HK40048908B - A server tray package and its forming method, and a method for cooling heat generating devices in a data center - Google Patents

Description

Server tray packaging and its forming method; method for cooling heat-generating equipment in data centers

Technical Field

This document relates to systems and methods for providing cooling to electronic devices, such as computer server racks and related equipment in computer data centers, using cooling plates.

Background Technology

Computer users often focus on the speed of computer microprocessors (e.g., megahertz and gigahertz). Many computer users forget that this speed often translates to higher power consumption. This power consumption also generates heat. This is because, by simple laws of physics, all power must go somewhere and ultimately be converted into heat. A pair of microprocessors mounted on a single motherboard can draw hundreds of watts or more of power. Multiply that number by thousands (or tens of thousands) to calculate the amount of heat that can be generated by many computers in a large data center, and one can easily understand the potential heat output. The impact of power consumed by critical loads in a data center is often amplified when combined with all the auxiliary equipment needed to support them.

Many technologies can be used to cool electronic devices (e.g., processors, memory, networking devices, and other heat-generating components) located on server or network rack trays. For example, forced convection can be created by providing cooling airflow onto the device. Fans located near the device, in the computer server room, and/or in duct systems that are in airflow communication with the surrounding electronic equipment can force cooling airflow across the tray containing the device. In some cases, one or more components or devices on a server tray may be located in areas of the tray that are difficult to cool; for example, areas where forced convection is not particularly effective or available.

Inadequate and/or insufficient cooling can result in the failure of one or more electronic devices on a tray due to the device exceeding its maximum rated temperature. While some redundancy can be built into computer data centers, server racks, or even individual trays, device failure due to overheating can incur significant costs in terms of speed, efficiency, and expense.

Summary of the Invention

This disclosure describes a cooling system for, for example, rack-mounted electronic devices (e.g., servers, processors, memory, networking devices, etc.) in a data center. In various disclosed embodiments, the cooling system may be or include a liquid cooling plate assembly that is part of or integrated with a server tray package. In some embodiments, the liquid cooling plate assembly includes a base and a top that combine to form a coolant flow path and a thermal interface between one or more heat-generating devices and the coolant, through which the coolant circulates.

In an example implementation, a server tray package includes: a motherboard assembly including a plurality of data center electronics devices, the plurality of data center electronics devices including at least one heat-generating processor device; a liquid cooling plate assembly including: a base mounted to the motherboard assembly, the base and the motherboard assembly defining a volume that at least partially surrounds the plurality of data center electronics devices; and a top mounted to the base and including a heat transfer member, the heat transfer member including an inlet end and an outlet end in fluid communication with a coolant flow path defined through the heat transfer member; and a vapor chamber located between the base and the top, the vapor chamber including a housing surrounding the heat transfer fluid in thermal contact with the motherboard assembly and the liquid cooling plate assembly.

One aspect that can be combined with the example implementation further includes a first thermal interface material located between the bottom surface of the top and the vapor chamber.

Another aspect, which may be combined with any of the preceding aspects, further includes a second thermal interface material located between the top surface of the base and at least a portion of the plurality of data center electronic devices.

Another aspect, which may be combined with any of the preceding aspects, further includes a third thermal interface material located between the top surface of the base and the vapor chamber.

In another aspect, which can be combined with any of the preceding aspects, the liquid cooling plate assembly further includes a plurality of heat transfer surfaces surrounding the coolant flow path.

In another aspect, which can be combined with any of the preceding aspects, the steam chamber includes a plurality of fluid-independent chambers within the housing, each of the fluid-independent chambers surrounding at least a portion of the heat transfer fluid.

In another aspect, which can be combined with any of the preceding aspects, the portion of the heat transfer fluid varies in at least one of its composition or amount.

In another aspect that can be combined with any of the preceding aspects, at least one of the fluid-independent chambers includes a first volume, and at least another of the fluid-independent chambers includes a second volume larger than the first volume.

In another aspect, which can be combined with any of the previous aspects, the second volume is vertically aligned and positioned above the heat-generating processor device.

In another aspect, which can be combined with any of the previous aspects, the vapor chamber is integrally formed as the base of the top of the liquid cooling plate assembly, and the vapor chamber is located at the top of the cover of the base and is in conductive heat-transferring contact with the cover through a thermal interface material.

In another aspect, which can be combined with any of the previous aspects, the vapor chamber is integrally formed as a cover for the base of the liquid cooling plate assembly, and the vapor chamber supports the top base and conducts heat transfer into contact with the base through a thermal interface material.

In another example embodiment, a method for cooling heat-generating equipment in a data center includes: circulating a coolant flow to a server tray package, the server tray package including: a motherboard assembly including a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat-generating processor device; a liquid cooling plate assembly including a base and a top, the base being mounted to the motherboard assembly, the base and the motherboard assembly defining a volume at least partially surrounding the plurality of data center electronic devices, the top being mounted to the base; and a vapor chamber located between the base and the top; circulating a coolant flow into an inlet end of a heat transfer component; receiving heat from the plurality of data center electronic devices into a heat transfer fluid surrounding a housing of the vapor chamber to evaporate at least a portion of the heat transfer fluid; circulating the coolant flow from the inlet end through a coolant flow path defined through the heat transfer component to transfer heat from the evaporated portion of the heat transfer fluid to the coolant; and circulating the heated coolant flow from the coolant flow path to an outlet end of the heat transfer component.

One aspect that can be combined with the example implementation further includes transferring heat from the plurality of data center electronic devices through a first thermal interface material located between the top surface of the plurality of data center electronic devices and the base.

Another aspect, which can be combined with any of the preceding aspects, further includes transferring heat from the top surface of the base through a second thermal interface material located between the base and the steam chamber.

Another aspect, which can be combined with any of the preceding aspects, further includes transferring heat from the steam chamber through a third thermal interface material located between the bottom surface of the top of the liquid cooling plate assembly and the steam chamber.

In another aspect, which can be combined with any of the preceding aspects, circulating the coolant flow through the coolant flow path defined through the heat transfer member includes circulating the coolant through a plurality of flow channels defined by a plurality of heat transfer surfaces surrounding the coolant flow path.

In another aspect, which can be combined with any of the preceding aspects, receiving heat from the plurality of data center electronic devices into the heat transfer fluid within the housing surrounding the steam chamber to evaporate at least a portion of the heat transfer fluid includes receiving heat from the plurality of data center electronic devices into multiple portions of the heat transfer fluid within respective fluid-independent chambers surrounding the housing surrounding the steam chamber.

In another aspect, which can be combined with any of the preceding aspects, the portion of the heat transfer fluid varies in at least one of its composition or amount.

In another aspect, which can be combined with any of the preceding aspects, at least one of the fluid-independent chambers comprises a first volume.

In another aspect, which can be combined with any of the preceding aspects, at least one of the fluid-independent chambers includes a second volume greater than the first volume.

Another aspect, which can be combined with any of the preceding aspects, further includes receiving heat from the heat-generating processor device into a portion of the heat transfer fluid within the second volume surrounding the other fluid-independent chamber.

Another aspect, which can be combined with any of the preceding aspects, further includes receiving heat from one or more memory devices into a portion of the heat transfer fluid within the first volume surrounding the at least one of the fluid-independent chambers.

In another aspect, which can be combined with any of the previous aspects, the vapor chamber is integrally formed as the base of the top of the liquid cooling plate assembly, and the vapor chamber is located at the top of the cover of the base and is in conductive heat-transferring contact with the cover through a thermal interface material.

In another aspect, which can be combined with any of the previous aspects, the vapor chamber is integrally formed as a cover for the base of the liquid cooling plate assembly, and the vapor chamber supports the top base and conducts heat transfer into contact with the base through a thermal interface material.

In another example embodiment, a method for forming a server tray package includes: mounting a plurality of data center electronic devices to a motherboard assembly, the plurality of data center electronic devices including at least one heat-generating processor device; mounting a liquid cooling plate assembly substrate to the motherboard assembly to at least partially define a volume surrounding the plurality of data center electronic devices; mounting a vapor chamber to the liquid cooling plate assembly substrate, the vapor chamber including a housing defining at least one fluid isolation chamber surrounding at least a portion of a phase change fluid; and mounting a liquid cooling plate assembly top cap to the vapor chamber, the liquid cooling plate assembly top cap including a heat transfer member, the heat transfer member including an inlet end and an outlet end, the inlet end and the outlet end being in fluid communication with a coolant flow path defined through the heat transfer member.

One aspect that can be combined with the example implementation further includes mounting the plurality of data center electronic devices to an intermediary layer of the motherboard assembly.

Another aspect, which can be combined with any of the preceding aspects, further includes mounting the intermediary layer to the substrate of the motherboard assembly.

Another aspect, which can be combined with any of the preceding aspects, further includes mounting the substrate to the motherboard of the motherboard assembly.

Another aspect, which can be combined with any of the preceding aspects, further includes positioning a first thermal interface material between the cover of the liquid cooling plate assembly substrate and the vapor chamber.

Another aspect, which can be combined with any of the preceding aspects, further includes positioning a second thermal interface material between the cover and the plurality of data center electronic devices.

Another aspect, which can be combined with any of the preceding aspects, further includes positioning a third thermal interface material between the vapor chamber and the substrate of the top cap of the liquid cooling plate assembly.

In another aspect, which can be combined with any of the previous aspects, the steam chamber includes the base of the top cap of the liquid cooling plate assembly.

In another aspect, which can be combined with any of the previous aspects, the steam chamber includes a cover for the base of the liquid cooling plate assembly.

In another aspect, which can be combined with any of the preceding aspects, the area of the bottom surface of the housing of the vapor chamber is different from the area of the liquid cooling plate assembly base on which the vapor chamber is mounted.

Various embodiments of the data center cooling system according to this disclosure may include one, some, or all of the following features. For example, the server tray package according to this disclosure may provide direct liquid cooling for high-heat-generating electronic devices in a data center. As another example, the server tray package according to this disclosure may provide multiple functions, including cooling, mechanical stiffness, and liquid coolant sealing. As another example, the server tray package according to this disclosure may provide customized coolant flow paths and flow geometries to cool high-heat-generating and low-heat-generating electronic devices mounted on a single substrate. As yet another example, the server tray package according to this disclosure may allow cooling of heat-generating devices mounted on a substrate with different heights (and different power consumptions). As a further example, the server tray package according to this disclosure may allow hotspot diffusion to be combined with high-performance liquid cooling via a cooling plate. As yet another example, the server tray package according to this disclosure may include one or more vapor chambers that may be regulated based on temperature and power requirements to cool individual heat sources. As another example, the server tray package according to this disclosure may allow cooling of higher-power computing components (e.g., processors) through direct conductive contact with a liquid-cooled cooling plate for better performance. As a further example, the server tray package according to this disclosure may include a partial cover with holes to allow integration of a liquid-cooled cooling plate with less potential warping, while providing protection for the server-packaged electronics. As yet another example, the server tray package according to this disclosure may include a partial cover that provides a seat surface for the liquid-cooled cooling plate and prevents the plate from tilting. As yet another example, the server tray package according to this disclosure may provide more direct heat transfer through conductive contact between heat-generating devices (such as processors) while still providing cooling for devices that generate less heat (such as memory modules).

