HK1188840A

HK1188840A - Transparent conductive element, input device, electronic device, and master board for producing transparent conductive element

Info

Publication number: HK1188840A
Application number: HK14101806.6A
Authority: HK
Inventors: 高桥秀俊; 水野干久; 石渡正之
Original assignee: 迪睿合电子材料有限公司
Priority date: 2011-02-07
Filing date: 2011-07-12
Publication date: 2014-05-16

Description

Transparent conductive element, input device, electronic device, and master for producing transparent conductive element

Technical Field

The present technology relates to a transparent conductive element, an input device and an electronic device using the transparent conductive element, and a master for manufacturing a transparent conductive element used for manufacturing the transparent conductive element. More particularly, the present invention relates to a transparent conductive element capable of improving visibility.

Background

A transparent conductive film obtained by laminating a transparent and low-resistance thin film on a substrate made of a transparent plastic film is widely used in applications in the electric and electronic fields utilizing the conductivity thereof, and is widely used for, for example, flat panel displays such as liquid crystal displays and electroluminescence (abbreviated as EL) displays, or transparent electrodes of resistive film type touch panels.

In recent years, the number of cases where a capacitive touch panel is mounted on a mobile device such as a mobile phone or a portable music terminal has increased. In such a capacitive touch panel, a transparent conductive film in which a patterned transparent conductive layer is formed on a surface of a base material is used. However, when a conventional transparent conductive film is used, since there is a large difference in optical characteristics between a portion having a transparent conductive layer and a portion removed, patterning is emphasized, and there is a problem that visibility is lowered when the transparent conductive film is disposed on the front surface of a display device such as a liquid crystal display.

Therefore, the following techniques are proposed: a laminated film in which dielectric layers having different refractive indices are laminated is provided between a transparent conductive thin film layer and a base film, and the visibility of the transparent conductive film is improved by optical interference of these laminated films (for example, patent documents 1 and 2).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2010-23282;

patent document 2: jp 2010-27294 a.

Disclosure of Invention

Problems to be solved by the invention

However, in the above-mentioned techniques, since the optical adjustment function of the laminated film depends on the wavelength, it is difficult to sufficiently improve the visibility of the transparent conductive film. Therefore, in recent years, as a technique for improving the visibility of the transparent conductive film, a technique of replacing the above-described laminated film is desired.

Therefore, an object of the present technology is to provide a transparent conductive element having good visibility, an information input device and an electronic device using the transparent conductive element, and a master for producing a transparent conductive element used for manufacturing the transparent conductive element.

Means for solving the problems

In order to solve the above problem, a first technique is a transparent conductive element including:

a substrate having a surface; and

transparent conductive parts and transparent insulating parts alternately arranged on the surface,

the transparent conductive part is a transparent conductive layer in which a plurality of hole parts are randomly arranged,

the transparent insulating portion is a transparent conductive layer composed of a plurality of island portions arranged at random,

the boundary between the transparent conductive part and the transparent insulating part is in a random shape.

A second technique is a transparent conductive element having:

a substrate having a first surface and a second surface; and

a transparent electrode pattern part and a transparent insulating pattern part formed on at least one of the first surface and the second surface,

the transparent electrode pattern part and the transparent insulating pattern part are alternately laid on at least one of the first surface and the second surface,

the transparent electrode pattern part is a transparent conductive layer with a plurality of hole parts formed separately and randomly,

the transparent insulating pattern portion is a transparent conductive layer composed of a plurality of island portions which are separated and formed randomly,

the shape of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion is random.

A third technique is an input device including:

a first transparent conductive element; and

a second transparent conductive element provided on a surface of the first transparent conductive element,

at least one of the first transparent conductive element and the second transparent conductive element has:

a substrate having a surface; and

A fourth technology is an electronic device in which,

has a transparent conductive element, and a conductive layer,

the transparent conductive element has:

a substrate having a surface; and

The fifth technique is a master for forming a transparent conductive element, wherein,

having a surface on which transparent conductive part forming regions and transparent insulating part forming regions are alternately arranged,

a plurality of holes having a concave shape are randomly provided in the transparent conductive section forming region,

a plurality of convex island parts are randomly arranged in the transparent insulating part forming area,

the boundary between the transparent conductive part forming region and the transparent insulating part forming region has a random shape.

In the present technology, it is preferable that the average boundary line length ratio (L1/L2) between the average boundary line length L1 of the transparent conductive part and the average boundary line length L2 of the transparent insulating part is in the range of 0.75 to 1.25.

In the present technology, it is preferable that the absolute value of the difference between the reflection L values of the transparent conductive part and the transparent insulating part is less than 0.3.

In this technique, the hole and the land preferably have a dot shape. Preferably, the dot shape is at least one selected from the group consisting of a circular shape, an elliptical shape, a shape obtained by cutting a part of a circular shape, a shape obtained by cutting a part of an elliptical shape, a polygon with corners cut, and an irregular shape.

In this technique, the conductive portions between the holes and the gap portions between the islands preferably have a mesh shape.

In this technique, the hole portions preferably have a dot shape, and the gap portions between the land portions preferably have a mesh shape.

In this technique, the conductive portions between the holes preferably have a mesh shape, and the islands preferably have a dot shape.

In the present technology, it is preferable that the random patterns of the transparent conductive part and the transparent insulating part are different random patterns from each other.

In the present technology, it is preferable that a plurality of inversion portions that invert from the hole portion to the island portion with the boundary line as a boundary are formed at random on the boundary line between the transparent conductive portion and the transparent insulating portion.

In the present technology, the coverage of the transparent conductive layer in the transparent conductive portion and the transparent insulating portion is preferably 65% or more and 100% or less.

In the present technology, it is preferable that the rear surface opposite to the front surface further has transparent conductive portions and transparent insulating portions alternately provided,

the difference between the sum of the coverage of the front transparent conductive layer and the coverage of the back transparent conductive layer is in the range of 0% to 60%.

In the present technology, it is preferable that the transparent conductive part has a plurality of regions, and the coverage of the transparent conductive layer is set to be larger in a region having a larger ratio (L/W) when the width of the region is W and the length of the region is L. Preferably, the plurality of regions are composed of a first region and a second region, and the coverage of the transparent conductive layer is set to be larger in the two regions as the ratio (L/W) is larger.

In the present technology, the transparent conductive portion is preferably a transparent electrode pattern portion.

A sixth technique is a transparent conductive element having:

a substrate having a first surface and a second surface; and

a plurality of holes are formed at the transparent electrode pattern part separately and randomly,

a plurality of island portions are formed at random in a separated manner in the transparent insulating pattern portion.

A seventh technique is an information input device including:

a first transparent conductive element; and

a substrate having a surface; and

a transparent electrode pattern part and a transparent insulating pattern part formed on the surface,

the transparent electrode pattern part and the transparent insulating pattern part are alternately laid on the surface of the base material,

An eighth technique is an information input device in which,

has a transparent conductive element, and a conductive layer,

the transparent conductive element has:

a substrate having a first surface and a second surface; and

a transparent electrode pattern portion and a transparent insulating pattern portion formed on the first surface and the second surface,

the transparent electrode pattern part and the transparent insulation pattern part are alternately laid on the first surface and the second surface,

A ninth technique is a master for forming a transparent conductive element, wherein,

having a surface on which transparent electrode pattern forming regions and transparent insulating pattern forming regions are alternately arranged,

a plurality of holes having a concave shape are formed at random and separately in the transparent electrode pattern forming region,

a plurality of convex island parts are formed at random in the transparent insulation pattern part forming region.

A tenth technique is a method for manufacturing a transparent conductive element, including:

printing a conductive coating on the surface of a substrate; and

a step of forming a transparent electrode pattern portion and a transparent insulating pattern portion on the surface of the base material by drying and/or heating the conductive coating material,

An eleventh technique is a method for manufacturing a transparent conductive element, including:

forming a resist pattern on a surface of a transparent conductive layer provided on a surface of a base material; and

a step of forming a transparent electrode pattern portion and a transparent insulating pattern portion on the surface of the base material by etching the transparent conductive layer using the resist pattern as a mask,

In the present technology, the transparent electrode pattern portion is preferably a transparent conductive layer in which a plurality of holes are formed separately and randomly, and the transparent insulating pattern portion is preferably a transparent conductive layer composed of a plurality of island portions formed separately and randomly.

In the present technology, the shape of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion is preferably a random shape. The random shape is preferably a shape obtained by forming a plurality of inversion portions, which are separated from each other and are inverted from the hole to the island at random, on a boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion, or a shape obtained by combining a part of the shapes of the hole and the island.

In the present technology, the shape of the hole and the land is at least one selected from the group consisting of a circular shape, an elliptical shape, a shape obtained by cutting a part of a circular shape, a shape obtained by cutting a part of an elliptical shape, a polygonal shape obtained by cutting corners, and an irregular shape, and is particularly preferably a circular shape in view of easily generating a random pattern. The shapes of the hole and the land may be different from each other. Here, the elliptical shape includes not only a mathematically complete ellipse but also an ellipse with some distortion (for example, an oblong, an egg-shaped, or the like). As the circle, not only a mathematically defined perfect circle (perfect circle) but also a circle with some distortion is included. The polygons include not only mathematically defined complete polygons but also polygons with deformations on the sides, polygons with rounded corners on the corners, and polygons with deformations on the sides and rounded corners. The deformation applied to the opposite side may be a curve such as a convex or concave shape.

In the present technology, as a method for forming a plurality of holes and a plurality of islands having a random pattern, a method of removing unnecessary portions after forming a uniform film (hereinafter, appropriately referred to as an etching method), a method of directly forming a random pattern from the beginning (hereinafter, appropriately referred to as a printing method), and the like can be given, but the forming method is not limited to these methods. As the etching method, a method of patterning by exposure and wet etching using an etching solution, a method of applying an etching paste in a patterned shape, or the like can be used, but the etching method is not limited to these methods. Further, as the printing method, screen printing, waterless lithography, flexography, gravure printing, gravure offset printing, reverse offset printing, and micro-contact printing can be used, but the printing method is not limited to these methods.

In the present technology, the transparent electrode pattern portion is preferably an X electrode pattern portion or a Y electrode pattern portion. When the transparent conductive element is used as an electrostatic capacitance type information input device (touch panel), the X electrode pattern portion and the Y electrode pattern portion may be formed on one of the first surface and the second surface of the base material different from each other. The X electrode pattern portion and the Y electrode pattern portion may be formed on the first surface and the second surface of one base material, respectively, or both the X electrode pattern portion and the Y electrode pattern portion may be formed on one of the first surface and the second surface of one base material. In the case where both the X electrode pattern portion and the Y electrode pattern portion are formed on one of the first surface and the second surface of one base material, it is preferable that a transparent insulating pattern portion is formed in a gap between the X electrode pattern portion and the Y electrode pattern portion.

In the present technology, the plurality of holes are preferably formed so as to be entirely separated, but a part of the plurality of holes may be joined or overlapped with each other within a range in which visibility and conductivity are not degraded. Further, the plurality of island portions are preferably formed so as to be entirely separated, but a part of the plurality of island portions may be joined or overlapped with each other within a range in which visibility and insulation are not degraded.

In the present technology, since the transparent electrode pattern portion and the transparent insulating pattern portion are alternately laid on the surface of the base material, the difference in optical characteristics between the region where the transparent electrode pattern portion is formed and the region where the transparent electrode pattern portion is not formed (that is, the region where the transparent insulating pattern portion is formed) can be reduced. Therefore, the transparent electrode pattern portion can be prevented from being recognized. In addition, since the plurality of holes are formed in the transparent electrode pattern portion and the plurality of island portions are formed in the transparent insulating pattern portion, the occurrence of streaks can be suppressed.

ADVANTAGEOUS EFFECTS OF INVENTION

As described above, according to the present technology, since the occurrence of the streak can be suppressed while the visibility of the transparent electrode pattern portion can be suppressed, the transparent conductive element having good visibility can be realized.

Drawings

Fig. 1 is a cross-sectional view showing an example of the configuration of an information input device according to a first embodiment of the present technology.

Fig. 2A is a plan view showing an example of the structure of the first transparent conductive element according to the first embodiment of the present technology. Fig. 2B is a sectional view taken along the line a-a shown in fig. 1A. FIG. 2C is an enlarged view showing a region C shown in FIG. 2A₁Top view of (a).

Fig. 3A is an enlarged plan view showing the vicinity of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion. Fig. 3B is a sectional view taken along the line a-a shown in fig. 3A.

Fig. 4A is a plan view showing an example of the structure of the second transparent conductive element according to the first embodiment of the present technology. Fig. 4B is a sectional view taken along the line a-a shown in fig. 4A. FIG. 4C is an enlarged view showing a region C shown in FIG. 4A₂Top view of (a).

Fig. 5A to 5D are process diagrams for explaining an example of the method for manufacturing the first transparent conductive element according to the first embodiment of the present technology.

Fig. 6 is a diagram for explaining an algorithm for generating a random pattern.

Fig. 7 is a flowchart for explaining an algorithm for generating a random pattern.

Fig. 8 is a diagram for explaining an algorithm for generating a random pattern.

Fig. 9 is a flowchart for explaining an algorithm for generating a random pattern.

Fig. 10 is a diagram for explaining an algorithm for generating a random pattern.

Fig. 11A is a schematic diagram of an image showing a method of generating a random pattern. Fig. 11B is a diagram showing an example of generating a random pattern having a circle area ratio of 80%.

Fig. 12A is a diagram showing an example in which the circle radius is smaller than the generated pattern. Fig. 12B is a diagram showing an example of generating a pattern using a square with a cut-off corner.

Fig. 13A is an enlarged plan view showing the vicinity of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion of the first transparent conductive element. Fig. 13B is an enlarged plan view showing the vicinity of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion of the second transparent conductive element.

Fig. 14A to 14E are cross-sectional views showing modifications of the first transparent conductive element and the second transparent conductive element according to the first embodiment of the present technology.

FIG. 15A shows a first perspective view of a second embodiment of the present technologyA perspective view showing an example of the shape of a master used in a method for manufacturing a conductive element. FIG. 15B is an enlarged view showing the first region R shown in FIG. 15A₁And a second region R₂A top view of a portion of (a).

Fig. 16A and 16B are process diagrams for explaining an example of a method for manufacturing a first conductive element according to a second embodiment of the present technology.

Fig. 17A is a plan view showing an example of the structure of a first transparent conductive element according to a third embodiment of the present technology. Fig. 17B is a sectional view taken along the line a-a shown in fig. 17A. FIG. 17C is an enlarged view showing a region C shown in FIG. 17A₁Top view of (a).

Fig. 18A is an enlarged plan view showing the vicinity of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion. Fig. 18B is a sectional view taken along the line B-B shown in fig. 18A.

Fig. 19A is a plan view showing an example of the structure of the second transparent conductive element according to the third embodiment of the present technology. Fig. 19B is a sectional view taken along the line c-c shown in fig. 19A. FIG. 19C is an enlarged view showing a region C shown in FIG. 19A₂Top view of (a).

Fig. 20A to 20C are explanatory views of patterns of the conductive portion and a comparative example.

Fig. 21 is an explanatory diagram of sheet resistance (sheet resistance) with respect to the coverage of the conductive portion.

Fig. 22A is a plan view for explaining an overlapping region of the first and second transparent conductive elements according to the third embodiment of the present technology. Fig. 22B is a plan view showing a part of fig. 22A in an enlarged manner.

Fig. 23A and 23B are graphs for explaining weighting of random numbers in the third embodiment of the present technology.

Fig. 24A to 24C are diagrams for explaining a method of forming a mesh pattern in the third embodiment of the present technology.

Fig. 25A is a perspective view showing an example of the shape of a master used in the method for manufacturing the first transparent conductive element according to the third embodiment of the present technology. FIG. 25B is an enlarged view showing the first region R shown in FIG. 25A₁And a second region R₂A top view of a portion of (a).

Fig. 26A is a plan view showing an example of the structure of the first transparent conductive element according to the fourth embodiment of the present technology. Fig. 26B is a plan view showing an example of the structure of the second transparent conductive element according to the fourth embodiment of the present technology.

Fig. 27A is a plan view for explaining an overlapping region of the first and second transparent conductive elements according to the fourth embodiment of the present technology. Fig. 27B is an enlarged plan view showing a part of fig. 27A.

Fig. 28 is a schematic diagram for explaining a combination of patterns in the fourth embodiment of the present technology.

Fig. 29A to 29C are sectional views showing a configuration example of a transparent conductive element according to a fifth embodiment of the present technology.

Fig. 30 is a plan view showing an example of the structure of a transparent conductive element according to a sixth embodiment of the present technology.

Fig. 31A is an enlarged plan view of the region a shown in fig. 30. Fig. 31B is a sectional view taken along line a-a' of fig. 31A.

Fig. 32A to 32C are plan views for explaining a procedure of creating groove patterns of absolute regions based on the generated pattern.

Fig. 33 is a plan view showing a change in the width of the groove pattern.

Fig. 34A is a perspective view showing an example of the shape of a master used in the method for manufacturing a transparent conductive element according to the sixth embodiment of the present technology. FIG. 34B is an enlarged view showing the first region R shown in FIG. 34A₁And a second region R₂A top view of a portion of (a).

Fig. 35A is an enlarged plan view of a part of a transparent conductive element according to a seventh embodiment of the present technology. Fig. 35B is a sectional view taken along line a-a' of fig. 35A.

Fig. 36A is a plan view for explaining a configuration example of the transparent conductive element according to the eighth embodiment of the present technology. Fig. 36B is a plan view for explaining a modification of the transparent conductive element according to the eighth embodiment of the present technology.

Fig. 37 is a cross-sectional view showing an example of the configuration of an information input device according to a ninth embodiment of the present technology.

Fig. 38A is a plan view showing an example of the structure of a transparent conductive element according to a tenth embodiment of the present technology. Fig. 38B is a schematic sectional view taken along the line a-a shown in fig. 38A.

Fig. 39A is an enlarged plan view showing the vicinity of the intersection C shown in fig. 38A. Fig. 39B is a sectional view taken along the line a-a shown in fig. 39A.

Fig. 40 is a perspective view showing a television (electronic device) having a display unit.

Fig. 41 is a perspective view showing a digital camera (electronic device) having a display unit.

Fig. 42 is a perspective view showing a notebook personal computer (electronic device) having a display portion.

Fig. 43 is a perspective view showing a video camera (electronic device) having a display unit.

Fig. 44 is a front view of a portable terminal device (electronic apparatus) having a display unit.

Fig. 45A and 45B show photographs of the transparent electrode pattern portion and the transparent insulating pattern portion of the transparent conductive film of example 1.

Fig. 46A and 46B are plan views of random patterns for explaining the embodiment.

Fig. 47 is a top view of a random pattern for illustrating an embodiment.

FIG. 48 is a plan view showing the transparent electrode pattern part (electrode region) and the transparent insulating pattern part (insulating region) in examples 3-1 to 3-3.

Detailed Description

Embodiments of the present technology are described below in the following order with reference to the drawings. Note that, in all the drawings of the following embodiments, the same or corresponding portions are denoted by the same reference numerals.

1. A first embodiment (an example of a transparent conductive element and an information input device using the same).

2. A second embodiment (an example of a method for manufacturing a transparent conductive element by a printing method).

3. A third embodiment (an example in which the random patterns of the transparent electrode pattern portion and the transparent insulating pattern portion are different from each other).

