JP2000068619A - Method of manufacturing conductive material for connection between wirings via insulating layer and wiring board - Google Patents
Method of manufacturing conductive material for connection between wirings via insulating layer and wiring boardInfo
- Publication number
- JP2000068619A JP2000068619A JP10240427A JP24042798A JP2000068619A JP 2000068619 A JP2000068619 A JP 2000068619A JP 10240427 A JP10240427 A JP 10240427A JP 24042798 A JP24042798 A JP 24042798A JP 2000068619 A JP2000068619 A JP 2000068619A
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- insulating layer
- metal foil
- connection
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】
【課題】絶縁層を介する配線間の接続を、絶縁層に開け
た穴に充填した導電材料で行なうプリント配線板におい
て、導電材料による接続の信頼性を高める。
【解決手段】熱溶融可能な導電性粒子と熱硬化性樹脂を
含有する導電材料を用いる。前記導電性粒子は、配線板
の製造工程で加えられる温度以下且つ１００℃以上の固
相溶融温度を有する。例えば、プリプレグ１の所定位置
に穴１を開けここに前記導電材料を充填する。このプリ
プレグ１の両側に金属箔４を載置し加熱加圧成形により
両面金属箔張り積層板を製造する。前記加熱加圧により
導電材料中の導電性粒子３を溶融させ圧縮すると共に熱
硬化性樹脂を硬化させ導体５とする。この導体は、プリ
プレグが硬化してなる絶縁層６を貫通する導体となる。
(57) [PROBLEMS] To improve the reliability of connection of a conductive material in a printed wiring board in which connection between wirings via an insulating layer is performed using a conductive material filled in a hole formed in the insulating layer. An electrically conductive material containing electrically fusible electrically conductive particles and a thermosetting resin is used. The conductive particles have a solid-state melting temperature of 100 ° C. or lower, which is lower than the temperature applied in the wiring board manufacturing process. For example, a hole 1 is opened at a predetermined position of the prepreg 1 and the conductive material is filled therein. A metal foil 4 is placed on both sides of the prepreg 1, and a double-sided metal foil-clad laminate is manufactured by heating and pressing. The conductive particles 3 in the conductive material are melted and compressed by the heating and pressurization, and the thermosetting resin is cured to form the conductor 5. This conductor becomes a conductor that penetrates the insulating layer 6 formed by curing the prepreg.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
絶縁層を介して配置された配線間を、絶縁層に開けた穴
において接続したり、ＣＳＰ（Chip Size Package）の
インタポーザにおける絶縁層上下の電極間を絶縁層に開
けた穴において接続するための導電材料に関する。ま
た、このような導電材料を使用して、絶縁層を介して配
置された配線間や絶縁層上下の電極間を、絶縁層に開け
た穴において接続するプリント配線板やＣＳＰの製造法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting wirings arranged via an insulating layer of a printed wiring board with a hole formed in the insulating layer, and a method of forming an insulating layer on an interposer of a CSP (Chip Size Package). And a conductive material for connecting between the electrodes at a hole formed in the insulating layer. In addition, the present invention relates to a method for manufacturing a printed wiring board or a CSP in which a conductive material is used to connect between wirings arranged via an insulating layer or between electrodes above and below the insulating layer through holes formed in the insulating layer.
【０００２】[0002]
【従来の技術】近年、電子機器の軽薄短小化が強く求め
られるに伴って、電子機器を構成する電子部品及びプリ
ント配線板に対する軽薄短小化の要求が益々強く、この
要求に応えるために、高密度実装技術の開発が急がれて
いる。実装部品の高密度化の代表としては、シリコンチ
ップをフェイスダウン実装するＣＳＰがあり、次世代技
術として精力的に開発されている。一方、高密度実装を
実現する上で、プリント配線板の高密度化も重要なポイ
ントである。現在、高密度プリント配線板として、ビル
ドアップ基板が広く知られている。これは、一般的なガ
ラスエポキシ基板（又は多層基板）を用い、次のように
して製造される。まず、前記基板上に絶縁層となる樹脂
層を重ね、当該樹脂層にレーザ光もしくは紫外線により
微小な電気接続用穴を開ける。そして、この電気接続用
穴に銅メッキを施して、樹脂層を介してその上下に位置
する配線間の接続を行なうものである。2. Description of the Related Art In recent years, as electronic devices have been strongly demanded to be light and thin, there has been an increasing demand for electronic components and printed wiring boards constituting electronic devices to be lighter and thinner. The development of density packaging technology is urgent. A representative example of a high-density mounting component is a CSP for mounting a silicon chip face-down, and has been vigorously developed as a next-generation technology. On the other hand, to realize high-density mounting, increasing the density of the printed wiring board is also an important point. At present, build-up boards are widely known as high-density printed wiring boards. This is manufactured using a general glass epoxy substrate (or a multilayer substrate) as follows. First, a resin layer serving as an insulating layer is overlaid on the substrate, and minute electric connection holes are made in the resin layer with laser light or ultraviolet light. Then, the electrical connection holes are plated with copper, and connections between wirings located above and below the electrical connection holes are made via a resin layer.