Details of one or more embodiments are set forth in the following drawings and description. Other features, objects, and advantages will become apparent from the description and drawings, and from the claims.

Attached Figure Description

Figure 1 shows a front view of a server rack used in a data center environment and server rack sub-assemblies configured to be installed within the rack.

Figure 2 shows a schematic cross-sectional side view of an example embodiment of a server tray package including a liquid cooling plate assembly.

Figure 3A shows a schematic cross-sectional side view of another example implementation of a server tray package including a liquid cooling plate assembly and a vapor chamber.

Figure 3B shows a schematic cross-sectional side view of an example embodiment of a vapor chamber that can be used in a liquid cooling plate assembly in a server tray package.

Figures 3C and 3D show schematic side and top views of another example implementation of a vapor chamber that can be used in a liquid cooling plate assembly in a server tray package.

Figure 4A shows a schematic cross-sectional side view of another example implementation of a server tray package including a liquid cooling plate assembly and a vapor chamber.

Figures 4B and 4C show schematic side and top views of another example implementation of a vapor chamber that can be used in a liquid cooling plate assembly in a server tray package.

Figure 5 shows a schematic cross-sectional side view of another example implementation of a server tray package including a liquid cooling plate assembly and a vapor chamber.

Figure 6 shows a schematic cross-sectional side view of another example implementation of a server tray package including a liquid cooling plate assembly and a vapor chamber.

Figure 7 shows a schematic cross-sectional side view of a portion of an example embodiment of a server tray package including a liquid cooling plate assembly disposed on a partial cover.

Figure 8 shows a schematic cross-sectional side view of a portion of an example embodiment of a server tray package including a liquid cooling plate assembly disposed on a partial cover.

Figure 9 shows a schematic cross-sectional side view of a portion of another example embodiment of a server tray package including a liquid cooling plate assembly disposed on a partial cover.

Figure 10 shows a schematic cross-sectional side view of a portion of another example embodiment of a server tray package including a liquid cooling plate assembly disposed on a partial cover.

Figure 11 shows a schematic cross-sectional side view of a portion of another example embodiment of a server tray package including a liquid cooling plate assembly disposed on a partial cover.

Detailed Implementation

In some example embodiments, cooling systems are disclosed for, for example, rack-mounted electronic devices (e.g., servers, processors, memory, networking devices, etc.) in data centers. In various disclosed embodiments, the cooling system may be or include a liquid cooling plate assembly that is part of or integrated with a server tray package. In some embodiments, the liquid cooling plate assembly includes a base and a top that combine to form a coolant flow path and a thermal interface between one or more heat-generating devices and the coolant, through which the coolant circulates.

Figure 1 illustrates an example system 100 including a server rack 105 (e.g., a 13-inch or 19-inch server rack) and multiple server rack sub-assemblies 110 mounted within the rack 105. While a single server rack 105 is shown, it can be one of several server racks within a system 100 that may include server clusters or a co-location facility containing various rack-mounted computer systems. Furthermore, while multiple server rack sub-assemblies 110 are shown mounted within the rack 105, a single server rack sub-assembly may also be used. Typically, the server rack 105 defines multiple slots 107 arranged in an ordered and repeating manner within the rack, and each slot 107 is a space within the rack into which a corresponding server rack sub-assembly 110 can be placed and removed. For example, a server rack sub-assembly may be supported on a track 112 projecting from opposite sides of the rack 105, and this track 112 may define the position of the slot 107.

Slot 107 and server rack assembly 110 can be oriented in a horizontal arrangement (relative to gravity) as shown. Alternatively, slot 107 and server rack assembly 110 can be oriented vertically (relative to gravity). When the slot is oriented horizontally, they can be stacked vertically in rack 105, and when the slot is oriented vertically, they can be stacked horizontally in rack 105.

Server rack 105, as part of, for example, a larger data center, can provide data processing and storage capacity. In operation, the data center can be connected to a network and can receive and respond to various requests from the network to retrieve, process, and/or store data. For example, in operation, server rack 105 typically facilitates communication via the network with a user interface generated by a user's web browser application, which requests services provided by applications running on computers within the data center. For instance, server rack 105 can provide or assist in providing access to websites on the Internet or the World Wide Web to users using web browsers.

Server rack assembly 110 can be one of a variety of structures that can be mounted in a server rack. For example, in some embodiments, server rack assembly 110 can be a “tray” or tray assembly that is slidably inserted into server rack 105. The term “tray” is not limited to any particular arrangement but is applied to a motherboard or other relatively flat structure attached to the motherboard for supporting the motherboard in its proper position within the rack structure. In some embodiments, server rack assembly 110 can be a server tray enclosure, server chassis, or server container (e.g., a server box). In some embodiments, server rack assembly 110 can be a hard disk drive cage.

Figure 2 shows a schematic cross-sectional side view of an example embodiment of a server tray package 200 including a liquid cooling plate assembly 201. In some embodiments, the server tray package 200 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 2, the server tray package 200 includes a printed circuit board 202 (e.g., a motherboard 202) that supports one or more data center electronics devices; in this example, two or more memory modules 214 and one or more processing devices 216 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 202 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 202 into place and hold it in place within the rack 105. For example, the server tray package 200 may be mounted horizontally in the server rack 105, such as by sliding the frame into a slot 107 and above a pair of rails in the rack 105 on opposite sides of the server tray package 200—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 202, or may have other forms (e.g., by implementing it as a peripheral frame surrounding the motherboard 202), or may be removed so that the motherboard itself is located within the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 202 is mounted on the frame; alternatively, multiple motherboards 202 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 202 or the frame such that when the server tray package 200 is mounted in the rack 105, air enters at the front edge of the server tray package 200 closer to the front of the rack 105, flows over the motherboard 202, flows over some data center electronic components on the motherboard 202, and exits from the server tray package 200 at the rear edge closer to the rear of the rack 105 when the server tray package 200 is mounted in the rack 105. One or more fans may be mounted to the motherboard 202 or the frame via brackets.

As shown, substrate 204 and interposer 212 (e.g., silicon interposer) are located between data center electronics devices 214 and 216 and motherboard 202. For example, substrate 204 provides an interface between one or more data center electronics devices (e.g., processing device 216) and motherboard 202, such as by providing pins for electrical and communication interfaces. In this example, substrate 204 may also provide mounting locations for one or more components of liquid cooling plate assembly 201. For example, interposer 212 provides high-bandwidth connections between data center electronics devices, such as between memory module 214 and processing device 216.

As shown in Figure 2, the liquid cooling plate assembly 201 includes a top 222 (also referred to as a top cap 222) and a base 206. The base 206 includes a cover 208 defining a top surface of the base 206 and side surfaces 210 coupling the cover 208 to a substrate 204. The cover 208 and side surfaces 210 together define or enclose a volume 203 in which an interposer 212 and data center electronics 214 and 216 (mounted thereon) are located within a server tray package 200. As illustrated in this example, a thermal interface material 218 (e.g., a phase change material or other thermally conductive material) is contactlessly located between the bottom side of the cover 208 and the data center electronics 214 and 216 to provide a conductive heat transfer interface between these components.

In this example embodiment, the top cap 222 is attached to the top surface of the cover 208 via another thermal interface material 220 (e.g., a phase change material or other thermally conductive material), which provides a conductive heat transfer interface between the bottom 228 of the top cap 222 and the cover 208 of the base 206. As shown, the top cap 222 includes a cap 224 connected to the bottom 228 via a side 226. The cover 224, the side 226, and the bottom 228 together define a volume 234 through which coolant can circulate.

As shown in this example, cover 224 includes a coolant inlet 230 through which a coolant source 240 can enter. Cover 224 also includes a coolant outlet 232 through which a coolant return flow 242 can exit. Volume 234 defines or includes a coolant flow path between inlet 230 and outlet 232. As shown in this example, one or more heat transfer surfaces 236 (e.g., fins, undulations, ridges, or other extended surfaces that increase heat transfer area) are located in volume 234. Heat transfer surfaces 236 define channels 238 through which coolant can circulate to increase the amount of heat transferred from data center electronics 214 and 216 to the coolant (e.g., relative to the amount transferred in an embodiment of server tray package 200 that does not include heat transfer surfaces 236). Alternative embodiments of server tray package 200 may include multiple inlets 230, multiple outlets 232, or may not include heat transfer surfaces 236.

In an example operation of cooling data center electronics 214 and 216 with server tray package 200, server tray package 200 may be deployed in, for example, a data center server rack 105 in a data center. During operation of server tray package 200, processing device 216 and memory module 214 generate heat that may need to be dissipated or removed from server tray package 200 (e.g., for proper operation of server tray package 200). The heat generated by processing device 216 and memory module 214 is transferred via thermal interface material 218 to cover 208 of base 206 of liquid cooling plate assembly 201. The transferred heat is further transferred from cover 208 to bottom 228 of top cap 222 via thermal interface material 220. In some examples, one or more components of liquid cooling plate assembly 201 may be formed or made of thermally conductive materials, such as copper, aluminum, combinations of copper and aluminum, or other thermally conductive materials.

Heat transferred to the bottom 228 of the top cap 222 is then transferred to the coolant source 240, which circulates through inlet 230 and enters the volume 234 of the top cap 222. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray package 200. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 240 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 214 and 216.

In some examples, heat is transferred directly from the bottom 228 to the coolant source 240. Heat may also be transferred from the bottom 228 via one or more heat transfer surfaces 236 and then to the coolant source 240 flowing through the channel 238. The heated coolant source 240 circulates to the outlet 232 and exits the top cap 222 as a coolant return 242 (e.g., the temperature of the coolant return 242 is higher than the temperature of the coolant source 240). The coolant return 242 circulates back to, for example, a coolant source to dissipate heat from the return 242 (e.g., in a cooler, cooling tower, or other heat exchanger).

Figure 3A shows a schematic cross-sectional side view of another example embodiment of a server tray package 300 including a liquid cooling plate assembly 301 and a vapor chamber 350. In some embodiments, the server tray package 300 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 3A, the server tray package 300 includes a printed circuit board 302 (e.g., a motherboard 302) supporting one or more data center electronics devices; in this example, two or more memory modules 314 and one or more processing devices 316 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 302 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 302 into place and hold it in place within the rack 105. For example, the server tray package 300 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and above a pair of rails in the rack 105 on the opposite side of the server tray package 300—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 302, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 302), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 302 is mounted on the frame; alternatively, multiple motherboards 302 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 302 or the frame such that when the server tray package 300 is mounted in the rack 105, air enters at the front edge of the server tray package 300 closer to the front of the rack 105, flows over the motherboard 302, flows over some data center electronic components on the motherboard 302, and exits from the server tray package 300 at the rear edge closer to the rear of the rack 105 when the server tray package 300 is mounted in the rack 105. One or more fans may be mounted to the motherboard 302 or the frame via brackets.

As shown, substrate 304 and interposer 312 (e.g., silicon interposer) are located between data center electronics devices 314 and 316 and motherboard 302. For example, substrate 304 provides an interface between one or more data center electronics devices (e.g., processing device 316) and motherboard 302, such as by providing pins for electrical and communication interfaces. In this example, substrate 304 may also provide mounting locations for one or more components of liquid cooling plate assembly 301. For example, interposer 312 provides high-bandwidth connections between data center electronics devices, such as between memory module 314 and processing device 316.