4. A fourth embodiment (an example of a diamond pattern electrode).

5. A fifth embodiment (an example of a transparent conductive element using metal nanowires).

6. A sixth embodiment (an example in which a mesh-like groove portion is provided in a transparent insulating pattern portion).

7. A seventh embodiment (an example in which only the transparent insulating pattern portion is provided with a transparent conductive element having a random pattern).

8. An eighth embodiment (an example in which the numerical range of the ratio of the lengths of the boundary lines between the transparent electrode pattern portion and the transparent insulating pattern portion is limited).

9. A ninth embodiment (an example in which an X electrode is provided on one main surface of a substrate and a Y electrode is provided on the other main surface).

10. A tenth embodiment (an example in which an X electrode and a Y electrode are provided on one main surface of a substrate).

11. An eleventh embodiment (application example applied to electronic equipment).

< 1> first embodiment >

[ Structure of information input device ]

Fig. 1 is a cross-sectional view showing an example of the configuration of an information input device according to a first embodiment of the present technology. As shown in fig. 1, the information input device 10 is provided on the display surface of the display device 4. The information input device 10 is bonded to the display surface of the display device 4 with, for example, a bonding layer 5.

The information input device 10 is a so-called projected capacitive touch panel, and includes a first transparent conductive element 1 and a second transparent conductive element 2 provided on a surface of the first transparent conductive element 1, and the first transparent conductive element 1 and the second transparent conductive element 2 are bonded to each other with a bonding layer 6 interposed therebetween. Further, the optical layer 3 may be provided on the surface of the second transparent conductive element 2 as needed.

(first transparent conductive element)

Fig. 2A is a plan view showing an example of the structure of the first transparent conductive element according to the first embodiment of the present technology. Fig. 2B is a sectional view taken along the line a-a shown in fig. 2A. FIG. 2C is an enlarged view showing a region C shown in FIG. 2A₁Top view of (a). As shown in fig. 2A and 2B, the first transparent conductive element 1 includes: a substrate 11 having a surface; and a transparent conductive layer 12 formed on the surface. The transparent conductive layer 12 has a transparent electrode pattern portion 13 and a transparent insulating pattern portion 14. The transparent electrode pattern portion 13 is an X-electrode pattern portion extending in the X-axis direction. The transparent insulating pattern portions 14 are so-called dummy electrode pattern portions extending in the X-axis direction and interposed between the transparent electrode pattern portions 13 so that adjacent transparent electrode pattern portions 13 are interposed between the transparent electrode pattern portions 13An insulating pattern portion. These transparent electrode pattern portions 13 and transparent insulating pattern portions 14 are alternately laid on the surface of the base material 11 in the Y-axis direction. In addition, in FIGS. 2A to 2C, the region R₁Region R representing a region for forming the transparent electrode pattern 13₂The formation region of the transparent insulating pattern part 14 is shown.

The shapes of the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are preferably selected appropriately according to the screen shape, the driving circuit, and the like, and examples thereof include a linear shape, a shape in which a plurality of diamonds (diamond shapes) are connected in a linear shape, and the like, but are not particularly limited to these shapes. Fig. 2A illustrates a case where the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are formed linearly.

As shown in fig. 2C, the transparent electrode pattern 13 is a transparent conductive layer in which a plurality of holes 13a are formed at random while being separated, and a conductive portion 13b is present between adjacent holes 13 a. On the other hand, the transparent insulating pattern 14 is a transparent conductive layer composed of a plurality of island portions 14a formed at random and separated from each other, and a gap portion 14b as an insulating portion is present between adjacent island portions 14 a. Here, although it is preferable to completely remove the transparent conductive layer in the gap portion 14b, a part of the transparent conductive layer may be left in an island shape or a film shape as long as the gap portion 14b can function as an insulating portion. The hole portion 13a and the island portion 14a preferably have a random structure without periodicity. When the hole 13a and the island 14a are formed with a periodic structure of a micron order or less, interference light (interference light) may occur in the hole itself or when the information input device 10 is arranged on the display surface of the display device 4 and observed, streaks may occur.

Fig. 3A is an enlarged plan view showing the vicinity of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion. Fig. 3B is a sectional view taken along the line a-a shown in fig. 3A. As shown in fig. 3A and 3B, it is preferable that the boundary L between the transparent electrode pattern 13 and the transparent insulating pattern 14 is formed₁A plurality of inversion portions 15 are formed at random and separated from each other. The inversion portion 15 has the following structure: having a hole portion 13a and an island portion 14a, with a boundary line L₁As a boundary, the hole 13a is inverted to the island 14 a. This is because, in this way, the boundary line L is formed₁The plurality of inversion portions 15 are formed at random, thereby suppressing the boundary line L₁And (4) identifying.

In the first region R₁For example, the plurality of holes 13a are exposed areas on the surface of the base material, and the conductive portions 13b interposed between the adjacent holes 13a are covered areas on the surface of the base material. On the other hand, in the second region R₂While the plurality of island portions 14a are covered regions of the substrate surface, the gap portions 14b between adjacent island portions 14a are exposed regions of the substrate surface. Making the first region R₁And a second region R₂The coverage difference of (a) is 60% or less, preferably 40% or less, and more preferably 30% or less, and the hole 13a and the island 14a are formed in sizes that are not visually recognizable. When the transparent electrode pattern part 13 and the transparent insulating pattern part 14 are compared by visual observation, the transparent conductive layer is sensed in the first region R₁And a second region R₂Since the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are covered with the same covering material, visibility can be suppressed.

Preferably in the first region R₁The ratio of the covered area of the conductive portion 13b is high. This is because, in order to have the same conductivity as the coverage decreases, the thickness of the conductive portion 13b must be increased, but when etching is considered, the thickness of the entire surface at the time of first film formation must be increased, and the cost increases in inverse proportion to the coverage. For example, the material cost is 2 times for a coverage of 50%, and 10 times for a coverage of 10%. In addition, the problem arises that the thickness of the conductive portion 13b is increased, which deteriorates optical characteristics, and deteriorates printability when a conductive material is made into a paint to print a fine pattern. When the coverage is too small, the possibility of insulation becomes high. In view of the above, the coverage is preferably at least 10% or more. The upper limit of the coverage is not particularly limited.

When in the second region R₂If the coverage of the island portion 14a in (d) is too high, it is difficult to generate the random pattern itself, and the island portions 14a are close to each other and may cause short-circuiting, so the coverage of the island portion 14a is preferably 95% or less.

The shapes of the hole 13a and the island 14a may be any shapes as long as they are not visually recognizable and do not have periodicity, and for example, 1 kind or 2 or more kinds selected from the group consisting of a circular shape, an elliptical shape, a shape in which a part of a circular shape is cut off, a shape in which a part of an elliptical shape is cut off, a polygon in which corners are cut off, and an irregular shape may be used in combination. However, when the size of each shape is too large, the shapes of the hole 13a and the island 14a can be visually recognized, and therefore, it is preferable to avoid a shape in which the conductive portion or the non-conductive portion is continuous by 50 μm or more in any direction from any point. For example, when the island portion 14a is circular, the diameter is preferably smaller than 100 μm. In terms of the distance to be recognized, it is preferable to avoid a shape in which the conductive portion or the non-conductive portion is continuous by 30 μm or more in any direction from any point. According to the method of manufacturing the first transparent conductive element 1, the thickness of the transparent conductive layer may not be uniform. In this case, the "coverage" may be defined in terms of the volume of the conductive material per unit area.

The absolute value of the difference between the reflection L values of the transparent electrode pattern 13 and the transparent insulating pattern 14 is preferably less than 0.3. This is because the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 can be prevented from being recognized.

(substrate)

As the material of the substrate 11, for example, glass or plastic can be used. As the glass, for example, known glass can be used. Specific examples of the known glass include soda lime glass, lead glass, hard glass, quartz glass, and liquid crystal glass. As the plastic, for example, a known polymer material can be used. Specific examples of the known polymer material include Triacetylcellulose (TAC), polyester (TPEE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyimide (PI), Polyamide (PA), aramid, polyethylene (P), polyacrylate, polyethersulfone, polysulfone, polypropylene (PP), diacetylcellulose, polyvinyl chloride, acrylic resin (PMMA), Polycarbonate (PC), epoxy resin, urea resin, polyurethane resin, melamine resin, cycloolefin polymer (COP), norbornene-based thermoplastic resin, and the like.

The thickness of the glass substrate is preferably 20 μm to 10mm, but is not particularly limited to this range. The thickness of the plastic substrate is preferably 20 μm to 500. mu.m, but is not particularly limited to this range.

(transparent conductive layer)

Examples of the material of the transparent conductive layer 12 include metal oxides such as Indium Tin Oxide (ITO), zinc oxide, indium oxide, antimony-doped tin oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, silicon-doped zinc oxide, zinc oxide-tin oxides, indium oxide-tin oxides, and zinc oxide-indium oxide-magnesium oxide, metals such as copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, and lead, and alloys thereof. A composite material in which carbon nanotubes are dispersed in a binder material may also be used. Conductive polymers of substituted or unsubstituted polyaniline, polypyrrole, polythiophene, and (co) polymers composed of one or two selected from them can also be used. Two or more of them may be used in combination.

As a method for forming the transparent conductive layer 12, for example, a PVD method such as a sputtering method, a vacuum deposition method, or an ion plating method, a CVD method, a coating method, a printing method, or the like can be used. Preferably, the thickness of the transparent conductive layer 12, 22 is appropriately selected in the following manner: in a state before patterning (a state in which the transparent conductive layers 12 and 22 are formed on the entire surface of the substrate 11), the surface resistance is 1000 Ω/□ or less.

(second transparent conductive element)

Fig. 4A is a plan view showing an example of the structure of the second transparent conductive element according to the first embodiment of the present technology. Fig. 4B is a sectional view taken along the line a-a shown in fig. 4A. FIG. 4C is an enlarged view showing a region C shown in FIG. 4A₂Top view of (a). As shown in fig. 4A and 4B, the second transparent conductive element 2 includes: a substrate 21 having a surface; and a transparent conductive layer 22 formed on the surface. The transparent conductive layer 22 has a transparent electrode pattern portion 23 and a transparent insulating pattern portion 24. The transparent electrode pattern portion 23 is a Y electrode pattern portion extending in the Y axis direction. The transparent insulating pattern portions 24 are so-called dummy electrode pattern portions, and are insulating pattern portions extending in the Y-axis direction and interposed between the transparent electrode pattern portions 23 to insulate between the adjacent transparent electrode pattern portions 23. These transparent electrode pattern portions 23 and transparent insulating pattern portions 24 are alternately laid on the surface of the base material 11 in the X-axis direction. The transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 of the first transparent conductive element 1 and the transparent electrode pattern portion 23 and the transparent insulating pattern portion 24 of the second transparent conductive element 2 are, for example, in a mutually orthogonal relationship. In addition, in FIGS. 4A to 4C, the region R₁Region R representing a region for forming the transparent electrode pattern portion 23₂The formation region of the transparent insulating pattern portion 24 is shown.

As shown in fig. 4C, the transparent electrode pattern portion 23 is a transparent conductive layer in which a plurality of holes 23a are formed at random while being separated, and conductive portions 23b are present between adjacent holes 23 a. On the other hand, the transparent insulating pattern 24 is a transparent conductive layer composed of a plurality of island portions 24a formed at random and separated from each other, and a gap portion 24b as an insulating portion is present between adjacent island portions 24 a. Preferably, the boundary L between the transparent electrode pattern 23 and the transparent insulating pattern 24₂A plurality of inversion portions 25 are formed at random and separated from each other.

The second transparent conductive element 2 is the same as the first transparent conductive element 1 except for the above.

(optical layer)

The optical layer 3 includes, for example, a base material 31 and a bonding layer 32 provided between the base material 31 and the second transparent conductive element 2, and the base material 31 is bonded to the surface of the second transparent conductive element 2 with the bonding layer 32 interposed therebetween. The optical layer 3 is not limited to this example, and may be SiO₂Etc. ceramic coatings (overlays).

(display device)

The Display device 4 to which the information input device 10 is applied is not particularly limited, but examples thereof include various Display devices such as a liquid crystal Display, a crt (cathode Ray tube) Display, a Plasma Display Panel (PDP), an Electro Luminescence (EL) Display, and a Surface-conduction Electron-emitter Display (SED).

[ method for producing transparent conductive element ]

Next, an example of a method for manufacturing the first conductive element 1 configured as described above will be described with reference to fig. 5A to 5D. Since the second transparent conductive element 2 can be manufactured in the same manner as the first transparent conductive element 1, a description of a method for manufacturing the second transparent conductive element 2 will be omitted.

(Process for Forming transparent conductive layer)

First, as shown in fig. 5A, a transparent conductive layer 12 is formed on the surface of a substrate 11. When forming the transparent conductive layer 12, the substrate 11 may be heated. As a method for forming the transparent conductive layer 12, for example, a CVD method (Chemical Vapor Deposition method): a technique of depositing a thin film from a gas phase by a Chemical reaction) such as thermal CVD, plasma CVD, or photo CVD, a PVD method (Physical Vapor Deposition) such as vacuum Vapor Deposition, plasma-assisted Vapor Deposition, sputtering, or ion plating, a technique of condensing a physically vaporized material in a vacuum on a substrate to form a thin film, or the like can be used. Next, the transparent conductive layer 12 is subjected to annealing treatment as necessary. Thereby, the transparent conductive layer 12 is, for example, in a mixed state of amorphous and polycrystalline or a polycrystalline state, and the conductivity of the transparent conductive layer 12 is improved.

(Process for Forming resist layer)

Next, as shown in fig. 5B, a resist layer 41 having an opening 33 in a portion corresponding to the hole 13a and the gap 14B is formed on the surface of the transparent conductive layer 12. As a material of the resist layer 41, for example, any of an organic resist and an inorganic resist can be used. As the organic resist, for example, a phenol-aldehyde resist or a chemical amplification resist can be used. As the inorganic resist, for example, a metal compound composed of 1 or 2 or more kinds of transition metals can be used.

(developing step)

Next, as shown in fig. 5C, the transparent conductive layer 12 is subjected to etching treatment using the resist layer 41 having the plurality of openings 33 formed therein as an etching mask. Thereby, in the first region R₁The transparent conductive layer 12 has holes 13a and conductive parts 13b formed therein, and the second region R₂The transparent conductive layer 12 of (2) forms an island portion 14a and a gap portion 14 b. As the etching, for example, either dry etching or wet etching can be used, but wet etching is preferably used from the viewpoint of simplifying the equipment.

(Process for peeling resist layer)

Next, as shown in fig. 5D, the resist layer 41 formed on the transparent conductive layer 12 is peeled off by ashing or the like.

Through the above steps, the intended first transparent conductive element 1 is obtained.

[ method of generating random Pattern ]

A method of generating a random pattern for forming the holes 13a and 23a and the islands 14a and 24a will be described below. Here, a case where a circular random pattern is generated will be described as an example, but the shape of the random pattern is not limited to this.

(basic algorithm for generating random Pattern)

The radius of the circle is randomly changed within a set range, and the center coordinates of the circles are calculated so that adjacent circles always touch each other, and the circles are arranged, thereby generating a pattern that achieves both the randomness of the arrangement and high-density filling. A pattern which is randomly arranged with high density and uniformity is obtained with a small amount of calculation by the following algorithm.

(1) Circles "with a radius randomly within a certain range" are arranged in a tangential manner on the X-axis.

(2) The "circles of random radius" are determined to be stacked in order from the lower side in such a manner as to be tangent to the existing two circles and not to overlap with other circles.

The parameters used in generating the random pattern are shown below.

X_min: generating the X-coordinate maximum of the area of the circle

Y_max: generating a maximum value of a Y-coordinate of a region of a circle

R_min: minimum radius of generated circle

R_max: maximum radius of the generated circle

R_fill: minimum radius for assisting in setting circle for increasing filling rate

Rnd: random number obtained in the range of 0.0 to 1.0

P_n: from X coordinate value X_nY coordinate value Y_nRadius r_nA defined circle.

The parameters to be used are shown below.

X_min: generating the X-coordinate maximum of the area of the circle

Y_w: setting of maximum value of Y coordinate that can be obtained when circles are arranged on X axis

R_min: minimum radius of generated circle

R_max: maximum radius of the generated circle

Rnd: random number obtained in the range of 0.0 to 1.0

P_n: from the value of X coordinate_nY-coordinate value Y_nRadius r_nA defined circle.

As shown in fig. 6, from 0.0 to substantially R on the X-axis_minThe value of (2) randomly determines the Y coordinate value, and is repeatedly arranged in a tangential manner with respect to the existing circle_minTo R_maxThe range of (2) randomly determines a circle of radius, and a row of circles are randomly arranged on the X-axis.

Hereinafter, the algorithm will be described with reference to a flowchart shown in fig. 7.

First, in step S1, necessary parameters are set. Next, in step S2, the circle P is set as follows₀（x₀，y₀，r₀）。

x₀=0.0

y₀=0.0

r₀=R_min+（R_max－R_min）×Rnd

Next, in step S3, the circle P is determined by the following equation_n（x_n，y_n，r_n）。

r_n=R_min+（R_max－R_min）×Rnd

y_n=Y_w×Rnd

x_n=x_n-1+（r_n－r_n-1）×cos（asin（y_n－y_n-1）/（r_n－r_n-1））

Next, X is determined in step S4_n>X_maxWhether or not this is true. At step S4, it is determined as X_n>X_maxIf true, the process ends. At step S4, it is determined as X_n>X_maxIf not, the process proceeds to step S5. In step S5, the circle P is stored_n（x_n，y_n，r_n). Next, in step S6, the value of n is increased, and the process proceeds to step S3.

The parameters used are shown below.

X_min: generating the X-coordinate maximum of the area of the circle

Y_max: generating a maximum value of a Y-coordinate of a region of a circle

R_min: minimum radius of generated circle

R_max: maximum radius of the generated circle

Rnd: random number obtained in the range of 0.0 to 1.0

As shown in FIG. 8, the circle aligned in a line on the X-axis determined in (1) is drawn from the R_minTo R_maxThe range of (2) determines a circle of random radius, starting from a circle of small Y coordinate and tangent to other circlesThe circle is repeatedly arranged. In addition, a ratio R is set_minR of (A) to (B)_fillIf the circle is determined to have a gap that is not filled, the gap is filled to increase the filling rate. Without using the ratio R_minIn the case of a small circle, set to R_fill=R_min。

Hereinafter, the algorithm will be described with reference to a flowchart shown in fig. 9.

First, necessary parameters are set in step S11. Next, in step S12, the circle P is obtained₀To the circle P_nY coordinate value Y in (1)_iSmallest circle P_i. Subsequently, in step S13, y is determined_i<Y_maxWhether or not this is true. It is determined at step S13 that y is_i<Y_maxWhen this is true, the process ends. It is determined at step S13 that y is_i<Y_maxIf not, the additional circle P is made in step S14_kRadius r of_kIs r_k=R_min+（R_max－R_min) X Rnd. Next, in step S15, circle P_iFinding out the exclusion circle P_iOuter Y coordinate value Y_iSmallest circle P_j。

Next, in step S16, it is determined whether or not the smallest circle P exists_i. It is determined in step S16 that the smallest circle P does not exist_iIn the case of (1), in step S17, P is set forth later_iAnd (4) invalidation. It is determined in step S16 that the smallest circle P exists_iIn step S18, it is determined whether or not the circle P exists_iAnd the circle P_jRadius of tangency r_kCircle P of_k. Fig. 10 shows a method for determining coordinates when a circle of an arbitrary radius is arranged so as to be tangent to two tangent circles in step S18.