【０００３】近年、上記ビルドアップの技術を発展させ
て、アラミド繊維不織布プリプレグを絶縁層に用いる技
術が注目されている。この技術は、前記プリプレグの所
定箇所にレーザ光により電気接続用穴を開け、銅粒子と
液状樹脂を主体としたペースト状導電材料を充填してお
く。そうすると、アラミド繊維不織布プリプレグが硬化
して形成された絶縁層の所定位置にはペースト状導電材
料が固化してできた導体が配置されることになり、この
導体によって、絶縁層を介してその上下に位置する配線
間の接続をする（特開平５−１７５６５０号公報、特開
平７−１７６８４６号公報等）。この技術によれば、絶
縁層を介してその上下に位置する配線間の接続を、完全
なＩＶＨ（Interstitial Via Hole)によって実現した多
層プリント配線板を製造でき、ガラスエポキシ基板上に
樹脂層を重ねて絶縁層を形成し、銅メッキを施すビルド
アップ基板より一層高密度化が可能である。なぜなら、
ペースト状導電材料が固化してできた導体の直上にさら
にＩＶＨを形成できるからである。しかし、銅粒子と液
状樹脂を主体としたペースト状導電材料が硬化した導体
は、銅粒子同士の表面接触によって導電性を維持してい
るため、ＩＶＨの小径化を図る（導体を細くする）こと
と、当該導体の導電性を確保する（低電気抵抗にする）
こととは、目的が互に矛盾し双方を同時に実現すること
は非常に難しい。銅粒子の含有率を上げて導体の導電性
を高めようとすると、ペースト状導電材料の粘度が上が
り電気接続用穴への充填が難しくなるばかりでなく、そ
の導体とプリント配線との接着力が低下するため、部品
実装時にプリント配線(ランド)の剥離が発生しやすくな
る。In recent years, a technique of using aramid fiber non-woven fabric prepreg for an insulating layer has been attracting attention by developing the above build-up technique. According to this technique, a hole for electric connection is made in a predetermined portion of the prepreg by a laser beam, and a paste-like conductive material mainly containing copper particles and a liquid resin is filled. Then, a conductor formed by solidifying the paste-like conductive material is disposed at a predetermined position of the insulating layer formed by curing the aramid fiber nonwoven prepreg, and the conductor is placed above and below the insulating layer via the insulating layer. (See, for example, JP-A-5-175650, JP-A-7-176846). According to this technology, it is possible to manufacture a multilayer printed wiring board in which connection between wirings located above and below the insulating layer is realized by complete IVH (Interstitial Via Hole), and a resin layer is laminated on a glass epoxy substrate. Higher density than a build-up substrate on which an insulating layer is formed and plated with copper. Because
This is because the IVH can be further formed immediately above the conductor formed by solidifying the paste-like conductive material. However, since the conductor in which the paste-like conductive material mainly composed of the copper particles and the liquid resin is hardened maintains the conductivity by the surface contact between the copper particles, the diameter of the IVH should be reduced (the conductor is made thinner). And ensure the conductivity of the conductor (low electrical resistance)
That is, it is very difficult to achieve both goals simultaneously and achieve both at the same time. When the content of copper particles is increased to increase the conductivity of the conductor, not only does the viscosity of the paste-like conductive material increase, making it difficult to fill the holes for electrical connection, but also increasing the adhesive strength between the conductor and the printed wiring. As a result, the printed wiring (land) is likely to peel off during component mounting.
【０００４】この問題点を解決するため、特開平１０−
１４４１３９号公報に開示された技術では、銅粒子など
の導電性粒子の全部又は一部を液体金属に置き換えてい
る。これにより、ペースト状導電材料の粘度を上げるこ
となく、ペースト状導電材料が固化した導体の導電性を
上げることができる。In order to solve this problem, Japanese Patent Laid-Open No.
In the technique disclosed in Japanese Patent No. 144139, all or a part of conductive particles such as copper particles is replaced with a liquid metal. Thereby, the conductivity of the conductor in which the paste-like conductive material is solidified can be increased without increasing the viscosity of the paste-like conductive material.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、液体金
属を含有した上記導体は、銅箔などからなるプリント配
線との接着が弱く、部品実装時の層間剥離を防止するこ
とができない。さらに、液状の樹脂と液体金属を混練し
て導電性ペーストを調製するため、液体金属が十分に導
電性粒子表面に付着せず、十分な導通信頼性を得ること
ができなかった。本発明が解決しようとする課題は、絶
縁層を介する配線間の接続を、当該絶縁層に開けた穴に
充填した導電材料で行なう構成において、この導電材料
を用いたプリント配線板の接続信頼性を高めることであ
る。However, the conductor containing a liquid metal has a weak adhesion to a printed wiring made of copper foil or the like, and cannot prevent delamination during component mounting. Furthermore, since the conductive paste is prepared by kneading the liquid resin and the liquid metal, the liquid metal does not sufficiently adhere to the surface of the conductive particles, so that sufficient conduction reliability cannot be obtained. An object of the present invention is to provide a configuration in which a connection between wirings via an insulating layer is performed by a conductive material filled in a hole formed in the insulating layer, and the connection reliability of a printed wiring board using the conductive material is reduced. Is to increase.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するた
め、本発明に係る接続用導電材料は、熱溶融可能な導電
性粒子と熱硬化性樹脂を含有する。この熱溶融可能な導
電性粒子が、当該導電材料を用いる配線板の製造工程で
加えられる温度以下で且つ１００℃以上の固相溶融温度
を有することを特徴とする。本発明に係る接続用導電材
料は、好ましくはゴム弾性有機質粒子を含有する。Means for Solving the Problems In order to solve the above problems, a conductive material for connection according to the present invention contains conductive particles that can be melted by heat and a thermosetting resin. The heat-fusible conductive particles are characterized in that they have a solid-state melting temperature of 100 ° C. or higher, which is lower than the temperature applied in the process of manufacturing a wiring board using the conductive material. The conductive material for connection according to the present invention preferably contains rubber elastic organic particles.