As shown in Figure 3A, the liquid cooling plate assembly 301 includes a top 322 (also referred to as a top cap 322) and a base 306. The base 306 includes a cover 308 defining a top surface of the base 306 and side surfaces 310 coupling the cover 308 to a substrate 304. The cover 308 and side surfaces 310 together define or enclose a volume 303 in which an interposer 312 and data center electronics 314 and 316 (mounted thereon) are located within a server tray package 300. As illustrated in this example, a thermal interface material 318 (e.g., a phase change material or other thermally conductive material) is contactlessly located between the bottom side of the cover 308 and the data center electronics 314 and 316 to provide a conductive heat transfer interface between these components.

In this example embodiment, the top cap 322 is mounted to the steam chamber 350 via another thermal interface material 320 (e.g., a phase change material or other thermally conductive material), which provides a conductive heat transfer interface between the bottom 328 of the top cap 322 and the steam chamber 350. Turning briefly to Figure 3B, this figure shows a schematic cross-sectional side view of an example embodiment of the steam chamber 350. As shown, the steam chamber 350 includes a housing containing a heat transfer fluid 354 (e.g., water, refrigerant, or other fluid that boils in response to received heat). In this example, the steam chamber 350 includes a single chamber within a housing 352 surrounding the fluid 354. In some aspects, the steam chamber 350 may include boiling enhancement elements (e.g., fins or others) within the chamber (e.g., on the inner surface of the bottom) to increase heat transfer to the fluid 354. The steam chamber 350 may also include condensation enhancements (e.g., wicking structures) on the interior (e.g., on the inner surface of the top) to allow for better heat transfer from the fluid 354 to the bottom 328 of the top cap 322.

As illustrated in this example, a steam chamber 350 (having a single chamber and fluid 354) is located on top of data center electronics 314 and 316. In some respects, one or more electronics (e.g., processor 316) may generate more heat than other electronics (e.g., memory module 314). Therefore, the steam chamber 350 can eliminate or help eliminate hot spots caused by processor 316 by distributing the heat from processor 316 throughout the chamber 350 (e.g., distributing it into fluid 354). Thus, while there may be non-uniform (per unit area) heat transfer from data center electronics 314 and 316 to the steam chamber, uniform or substantially uniform (per unit area) heat transfer from the steam chamber to the top cap assembly 322 can be achieved.

The steam chamber 350 is mounted to the cover 308 of the base 306 via another thermal interface material 353 (e.g., a phase change material or other thermally conductive material). Therefore, there is a conductive heat transfer interface between the steam chamber 350 and the cover 308 of the base 306.

As shown, the top cap 322 includes a cap 324 connected to the bottom 328 via a side 326. The cap 324, side 326 and bottom 328 together define a volume 334 through which coolant can circulate.

As shown in this example, cover 324 includes a coolant inlet 330 through which a coolant source 340 can enter. Cover 324 also includes a coolant outlet 332 through which a coolant return flow 342 can exit. Volume 334 defines or includes a coolant flow path between inlet 330 and outlet 332. As shown in this example, one or more heat transfer surfaces 336 (e.g., fins, undulations, ridges, or other extended surfaces that increase heat transfer area) are located in volume 334. Heat transfer surfaces 336 define channels 338 through which coolant can circulate to increase the amount of heat transferred from data center electronics 314 and 316 to the coolant (e.g., relative to the amount transferred in an embodiment of server tray package 300 that does not include heat transfer surfaces 336). Alternative embodiments of server tray package 300 may include multiple inlets 330, multiple outlets 332, or may not include heat transfer surfaces 336.

In an example operation of cooling data center electronics 314 and 316 with server tray package 300, server tray package 300 may be deployed in, for example, a data center server rack 105 in a data center. During operation of server tray package 300, processing devices 316 and memory modules 314 generate heat that may need to be dissipated or removed from server tray package 300 (e.g., for proper operation of server tray package 300). The heat generated by processing devices 316 and memory modules 314 is transferred via thermal interface material 318 to the cover 308 of the base 306 of liquid cooling plate assembly 301. The transferred heat is further transferred from cover 308 to vapor chamber 350 via thermal interface material 320. When heat is transferred to fluid 354, fluid 354 may boil or evaporate. Boiling or evaporating fluid 354 naturally circulates toward the top of vapor chamber 350, where heat is transferred to the bottom 328 of top cap 322. When heat is transferred to the bottom 328, the evaporated or boiled fluid 354 condenses back into liquid form and falls back to the bottom of the steam chamber 350.

Heat transferred to the bottom 328 of the top cap 322 is then transferred to the coolant source 340, which circulates through inlet 330 and enters the volume 334 of the top cap 322. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray package 300. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 340 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 314 and 316.

In some examples, heat is transferred directly from the bottom 328 to the coolant source 340. Heat may also be transferred from the bottom 328 via one or more heat transfer surfaces 336 and then to the coolant source 340 flowing through the channel 338. The heated coolant source 340 circulates to the outlet 332 and exits the top cap 322 as a coolant return 342 (e.g., the temperature of the coolant return 342 is higher than the temperature of the coolant source 340). The coolant return 342 circulates back to, for example, a coolant source to dissipate heat from the return 342 (e.g., in a cooler, cooling tower, or other heat exchanger).

Figures 3C and 3D illustrate schematic side and top views of another example embodiment of a vapor chamber 370 that can be used in a liquid cooling plate assembly in a server tray package (such as server tray package 300). As shown, the vapor chamber 370 has multiple sub-chambers; in this example, three sub-chambers are divided between two sub-chambers 374 and 376. A heat transfer fluid may be contained in each sub-chamber 374 and 376. As further shown, sub-chamber 374 may have different dimensions (e.g., length and width) than sub-chamber 376. As shown in Figure 3D, when the vapor chamber 370 is located on cover 308, the larger single sub-chamber 376 may be located above processor 316, while the two sub-chambers 374 may be located above memory module 314. In this example, each sub-chamber may be customized, for example, according to the thermal power output of the specific data center electronic device in which each sub-chamber is located. For example, the type of heat transfer fluid contained in each sub-chamber or the size of each sub-chamber may be customized to meet the heat transfer requirements for removing heat from a specific data center electronic device.

Figure 4A shows a schematic cross-sectional side view of another example embodiment of a server tray package 400 including a liquid cooling plate assembly 401 and a vapor chamber 450. In some embodiments, the server tray package 400 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 4, the server tray package 400 includes a printed circuit board 402 (e.g., a motherboard 402) supporting one or more data center electronics devices; in this example, two or more memory modules 414 and one or more processing devices 416 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 402 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 402 into place and hold it in place within the rack 105. For example, the server tray package 400 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and above a pair of rails in the rack 105 on the opposite side of the server tray package 400—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 402, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 402), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 402 is mounted on the frame; alternatively, multiple motherboards 402 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 402 or the frame such that when the server tray package 400 is mounted in the rack 105, air enters at the front edge of the server tray package 400 closer to the front of the rack 105, flows over the motherboard 402, flows over some data center electronic components on the motherboard 402, and exits from the server tray package 400 at the rear edge closer to the rear of the rack 105 when the server tray package 400 is mounted in the rack 105. One or more fans may be mounted to the motherboard 402 or the frame via brackets.

As shown, substrate 404 and interposer 412 (e.g., silicon interposer) are located between data center electronics devices 414 and 416 and motherboard 402. For example, substrate 404 provides an interface between one or more data center electronics devices (e.g., processing device 416) and motherboard 402, such as by providing pins for electrical and communication interfaces. In this example, substrate 404 may also provide mounting locations for one or more components of liquid cooling plate assembly 401. For example, interposer 412 provides high-bandwidth connections between data center electronics devices, such as between memory module 414 and processing device 416.

As shown in Figure 4, the liquid cooling plate assembly 401 includes a top 422 (also referred to as a top cap 422) and a base 406. The base 406 includes a cover 408 defining a top surface of the base 406 and side surfaces 410 coupling the cover 408 to a substrate 404. The cover 408 and side surfaces 410 together define or enclose a volume 403 in which an interposer 412 and data center electronics 414 and 416 (mounted thereon) are located within a server tray package 400. As illustrated in this example, a thermal interface material 418 (e.g., a phase change material or other thermally conductive material) is contactlessly located between the bottom side of the cover 408 and the data center electronics 414 and 416 to provide a conductive heat transfer interface between these components.

In this example embodiment, the top cap 422 is attached to the steam chamber 450 via another thermal interface material 420 (e.g., a phase change material or other thermally conductive material), which provides a conductive heat transfer interface between the bottom 428 of the top cap 422 and the steam chamber 450. In this example, the steam chamber 450 may be a single-chamber steam chamber (e.g., as shown in FIG. 3B) or a multi-chamber steam chamber (as shown in FIG. 3C-3D or 4B-4C). Furthermore, as shown in this example, the top cap 422 and the steam chamber 450 may have dimensions larger than those of the base 406 (e.g., length and width). Therefore, as shown, the steam chamber 450 and the top cap 422 may hang over two or more sides of the cover 408 of the base 406 (two sides shown in FIG. 4A). Compared to a vapor chamber/cap combination with similar dimensions (e.g., length and width) to cap 408, this vapor chamber 450/cap 422 combination can provide better heat transfer from data center electronics 414 and 416. Therefore, more heat can be removed, or alternatively, a smaller volume of coolant flow 440 can be circulated to cap 322 to produce the same amount of heat transfer performance.

In some respects, one or more electronic devices (e.g., processor 416) may generate more heat than other electronic devices (e.g., memory module 414). Therefore, the steam chamber 450 can eliminate or help eliminate hot spots caused by processor 416 by distributing the heat from processor 416 throughout the chamber 450 (e.g., distributing it into the fluid). Thus, while there may be non-uniform (per unit area) heat transfer from data center electronic devices 414 and 416 to the steam chamber, uniform or substantially uniform (per unit area) heat transfer from the steam chamber to the top cap assembly 422 can be achieved.

The steam chamber 450 is mounted to the cover 408 of the base 406 via another thermal interface material 453 (e.g., a phase change material or other thermally conductive material). Therefore, there is a conductive heat transfer interface between the steam chamber 450 and the cover 408 of the base 406.

As shown, the top cap 422 includes a cap 424 connected to the bottom 428 via a side 426. The cap 424, side 426, and bottom 428 together define a volume 434 through which coolant flow circulates. As shown in this example, the cap 424 includes a coolant inlet 430 through which a coolant source 440 enters. The cap 424 also includes a coolant outlet 432 through which coolant return 442 exits. The volume 434 defines or includes a coolant flow path between the inlet 430 and the outlet 432. As shown in this example, one or more heat transfer surfaces 436 (e.g., fins, undulations, ridges, or other extended surfaces that increase heat transfer area) are located within the volume 434. The heat transfer surface 436 defines a channel 438 through which coolant can circulate, for example, to increase the amount of heat transferred from data center electronics 414 and 416 to the coolant (e.g., relative to the amount transferred in an embodiment of the server tray package 400 that does not include the heat transfer surface 436). Alternative embodiments of the server tray package 400 may include multiple inlets 430, multiple outlets 432, or may exclude the heat transfer surface 436.