Next, in step S19, it is determined whether or not the circle P exists_iAnd the circle P_jRadius of tangency r_kCircle P of_k. It is determined in step S19 that circle P is not present_kThen, the circle P is excluded in step S20_iCircle P_jCombinations of (a) and (b). It is determined in step S19To exist a circle P_kWhen the circle is determined to be the slave circle P in step S21₀To the circle P_nWhether or not there is a circle P_kA repeated circle. If it is determined at step S21 that there is no overlapping circle, the circle P is stored at step S24_k（x_k，y_k，r_k). Next, in step S25, the value of n is increased, and the process proceeds to step S12.

If it is determined in step S21 that there is a circle that overlaps, it is determined in step S22 that R is the circle_fillThe above range is reduced by a circle P_kRadius r of_kWhether duplication can be avoided. If it is determined in step S22 that duplication cannot be avoided, in step S20, the circle P is excluded from the following_iCircle P_jCombinations of (a) and (b). If it is determined in step S22 that overlap can be avoided, the radius r is set to_kTo the maximum value that can avoid repetition. Next, the circle P is stored in step S24_k（x_k，y_k，r_k). Next, in step S25, the value of n is increased, and the process proceeds to step S12.

Fig. 11A is a schematic diagram of an image showing a method of generating a random pattern. Fig. 11B is a diagram showing an example of generating a random pattern in which the area ratio of the circle is 80%. As shown in fig. 11A, by randomly changing the radius of the circle within a predetermined range and stacking the circles, a pattern having high density can be generated irregularly. Since the pattern has no regularity, it is possible to avoid occurrence of defects such as streaks in the information input device 10 and the like.

Fig. 12A is a diagram showing an example in which the circle radius is smaller than the generated pattern. Fig. 12B is a diagram showing an example of a pattern generated by a square with corners cut off. By drawing a figure smaller than a circle in the generated circle, each isolated pattern can be formed (fig. 12A). By using the isolated pattern in this way, the transparent electrode pattern portions 13 and 23 and the transparent insulating pattern portions 14 and 24 can be formed. By drawing an arbitrary figure in the generated pattern circle, the tendency of the pattern can be changed or the area occupancy can be adjusted (fig. 12B). Examples of the shape of the figure drawn in the circle include a circle, an ellipse, a polygon with corners cut off, and an indeterminate shape, and fig. 12B shows an example of a polygon with corners cut off.

(modification example)

Next, a modified example of the first transparent conductive element and the second transparent conductive element according to the first embodiment will be described.

(borderline)

Fig. 13A is an enlarged plan view showing the vicinity of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion of the first transparent conductive element. Fig. 13B is an enlarged plan view showing the vicinity of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion of the second transparent conductive element. As shown in fig. 13A, it is preferable that a boundary line L between the transparent electrode pattern portion and the transparent insulating pattern portion of the first transparent conductive element is set to be larger than a boundary line L between the transparent electrode pattern portion and the transparent insulating pattern portion₁The shape of (2) is a combination of the shapes of the hole 13a and the island 14 a. By adopting such a shape, the boundary line L can be formed₁In a random shape. As shown in FIG. 13B, it is preferable that the boundary line L between the transparent electrode pattern portion and the transparent insulating pattern portion of the second transparent conductive element is set to be larger than the boundary line L between the transparent electrode pattern portion and the transparent insulating pattern portion of the second transparent conductive element₂The shape of (2) is a combination of the shapes of the hole 23a and the island 24 a. By adopting such a shape, the boundary line L can be formed₂In a random shape.

(surfaces on which conductive pattern portions and non-conductive pattern portions are formed)

As shown in fig. 14A, the transparent conductive layer 12 may be formed on one surface of the base material 21 of the second transparent conductive element 2 and the transparent conductive layer 22 may be formed on the other surface. In this case, in the information input device 10 shown in fig. 1, the formation of the base material 11 can be omitted.

(hard coating)

As shown in fig. 14B, a hard coat layer 61 may be formed on at least one of both surfaces of the first transparent conductive element 1. Thus, when a plastic substrate is used as the substrate 11, it is possible to prevent the substrate 11 from being damaged in the process, impart chemical resistance, and suppress precipitation of low-molecular-weight substances such as oligomers. As the material of the hard coat layer, an ionizing radiation curing resin which cures by light, electron beam, or the like, or a thermal curing resin which cures by heat is preferably used, and a photosensitive resin which cures by ultraviolet rays is most preferred. As such a photosensitive resin, for example, an acrylate resin such as urethane acrylate, epoxy acrylate, polyester acrylate, polyol acrylate, polyether acrylate, and melamine acrylate can be used. For example, a urethane acrylate resin is obtained by reacting an isocyanate monomer or prepolymer with a polyester polyol and reacting the resultant with an acrylate or methacrylate monomer having a hydroxyl group. The thickness of the hard coat layer 61 is preferably 1 μm to 20 μm, but is not particularly limited to this range.

The hard coat layer 61 is formed by applying a hard coat paint on the substrate 11. The coating method is not particularly limited, and a known coating method can be used. Examples of known coating methods include a micro gravure coating method, a wire bar coating method, a direct gravure coating method, a dispensing coating method, a dipping method, a spray coating method, a reverse roll coating method, a curtain coating method, a dispensing (comma coating) method, a doctor blade coating method, and a spin coating method. The hard coat coating material includes a resin raw material such as a bifunctional or higher monomer and/or oligomer, a photopolymerization initiator, and a solvent. The solvent is volatilized by drying the hard coat paint applied on the substrate 11. Thereafter, the hard coat paint dried on the substrate 11 is hardened by, for example, irradiation of ionizing radiation or heating. In addition, similarly to the first transparent conductive element 1 described above, the hard coat layer 61 may be formed on at least one of the two surfaces of the second transparent conductive element 2.

(optical adjustment layer)

As shown in fig. 14C, an optical adjustment layer 62 is preferably present between the substrate 11 and the transparent conductive layer 12 of the first transparent conductive element 1. This can facilitate invisibility of the pattern shape of the transparent electrode pattern portion 13. The optical adjustment layer 62 is composed of, for example, a laminate of 2 or more layers having different refractive indices, and the transparent conductive layer 12 is formed on the low refractive index layer side. More specifically, as the optical adjustment layer 62, for example, a conventionally known optical adjustment layer can be used. As such an optical adjustment layer, for example, the optical adjustment layers described in japanese patent application laid-open nos. 2008-98169, 2010-15861, 2010-23282, and 2010-27294 can be used. Further, as in the first transparent conductive element 1 described above, an optical adjustment layer 62 may be present between the base material 21 and the transparent conductive layer 22 of the second transparent conductive element 2.

(adhesion assisting layer)

As shown in fig. 14D, a contact auxiliary layer 63 is preferably provided as a base layer of the transparent conductive layer 12 of the first transparent conductive element 1. This can improve the adhesion of the transparent conductive layer 12 to the substrate 11. As the material of the adhesion assisting layer 63, for example, polyacrylic resin, polyamide-imide resin, polyester resin, and a product of hydrolysis and dehydration condensation of chloride, peroxide, alkoxide, or the like of a metal element can be used.

Instead of using the adhesion assisting layer 63, a discharge treatment of irradiation glow discharge or corona discharge may be applied to the surface on which the transparent conductive layer 12 is provided. Alternatively, a chemical treatment method of treating the surface on which the transparent conductive layer 12 is provided with an acid or an alkali may be used. After the transparent conductive layer 12 is provided, the adhesiveness can be improved by rolling treatment. In addition, the second transparent conductive element 2 may be provided with the adhesion assisting layer 63 in the same manner as the first transparent conductive element 1 described above. In addition, the above-described treatment for improving the adhesion may be performed.

(Shielding layer)

As shown in fig. 14E, a shield layer 64 is preferably formed on the first transparent conductive element 1. For example, a film provided with the shield layer 64 may be bonded to the first transparent conductive element 1 via a transparent adhesive layer. In the case where the X electrode pattern and the Y electrode pattern are formed on the same surface side of one substrate 11, the shield layer 64 may be formed directly on the opposite side. As a material of the shield layer 64, the same material as the transparent conductive layer 12 can be used. As a method for forming the shield layer 64, the same method as that for the transparent conductive layer 12 can be used. However, the shield layer 64 is not patterned and used in a state of being formed on the entire surface of the substrate 11. By forming the shield layer 64 on the first transparent conductive element 1, noise caused by electromagnetic waves or the like emitted from the display device 4 can be reduced, and the accuracy of position detection of the information input device 10 can be improved. Further, similarly to the first transparent conductive element 1 described above, the shield layer 64 may be formed on the second transparent conductive element 2.

< 2> second embodiment

The second embodiment of the present technology differs from the first embodiment in that: the first transparent conductive element 1 and the second transparent conductive element 2 were produced by a printing method instead of an etching method. Note that, since the second transparent conductive element 2 can be produced in the same manner as the first transparent conductive element 1, a description of a method for producing the second transparent conductive element 2 will be omitted.

[ Master plate ]

Fig. 15A is a perspective view showing an example of the shape of a master used in the method for manufacturing a first conductive element according to the second embodiment of the present technology. FIG. 15B is an enlarged view showing the first region R shown in FIG. 15A₁And a second region R₂A top view of a portion of (a). The master 100 is, for example, a roll master (roll master) having a cylindrical surface as a transfer surface on which first regions R are alternately laid₁And a second region R₂. In the first region R₁A plurality of holes 113a having a concave shape are formed separately, and the holes 113a are separated by a convex portion 113 b. Hole 113aThe hole 13a for forming the transparent electrode pattern portion 13 by printing, and the projection 113b for forming the conductive portion 13b of the transparent electrode pattern portion 13 by printing. In the second region R₂A plurality of convex island portions 114a are formed separately, and the island portions 114a are separated by concave portions 114 b. The island portion 114a is used to form the island portion 14a of the transparent insulating pattern portion 14 by printing, and the recess portion 114b is used to form the gap portion 14b of the transparent insulating pattern portion 14 by printing.

[ method for producing transparent conductive element ]

An example of a method for manufacturing a first transparent conductive element according to a second embodiment of the present technology will be described with reference to fig. 16A and 16B.

First, as shown in fig. 16A, a conductive ink is applied to the transfer surface of the master 100, and the applied conductive ink is printed on the surface of the substrate 11. As the printing method, for example, screen printing, waterless offset printing, gravure offset printing, reverse offset printing, or the like can be used. Next, as shown in fig. 16B, the conductive ink printed on the surface of the substrate 11 is heated as necessary, thereby drying and/or firing the conductive ink. This makes it possible to obtain the intended first transparent conductive element 1.

< 3> third embodiment

[ Structure of transparent conductive element ]

A first transparent conductive element 1 and a second transparent conductive element 2 according to a third embodiment will be described. Hereinafter, the first transparent conductive element 1 and the second transparent conductive element 2 are referred to as a transparent conductive element 1 and a transparent conductive element 2, respectively, as appropriate.

First, the transparent conductive element 1 on which the X electrode is formed will be described with reference to fig. 17A to 18B. Fig. 17A is a plan view showing an example of the structure of the transparent conductive element. Fig. 17B is a sectional view taken along the line a-a shown in fig. 17A. FIG. 17C is an enlarged view showing a region C shown in FIG. 17A₁Is bentAnd (6) view.

As shown in fig. 17A and 17B, the transparent conductive element 1 includes: a substrate 11 having a surface; and a transparent conductive layer 12 formed on the surface. The transparent conductive layer 12 has a transparent electrode pattern portion 13 and a transparent insulating pattern portion 14. The transparent electrode pattern portion 13 is an X-electrode pattern portion extending in the X-axis direction. The transparent insulating pattern portions 14 are so-called dummy electrode pattern portions, and are insulating pattern portions extending in the X-axis direction and interposed between the transparent electrode pattern portions 13 to insulate between the adjacent transparent electrode pattern portions 13. These transparent electrode pattern portions 13 and transparent insulating pattern portions 14 are alternately laid on the surface of the base material 11 in the Y-axis direction. In fig. 17A to 17C, a region R1 indicates a formation region (electrode region) of the transparent electrode pattern 13, and a region R2 indicates a formation region (insulating region) of the transparent insulating pattern 14.

The shapes of the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are preferably selected as appropriate in accordance with the screen shape, the drive circuit, and the like, and examples thereof include a linear shape, a shape in which a plurality of diamond shapes are connected in a linear shape, and the like, but are not particularly limited to these shapes. In the first embodiment, the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are formed in a linear pattern. An example of the diamond-shaped pattern will be described later as a fourth embodiment.

As shown in fig. 17C, the transparent electrode pattern 13 is a transparent conductive layer in which a plurality of holes 13a are formed at random while being separated, and a conductive portion 13b is present between adjacent holes 13 a. The conductive portion 13b is a conductive material portion in which a conductive material is covered on the surface of the base material 21, and the hole portion 13a is a non-conductive portion which is a portion not covered with the conductive material. Therefore, the transparent electrode pattern portion 13 is formed with a plurality of non-conductive portions (holes 13 a) separated and randomly formed in the formation surface of the conductive material portion (conductive portion 13 b).

On the other hand, the transparent insulating pattern 14 is a transparent conductive layer composed of a plurality of island portions 14a formed at random and separated from each other, and a gap portion 14b as an insulating portion is present between adjacent island portions 14 a. The island portion 14a is a conductive material portion in which a conductive material is covered on the surface of the base material 21, and the gap portion 14b is a non-conductive portion which is a portion not covered with the conductive material. Therefore, the insulating pattern portion 14 is formed with the conductive material portion (island portion 14 a) separated and randomly in the formation surface of the non-conductive portion (gap portion 14 b).

In the present embodiment, the transparent electrode pattern 13 and the transparent insulating pattern 14 are formed of different random patterns. Specifically, the patterns formed by the boundaries of the conductive material portions and the non-conductive portions are random patterns different from each other. Random patterns different from each other are formed as follows: the conductive material portion and the non-conductive portion are arranged based on random patterns generated by different generation conditions. That is, a random pattern for the transparent electrode pattern portion 13 is formed, and the hole portion 13a and the conductive portion 13b are formed based on this pattern. Further, a random pattern for the transparent insulating pattern portion 14 is formed, and the island portion 14a and the gap portion 14b are formed based on this pattern.

In the gap portion 14b of the transparent insulating pattern portion 14, it is preferable to completely remove the conductive material, but a part of the conductive material may remain in an island shape or a film shape as long as the gap portion 14b functions as an insulating portion. The hole 13a and the island 14a preferably have a random structure without periodicity. This is because, when the hole 13a and the land 14a are formed with a periodic structure of a micron order or less, interference light may occur by itself, or a streak may occur when the information input device 10 is placed on the display surface of the display device 4 and observed.

Fig. 18A is an enlarged plan view showing the vicinity of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion. Fig. 18B is a sectional view taken along the line B-B shown in fig. 18A. As shown in fig. 18B, the conductive portions 13B and the island portions 14a are portions where the base 11 is covered with a conductive material, and the hole portions 13a and the gap portions 14B are portions where the conductive material is removed and the base surface is exposed.

As is clear from fig. 18A, the transparent electrode pattern 13 and the transparent insulating pattern 14 are different from each other in useThe random pattern of (2) forms a conductive material portion and a non-conductive portion at a boundary line L₁The two random patterns are bonded after being directly cut. Therefore, at the boundary line L₁The boundary line between the nearby conductive material and the non-conductive part becomes irregular, and the boundary line L can be suppressed₁And (4) identifying.

Fig. 19 shows a transparent conductive element forming a Y electrode. Fig. 19A is a plan view showing an example of the structure of the transparent conductive element, and fig. 19B is a cross-sectional view taken along the line c-c shown in fig. 19A. FIG. 19C is an enlarged view showing a region C shown in FIG. 19A₂Top view of (a).

As shown in fig. 19A and 19B, the transparent conductive element 2 includes: a substrate 21 having a surface; and a transparent conductive layer 22 formed on the surface. The transparent conductive layer 22 has a transparent electrode pattern portion 23 and a transparent insulating pattern portion 24. The transparent electrode pattern portion 23 is a Y electrode pattern portion extending in the Y axis direction. The transparent insulating pattern portions 24 are so-called dummy electrode pattern portions, and are insulating pattern portions extending in the Y-axis direction and interposed between the transparent electrode pattern portions 23 to insulate between the adjacent transparent electrode pattern portions 23. These transparent electrode pattern portions 23 and transparent insulating pattern portions 24 are alternately laid on the surface of the base material 21 in the X-axis direction. The transparent electrode pattern 13 and the transparent insulating pattern 14 of the transparent conductive element 1 and the transparent electrode pattern 23 and the transparent insulating pattern 24 of the transparent conductive element 2 are, for example, in a mutually orthogonal relationship. In fig. 19A to 19C, a region R1 indicates a formation region (electrode region) of the transparent electrode pattern portion 23, and a region R2 indicates a formation region (insulating region) of the transparent insulating pattern portion 24.

As shown in fig. 19C, the transparent electrode pattern portion 23 is a transparent conductive layer in which a plurality of holes 23a are formed at random while being separated, and conductive portions 23b are present between adjacent holes 23 a. Therefore, the transparent electrode pattern portion 23 has a plurality of non-conductive portions (holes 23 a) separated and randomly formed in the formation surface of the conductive material portion (conductive portion 23 b).

On the other hand, the transparent insulating pattern 24 is a transparent conductive layer composed of a plurality of island portions 24a formed at random and separated from each other, and a gap portion 24b as an insulating portion is present between adjacent island portions 24 a. Therefore, the insulating pattern portion 24 is formed with the conductive material portion (island portion 24 a) separated and randomly in the formation surface of the non-conductive portion (gap portion 24 b).

Similarly to the transparent conductive element 1 of the X electrode, the transparent electrode pattern 23 and the transparent insulating pattern 24 are formed of different random patterns. Specifically, the patterns formed by the boundaries of the conductive material portions and the non-conductive portions are random patterns different from each other. At the boundary line L between the transparent electrode pattern part 23 and the transparent insulation pattern part 24₂The two random patterns are bonded after being directly cut.

The conductive material covering of the transparent electrode pattern portions 13 and 23 and the transparent insulating pattern portions 14 and 24 in the transparent conductive elements 1 and 2 having the above-described structure will be described. In the following description, the transparent electrode pattern 13 and the transparent insulating pattern 14 on the X electrode side are mainly used, but the same applies to the transparent electrode pattern 23 and the transparent insulating pattern 24 on the Y electrode side.

Fig. 20A shows a state in which a conductive material is formed on the entire surface of the transparent electrode pattern section 13. That is, the entire surface is in the state of the conductive portion 13b without the hole portion 13 a. Therefore, the coverage of the conductive material (conductive portion 13 b) with respect to the lower substrate 11 (not shown) is 100%. The electrode width of the transparent electrode pattern section 13 shown in fig. 20A is defined as an electrode width W.

