entrance portion and tapering of a machining side wall surface. In the case of performing deep excavation using a tool electrode having a high aspect ratio structure, the tendency is increased, which is a factor that hinders high-accuracy machining. By forming an insulating material on the side surface of the tool electrode, unnecessary electrolytic elution is suppressed, and highly accurate electrolytic processing can be performed. The embodiment will be described below.

In FIG. 5, a pattern of the silicon oxide film 13 formed by photolithography is formed on the surface of the silicon 12 adhered to the conductive plate 9 (step (1)). Using the pattern of the silicon oxide film 13 as a mask, the silicon 12 is anisotropically etched by RIE or the like until it reaches the conductive plate 9 to form a mold of the silicon 12 (step (2)). A silicon oxide film 13 as an insulating layer is formed on the surface of the silicon 12 mold by a thermal oxidation method or the like (step (3)). Here, the silicon oxide film 13 on the bottom surface is removed by an etch-back method while leaving the silicon oxide film 13 on the mold side surface of the silicon 12 (step (4)). At this time, the silicon oxide film 13 corresponding to the thickness of the mask remains on the upper surface of the silicon 12, so that only the conductive plate surface on the bottom surface of the pattern of the silicon 12 becomes an electroformed base, so that the electroformed metal can be grown with high precision. it can.

After forming the tool electrode 6 in the mold of the silicon 12 by electroforming in the electroforming, the upper surface is wrapped to remove the silicon oxide film 13 on the upper surface of the silicon 12 (step (5)). Thereafter, by etching the silicon 12, the tool electrode 6 having the insulating layer of the silicon oxide film 13 formed on the side surface is obtained (step (6)). Silicon 12
Can be performed by using a solution such as hydrazine, EPW (ethylenediamine-pyrocatechol-water) or TMAII (tetramethylammonium hydroxide) without substantially damaging the silicon oxide film 13.

While the electric current is flowing between the tool electrode 6 and the workpiece 7 in an electrolytic solution such as an aqueous solution of sodium nitrate by the DC power supply 14, the tool electrode 6 is sent to the workpiece 7 so that the electrolytic machining proceeds. (Step (7)). In this electrolytic processing, the side surface of the tool electrode 6 is
3, unnecessary electrolysis phenomena other than electrolysis that proceeds on the bottom surface of the tool electrode 6 do not occur.
High-precision processing can be performed without edge drooping or processing side faces becoming tapered.

As shown in the above embodiment by electrolytic machining, by using a tool electrode having a surface formed of a material different from the material of the tool electrode formed by electroforming, the same as in the fourth embodiment, Machining characteristics superior to those of a tool electrode formed by electroforming can be realized.

(Sixth Embodiment) Next, a fine shape processing method according to a sixth embodiment of the present invention will be described with reference to FIG.

In parallel machining for performing simultaneous transfer of a plurality of structures by performing electrical discharge machining on a workpiece using a plurality of tool electrodes at the same time, a pulse discharge control means connected between the tool electrode and the workpiece is provided. In a single case, the pulse discharge occurs serially while circulating through each tool electrode, so machining actually proceeds serially, and the machining time is the sum of the machining times when machining individual structures individually. Is not much different. In this processing, if a pulse discharge can be generated independently at each tool electrode, the processing proceeds simultaneously in parallel at each tool electrode, and as a result, the processing time can be significantly reduced. The embodiment will be described below.

In FIG. 6, individual tool electrodes 61 to 65 are shown.
Are formed on the divided electroformed bases 2, and since these electroformed bases 2 are formed on the insulating plate 15, they are electrically independent (step (5)). The division of the electroformed base 2 may be performed by exposure and etching in accordance with the tool electrode pattern. Except for previously dividing the electroformed base 2 in FIG. 1, the steps (1) to ( Tool electrodes 61 to 65 can be manufactured in the same process as in (5) (steps (1) to (5)). In the electroforming performed in the step (4) of FIG. 6, it is sufficient to supply a current to each of the divided electroformed bases 2.