【０００７】このような接続用導電材料を用いて、次の
ような工程でプリント配線板を製造する。まず、シート
状繊維基材に熱硬化性樹脂を含浸乾燥して得たプリプレ
グの所定位置に貫通穴を開け、当該穴に上記の接続用導
電材料を充填する。このプリプレグの両側に金属箔を載
置し加熱加圧成形により両面金属箔張り積層板を製造す
る。このとき、前記加熱加圧により接続用導電材料中の
熱溶融可能な導電性粒子を溶融させ圧縮すると共に熱硬
化性樹脂を硬化させ導体とする。この導体は、前記プリ
プレグが硬化してなる絶縁層を貫通する導体となる。図
１（ａ）は、積層板成形前のプリプレグ１に開けた穴２
に接続用導電材料を充填した状態を示している。導電性
粒子３は、互いの表面が単に接触した状態にある。ま
た、図示していないが、導電性粒子間には硬化前の熱硬
化性樹脂が存在している。４はプリプレグの両側に載置
した金属箔である。図１（ｂ）は、積層板成形後の状態
を示している。導電性粒子は積層板成形時の熱で溶融し
圧力で圧縮され互いが結合して良好な導電性の導体５を
形成している。この導体５は、プリプレグが硬化して形
成された絶縁層６を貫通しており、両面の金属箔４に接
着している。接着は、接続用導電材料に含まれる熱硬化
性樹脂の硬化により達成される。この熱硬化性樹脂は、
導体５中で海島構造（熱硬化性樹脂が島）の状態で存在
している。また、図２は、接続用導電材料としてゴム弾
性有機質粒子を含有するものを用いた場合を示してい
る。図から明らかなように、ゴム弾性有機質粒子７は絶
縁層６と導体５の間や導体５中に存在し、温度変化に伴
う導体５の熱応力を緩和する機能を果たしている。そし
て、前記成形した両面金属箔張り積層板の金属箔をエッ
チング加工して所定の配線回路を形成し、絶縁層を介し
て配置された配線間が前記導体により接続されたプリン
ト配線板とする。A printed wiring board is manufactured using the conductive material for connection in the following steps. First, a through hole is formed at a predetermined position of a prepreg obtained by impregnating and drying a sheet-like fiber base material with a thermosetting resin, and the hole is filled with the above-described conductive material for connection. A metal foil is placed on both sides of the prepreg, and a double-sided metal foil-clad laminate is manufactured by heat and pressure molding. At this time, the heat and pressure melts and compresses the thermally fusible conductive particles in the conductive material for connection, and also cures the thermosetting resin to form a conductor. This conductor is a conductor that penetrates the insulating layer formed by curing the prepreg. FIG. 1A shows a hole 2 formed in a prepreg 1 before forming a laminate.
Shows a state filled with a conductive material for connection. The conductive particles 3 are in a state where their surfaces are simply in contact with each other. Although not shown, a thermosetting resin before curing exists between the conductive particles. Reference numeral 4 denotes a metal foil placed on both sides of the prepreg. FIG. 1B shows a state after the laminate is formed. The conductive particles are melted by heat at the time of molding the laminate, compressed by pressure, and bonded together to form a good conductive conductor 5. The conductor 5 penetrates the insulating layer 6 formed by curing the prepreg, and adheres to the metal foils 4 on both surfaces. The adhesion is achieved by curing a thermosetting resin contained in the conductive material for connection. This thermosetting resin is
The conductor 5 exists in a sea-island structure (thermosetting resin is an island) in the conductor 5. FIG. 2 shows a case where a material containing rubber elastic organic particles is used as the conductive material for connection. As is clear from the figure, the rubber elastic organic particles 7 exist between the insulating layer 6 and the conductor 5 and in the conductor 5, and have a function of relieving the thermal stress of the conductor 5 due to a temperature change. Then, a predetermined wiring circuit is formed by etching the formed metal foil of the double-sided metal foil-clad laminate, and a printed wiring board is provided in which the wiring arranged via an insulating layer is connected by the conductor.
【０００８】上記のプリント配線板の製造では、接続用
導電材料に含まれる導電性粒子の固相溶融温度を積層板
成形時の加熱温度以下に設定して、導電性粒子が積層板
成形時の加熱により溶融し導体を形成するようにしてい
る。しかし、接続用導電材料中の導電性粒子は、プリン
ト配線板に部品実装をして完成品となるまでに溶融すれ
ばよいので、導電性粒子の固相溶融温度を、部品実装の
ための半田付け温度など積層板成形時の温度より高い温
度に設定することは差し支えない。本発明に係る接続用
導電材料においては、導電性粒子の固相溶融温度を、配
線板の製造工程で加えられる最も高い温度以下に設定す
ればよいわけである。尚、導電性粒子の固相溶融温度を
低く設定しすぎると、プリント配線板使用時に加わる熱
ストレスによって、導体５を構成する金属の結晶粒界粗
大化が著しく、接続信頼性が低下することになる。従っ
て、導電性粒子５の固相溶融温度を１００℃以上に設定
する。In the manufacture of the above printed wiring board, the solid-state melting temperature of the conductive particles contained in the conductive material for connection is set to be equal to or lower than the heating temperature at the time of forming the laminate, and the conductive particles are heated at the time of forming the laminate. The conductor is melted by heating to form a conductor. However, the conductive particles in the conductive material for connection need only be melted by mounting components on the printed wiring board until a finished product is obtained. It is possible to set a temperature higher than the temperature at the time of molding the laminate, such as the attachment temperature. In the conductive material for connection according to the present invention, the solid-phase melting temperature of the conductive particles may be set to be equal to or lower than the highest temperature applied in the manufacturing process of the wiring board. If the solid phase melting temperature of the conductive particles is set too low, the thermal stress applied when the printed wiring board is used significantly increases the crystal grain boundary of the metal constituting the conductor 5 and significantly reduces the connection reliability. Become. Therefore, the solid-phase melting temperature of the conductive particles 5 is set to 100 ° C. or higher.
