HK1209551B - Compact spacer in multi-lens array module - Google Patents
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Description
技术领域Technical Field
本发明一般来说涉及图像传感器,且更具体来说,涉及一种用于经分割图像传感器的透镜阵列。The present invention relates generally to image sensors, and more particularly to a lens array for a segmented image sensor.
背景技术Background Art
图像捕获单元通常包含图像传感器及成像透镜。成像透镜将光聚焦到图像传感器上以形成图像,且图像传感器将光转换成电信号。电信号从图像捕获单元输出到主机电子系统或子系统中的其它单元。所述电子系统可为移动电话、计算机、数码相机或医疗装置。An image capture unit typically includes an image sensor and an imaging lens. The imaging lens focuses light onto the image sensor to form an image, and the image sensor converts the light into an electrical signal. The electrical signal is then output from the image capture unit to a host electronic system or other unit within a subsystem. This electronic system can be a mobile phone, computer, digital camera, or medical device.
随着图像捕获单元在电子系统中的使用的增加,对图像捕获单元特征、能力及装置尺寸的需求也增加。举例来说,越来越多地需要图像捕获单元具有更低轮廓,使得可减小包含所述图像捕获单元的电子系统的总体大小而同时不牺牲所捕获的所述光学图像的质量。图像捕获单元的轮廓可与从图像传感器的底部到成像透镜的顶部的距离相关联。As the use of image capture units in electronic systems increases, demands on image capture unit features, capabilities, and device size also increase. For example, there is a growing demand for image capture units with a lower profile so that the overall size of the electronic system incorporating the image capture unit can be reduced without sacrificing the quality of the captured optical image. The profile of an image capture unit can be related to the distance from the bottom of the image sensor to the top of the imaging lens.
发明内容Summary of the Invention
在示范性实施例中,一种设备包括:图像传感器,其被分割成N个图像传感器区,其中所述图像传感器附接到电路板;透镜阵列,其包含N个透镜,接近所述图像传感器而安置,其中所述N个透镜中的每一者经布置以将单个图像聚焦到所述N个图像传感器区中的相应一者上;及间隔件结构,其堆叠于所述透镜阵列与所述电路板之间以将所述透镜阵列与所述图像传感器分离,其中所述间隔件结构环绕围绕所有所述N个图像传感器区及N个透镜的周界,使得所述间隔件结构都不安置于所述N个透镜与所述图像传感器的N个图像传感器区中的任一者之间。In an exemplary embodiment, an apparatus includes an image sensor partitioned into N image sensor regions, wherein the image sensor is attached to a circuit board; a lens array comprising N lenses disposed proximate to the image sensor, wherein each of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions; and a spacer structure stacked between the lens array and the circuit board to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter surrounding all of the N image sensor regions and N lenses such that the spacer structure is not disposed between the N lenses and any of the N image sensor regions of the image sensor.
在另一示范性实施例中,一种成像系统包括:像素阵列,其包含被分割成N个图像传感器区的图像传感器,其中所述N个图像传感器区中的每一者具有布置于其中的多个像素,其中所述图像传感器附接到电路板;透镜阵列,其包含N个透镜,接近所述图像传感器而安置,其中所述N个透镜中的每一者经布置以将单个图像聚焦到所述N个图像传感器区中的相应一者上;间隔件结构,其堆叠于所述透镜阵列与印刷电路之间以将所述透镜阵列与所述图像传感器分离,其中所述间隔件结构环绕围绕所有所述N个图像传感器区及N个透镜的周界,使得所述间隔件结构都不安置于所述N个透镜与所述图像传感器的N个图像传感器区中的任一者之间;控制电路,其耦合到所述像素阵列以控制所述像素阵列的操作;及读出电路,其耦合到所述像素阵列以从所述多个像素读出单个图像数据。In another exemplary embodiment, an imaging system includes a pixel array comprising an image sensor partitioned into N image sensor regions, wherein each of the N image sensor regions has a plurality of pixels arranged therein, wherein the image sensor is attached to a circuit board; a lens array comprising N lenses disposed proximate to the image sensor, wherein each of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions; a spacer structure stacked between the lens array and a printed circuit to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter surrounding all of the N image sensor regions and the N lenses such that the spacer structure is not disposed between the N lenses and any of the N image sensor regions of the image sensor; control circuitry coupled to the pixel array to control operation of the pixel array; and readout circuitry coupled to the pixel array to read out single image data from the plurality of pixels.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
参考以下各图描述本发明的非限制性及非详尽实施例,其中在所有各视图中相似参考编号指代相似部件,除非另有规定。Non-limiting and non-exhaustive embodiments of the present invention are described with reference to the following figures, wherein like reference numerals refer to like parts throughout the various views unless otherwise specified.
