IN2014DN03368A - - Google Patents
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- Publication number
- IN2014DN03368A IN2014DN03368A IN3368DEN2014A IN2014DN03368A IN 2014DN03368 A IN2014DN03368 A IN 2014DN03368A IN 3368DEN2014 A IN3368DEN2014 A IN 3368DEN2014A IN 2014DN03368 A IN2014DN03368 A IN 2014DN03368A
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- IN
- India
- Prior art keywords
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- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Metal Rolling (AREA)
- Powder Metallurgy (AREA)
Abstract
Provided is a copper alloy comprising by mass% Zn at greater than 2.0% and 36.5% or less Sn at 0.1% to 0.9% Ni at 0.05% or more and less than 1.0% Fe at 0.001% or more and less than 0.10% P at 0.005% to 0.10% and the remainder including Cu and inevitable impurities wherein in atomic ratio 0.002=Fe/Ni<1.5 3<(Ni+Fe)/P<15 and 0.3<Sn/(Ni+Fe)<5 are satisfied as the content ratio of the elements the average particle size of a phase crystal particles including Cu Zn and Sn is 0.1 to 50 µm and a deposit comprising Fe and/or Ni and P is included.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012001177 | 2012-01-06 | ||
| JP2012203517 | 2012-09-14 | ||
| PCT/JP2013/050004 WO2013103149A1 (en) | 2012-01-06 | 2013-01-04 | Copper alloy for electronic/electric device, copper alloy thin plate for electronic/electric device, method for manufacturing copper alloy for electronic/electric device, and conductive part and terminal for electronic/electric device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014DN03368A true IN2014DN03368A (en) | 2015-06-26 |
Family
ID=48745206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN3368DEN2014 IN2014DN03368A (en) | 2012-01-06 | 2013-01-04 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US8951369B2 (en) |
| EP (2) | EP3284835A3 (en) |
| JP (1) | JP5303678B1 (en) |
| KR (1) | KR101437307B1 (en) |
| CN (2) | CN103502489B (en) |
| AU (1) | AU2013207042B2 (en) |
| CA (1) | CA2852084A1 (en) |
| IN (1) | IN2014DN03368A (en) |
| MX (1) | MX352545B (en) |
| TW (1) | TWI452154B (en) |
| WO (1) | WO2013103149A1 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5303678B1 (en) | 2012-01-06 | 2013-10-02 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
| JP5572753B2 (en) * | 2012-12-26 | 2014-08-13 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
| JP5417523B1 (en) * | 2012-12-28 | 2014-02-19 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
| JP5572754B2 (en) | 2012-12-28 | 2014-08-13 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
| JP5417539B1 (en) | 2013-01-28 | 2014-02-19 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
| JP5501495B1 (en) * | 2013-03-18 | 2014-05-21 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
| JP5604549B2 (en) * | 2013-03-18 | 2014-10-08 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
| WO2015004940A1 (en) * | 2013-07-10 | 2015-01-15 | 三菱マテリアル株式会社 | Copper alloy for electronic/electrical equipment, copper alloy thin sheet for electronic/electrical equipment, conductive component for electronic/electrical equipment, and terminal |
| MX2016000027A (en) * | 2013-07-10 | 2016-10-31 | Mitsubishi Materials Corp | Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal. |
| US9970081B2 (en) * | 2013-09-26 | 2018-05-15 | Mitsubishi Shindoh Co., Ltd. | Copper alloy and copper alloy sheet |
| JP6218325B2 (en) * | 2014-02-27 | 2017-10-25 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
| JP5783293B1 (en) | 2014-04-22 | 2015-09-24 | 三菱マテリアル株式会社 | Material for cylindrical sputtering target |
| EP3136433B1 (en) * | 2014-04-25 | 2019-02-13 | Mitsubishi Materials Corporation | Power module substrate unit and power module |
| US9791390B2 (en) * | 2015-01-22 | 2017-10-17 | EDAX, Incorporated | Devices and systems for spatial averaging of electron backscatter diffraction patterns |
| JP2018070916A (en) * | 2016-10-26 | 2018-05-10 | 株式会社神戸製鋼所 | Copper alloy |
| CN109338151B (en) * | 2018-12-14 | 2021-07-20 | 宁波博威合金材料股份有限公司 | Copper alloy for electronic and electrical equipment and application |
| WO2021025071A1 (en) | 2019-08-06 | 2021-02-11 | 三菱マテリアル株式会社 | Copper alloy sheet, copper alloy sheet with plating film, and methods for producing these |
| JP7014211B2 (en) * | 2019-09-27 | 2022-02-01 | 三菱マテリアル株式会社 | Copper alloys for electronic / electrical equipment, copper alloy strips for electronic / electrical equipment, parts for electronic / electrical equipment, terminals, and bus bars |
| JP7347402B2 (en) * | 2020-11-25 | 2023-09-20 | ウシオ電機株式会社 | Rotating foil trap and light source device |
| CN113755715A (en) * | 2021-09-07 | 2021-12-07 | 大连理工大学 | A kind of high-performance copper alloy and preparation method thereof |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52124503A (en) | 1976-04-09 | 1977-10-19 | Hitachi Zosen Corp | Composite boiler |