In an example operation of cooling data center electronics 414 and 416 with server tray package 400, server tray package 400 may be deployed in, for example, a data center server rack 105 in a data center. During operation of server tray package 400, processing devices 416 and memory modules 414 generate heat that may need to be dissipated or removed from server tray package 400 (e.g., for proper operation of server tray package 400). The heat generated by processing devices 416 and memory modules 414 is transferred via thermal interface material 418 to the cover 408 of the base 406 of liquid cooling plate assembly 401. The transferred heat is further transferred from cover 408 to vapor chamber 450 via thermal interface material 420. When heat is transferred to the fluid, the fluid may boil or evaporate. The boiling or evaporating fluid naturally circulates toward the top of vapor chamber 450, where heat is transferred to the bottom 428 of top cap 422. When heat is transferred to bottom 428, the evaporated or boiled fluid condenses back into liquid form and falls back to the bottom of vapor chamber 450.

Heat transferred to the bottom 428 of the top cap 422 is then transferred to the coolant source 440, which circulates through inlet 430 and enters the volume 434 of the top cap 422. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray package 400. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 440 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 414 and 416.

In some examples, heat is transferred directly from the bottom 428 to the coolant source 440. Heat can also be transferred from the bottom 428 via one or more heat transfer surfaces 436 and then to the coolant source 440 flowing through the channel 438. The heated coolant source 440 circulates to the outlet 432 and exits the top cap 422 as a coolant return 442 (e.g., the temperature of the coolant return 442 is higher than the temperature of the coolant source 440). The coolant return 442 circulates back to, for example, a coolant source to dissipate heat from the return 442 (e.g., in a cooler, cooling tower, or other heat exchanger).

Figures 4B and 4C illustrate schematic side and top views of another example embodiment of a vapor chamber 470 that can be used in a liquid cooling plate assembly in a server tray package (such as server tray package 400). As shown, the vapor chamber 470 has multiple sub-chambers; in this example, three sub-chambers are divided between two sub-chambers 474 and 476. A heat transfer fluid may be contained in each sub-chamber 474 and 476. As further shown, sub-chamber 474 may have different dimensions (e.g., length and width, or even shape) than sub-chamber 476. As shown in Figure 4C, when the vapor chamber 470 is positioned on cover 408, the larger single sub-chamber 476 may be positioned above processor 416 and extend adjacent to memory module 414 (e.g., in an "I" or "H" shape). Two sub-chambers 474 may be positioned above memory module 414 and are rectangular in shape in this example. In this example, each sub-chamber may be customized, for example, according to the thermal power output of the specific data center electronics where each sub-chamber is located. For example, the type of heat transfer fluid contained in each sub-chamber or the size or shape of each sub-chamber can be customized to meet the heat transfer requirements for removing heat from specific data center electronic equipment.

Figure 5 shows a schematic cross-sectional side view of another example embodiment of a server tray package 500 including a liquid cooling plate assembly 501 and a vapor chamber 550. In some embodiments, the server tray package 500 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 5, the server tray package 500 includes a printed circuit board 502 (e.g., a motherboard 502) supporting one or more data center electronics devices; in this example, two or more memory modules 514 and one or more processing devices 516 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 502 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 502 into place and hold it in place within the rack 105. For example, the server tray package 500 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and above a pair of rails in the rack 105 on the opposite side of the server tray package 500—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 502, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 502), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 502 is mounted on the frame; alternatively, multiple motherboards 502 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 502 or the frame such that when the server tray package 500 is mounted in the rack 105, air enters at the front edge of the server tray package 500 closer to the front of the rack 105, flows over the motherboard 502, flows over some data center electronic components on the motherboard 502, and exits from the server tray package 500 at the rear edge closer to the rear of the rack 105 when the server tray package 500 is mounted in the rack 105. One or more fans may be mounted to the motherboard 502 or the frame via brackets.

As shown, substrate 504 and interposer 512 (e.g., silicon interposer) are located between data center electronics devices 514 and 516 and motherboard 502. For example, substrate 504 provides an interface between one or more data center electronics devices (e.g., processing device 516) and motherboard 502, such as by providing pins for electrical and communication interfaces. In this example, substrate 504 may also provide mounting locations for one or more components of liquid cooling plate assembly 501. For example, interposer 512 provides high-bandwidth connections between data center electronics devices, such as between memory module 514 and processing device 516.

As shown in Figure 5, the liquid cooling plate assembly 501 includes a top 522 (also referred to as a top cap 522) and a base 506. The base 506 includes a cover 508 defining a top surface of the base 506 and side surfaces 510 coupling the cover 508 to a substrate 504. The cover 508 and side surfaces 510 together define or enclose a volume 503 in which an interposer 512 and data center electronics 514 and 516 (mounted thereon) are located within a server tray package 500. As illustrated in this example, a thermal interface material 518 (e.g., a phase change material or other thermally conductive material) is contactlessly located between the bottom side of the cover 508 and the data center electronics 514 and 516 to provide a conductive heat transfer interface between these components.

In this example embodiment, the top cap 522 includes a steam chamber 550 (integrated with the steam chamber 550). The steam chamber 550 can be a single-chamber steam chamber (e.g., as shown in FIG. 3B) or a multi-chamber steam chamber (e.g., as shown in FIG. 3C-3D or 4B-4C). As shown in this example, the steam chamber 550 is located on top of the data center electronics 514 and 516. In some aspects, one or more electronics (e.g., processor 516) may generate more heat than other electronics (e.g., memory module 514). Therefore, the steam chamber 550 can eliminate or help eliminate hot spots caused by the processor 516 by distributing the heat from the processor 516 throughout the chamber 550 (e.g., distributing it into a fluid). Thus, while there may be non-uniform (per unit area) heat transfer from the data center electronics 514 and 516 to the steam chamber, uniform or substantially uniform (per unit area) heat transfer from the steam chamber to the top cap assembly 522 can be achieved.

A top cap 522, including a steam chamber 550, is attached to a cover 508 of a base 506 via another thermal interface material 520 (e.g., a phase change material or other thermally conductive material). Thus, a conductive heat transfer interface is established between the top cap 522 and the cover 508 of the base 506 via the steam chamber 550 and the thermal interface material 520.

As shown, the top cap 522 includes a cap 524 connected to the steam chamber 550 via a side 526. The cap 524, side 526, and steam chamber 550 together define a volume 534 through which coolant flow circulates. As shown in this example, the cap 524 includes a coolant inlet 530 through which a coolant source 540 can enter. The cap 524 also includes a coolant outlet 532 through which coolant return 542 can exit. The volume 534 defines or includes a coolant flow path between the inlet 530 and the outlet 532. As shown in this example, one or more heat transfer surfaces 536 (e.g., fins, undulations, ridges, or other extended surfaces that increase heat transfer area) are located within the volume 534. The heat transfer surface 536 defines a channel 538 through which coolant can circulate, for example, to increase the amount of heat transferred from data center electronics 514 and 516 to the coolant (e.g., relative to the amount transferred in an embodiment of the server tray package 500 that does not include the heat transfer surface 536). Alternative embodiments of the server tray package 500 may include multiple inlets 530, multiple outlets 532, or may not include the heat transfer surface 536.

In an example operation of cooling data center electronics 514 and 516 with server tray package 500, server tray package 500 may be deployed in, for example, a data center server rack 105 in a data center. During operation of server tray package 500, processing devices 516 and memory modules 514 generate heat that may need to be dissipated or removed from server tray package 500 (e.g., for proper operation of server tray package 500). The heat generated by processing devices 516 and memory modules 514 is transferred via thermal interface material 518 to the cover 508 of the base 506 of liquid cooling plate assembly 501. The transferred heat is further transferred from cover 508 to vapor chamber 550 via thermal interface material 520. When heat is transferred to the fluid, the fluid may boil or evaporate. The boiling or evaporating fluid naturally circulates toward the top of vapor chamber 550, where heat is transferred to coolant source 540. When heat is transferred to source 540, the evaporated or boiling fluid condenses back into liquid form and falls back to the bottom of vapor chamber 550.

Heat from the vapor chamber 550 is transferred to the coolant source 540, which circulates through inlet 530 and enters the volume 534 of the top cap 522. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray enclosure 500. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquids (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 540 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 514 and 516.

In some examples, heat is transferred directly from the steam chamber 550 (shell) to the coolant source 540. Heat can also be transferred from the shell of the steam chamber 550 via one or more heat transfer surfaces 536 and then to the coolant source 540 flowing through passage 538. The heated coolant source 540 circulates to outlet 532 and exits the top cap 522 as coolant return 542 (e.g., the temperature of the coolant return 542 is higher than the temperature of the coolant source 540). The coolant return 542 circulates back to, for example, a coolant source to dissipate heat from the return 542 (e.g., in a cooler, cooling tower, or other heat exchanger).

Figure 6 shows a schematic cross-sectional side view of another example embodiment of a server tray package 600 including a liquid cooling plate assembly 601 and a vapor chamber 650. In some embodiments, the server tray package 600 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 6, the server tray package 600 includes a printed circuit board 602 (e.g., a motherboard 602) supporting one or more data center electronics devices; in this example, two or more memory modules 614 and one or more processing devices 616 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 602 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 602 into place and hold it in place within the rack 105. For example, the server tray package 600 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and above a pair of rails in the rack 105 on the opposite side of the server tray package 600—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 602, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 602), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 602 is mounted on the frame; alternatively, multiple motherboards 602 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 602 or the frame such that when the server tray package 600 is mounted in the rack 105, air enters at the front edge of the server tray package 600 closer to the front of the rack 105, flows over the motherboard 602, flows over some data center electronic components on the motherboard 602, and exits from the server tray package 600 at the rear edge closer to the rear of the rack 105 when the server tray package 600 is mounted in the rack 105. One or more fans may be mounted to the motherboard 602 or the frame via brackets.

As shown, substrate 604 and interposer 612 (e.g., silicon interposer) are located between data center electronics devices 614 and 616 and motherboard 602. For example, substrate 604 provides an interface between one or more data center electronics devices (e.g., processing device 616) and motherboard 602, such as by providing pins for electrical and communication interfaces. In this example, substrate 604 may also provide mounting locations for one or more components of liquid cooling plate assembly 601. For example, interposer 612 provides high-bandwidth connections between data center electronics devices, such as between memory module 614 and processing device 616.

As shown in Figure 6, the liquid cooling plate assembly 601 includes a top 622 (also referred to as a top cap 622) and a base 606. The base 606 includes a vapor chamber 650 integrated therein defining a top surface of the base 606 and sidewalls 610 coupling the vapor chamber 650 to a substrate 604. The vapor chamber 650 and sidewalls 610 together define or enclose a volume 603 in which an interposer 612 and data center electronics 614 and 616 (mounted thereon) are located within a server tray package 600. As illustrated in this example, a thermal interface material 618 (e.g., a phase change material or other thermally conductive material) is contactlessly located between the bottom side of the vapor chamber 650 and the data center electronics 614 and 616 to provide a conductive heat transfer interface between these components.