图1A是包含成像透镜及图像传感器的图像捕获单元的示意图。FIG. 1A is a schematic diagram of an image capture unit including an imaging lens and an image sensor.
图1B是包含低轮廓成像透镜及图像传感器的低轮廓图像捕获单元的示意图。FIG. 1B is a schematic diagram of a low-profile image capture unit including a low-profile imaging lens and an image sensor.
图2图解说明根据本发明的教示具有四个经分割区域的图像传感器的一个实例的俯视图。2 illustrates a top view of one example of an image sensor having four segmented regions in accordance with the teachings of the present invention.
图3图解说明根据本发明的教示定位于具有四个经分割区域的图像传感器上方的2×2多透镜阵列模块的一个实例的俯视图。3 illustrates a top view of one example of a 2×2 multi-lens array module positioned over an image sensor having four segmented regions in accordance with the teachings of the present invention.
图4是图解说明根据本发明的教示定位于低轮廓图像捕获单元的一个实例的两个经分割区域上方的实例2×2多透镜阵列模块的一个实例的两个透镜的横截面。4 is a cross-section illustrating two lenses of an example 2×2 multi-lens array module positioned over two segmented regions of an example low-profile image capture unit in accordance with the teachings of the present invention.
图5是图解说明根据本发明的教示包含定位于具有经分割区域的图像传感器上方的多透镜阵列模块的图像感测系统的一部分的一个实例的框图。5 is a block diagram illustrating one example of a portion of an image sensing system including a multi-lens array module positioned over an image sensor having segmented areas in accordance with the teachings of the present invention.
在图式的所有数个视图中,对应参考字符指示对应组件。所属领域的技术人员将了解,图中的元件是为简单及清晰起见而图解说明的,且未必按比例绘制。举例来说,为了有助于改进对本发明的各种实施例的理解,图中的元件中的一些元件的尺寸可能相对于其它元件放大。此外,通常未描绘在商业上可行的实施例中有用或必需的常见而众所周知的元件以便促进对本发明的这各种实施例的较不受阻挡的观察。Corresponding reference characters indicate corresponding components throughout the several views of the drawings. Those skilled in the art will appreciate that the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, to help improve understanding of the various embodiments of the present invention, the dimensions of some of the elements in the figures may be exaggerated relative to other elements. Furthermore, common and well-known elements that are useful or necessary in commercially feasible embodiments are generally not depicted to facilitate a less obstructed view of the various embodiments of the present invention.
具体实施方式DETAILED DESCRIPTION
在以下描述中,陈述众多特定细节以便提供对本发明的透彻理解。然而,所属领域的一般技术人员将明了,不需要采用特定细节来实践本发明。在其它实例中,未详细描述众所周知的材料或方法以避免使本发明模糊。In the following description, numerous specific details are set forth to provide a thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that it is not necessary to employ specific details to practice the present invention. In other instances, well-known materials or methods are not described in detail to avoid obscuring the present invention.
在本说明书通篇中对“一个实施例”、“一实施例”、“一个实例”或“一实例”的提及意指结合所述实施例或实例所描述的特定特征、结构或特性包含于本发明的至少一个实施例中。因此,在本说明书通篇的各个位置中短语“在一个实施例中”、“在一实施例中”、“一个实例”或“一实例”的出现未必全部指代同一实施例或实例。此外,在一个或一个以上实施例或实例中,可以任何适合组合及/或子组合来组合所述特定特征、结构或特性。特定特征、结构或特性可包含于集成电路、电子电路、组合逻辑电路或提供所描述的功能性的其它适合组件中。另外,应了解,随本文一起提供的各图是出于向所属领域的一般技术人员解释的目的且图式未必按比例绘制。References throughout this specification to "one embodiment," "an embodiment," "an example," or "an instance" mean that a particular feature, structure, or characteristic described in connection with the embodiment or instance is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment," "in an embodiment," "an example," or "an instance" in various places throughout this specification are not necessarily all referring to the same embodiment or instance. Furthermore, in one or more embodiments or instances, the particular features, structures, or characteristics may be combined in any suitable combinations and/or subcombinations. The particular features, structures, or characteristics may be included in an integrated circuit, an electronic circuit, a combinational logic circuit, or other suitable components that provide the described functionality. In addition, it should be understood that the figures provided herein are for explanation purposes to persons of ordinary skill in the art and that the figures are not necessarily drawn to scale.
本发明揭示针对于供在低轮廓图像捕获单元中使用的包含紧凑间隔件结构的多透镜阵列模块的实例方法及设备。如将了解,可提供根据本发明的教示供在低轮廓图像捕获单元中使用的多透镜阵列模块,而根据本发明的教示并不牺牲所捕获的光学图像的质量(例如分辨率(即,像素的数目)及清晰度)来实现低轮廓。The present disclosure is directed to example methods and apparatus for a multi-lens array module including a compact spacer structure for use in a low-profile image capture unit. As will be appreciated, a multi-lens array module for use in a low-profile image capture unit can be provided in accordance with the teachings of the present disclosure without sacrificing the quality of the captured optical image, such as resolution (i.e., number of pixels) and clarity, to achieve a low profile in accordance with the teachings of the present disclosure.