In contrast, as shown in fig. 20B, a case where holes 13a are formed in a random pattern is considered. In this case, the coverage of the conductive portions 13b is 50%. Then, in the case of fig. 20B, the average electrode width becomes W × 0.5. Therefore, in the case where the film thickness of the conductive material is the same, the resistance of the transparent electrode pattern portion 13 in fig. 20B is 2 times higher than that in the case where the coverage ratio is 100% in fig. 20A. When the resistance of the transparent electrode pattern portion 13 is large, the response speed and the position detection accuracy may be lowered when the transparent electrode pattern portion is used in a capacitive touch panel.

Of course, even if the hole 13a is formed as shown in fig. 20B, if the film thickness of the conductive material is 2 times, the resistance can be made the same as that of fig. 20A. However, this case is not preferable because it causes problems such as an increase in material cost and a decrease in line speed.

On the other hand, the provision hole portion 13a has a meaning of improving invisibility between the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14. For example, in fig. 20C, a random pattern in which dots of various diameters are arranged at random is generated, and based on this, the hole portions 13a of the transparent electrode pattern portion 13 and the island portions 14a of the transparent insulating pattern portion 14 are formed. In fig. 20C, the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 share one random pattern, and the boundary line L is formed₁It is reversed. That is, the dot portions in the random pattern are formed as holes 13a (non-conductive portions) in the transparent electrode pattern portion 13 and as islands 14a (conductive material portions) in the transparent insulating pattern portion 14. As described above, by introducing random patterns into the transparent electrode pattern 13 and the transparent insulating pattern 14, invisibility can be improved so that the electrode lines cannot be recognized.

Here, the problem of the resistance value before occurs.

When a random pattern is introduced into the transparent electrode pattern portion 13 as shown in fig. 20C, the resistance becomes high. In order to improve the deterioration of the resistance (increase in the resistance value) of the transparent electrode pattern portion 13, it is desired to increase the coverage of the conductive material of the transparent electrode pattern portion 13. That is, the area ratio of the hole 13a is reduced and the area ratio of the conductive portion 13b is increased. However, in this case, when a common random pattern is used for the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14, the area ratio of the island portion 14a is smaller and the area ratio of the gap portion 14b is larger on the transparent insulating pattern portion 14 side. As a result, the following states are obtained: in the transparent electrode pattern portion 13, the conductive portion 13b covering the conductive material is conspicuous, and in the transparent insulating pattern portion 14, the gap portion 14b not covering the conductive material is conspicuous. That is, the difference in coverage of the conductive material between the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 is large, and invisibility is hindered.

Fig. 21 shows a change in sheet resistance with respect to the coverage of the conductive portion 13 b. In fig. 21, the changes in sheet resistance when the coverage is decreased are shown with respect to the cases where a certain conductive material having a certain electrode width and thickness is used and the sheet resistances are 135 Ω/□, 100 Ω/□, 75 Ω/□, and 50 Ω/□ when the coverage of the conductive portion 13b is made 100%, respectively.

As shown in the figure, as the coverage of the conductive portion 13b becomes smaller, the sheet resistance becomes higher. For example, when a touch panel is used for a display such as a notebook-type or tablet-type personal computer, it is preferably about 150 Ω/□ or less. Therefore, in the case of the conductive portions 13b of a conductive material having a sheet resistance of 100 Ω/□ at a coverage of 100%, an electrode width, and a film thickness, it is preferable that the coverage of the conductive portions 13b is 67% or more (approximately 65% or more).

That is, the hole portions 13a and the island portions 14a are provided in a random pattern, whereby it is advantageous in terms of invisibility, but in order to improve invisibility, it is preferable that the area ratio of the hole portions 13a in the transparent electrode pattern portion 13 and the area ratio of the island portions 14a in the transparent insulating pattern portion 14 are almost the same. Therefore, it is preferable to form a random pattern having a coverage of the conductive material of 50% as shown in fig. 20B, and one random pattern is formed on the boundary line L between the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 as shown in fig. 20C₁A pattern inversion is performed to cover the conductive material.

However, in this case, the coverage of the conductive portions 13b in the transparent electrode pattern portion 13 is about 50%, and the sheet resistance becomes high. Therefore, when the coverage of the conductive portions 13b in the transparent electrode pattern portions 13 is, for example, about 65% or more in consideration of this situation, the sheet resistance is suppressed, but the area ratio of the gap portions 14b in the transparent insulating pattern portions 14 is high this time, and the invisibility is deteriorated. In this way, when a common random pattern is repeatedly used for the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14, the electrode resistance and invisibility are in a trade-off relationship.

Therefore, in the present embodiment, different patterns are used for the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14. The different patterns are exemplified below.

First, consider a case where the transparent electrode pattern portion 13 is a full-coat pattern with a coverage of the conductive material of 100% and the transparent insulating pattern portion 14 is a random pattern. In the full-coating pattern, the entire transparent electrode pattern portion 13 is the conductive portion 13b, and the hole portion 13a is not present. The transparent insulating pattern 14 is provided with an island 14a and a gap 14b at random. That is, the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are an example of the following cases: each having at least a conductive material portion, and the conductive material portions are formed by patterns different from each other.

Further, the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 include an example in which the conductive material portion and the non-conductive portion are formed by random patterns different from each other. For example, the transparent electrode pattern portion 13 has a plurality of holes 13a (non-conductive portions) separated and randomly formed in the formation surface of the conductive material portion, and the transparent insulating pattern portion 14 has a conductive material portion (island portion 14 a) separated and randomly formed in the formation surface of the non-conductive portion. In addition, in the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14, patterns formed by boundaries of the conductive material portions and the non-conductive portions are random patterns different from each other as an example. In the case of this embodiment, as shown in fig. 17C and 19C, the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are formed using random patterns different from each other in this manner. The different random patterns are patterns generated under different conditions of generating random patterns (radius ranges, drawing conditions of graphics into the generated circle, weighting of random numbers described later, and the like).

Further, by using different random patterns, both the reduction of the resistance value and the invisibility of the transparent electrode pattern portion 13 can be achieved. For example, in the case of forming the conductive portions 13b of the conductive material having a sheet resistance of 100 Ω/□, an electrode width, and a film thickness as shown in fig. 21 in the transparent electrode pattern portion 13, the coverage of the conductive portions 13b may be approximately 65% or more, and therefore, a random pattern such that the area ratio of the holes 13a is 35% or less may be used. In this case, the transparent insulating pattern portion 14 may be formed using a random pattern in which the area ratio of the gap portions 14b and the area ratio of the holes 13a are not significantly different. This can maintain invisibility. For example, when the coverage of the conductive material portion (conductive portion 13 b) in the transparent electrode pattern portion 13 is set to 65% or more and 100% or less, the coverage of the conductive material portion (gap portion 14 b) in the insulating pattern portion 14 may be set to 65% or more and 100% or less. This state can be achieved by using different random patterns.

Further, in order to make the transparent conductive element 1 (X electrode) invisible, it is necessary to consider a state in which both the transparent conductive element 1 (Y electrode) and the transparent conductive element 2 (Y electrode) are overlapped. First, in the transparent electrode pattern portions 13 (23) and the transparent insulating pattern portions 14 (24) of the transparent conductive elements 1 and 2 constituting the information input device 10 of the present embodiment, the conductive material portions and the non-conductive portions are formed in random patterns different from each other.

Fig. 22A shows the state of fig. 1, that is, the state in which the transparent conductive elements 1 and 2 are arranged to overlap each other, and fig. 22B shows an enlarged view of a part thereof. In this case, the region AR1 is a region where the transparent electrode pattern portions 13 and 23 overlap. The area AR2 is an area where the transparent insulating pattern portions 14 and 24 overlap. The region AR3 is a region where the transparent electrode pattern portion 13 and the transparent insulating pattern portion 24 overlap or where the transparent insulating pattern portion 14 and the transparent electrode pattern portion 23 overlap. When viewed from the input surface side where the user performs the touch operation, all of the portions (input surface forming portions) where the transparent conductive elements 1 and 2 overlap are classified into these regions AR1, AR2, and AR 3. Recognizing the difference of these areas AR1, AR2, AR3 must be prevented in consideration of the invisibility of vision from the user.

In the present embodiment, in a state where the transparent conductive element 1 and the transparent conductive element 2 are stacked, in all the regions AR1, AR2, and AR3 viewed from the input surface direction, the difference between the sum of the coverage of the conductive material portion in the transparent conductive element 1 and the coverage of the conductive material portion in the transparent conductive element 2 is 0 or more and 60 or less.

For example, the coverage of the conductive material portions (conductive portions 13b and 23 b) in the transparent electrode pattern portions 13 and 23 is 80%. The coverage of the conductive material portions (the island portions 14a and 24 a) in the transparent insulating pattern portions 14 and 24 was set to 50%. Then, the sum of the coverage of the conductive material portion of the transparent conductive element 1 and the coverage of the conductive material portion of the transparent conductive element 2 in the regions AR1, AR2, and AR3 is as follows.

Area AR 1: 80+80=160

Area AR 2: 50+50=100

Area AR 3: 80+50= 130.

In this case, the added value is the largest in the area AR1 and the smallest in the area AR2, but the difference between the added values is 60. If the difference between the added values is 60 or less, the visibility is not good. The added value is used as an index because invisibility is considered based entirely on the user's vision. For example, when the diameter of the actual hole 13a or island 14a is, for example, 10 μm to 100 μm or 100 μm to 500 μm, the hole is extremely fine if viewed from human vision, although it varies depending on the parameter setting for generating the random pattern. Further, the user can hardly recognize the respective holes 13a or the islands 14a on the transparent electrode. In the case of macroscopic consideration by the user, when the transparent conductive elements 1 and 2 are superposed, the average coverage of the region is determined as a value obtained by adding the coverage of the conductive material portion in the transparent conductive element 1 and the coverage of the conductive material portion in the transparent conductive element 2. That is, when the difference between the added values is large, the difference between the areas AR1, AR2, and AR3 is easily recognized visually by the user. As a result of the investigation by the inventors, it was found that the invisibility can be maintained when the above-described difference in the added values is 0 to 60 inclusive in all the regions viewed from the input surface direction.

Of course, by reducing the difference in the added values, it is more advantageous to improve invisibility. For example, in the above example, if the added value in the area AR2 is increased, the difference between the added values in the areas can be further reduced. Therefore, the coverage of the conductive material portions (the island portions 14a and 24 a) in the transparent insulating pattern portions 14 and 24 is set to 65%. Then, the sum of the coverage of the conductive material portion of the transparent conductive element 1 in the regions AR1, AR2, and AR3 and the coverage of the conductive material portion in the transparent conductive element 2 is as follows.

Area AR 1: 80+80=160

Area AR 2: 65+65=130

Area AR 3: 80+65= 145.

In this case, the difference between the added values is 30, which is more preferable in terms of invisibility.

However, when the coverage of the conductive material portions (the island portions 14a and 24 a) in the transparent insulating pattern portions 14 and 24 is increased, for example, in the case of printing, which will be described later, the amount of the conductive material used increases, and the material cost increases. Therefore, in a range where the difference in the sum value between the regions does not exceed 60, the coverage of the conductive material portions (the island portions 14a and 24 a) in the transparent insulating pattern portions 14 and 24 may be set in consideration of the material cost and the resistance value of the transparent electrode pattern portion 13.

In the above embodiment, different random patterns are used for the transparent electrode pattern portions 13 (23) and the transparent insulating pattern portions 14 (24). By using different random patterns, the degree of freedom in setting the coverage of the conductive material portion can be increased in the transparent electrode pattern portions 13 (23) and the transparent insulating pattern portions 14 (24). Therefore, after the resistance value in the transparent electrode pattern portions 13 and 23 is set to an appropriate value (for example, 150 Ω or less), the coverage of the conductive material portion on the side of the transparent insulating pattern portion 14 and 24 can be set in consideration of invisibility and material cost. As a result, the resistance value of the transparent electrode pattern portion 13 (24) can be reduced, and the electrode structure can be made invisible in all regions viewed from the input surface side. In addition, this makes it possible to realize the high-performance information input device 10 that is difficult to recognize.

The coverage of the conductive material portion in the transparent electrode pattern portions 13 (23) and the transparent insulating pattern portions 14 (24) may be 65% or more and 100% or less. In addition, in order to make the transparent conductive layer pattern invisible, the difference in the sum of the coverage rates of the conductive materials is 0 to 60 inclusive in all the regions where the transparent conductive elements 1 and 2 are overlapped.

Although the description is given with reference to fig. 18A and 19C, the boundary line L between the transparent electrode pattern portions 13 and 23 and the transparent insulating pattern portions 14 and 24 is shown₁（L₂) In the above, the two random patterns are directly cut and then bonded (pattern cutting). This is preferable in forming a boundary line of a random shape which is difficult to recognize. Further, since the plurality of holes 13a (23 a) are formed in the transparent electrode pattern portion 13 (23) separately and randomly and the plurality of island portions 14a (24 a) are formed in the transparent insulating pattern portion 14 (24) separately and randomly, the occurrence of streaks can be suppressed.

In the transparent electrode pattern 13, the coverage of the holes 13a may be 0%, that is, the coverage of the conductive portions 13b may be 100%. The transparent electrode pattern 13 may be formed by mixing two or more types of regions of different coverage of the holes 13 a. In addition, as the random pattern, a random mesh pattern described later may be used in the transparent electrode pattern portion 13 or the transparent insulating pattern portion 14.

Further, the plurality of holes 13a are preferably formed entirely separately, but some of the plurality of holes 13a may be joined or overlapped with each other within a range in which visibility and conductivity are not degraded. Further, it is preferable that all of the plurality of island portions 14a are formed separately, but some of the plurality of island portions 14a may be joined or overlapped with each other within a range in which the visibility and the insulation are not degraded.

[ method for producing transparent conductive element ]

The method for manufacturing a transparent conductive element according to the third embodiment is the same as the method for manufacturing a transparent conductive element according to the first embodiment, except for the method for forming a random pattern. In the method for manufacturing a transparent conductive element according to the third embodiment, the random pattern for the transparent electrode pattern portion and the random pattern for the transparent insulating pattern portion are set and generated so that the pattern generation conditions (radius range, drawing conditions of a figure into the generated circle, weighting of random numbers described later, and the like) are different from each other.

[ method of Forming random Pattern ]

In the transparent conductive elements 1 and 2 according to the present embodiment, the conductive material portions are formed on the basis of different random patterns in the transparent electrode pattern portions 13 and 23 and the transparent insulating pattern portions 14 and 24. Here, an example of a method of forming the random pattern itself which is a base for forming such a conductive material portion is described. A method of generating a random pattern for forming the circular holes 13a and 23a and the islands 14a and 24a will be described as an example, but the shape of the random pattern is not limited thereto.

In this example, random patterns different from each other are used for the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14, and this makes the generation conditions different when generating each random pattern.

As different generation conditions, the above-described parameter setting is assumed first. For example, let R_min、R_max、R_fillThe radius ranges of the random circles generated as shown in fig. 8 are different for different settings. Further, the reduction rate of the circle (or another pattern arranged in the circle) from the state shown in fig. 8 may be changed. In addition, the patterns arranged randomly may be different. E.g. one being a circle and the other being a square, etc. In addition, it is also possible toHaving one a pattern of random dots and the other a random mesh pattern, etc. Further, as the random number Rnd, a random number obtained in a range of 0.0 to 1.0 is used, but it is also conceivable to make the weighting different from this. In addition, it is needless to say that they may be combined.

By making these generation conditions different, the random pattern used in the transparent electrode pattern portion 13 and the random pattern used in the transparent insulating pattern portion 14 are made to be different patterns, and thus, the desired coverage of the conductive material portion can be achieved.

The weighting of the random numbers will be described.

The diameters of the circles generated as shown in fig. 8 are:

diameter of circle = set minimum diameter R_min+ (setting maximum diameter R_maxSetting the minimum diameter R_min) X random number.

The random number Rnd is a random number obtained in the range of 0.0 to 1.0.

The random number is substituted into a calculation formula having a calculation result in the range of 0 to 1, thereby enabling weighting to be applied to the distribution of the generated circle diameters.

For example, by setting the (random number) 3, the distribution of small diameters can be increased. Further, by providing (random number) 1/3, the distribution of large diameters can be increased, and the dot filling rate can be increased. As y = x^1/3、y=x³Fig. 23A shows the weighted random number.

Fig. 23B shows the frequency of the diameter of the circle (dot) when the random number is weighted in this manner. This is the case: as the generated random pattern, a circular random pattern was generated under the following conditions.

･ radius range: 35 to 56 μm

･ radius reduction value: 10 μm.

In fig. 23B, the frequency distribution and the line AW in the case where the line NW is not weighted and the line AW is shown at a pitch of 1 μm in diameter are y = x^1/3Frequency distribution in case of weighting. It is found that the frequency of generating a circle having a large diameter can be increased by weighting with random numbers, and the dot filling rate can be improved. Conversely, the frequency of a small diameter can be increased, and the dot filling rate can be decreased. However, if the frequency of any diameter is excessively increased, randomness is reduced, and there is a possibility that streaks or diffracted light may be generated. Preferably, a frequency distribution of a pitch of 1 μm in diameter is used so that the frequency of any diameter is 35% or less.

However, the generation of a random pattern such as dots or polygons within a circle has been described so far, and the generation of a random mesh pattern as shown in fig. 24A is also described.

When generating the random mesh pattern, the pattern of the random circular arrangement may be first generated by the above algorithm. Fig. 24B is a diagram in which the random circular pattern is scribed at random angles to form a mesh pattern. That is, straight lines passing through the centers of the circles are drawn by directly using the center coordinates of the circles. At this time, the rotation angle of each straight line is randomly determined within the range of 0 to 180 degrees, thereby forming a line with a random inclination as shown in the drawing. In this way, a random mesh pattern can be generated.

In addition, the method of fig. 24C may also be employed.

In the case of fig. 24C, the generated pattern of random circular arrangement is also used. In this case, a line segment connecting the center coordinates of the circles close to each other from the center coordinates of the circles is drawn. That is, the centers of the nearby circles are connected to each other. This also enables the generation of random mesh patterns.

In the case of either method of fig. 24B or 24C, two different random patterns can be generated by setting parameters differently or changing the weighting of random numerical values. In addition, it is also possible to easily form random patterns having different coverage rates of the conductive material portions by changing the thickness of the straight lines formed at random.

[ modified examples ]

In the third embodiment of the present technology, the transparent conductive elements 1 and 2 may be manufactured by a printing method instead of the etching method. The configuration of the master except for the transfer surface shape of the master used in the printing method is the same as that of the second embodiment described above, and therefore, the configuration of the master will be described here.

[ Master plate ]

Fig. 25A is a perspective view showing an example of the shape of the master. Fig. 25B is a plan view showing a part of the region R1 and the region R2 shown in fig. 25A in an enlarged manner. The master 100 is, for example, a roll master having a cylindrical surface as a transfer surface, and the regions R1 and R2 are alternately laid on the cylindrical surface.

In region R1, a plurality of holes 113a having a concave shape are formed separately, and these holes 113a are separated by convex portions 113 b. The holes 113a are used to form the holes 13a of the transparent electrode pattern 13 by printing, and the protrusions 113b are used to form the conductive portions 13b of the transparent electrode pattern 13 by printing.

A plurality of convex island portions 114a are formed separately in the region R2, and the island portions 114a are separated by concave portions 114 b. The island portion 114a is used to form the island portion 14a of the transparent insulating pattern portion 14 by printing, and the recess portion 114b is used to form the gap portion 14b of the transparent insulating pattern portion 14 by printing.