In the case of performing electric discharge machining using the tool electrodes 61 to 65 described above, the electric discharge machining means 81 to 85 are connected to the respective tool electrodes to perform machining (step (6)).
In this way, independent pulse discharge can be generated in each tool electrode, that is, high-speed machining in which machining simultaneously proceeds with each tool electrode can be realized.

(Seventh Embodiment) Next, a fine shape processing method according to a seventh embodiment of the present invention will be described with reference to FIG.

When a tool electrode is formed on a conductive surface of a substrate by electroforming, and this substrate is used as a support for the tool electrode during processing, the tool electrode is formed due to contamination on the conductive surface, material difference from the electroformed metal, and the like. As a result, good adhesion may not be obtained at the connection between the tool electrode and its support. In the case where the tool electrode is a fine structure having a high aspect ratio, if the tool electrode and the joint between the support and the support are low in adhesion, there is a possibility that the tool electrode may fall off the support even by a small external force. Actually, since a machining reaction force due to the vaporization explosion of the machining fluid is applied to the tool electrode of the electric discharge machining, a high adhesion is required particularly at the joint when the tool electrode has a high aspect ratio structure. An embodiment for solving the problem of adhesion between the tool electrode and its support will be described below.

In FIG. 7, the state shown in step (1) is obtained by the same process as in step (3) in FIG. A metal lump 16 is formed on the surface of the photosensitive material 3 on the plating bath side by performing electroforming on the electroformed base 2 to embed metal in the space in the pattern of the photosensitive material 3 and continuously growing the metal. (Step (2)). This metal lump 16
The metal grown from each part of the pattern rises from the surface of the photosensitive material 3 and continues to grow, and the adjacent ones are fused to form. Since irregularities are formed on the surface of the metal block 16, the surface is wrapped and smoothed (step (3)). By removing the silicon substrate 1, the electroformed base 2, and the photosensitive material 3, the tool electrode 6 supported by the metal lump 16 is obtained (step (4)). Since the metal block 16 and the tool electrode 6 are formed of the same electroformed metal and are integrated, the tool electrode 6 does not separate from the support. When machining using the tool electrode 6, the metal lump 16 can be mounted on a machining machine such as an electric discharge machine with high precision using the smoothed surface as a support.

It is to be noted that the energization of the minute tool electrode 6 can also be performed through the metal lump 16. This tool electrode 6
Is transferred to the workpiece 7 for transfer processing (step (5)).
Even if a processing reaction force is applied to the tool electrode 6 in the process, the tool electrode 6 and the metal block 16 of the support are firmly connected, and a part of the tool electrode 6 falls off during the processing. Defects do not occur, and highly reliable processing can be performed.

(Eighth Embodiment) Next, a fine shape processing method according to an eighth embodiment of the present invention will be described with reference to FIG.

When performing electric discharge machining, it is necessary to replace the tool electrode in order to prevent machining errors due to consumption of the tool electrode due to machining. Alternatively, in a case where transfer processing of various shapes is performed on a workpiece or a case where different tool electrodes are used in roughing or finishing, tool electrode replacement is also required. The exchange of the tool electrode requires quickness without lowering the productivity and high reproducibility of the relative position with respect to the workpiece. Hereinafter, an embodiment in which tool exchange can be performed quickly and with high accuracy will be described.

In FIG. 8, the state shown in step (1) is obtained by the same process as in step (4) in FIG. The photosensitive materials 31, 32, 33 shown in this step (1)
Have a columnar structure, the photosensitive materials 31 and 32 have the same diameter, and 33 has a slightly smaller diameter. Electroforming is performed on the molds of these photosensitive materials. In this state, the photosensitive materials 31 to 33 are removed (step (2)), and the electroformed base 2 is etched to separate the tool electrode array 17 formed by electroforming from the silicon substrate 1 (step (3)). ).