【０００９】[0009]
【発明の実施の形態】本発明に係る接続用導電材料は、
導電性粒子と熱硬化性樹脂を混練してペースト状に調製
する。導電性粒子は、固層溶融温度が３１０℃以下の金
属単独もしくは固層溶融温度が３１０℃以下になるよ
う、２種類以上の金属を組み合せた合金が望ましい。固
層溶融温度が３１０℃を越えると、導電材料を溶融する
際、熱硬化性樹脂が劣化する場合がある。固相溶融温度
１００℃以上で、且つ、配線板製造工程において加えら
れる熱により溶融する導電性の材料であれば特に限定す
るものではないが、溶融したときに、配線を構成する金
属に対して濡れが良好で、導体を形成した後には靱性を
有する材料を選択するのがよい。導電性粒子と共に配合
する熱硬化性樹脂は、特に限定するものではないが、無
溶剤でペースト状の接続用導電材料を調製でき、且つ、
硬化時に水やアンモニアなどの揮発成分が発生しないも
のが望ましい。常温で液状の熱硬化性樹脂は好ましいも
のである。この熱硬化性樹脂には、一般的に知られてい
る硬化剤や硬化促進剤を配合する場合が多い。本発明に
係る接続用導電材料は、スクリーン印刷等により穴に充
填する。分散剤を添加することにより、印刷等の条件に
併せて導電材料の粘度挙動を制御することができる。導
電材料には、シリカ等の無機充填材、着色剤などを必要
に応じて添加することを妨げない。BEST MODE FOR CARRYING OUT THE INVENTION The connecting conductive material according to the present invention comprises:
The conductive particles and the thermosetting resin are kneaded to prepare a paste. The conductive particles are desirably a metal having a solid phase melting temperature of 310 ° C. or lower alone or an alloy in which two or more metals are combined so that the solid phase melting temperature is 310 ° C. or lower. If the solid phase melting temperature exceeds 310 ° C., the thermosetting resin may deteriorate when the conductive material is melted. The solid-phase melting temperature is 100 ° C. or higher, and is not particularly limited as long as it is a conductive material that is melted by heat applied in a wiring board manufacturing process. It is preferable to select a material that has good wettability and has toughness after the conductor is formed. The thermosetting resin to be mixed with the conductive particles is not particularly limited, but a paste-like conductive material for connection can be prepared without a solvent, and
Desirable are those which do not generate volatile components such as water and ammonia during curing. Thermosetting resins that are liquid at room temperature are preferred. The thermosetting resin often contains a generally known curing agent or curing accelerator. The conductive material for connection according to the present invention is filled in the hole by screen printing or the like. By adding a dispersant, the viscosity behavior of the conductive material can be controlled according to the conditions such as printing. It does not prevent addition of an inorganic filler such as silica, a coloring agent, and the like to the conductive material as needed.
【００１０】導電性粒子は、平均粒径が好ましくは１０
０μｍ以下である。これによって、導電材料をスクリー
ン印刷等により径３００μｍ以下の穴に支障なく充填す
ることができる。また、導電材料には、ゴム弾性有機質
粒子を配合することが望ましい。ゴム弾性有機質粒子
は、導電材料で構成された導体が熱ストレスを受けたと
きに金属の結晶粒界粗大化により脆弱化するのを抑制す
る。脆弱化の抑制は、接続信頼性の向上につながる。脆
弱化抑制の効果を十分に発揮させるためには、熱硬化性
樹脂１００重量部に対してゴム弾性有機質粒子の含有量
を２重量部以上にするのが望ましい。導体の導電性を十
分に確保する上では、ゴム弾性有機質粒子の平均粒径を
５０μｍ以下にするのが望ましい。ゴム弾性有機質粒子
は、アクリル系ゴム微粒子、ニトリル系ゴム微粒子、シ
リコーン系ゴム粒子、コア−シェル系ゴム粒子などであ
る。The conductive particles preferably have an average particle size of 10
0 μm or less. Thereby, the conductive material can be filled into the hole having a diameter of 300 μm or less without any trouble by screen printing or the like. Further, it is desirable to mix rubber elastic organic particles with the conductive material. The rubber elastic organic particles prevent the conductor made of a conductive material from becoming brittle due to coarsening of the metal grain boundaries when subjected to thermal stress. Suppression of weakening leads to improvement in connection reliability. In order to sufficiently exhibit the effect of suppressing brittleness, the content of the rubber elastic organic particles is desirably 2 parts by weight or more based on 100 parts by weight of the thermosetting resin. In order to sufficiently secure the conductivity of the conductor, it is desirable that the average particle size of the rubber elastic organic particles be 50 μm or less. The rubber elastic organic particles include acrylic rubber fine particles, nitrile rubber fine particles, silicone rubber particles, and core-shell rubber particles.
【００１１】プリント配線板の製造は、上記の接続用導
電材料を用いて、次のような工程で実施する。まず、シ
ート状繊維基材に熱硬化性樹脂を含浸乾燥して得たプリ
プレグの所定位置にドリルもしくはレーザ光の照射によ
り貫通穴を開け、当該穴に上記の接続用導電材料を充填
する。シート状繊維基材は、ガラス繊維織布、ガラス繊
維不織布、有機繊維不織布などである。このプリプレグ
の両側に金属箔（銅箔やニッケル箔）を載置し加熱加圧
成形により両面金属箔張り積層板を製造する。このと
き、前記加熱加圧により接続用導電材料中の熱溶融可能
な導電性粒子を溶融し圧縮すると共に熱硬化性樹脂を硬
化させる。この導体は、前記プリプレグが硬化してなる
絶縁層を貫通する導体となる。上記成形した両面金属箔
張り積層板の金属箔をエッチング加工して所定の配線回
路を形成し、絶縁層を介して配置された配線間が前記導
体により接続されたプリント配線板とする。The printed wiring board is manufactured in the following steps using the above-mentioned conductive material for connection. First, a through-hole is opened at a predetermined position of a prepreg obtained by impregnating and drying a thermosetting resin in a sheet-like fiber base material, and then drilling or irradiating a laser beam to fill the hole with the conductive material for connection. The sheet-like fiber substrate is a glass fiber woven fabric, a glass fiber nonwoven fabric, an organic fiber nonwoven fabric, or the like. A metal foil (a copper foil or a nickel foil) is placed on both sides of the prepreg, and a double-sided metal foil-clad laminate is manufactured by heat and pressure molding. At this time, the heat-pressurization melts and compresses the heat-fusible conductive particles in the conductive material for connection and cures the thermosetting resin. This conductor is a conductor that penetrates the insulating layer formed by curing the prepreg. A predetermined wiring circuit is formed by etching the formed metal foil of the double-sided metal foil-clad laminate, and a printed wiring board in which wiring arranged via an insulating layer is connected by the conductor.