In this example embodiment, the top cap 622 is attached to the steam chamber 650 via another thermal interface material 620 (e.g., a phase change material or other thermally conductive material), which provides a conductive heat transfer interface between the bottom 628 of the top cap 622 and the steam chamber 650. The steam chamber 650 can be a single-chamber steam chamber (e.g., as shown in FIG. 3B) or a multi-chamber steam chamber (e.g., as shown in FIG. 3C-3D or 4B-4C). As shown in this example, the steam chamber 650 is located at the top of the data center electronics 614 and 616. In some aspects, one or more electronics (e.g., processor 616) may generate more heat than other electronics (e.g., memory module 614). Therefore, the steam chamber 650 can eliminate or help eliminate hot spots caused by the processor 616 by distributing the heat from the processor 616 throughout the chamber 650 (e.g., distributing it into a fluid). Therefore, although there may be non-uniform (per unit area) heat transfer from the data center electronics 614 and 616 to the steam chamber, uniform or substantially uniform (per unit area) heat transfer from the steam chamber to the top cap 622 can be achieved.

As shown, the top cap 622 includes a cap 624 connected to the bottom 628 via a side 626. The cap 624, side 626, and bottom 628 together define a volume 634 through which coolant flow circulates. As shown in this example, the cap 624 includes a coolant inlet 630 through which a coolant source 640 enters. The cap 624 also includes a coolant outlet 632 through which coolant return 642 exits. The volume 634 defines or includes a coolant flow path between the inlet 630 and the outlet 632. As shown in this example, one or more heat transfer surfaces 636 (e.g., fins, undulations, ridges, or other extended surfaces that increase heat transfer area) are located within the volume 634. The heat transfer surface 636 defines a channel 638 through which coolant can circulate, for example, to increase the amount of heat transferred from data center electronics 614 and 616 to the coolant (e.g., relative to the amount transferred in an embodiment of the server tray package 600 that does not include the heat transfer surface 636). Alternative embodiments of the server tray package 600 may include multiple inlets 630, multiple outlets 632, or may exclude the heat transfer surface 636.

In an example operation of cooling data center electronics 614 and 616 with server tray package 600, server tray package 600 may be deployed in, for example, a data center server rack 105 in a data center. During operation of server tray package 600, processing devices 616 and memory modules 614 generate heat that may need to be dissipated or removed from server tray package 600 (e.g., for proper operation of server tray package 600). The heat generated by processing devices 616 and memory modules 614 is transferred via thermal interface material 618 to vapor chamber 650 of base 606 of liquid cooling plate assembly 601. The transferred heat is transferred via thermal interface material 620 to fluid in vapor chamber 650. As heat is transferred to the fluid, the fluid may boil or evaporate. The boiling or evaporating fluid naturally circulates toward the top of vapor chamber 650, where heat is transferred to bottom 628 of top cap 622. When heat is transferred to bottom 628, the evaporated or boiled fluid condenses back into liquid form and falls back to bottom of vapor chamber 650.

Heat transferred to the bottom 628 of the top cap 622 is then transferred to a coolant source 640, which circulates through inlet 630 and enters the volume 634 of the top cap 622. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray enclosure 600. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 640 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 614 and 616.

In some examples, heat is transferred directly from the bottom 628 to the coolant source 640. Heat may also be transferred from the bottom 628 via one or more heat transfer surfaces 636 and then to the coolant source 640 flowing through the channel 638. The heated coolant source 640 circulates to the outlet 632 and exits the top cap 622 as a coolant return 642 (e.g., the temperature of the coolant return 642 is higher than the temperature of the coolant source 640). The coolant return 642 circulates back to, for example, a coolant source to dissipate heat from the return 642 (e.g., in a cooler, cooling tower, or other heat exchanger).

Figure 7 shows a schematic cross-sectional side view of a portion of an example embodiment of a server tray package 700 including a liquid cooling plate assembly 701 disposed on a partial cover 706. In some embodiments, the server tray package 700 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 7, the server tray package 700 includes a printed circuit board 702 (e.g., a motherboard 702) supporting one or more data center electronics devices; in this example, two or more voltage regulators 714, two or more capacitors 705, and one or more processing devices 716 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 702 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 702 into place and hold it in place within the rack 105. For example, the server tray package 700 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and above a pair of rails in the rack 105 on the opposite side of the server tray package 700—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 702, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 702), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 702 is mounted on the frame; alternatively, multiple motherboards 702 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 702 or the frame such that when the server tray package 700 is mounted in the rack 105, air enters at the front edge of the server tray package 700 closer to the front of the rack 105, flows over the motherboard 702, flows over some data center electronic components on the motherboard 702, and exits from the server tray package 700 at the rear edge closer to the rear of the rack 105 when the server tray package 700 is mounted in the rack 105. One or more fans may be mounted to the motherboard 702 or the frame via brackets.

As shown, substrate 704 and one or more interposers 712 (e.g., silicon interposers) are located between data center electronics devices 705, 714, and 716 and motherboard 702. For example, substrate 704 provides an interface between one or more data center electronics devices (e.g., processing device 716) and motherboard 702, such as by providing pins for electrical and communication interfaces. In this example, substrate 704 may also provide mounting locations for one or more components of liquid cooling plate assembly 701. For example, interposers 712 provide high-bandwidth connections between data center electronics devices, such as between memory module 714 and processing device 716.

In the example of the server tray package 700, the data center electronics 705, 714, and 716 can have different dimensions, and more specifically, different heights. For example, as shown, the voltage regulator 714 can be relatively taller than the processor 716 (and capacitor 705) (e.g., 2 to 3 times taller). Furthermore, in some respects, the data center electronics 705, 714, and 716 can generate different thermal outputs during their respective operations. For example, in some respects, the processor 716 can generate significantly more heat during operation than the voltage regulator 714 (e.g., at least an order of magnitude more).

As shown in Figure 7, the liquid cooling plate assembly 701 includes a side portion 735 and a base portion 739. As shown, the side portion 735 extends from the base portion 739 and is thinner than the base portion 739 (e.g., shorter in vertical distance). Although not shown, from a top view, the liquid cooling plate assembly 701 may be a relatively square shape, wherein the side portion 735 is part of a peripheral region that is external to the base portion 739.

A cover 706 or a partial cover 706 is located on the substrate 704 and includes a hole through which the base 739 can extend when the liquid cooling plate assembly 701 is located on the cover 706. Although not shown, from a top view, the partial cover 706 may be in the shape of a square ring, wherein the hole is square in shape to allow the base 739 of the liquid cooling plate assembly to be inserted when the side portion 735 is located on the partial cover 706.

As shown, a partial cover 706 defines or surrounds a volume 703 in which an interposer 712 and data center electronics 705, 714, and 716 (mounted thereon) are located within a server tray package 700. As illustrated in this example, a thermal interface material 718 (e.g., a phase change material or other thermally conductive material) is located in contact between the underside of the partial cover 706 and the data center electronics 714 to provide a conductive heat transfer interface between these components.

In this example embodiment, side portion 735 is mounted to the top surface of partial cover 706. When side portion 735 is mounted to the top of partial cover 706, base portion 739 (e.g., bottom surface of base portion 739) is positioned to be in thermal contact with the top surface of processor 716 via phase change material 718 (or other thermally conductive material), which provides a conductive heat transfer interface between the bottom of base portion 739 and processor 716.

As illustrated in this example, the liquid cooling plate assembly 701 includes a coolant inlet 730 through which a coolant source 740 may enter. The liquid cooling plate assembly 701 also includes a coolant outlet 732 through which a coolant return flow 742 may exit. A volume 734 defines or includes a coolant flow path between the inlet 730 and the outlet 732. As illustrated in this example, one or more heat transfer surfaces 736 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 734. In this example, the heat transfer surface 736 extends from or near the top inner surface of the assembly 701 to or near the bottom inner surface of the base 739 of the assembly 701.

The heat transfer surface 736 defines a channel 738 through which coolant can circulate, for example, to increase the amount of heat transferred from data center electronics 714 and 716 to the coolant (e.g., relative to the amount transferred in an embodiment of the server tray package 700 that does not include the heat transfer surface 736). Alternative embodiments of the server tray package 700 may include multiple inlets 730, multiple outlets 732, or may exclude the heat transfer surface 736.

In an example operation of cooling data center electronics 714 and 716 with server tray package 700, server tray package 700 may be deployed in, for example, a data center server rack 105 in a data center. During operation of server tray package 700, processing device 716 and voltage regulator 714 generate heat that may need to be dissipated or removed from server tray package 700 (e.g., for proper operation of server tray package 700). The heat generated by processing device 716 is transferred to base 739 of liquid cooling plate assembly 701 via thermal interface material 718. The heat generated by voltage regulator 714 is transferred to side 735 of liquid cooling plate assembly 701 via thermal interface material 718 and partial cover 706. In some examples, one or more components of liquid cooling plate assembly 701 may be formed or made of thermally conductive materials, such as copper, aluminum, combinations of copper and aluminum, or other thermally conductive materials.

Heat transferred to the base 739 and sides 735 of the liquid cooling plate assembly 701 is then transferred to a coolant source 740, which circulates through inlet 730 and enters the volume 734 of the liquid cooling plate assembly 701. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray package 700. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 740 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 714 and 716.

In some examples, heat is transferred directly from the base 739 to the coolant source 740. Heat may also be transferred from the base 739 via one or more heat transfer surfaces 736 (in this example, confined to the base 739) and then to the coolant source 740 flowing through the channel 738. The heated coolant source 740 circulates to the outlet 732 and exits the liquid cooling plate assembly 701 as a coolant return 742 (e.g., the temperature of the coolant return 742 is higher than the temperature of the coolant source 740). The coolant return 742 circulates back to, for example, the coolant source to dissipate heat from the return 742 (e.g., in a cooler, cooling tower, or other heat exchanger).

Figure 8 shows a schematic cross-sectional side view of a portion of an example embodiment of a server tray package 800 including a liquid cooling plate assembly 801 disposed on a partial cover 806. In some embodiments, the server tray package 800 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 8, the server tray package 800 includes a printed circuit board 802 (e.g., a motherboard 802) supporting one or more data center electronics devices; in this example, two or more voltage regulators 814, two or more capacitors 805, and one or more processing devices 816 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 802 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 802 into place and hold it in place within the rack 105. For example, the server tray package 800 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and above a pair of rails in the rack 105 on the opposite side of the server tray package 800—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 802, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 802), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 802 is mounted on the frame; alternatively, multiple motherboards 802 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 802 or the frame such that when the server tray package 800 is mounted in the rack 105, air enters at the front edge of the server tray package 800 closer to the front of the rack 105, flows over the motherboard 802, flows over some data center electronic components on the motherboard 802, and exits from the server tray package 800 at the rear edge closer to the rear of the rack 105 when the server tray package 800 is mounted in the rack 105. One or more fans may be mounted to the motherboard 802 or the frame via brackets.

As shown, substrate 804 and one or more interposers 812 (e.g., silicon interposers) are located between data center electronics devices 805, 814, and 816 and motherboard 802. For example, substrate 804 provides an interface between one or more data center electronics devices (e.g., processing device 816) and motherboard 802, such as by providing pins for electrical and communication interfaces. In this example, substrate 804 may also provide mounting locations for one or more components of liquid cooling plate assembly 801. For example, interposers 812 provide high-bandwidth connections between data center electronics devices, such as between memory module 814 and processing device 816.

