[go: up one dir, main page]

IL162005A0 - Copper deposition using copper formate complexes - Google Patents

Copper deposition using copper formate complexes

Info

Publication number
IL162005A0
IL162005A0 IL16200502A IL16200502A IL162005A0 IL 162005 A0 IL162005 A0 IL 162005A0 IL 16200502 A IL16200502 A IL 16200502A IL 16200502 A IL16200502 A IL 16200502A IL 162005 A0 IL162005 A0 IL 162005A0
Authority
IL
Israel
Prior art keywords
copper
deposition
complexes
formate complexes
formate
Prior art date
Application number
IL16200502A
Other languages
English (en)
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of IL162005A0 publication Critical patent/IL162005A0/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C31/00—Saturated compounds having hydroxy or O-metal groups bound to acyclic carbon atoms
    • C07C31/28—Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/005—Compounds containing elements of Groups 1 or 11 of the Periodic Table without C-Metal linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C29/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring
    • C07C29/15—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively
    • C07C29/151—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases
    • C07C29/153—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases characterised by the catalyst used
    • C07C29/154—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of oxides of carbon exclusively with hydrogen or hydrogen-containing gases characterised by the catalyst used containing copper, silver, gold, or compounds thereof
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/08—Copper compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Chemical Vapour Deposition (AREA)
  • Pyridine Compounds (AREA)
  • Physical Vapour Deposition (AREA)
IL16200502A 2001-12-12 2002-12-12 Copper deposition using copper formate complexes IL162005A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34063101P 2001-12-12 2001-12-12
PCT/US2002/039637 WO2003053895A2 (fr) 2001-12-12 2002-12-12 Depot de cuivre a partir de complexes de formate de cuivre

Publications (1)

Publication Number Publication Date
IL162005A0 true IL162005A0 (en) 2005-11-20

Family

ID=23334264

Family Applications (1)

Application Number Title Priority Date Filing Date
IL16200502A IL162005A0 (en) 2001-12-12 2002-12-12 Copper deposition using copper formate complexes

Country Status (11)

Country Link
US (1) US6770122B2 (fr)
EP (1) EP1461345B1 (fr)
JP (1) JP2005513117A (fr)
KR (1) KR20040071193A (fr)
CN (1) CN1602314A (fr)
AT (1) ATE327998T1 (fr)
AU (1) AU2002357160A1 (fr)
DE (1) DE60211949D1 (fr)
IL (1) IL162005A0 (fr)
TW (1) TW200409829A (fr)
WO (1) WO2003053895A2 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602004013800D1 (de) * 2003-07-03 2008-06-26 Mec Co Ltd Verfahren zur Herstellung einer dünnen Kupferschicht
US7018917B2 (en) 2003-11-20 2006-03-28 Asm International N.V. Multilayer metallization
DE10360046A1 (de) 2003-12-18 2005-07-21 Basf Ag Kupfer(l)formiatkomplexe
US20050274933A1 (en) * 2004-06-15 2005-12-15 Peng Chen Formulation for printing organometallic compounds to form conductive traces
EP1629902A1 (fr) * 2004-08-30 2006-03-01 E.I. Dupont De Nemours And Company Procédé de dépôt de cuivre à partir d'une solution fluide supercritique contenant des complexes de cuivre (1) avec un ligand neutre
JP5145052B2 (ja) * 2008-01-07 2013-02-13 東京エレクトロン株式会社 成膜方法および成膜装置、ならびに記憶媒体
US8309179B2 (en) * 2009-09-28 2012-11-13 Rohm And Haas Electronics Materials Llc Selenium/group 1b ink and methods of making and using same
KR20110064153A (ko) 2009-12-07 2011-06-15 삼성전자주식회사 금속 유기 전구체, 이의 제조방법, 및 이를 이용한 전도성 금속막 또는 패턴 형성방법
IN2015DN00149A (fr) 2012-07-09 2015-06-12 Shikoku Chem
US9012278B2 (en) 2013-10-03 2015-04-21 Asm Ip Holding B.V. Method of making a wire-based semiconductor device
JP6100178B2 (ja) * 2014-01-06 2017-03-22 四国化成工業株式会社 銅被膜形成剤および銅被膜の形成方法
SG11201610182SA (en) 2014-06-19 2017-01-27 Nat Res Council Canada Molecular inks
JP6387282B2 (ja) * 2014-10-10 2018-09-05 株式会社Adeka 銅膜形成用組成物及びそれを用いた銅膜の製造方法
US10954406B2 (en) * 2015-06-11 2021-03-23 National Research Council Of Canada Preparation of high conductivity copper films
EP3792825B1 (fr) * 2015-12-18 2022-05-11 Abbott Laboratories Procédés et systèmes d'évaluation de colorations histologiques
TWI842668B (zh) 2017-02-08 2024-05-21 加拿大國家研究委員會 具低黏度與低加工溫度之銀分子油墨
TWI874294B (zh) 2017-02-08 2025-03-01 加拿大國家研究委員會 可印刷分子油墨
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨
US11936968B2 (en) 2021-04-21 2024-03-19 Lg Innotek Co., Ltd. Circuit board, an image sensor module, a lens driving device, and a camera module including the same
CN114106019A (zh) * 2021-12-06 2022-03-01 桂林理工大学 吡唑-3-甲酸铜配合物的晶体结构及其磁性质
CN116082371B (zh) * 2022-10-26 2025-06-17 蚌埠学院 一种1h-吡唑铜共晶配合物、合成方法及其在超级电容器中的应用
CN115869949B (zh) * 2022-12-22 2024-07-02 中国科学院过程工程研究所 一种负载型单原子铜基催化剂及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3771973A (en) * 1971-05-10 1973-11-13 Hooker Chemical Corp Metal plating of synthetic polymers
US3980654A (en) * 1973-10-26 1976-09-14 Eastman Kodak Company Copper (II) complexes
US4582731A (en) * 1983-09-01 1986-04-15 Battelle Memorial Institute Supercritical fluid molecular spray film deposition and powder formation
JPS60195077A (ja) * 1984-03-16 1985-10-03 奥野製薬工業株式会社 セラミツクスの無電解めつき用触媒組成物
US4761467A (en) * 1985-10-21 1988-08-02 Texaco Inc. Pyridine ligands for preparation of organic carbonates
US4818255A (en) * 1987-02-10 1989-04-04 Kozo Director-general of Agency of Industrial Science and Technology Iizuka Material for gas separation
US5767303A (en) * 1996-10-04 1998-06-16 Chiyoda Corporation Process of producing carbonic diester
US5789027A (en) * 1996-11-12 1998-08-04 University Of Massachusetts Method of chemically depositing material onto a substrate
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features