【００１２】上記の接続用導電材料を用いるプリント配
線板の別の製造方法は、まず、シート状繊維基材に熱硬
化性樹脂を含浸乾燥して得たプリプレグの所定位置に貫
通穴を開け、当該穴に接続用導電材料を充填する。別途
準備した配線板の両側又は片側に、前記プリプレグを介
して金属箔を載置し加熱加圧成形により金属箔張り積層
板を製造し、前記加熱加圧により接続用導電材料中の熱
溶融可能な導電性粒子を溶融し圧縮すると共に熱硬化性
樹脂を硬化させて、前記プリプレグが硬化してなる絶縁
層を貫通する導体を形成する。次に、金属箔張り積層板
の金属箔をエッチング加工して所定の配線回路を形成す
る工程を経て、絶縁層を介して配置された配線間を前記
導体により接続したプリント配線板とする。このように
作製されたプリント配線板上に、部品を搭載し半田付け
をするためにフロー半田付け装置やリフロー半田付け装
置でプリント配線板を加熱し、部品を実装すると同時に
接続用導電材料を再度溶融して接続を確実にする。尚、
導電性粒子の溶融を上記の金属箔張り積層板の製造工程
では行なわず（導電性粒子の圧縮だけをする）、前記半
田付け工程において初めて導電性粒子の溶融を行なうよ
うにしてもよい。この発明の実施の形態では、別途準備
した配線板上に形成する絶縁層を、プリプレグで構成し
ているが、シリコーンゴムフィルム、ポリイミドフィル
ムなどの有機フィルムで構成することもできる。この場
合、有機フィルムの所定箇所に穴を開けて接続用導電材
料を充填する。Another method of manufacturing a printed wiring board using the above-mentioned conductive material for connection is as follows. First, a through hole is formed at a predetermined position of a prepreg obtained by impregnating and drying a thermosetting resin in a sheet-like fiber base material, The hole is filled with a conductive material for connection. On both sides or one side of a separately prepared wiring board, a metal foil is placed via the prepreg, and a metal foil-clad laminate is manufactured by heating and pressing, and heat melting in the conductive material for connection is possible by the heating and pressing. The conductive particles are melted and compressed, and the thermosetting resin is cured to form a conductor penetrating the insulating layer formed by curing the prepreg. Next, through a step of forming a predetermined wiring circuit by etching the metal foil of the metal foil-clad laminate, a printed wiring board is obtained in which the wiring arranged via the insulating layer is connected by the conductor. On the printed wiring board thus manufactured, the printed wiring board is heated by a flow soldering device or a reflow soldering device in order to mount and solder the components, and at the same time as mounting the components, reconnect the conductive material for connection again. Melts to ensure connection. still,
The melting of the conductive particles may not be performed in the manufacturing process of the metal foil-clad laminate (only the conductive particles are compressed), and the conductive particles may be melted for the first time in the soldering process. In the embodiment of the present invention, the insulating layer formed on a separately prepared wiring board is made of a prepreg, but may be made of an organic film such as a silicone rubber film or a polyimide film. In this case, a hole is made in a predetermined portion of the organic film and the conductive material for connection is filled.
【００１３】[0013]
【実施例】以下に具体的な実施例を用いて本発明を詳し
く説明する。 実施例１〜１０と比較例１ 表１に示した合金の成分組成と固相溶融温度と平均粒径
を有する各種導電性粒子を準備した。また、常温で液状
のエポキシ樹脂（エポキシ当量１９０，油化シェル製
「Ｅｐ−８２８」）５５重量部と硬化剤として無水メチ
ルナジック酸（日立化成製）４４重量部と硬化促進剤と
して２−エチル−４−メチルイミダゾール１重量部を配
合したエポキシ樹脂組成物を準備した。さらに、平均粒
径が３μｍ，１０μｍ，１２μｍの各シリコーン系ゴム
粒子（東レ・ダウコーニング・シリコーン製）を準備し
た。上記各導電性粒子とエポキシ樹脂組成物と必要に応
じてシリコーン系ゴム粒子を、表２に示す各配合割合で
３本ロールミルにより混練し、揮発性の溶剤を含まない
ペースト状導電材料を調製した。次に、アラミド繊維不
織布にエポキシ樹脂を含浸乾燥して製造した１４０μｍ
厚のプリプレグの所定箇所にレーザ光を照射して２００
μｍ径の電気接続用穴を形成し、この電気接続用穴に表
２に示した各配合組成のペースト状導電材料を充填し
た。そして、このプリプレグの両側に銅箔を重ね、表２
に示した各積層温度と４０kg／cm2の圧力で加熱加圧成
形して両面銅張り積層板を製造した。両面の銅箔を所定
の配線回路にエッチング加工し、前記加熱加圧成形の工
程でペースト状導電材料が固化した導体により両面の配
線が接続されているプリント配線板を製造した。このプ
リント配線板をリフロー半田付け装置に通し加熱した。
実施例４では、リフロー半田付け装置に通したときに初
めて導電性粒子が溶融する。他の実施例と比較例１で
は、両面銅張り積層板の製造工程で導電性粒子が溶融
し、リフロー半田付け装置に通したときに再度溶融す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to specific embodiments. Examples 1 to 10 and Comparative Example 1 Various conductive particles having the component compositions, solid-state melting temperatures, and average particle diameters of the alloys shown in Table 1 were prepared. 55 parts by weight of a liquid epoxy resin at room temperature (epoxy equivalent: 190, "Ep-828" manufactured by Yuka Shell), 44 parts by weight of methylnadic anhydride (manufactured by Hitachi Chemical) as a curing agent, and 2-ethyl as a curing accelerator An epoxy resin composition containing 1 part by weight of -4-methylimidazole was prepared. Furthermore, silicone rubber particles (manufactured by Dow Corning Toray Silicone) having an average particle diameter of 3 μm, 10 μm, and 12 μm were prepared. Each of the conductive particles, the epoxy resin composition, and, if necessary, the silicone rubber particles were kneaded by a three-roll mill at each mixing ratio shown in Table 2 to prepare a paste-like conductive material containing no volatile solvent. . Next, aramid fiber nonwoven fabric was impregnated with epoxy resin and dried to produce 140 μm
A predetermined portion of the thick prepreg is irradiated with a laser beam for 200
A hole for electric connection having a diameter of μm was formed, and the hole for electric connection was filled with a paste-like conductive material having each composition shown in Table 2. Then, copper foil was placed on both sides of this prepreg,
The two- sided copper-clad laminate was manufactured by heating and pressing at each laminating temperature and at a pressure of 40 kg / cm 2 shown in FIG. The copper foil on both sides was etched into a predetermined wiring circuit, and a printed wiring board in which the wiring on both sides was connected by a conductor in which the paste-like conductive material was solidified in the heating and pressing step was manufactured. This printed wiring board was passed through a reflow soldering apparatus and heated.