The hole portions 113a of the region R1 and the island portions 114a of the region R2 have random patterns different from each other.

<4 > fourth embodiment

A case where the transparent conductive elements 1 and 2 have diamond-like pattern electrodes will be described as a fourth embodiment.

Fig. 26A and 26B show electrode patterns in the transparent conductive elements 1 and 2. As shown in fig. 26A, in this case as well, the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are formed on the transparent conductive layer 12 of the transparent conductive element 1. The transparent electrode pattern 13 has a shape in which diamond-shaped (substantially rhombus-shaped) portions are continuous in the X-axis direction. The transparent electrode pattern portions 13 and the transparent insulating pattern portions 14 are alternately laid on the surface of the base material 11 in the Y-axis direction.

As shown in fig. 23B, a transparent electrode pattern portion 23 and a transparent insulating pattern portion 24 are formed on the transparent conductive layer 22 of the transparent conductive element 2. The transparent electrode pattern portion 23 has a shape in which diamond-shaped (substantially rhombus-shaped) portions are continuous in the Y-axis direction. The transparent electrode pattern portions 23 and the transparent insulating pattern portions 24 are alternately laid on the surface of the base material 21 in the Y-axis direction.

In the second embodiment, as in the third embodiment, the transparent electrode pattern portions 13 (23) and the transparent insulating pattern portions 14 (24) may be formed with different random patterns. In this respect, specifically, the same examples as those described in the third embodiment are considered. Here, a specific example will be described in which the visibility when the X electrode and the Y electrode are overlapped and the transparent electrode pattern portions 13 and 23 are formed of a plurality of regions having different coverage of the conductive material portion.

First, fig. 27A shows a state where the transparent electrode pattern portions 13 and 14 are in a diamond shape as a state where the transparent conductive elements 1 and 2 are superimposed, similarly to fig. 22A, and fig. 27B shows an enlarged view of a part thereof. Here, the transparent conductive element 2 side is indicated by a broken line. Similarly to the case described with reference to fig. 22B, area AR1 is an area where transparent electrode pattern portions 13 and 23 overlap, and area AR2 is an area where transparent insulating pattern portions 14 and 24 overlap. The region AR3 is a region where the transparent electrode pattern portion 13 and the transparent insulating pattern portion 24 overlap each other or a region where the transparent insulating pattern portion 14 and the transparent electrode pattern portion 23 overlap each other. In this case, when viewed from the input surface side where the user performs the touch operation, all of the portions (input surface forming portions) where the transparent conductive elements 1 and 2 overlap are classified into these regions AR1, AR2, and AR 3. When the invisibility from the user is taken into consideration, it is required that the differences of the areas AR1, AR2, and AR3 cannot be recognized.

As shown in fig. 27B, if the electrode pattern shapes are different, the shapes and ranges of the regions AR1, AR2, and AR3 are also different, and in this case, for example, the coverage of the conductive material portions (conductive portions 13B, 23B) in the transparent electrode pattern portions 13, 23 is set to 80%, and the coverage of the conductive material portions (island portions 14a, 24 a) in the transparent insulating pattern portions 14, 24 is set to 50%, or the like. Further, when the difference between the sum of the coverage of the conductive material portions of the transparent conductive element 1 and the coverage of the conductive material portions of the transparent conductive element 2 in the regions AR1, AR2, and AR3 is 60 or less, the invisibility is good.

In particular, in the case of the diamond-shaped pattern, it is effective to mix two or more types of regions having different coverage of the conductive material portion in the transparent electrode pattern portion 13. As shown in fig. 28, the transparent electrode pattern portion 13 of the diamond-shaped pattern is divided into a region a and a region B. The region corresponding to the transparent insulating pattern 14 is referred to as a region C. The width of the region A is W_ATo a length of L_A. Width WB of region B is W_B= (area of region B)/L_B。L_BIs the length of region B.

In the case where the shape of the transparent electrode pattern 13 can be differentiated into 2 or more regions as in the case of the diamond shape, it is preferable to set the coverage of the hole 13a to be smaller (= to set the coverage of the conductive portion 13b to be larger) in a region where the value of l (x)/w (x) is larger. This is because, in a region having a larger value of l (x)/w (x), the resistance value of the region itself is large, and the influence of the increase in resistance caused by the increase in coverage of the hole portion 13a is large. In the case of fig. 28, the area a has a larger value of l (x)/w (x) than the area B, and its own resistance value is larger. Therefore, as shown in the figure, it is considered that the coverage of the conductive portion 13B is 79% (the coverage of the hole portion 13a is 21%) in the region B, the coverage of the conductive portion 13B is 100% (the coverage of the hole portion 13a is 0%) in the region a, and the like. Note that this coverage is merely an example.

In the region C, that is, the transparent insulating pattern portion 14, the coverage of the conductive material portion (island portion 14 a) may be set so as to match the condition of the difference in the sum of the coverage when the X, Y electrodes overlap. In addition, as shown in the figure, a pattern of a random mesh may be used instead of a random dot pattern.

As in this example, by locally controlling the coverage of the conductive material portion, the amount of the conductive material used (= suppressing the material cost) can be suppressed when the electrode is formed by printing. In addition, in order to make the pattern invisible, the coverage difference of the conductive material in the areas A-C is preferably 0% or more and 30% or less.

<5 > fifth embodiment

In the fifth embodiment, transparent conductive elements 1 and 2 using metal nanowires will be described. In the case where the transparent conductive layer 12 is formed of a metal nanowire, when the transparent electrode pattern section 13 is subjected to random patterning, the value of the reflection L value of the conductive section is reduced by reducing the metal nanowire coverage area. As a result, the conductive material portion has a darker black display on the screen, and the display characteristics (contrast) of the display are improved as compared with the case where a linear pattern, a diamond pattern, or the like is used. In addition, by combining predetermined surface treatments, the reflection L value can be suppressed to be lower in both the conductive material portion and the non-conductive portion, and the contrast is further improved.

The transparent conductive layer using metal nanowires as a conductive material can be formed by a coating process without using a sputtering method such as a transparent conductive layer using ITO. Unlike sputtering, the coating process does not require a vacuum environment, and therefore, reduction in manufacturing cost can be expected. In addition, a transparent conductive layer using the metal nanowire is also attracting attention as a next-generation transparent conductive layer not using indium which is a rare metal.

Fig. 29A shows an example of the structure of a transparent conductive element using metal nanowires. A transparent conductive layer 81 using metal nanowires is formed on the substrate 80. In the transparent conductive layer 81, a surface treatment dye, a dispersant, a binder, or the like is used in addition to the metal nanowires.

The substrate 80 is, for example, an inorganic substrate or a plastic substrate having transparency. As the shape of the base material, for example, a film, a sheet, a substrate, or the like having transparency can be used. Examples of the material of the inorganic substrate include quartz, sapphire, and glass. As the material of the plastic substrate, for example, a known polymer material can be used. Specific examples of the known polymer material include Triacetylcellulose (TAC), polyester (TPEE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyimide (PI), Polyamide (PA), aramid, Polyethylene (PE), polyacrylate, polyethersulfone, polysulfone, polypropylene (PP), diacetylcellulose, polyvinyl chloride, acrylic resin (PMMA), Polycarbonate (PC), epoxy resin, urea resin, polyurethane resin, melamine resin, and cycloolefin polymer (COP). From the viewpoint of productivity, the thickness of the plastic substrate is preferably 38 to 500 μm, but is not particularly limited to this range.

The metal nanowire is composed of at least one element selected from Ag, Au, Ni, Cu, Pd, Pt, Rh, Ir, Ru, Os, Fe, Co and Sn. The nanowires preferably have an average minor axis diameter of more than 1nm and not more than 500nm, and an average major axis length of more than 1 μm and not more than 1000 μm. When the average minor axis diameter is less than 1nm, the conductivity of the wire is deteriorated, and it is difficult to function as a conductive layer after coating. In addition, when the average minor axis diameter is larger than 500nm, the total light transmittance is deteriorated. When the average major axis length is shorter than 1 μm, the wires are difficult to connect to each other, and it is difficult to function as a conductive layer after coating. In addition, when the average major axis length is longer than 1000 μm, the total light transmittance deteriorates. Alternatively, the dispersibility of the nanowires in the case of forming the coating material may be deteriorated.

In order to improve the dispersibility of the metal nanowires in the coating material, the metal nanowires may be surface-treated with an amino group-containing compound such as PVP, polyethyleneimine, or the like. The amount of the additive is preferably such that the conductivity is not deteriorated when the coating is formed. Further, a compound having a functional group such as a sulfonic acid group (sulfonate-containing group), a sulfonyl group, a sulfonamide group, a carboxylic acid group (including carboxylate), an amide group, a phosphoric acid group (phosphoric acid-containing group, phosphate group), a phosphine group, a silanol group, an epoxy group, an isocyanate group, a cyano group, a vinyl group, a mercapto group, or a carbinol group, and capable of adsorbing to a metal may be used as the dispersant.

As the dispersant, a dispersant in which metal nanowires are dispersed is used. For example, at least one selected from water, alcohols (methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, tert-butanol, etc.), ketones (cyclohexanone, cyclopentanone), amides (DMF), thioether sulfone (DMSO), and the like is used. In order to suppress drying unevenness, cracks, and the like on the coated surface, a high boiling point solvent can be added to control the evaporation rate of the solvent. Examples thereof include ethylene glycol monobutyl ether, diacetone alcohol, butyl triethylene glycol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol diethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, propylene glycol monoisopropyl ether, dipropylene glycol isopropyl ether, tripropylene glycol isopropyl ether, and methyl glycol. These solvents may be used alone, or a plurality of them may be used in combination.

As the applicable binder material, a wide range of transparent natural polymer resins or synthetic polymer resins can be selected and used. For example, a transparent thermoplastic resin (for example, polyvinyl chloride, a vinyl chloride-vinyl acetate copolymer, polymethyl methacrylate, nitrocellulose, chlorinated polyethylene, chlorinated polypropylene, vinylidene fluoride, ethyl cellulose, and hydroxypropyl methyl cellulose) or a transparent curable resin (for example, a silicone resin such as melamine acrylate, urethane acrylate, isocyanate, epoxy resin, polyimide resin, or acrylic-modified silicate) that is cured by heat, light, electron beam, or radiation can be used. Further, examples of the additive include a surfactant, a viscosity modifier, a dispersant, a hardening acceleration catalyst, a plasticizer, an antioxidant, a stabilizer such as a vulcanization inhibitor, and the like.

In addition, in order to improve durability, an overcoat layer 82 may be separately provided after the metal nanowire is coated as shown in fig. 29B. As the overcoat layer 82, a hydrolyzed and dehydrated condensate of polypropylene, polyamide, polyester, cellulose, metal alkoxide, or the like can be used. The thickness of the overcoat layer 82 is preferably a thickness that does not significantly reduce the optical characteristics.

In addition, in order to improve the adhesion, an anchor layer 83 may be separately provided on the base material 80 before the metal nanowire is coated as shown in fig. 29C. As the anchor layer, a hydrolyzed and dehydrated condensate of polypropylene, polyamide, polyester, cellulose, metal alkoxide, or the like can be used. The thickness of the anchor layer is preferably a thickness that does not significantly reduce the optical characteristics. Both the overcoat layer and the anchor layer may also be used.

The transparent conductive layer 81 using the metal nanowire is manufactured by the following steps.

(step 1) the metal nanowires are dispersed in a solvent. As the dispersion method, stirring, ultrasonic dispersion, glass bead dispersion, kneading, homogenization treatment, and the like can be preferably employed. The amount of the wire is 0.01 to 10 parts by weight when the weight of the coating is 100 parts by weight. In the case of less than 0.01 part by weight, a sufficient weight per unit area cannot be obtained when a film is formed by coating. On the other hand, if the amount is more than 10 parts by weight, the dispersibility of the nanowires may be deteriorated. In order to improve the dispersibility of the metal nanowires, an amino group-containing compound such as PVP or polyethyleneimine may be added as a dispersant to the metal nanowire coating dispersion. When a dispersant is added, the dispersant is preferably added in such an amount that the conductivity is not deteriorated when the coating is formed. In addition, a compound having a functional group such as a sulfonic acid group (sulfonate-containing group), a sulfonyl group, a sulfonamide group, a carboxylic acid group (including carboxylate), an amide group, a phosphoric acid group (phosphoric acid-containing group, phosphate group), a phosphine group, a silanol group, an epoxy group, an isocyanate group, a cyano group, a vinyl group, a mercapto group, or a carbinol group, and capable of adsorbing to a metal may be used as the dispersant. In order to improve the coating property, the adhesion property and the durability to the substrate 80, a binder, an additive and the like may be mixed.

(step 2) A transparent conductive layer is formed on the substrate by using the metal nanowires. The method is not particularly limited, but a wet film-forming method is preferable in consideration of physical properties, convenience, manufacturing cost, and the like, and known methods include, for example, coating, spraying, printing, and the like. The coating method is not particularly limited, and a known coating method can be used. Examples of the known coating method include a micro gravure coating method, a wire bar coating method, a direct gravure coating method, a dispensing coating method, a dipping method, a spray coating method, a reverse roll coating method, a curtain coating method, a dispensing method, a doctor blade coating method, and a spin coating method. Examples of the printing method include relief printing, offset printing, gravure printing, flexographic printing, screen printing, and inkjet printing.

(step 3) drying the solvent after coating. The drying may be either natural drying or heat drying. When the adhesive is cured, the adhesive is cured by UV, heat, or the like. In addition, in order to reduce the sheet resistance value, a press treatment may be performed by a calender.

The weight per unit area (g/m) of the metal nanowires in the metal nanowire layer in fig. 29A is expected²) Is 0.001g to 1 g. In the case of less than 0.001g, the metal nanowires are not sufficiently present in the coating film, deteriorating the performance of the transparent conductive layer. The larger the weight per unit area, the lower the sheet resistance value, but if it exceeds 1g, the excessive presence of the metal nanowire coating film deteriorates the total light transmittance.

< 6> sixth embodiment

Fig. 30 is a plan view illustrating the structure of the transparent conductive element according to the sixth embodiment. Fig. 31A is an enlarged plan view of the enlarged portion a in fig. 30. Fig. 31B is a sectional view of a-a' portion in the enlarged top view of fig. 31A. The transparent conductive element 1 shown in these figures is a transparent conductive element suitably arranged on the display surface side of, for example, a display panel, and is configured as follows.

That is, the transparent conductive element 1 includes a substrate 11 and a transparent conductive layer 12 provided on the substrate 11. The transparent conductive element 1 is further characterized by having a plurality of transparent electrode pattern portions (electrode regions) 13 formed using the transparent conductive layer 12 and a transparent insulating pattern portion (insulating region) 14 disposed adjacent to the transparent electrode pattern portions 13, and the transparent conductive layer 12 is also disposed in the transparent insulating pattern portion 14. The respective members and regions will be described in detail below.

(substrate)

The substrate 11 is made of, for example, a transparent material, and for example, a known glass or a known plastic can be used. Examples of the known glass include soda lime glass, lead glass, hard glass, quartz glass, and liquid crystal glass. Examples of the known plastic include Triacetylcellulose (TAC), polyester (TPEE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyimide (PI), Polyamide (PA), aramid, polyethylene (P), polyacrylate, polyethersulfone, polysulfone, polypropylene (PP), diacetylcellulose, polyvinyl chloride, acrylic resin (PMMA), Polycarbonate (PC), epoxy resin, urea resin, polyurethane resin, melamine resin, cycloolefin polymer (COP), norbornene thermoplastic resin, and the like.

The thickness of the substrate 11 using glass is preferably 20 μm to 10mm, but is not particularly limited to this range. The thickness of the substrate 11 made of plastic is preferably 20 μm to 500 μm, but is not particularly limited to this range.

(transparent conductive layer)

As a material of the transparent conductive layer 12, for example, metal oxides such as Indium Tin Oxide (ITO), zinc oxide, indium oxide, antimony-doped tin oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, silicon-doped zinc oxide, zinc oxide-tin oxides, indium oxide-tin oxides, and zinc oxide-indium oxide-magnesium oxide can be used. In addition, metals such as copper, silver, gold, platinum, palladium, nickel, tin, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, and lead, and alloys thereof can be mentioned.

As the material of the transparent conductive layer 12, in addition to the above, a composite material in which carbon nanotubes are dispersed in a binder material, a metal nanowire, or a material in which a colored compound is adsorbed to prevent light from being diffusely reflected on the surface may be used. Further, a conductive polymer which is a (co) polymer composed of one or two selected from substituted or unsubstituted polyaniline, polypyrrole, and polythiophene, may be used. Two or more of them may be used in combination.

As a method for forming the transparent conductive layer 12, for example, a PVD method such as a sputtering method, a vacuum deposition method, or an ion plating method, a CVD method, a coating method, a printing method, or the like can be used. Preferably, the thickness of the transparent conductive layer 12 is appropriately selected in the following manner: in a state before patterning (a state in which a transparent conductive layer is formed on the entire surface of the substrate 11), the surface resistance is 1000 Ω/□ or less.

(transparent electrode pattern part)

The transparent electrode pattern portion 13 is configured as a region where a plurality of holes 13a are randomly provided in the transparent conductive layer 12. That is, the transparent electrode pattern portion 13 is formed using the transparent conductive layer 12, and holes 13a having random sizes are randomly arranged as a random pattern. Here, for example, circular holes 13a having various diameters are independently arranged in the transparent conductive layer 12, whereby the transparent electrode pattern portions 13 as a whole are ensured to be conductive.

In the transparent electrode pattern portion 13, the coverage of the transparent conductive layer 12 is adjusted by the range of the diameter set for each hole portion 13 a. The coverage is set to a level that can obtain the conductivity required for the transparent electrode pattern 13, depending on the material and film thickness of the transparent conductive layer 12. The following description will discuss a method for generating a random pattern by adjusting the coverage rate using the range of the diameter of the hole 13 a.

The shape of the hole 13a disposed in the transparent electrode pattern 13 is not limited to a circular shape. The shape of the hole 13a may not be visually recognized and may not have periodicity, and for example, 1 or 2 or more selected from the group consisting of a circular shape, an elliptical shape, a shape obtained by cutting a part of a circular shape, a shape obtained by cutting a part of an elliptical shape, a polygon with corners cut, and an irregular shape may be used in combination.

The transparent electrode pattern 13 may be configured such that the transparent insulating pattern 14 described below is provided with the groove portions 14c reversed, the transparent conductive layer 12 is provided as a stripe pattern, and the holes 13a separated by the stripe pattern are arranged. In this case, the following states are achieved: in the transparent electrode pattern portion 13, a stripe pattern formed of the transparent conductive layer 12 is extended in random directions. Further, such a stripe pattern having a random extending direction is also a random pattern.

However, if the size of each hole 13a is too large, the shape of the hole 13a can be visually recognized. Therefore, it is preferable to avoid a state where a plurality of shaped portions, which are continuous from any point to any direction by 100 μm or more and partially continue the hole portion 13a and the transparent conductive layer 12, exist in the transparent electrode pattern portion 13. For example, when the hole 13a has a circular shape, the diameter is preferably smaller than 100 μm.