Also Published As

Publication number Publication date
KR20040071193A (ko) 2004-08-11
JP2005513117A (ja) 2005-05-12
EP1461345B1 (fr) 2006-05-31
CN1602314A (zh) 2005-03-30
TW200409829A (en) 2004-06-16
AU2002357160A8 (en) 2003-07-09
AU2002357160A1 (en) 2003-07-09
DE60211949D1 (de) 2006-07-06
WO2003053895A3 (fr) 2004-01-15
EP1461345A2 (fr) 2004-09-29
ATE327998T1 (de) 2006-06-15
US6770122B2 (en) 2004-08-03
WO2003053895A2 (fr) 2003-07-03
US20030165623A1 (en) 2003-09-04

Similar Documents

Publication Publication Date Title
IL162005A0 (en) Copper deposition using copper formate complexes
IL147235A0 (en) Chemical mechanical polishing systems and methods for their use
WO2003095701A8 (fr) Complexes de cuivre (ii) volatils destines au depot de films de cuivre par depot par couche atomique
WO2003008583A3 (fr) Nouvelles compositions et methodes relatives au cancer
AU2001249149A1 (en) Spray drying methods of making agglomerate abrasive grains and abrasive articles
MXPA03011197A (es) Benzoilsufonamidas y sulfonilbenzamidinas que se usan como agentes antitumorales.
MY130718A (en) Antitumor compounds and methods
WO2003048301A3 (fr) Anticorps anti-hla-dr et leurs methodes d'utilisation
WO2003045230A3 (fr) Compositions et procedes contre le cancer
IL145557A0 (en) Immunoabsorber for use in sepsis therapy
AU2001245659A1 (en) Pyrazolate copper complexes, and mocvd of copper using same
AU2003290592A1 (en) Antitumor benzoylsulfonamides
TW200500327A (en) Volatile copper(I) complexes for deposition of copper films by atomic layer deposition
WO2001054476A8 (fr) Transactions electroniques entre plusieurs parties
WO2003053224A3 (fr) Nouvelles compositions et methodes contre le cancer
GB2389854B (en) Release films
TW200617198A (en) Copper(Ⅱ) complexes for deposition of copper films by atomic layer deposition
SI1377574T1 (fr)
WO2003035837A3 (fr) Nouvelles compositions et procedes relatifs au cancer
TW200606513A (en) A wiring substrate and method using the same
WO2000047192A3 (fr) COENZYME Qn UTILISE POUR TRAITER LA DOULEUR
WO2001082972A3 (fr) Compositions comportant des vehicules et des complexes transportables
PL355604A1 (en) Composite elements
UA66851C2 (uk) Фурилфосфіни, металоорганічні комплекси на їх основі, способи їх одержання і каталізатори
WO2000029420A3 (fr) Procedes de fabrication de nucleosides modifies