In the fourth embodiment, the conductive particles are melted only when the conductive particles pass through the reflow soldering device. In other examples and Comparative Example 1, the conductive particles are melted in the manufacturing process of the double-sided copper-clad laminate and melted again when passed through the reflow soldering apparatus.
【００１４】従来例１ 導電性粒子として銅粒子（平均粒径２０μｍ）を用い、
これと上記実施例で用いたエポキシ樹脂組成物を表２に
示す配合割合で３本ロールミルにより混練し、揮発性の
溶剤を含まないペースト状導電材料を調製した。このペ
ースト状導電材料を用いて、以下、上記の実施例と同様
にプリント配線板を製造した。尚、銅張り積層板成形の
積層温度を１７０℃、圧力を４０kg／cm2とした。Conventional Example 1 Copper particles (average particle diameter 20 μm) were used as conductive particles.
This and the epoxy resin composition used in the above example were kneaded in a mixing ratio shown in Table 2 by a three-roll mill to prepare a paste-like conductive material containing no volatile solvent. Using this paste-like conductive material, a printed wiring board was manufactured in the same manner as in the above examples. The laminating temperature for forming the copper-clad laminate was 170 ° C. and the pressure was 40 kg / cm 2 .
【００１５】従来例２ 導電性粒子として銅粒子（平均粒子径２０μｍ）を用
い、これと上記実施例で用いたエポキシ樹脂組成物と液
体金属（Ｇａ−Ｓｎ合金）を表２に示す配合割合で３本
ロールミルにより混練し、揮発性の溶剤を含まないペー
スト状導電材料を調製した。このペースト状導電材料を
用いて、以下、上記の実施例と同様にプリント配線板を
製造した。尚、銅張り積層板成形の積層温度を１７０
℃、圧力を４０kg／cm2とした。Conventional Example 2 Copper particles (average particle diameter: 20 μm) were used as the conductive particles, and the epoxy resin composition and the liquid metal (Ga—Sn alloy) used in the above examples were mixed in the mixing ratio shown in Table 2. The mixture was kneaded with a three-roll mill to prepare a paste-like conductive material containing no volatile solvent. Using this paste-like conductive material, a printed wiring board was manufactured in the same manner as in the above examples. The lamination temperature of the copper-clad laminate was set to 170
° C and the pressure were 40 kg / cm 2 .
【００１６】上記各例のプリント配線板において、ペー
スト状導電材料が固化してなる導体によって接続された
配線の接続信頼性を評価した結果を表２示す。この評価
試験は熱衝撃試験であり、ペースト状導電材料が固化し
てなる導体によって両面の配線を順次直列接続した配線
パターン（導体１００００個による直列接続）を形成
し、−５０℃と８０℃の冷熱サイクルを５０００サイク
ル行なった後に、試験前の抵抗値と試験後の抵抗値に基
づいて、抵抗変化量を次の（式１）で計算した。Table 2 shows the results of evaluating the connection reliability of the wiring connected by the conductor formed by solidifying the paste-like conductive material in the printed wiring board of each of the above examples. This evaluation test is a thermal shock test in which a wiring pattern (series connection by 10,000 conductors) in which wirings on both sides are connected in series by a conductor obtained by solidifying a paste-like conductive material is formed. After 5000 thermal cycles, the resistance change was calculated by the following (Equation 1) based on the resistance before the test and the resistance after the test.
【００１７】[0017]
【数1】 (Equation 1)
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【表２】 [Table 2]
【００２０】[0020]
【発明の効果】以上の結果より、本発明に係る導電材料
は、配線板の製造工程で加えられる温度以下で熱溶融可
能な導電性粒子の固相溶融温度を１００℃以上にするこ
とにより、熱衝撃に強い接続信頼性の高い導体を形成で
きる（実施例１〜４と比較例１の対照）。熱溶融可能な
導電性粒子の平均粒子径を１００μｍ以下にすれば、接
続信頼性をさらに高めることができる（実施例３，８と
実施例９の対照）。また、ゴム弾性有機質粒子を含有さ
せると、接続信頼性を高めることができる（実施例５〜
７，１０，１１と実施例３の対照）。そして、ゴム弾性
有機質粒子の配合量が２重量部以上のときに接続信頼性
の効果が顕著になる（実施例６，７と実施例５の対
照）。さらに、ゴム弾性有機質粒子の平均粒子径が５０
μｍ以下のときに接続信頼性の効果が顕著になる（実施
例７，１０と実施例１１の対照）。According to the above results, the conductive material according to the present invention has a solid phase melting temperature of 100 ° C. or higher of the conductive particles which can be melted at a temperature lower than the temperature applied in the manufacturing process of the wiring board. A conductor with high connection reliability that is resistant to thermal shock can be formed (Comparative Examples 1 to 4 and Comparative Example 1). If the average particle diameter of the heat-fusible conductive particles is set to 100 μm or less, the connection reliability can be further improved (Comparative Examples 3 and 8 and Example 9). When rubber elastic organic particles are contained, connection reliability can be improved (Examples 5 to 5).
7, 10, 11 and control of Example 3). When the blending amount of the rubber elastic organic particles is 2 parts by weight or more, the effect of the connection reliability becomes remarkable (control of Examples 6, 7 and Example 5). Further, the average particle size of the rubber elastic organic particles is 50
The effect of connection reliability becomes remarkable when the thickness is equal to or less than μm (a comparison between Examples 7 and 10 and Example 11).
【図1】本発明に係る接続用導電材料を用いてプリント
配線板を製造するときに、当該接続用導電材料がどのよ
うに変化するかを示す断面説明図である。FIG. 1 is an explanatory cross-sectional view showing how the conductive material for connection changes when a printed wiring board is manufactured using the conductive material for connection according to the present invention.
【図2】本発明に係る別の接続用導電材料を用いてプリ
ント配線板を製造するときに、当該接続用導電材料がど
のように変化するかを示す断面説明図である。FIG. 2 is an explanatory cross-sectional view showing how the conductive material for connection changes when a printed wiring board is manufactured using another conductive material for connection according to the present invention.