为了图解说明,图1A是包含成像透镜102及图像传感器104的图像捕获单元100的示意图。透镜102与图像传感器104之间的距离大致为f,其中f为透镜102的焦距。图像传感器104被透镜102覆盖的宽度为W,且透镜直径为D。为了比较,图1B展示包含成像透镜108及图像传感器110的低轮廓图像捕获单元106的示意图。透镜108与图像传感器110之间的距离大致为f/2,其中f/2为透镜108的焦距。图像传感器110被透镜108覆盖的宽度为W/2,且透镜直径为D/2。For illustration, FIG1A is a schematic diagram of an image capture unit 100 including an imaging lens 102 and an image sensor 104. The distance between lens 102 and image sensor 104 is approximately f, where f is the focal length of lens 102. The width of image sensor 104 covered by lens 102 is W, and the lens diameter is D. For comparison, FIG1B shows a schematic diagram of a low-profile image capture unit 106 including an imaging lens 108 and an image sensor 110. The distance between lens 108 and image sensor 110 is approximately f/2, where f/2 is the focal length of lens 108. The width of image sensor 110 covered by lens 108 is W/2, and the lens diameter is D/2.
在低轮廓图像捕获单元中,用低轮廓成像透镜替换所述成像透镜,而图像传感器不变。图像传感器104及110为相同图像传感器,且两个图像传感器具有相同像素阵列结构。由于图像传感器110的宽度为图像传感器104的宽度的一半,因此在一个尺寸上,图像传感器110与图像传感器104相比将具有一半数目的像素。在两个尺寸上,图像传感器110与图像传感器104相比将具有四分之一数目的像素。换句话说,所捕获的图像的像素数目大致与透镜与图像传感器之间的距离的标度的平方成比例。In the low-profile image capture unit, the imaging lens is replaced with a low-profile imaging lens, while the image sensor remains unchanged. Image sensors 104 and 110 are identical, and both image sensors have the same pixel array structure. Because the width of image sensor 110 is half the width of image sensor 104, image sensor 110 will have half the number of pixels as image sensor 104 in one dimension. In both dimensions, image sensor 110 will have one-quarter the number of pixels as image sensor 104. In other words, the number of pixels in the captured image is roughly proportional to the square of the distance between the lens and the image sensor.
图2图解说明根据本发明的教示具有彼此紧密接近地布置于电路板221上的四个经分割区域214、216、218及220的图像传感器212。如下文将更详细地论述,根据本发明的教示,每一经分割区域214、216、218及220由多透镜阵列模块中的相应成像透镜覆盖。以此方式,多透镜阵列模块中的每一成像透镜的焦距可为在图像传感器未被分割成四个区域时的成像透镜的一半。因此,根据本发明的教示,可使用四个透镜及图像传感器的四个经分割区域来构造低轮廓图像捕获单元。低轮廓图像捕获单元与原始图像捕获单元相比将具有大致相同的分辨率(即,相同的像素数目),因为使用图像传感器的四个区域。每一经分割区域的面积可类似于图1B的图像传感器110。在一个实例中,分别将图像传感器212的经分割区域214、216、218及220指定为红色(R)、绿色(G)、蓝色(B)及透明(C)区域。FIG2 illustrates an image sensor 212 having four segmented regions 214, 216, 218, and 220 arranged in close proximity to one another on a circuit board 221 in accordance with the teachings of the present invention. As will be discussed in greater detail below, in accordance with the teachings of the present invention, each segmented region 214, 216, 218, and 220 is covered by a corresponding imaging lens in a multi-lens array module. In this manner, the focal length of each imaging lens in the multi-lens array module can be half that of an imaging lens when the image sensor is not segmented into four regions. Thus, in accordance with the teachings of the present invention, a low-profile image capture unit can be constructed using four lenses and four segmented regions of the image sensor. The low-profile image capture unit will have approximately the same resolution (i.e., the same number of pixels) as the original image capture unit because four regions of the image sensor are used. The area of each segmented region can be similar to that of the image sensor 110 of FIG1B. In one example, segmented regions 214 , 216 , 218 , and 220 of image sensor 212 are designated as red (R), green (G), blue (B), and transparent (C) regions, respectively.
