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IN2013CH00566A - - Google Patents

Info

Publication number
IN2013CH00566A
IN2013CH00566A IN566CH2013A IN2013CH00566A IN 2013CH00566 A IN2013CH00566 A IN 2013CH00566A IN 566CH2013 A IN566CH2013 A IN 566CH2013A IN 2013CH00566 A IN2013CH00566 A IN 2013CH00566A
Authority
IN
India
Prior art keywords
robot
robot control
control device
substrate positioning
positioning device
Prior art date
Application number
Other languages
English (en)
Inventor
Minami Takashi
Katsuda Shinichi
Original Assignee
Yaskawa Denki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Denki Seisakusho Kk filed Critical Yaskawa Denki Seisakusho Kk
Publication of IN2013CH00566A publication Critical patent/IN2013CH00566A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1628—Programme controls characterised by the control loop
    • B25J9/1633—Programme controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Programme controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50036—Find center of circular mark, groove
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
IN566CH2013 2012-02-16 2013-02-11 IN2013CH00566A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012031982A JP5573861B2 (ja) 2012-02-16 2012-02-16 搬送システム

Publications (1)

Publication Number Publication Date
IN2013CH00566A true IN2013CH00566A (fr) 2015-04-24

Family

ID=48957803

Family Applications (1)

Application Number Title Priority Date Filing Date
IN566CH2013 IN2013CH00566A (fr) 2012-02-16 2013-02-11

Country Status (6)

Country Link
US (1) US8989901B2 (fr)
JP (1) JP5573861B2 (fr)
KR (1) KR101446413B1 (fr)
CN (1) CN103253512A (fr)
IN (1) IN2013CH00566A (fr)
TW (1) TW201347937A (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6199199B2 (ja) * 2014-02-20 2017-09-20 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
JP6384195B2 (ja) * 2014-08-20 2018-09-05 株式会社安川電機 ロボットシステムおよびロボット教示方法
US9824908B2 (en) * 2015-05-05 2017-11-21 Kawasaki Jukogyo Kabushiki Kaisha Conveying system, conveying robot and teaching method of the same
JP6587423B2 (ja) * 2015-05-28 2019-10-09 キヤノン株式会社 搬送システム及び露光システム
WO2017104039A1 (fr) * 2015-12-17 2017-06-22 株式会社安川電機 Système d'apprentissage, procédé d'apprentissage, et robot
US10099377B2 (en) * 2016-06-29 2018-10-16 Applied Materials, Inc. Methods and systems providing misalignment correction in robots
JP6741538B2 (ja) * 2016-09-28 2020-08-19 川崎重工業株式会社 ロボット、ロボットの制御装置、及び、ロボットの位置教示方法
JP7199073B2 (ja) * 2017-10-20 2023-01-05 株式会社キーレックス 垂直多関節ロボットの教示データ作成システム
KR102669504B1 (ko) * 2018-04-09 2024-05-28 도쿄엘렉트론가부시키가이샤 레이저 가공 장치, 레이저 가공 시스템 및 레이저 가공 방법
US10974388B2 (en) * 2018-12-27 2021-04-13 Kawasaki Jukogyo Kabushiki Kaisha Method of correcting position of robot and robot
US11059178B2 (en) * 2018-12-27 2021-07-13 Kawasaki Jukogyo Kabushiki Kaisha Method of correcting position of robot and robot
CN113276104B (zh) * 2020-02-19 2024-08-27 总督科技股份有限公司 晶圆转载机构的机械臂校准方法
US12394653B2 (en) * 2020-02-19 2025-08-19 Mao-Yen Sung Wafer carrier disc installation/uninstallation device and installation/uninstallation method thereof
JP7515323B2 (ja) * 2020-07-09 2024-07-12 東京エレクトロン株式会社 検査装置及び基板搬送方法
JP7712078B2 (ja) * 2020-12-25 2025-07-23 川崎重工業株式会社 基板搬送ロボットの制御装置及び関節モータの制御方法
TW202306022A (zh) * 2021-06-18 2023-02-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 氣相沉積總成、基座處理設備以及清潔基材之方法
CN114536339B (zh) * 2022-03-03 2024-05-31 深圳市大族机器人有限公司 协作机器人的控制方法、装置、协作机器人和存储介质
WO2025002723A1 (fr) 2023-06-29 2025-01-02 Asml Netherlands B.V. Système et procédé d'étalonnage de robot

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Publication number Priority date Publication date Assignee Title
JPH10173022A (ja) * 1996-12-10 1998-06-26 Mecs:Kk ウェハ搬送装置
US6405101B1 (en) * 1998-11-17 2002-06-11 Novellus Systems, Inc. Wafer centering system and method
JP2003142417A (ja) 2001-11-05 2003-05-16 Anelva Corp 成膜処理装置に装備されたロボットの制御装置
JP3760212B2 (ja) * 2001-11-30 2006-03-29 川崎重工業株式会社 アライメント処理方法およびアライメント処理装置
JP4071057B2 (ja) * 2002-07-10 2008-04-02 東京エレクトロン株式会社 基板位置決め装置及び基板処理装置
US6748293B1 (en) * 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
KR100583727B1 (ko) * 2004-01-07 2006-05-25 삼성전자주식회사 기판 제조 장치 및 이에 사용되는 기판 이송 모듈
CN1876529B (zh) 2006-07-11 2010-12-01 友达光电股份有限公司 玻璃基板移送装置
JP2008173744A (ja) * 2007-01-22 2008-07-31 Tokyo Electron Ltd 搬送システムの搬送位置合わせ方法
KR100855877B1 (ko) 2007-02-23 2008-09-03 세메스 주식회사 기판 처리 장치 및 그 장치에서의 기판 정렬 방법
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JP5755844B2 (ja) * 2010-05-31 2015-07-29 株式会社ダイヘン ワーク搬送システム
JP5627518B2 (ja) * 2011-03-16 2014-11-19 大日本スクリーン製造株式会社 基板処理装置および電源管理方法

Also Published As

Publication number Publication date
KR101446413B1 (ko) 2014-10-02
JP5573861B2 (ja) 2014-08-20
JP2013168579A (ja) 2013-08-29
KR20130094754A (ko) 2013-08-26
TW201347937A (zh) 2013-12-01
CN103253512A (zh) 2013-08-21
US8989901B2 (en) 2015-03-24
US20130218337A1 (en) 2013-08-22

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