(transparent insulating Pattern part)

The transparent insulating pattern 14 is a region disposed adjacent to the transparent electrode patterns 13, and is provided to fill the space between the transparent electrode patterns 13 and insulate the space between the transparent electrode patterns 13. The transparent conductive layer 12 disposed in the transparent insulating pattern portion 14 is divided into independent island-like shapes by groove portions 14c extending in random directions. That is, the transparent insulating pattern portion 14 is formed using the transparent conductive layer 12, and island-like patterns obtained by dividing the transparent conductive layer 12 by groove portions 14c extending in random directions are arranged as random patterns. These island-like patterns (i.e., random patterns) are divided into random polygons by groove portions 14c extending in random directions. The grooves 14c themselves extending in random directions are also in a random pattern.

Here, the grooves 14c provided in the transparent insulating pattern 14 extend in random directions in the transparent insulating pattern 14, and the width perpendicular to the extending direction (referred to as a line width) is the same line width. In the transparent insulating pattern portion 14, the coverage of the transparent conductive layer 12 is adjusted by the line width of each groove portion 14 c. The coverage is set as follows: the coverage is substantially the same as that of the transparent conductive layer 12 in the transparent electrode pattern 13. Here, the same degree means a degree that the pattern portions 13 and 14 cannot be recognized as a pattern according to the pitches of the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14. The line width adjustment coverage of the groove portion 14c will be described in the following items of a method for generating a random pattern.

However, if the respective sizes of the island-shaped transparent conductive layers 12 separated by the groove portions 14c are too large, the shapes can be visually recognized. Therefore, it is preferable to avoid a state where the transparent electrode pattern 13 has a plurality of shape portions which are continuous from any point to any direction by 100 μm or more and partially continue the transparent conductive layer 12.

The transparent conductive layer 12 disposed between the pattern portions 13 and 14 is randomly disposed on the boundary between the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 as described above.

[ method for producing transparent conductive element ]

The method for manufacturing a transparent conductive element according to the sixth embodiment is the same as the method for manufacturing a transparent conductive element according to the first embodiment, except for a method for forming a random pattern of the transparent insulating pattern portion 14 which is an insulating region.

[ Pattern formation of transparent insulating Pattern part ]

As shown in fig. 32A, in the generated random pattern, a straight line connecting the centers of circles whose peripheries are tangent to each other is generated. Thereby, as shown in fig. 32B, a random pattern of polygons formed of line segments extending in random directions is generated. Next, as shown in fig. 32C, the line segments constituting the polygonal random pattern are thickened to a predetermined line width, and the thickened line segments are made into the groove portions 14C in the transparent insulating pattern portion 14 shown in fig. 31A, whereby the random pattern of the transparent insulating pattern portion 14 can be obtained.

As shown in fig. 33, the groove portion 14c can be changed to various line widths W. By changing the line width W of the groove portion 14c, the coverage of the transparent insulating pattern portion 14 of the transparent conductive layer 12 divided by the groove portion 14c can be adjusted in a wide range. The following results are shown in table 1 below: range of radius R (R) according to a circle generated as a random pattern_min~R_max) And the line width W of the groove portion 14c, the coverage of the transparent insulating pattern portion 14 of the transparent conductive layer 12 [% ]]。

As shown in table 1, it is understood that the coverage of the transparent conductive layer 12 can be adjusted in a wide range of 28.5% to 74.9% in the transparent insulating pattern portions 14 obtained by dividing the transparent conductive layer 12 by the groove portions 14 c.

In contrast, for example, when the reverse pattern of the transparent electrode pattern section 13 shown in fig. 31A is used as the insulating region, the coverage of the transparent conductive layer 12 in the insulating region is derived as a limit value to about 65% of the upper limit by the following calculation.

That is, in the case where circles are arranged in a certain region, the maximum value of the fill factor of the circles is 90.7% in theory in the state where the circles are arranged in a staggered manner. Here, when the radius of the circle is 50 μm, if an interval of 8 μm is provided between the circles in order to independently arrange the circles, the radius of each circle is reduced to (50-8/2) =46 μm. The area ratio of the circle in this state is (46 × 46)/(50 × 50) =0.846, and the filling ratio of the circle is (90.7%) × (0.846) = 76.7%.

Here, when the radii of the circles are made random, the gaps between the circles are further expanded, and the actual filling ratio is a value between the filling ratio in the staggered arrangement (90.7%) and the filling ratio in the grid arrangement (78.5%). This value varies depending on the ratio (distribution) of the maximum radius and the minimum radius of the randomly generated circle, and is about 80% at the maximum.

Therefore, the range of the radius R of the circle generated as the random pattern is initially set to R_min=35μm~R_max=50 μm, with an 8 μm spacing between circles. The filling ratio of the circle in this case is 80% × (31 × 31)/(35 × 35) =62.76% to 80% × (46 × 46)/(50 × 50) = 67.71%. Even if the distribution of the randomly generated circles is slightly shifted to a large circle, the filling rate is derived as a limit value of about 65%. The limit value of the filling rate calculated in this way, which is about 65%, is lower than the coverage rate of 74.9% calculated in the transparent insulating pattern portion 14 obtained by dividing the transparent conductive layer 12 by the groove portion 14 c.

[ Effect ]

In the transparent conductive element 1 having the above-described configuration, the plurality of holes 13a are randomly provided in the transparent conductive layer 12 constituting the transparent electrode pattern 13, whereby the coverage of the transparent conductive layer 12 in the transparent electrode pattern 13 can be suppressed. On the other hand, the transparent conductive layer 12 divided into island shapes is disposed in the transparent insulating pattern portion 14 adjacent to the transparent electrode pattern portion 13. This suppresses the difference in coverage of the transparent conductive layer 12 between the transparent electrode pattern 13 and the transparent insulating pattern 14 to be small, thereby lowering the contrast between these patterns 13 and 14 and reducing the visibility of the pattern of the transparent electrode pattern 13.

In particular, holes 13a are randomly provided in the transparent conductive layer 12 of the transparent electrode pattern portion 13, and the transparent conductive layer 12 of the transparent insulating pattern portion 14 is divided by grooves 14c extending in random directions. Therefore, the occurrence of stripes is suppressed, and the groove pattern continuous along the transparent electrode pattern portion 13 is not arranged at the boundary between the transparent insulating pattern portion 14 and the transparent electrode pattern portion 13, so that the outline of the electrode region is not noticeable.

The coverage of the transparent conductive layer 12 in the transparent insulating pattern portion 14 can be adjusted in a wide range by the width of the groove portion 14 c. Therefore, even when the thickness of the transparent conductive layer 12 is set to be thick in order to reduce the sheet voltage in the transparent electrode pattern 13, the transparent insulating pattern 14 having a high coverage of the transparent conductive layer 12 can be formed, and thus the contrast of the transparent electrode pattern 13 can be effectively reduced.

[ modified examples ]

In the second embodiment of the present technology, the transparent conductive elements 1 and 2 may be manufactured by using a printing method instead of an etching method. The configuration of the master is only explained here, since the configuration can be the same as that of the second embodiment except for the shape of the transfer surface of the master used in the printing method.

[ Master plate ]

Fig. 34A is a perspective view showing an example of the shape of the master used in the first manufacturing method. FIG. 34B is an enlarged view of the electrode region forming part R shown in FIG. 34A₁And an insulating region forming part R₂A top view of a part (enlarged portion B) of (a). The master 100 shown in these figures is, for example, a roll master having a cylindrical surface as a transfer surface on which electrode region forming portions R are alternately laid₁And an insulating region forming part R₂。

At the electrodeRegion forming part R₁A plurality of hole portions 113a having a concave shape are separately formed. These hole portions 113a are portions for forming a hole pattern in the electrode region of the transparent conductive element by printing. In addition, an electrode region forming part R₁The convex portions between the holes 113a are portions for forming transparent conductive layers arranged in the electrode region by printing.

Forming a portion R in the insulating region₂The groove portions 114c are provided to extend in random directions. These groove portions 114c are portions for forming groove patterns in the insulating region of the transparent conductive element 1 by printing. In addition, an insulating region forming part R₂The island-shaped convex portions separated by the grooves 114c are portions for forming transparent conductive layers arranged in an independent island-shape in the insulating region by printing, and have portions R forming the electrode region₁The convex portion of (a) is at the same height.

<7 > seventh embodiment

Fig. 35A and 35B are enlarged views for explaining the structure of the transparent conductive element according to the seventh embodiment. Fig. 35A is an enlarged plan view corresponding to enlarged portion a in fig. 30, and fig. 35B is a sectional view of portion a-a' in the enlarged plan view of fig. 35A. The transparent conductive element 1 shown in these figures is different from the transparent conductive element 1 according to the sixth embodiment described with reference to fig. 31 in that the transparent electrode pattern portion 13 is formed of the transparent conductive layer 12 in the form of a solid film, and the other configurations are the same.

That is, the transparent conductive layer 12 is disposed in a solid film shape in the region of the transparent electrode pattern portion 13, and the coverage of the transparent conductive layer 12 is 100%. The transparent conductive layer 12 disposed between the pattern portions 13 and 14 is also randomly disposed at the boundary between the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14.

In this case, the configuration of the transparent insulating pattern part 14 is the same as that of the first embodiment, but the set range of the coverage of the transparent conductive layer 12 of the transparent insulating pattern part 14 is higher than that of the sixth embodiment. Therefore, the adjustment range of the line width of the groove portion 14c for adjusting the coverage is smaller than that of the first embodiment.

[ Effect ]

In the transparent conductive element 2 having such a configuration, the transparent conductive layer 12 divided into island-like shapes by the groove portions 14c extending in random directions is arranged in the transparent insulating pattern portion 14 adjacent to the transparent electrode pattern portion 13. Therefore, as in the sixth embodiment, the occurrence of stripes is suppressed, the outline of the transparent electrode pattern 13 is not conspicuous, and the transparent insulating pattern 14 having a high coverage of the transparent conductive layer 12 can be formed even when the film thickness of the transparent conductive layer 12 is set to be thick in order to suppress the thin layer in the transparent electrode pattern 13 to be low. Therefore, the contrast of the transparent electrode pattern portion 13 can be effectively reduced.

<8 > eighth embodiment

Fig. 36A is a plan view for explaining a configuration example of the transparent conductive element according to the eighth embodiment of the present technology. The eighth embodiment of the present technology differs from the first embodiment in that: the numerical range of the average boundary line length ratio (La/Lb) of the average boundary line length La of the transparent electrode pattern portion 13 and the average boundary line length Lb of the transparent insulating pattern portion 14 is defined. Specifically, it is preferable that the first region (electrode region) R is formed in the first region₁The average boundary line length La of the transparent electrode pattern 13 and the average boundary line length La in the second region (insulating region) R₂The average boundary line length ratio (La/Lb) of the average boundary line length Lb of the transparent insulating pattern portion 14 is set in the range of 0.75 to 1.25. Here, the average boundary line length La is the length of the average boundary line between the hole 13a and the conductive portion 13b provided in the transparent electrode pattern portion 13, and the length Lb of the average boundary line is the length of the average boundary line between the island portion 14a and the gap portion 14b provided in the transparent insulating pattern portion 14.

When the average boundary line length ratio (La/Lb) is outside the above range, the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 are recognized even if the coverage difference between the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 is the same. The reason for this is that, for example, the refractive index is different between a portion having the transparent conductive material and a portion having no transparent conductive material. When the difference in refractive index between the portion having the transparent conductive material and the portion not having the transparent conductive material is large, light scattering occurs at the boundary between the portion having the transparent conductive material and the portion not having the transparent conductive material. Accordingly, the region having a longer boundary line length is whiter, and the absolute value of the difference between the reflection L values of the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 evaluated according to JIS Z8722 is 0.3 or more, and the pattern is recognized regardless of the coverage difference.

Here, the average boundary line length La of the transparent electrode pattern portion 13 is obtained as follows. First, the transparent electrode pattern 13 was observed with a digital microscope (product name: VHX-900, manufactured by Kiyoji corporation) at an observation magnification of 100 to 500 times, and an observation image was stored. Next, the boundary line (∑ C) is measured by image analysis based on the stored observation image_i=C₁+･･･+C_n) Thereby obtaining the boundary line length L₁[mm/mm²]. The measurement was performed for 10 fields of view randomly selected from the transparent electrode pattern section 13 to obtain the boundary line length L₁、････、L₁₀. Then, the obtained boundary line length L is compared₁、････、L₁₀The average boundary line length La of the transparent electrode pattern portion 13 is obtained by simply averaging (arithmetic mean).

The average boundary line length Lb of the transparent insulating pattern portion 14 is determined as follows. First, the transparent insulating pattern 14 was observed with a digital microscope (product name: VHX-900, manufactured by Kiyoji corporation) at an observation magnification of 100 to 500 times, and an observation image was stored. Then, boundary lines (Σ C) are analyzed by an image based on the stored observation image_i=C₁+･･･+C_n) The length of the boundary line L is obtained by measurement₁[mm/mm²]. The measurement is performed for 10 fields of view randomly selected from the transparent insulating pattern part 14, thereby obtaining the edgesLength of boundary line L₁、････、L₁₀. Then, the obtained boundary line length L is compared₁、････、L₁₀The average boundary line length Lb of the transparent insulating pattern portion 14 is obtained by simply averaging (arithmetic mean).

[ modified examples ]

Fig. 36B is a plan view for explaining a modification of the transparent conductive element according to the eighth embodiment of the present technology. As shown in fig. 36B, in the case of employing a structure in which the mesh-like groove portions 14c are provided in the transparent insulating pattern portion 14, the average boundary line length ratio (La/Lb) is preferably in the range of 0.75 to 1.25. Here, the length Lb of the average boundary line is the length of the average boundary line of the groove portion 14c, which is an example of the island portion 14a and the gap portion provided in the transparent insulating pattern portion 14. The average boundary line length Lb of the transparent insulating pattern portion 14 is measured by image analysis except for the boundary line (Σ l)_i=l₁+･･･+l_n) To obtain the boundary line length L₁、････、L₁₀[mm/mm²]Except for this, the measurement was performed in the same manner as in the above method. Wherein the boundary line l_i（l₁、･･･、l_n) Is the boundary between each island 14a and groove 14 c.

< 9> ninth embodiment >

Fig. 37 is a cross-sectional view showing an example of the configuration of an information input device according to a ninth embodiment of the present technology. The information input device of the ninth embodiment differs from the information input device of the first embodiment in that the substrate 21 has the transparent conductive layer 12 on one main surface and the transparent conductive layer 22 on the other main surface. The transparent conductive layer 12 has a transparent electrode pattern portion and a transparent insulating pattern portion. The transparent conductive layer 22 has a transparent electrode pattern portion and a transparent insulating pattern portion. The transparent electrode pattern portion of the transparent conductive layer 12 is an X electrode pattern portion extending in the X-axis direction, and the transparent electrode pattern portion of the transparent conductive layer 22 is a Y electrode pattern portion extending in the Y-axis direction. Therefore, the transparent electrode patterns of the transparent conductive layer 12 and the transparent conductive layer 22 are orthogonal to each other.

<10 > tenth embodiment

Fig. 38 is a cross-sectional view showing an example of the structure of a transparent conductive element according to a tenth embodiment of the present technology. As shown in fig. 38, the information input device 10 includes a base material 11, a plurality of transparent electrode pattern portions 13, a plurality of transparent electrode pattern portions 23, an insulating pattern portion 14, and a transparent insulating layer 51. The plurality of transparent electrode pattern portions 13 and the transparent electrode pattern portion 24 are provided on the same surface of the substrate 11. The insulating pattern portion 14 is provided between the transparent electrode pattern portion 13 and the transparent electrode pattern portion 23 in the in-plane direction of the substrate 11. The transparent insulating layer 51 is interposed between the intersections of the transparent electrode pattern portions 13 and 23.

Further, the optical layer 52 may be provided on the surface of the substrate 11 on which the transparent electrode pattern 13 and the transparent electrode pattern 23 are formed, as necessary. The optical layer 52 has a bonding layer 53 and a base 54, and the base 54 is bonded to the surface of the substrate 11 with the bonding layer 53 interposed therebetween. The information input device 10 is applied to a display surface of a display device. The substrate 11 and the optical layer 52 preferably have transparency to visible light, and the refractive index n thereof is in the range of 1.2 to 1.7, for example. Hereinafter, 2 directions orthogonal to each other in the plane of the surface of the information input device 10 are referred to as an X-axis direction and a Y-axis direction, respectively, and a direction perpendicular to the surface is referred to as a Z-axis direction.

The transparent electrode pattern portion 13 extends in the X-axis direction (first direction) on the surface of the substrate 11, whereas the transparent electrode pattern portion 23 extends in the Y-axis direction (second direction) on the surface of the substrate 11. Therefore, the transparent electrode pattern portion 13 and the transparent electrode pattern portion 23 intersect orthogonally. A transparent insulating layer 51 for insulating the electrodes is present at an intersection C where the transparent electrode pattern 13 and the transparent electrode pattern 23 intersect. Lead electrodes are electrically connected to one ends of the transparent electrode pattern portion 13 and the transparent electrode pattern portion 23, respectively, and the lead electrodes and the driving circuit are connected via an fpc (flexible Printed circuit).

Fig. 39A is an enlarged plan view showing the vicinity of the intersection C shown in fig. 38A. Fig. 39B is a sectional view taken along the line a-a shown in fig. 39A. The transparent electrode pattern portion 13 has a plurality of pad portions (unit electrode bodies) 13m and a plurality of connecting portions 13n that connect the plurality of pad portions 13m to each other. The connecting portions 13n extend in the X-axis direction and connect the end portions of the adjacent pad portions 13m to each other. The transparent electrode pattern portion 23 has a plurality of pad portions (unit electrode bodies) 23m and a plurality of connecting portions 23n connecting the plurality of pad portions 23m to each other. The connecting portions 23n extend in the Y-axis direction and connect the end portions of the adjacent pad portions 23m to each other.

In the intersection C, the coupling portion 23n, the transparent insulating layer 51, and the coupling portion 13n are laminated in this order on the surface of the substrate 11. The connecting portion 13n is formed so as to straddle the transparent insulating layer 51, one end of the connecting portion 13n straddling the transparent insulating layer 51 is electrically connected to one of the adjacent pad portions 13m, and the other end of the connecting portion 13n straddling the transparent insulating layer 51 is electrically connected to the other of the adjacent pad portions 13 m.

The pad portion 23m and the coupling portion 23n are integrally formed, whereas the pad portion 13m and the coupling portion 13n are separately formed. The pad portion 13m, the pad portion 23m, the connection portion 23n, and the insulating pattern portion 14 are formed of a single transparent conductive layer 12 provided on the surface of the substrate 11. The connection portion 13n is formed of, for example, a conductive layer.

(transparent insulating layer)

The transparent insulating layer 51 preferably has a larger area than the portion where the connection portion 13n and the connection portion 23n intersect, for example, a size to cover the pad portions 13m and the pad portions 23m at the intersection portion C.