图3图解说明根据本发明的教示定位于具有安装于电路板321上的四个经分割区域的图像传感器上方的2×2多透镜阵列模块311的一个实例的俯视图。在一个实例中,应了解,具有安装于图3的电路板321上的四个经分割区域的图像传感器为具有上文关于图2所论述的安装于电路板221上的四个经分割区域214、216、218、220的图像传感器212的一个实例。因此,应了解,下文所提及的类似命名及编号的元件如上文所描述而耦合及起作用。FIG3 illustrates a top view of one example of a 2×2 multi-lens array module 311 positioned above an image sensor having four segmented regions mounted on a circuit board 321 in accordance with the teachings of the present invention. In one example, it should be understood that the image sensor having four segmented regions mounted on the circuit board 321 of FIG3 is one example of the image sensor 212 having four segmented regions 214, 216, 218, 220 mounted on the circuit board 221 discussed above with respect to FIG2. Therefore, it should be understood that similarly named and numbered elements mentioned below are coupled and function as described above.
如在图3中所描绘的实例中所展示,根据本发明的教示,多透镜阵列模块311包含2×2透镜阵列313,透镜阵列313包含安装到在具有安装于电路板321上的四个经分割区域的图像传感器上方的间隔件结构330的透镜322、324、326及328。在一个实例中,根据本发明的教示,透镜阵列313的透镜322、324、326及328为安装到附接到间隔件结构330的玻璃晶片315的低轮廓透镜,间隔件结构330堆叠于透镜阵列313与电路板321之间。在一个实例中,间隔件结构330适于将透镜阵列313与图像传感器分离达透镜322、324、326及328的焦距。如在所图解说明实例中所展示,根据本发明的教示,间隔件结构330环绕围绕图像传感器的所有经分割区域以及透镜322、324、326及328的周界,使得间隔件结构330都不安置于透镜322、324、326及328与安装于电路板321上的图像传感器的经分割区域中的任一者之间。在一个实例中,根据本发明的教示,间隔件结构330直接接合于电路板321上。3 , in accordance with the teachings of the present invention, multi-lens array module 311 includes a 2×2 lens array 313 including lenses 322, 324, 326, and 328 mounted to a spacer structure 330 above an image sensor having four segmented regions mounted on a circuit board 321. In one example, in accordance with the teachings of the present invention, lenses 322, 324, 326, and 328 of lens array 313 are low-profile lenses mounted to a glass wafer 315 attached to a spacer structure 330, which is stacked between lens array 313 and circuit board 321. In one example, spacer structure 330 is adapted to separate lens array 313 from the image sensor by the focal length of lenses 322, 324, 326, and 328. As shown in the illustrated example, in accordance with the teachings of the present invention, spacer structure 330 surrounds the perimeter of all of the segmented regions of the image sensor and lenses 322, 324, 326, and 328, such that spacer structure 330 is not disposed between lenses 322, 324, 326, and 328 and any of the segmented regions of the image sensor mounted on circuit board 321. In one example, spacer structure 330 is bonded directly to circuit board 321 in accordance with the teachings of the present invention.
如在所描绘的实例中所展示,分别将透镜322、324、326及328指定为红色(R)、绿色(G)、蓝色(B)及透明(C)区域。换句话说,透镜322、324、326及328中的每一者经布置以将单个图像聚焦到图像传感器区的红色(R)、绿色(G)、蓝色(B)及透明(C)区域(例如,分别为如图2中所图解说明的图像传感器212的经分割区域214、216、218及220)中的相应一者上。因此,在一个实例中,透镜322仅形成红色图像,透镜324仅形成绿色图像,且透镜326仅形成蓝色图像。另外,在一个实例中,根据本发明的教示,透镜322、324、326及328中的每一者具有与正聚焦到对应图像传感器区上的特定光色彩对应的不同相应曲率半径。As shown in the depicted example, lenses 322, 324, 326, and 328 are designated as red (R), green (G), blue (B), and transparent (C) regions, respectively. In other words, each of lenses 322, 324, 326, and 328 is arranged to focus a single image onto a respective one of the red (R), green (G), blue (B), and transparent (C) regions of the image sensor area (e.g., segmented regions 214, 216, 218, and 220, respectively, of image sensor 212, as illustrated in FIG. 2 ). Thus, in one example, lens 322 forms only a red image, lens 324 forms only a green image, and lens 326 forms only a blue image. Additionally, in one example, each of lenses 322, 324, 326, and 328 has a different respective radius of curvature corresponding to the particular color of light being focused onto the corresponding image sensor area, in accordance with the teachings of the present invention.