In the example of server tray package 800, data center electronics 805, 814, and 816 can have different dimensions, and more specifically, different heights. For example, as shown, voltage regulator 814 can be relatively taller than processor 816 (and capacitor 805) (e.g., 2 to 3 times taller). Furthermore, in some respects, data center electronics 805, 814, and 816 can generate different thermal outputs during their respective operations. For example, in some respects, processor 816 can generate significantly more heat during operation than voltage regulator 814 (e.g., at least an order of magnitude more).

As shown in Figure 8, the liquid cooling plate assembly 801 includes a side portion 835 and a base portion 839. As shown, the side portion 835 extends from the base portion 839 and is thinner than the base portion 839 (e.g., shorter in vertical distance). Although not shown, from a top view, the liquid cooling plate assembly 801 may be a relatively square shape, wherein the side portion 835 is part of a peripheral region that is external to the base portion 839.

A cover 806 or a partial cover 806 is located on the substrate 804 and includes a hole through which the base 839 can extend when the liquid cooling plate assembly 801 is located on the cover 806. Although not shown, from a top view, the partial cover 806 may be in the shape of a square ring, wherein the hole is square in shape to allow the base 839 of the liquid cooling plate assembly to be inserted when the side portion 835 is located on the partial cover 806.

As shown, a partial cover 806 defines or surrounds a volume 803 in which an interposer 812 and data center electronics 805, 814, and 816 (mounted thereon) are located within a server tray package 800. As illustrated in this example, a thermal interface material 818 (e.g., a phase change material or other thermally conductive material) is located in contact between the underside of the partial cover 806 and the data center electronics 814 to provide a conductive heat transfer interface between these components.

In this example embodiment, side portion 835 is mounted to the top surface of partial cover 806. When side portion 835 is mounted to the top of partial cover 806, base portion 839 (e.g., bottom surface of base portion 839) is positioned to be in thermal contact with the top surface of processor 816 via phase change material 818 (or other thermally conductive material), which provides a conductive heat transfer interface between the bottom of base portion 839 and processor 816.

As illustrated in this example, the liquid cooling plate assembly 801 includes a coolant inlet 830 through which a coolant source 840 can enter. The liquid cooling plate assembly 801 also includes a coolant outlet 832 through which a coolant return flow 842 can exit. A volume 834 defines or includes a coolant flow path between the inlet 830 and the outlet 832. As illustrated in this example, one or more heat transfer surfaces 836 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located within the volume 834. In this example, the heat transfer surfaces 836 extend from or near the top inner surface of the assembly 801 to or near the bottom inner surface of the base 839 of the assembly 801. Therefore, in this example, the volume 834 (and the heat transfer surfaces 836) have a substantially uniform height between the inlet 830 and the outlet 840.

The heat transfer surface 836 defines a channel 838 through which coolant can circulate, for example, to increase the amount of heat transferred from data center electronics 814 and 816 to the coolant (e.g., relative to the amount transferred in an embodiment of the server tray package 800 that does not include the heat transfer surface 836). Alternative embodiments of the server tray package 800 may include multiple inlets 830, multiple outlets 832, or may not include the heat transfer surface 836.

In an example operation of cooling data center electronics 814 and 816 using a server tray package 800, the server tray package 800 may be deployed in a data center server rack 105, for example, in a data center. During operation of the server tray package 800, the processing device 816 and the voltage regulator 814 generate heat that may need to be dissipated or removed from the server tray package 800 (e.g., for proper operation of the server tray package 800). The heat generated by the processing device 816 is transferred to the base 839 of the liquid cooling plate assembly 801 via a thermal interface material 818. The heat generated by the voltage regulator 814 is transferred to the side 835 of the liquid cooling plate assembly 801 via the thermal interface material 818 and a partial cover 806. In some examples, one or more components of the liquid cooling plate assembly 801 may be formed or made of a thermally conductive material, such as copper, aluminum, a combination of copper and aluminum, or other thermally conductive materials.

Heat transferred to the base 839 and sides 835 of the liquid cooling plate assembly 801 is then transferred to a coolant source 840, which circulates through inlet 830 and enters the volume 834 of the liquid cooling plate assembly 801. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray package 800. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 840 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 814 and 816.

In some examples, heat is transferred directly from the base 839 to the coolant source 840. Heat can also be transferred from the base 839 via one or more heat transfer surfaces 836 (in this example, confined to the base 839, but only to the height of the volume 834) and then to the coolant source 840 flowing through the channel 838. The heated coolant source 840 circulates to the outlet 832 and exits the liquid cooling plate assembly 801 as a coolant return 842 (e.g., the temperature of the coolant return 842 is higher than the temperature of the coolant source 840). The coolant return 842 circulates back to, for example, the coolant source to dissipate heat from the return 842 (e.g., in a cooler, cooling tower, or other heat exchanger).

Figure 9 shows a schematic cross-sectional side view of a portion of another example embodiment of a server tray package 900 including a liquid cooling plate assembly 901 disposed on a partial cover 906. In some embodiments, the server tray package 900 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 9, the server tray package 900 includes a printed circuit board 902 (e.g., a motherboard 902) supporting one or more data center electronics devices; in this example, two or more voltage regulators 914, two or more capacitors 905, and one or more processing devices 916 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 902 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 902 into place and hold it in place within the rack 105. For example, the server tray package 900 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and above a pair of rails in the rack 105 on the opposite side of the server tray package 900—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 902, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 902), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 902 is mounted on the frame; alternatively, multiple motherboards 902 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 902 or the frame such that when the server tray package 900 is mounted in the rack 105, air enters at the front edge of the server tray package 900 closer to the front of the rack 105, flows over the motherboard 902, flows over some data center electronic components on the motherboard 902, and exits from the server tray package 900 at the rear edge closer to the rear of the rack 105 when the server tray package 900 is mounted in the rack 105. One or more fans may be mounted to the motherboard 902 or the frame via brackets.

As shown, substrate 904 and one or more interposers 912 (e.g., silicon interposers) are located between data center electronics devices 905, 914, and 916 and motherboard 902. For example, substrate 904 provides an interface between one or more data center electronics devices (e.g., processing device 916) and motherboard 902, such as by providing pins for electrical and communication interfaces. In this example, substrate 904 may also provide mounting locations for one or more components of liquid cooling plate assembly 901. For example, interposers 912 provide high-bandwidth connections between data center electronics devices, such as between memory module 914 and processing device 916.

In the example of server tray package 900, data center electronics 905, 914, and 916 can have different dimensions, and more specifically, different heights. For example, as shown, voltage regulator 914 can be relatively taller than processor 916 (and capacitor 905) (e.g., 2 to 3 times taller). Furthermore, in some respects, data center electronics 905, 914, and 916 can generate different thermal outputs during their respective operations. For example, in some respects, processor 916 can generate significantly more heat during operation than voltage regulator 914 (e.g., at least an order of magnitude more).

As shown in Figure 9, the liquid cooling plate assembly 901 includes a side portion 935 and a base portion 939. As shown, the side portion 935 extends from the base portion 939 and is thinner than the base portion 939 (e.g., shorter in vertical distance). Although not shown, from a top view, the liquid cooling plate assembly 901 may be a relatively square shape, wherein the side portion 935 is part of a peripheral region that is external to the base portion 939.

A cover 906 or a partial cover 906 is located on a substrate 904 and includes a hole through which a base 939 can extend when the liquid cooling plate assembly 901 is located on the cover 906. Although not shown, from a top view, the partial cover 906 may be in the shape of a square ring, wherein the hole is square in shape to allow the base 939 of the liquid cooling plate assembly to be inserted when the side portion 935 is located on the partial cover 906.

As shown, a partial cover 906 defines or surrounds a volume 903 in which an interposer 912 and data center electronics 905, 914, and 916 (mounted thereon) are located within a server tray package 900. As illustrated in this example, a thermal interface material 918 (e.g., a phase change material or other thermally conductive material) is located in contact between the underside of the partial cover 906 and the data center electronics 914 to provide a conductive heat transfer interface between these components.

In this example embodiment, side 935 is mounted to the top surface of partial cover 906. When side 935 is mounted to the top of partial cover 906, base 939 (e.g., bottom surface of base 939) is positioned to be in thermal contact with the top surface of processor 916 via phase change material 918 (or other thermally conductive material), which provides a conductive heat transfer interface between the bottom of base 939 and processor 916.

As shown in this example, the liquid cooling plate assembly 901 includes a coolant inlet 930 through which a coolant source 940 can enter. The liquid cooling plate assembly 901 also includes a coolant outlet 932 through which a coolant return flow 942 can exit. A volume 934 defines or includes a coolant flow path between the inlet 930 and the outlet 932. As shown in this example, one or more heat transfer surfaces 936 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located within the volume 934. In this example, the heat transfer surfaces 936 extend from or near the top inner surface of the assembly 901 to or near the bottom inner surface of the base 939 of the assembly 901. Therefore, in this example, the volume 934 (and the heat transfer surfaces 936) have a substantially uniform height between the inlet 930 and the outlet 932. Furthermore, as shown in this example, the heat transfer surface extends from or near inlet 930 to or near outlet 932.

The heat transfer surface 936 defines a channel 938 through which coolant can circulate, for example, to increase the amount of heat transferred from data center electronics 914 and 916 to the coolant (e.g., relative to the amount transferred in an embodiment of the server tray package 900 that does not include the heat transfer surface 936). Alternative embodiments of the server tray package 900 may include multiple inlets 930, multiple outlets 932, or may exclude the heat transfer surface 936.

In an example operation of cooling data center electronics 914 and 916 with server tray package 900, server tray package 900 may be deployed in, for example, a data center server rack 105 in a data center. During operation of server tray package 900, processing device 916 and voltage regulator 914 generate heat that may need to be dissipated or removed from server tray package 900 (e.g., for proper operation of server tray package 900). The heat generated by processing device 916 is transferred to base 939 of liquid cooling plate assembly 901 via thermal interface material 918. The heat generated by voltage regulator 914 is transferred to side 935 of liquid cooling plate assembly 901 via thermal interface material 918 and partial cover 906. In some examples, one or more components of liquid cooling plate assembly 901 may be formed or made of thermally conductive materials, such as copper, aluminum, combinations of copper and aluminum, or other thermally conductive materials.

Heat transferred to the base 939 and sides 935 of the liquid cooling plate assembly 901 is then transferred to a coolant source 940, which circulates through inlet 930 and enters the volume 934 of the liquid cooling plate assembly 901. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray package 900. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 940 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 914 and 916.

In some examples, heat is transferred directly from the base 939 to the coolant source 940. Heat can also be transferred from the base 939 via one or more heat transfer surfaces 936 (in this example, extending through a volume 934 between the inlet 930 and the outlet 932) and then to the coolant source 940 flowing through the channel 938. The heated coolant source 940 circulates to the outlet 932 and exits the liquid cooling plate assembly 901 as a coolant return 942 (e.g., the temperature of the coolant return 942 is higher than the temperature of the coolant source 940). The coolant return 942 circulates back to, for example, the coolant source to dissipate heat from the return 942 (e.g., in a cooler, cooling tower, or other heat exchanger).