The transparent insulating layer 51 contains a transparent insulating material as a main component. As the transparent insulating material, a polymer material having transparency is preferably used, and examples of such a material include: (meth) acrylic resins such as copolymers of polymethyl methacrylate and methyl methacrylate with other vinyl monomers such as alkyl (meth) acrylates and styrene; polycarbonate resins such as polycarbonate and diethylene glycol bisallyl carbonate (CR-39); thermosetting (meth) acrylic resins such as homopolymers or copolymers of (brominated) bisphenol a type di (meth) acrylate, polymers and copolymers of (brominated) bisphenol a mono (meth) acrylate urethane-modified monomers; the polyesters are, in particular, polyethylene terephthalate, polyethylene naphthalate and unsaturated polyesters, acrylonitrile-styrene copolymers, polyvinyl chloride, polyurethanes, epoxy resins, polyarylates, polyether sulfones, polyether ketones, olefin polymers (trade names: ARTON, ZEONOR), cycloolefin copolymers and the like. In addition, aramid resins in consideration of heat resistance can also be used. Herein, (meth) acrylate means acrylate or methyl methacrylate.

(conductive layer)

As the conductive layer constituting the connection portion 13n, for example, a metal layer or a transparent conductive layer can be used. The metal layer contains a metal as a main component. As the metal, a metal having high conductivity is preferably used, and examples of such a material include Ag, Al, Cu, Ti, Nb, Si with impurities added thereto, and the like. Preferably, a metal having high conductivity is used as a material of the metal layer, and the width of the connecting portion 13n is narrowed, the thickness thereof is reduced, and the length thereof is shortened. This can improve visibility.

The transparent conductive layer contains a transparent conductive material as a main component. As the transparent conductive material, the same material as the pad portion 13m, the pad portion 23m, and the connection portion 23n can be used. In the case of using a transparent conductive layer as the conductive layer, the width of the connection portion 13n may be made wider than that in the case of using a metal as the conductive layer in order to make the connection portion 13n transparent.

<11 > eleventh embodiment >

(application example to electronic device)

Fig. 40 to 44 show an example of an electronic device in which a display device having the information input device according to the first embodiment described with reference to fig. 1 is applied to a display unit. Hereinafter, an application example of the electronic device of the present technology will be described.

Fig. 40 is a perspective view showing a television to which the present technology is applied. The television 200 of the present application example includes a display unit 201 including a front panel 202, a filter glass 203, and the like, and the display device described above is applied as the display unit 201.

Fig. 41 is a diagram showing a digital camera to which the present technology is applied, fig. 41A is a perspective view seen from the front side, and fig. 41B is a perspective view seen from the rear side. The digital camera 210 according to the present application example includes a flash light emitting unit 211, a display unit 212, a menu switch 213, a shutter button 214, and the like, and the display device described above is applied as the display unit 212.

Fig. 42 is a perspective view showing a notebook personal computer to which the present technology is applied. The notebook personal computer 220 of this application example includes a keyboard 222 operated to input characters and the like to the main body 221, a display portion 223 displaying images, and the like, and the display device described above is applied as the display portion 223.

Fig. 43 is a perspective view showing a camera to which the present technology is applied. The camera 230 of the present application example includes a main body 231, a lens 232 positioned on a side surface facing forward for photographing an object, a start/stop switch 233 at the time of photographing, a display 234, and the like, and the display device described above is applied as the display 234.

Fig. 44 is a front view of a mobile terminal device, for example, a mobile phone, to which the present technology is applied. The mobile phone 240 of the present application example includes an upper casing 241, a lower casing 242, a connecting portion (hinge portion in this case) 243, and a display portion 244, and the display device described above is applied as the display portion 244.

[ Effect ]

In each of the electronic devices according to the eleventh embodiment described above, since the display device described in the first embodiment is used as the display unit, high-definition display can be performed on the display panel while including the information input device 10.

Examples

The present technology will be specifically described below with reference to examples, but the present technology is not limited to these examples.

(examples 1-1 to 1-4)

First, an ITO layer was formed on the surface of a 125 μm thick PET film by sputtering, thereby obtaining a transparent conductive film. The sheet resistance of the transparent conductive film was 254 Ω/□. Next, after a resist layer was formed on the ITO layer of the transparent conductive film, the resist layer was exposed to light using a Cr photomask in which a random pattern was formed. In this case, a random pattern having a circular shape was used as the random pattern of the Cr photomask. Next, the resist layer is developed to form a resist pattern, the ITO layer is wet-etched using the resist pattern as a mask, and then the resist layer is removed by ashing. Thus, a transparent electrode pattern portion and a transparent insulating pattern portion were obtained in which a plurality of holes and a plurality of island portions having the parameters shown in table 2 were formed at random. Photographs of these pattern portions are shown in fig. 45A and 45B. In fig. 45A and 45B, the first region R₁A conductive part functioning as an electrode, and a second region R₂Is a non-conductive part that functions as a dummy electrode.

In this way, the desired transparent conductive film is obtained.

(examples 1-5 to 1-8)

A transparent conductive film was obtained by forming a silver nanowire layer on the surface of a PET film having a thickness of 125 μm by a coating method. The sheet resistance of the transparent conductive film was 130. omega./□. Except for this, a transparent conductive film was obtained in the same manner as in examples 1-1 to 1-4.

Comparative example 1-1

A transparent conductive film was obtained in the same manner as in example 1-1, except that a Cr photomask in which a random pattern was not formed was used to form the transparent electrode pattern portion and the transparent insulating pattern portion.

Comparative examples 1 and 2

A transparent conductive film was obtained in the same manner as in examples 1 to 5, except that a Cr photomask in which a random pattern was not formed was used to form the transparent electrode pattern portion and the transparent insulating pattern portion.

(evaluation)

The transparent conductive film obtained as described above was evaluated for invisibility, glare, streaks, and interference light of the transparent electrode pattern portion as follows. First, the ITO side or silver line side surface of the transparent conductive film was bonded to a liquid crystal display having a diagonal angle of 3.5 inches so as to face the screen via an adhesive sheet. Next, an AR film was bonded to the base material (PET film) side of the transparent conductive film via an adhesive sheet. Then, the liquid crystal display was caused to perform black display or green display, and the display surface was visually observed to evaluate invisibility, glare, streaks, and interference light. The results are shown in Table 2.

Evaluation criteria for invisibility, glare, streaks, and interference light are shown below.

< invisibility >

Very good: the pattern is not recognizable from any angle

O: the pattern is very difficult to recognize, but can be recognized according to the angle

X: can be identified.

< Glare >

Very good: no glare is perceived from all angles

O: no glare when viewed from the front, but slight glare when viewed from an oblique direction

X: glare is perceived from a frontal view.

< fringe and interference light >

Very good: no fringes and interference light are perceived from all angles

O: the fringe and the interference light are not observed from the front, but the fringe and the interference light are slightly sensed from the oblique view

X: the fringes and the interference light are perceived as being observed from the front.

The following can be understood from table 2.

In examples 1-1 to 1-8 in which the hole portions and the island portions were formed at random, the invisibility of the conductive pattern portion could be improved. In addition, glare can be suppressed, and occurrence of fringes and interference light can also be suppressed. On the other hand, in comparative examples 1-1 and 1-2 in which the hole portions and the island portions were not formed, the invisibility of the conductive pattern portions could not be improved.

By using the random patterns shown in examples 1-1 to 1-8, the invisibility of the electrode pattern was improved in both the ITO film and the silver wire film. Further, when the conductive film is observed in more detail, the silver wire coverage area is reduced in the case of the silver wire film, and the value of the reflection L value of the conductive portion is reduced. As a result, the black display of the screen of the conductive portion was deeper, and the effect of improving the display characteristics of the display was observed as compared with the case of using a linear pattern, a diamond pattern, or the like.

Thus, ITO and silver lines have some difference in effect because the main reason for being able to recognize the patterns of both is different. In the case of the ITO film, the pattern can be recognized due to the difference in reflectance of the conductive portion and the non-conductive portion, whereas in the case of the silver wire film, the pattern can be recognized due to the difference in reflection L value. Therefore, by using the random patterns shown in examples 1-1 to 1-8, the invisibility can be improved similarly in all cases, but some difference occurs in the effects obtained concomitantly.

Even if the difference in coverage between the conductive pattern portion and the non-conductive pattern portion is 50%, it is sufficient that the effect of the transparent electrode pattern portion is not observed. In addition, when the coverage is substantially the same, the transparent electrode pattern portion cannot be confirmed regardless of the recognition method. This is because the transparent electrode pattern portion and the transparent insulating pattern portion are most difficult to be recognized when the coverage rates thereof are completely the same. In consideration of this, it is preferable that the coverage rates of both are close to the same or similar values.

Various conditions and evaluation results are shown in Table 3 for examples 2-1 to 2-12 described below. The evaluation criteria for invisibility, fringe, interference light and glare were the same as in examples 1-1 to 1-8 and comparative examples 1-1 and 1-2.

< examples 2-1 to 2-3>

First, an ITO layer was formed on the surface of a PET film having a thickness of 125 μm by a sputtering method, thereby obtaining a transparent conductive film. The sheet resistance of the transparent conductive film was 150. omega./□. Next, after a resist layer was formed on the ITO layer of the transparent conductive film, the resist layer was exposed to light using a Cr photomask in which a random pattern was formed. In this case, a random pattern having a circular shape was used as the random pattern of the Cr photomask. Next, the resist layer is developed to form a resist pattern, the ITO layer is wet-etched using the resist pattern as a mask, and then the resist layer is removed by ashing.

As a result, an X-electrode (transparent conductive element 1) having the parameters shown in example 2-1 of table 3 and having a transparent electrode pattern 13 and a transparent insulating pattern 14 was obtained, and as shown in fig. 46A, a plurality of holes 13a and a plurality of islands 14a were randomly formed in the transparent electrode pattern 13 and the transparent insulating pattern 14, respectively. See Table 3 for exampleAs shown in the figure, in the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14, the circle size ranges are set to different parameters, thereby creating a pattern portion based on random patterns different from each other. The numerical values in the circle size ranges in table 3 indicate the diameters of the finally randomly generated circles (circles corresponding to the hole portions 13a and the island portions 14 a), and are not the radial sizes of the circles during the pattern formation (i.e., R described above)_min、R_max). The coverage of the conductive material portion of the transparent electrode pattern portion 13 was 66.9%, and the coverage of the conductive material portion of the transparent insulating pattern portion 14 was 49.8.

As a result of evaluation of the transparent conductive element 1 of example 2-1 alone, the fringe, interference light, and glare were extremely good, and the invisibility was also almost good.

As example 2-2, a Y electrode (transparent conductive element 2) having parameters shown in table 3 and having a transparent electrode pattern portion 23 and a transparent insulating pattern portion 24 was produced in the same manner as in example 2-1, and the transparent electrode pattern portion 23 and the transparent insulating pattern portion 24 were formed with a plurality of holes 13a and a plurality of island portions 14a at random as shown in fig. 45B. In example 2-2, the coverage of the conductive material portion of the transparent electrode pattern portion 23 was also 66.9%, and the coverage of the conductive material portion of the transparent insulating pattern portion 24 was also 49.8.

As a result of evaluation of the transparent conductive element 2 of example 2-2 as a single body, the fringe, interference light and glare were extremely good, and the invisibility was also almost good.

Example 2-3 in the embodiment 2-1, 2-2 of the transparent conductive element 1, 2 were superimposed under the condition of evaluation. Specifically, evaluation was performed in the state of the information input device 10 having the configuration of fig. 1.

The difference in the sum of the coverage of the conductive material portions is 34.2 at most.

That is, in the areas AR1, AR2, and AR3 shown in fig. 22B and 27B, the sum of the coverage rates is:

area AR 1: 66.9+66.9=133.8

Area AR 2: 49.8+49.8=99.6

Area AR 3: 66.9+49.8=116.7

The maximum value of the difference between the added values is 133.8-99.6= 34.2.

As the evaluation results of examples 2 to 3, the fringes and the interference light and the glare were extremely good, and the invisibility was also almost good.

< examples 2-4 to 2-6>

A silver nanowire layer was formed on the surface of a PET film having a thickness of 125 μm by a coating method, thereby obtaining a transparent conductive film. The sheet resistance of the transparent conductive film was 100. omega./□. Except for this, evaluation was performed in the same manner as in examples 2-1 to 2-3. In this case, in examples 2 to 6, the difference in the added value of the coverage of the conductive material portion was 34.2 at the maximum. As shown in table 3, in examples 2 to 4 (the single transparent conductive member 1), examples 2 to 5 (the single transparent conductive member 2), and examples 2 to 6 (the information input device 10 having the structure of fig. 1 using examples 2 to 4 and 2 to 5), the fringes and the interference light and the glare were extremely good, and the invisibility was also almost good.

< examples 2-7 to 2-9>

The same method as in examples 2-4 to 2-6 was used to obtain the X electrode (transparent conductive element 1) of examples 2-7, the Y electrode (transparent conductive element 2) of examples 2-8, and the combination of the X electrode and the Y electrode (information input device 10) of examples 2-9, each of which had the transparent electrode pattern portion and the transparent insulating pattern portion in which the plurality of holes 13a and the plurality of island portions 14a were randomly formed, and which had the parameters shown in table 3. Wherein, the conducting part of the Y electrode is not provided with a random pattern.

In the X-electrode, pattern portions based on random patterns different from each other are formed in the transparent electrode pattern portion 13 and the transparent insulating pattern portion 14 by setting the circle size range and the nearest neighbor distance to different parameters. In the Y electrode, the conductive material portion 100% of the transparent electrode pattern portion 23, the transparent insulating pattern portion 24 depends on a random pattern based on the parameters of the illustrated circle size range and the nearest neighbor distance, so that the transparent electrode pattern portion 23 and the transparent insulating pattern portion 24 are different patterns. In examples 2 to 9, the difference in the sum of the coverage rates of the conductive material portions was 52.6 at maximum.

As shown in table 3, in examples 2 to 7 (the single transparent conductive member 1), examples 2 to 8 (the single transparent conductive member 2), and examples 2 to 9 (the information input device 10 having the structure of fig. 1 using examples 2 to 7 and 2 to 8), the fringes and the interference light and the glare were extremely good, and the invisibility was also almost good.

< examples 2-10 to 2-12>

The same method as in examples 2-4 to 2-6 was used to obtain the X electrodes (transparent conductive elements 1) of examples 2-10, the Y electrodes (transparent conductive elements 2) of examples 2-11, and the combinations of the X electrodes and the Y electrodes (information input devices 10) of examples 2-12.

In examples 2 to 10 and 2 to 11, as shown in fig. 47, the random pattern was not disposed in the transparent electrode pattern portions 13 and 23 (the region R1), and the coverage of the conductive material portion was 100%. In addition, a random mesh pattern is arranged in the transparent insulating pattern portions 14 and 24 (the region R2). Such a random mesh pattern having the island portions 14a is generated with the parameters of the circle size range and the nearest neighbor distance shown in table 3. In this case, in examples 2 to 12, the difference between the added values of the coverage of the conductive material portions was 32.2 at maximum.

As shown in table 3, in examples 2 to 10 (the single transparent conductive member 1), examples 2 to 11 (the single transparent conductive member 2), and examples 2 to 12 (the information input device 10 having the structure of fig. 1 using examples 2 to 10 and 2 to 11), the fringes and the interference light and the glare were extremely good, and the invisibility was also almost good.

In the case of the Ag nanowire film, when the transparent electrode pattern portions 13 and 23 are subjected to the random patterning, the Ag nanowire coverage area is reduced, thereby reducing the value of the reflection L value of the conductive portion. As a result, the black display of the screen of the conductive portion is deeper, and the effect of improving the display characteristics of the display can be seen as compared with the case of using a linear pattern, a diamond pattern, or the like.

The Ag nanowire film applied with the random pattern is immersed in a solution in which a colored compound is dissolved, so that the colored compound is selectively adsorbed on the surface of the Ag nanowire. By this processing, the reflection L values of both the conductive portion and the non-conductive portion become small. As a result, the display characteristics of the display are further improved.

< example 3-1>

As shown in fig. 48A, pattern exposure is performed so that a groove pattern as a random pattern is formed in the insulating region without forming a random pattern in the electrode region. The parameters used in generating the random pattern are as follows.

Electrode region … has no

Radius of insulation region …: 25-45 μm, line width of groove pattern: 8 μm.

< examples 3 and 2>

As shown in fig. 48B, pattern exposure is performed so that a hole pattern as a random pattern is formed in the electrode region and a groove pattern as a random pattern is formed in the insulating region. The parameters used in generating the random pattern are as follows.

Radius of electrode area …: 35-48 μm, radius reduction value: 18.5 μm

The insulating region … is the same as in example 3-1.

< examples 3 to 3>

As shown in fig. 48C, pattern exposure is performed so that a stripe pattern as a random pattern is formed in the electrode region and a groove pattern as a random pattern is formed in the insulating region. The parameters used in generating the random pattern are as follows.

Radius of electrode area …: 25-45 μm, line width of the stripe pattern: 30 μm

The insulating region … is the same as in example 3-1.

< comparative example 3-1>

The electrode region and the insulating region are not provided with random patterns.

After the pattern exposure as described above, the resist layer is developed to form a resist pattern, and the silver nanowire layer is wet-etched using the resist pattern as a mask. After the etching is completed, the resist layer is removed by ashing.

As described above, a transparent electrode element having each coverage parameter of the transparent conductive layer and having an electrode region and an insulating region was obtained.

< evaluation >

The transparent electrode elements produced in examples 3-1 to 3-3 and comparative example were visually evaluated for invisibility, streaks, interference light, and glare of the patterns of the electrode region and the insulating region. The results are shown in table 4 below together with the respective coverage parameters of the transparent conductive layer. The evaluation criteria for each item are as follows.

[ invisibility ]

The invisibility was evaluated in the same manner as in examples 1-1 to 1-8 and comparative examples 1-1 and 1-2.

[ fringes and interference light ]

The evaluation of the fringes and the interference light was carried out in the same manner as in examples 1-1 to 1-8 and comparative examples 1-1 and 1-2.

[ Glare ]

Glare was evaluated in the same manner as in examples 1-1 to 1-8 and comparative examples 1-1 and 1-2.

From the results shown in Table 4, it was confirmed that the pattern invisibility of the electrode region and the insulating region was improved by providing the transparent conductive layer also in the insulating region as in examples 3-1 to 3-3. In particular, it was confirmed that, as in examples 3-2 to 3-3, the random pattern was provided also in the transparent conductive layer in the electrode region, and the coverage difference between the transparent conductive layer in the electrode region and the insulating region was suppressed, whereby the invisibility of the pattern was improved as compared with example 3-1.

In addition, in the electrode regions of examples 3-2 and 3-3, since the coverage of the transparent conductive layer composed of the silver nanowire layer was controlled, the value of the reflection L value by the diffuse reflection of the external light on the surface of the silver nanowire was reduced. As a result, in the configuration in which the transparent electrode elements were disposed on the display surface of the display panel, the effect of dark display on the display screen was confirmed in the case of using the transparent electrode elements of examples 3-2 and 3-3, as compared with the case of using the linear pattern, the diamond pattern, or the like in the electrode region. Thus, in a display device in which a touch panel using a transparent electrode element is provided on a display surface, an effect of improving display characteristics is also seen.

Further, as an additional example, the following processing is performed: the silver nanowire layer (transparent conductive layer) having the random pattern obtained in examples 3-1 to 3-3 was immersed in a solution in which a colored compound was dissolved, so that the colored compound was adsorbed on the surface of the silver nanowire. This treatment confirmed that the reflection L values of the electrode region and the insulating region, both of which were formed of the silver nanowire layers (transparent conductive layers) of examples 3-1 to 3-3, were smaller. As a result, it was confirmed that the display characteristics of the display panel can be maintained while the touch panel is provided on the display surface by using the transparent conductive layer in which the colored compound is adsorbed on the metal nanowires and using the transparent electrode element in which the random pattern is formed on the transparent conductive layer as the touch panel.