相比之下,典型图像捕获单元使用同时形成红色、绿色及蓝色图像的单个成像透镜。然而,由于根据本发明的教示的每一透镜322、324、326及328个别地形成单个彩色图像,因此可通过个别地调整每一透镜及对应图像传感器的曲率半径来改进每一个别图像的光学质量(例如,清晰度)。因此,在一个实例中,根据本发明的教示,可根据光波长个别地调整透镜322、324、326及328中的每一者及对应经分割图像传感器的曲率半径以便获得高质量图像。因此,在一个实例中,根据本发明的教示,红色透镜相对于图像传感器的红色区域的曲率半径、绿色透镜相对于图像传感器的绿色区域的曲率半径及蓝色透镜相对于图像传感器的蓝色区域的曲率半径为不同的。在一个实例中,C透镜相对于图像传感器的C区域的曲率半径可经调整以与白色光对应,或(举例来说)可经调整以与绿色光对应。In contrast, a typical image capture unit uses a single imaging lens that simultaneously forms red, green, and blue images. However, since each lens 322, 324, 326, and 328 forms a single color image according to the teachings of the present invention, the optical quality (e.g., clarity) of each individual image can be improved by individually adjusting the radius of curvature of each lens and the corresponding image sensor. Thus, in one example, according to the teachings of the present invention, the radius of curvature of each of lenses 322, 324, 326, and 328 and the corresponding segmented image sensor can be individually adjusted according to the wavelength of light to obtain high-quality images. Thus, in one example, according to the teachings of the present invention, the radius of curvature of the red lens relative to the red region of the image sensor, the radius of curvature of the green lens relative to the green region of the image sensor, and the radius of curvature of the blue lens relative to the blue region of the image sensor are different. In one example, the radius of curvature of the C lens relative to the C region of the image sensor can be adjusted to correspond to white light, or, for example, can be adjusted to correspond to green light.
图4是图解说明根据本发明的教示定位于低轮廓图像捕获单元的一个实例的图像传感器412的两个经分割区域414及416上方的实例2×2多透镜阵列模块411的透镜阵列413的两个透镜422及424的横截面。在一个实例中,图4中所图解说明的横截面可与图2的虚线A-A'及/或图3的虚线A-A'对应。图4的图像传感器412的经分割区域414及416可为图2的图像传感器212的区域214及216的实例。类似地,图4的透镜阵列413的透镜422及424以及间隔件结构430A可分别为图3的透镜阵列313的透镜322及324以及间隔件结构330的实例。因此,应了解,下文所提及的类似命名及编号的元件如上文所描述而耦合及起作用。FIG4 illustrates a cross-section of two lenses 422 and 424 of lens array 413 of an example 2×2 multi-lens array module 411 positioned above two segmented regions 414 and 416 of an image sensor 412 of one example of a low-profile image capture unit in accordance with the teachings of the present invention. In one example, the cross-section illustrated in FIG4 may correspond to dashed line AA′ of FIG2 and/or dashed line AA′ of FIG3 . Segmented regions 414 and 416 of image sensor 412 of FIG4 may be examples of regions 214 and 216 of image sensor 212 of FIG2 . Similarly, lenses 422 and 424 and spacer structure 430A of lens array 413 of FIG4 may be examples of lenses 322 and 324 and spacer structure 330, respectively, of lens array 313 of FIG3 . Thus, it should be understood that similarly named and numbered elements mentioned below couple and function as described above.
如在图4中所图解说明的实例中所展示,根据本发明的教示,间隔件结构430A适于将透镜阵列413的透镜422及424与图像传感器412的经分割区域414及416分离开达透镜422及424的焦距f。在一个实例中,透镜422及424的焦距f以及图像传感器412的经分割区域414及416的宽度W为图1A的透镜102的焦距的一半及图像传感器104的宽度W的一半。4 , spacer structure 430A is adapted to separate lenses 422 and 424 of lens array 413 from segmented regions 414 and 416 of image sensor 412 by a focal length f of lenses 422 and 424. In one example, the focal length f of lenses 422 and 424 and the width W of segmented regions 414 and 416 of image sensor 412 are half the focal length of lens 102 and half the width W of image sensor 104 of FIG. 1A .
典型图像捕获单元可包含图像传感器上的拜耳型彩色滤光片阵列。相比之下,图4的图像传感器414及416的经分割区域可不包含拜耳型彩色滤光片阵列。返回参考上文在图2中所描述的实例,可分别将经分割区域214、216、218及220指定为红色(R)、绿色(G)、蓝色(B)及透明(C)区域。因此,红色区域可由单个红色滤光片覆盖,绿色区域可由单个绿色滤光片覆盖,蓝色区域可由单个蓝色滤光片覆盖,且透明或C区域可由任何滤光片覆盖或可由单个透明滤光片覆盖或可由单个绿色滤光片覆盖。A typical image capture unit may include a Bayer-type color filter array on the image sensor. In contrast, the segmented regions of image sensors 414 and 416 of FIG. 4 may not include a Bayer-type color filter array. Referring back to the example described above in FIG. 2 , segmented regions 214, 216, 218, and 220 may be designated as red (R), green (G), blue (B), and clear (C) regions, respectively. Thus, the red region may be covered by a single red filter, the green region by a single green filter, the blue region by a single blue filter, and the clear or C region by any filter, a single clear filter, or a single green filter.