１はプリプレグ ２は穴 ３は導電性粒子 ４は金属箔 ５は導体 ６は絶縁層 ７はゴム弾性有機質粒子 1 is a prepreg 2 is a hole 3 is a conductive particle 4 is a metal foil 5 is a conductor 6 is an insulating layer 7 is a rubber elastic organic particle
フロントページの続き Ｆターム(参考） 4E351 AA03 AA04 BB01 BB31 BB35 BB38 BB49 CC12 CC16 CC20 CC22 CC31 DD04 DD21 DD52 DD53 DD58 EE02 EE03 EE06 GG02 GG03 GG08 5E317 AA21 AA24 AA27 BB02 BB03 BB12 BB18 BB19 CC15 CC22 CC25 CC51 CD21 CD27 CD32 GG03 GG05 GG09 Continued on the front page F term (reference) 4E351 AA03 AA04 BB01 BB31 BB35 BB38 BB49 CC12 CC16 CC20 CC22 CC31 DD04 DD21 DD52 DD53 DD58 EE02 EE03 EE06 GG02 GG03 GG08 5E317 AA21 AA24 AA27 BB02 BB03 CC19 GG05 GG09
Claims (9)
層に開けた穴において接続するための導電材料であっ
て、熱溶融可能な導電性粒子と熱硬化性樹脂を含有し、 前記導電性粒子が、当該導電材料を用いる配線板の製造
工程で加えられる温度以下で且つ１００℃以上の固相溶
融温度を有することを特徴とする絶縁層を介する配線間
の接続用導電材料。1. A conductive material for connecting wirings arranged via an insulating layer in a hole formed in the insulating layer, the conductive material containing heat-fusible conductive particles and a thermosetting resin, The conductive material for connection between wirings via an insulating layer, wherein the conductive particles have a solid-state melting temperature of 100 ° C. or higher at a temperature not higher than a temperature applied in a manufacturing process of a wiring board using the conductive material.
であることを特徴とする請求項１記載の絶縁層を介する
配線間の接続用導電材料。2. The conductive material for connection between wirings via an insulating layer according to claim 1, wherein the average particle size of the conductive particles is 100 μm or less.
とする請求項１又は２記載の絶縁層を介する配線間の接
続用導電材料。3. The conductive material for connection between wirings via an insulating layer according to claim 1, wherein the conductive material contains rubber elastic organic particles.
以下であることを特徴とする請求項３記載の絶縁層を介
する配線間の接続用導電材料。4. The rubber elastic organic particles have an average particle size of 50 μm.
The conductive material for connection between wirings via an insulating layer according to claim 3, wherein:
弾性有機質粒子の含有量が、２重量部以上であることを
特徴とする請求項３又は４記載の絶縁層を介する配線間
の接続用導電材料。5. The method according to claim 3, wherein the content of the rubber elastic organic particles is at least 2 parts by weight based on 100 parts by weight of the thermosetting resin. Conductive material for connection.
燥して得たプリプレグの所定位置に貫通穴を開け、当該
穴に請求項１〜５のいずれかに記載の接続用導電材料を
充填する工程、 前記プリプレグの両側に金属箔を載置し加熱加圧成形に
より両面金属箔張り積層板を製造し、前記加熱加圧によ
り接続用導電材料中の熱溶融可能な導電性粒子を溶融さ
せ圧縮すると共に熱硬化性樹脂を硬化させて、前記プリ
プレグが硬化してなる絶縁層を貫通する導体を形成する
工程、両面金属箔張り積層板の金属箔をエッチング加工
して所定の配線回路を形成する工程を経て、 絶縁層を介して配置された配線間を前記導体により接続
したことを特徴とするプリント配線板の製造法。6. A conductive material for connection according to any one of claims 1 to 5, wherein a through-hole is formed in a predetermined position of a prepreg obtained by impregnating and drying a sheet-like fiber base material with a thermosetting resin. Filling a metal foil on both sides of the prepreg, producing a double-sided metal foil-clad laminate by heat and pressure molding, and heat-fusible conductive particles in the conductive material for connection by the heat and pressure. Melting and compressing and curing the thermosetting resin to form a conductor penetrating the insulating layer formed by curing the prepreg; etching a metal foil of a double-sided metal foil-clad laminate to form a predetermined wiring circuit; A method of manufacturing a printed wiring board, wherein wirings arranged via an insulating layer are connected by the conductor through a step of forming a printed wiring board.
燥して得たプリプレグの所定位置に貫通穴を開け、当該
穴に請求項１〜５のいずれかに記載の接続用導電材料を
充填する工程、 前記プリプレグの両側に金属箔を載置し加熱加圧成形に
より両面金属箔張り積層板を製造し、前記加熱加圧によ
り接続用導電材料中の熱溶融可能な導電性粒子を圧縮す
ると共に熱硬化性樹脂を硬化させて、前記プリプレグが
硬化してなる絶縁層を貫通する導体を形成する工程、両
面金属箔張り積層板の金属箔をエッチング加工して所定
の配線回路を形成する工程及び熱溶融可能な導電性粒子
を溶融させる工程経て、 絶縁層を介して配置された配線間を前記導体により接続
したことを特徴とするプリント配線板の製造法。7. A conductive material for connection according to any one of claims 1 to 5, wherein a through-hole is formed at a predetermined position of a prepreg obtained by impregnating and drying a thermosetting resin in a sheet-like fiber base material. Filling a metal foil on both sides of the prepreg, producing a double-sided metal foil-clad laminate by heat and pressure molding, and heat-fusible conductive particles in the conductive material for connection by the heat and pressure. Compressing and curing the thermosetting resin to form a conductor that penetrates the insulating layer formed by curing the prepreg, forming a predetermined wiring circuit by etching the metal foil of the double-sided metal foil-clad laminate And a step of melting the thermally fusible conductive particles, wherein the wiring arranged via an insulating layer is connected by the conductor.