Figure 10 shows a schematic cross-sectional side view of a portion of another example embodiment of a server tray package 1000 including a liquid cooling plate assembly 1001 disposed on a partial cover 1006. In some embodiments, the server tray package 1000 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 10, the server tray package 1000 includes a printed circuit board 1002 (e.g., a motherboard 1002) supporting one or more data center electronics devices; in this example, two or more voltage regulators 1014, two or more capacitors 1005, and one or more processing devices 1016 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 1002 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 1002 into place and hold it in place within the rack 105. For example, the server tray package 1000 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and above a pair of rails in the rack 105 on the opposite side of the server tray package 1000—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 1002, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 1002), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 1002 is mounted on the frame; alternatively, multiple motherboards 1002 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 1002 or the frame such that when the server tray package 1000 is mounted in the rack 105, air enters at the front edge of the server tray package 1000 closer to the front of the rack 105, flows over the motherboard 1002, flows over some data center electronic components on the motherboard 1002, and exits from the server tray package 1000 at the rear edge closer to the rear of the rack 105 when the server tray package 1000 is mounted in the rack 105. One or more fans may be mounted to the motherboard 1002 or the frame via brackets.

As shown, substrate 1004 and one or more interposers 1012 (e.g., silicon interposers) are located between data center electronics devices 1005, 1014, and 1016 and motherboard 1002. For example, substrate 1004 provides an interface between one or more data center electronics devices (e.g., processing device 1016) and motherboard 1002, such as by providing pins for electrical and communication interfaces. In this example, substrate 1004 may also provide mounting locations for one or more components of liquid cooling plate assembly 1001. For example, interposer 1012 provides high-bandwidth connections between data center electronics devices, such as between memory module 1014 and processing device 1016.

In the example of the server tray package 1000, the data center electronics 1005, 1014, and 1016 can have different dimensions, and more specifically, different heights. For example, as shown, the voltage regulator 1014 can be relatively taller than the processor 1016 (and capacitor 1005) (e.g., 2 to 3 times taller). Furthermore, in some aspects, the data center electronics 1005, 1014, and 1016 can generate different thermal outputs during their respective operations. For example, in some aspects, the processor 1016 can generate significantly more heat during operation than the voltage regulator 1014 (e.g., at least an order of magnitude more).

As shown in Figure 10, the liquid cooling plate assembly 1001 includes a side portion 1035 and a base portion 10310. As shown, the side portion 1035 extends from the base portion 10310 and is thinner than the base portion 10310 (e.g., shorter in vertical distance). Although not shown, from a top view, the liquid cooling plate assembly 1001 may be a relatively square shape, wherein the side portion 1035 is part of a peripheral region that is external to the base portion 1039.

A cover 1006 or a partial cover 1006 is located on a substrate 1004 and includes a hole through which a base 1039 can extend when the liquid cooling plate assembly 1001 is located on the cover 1006. Although not shown, from a top view, the partial cover 1006 may be in the shape of a square ring, wherein the hole is square in shape to allow the base 1039 of the liquid cooling plate assembly to be inserted when the side portion 1035 is located on the partial cover 1006.

As shown, a partial cover 1006 defines or surrounds a volume 1003 in which an interposer 1012 and data center electronics 1005, 1014, and 1016 (mounted thereon) are located within a server tray package 1000. As illustrated in this example, a thermal interface material 1018 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of the partial cover 1006 and the data center electronics 1014 to provide a conductive heat transfer interface between these components.

In this example embodiment, side portion 1035 is mounted to the top surface of partial cover 1006. When side portion 1035 is mounted to the top of partial cover 1006, base portion 1039 (e.g., the bottom surface of base portion 1039) is positioned to be in thermal contact with the top surface of processor 1016 via phase change material 1018 (or other thermally conductive material), which provides a conductive heat transfer interface between the bottom of base portion 1039 and processor 1016.

As illustrated in this example, the liquid cooling plate assembly 1001 includes a coolant inlet 1030 through which a coolant source 1040 can enter the central location of the assembly 1001. The liquid cooling plate assembly 1001 also includes coolant outlets 1032a and 1032b located at opposite edges of a side portion 1035, through which coolant return flows 1042a and 1042b can exit. A volume 1034 defines or includes a coolant flow path between the inlet 1030 and the outlets 1032a and 1032b. As illustrated in this example, one or more heat transfer surfaces 1036 (e.g., fins, undulations, ridges, or other extended surfaces that increase heat transfer area) are located within the volume 1034. In this example, the heat transfer surface 1036 extends from or near the top inner surface of the assembly 1001 to or near the bottom inner surface of the base 1039 of the assembly 1001. Therefore, in this example, the volume 1034 (and the heat transfer surface 1036) has a substantially uniform height between the inlet 1030 and the outlets 1032a and 1032b. Furthermore, as shown in this example, the heat transfer surface extends from or near the inlet 1030 to or near the outlets 1032a and 1032b.

The heat transfer surface 1036 defines a channel 1038 through which coolant can circulate, for example, to increase the amount of heat transferred from data center electronics 1014 and 1016 to the coolant (e.g., relative to the amount transferred in an embodiment of the server tray package 1000 that does not include the heat transfer surface 1036). Alternative embodiments of the server tray package 1000 may include a plurality of inlets 1030 and a plurality of outlets 1032, or may exclude the heat transfer surface 1036.

In an example operation of cooling data center electronics 1014 and 1016 with server tray package 1000, server tray package 1000 may be deployed in, for example, a data center server rack 105 in a data center. During operation of server tray package 1000, processing device 1016 and voltage regulator 1014 generate heat that may need to be dissipated or removed from server tray package 1000 (e.g., for proper operation of server tray package 1000). The heat generated by processing device 1016 is transferred to the base 1039 of liquid cooling plate assembly 1001 via thermal interface material 1018. The heat generated by voltage regulator 1014 is transferred to the side 1035 of liquid cooling plate assembly 1001 via thermal interface material 1018 and through partial cover 1006. In some examples, one or more components of liquid cooling plate assembly 1001 may be formed or made of thermally conductive materials, such as copper, aluminum, combinations of copper and aluminum, or other thermally conductive materials.

Heat transferred to the base 1039 and sides 1035 of the liquid cooling plate assembly 1001 is then transferred to a coolant source 1040, which circulates through inlet 1030 and enters the volume 1034 of the liquid cooling plate assembly 1001. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray package 1000. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquid (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 1040 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 1014 and 1016.

In some examples, heat is transferred directly from the base 1039 to the coolant source 1040. Heat can also be transferred from the base 1039 via one or more heat transfer surfaces 1036 (in this example, extending through the volume 1034 between the inlet 1030 and outlets 1032a and 1032b) and then to the coolant source 1040 flowing through the channel 1038. The heated coolant source 1040 circulates to outlets 1032a and 1032b and exits the liquid cooling plate assembly 1001 as coolant return streams 1042a and 1042b (e.g., the temperature of the coolant return streams 1042a and 1042b is higher than the temperature of the coolant source 1040). The coolant return streams 1042a and 1042b circulate back to, for example, the coolant source to dissipate heat from outlets 1032a and 1032b (e.g., in a cooler, cooling tower, or other heat exchanger).

Figure 11 shows a schematic cross-sectional side view of a portion of another example embodiment of a server tray package 1100 including a liquid cooling plate assembly 1101 disposed on a partial cover 1106. In some embodiments, the server tray package 1100 may serve as one or more server rack sub-assemblies 110 shown in Figure 1. Referring to Figure 11, the server tray package 1100 includes a printed circuit board 1102 (e.g., a motherboard 1102) supporting one or more data center electronics devices; in this example, two or more voltage regulators 1114, two or more capacitors 805, and one or more processing devices 1116 (e.g., one or more application-specific integrated circuits (ASICs)). In some aspects, the motherboard 1102 may be mounted on a frame (not shown) that may include or simply be a flat structure that can be gripped by a technician to move the motherboard 1102 into place and hold it in place within the rack 105. For example, the server tray package 1100 can be mounted horizontally in the server rack 105, such as by sliding the frame into the slot 107 and above a pair of rails in the rack 105 on the opposite side of the server tray package 1100—much like sliding a lunch tray into a cafeteria rack. The frame may extend below the motherboard 1102, or may have other forms (e.g., by implementing it as a peripheral frame around the motherboard 1102), or may be removed so that the motherboard itself is located in the rack 105, for example, slidably engaged with the rack 105. The frame may be a flat plate or include one or more sidewalls projecting upward from the edges of the flat plate, and the flat plate may be the base of a box or cage with a closed or open top.

In some examples, a single motherboard 1102 is mounted on the frame; alternatively, multiple motherboards 1102 may be mounted on the frame, depending on the specific application requirements. In some implementations, one or more fans (not shown) may be positioned on the motherboard 1102 or the frame such that when the server tray package 1100 is mounted in the rack 105, air enters at the front edge of the server tray package 1100 closer to the front of the rack 105, flows over the motherboard 1102, flows over some data center electronic components on the motherboard 1102, and exits from the server tray package 1100 at the rear edge closer to the rear of the rack 105 when the server tray package 1100 is mounted in the rack 105. One or more fans may be mounted to the motherboard 1102 or the frame via brackets.

As shown, substrate 1104 and one or more interposers 1112 (e.g., silicon interposers) are located between data center electronics devices 1105, 1114, and 1116 and motherboard 1102. For example, substrate 1104 provides an interface between one or more data center electronics devices (e.g., processing device 1116) and motherboard 1102, such as by providing pins for electrical and communication interfaces. In this example, substrate 1104 may also provide mounting locations for one or more components of liquid cooling plate assembly 1101. For example, interposer 1112 provides high-bandwidth connections between data center electronics devices, such as between memory module 1114 and processing device 1116.

In the example of server tray package 1100, data center electronics 1105, 1114, and 1116 can have different dimensions, and more specifically, different heights. For example, as shown, voltage regulator 1114 can be relatively taller than processor 1116 (and capacitor 1105) (e.g., 2 to 3 times taller). Furthermore, in some respects, data center electronics 1105, 1114, and 1116 can generate different thermal outputs during their respective operations. For example, in some respects, processor 1116 can generate significantly more heat during operation than voltage regulator 1114 (e.g., at least an order of magnitude more).

As shown in Figure 11, the liquid cooling plate assembly 1101 includes a side portion 1135 and a base portion 1139. As shown, the side portion 1135 extends from the base portion 1139 and is thinner than the base portion 1139 (e.g., shorter in vertical distance). Although not shown, from a top view, the liquid cooling plate assembly 1101 may be a relatively square shape, wherein the side portion 1135 is part of a peripheral region that is external to the base portion 1139.

A cover 1106, or a partial cover 1106, is located on the substrate 1104 and includes a hole through which the base 1139 can extend when the liquid cooling plate assembly 1101 is located on the cover 1106. As shown in this example, the partial cover does not contact the top surface of the voltage regulator 1114 (e.g., by phase change material 1118) but is formed as a ring. Although not shown, from a top view, the partial cover 1106 may be in the shape of a square ring, wherein the hole is square in shape to allow the base 1139 of the liquid cooling plate assembly to be inserted when the side portion 1135 is located on the partial cover 1106.

As shown, a partial cover 1106 defines or surrounds a volume 1103 in which an interposer 1112 and data center electronics 1105, 1114, and 1116 (mounted thereon) are located within a server tray package 1100. As illustrated in this example, a thermal interface material 1118 (e.g., a phase change material or other thermally conductive material) is located in contact between the bottom side of side 1135 and the voltage regulator 1114 to provide a conductive heat transfer interface between these components.