如在图4中所描绘的实例中所展示,透镜422的曲率半径不同于透镜424的曲率半径。在一个实例中,具有焦距f的透镜422的曲率半径与具有第一色彩(例如但不限于红色(R))的光对应,且具有焦距f的透镜424的曲率半径与具有第二色彩(例如但不限于绿色(G))的光对应。因此,根据本发明的教示,具有第一色彩的单个图像由透镜422聚焦到图像传感器412的分区区域414上,且具有第二色彩的相同单个图像由透镜424聚焦到图像传感器412的分区416上。As shown in the example depicted in FIG4 , the radius of curvature of lens 422 is different from the radius of curvature of lens 424. In one example, the radius of curvature of lens 422, having a focal length f, corresponds to light having a first color, such as, but not limited to, red (R), and the radius of curvature of lens 424, having a focal length f, corresponds to light having a second color, such as, but not limited to, green (G). Thus, in accordance with the teachings of the present invention, a single image having the first color is focused by lens 422 onto partitioned area 414 of image sensor 412, and the same single image having the second color is focused by lens 424 onto partition 416 of image sensor 412.
在一个实例中,可在每一透镜上面安置单个彩色滤光片。或者,可在每一透镜与单个图像传感器的每一经分割区域之间安置单个彩色滤光片。举例来说,如在图4中所描绘的实例中所展示,彩色滤光片432及434分别安置于透镜422及424上面。继续上文所论述的其中透镜422的曲率半径与红色(R)光对应且透镜424的曲率半径与绿色(G)光对应的实例,滤光片432为红色(R)滤光片且滤光片434为绿色(G)滤光片。In one example, a single color filter may be disposed over each lens. Alternatively, a single color filter may be disposed between each lens and each segmented region of a single image sensor. For example, as shown in the example depicted in FIG4 , color filters 432 and 434 are disposed over lenses 422 and 424, respectively. Continuing with the example discussed above in which the radius of curvature of lens 422 corresponds to red (R) light and the radius of curvature of lens 424 corresponds to green (G) light, filter 432 is a red (R) filter and filter 434 is a green (G) filter.
返回简略参考图2中所描绘的实例,红色(R)区域仅包含红色像素,绿色(G)区域仅包含绿色像素,且蓝色(B)区域仅包含蓝色像素。透明或C区域可在不应用滤光片时包含白色像素且在应用绿色滤光片时包含绿色像素。读出系统及/或处理器(未展示)可将红色、绿色及蓝色像素重新布置成拜耳图案或用于进一步处理彩色信号并形成彩色图像的任何图案。根据本发明的教示,C像素可用作用于特定处理的白色像素或仅充当绿色像素。Referring briefly back to the example depicted in FIG2 , the red (R) region includes only red pixels, the green (G) region includes only green pixels, and the blue (B) region includes only blue pixels. The transparent or C region may include white pixels when no filter is applied and green pixels when a green filter is applied. A readout system and/or processor (not shown) may rearrange the red, green, and blue pixels into a Bayer pattern or any pattern for further processing the color signal and forming a color image. In accordance with the teachings of the present invention, the C pixels may be used as white pixels for specific processing or as green pixels only.
返回参考图4中所描绘的多透镜阵列模块411的实例,透镜阵列413的透镜422及424为安装到附接到间隔件结构430A的玻璃晶片415的低轮廓透镜,间隔件结构430A堆叠于透镜阵列413与电路板421之间。在一个实例中,根据本发明的教示,间隔件结构430A适于将透镜阵列413与图像传感器412分离达透镜422及424的焦距f。在一个实例中,多透镜阵列模块411还可包含安装到玻璃晶片417的透镜417及419,玻璃晶片417附接到间隔件结构430A及间隔件结构430B,如所展示。在一个实例中,间隔件结构430A及430B为实质上类似的且如所展示而堆叠。确实,如在所图解说明的实例中所展示,根据本发明的教示,间隔件结构430A及间隔件结构430B环绕围绕图像传感器的所有经分割区域以及透镜422、424、417及419的周界,使得间隔件结构430A及间隔件结构430B都不安置于透镜422、424、417及419及/或安装于电路板421上的图像传感器412的经分割区域414及416中的任一者之间。在一个实例中,根据本发明的教示,间隔件结构430A及430B如所展示直接接合于电路板421上。Referring back to the example of multi-lens array module 411 depicted in FIG4 , lenses 422 and 424 of lens array 413 are low-profile lenses mounted to a glass wafer 415 attached to a spacer structure 430A, which is stacked between lens array 413 and circuit board 421. In one example, spacer structure 430A is adapted to separate lens array 413 from image sensor 412 by a focal length f of lenses 422 and 424 in accordance with the teachings of the present invention. In one example, multi-lens array module 411 may also include lenses 417 and 419 mounted to a glass wafer 417, which is attached to spacer structures 430A and 430B, as shown. In one example, spacer structures 430A and 430B are substantially similar and stacked as shown. Indeed, as shown in the illustrated example, in accordance with the teachings of the present invention, spacer structures 430A and 430B surround the perimeter of all of the segmented regions surrounding the image sensor and lenses 422, 424, 417, and 419, such that neither spacer structures 430A nor spacer structures 430B are disposed between lenses 422, 424, 417, and 419 and/or any of the segmented regions 414 and 416 of image sensor 412 mounted on circuit board 421. In one example, in accordance with the teachings of the present invention, spacer structures 430A and 430B are bonded directly onto circuit board 421 as shown.