燥して得たプリプレグの所定位置に貫通穴を開け、当該
穴に請求項１〜５のいずれかに記載の接続用導電材料を
充填する工程、 別途準備した配線板の両側又は片側に、前記プリプレグ
を介して金属箔を載置し加熱加圧成形により金属箔張り
積層板を製造し、前記加熱加圧により接続用導電材料中
の熱溶融可能な導電性粒子を溶融させ圧縮すると共に熱
硬化性樹脂を硬化させて、前記プリプレグが硬化してな
る絶縁層を貫通する導体を形成する工程、 金属箔張り積層板の金属箔をエッチング加工して所定の
配線回路を形成する工程を経て、 絶縁層を介して配置された配線間を前記導体により接続
したことを特徴とするプリント配線板の製造法。8. A conductive material for connection according to any one of claims 1 to 5, wherein a through hole is formed at a predetermined position of a prepreg obtained by impregnating and drying a sheet-like fiber base material with a thermosetting resin. A metal foil is placed on both sides or one side of a separately prepared wiring board via the prepreg, and a metal foil-clad laminate is manufactured by heating and pressing, and the conductive material for connection is formed by the heating and pressing. Melting and compressing the heat-fusible conductive particles therein and curing the thermosetting resin to form a conductor penetrating the insulating layer formed by curing the prepreg; a metal foil of a metal foil-clad laminate A method of manufacturing a printed wiring board, wherein wirings arranged via an insulating layer are connected by the conductors through a process of forming a predetermined wiring circuit by etching.
燥して得たプリプレグの所定位置に貫通穴を開け、当該
穴に請求項１〜５のいずれかに記載の接続用導電材料を
充填する工程、 別途準備した配線板の両側又は片側に、前記プリプレグ
を介して金属箔を載置し加熱加圧成形により金属箔張り
積層板を製造し、前記加熱加圧により接続用導電材料中
の熱溶融可能な導電性粒子を圧縮すると共に熱硬化性樹
脂を硬化させて、前記プリプレグが硬化してなる絶縁層
を貫通する導体を形成する工程、 金属箔張り積層板の金属箔をエッチング加工して所定の
配線回路を形成する工程及び熱溶融可能な導電性粒子を
溶融させる経て、 絶縁層を介して配置された配線間を前記導体により接続
したことを特徴とするプリント配線板の製造法。9. A conductive material for connection according to claim 1, wherein a through-hole is formed in a predetermined position of a prepreg obtained by impregnating and drying a thermosetting resin in a sheet-like fiber base material. A metal foil is placed on both sides or one side of a separately prepared wiring board via the prepreg, and a metal foil-clad laminate is manufactured by heating and pressing, and the conductive material for connection is formed by the heating and pressing. Compressing the heat-fusible conductive particles therein and curing the thermosetting resin to form a conductor that penetrates the insulating layer formed by curing the prepreg, etching the metal foil of the metal foil-clad laminate A process of forming a predetermined wiring circuit by processing and melting the conductive particles that can be melted by heat, and connecting the wirings arranged via an insulating layer by the conductors; Law.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24042798A JP3678015B2 (en) | 1998-08-26 | 1998-08-26 | Conductive material for connection between wirings through insulating layer and method for manufacturing wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24042798A JP3678015B2 (en) | 1998-08-26 | 1998-08-26 | Conductive material for connection between wirings through insulating layer and method for manufacturing wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000068619A true JP2000068619A (en) | 2000-03-03 |
| JP3678015B2 JP3678015B2 (en) | 2005-08-03 |
Family
ID=17059333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24042798A Expired - Fee Related JP3678015B2 (en) | 1998-08-26 | 1998-08-26 | Conductive material for connection between wirings through insulating layer and method for manufacturing wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3678015B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004303956A (en) * | 2003-03-31 | 2004-10-28 | Sekisui Chem Co Ltd | Printed circuit board manufacturing method |
-
1998
- 1998-08-26 JP JP24042798A patent/JP3678015B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004303956A (en) * | 2003-03-31 | 2004-10-28 | Sekisui Chem Co Ltd | Printed circuit board manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3678015B2 (en) | 2005-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6373000B2 (en) | Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board | |
| JP3375555B2 (en) | Circuit component built-in module and method of manufacturing the same | |
| JP3051700B2 (en) | Method of manufacturing multilayer wiring board with built-in element | |
| US8604350B2 (en) | Multilayer wiring substrate and manufacturing method of multilayer wiring substrate | |
| CN102884872B (en) | Multilayer wiring board and method for manufacturing multilayer wiring board | |
| JPH10256687A (en) | Conductor paste composition for filling via holes and printed wiring board using the same | |
| JP2008153693A (en) | Manufacturing method of circuit component built-in module | |
| JPH07176846A (en) | Composition of conductor paste for filling via hole, both-sided and multilayered printed board using it, and its manufacture | |
| JP2011176220A (en) | Wiring board, method of manufacturing wiring board, and via paste | |
| CN102792787A (en) | Multilayer wiring board, method for manufacturing multilayer wiring board, and via paste | |
| JP2011258838A (en) | Laminated circuit board, method of manufacturing the same, adhesive sheet, and method of manufacturing the same | |
| CN102893708A (en) | Wiring substrate, method for manufacturing wiring substrate, and via paste | |
| JP3461172B2 (en) | Method for manufacturing multilayer wiring circuit board | |
| JP4606685B2 (en) | Module with built-in circuit components | |
| EP1816653B1 (en) | Conductive paste and method for manufacturing multilayer printed wiring board using same | |
| EP1353541A1 (en) | Circuit board and production method therefor | |
| JP4468080B2 (en) | Conductive paste composition for multilayer wiring board | |
| JP4468081B2 (en) | Conductive paste composition for multilayer wiring board | |
| JP3501366B2 (en) | Conductive adhesive for via filling and method of manufacturing electronic device using the same | |
| JP3678015B2 (en) | Conductive material for connection between wirings through insulating layer and method for manufacturing wiring board | |
| JP4481734B2 (en) | Conductive paste composition for multilayer wiring board | |
| JP3728059B2 (en) | Multilayer wiring board | |
| JP2591447B2 (en) | Multilayer substrate and manufacturing method thereof | |
| JP2003273517A (en) | Multilayer circuit board and method of manufacturing the same | |
| JP2003273518A (en) | Multilayer circuit board and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050201 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050328 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050419 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050502 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090520 Year of fee payment: 4 |
|
| LAPS | Cancellation because of no payment of annual fees |