(method of evaluating average boundary line length)

In the present example and the comparative example, the average boundary line length La of the transparent electrode pattern portion was obtained as follows. First, the transparent electrode pattern portion was observed with a digital microscope (product name: VHX-900, manufactured by Kiyoji corporation) at an observation magnification of 100 to 500 times, and an observation image was stored. Then, the boundary line is measured by image analysis based on the stored observation image, and the boundary line length L is obtained₁[mm/mm²]. The measurement was performed for 10 fields of view randomly selected from the transparent electrode pattern part to obtain the boundary line length L₁、････、L₁₀. Then, the obtained boundary line length L is compared₁、････、L₁₀The average boundary line length La of the transparent electrode pattern portion is obtained by simple averaging (arithmetic average).

The average boundary line length Lb of the transparent insulating pattern portion is determined as follows. First, the transparent insulating pattern portion was observed with a digital microscope (product name: VHX-900, manufactured by Kiyoji corporation) at an observation magnification ranging from 100 to 500 times, and an observation image was stored. Then, the boundary line is measured by image analysis based on the stored observation image, and the boundary line length L is obtained₁[mm/mm²]. The measurement is performed for 10 views randomly selected from the transparent insulating pattern part to obtain the length L of the boundary line₁、････、L₁₀. Then, the obtained boundary line length L is compared₁、････、L₁₀The average boundary line length Lb of the transparent insulating pattern portion is obtained by simply performing an average (arithmetic mean).

(average boundary line length ratio)

In the present embodiment and the comparative example, the average boundary line length ratio is obtained by substituting the average boundary line lengths La and Lb obtained in the above-described "method for evaluating average boundary line length" into the following equation.

The ratio of the average boundary line length = (average boundary line length La)/(average boundary line length Lb).

(examples 4-1 to 4-5)

Transparent conductive films were obtained in the same manner as in examples 1-1 to 1-8 and comparative examples 1-1 and 1-2, except that a plurality of holes and a plurality of islands were randomly formed, the holes and the islands having the parameters shown in Table 5.

(evaluation of reflection L value)

In a state where a black tape was attached to the side of the transparent conductive film on which the transparent electrode pattern portion and the transparent insulating pattern portion were formed, measurement was performed from the side opposite to the side to which the black tape was attached, according to JIS Z8722, using Color i5 manufactured by acheiy corporation. This measurement was performed at 5 points randomly selected from the transparent electrode pattern portion of the transparent conductive film, and the measured values were simply averaged (arithmetic mean) to obtain the average reflection L value of the transparent electrode pattern portion. The same measurement was also performed on the transparent insulating pattern portion of the transparent conductive film, and the average reflection L value of the transparent insulating pattern portion was obtained.

(absolute value of difference between reflection L values)

The absolute value of the difference between the reflection L values is obtained by substituting the reflection L value obtained in the above-described "evaluation of reflection L value" into the following equation.

The absolute value of the difference in the reflection L values = | (reflection L value of transparent electrode pattern portion) - (reflection L value of transparent insulating pattern portion) |.

(invisibility)

(fringe and interference light)

(Glare)

(shapes other than circles)

When the pattern drawn in the random pattern circle generated in each example was changed from a circle to another shape, if the coverage difference between the transparent electrode pattern portion and the transparent insulating pattern portion and the ratio of the border line length were the same as in the case of the circle, the evaluation result was also the same as in the case of the circle.

The following can be seen from tables 5 and 6.

By setting the ratio of the boundary line lengths to a range of 0.75 to 1.25, pattern recognition can be suppressed. On the other hand, when the ratio of the boundary line lengths is out of the range of 0.75 to 1.25, the pattern is recognized even if the coverage difference is the same. The reason for this is that, for example, the refractive index is different between a portion having a conductive material and a portion having no conductive material. When the difference in refractive index between the portion having the conductive material and the portion not having the conductive material is large, light scattering occurs at the boundary between the portion having the conductive material and the portion not having the conductive material. Thus, the area with the longer boundary line length is whiter, the absolute value of the difference in the reflection L values of the conductive portion and the non-conductive portion evaluated according to JIS Z8722 is 0.3 or more, and the pattern is recognized regardless of the coverage difference.

From the above, from the viewpoint of suppressing the recognition of the electrode pattern, it is preferable that the ratio of the lengths of the boundary lines is in the range of 0.75 to 1.25.

While the embodiments of the present technology have been described above in detail, the present technology is not limited to the above-described embodiments, and various modifications can be made based on the technical idea of the present technology.

For example, the structures, methods, steps, shapes, materials, numerical values, and the like described in the above embodiments are merely examples, and structures, methods, steps, shapes, materials, numerical values, and the like different from those described above may be used as necessary.

The structures, methods, steps, shapes, materials, numerical values, and the like of the above embodiments can be combined with each other without departing from the gist of the present technology.

In the above-described embodiment, the surface of the base material may be exposed in the region where the conductive material is not present, which is formed by patterning, or an intermediate layer (for example, a hard coat layer, an optical adjustment layer, or an adhesion assisting layer) formed on the surface of the base material may be exposed. In addition, when the transparent conductive layer is formed of a conductive material and a binder material, the binder material may remain.

In the above embodiment, both the X electrode pattern portion and the Y electrode pattern portion may be formed on one of the first surface and the second surface of one base material. In this case, it is preferable that one of the X electrode pattern portion and the Y electrode pattern portion is electrically connected to the intersection portion of the two via a relay electrode. As the structure of the X electrode pattern portion and the Y electrode pattern portion using the relay electrode, for example, a conventionally known structure disclosed in japanese patent application laid-open No. 2008-310550 and the like can be adopted.

(1) The present technology can adopt the following configuration.

(1-1) a transparent conductive member, comprising:

a substrate having a surface; and

(1-2) the transparent conductive element according to (1-1), wherein an average boundary line length ratio (L1/L2) between the average boundary line length L1 of the transparent conductive part and the average boundary line length L2 of the transparent insulating part is in a range of 0.75 to 1.25.

(1-3) the transparent conductive element according to the item (1-1) or (1-2), wherein,

the absolute value of the difference between the reflection L values of the transparent conductive part and the transparent insulating part is less than 0.3.

(1-4) the transparent conductive element according to any one of (1-1) to (1-3),

the hole and the land have a dot shape.

(1-5) the transparent conductive element according to (1-4), wherein,

the dots are at least one selected from the group consisting of circular shapes, elliptical shapes, shapes obtained by cutting off a part of a circular shape, shapes obtained by cutting off a part of an elliptical shape, polygons obtained by cutting off corners, and irregular shapes.

(1-6) the transparent conductive element according to any one of (1-1) to (1-3),

the conductive portions between the holes and the gap portions between the islands have a mesh shape.

(1-7) the transparent conductive element according to any one of (1-1) to (1-3),

the holes are dot-shaped, and the gaps between the islands are mesh-shaped.

(1-8) the transparent conductive element according to any one of (1-1) to (1-3),

the conductive portions between the holes have a mesh shape, and the islands have a dot shape.

(1-9) the transparent conductive element according to any one of (1-1) to (1-8),

the random patterns of the transparent conductive part and the transparent insulating part are different random patterns from each other.

(1-10) the transparent conductive element according to any one of (1-1) to (1-9),

a plurality of inversion portions that are inverted from the hole portion to the island portion with the boundary line as a boundary are formed at random on the boundary line between the transparent conductive portion and the transparent insulating portion.

(1-11) the transparent conductive element according to any one of (1-1) to (1-10),

the coverage of the transparent conductive layer in the transparent conductive part and the transparent insulating part is 65% or more and 100% or less.

(1-12) the transparent conductive element according to any one of (1-1) to (1-11),

the back surface opposite to the surface is also provided with transparent conductive parts and transparent insulating parts which are alternately arranged,

the difference between the sum of the coverage of the transparent conductive layer on the front surface and the coverage of the transparent conductive layer on the back surface is in the range of 0% to 60%.

(1-13) the transparent conductive element according to any one of (1-1) to (1-12),

the transparent conductive portion has a plurality of regions,

when the width of the region is W and the length of the region is L, the coverage rate of the transparent conductive layer is set to be larger as the ratio (L/W) is larger.

(1-14) the transparent conductive element according to any one of (1-1) to (1-13),

the transparent conductive part is a transparent electrode pattern part.

(1-15) a transparent conductive member, comprising:

a substrate having a first surface and a second surface; and

the transparent electrode pattern part is a transparent conductive layer in which a plurality of hole parts are separately and randomly formed,

the shape of the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion is a random shape.

(1-16) an input device, comprising:

a first transparent conductive element; and

a substrate having a surface; and

(1-17) an electronic device having a transparent conductive member,

the transparent conductive element has:

a substrate having a surface; and

(1-18) A master for forming a transparent conductive element, wherein,

(2) The present technology can also adopt the following configuration.

(2-1) a transparent conductive member, comprising:

a substrate having a first surface and a second surface; and

a plurality of holes are formed at the transparent electrode pattern portion separately and randomly,

a plurality of island portions are formed at random in the transparent insulating pattern portion.

(2-2) the transparent conductive element according to (2-1), wherein,

the transparent insulating pattern portion is a transparent conductive layer composed of a plurality of island portions which are separated and randomly formed.

(2-3) the transparent conductive element according to the item (2-1) or (2-2), wherein,

(2-4) the transparent conductive element according to any one of (2-1) to (2-3),

on the boundary line between the transparent electrode pattern portion and the transparent insulating pattern portion, a plurality of inversion portions that are inverted from the hole portion to the island portion with the boundary line therebetween are formed at random and separated from each other.

(2-5) the transparent conductive element according to any one of (2-1) to (2-4),

the shape of the hole and the land is at least one selected from the group consisting of a circular shape, an elliptical shape, a shape obtained by cutting a part of a circular shape, a shape obtained by cutting a part of an elliptical shape, a polygon with corners cut, and an irregular shape.

(2-6) an information input device, comprising:

a first transparent conductive element; and

a substrate having a surface; and

a transparent electrode pattern part and a transparent insulation pattern part formed on the surface,

(2-7) an information input apparatus, wherein,

has a transparent conductive element, and a conductive layer,

the transparent conductive element has:

a substrate having a first surface and a second surface; and

a transparent electrode pattern part and a transparent insulating pattern part formed on the first surface and the second surface,

the transparent electrode pattern part and the transparent insulating pattern part are alternately laid on the first surface and the second surface,

(2-8) A master for forming a transparent conductive element, wherein,

having a surface on which a transparent electrode pattern part forming region and a transparent insulating pattern part forming region are alternately laid,

a plurality of convex island parts are formed at random in the transparent insulation pattern part forming region in a separated manner.

(2-9) a method for producing a transparent conductive element, comprising:

printing a conductive coating on the surface of a substrate; and

(2-10) the method for producing a transparent conductive element according to (2-9),

in the printing step, a conductive coating material is applied to the surface of the master for forming a transparent conductive element, the applied transparent conductive coating material is printed on the surface of the substrate,

the transparent conductive element forming master has a surface on which a transparent electrode pattern forming region and a transparent insulating pattern forming region are alternately laid,

a plurality of holes having a concave shape are formed at the transparent electrode pattern portion separately and randomly,

a plurality of convex island parts are formed at random on the transparent insulating pattern part in a separated mode.

(2-11) a method for producing a transparent conductive element, comprising:

(3) The present technology can also adopt the following configuration.

(3-1) a transparent conductive member, comprising:

a substrate; and

a transparent electrode pattern part and a transparent insulating pattern part alternately laid on the surface of the base material along a predetermined direction,

the transparent electrode pattern portion and the transparent insulating pattern portion each have at least a conductive material portion, and the conductive portions are formed of patterns different from each other.

(3-2) the transparent conductive element according to the item (3-1),

in the transparent electrode pattern portion and the transparent insulating pattern portion, the conductive material portion and the non-conductive portion are formed of random patterns different from each other.

(3-3) the transparent conductive element according to the item (3-1) or (3-2),

the transparent electrode pattern portion is formed with a plurality of the non-conductive portions separated and randomly in a formation plane of the conductive material portion,

the transparent insulating pattern part is separated and randomly formed with the conductive material part within a formation plane of the non-conductive part,

in the transparent electrode pattern portion and the transparent insulating pattern portion, patterns formed by boundaries of the conductive material portion and the non-conductive portion are random patterns different from each other.

(3-4) the transparent conductive element according to the item (3-2) or (3-3), wherein,

the conductive material portion and the non-conductive portion are arranged in the transparent electrode pattern portion and the transparent insulating pattern portion based on random patterns generated under different generation conditions, thereby forming random patterns different from each other.

(3-5) the transparent conductive element according to any one of (3-1) to (3-4),

the coverage of the conductive material portion in the transparent electrode pattern portion and the transparent insulating pattern portion is 65% or more and 100% or less.

(3-6) the transparent conductive element according to any one of (3-1) to (3-5),

the transparent electrode pattern portion is formed of a plurality of regions having different coverage rates of the conductive material portion.

(3-7) an input device, comprising:

a first transparent conductive element having a transparent electrode pattern portion and a transparent insulating pattern portion alternately laid on a surface of a base material in a predetermined direction; and

a second transparent conductive element having transparent electrode pattern portions and transparent insulating pattern portions alternately laid on a surface of a base material in a direction orthogonal to the predetermined direction, the second transparent conductive element being disposed in a positional relationship overlapping with the first transparent conductive element as viewed from an input surface direction,

the transparent electrode pattern portions and the transparent insulating pattern portions of the first and second transparent conductive elements each have at least a conductive material portion, and the conductive material portions are formed of different patterns from each other.

(3-8) the input device according to (3-7), wherein,

in the transparent electrode pattern portions and the transparent insulating pattern portions of the first and second transparent conductive elements, the conductive material portion and the non-conductive portion are formed of random patterns different from each other.

(3-9) the input device according to (3-7) or (3-8), wherein,

in a state where the first transparent conductive element and the second transparent conductive element are superimposed on each other, a difference between a sum of a coverage of the conductive material portion of the first transparent conductive element and a coverage of the conductive material portion of the second transparent conductive element is 0 or more and 60 or less in all regions viewed from an input surface direction.

(4) The present technology can also adopt the following configuration.

(4-1) a transparent electrode element, wherein:

a substrate;

a transparent conductive film disposed on the substrate;

an electrode region formed using the transparent conductive film; and

and an insulating region adjacent to the electrode region, the insulating region being formed by dividing the transparent conductive film into independent island-like shapes by a groove pattern extending in a random direction.

(4-2) the transparent electrode element according to (4-1), wherein,

the transparent conductive film is randomly arranged between the electrode region and the insulating region at the boundary therebetween.

(4-3) the transparent electrode element according to the item (4-1) or (4-2), wherein,

the groove patterns disposed in the insulating region have the same line width.

(4-4) the transparent electrode element according to any one of (4-1) to (4-3),

a plurality of hole patterns are randomly arranged on the transparent conductive film constituting the electrode region.

(4-5) the transparent electrode element according to (4-4), wherein,

the electrode region is provided with a plurality of strip patterns formed by the transparent conductive film extending in random directions, and the hole patterns are divided by the strip patterns.

(4-6) the transparent electrode element according to any one of (4-1) to (4-5),

the substrate is composed of a transparent material.

(4-7) an information input device, comprising:

a substrate;

a transparent conductive film disposed on the substrate;

a plurality of electrode regions formed using the transparent conductive film;

and an insulating region which is a region adjacent to the plurality of electrode regions and which divides the transparent conductive film into independent island-like shapes by a groove pattern extending in a random direction.

(4-8) an electronic apparatus, wherein:

a display panel;

a transparent conductive film provided on a display surface side of the display panel;

a plurality of electrode regions formed using the transparent conductive film;

(5) The present technology can also adopt the following configuration.

(5-1) a transparent conductive member, comprising:

a substrate having a surface; and

(5-2) the transparent conductive element according to (5-1), wherein,

(5-3) the transparent conductive element according to the item (5-1) or (5-2),

the island portion has a dot shape.

(5-4) the transparent conductive element according to (5-3), wherein,

the dot shape is at least one selected from the group consisting of a circular shape, an elliptical shape, a shape in which a part of a circular shape is cut off, a shape in which a part of an elliptical shape is cut off, a polygon in which corners are cut off, and an irregular shape.

(5-5) the transparent conductive element according to the item (5-1) or (5-2), wherein,

the gap between the island portions has a mesh shape.

(5-6) the transparent conductive element according to any one of (5-1) to (5-5),

the transparent conductive part is a transparent conductive layer continuously provided with a uniform thickness.

(5-7) the transparent conductive element according to any one of (5-6), wherein

(5-8) the transparent conductive element according to any one of (5-1) to (5-7),

(5-9) the transparent conductive element according to any one of (5-1) to (5-8),

the transparent conductive part is a transparent electrode pattern part.

(5-10) a transparent conductive member, comprising:

a substrate having a first surface and a second surface; and

(5-11) an input device, comprising:

a first transparent conductive element; and

a substrate having a surface; and

(5-12) an electronic apparatus, wherein,

has a transparent conductive element, and a conductive layer,

the transparent conductive element has:

a substrate having a surface; and

(5-13) A master for forming a transparent conductive element, wherein,

(5-14) the master for forming a transparent conductive element according to (5-13), wherein,

a convex flat surface having a uniform height is provided in the transparent conductive part forming region.

Description of reference numerals:

1 first transparent conductive element

2 second transparent conductive element

3 optical layer

4 display device

5. 32 lamination layer

11. 21, 31 base material

12. 22 transparent conductive layer

13. 23 transparent electrode pattern part

14. 24 transparent insulating pattern part

Holes 13a and 23a

13b, 23b conductive part

14a, 24a island

14b, 24b gap part

15 reversal part

41 resist layer

33 opening part

L₁、L₂Boundary line

R₁First region

R₂A second region.

Claims

1. A transparent conductive element, comprising:

a substrate having a surface; and

2. The transparent conductive element according to claim 1,

an average boundary line length ratio (L1/L2) between the average boundary line length L1 of the transparent conductive part and the average boundary line length L2 of the transparent insulating part is in a range of 0.75 to 1.25.

3. The transparent conductive element according to claim 1,

4. The transparent conductive element according to claim 1,

the hole and the land have a dot shape.

5. The transparent conductive element according to claim 1,

6. The transparent conductive element according to claim 1,

7. The transparent conductive element according to claim 1,

the holes are dot-shaped, and the gaps between the islands are mesh-shaped.

8. The transparent conductive element according to claim 1,

9. The transparent conductive element according to claim 1,

10. The transparent conductive element according to claim 1,

11. The transparent conductive element according to claim 1,

12. The transparent conductive element according to claim 1,

13. The transparent conductive element according to claim 1,

the transparent conductive portion has a plurality of regions,

14. The transparent conductive element according to claim 1,

the transparent conductive part is a transparent electrode pattern part.

15. A transparent conductive element, comprising:

a substrate having a first surface and a second surface; and

16. An input device, comprising:

a first transparent conductive element; and

a substrate having a surface; and

17. An electronic device, characterized in that,

has a transparent conductive element, and a conductive layer,

the transparent conductive element has:

a substrate having a surface; and

18. A master for forming a transparent conductive element, characterized in that,