In this example embodiment, side portion 1135 is mounted to the top surface of voltage regulator 1114. When side portion 1135 is mounted to the top of voltage regulator 1114, base portion 1139 (e.g., the bottom surface of base portion 1139) is positioned to be in thermal contact with the top surface of processor 1116 via phase change material 1118 (or other thermally conductive material), which provides a conductive heat transfer interface between the bottom of base portion 1139 and processor 1116.

As illustrated in this example, the liquid cooling plate assembly 1101 includes a coolant inlet 1130 through which a coolant source 1140 may enter. The liquid cooling plate assembly 1101 also includes a coolant outlet 1132 through which a coolant return flow 1142 may exit. A volume 1134 defines or includes a coolant flow path between the inlet 1130 and the outlet 1132. As illustrated in this example, one or more heat transfer surfaces 1136 (e.g., fins, undulations, ridges, or other extended surfaces that increase the heat transfer area) are located in the volume 1134. In this example, the heat transfer surface 1136 extends from or near the top inner surface of the assembly 1101 to or near the bottom inner surface of the base 1139 of the assembly 1101.

The heat transfer surface 1136 defines a channel 1138 through which coolant can circulate, for example, to increase the amount of heat transferred from data center electronics 1114 and 1116 to the coolant (e.g., relative to the amount transferred in an embodiment of the server tray package 1100 that does not include the heat transfer surface 1136). Alternative embodiments of the server tray package 1100 may include multiple inlets 1130 and multiple outlets 1132, or may exclude the heat transfer surface 1136.

In an example operation of cooling data center electronics 1114 and 1116 with server tray package 1100, the server tray package 1100 may be deployed in a data center server rack 105, for example, in a data center. During operation of the server tray package 1100, processing device 1116 and voltage regulator 1114 generate heat that may need to be dissipated or removed from the server tray package 1100 (e.g., for proper operation of the server tray package 1100). The heat generated by processing device 1116 is transferred to the base 1139 of liquid cooling plate assembly 1101 via thermal interface material 1118. The heat generated by voltage regulator 1114 is transferred to the side 1135 of liquid cooling plate assembly 1101 via thermal interface material 1118. In some examples, one or more components of liquid cooling plate assembly 1101 may be formed or made of thermally conductive materials, such as copper, aluminum, combinations of copper and aluminum, or other thermally conductive materials.

Heat transferred to the base 1139 and sides 1135 of the liquid cooling plate assembly 1101 is then transferred to a coolant source 1140, which circulates through inlet 1130 and enters the volume 1134 of the liquid cooling plate assembly 1101. In some examples, the coolant may be cooling water or glycol, such as from one or more coolers fluidly coupled to the server tray package 1100. In alternative examples, the coolant may be condensate water or other evaporatively cooled liquids (e.g., without mechanical refrigeration). In other examples, the coolant may be a dielectric single-phase or two-phase fluid. In any case, the coolant source 1140 may be at an appropriate temperature and flow rate to remove the desired heat from the data center electronics 1114 and 1116.

In some examples, heat is transferred directly from base 1139 to coolant source 1140. Heat may also be transferred from base 1139 via one or more heat transfer surfaces 1136 (in this example, confined to base 1139) and then to coolant source 1140 flowing through channel 1138. The heated coolant source 1140 circulates to outlet 1132 and exits the liquid cooling plate assembly 1101 as coolant return 1142 (e.g., the temperature of coolant return 1142 is higher than the temperature of coolant source 1140). Coolant return 1142 circulates back to, for example, a coolant source to dissipate heat from return 1142 (e.g., in a cooler, cooling tower, or other heat exchanger).

Several embodiments have been described. However, it should be understood that various modifications can be made without departing from the spirit and scope of the description. For example, the steps of the example methods and processes described herein can be performed in a different order, some steps can be removed, and other steps can be added. Therefore, other embodiments are within the scope of the following claims.

Claims (15)

1. A server tray package (300), characterized in that it comprises: A motherboard assembly, the motherboard assembly including a plurality of data center electronic devices (314), the plurality of data center electronic devices including at least one heat processor device (316); A liquid cooling plate assembly (301), the liquid cooling plate assembly comprising: A base (306) mounted to the motherboard assembly, the base (306) and the motherboard assembly defining a volume (303) that at least partially surrounds the plurality of data center electronic devices (314); and Top (322), the top being mounted to the base (306) and including a heat transfer member including an inlet end (330) and an outlet end (332), the inlet end and the outlet end being in fluid communication with a coolant flow path (334) defined through the heat transfer member; and A steam chamber (350) is located between the base (306) and the top (322), the steam chamber including a housing (352) that surrounds a heat transfer fluid (354) in thermal contact with the main board assembly and the liquid cooling plate assembly. The steam chamber (350) includes a plurality of fluid-independent chambers (374, 376) within the housing, each of the fluid-independent chambers surrounding at least a portion of the heat transfer fluid. At least one of the fluid-independent chambers (374) includes a first volume, and at least another fluid-independent chamber (376) includes a second volume greater than the first volume. 2. The server tray packaging according to claim 1, characterized in that it further comprises: A first thermal interface material (320) is located between the bottom surface (328) of the top (322) and the steam chamber (350); and A second thermal interface material (318) is located between the bottom surface of the base (306) and at least a portion of the plurality of data center electronic devices (314); and A third thermal interface material (353) is located between the top surface of the base (306) and the steam chamber (350). 3. The server tray packaging according to claim 1, characterized in that, The liquid cooling plate assembly further includes a plurality of heat transfer surfaces (336) surrounding the coolant flow path; and/or The portion of the heat transfer fluid varies in at least one of its components or amounts. 4. The server tray packaging according to claim 1, wherein the second volume is vertically aligned and positioned (370) above the heat-generating processor device (316). 5. The server tray packaging according to claim 1, characterized in that, The steam chamber (550) is integrally formed as the base of the top (522) of the liquid cooling plate assembly (501), and the steam chamber (550) is located at the top of the top surface (508) of the base (506) and is in conductive heat transfer contact with the top surface (508) of the base (506) through a thermal interface material (520); or The steam chamber (650) is integrally formed as a cover for the base (606) of the liquid cooling plate assembly (601), and the steam chamber (650) supports the bottom surface (628) of the top (622) and makes heat transfer contact with the bottom surface (628) of the top (622) through a thermal interface material (620). 6. A method for cooling heat-generating equipment in a data center, characterized in that it comprises: The coolant is circulated to the server tray package (300), the server tray package comprising: A motherboard assembly, the motherboard assembly including a plurality of data center electronic devices (314), the plurality of data center electronic devices (314) including at least one heat processor device (316); A liquid cooling plate assembly (301) including a base (306) and a top (322), the base being mounted to the motherboard assembly, the base (306) and the motherboard assembly defining a volume (303) at least partially surrounding the plurality of data center electronic devices (314), the top being mounted to the base (306) and including a heat transfer member including an inlet end (330) and an outlet end (332) in fluid communication with a coolant flow path defined through the heat transfer member; and A steam chamber (350) is located between the base (306) and the top (322); The coolant is circulated into the inlet end of the heat transfer component; Heat from the plurality of data center electronic devices is received into multiple portions of heat transfer fluid within respective fluid-independent chambers (374, 376) within the housing (352) surrounding the steam chamber, in order to evaporate at least a portion of the heat transfer fluid; The coolant flow from the inlet end is circulated through a coolant flow path defined through the heat transfer member to transfer heat from the evaporated portion of the heat transfer fluid to the coolant; and The heated coolant is circulated from the coolant flow path to the outlet end of the heat transfer component. At least one of the fluid-independent chambers includes a first volume, and at least another fluid-independent chamber includes a second volume larger than the first volume. 7. The method according to claim 6, further comprising: Heat is transferred from the steam chamber through a first thermal interface material (320) located between the bottom surface of the top (322) of the liquid cooling plate assembly (301) and the steam chamber (350); Heat is transferred from the plurality of data center electronic devices through a second thermal interface material (318) located between the plurality of data center electronic devices and the bottom surface of the base; and Heat is transferred from the top surface of the base (306) through a third thermal interface material (353) located between the top surface of the base (306) and the steam chamber (350). 8. The method according to claim 6, wherein circulating the coolant flow through the coolant flow path defined through the heat transfer member comprises circulating the coolant through a plurality of flow channels (338), the plurality of flow channels being defined by a plurality of heat transfer surfaces (336) surrounding the coolant flow path (334). 9. The method according to claim 6, wherein the portion of the heat transfer fluid varies in at least one of its components or amounts. 10. The method according to claim 6, further comprising: Heat from the heat-generating processor is received into a portion of the heat transfer fluid within the second volume surrounded by the other fluid-independent chamber; and Heat from one or more memory devices is received into a portion of the heat transfer fluid within the first volume surrounded by the at least one fluid-independent chamber. 11. The method according to claim 6, characterized in that, The vapor chamber is integrally formed as the base of the top of the liquid cooling plate assembly, and the vapor chamber is located at the top of the top surface (508) of the base (506) and is in conductive heat transfer contact with the top surface of the base through a thermal interface material; or The steam chamber is integrally formed as a cover for the base (606) of the liquid cooling plate assembly, and the steam chamber supports the bottom surface of the top (622) and conducts heat transfer to the bottom surface of the top through a thermal interface material. 12. A method for forming a server tray package (300), characterized in that it comprises: Multiple data center electronic devices (314) are mounted to a motherboard assembly, the multiple data center electronic devices including at least one heat processor device (316); The liquid cooling plate assembly base (306) is mounted to the motherboard assembly to at least partially define the volume (303) surrounding the plurality of data center electronic devices; A vapor chamber (350) is mounted to the base of the liquid cooling plate assembly. The vapor chamber includes a housing (352) defining a plurality of fluid-independent chambers (374, 376) within the housing. Each fluid-independent chamber surrounds at least a portion of the phase change fluid. At least one of the fluid-independent chambers (374) includes a first volume, and at least another fluid-independent chamber (376) includes a second volume larger than the first volume. The top (322) of the liquid cooling plate assembly is mounted to the steam chamber. The top of the liquid cooling plate assembly includes a heat transfer member, which includes an inlet end (330) and an outlet end (332) in fluid communication with a coolant flow path (334) defined through the heat transfer member. 13. The method according to claim 12, further comprising: The plurality of data center electronic devices are installed into the interposer layer (312) of the motherboard assembly; The interposer layer is mounted to the substrate (304) of the motherboard assembly; and The substrate is mounted onto the motherboard (302) of the motherboard assembly. 14. The method according to claim 13, further comprising: The first thermal interface material (320) is positioned between the steam chamber and the bottom surface (328) of the top (322) of the liquid cooling plate assembly; The second thermal interface material (318) is positioned between the bottom surface of the liquid cooling plate assembly base (306) and the plurality of data center electronic devices (314); and The third thermal interface material (353) is positioned between the top surface of the liquid cooling plate assembly base (306) and the vapor chamber (350). 15. The method according to claim 13, characterized in that, The steam chamber (550) includes the bottom surface of the top (522) of the liquid cooling plate assembly (501); or The steam chamber (650) includes the top surface of the base (606) of the liquid cooling plate assembly (601); or The area of the bottom surface of the housing of the steam chamber is different from the area of the base of the liquid cooling plate assembly, and the steam chamber is mounted on the base of the liquid cooling plate assembly.