The tool electrode array 17 includes a photosensitive material 31
Negative type tool electrode 171 having a through hole having the same diameter as
173 is a single plate-like structure. Each tool electrode has a highly accurate shape and placement accuracy on the order of submicrons by photolithography.

Using these negative tool electrodes 171 to 173, the workpiece 7 is subjected to axial machining for transferring the hole shape of each tool electrode. The axis machining here is performed by the negative tool electrode 17.
1 and 172, and a finishing process for obtaining a smooth machined surface using the negative tool electrode 173.

First, rough machining is performed by feeding the workpiece 7 to the negative tool electrode 171 (step (4)).
). Since each negative type tool electrode is a through-hole, a long-axis machining is possible by machining a workpiece fed from a hole entrance and removing it from the hole exit. However, the negative-type tool electrode 171 is worn out and its diameter is widened, and it becomes impossible to machine a shaft having a predetermined diameter during machining. Therefore, it is necessary to change tools in order to maintain machining accuracy. Here, utilizing the positional information between the negative tool electrodes arranged with high precision, positioning is performed from the negative tool electrode 171 that has consumed the workpiece 7 to the unused negative tool electrode 172 of the same shape. By doing so, the tool electrode can be exchanged quickly and with high accuracy. After performing additional roughing with this negative tool electrode 172 (process
(5)) The tool electrode is replaced with a negative tool electrode 173 for finishing. This exchange is also performed by the same positioning,
By finishing the workpiece 7 (step (6)), a fine axis having a smooth surface and a diameter substantially equal to that of the negative tool electrode 173 is obtained.

According to this embodiment, since the handling of the tool electrodes is not required for replacement, quick replacement is realized, and in addition, mounting errors due to replacement do not occur, and productivity is reduced. High-precision machining can be continued without inviting.

[0068]

According to the method for manufacturing a machining tool electrode and the machining method using the machining tool electrode of the present invention, even if the target shape to be obtained as described above has a high aspect fine pattern structure, An advantageous effect is obtained in that the target shape can be created at high speed and with high accuracy, and in addition, high-precision tool change can be performed, and high shape flexibility and high productivity can be achieved at the same time.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing the steps of a first embodiment of the fine shape processing method of the present invention.

FIG. 2 is a cross-sectional view showing the steps of a second embodiment of the fine shape processing method of the present invention.

FIG. 3 is a cross-sectional view showing the steps of a third embodiment of the fine shape processing method of the present invention.

FIG. 4 is a cross-sectional view showing the steps of a fourth embodiment of the fine shape processing method of the present invention.

FIG. 5 is a cross-sectional view showing a step of a fifth embodiment of the fine shape processing method of the present invention.

FIG. 6 is a cross-sectional view showing the steps of a sixth embodiment of the fine shape processing method of the present invention.

FIG. 7 is a cross-sectional view showing a process in a seventh embodiment of the fine shape processing method according to the present invention.

FIG. 8 is a cross-sectional view showing the steps of an eighth embodiment of the fine shape processing method of the present invention.

FIG. 9 is a cross-sectional view showing steps of a conventional fine shape processing method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 silicon substrate 2 electroformed base 3 photosensitive material 6, 61 to 65 tool electrode (electrode for processing tool) 6a tool electrode structural material 6b tool electrode surface material 7 workpiece 8, 81 to 85 discharge control means 9 conductive plate 10 insulating material DESCRIPTION OF SYMBOLS 11 Metal plate 12 Silicon 13 Silicon oxide film 14 DC power supply 15 Insulating plate 16 Metal lump 17 Tool electrode array 171-173 Negative tool electrode

Claims (20)