图5是图解说明根据本发明的教示包含定位于具有经分割区域514、516、518及520的图像传感器512上方的多透镜阵列模块511的图像感测系统536的一部分的一个实例的框图。在一个实例中,应了解,图5的实例多透镜阵列模块511为图3的多透镜阵列模块311或图4的多透镜阵列模块411的一个实例,或图5的实例图像传感器512为图2的图像传感器212或图4的图像传感器412的一个实例。因此,应了解,下文所提及的类似命名及编号的元件如上文所描述而耦合及起作用。FIG5 is a block diagram illustrating one example of a portion of an image sensing system 536 including a multi-lens array module 511 positioned above an image sensor 512 having segmented regions 514, 516, 518, and 520 in accordance with the teachings of the present invention. In one example, it should be understood that the example multi-lens array module 511 of FIG5 is one example of the multi-lens array module 311 of FIG3 or the multi-lens array module 411 of FIG4, or that the example image sensor 512 of FIG5 is one example of the image sensor 212 of FIG2 or the image sensor 412 of FIG4. Thus, it should be understood that similarly named and numbered elements mentioned below are coupled and function as described above.
如在图5中所描绘的实例中所展示,成像系统536包含定位于图像传感器512上方的多透镜阵列模块511、读出电路540、功能逻辑542及控制电路544。在所图解说明的实例中,将图像传感器512分割成四个经分割区域514、516、518及520。在一个实例中,每一经分割区域514、516、518及520由彩色滤光片覆盖。在一个实例中,根据本发明的教示,多透镜阵列模块511包含堆叠于多透镜阵列模块511的透镜阵列与图像传感器512之间的间隔件结构,例如图3的间隔件结构330或图4的间隔件结构430A及430B。如在所描绘的实例中所展示,多透镜阵列模块511适于将单个图像538引导到图像传感器512上。在一个实例中,根据本发明的教示,包含于多透镜阵列模块511中的透镜阵列中的每一透镜适于将单个图像538分别引导到分区514、516、518及520中的相应一者上,如上文所论述。As shown in the example depicted in FIG5 , imaging system 536 includes a multi-lens array module 511 positioned above image sensor 512, readout circuitry 540, function logic 542, and control circuitry 544. In the illustrated example, image sensor 512 is segmented into four segmented regions 514, 516, 518, and 520. In one example, each segmented region 514, 516, 518, and 520 is covered by a color filter. In one example, in accordance with the teachings of the present invention, multi-lens array module 511 includes a spacer structure, such as spacer structure 330 of FIG3 or spacer structures 430A and 430B of FIG4 , stacked between the lens arrays of multi-lens array module 511 and image sensor 512. As shown in the depicted example, multi-lens array module 511 is adapted to direct a single image 538 onto image sensor 512. In one example, each lens in the lens array included in multi-lens array module 511 is adapted to direct a single image 538 onto a respective one of partitions 514 , 516 , 518 , and 520 , respectively, as discussed above, in accordance with the teachings of the present invention.
如在所描绘的实例中所展示,图像传感器512包含像素单元(例如,像素P1、P2…Pn)的二维(2D)阵列。所述像素阵列中的每一像素单可包含CMOS像素或CCD像素。如所图解说明,每一像素单元被布置到像素阵列的一行(例如,行R1到Ry)及一列(例如,列C1到Cx)中以获取人、地点、物体等的图像数据,接着可使用所述图像数据再现所述人、地点、物体等的2D图像。在一个实例中,图像传感器512为背侧照明式(BSI)图像传感器。在一个实例中,图像传感器512为前侧照明式(FSI)图像传感器。As shown in the depicted example, image sensor 512 includes a two-dimensional (2D) array of pixel cells (e.g., pixels P1, P2, ... Pn). Each pixel cell in the pixel array can include a CMOS pixel or a CCD pixel. As illustrated, each pixel cell is arranged into a row (e.g., rows R1 through Ry) and a column (e.g., columns C1 through Cx) of the pixel array to acquire image data of a person, place, object, etc., which can then be used to reproduce a 2D image of the person, place, object, etc. In one example, image sensor 512 is a backside illuminated (BSI) image sensor. In one example, image sensor 512 is a frontside illuminated (FSI) image sensor.
