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IN2014DE00839A - - Google Patents

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Publication number
IN2014DE00839A
IN2014DE00839A IN839DE2014A IN2014DE00839A IN 2014DE00839 A IN2014DE00839 A IN 2014DE00839A IN 839DE2014 A IN839DE2014 A IN 839DE2014A IN 2014DE00839 A IN2014DE00839 A IN 2014DE00839A
Authority
IN
India
Prior art keywords
forming
fastener hole
cavity
circuit board
resin material
Prior art date
Application number
Other languages
English (en)
Inventor
Yoshida Akikazu
Echigo Masashi
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of IN2014DE00839A publication Critical patent/IN2014DE00839A/en

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
IN839DE2014 2013-03-28 2014-03-24 IN2014DE00839A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013068411A JP6032096B2 (ja) 2013-03-28 2013-03-28 電子制御ユニット及びその製造方法

Publications (1)

Publication Number Publication Date
IN2014DE00839A true IN2014DE00839A (fr) 2015-06-19

Family

ID=51601283

Family Applications (1)

Application Number Title Priority Date Filing Date
IN839DE2014 IN2014DE00839A (fr) 2013-03-28 2014-03-24

Country Status (3)

Country Link
JP (1) JP6032096B2 (fr)
CN (1) CN104080306B (fr)
IN (1) IN2014DE00839A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6323303B2 (ja) * 2014-11-10 2018-05-16 株式会社デンソー 電子部品ユニット
JP6668973B2 (ja) * 2016-06-28 2020-03-18 株式会社デンソー 電子装置、及び、電子装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5433665A (en) * 1977-08-22 1979-03-12 Hitachi Ltd Manufacture for resin sealed type semiconductor device and resin sealed metal mold
JP3193194B2 (ja) * 1993-07-09 2001-07-30 三菱電線工業株式会社 基板に実装されたｌｅｄチップにレンズ被覆層をモールドする方法およびそのモールド用基板構造
JP3461073B2 (ja) * 1995-12-08 2003-10-27 株式会社デンソー ベアチップ封止方法
JP4540884B2 (ja) * 2001-06-19 2010-09-08 三菱電機株式会社 半導体装置
JP2003100957A (ja) * 2001-09-26 2003-04-04 Nec Corp 半導体パッケージ
JP2003179093A (ja) * 2001-12-12 2003-06-27 Nissan Motor Co Ltd 半導体モジュールの製造方法および半導体モジュール
JP2003283144A (ja) * 2002-03-27 2003-10-03 Minolta Co Ltd 回路基板の放熱構造
US7166906B2 (en) * 2004-05-21 2007-01-23 Samsung Electronics Co., Ltd. Package with barrier wall and method for manufacturing the same
JP4741324B2 (ja) * 2005-09-06 2011-08-03 ユニチカ株式会社 プリント基板
JP2009200416A (ja) * 2008-02-25 2009-09-03 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP5187065B2 (ja) * 2008-08-18 2013-04-24 株式会社デンソー 電子制御装置の製造方法及び電子制御装置
JP5208099B2 (ja) * 2009-12-11 2013-06-12 日立オートモティブシステムズ株式会社 流量センサとその製造方法、及び流量センサモジュール
WO2012049742A1 (fr) * 2010-10-13 2012-04-19 日立オートモティブシステムズ株式会社 Capteur d'écoulement et son procédé de production, et module de capteur d'écoulement et son procédé de production
US8387457B2 (en) * 2011-01-11 2013-03-05 Delphi Technologies, Inc. Collision sensor housing and module

Also Published As

Publication number Publication date
CN104080306B (zh) 2018-10-12
JP2014192447A (ja) 2014-10-06
JP6032096B2 (ja) 2016-11-24
CN104080306A (zh) 2014-10-01

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