| JPH0533087A (en) | 1991-07-31 | 1993-02-09 | Furukawa Electric Co Ltd:The | Copper alloy for small conductive materials |
| JPH06184679A (en) | 1992-12-18 | 1994-07-05 | Mitsui Mining & Smelting Co Ltd | Copper alloy for electrical parts |
| US6695934B1 (en) | 1997-09-16 | 2004-02-24 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US6679956B2 (en) | 1997-09-16 | 2004-01-20 | Waterbury Rolling Mills, Inc. | Process for making copper-tin-zinc alloys |
| US5893953A (en) | 1997-09-16 | 1999-04-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US7056396B2 (en) * | 1998-10-09 | 2006-06-06 | Sambo Copper Alloy Co., Ltd. | Copper/zinc alloys having low levels of lead and good machinability |
| US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| JP3717321B2 (en) * | 1998-12-11 | 2005-11-16 | 古河電気工業株式会社 | Copper alloy for semiconductor lead frames |
| JP4186095B2 (en) | 2000-04-27 | 2008-11-26 | Ｄｏｗａホールディングス株式会社 | Copper alloy for connector and its manufacturing method |
| JP2002003966A (en) | 2000-06-20 | 2002-01-09 | Furukawa Electric Co Ltd:The | Copper alloy for electronic and electrical equipment with excellent solderability |
| JP3953357B2 (en) * | 2002-04-17 | 2007-08-08 | 株式会社神戸製鋼所 | Copper alloy for electrical and electronic parts |
| JP2005029826A (en) * | 2003-07-10 | 2005-02-03 | Hitachi Cable Ltd | Method for producing copper alloy foil for electronic parts |
| JP2005060773A (en) | 2003-08-12 | 2005-03-10 | Mitsui Mining & Smelting Co Ltd | Special brass and method for strengthening the special brass |
| JP5050226B2 (en) | 2005-03-31 | 2012-10-17 | Ｄｏｗａメタルテック株式会社 | Manufacturing method of copper alloy material |
| JP4804266B2 (en) | 2005-08-24 | 2011-11-02 | Ｊｘ日鉱日石金属株式会社 | Cu-Zn-Sn alloy for electrical and electronic equipment and method for producing the same |
| EP2426224B1 (en) * | 2006-05-26 | 2015-09-16 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy with high strength, high electrical conductivity, and excellent bendability |
| JP5466879B2 (en) | 2009-05-19 | 2014-04-09 | Ｄｏｗａメタルテック株式会社 | Copper alloy sheet and manufacturing method thereof |
| JP5468423B2 (en) * | 2010-03-10 | 2014-04-09 | 株式会社神戸製鋼所 | High strength and high heat resistance copper alloy material |
| JP5539055B2 (en) * | 2010-06-18 | 2014-07-02 | 株式会社Ｓｈカッパープロダクツ | Copper alloy material for electric / electronic parts and method for producing the same |
| JP5158915B2 (en) | 2010-08-27 | 2013-03-06 | 古河電気工業株式会社 | Copper alloy sheet and manufacturing method thereof |
| JP5088425B2 (en) * | 2011-01-13 | 2012-12-05 | 三菱マテリアル株式会社 | Copper alloy, copper alloy sheet and conductive member for electronic and electrical equipment |
| JP5834528B2 (en) | 2011-06-22 | 2015-12-24 | 三菱マテリアル株式会社 | Copper alloy for electrical and electronic equipment |
| JP5303678B1 (en) | 2012-01-06 | 2013-10-02 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
-
2012
- 2012-12-28 JP JP2012287965A patent/JP5303678B1/en active Active
-
2013
- 2013-01-04 MX MX2014006312A patent/MX352545B/en active IP Right Grant
- 2013-01-04 CA CA2852084A patent/CA2852084A1/en not_active Abandoned
- 2013-01-04 US US14/114,862 patent/US8951369B2/en active Active
- 2013-01-04 AU AU2013207042A patent/AU2013207042B2/en active Active
- 2013-01-04 IN IN3368DEN2014 patent/IN2014DN03368A/en unknown
- 2013-01-04 EP EP17190817.1A patent/EP3284835A3/en not_active Withdrawn
- 2013-01-04 KR KR1020137025606A patent/KR101437307B1/en active Active
- 2013-01-04 TW TW102100373A patent/TWI452154B/en active
- 2013-01-04 WO PCT/JP2013/050004 patent/WO2013103149A1/en not_active Ceased
- 2013-01-04 CN CN201380001177.7A patent/CN103502489B/en active Active
- 2013-01-04 CN CN201510381604.XA patent/CN105154713A/en active Pending
- 2013-01-04 EP EP13733581.6A patent/EP2801630B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103502489B (en) | 2015-11-25 |
| US8951369B2 (en) | 2015-02-10 |
| EP3284835A3 (en) | 2018-02-28 |
| EP2801630A4 (en) | 2015-10-07 |
| CN103502489A (en) | 2014-01-08 |
| CA2852084A1 (en) | 2013-07-11 |
| JP5303678B1 (en) | 2013-10-02 |
| EP2801630B1 (en) | 2017-11-01 |
| MX2014006312A (en) | 2014-06-23 |
| KR20130128465A (en) | 2013-11-26 |
| KR101437307B1 (en) | 2014-09-03 |
| US20140087606A1 (en) | 2014-03-27 |
| MX352545B (en) | 2017-11-29 |
| EP3284835A2 (en) | 2018-02-21 |
| AU2013207042B2 (en) | 2016-07-21 |
| WO2013103149A1 (en) | 2013-07-11 |
| TW201343937A (en) | 2013-11-01 |
| TWI452154B (en) | 2014-09-11 |
| AU2013207042A1 (en) | 2014-05-29 |
| EP2801630A1 (en) | 2014-11-12 |
| JP2014074220A (en) | 2014-04-24 |
| AU2013207042A2 (en) | 2014-09-11 |
| CN105154713A (en) | 2015-12-16 |
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