[Claims] A step of forming an insulating material in a predetermined pattern on the conductive surface of the substrate; a step of growing and embedding a metal from the conductive surface by electroforming in a gap between the patterns; and removing the insulating material from the substrate. A method for manufacturing an electrode for a working tool, comprising: 2. The method according to claim 1, wherein the insulating material is a photosensitive material. 3. The method according to claim 1, wherein the pattern is formed by photolithography. 4. A pattern of a photosensitive material adhered to a conductive surface of a substrate is formed by photolithography, and a metal is grown and buried from a conductive surface in a gap of the pattern by electroforming, and the photosensitive material is removed from the substrate. A method for producing an electrode for a working tool, comprising forming a metal microstructure by heating. 5. An insulating material pattern is formed by anisotropic etching using a mask formed by photolithography, and a metal is buried in a gap of the pattern by electroforming on a conductive surface which is in close contact with the insulating material. A method for producing an electrode for a working tool, characterized by forming a fine metal structure by removing the metal. 6. A method for manufacturing a working tool electrode, comprising forming a metal microstructure by anisotropic metal etching using a mask formed by photolithography. 7. The method for manufacturing a working tool electrode according to claim 4, wherein the metal fine structure is formed of a plurality of materials. 8. A metal fine structure is formed on each of the electrically divided conductive surfaces.
8. The method for producing a working tool electrode according to any one of claims 7 to 7. 9. The method according to claim 4, wherein a metal lump is integrally formed on a portion formed in the pattern of the insulating material including the photosensitive material, and the metal lump supports a metal fine structure. 8. The method for producing an electrode for a working tool according to 5 or 7. 10. The method for manufacturing a working tool electrode according to claim 4, wherein a plurality of metal microstructures are integrally arranged in an exposure surface direction in photolithography. 11. A step of forming an insulating material in a predetermined pattern on a conductive surface of a substrate, a step of growing and embedding a metal from the conductive surface by electroforming in a gap between the patterns, and removing the insulating material from the substrate. Obtaining a machining tool electrode by performing
A step of subjecting a workpiece to electrical discharge machining or electrolytic machining using the machining tool electrode. 12. The processing method according to claim 11, wherein the insulating material is a photosensitive material. 13. The processing method according to claim 11, wherein the pattern is formed by photolithography. 14. A pattern of a photosensitive material adhered to a conductive surface of a substrate by photolithography, a metal is grown from a conductive surface in a gap of the pattern by electroforming, and the photosensitive material is removed from the substrate. A machining method characterized by forming a metal microstructure by using the metal microstructure as a machining tool electrode and subjecting a workpiece to electrical discharge machining or electrolytic machining. 15. An insulating material pattern is formed by anisotropic etching using a mask formed by photolithography, and a metal is buried in a gap of the pattern by electroforming on a conductive surface that is in close contact with the insulating material. A machining method comprising: forming a metal microstructure by removing the metal; and subjecting the workpiece to electrical discharge machining or electrolytic machining using the metal microstructure as a machining tool electrode. 16. A metal microstructure is formed by anisotropic etching of a metal using a mask formed by photolithography, and the workpiece is subjected to electric discharge machining or electric discharge machining using the metal microstructure as a machining tool electrode. A processing method characterized by performing electrolytic processing. 17. The machining method according to claim 14, wherein the machining tool electrode is made of a plurality of materials. 18. The machining tool electrode according to claim 14, wherein a plurality of machining tool electrodes are respectively formed on electrically divided conductive surfaces, and different power is supplied to each machining electrode in the machining process. 18. The processing method according to any one of 17. 19. An electrode for a working tool is formed in a pattern of an insulating material obtained by electroforming until a metal is covered with a sufficient thickness on the surface of the insulating material including the photosensitive material on the plating bath side, and the metal is covered. 18. The semiconductor device according to claim 14, 15 or 17, which is supported by a metal lump other than the machining tool electrode portion to be formed.
The processing method described. 20. A plurality of processing tool electrodes are arranged in an exposure surface direction in photolithography, and the tool electrodes are exchanged by positioning the workpiece and each tool electrode in the exposure surface direction. Item 20. The processing method according to any one of Items 14 to 19.