在每一像素单元P1、P2、…Pn已获取其图像数据或图像电荷之后,通过位线将图像数据从图像传感器512读出到读出电路540,可接着将所述图像数据转移到功能逻辑542。读出电路540可包含放大电路、模/数(ADC)转换电路或其它。功能逻辑542可仅存储所述图像数据或甚至通过应用图像后效果(例如,剪裁、旋转、移除红眼、调整亮度、调整对比度或其它)来操纵所述图像数据。在一个实例中,读出电路540可沿着读出列线从图像传感器512一次读出一行图像数据或从每一分区514、516、518及520读出图像数据(所图解说明)或可使用多种其它技术(未图解说明)读出所述图像数据,例如串行读出或同时全并行读出所有像素。After each pixel cell P1, P2, ... Pn has acquired its image data or image charge, the image data is read out from the image sensor 512 via the bit lines to the readout circuitry 540, which can then be transferred to the function logic 542. The readout circuitry 540 may include amplification circuitry, analog-to-digital (ADC) conversion circuitry, or other circuitry. The function logic 542 may simply store the image data or even manipulate the image data by applying post-image effects (e.g., cropping, rotation, red-eye removal, brightness adjustment, contrast adjustment, or other). In one example, the readout circuitry 540 may read out the image data from the image sensor 512 one row at a time along the readout column lines, or read out the image data from each partition 514, 516, 518, and 520 (illustrated), or may read out the image data using a variety of other techniques (not illustrated), such as serial readout or simultaneous full parallel readout of all pixels.
控制电路544耦合到图像传感器512以控制像素阵列512的操作特性。举例来说,控制电路544可产生用于控制图像获取的快门信号。在一个实例中,所述快门信号为用于同时启用图像传感器512内的所有像素以在单一获取窗期间同时捕获其相应图像数据的全局快门信号。在替代实例中,所述快门信号为滚动快门信号,借此在连续获取窗期间依序启用每一像素行、每一像素列或每一像素群组或每一分区。Control circuitry 544 is coupled to image sensor 512 to control the operating characteristics of pixel array 512. For example, control circuitry 544 may generate a shutter signal for controlling image acquisition. In one example, the shutter signal is a global shutter signal for simultaneously enabling all pixels within image sensor 512 to simultaneously capture their respective image data during a single acquisition window. In an alternative example, the shutter signal is a rolling shutter signal, whereby each pixel row, column, group, or partition is sequentially enabled during successive acquisition windows.
应了解,低轮廓图像捕获单元并不限制于2×2透镜阵列,多透镜阵列模块511中的透镜阵列的任何大小均为可能的。因此,图像传感器512并不限制于四个经分割区域。任何数目的经分割区域为可能的。图像传感器512的经分割区域514、516、518及520可为正方形或矩形的。It should be understood that the low-profile image capture unit is not limited to a 2×2 lens array; any size of lens array in the multi-lens array module 511 is possible. Therefore, the image sensor 512 is not limited to four segmented regions. Any number of segmented regions is possible. The segmented regions 514, 516, 518, and 520 of the image sensor 512 can be square or rectangular.
包含发明摘要中所描述内容的本发明的所图解说明实例的以上描述并非打算为穷尽性或限制于所揭示的精确形式。尽管出于说明性目的而在本文中描述本发明的特定实施例及实例,但可在不背离本发明的较宽广精神及范围的情况下做出各种等效修改。The above description of the illustrated examples of the present invention, including what is described in the Abstract, is not intended to be exhaustive or limited to the precise forms disclosed. Although specific embodiments and examples of the invention are described herein for illustrative purposes, various equivalent modifications may be made without departing from the broader spirit and scope of the invention.
可根据以上详细描述对本发明的实例做出这些修改。所附权利要求书中所使用的术语不应理解为将本发明限制于说明书及权利要求书中所揭示的特定实施例。而是,范围将完全由所附权利要求书来确定,所述权利要求书将根据所创建的权利要求解释原则来加以理解。因此,应将本说明书及图视为说明性而非限制性。These modifications may be made to examples of the present invention in light of the above detailed description. The terms used in the appended claims should not be construed to limit the invention to the specific embodiments disclosed in the specification and claims. Rather, the scope is to be determined entirely by the appended claims, which are to be construed in accordance with established doctrines of claim interpretation. Accordingly, the specification and drawings are to be regarded as illustrative rather than restrictive.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/064,813 | 2013-10-28 | ||
| US14/064,813 US9386203B2 (en) | 2013-10-28 | 2013-10-28 | Compact spacer in multi-lens array module |
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| HK1209551A1 HK1209551A1 (en) | 2016-04-01 |
| HK1209551B true HK1209551B (en) | 2019-09-06 |
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