HK1163015B

HK1163015B - Electrodeposited wire tool

Info

Publication number: HK1163015B
Application number: HK12103474.5A
Authority: HK
Inventors: 风早克夫; 松本宁; 福西利夫; 辻本宗裕; 小川秀树; 山中正明; 福岛健二
Original assignee: 联合材料公司
Priority date: 2008-04-11
Filing date: 2011-07-22
Publication date: 2014-05-30

Abstract

An electrodeposited wire tool (10) having a longitudinally extending core wire (4), a plated layer (3) on the outer peripheral surface (41) of the core wire (4), super-grinding particles (1) retained by the plated layer (3), and a covering layer (2) which covers the outer peripheral surface of the super-grinding particles (1). The covering layer (2) is formed by non-electrolytic Ni-P plating. The covering layer (2) is heat treated and some or all of the non-electrolytic Ni-P plating is crystallized.

Description

Electrodeposition wire tool

The present application is a divisional application of 200980112780.6 (international application No. PCT/JP2009/057163), the date of application of the original application is 4/8/2009, and the name of the invention of the original application is an electrodeposition line tool and a method for manufacturing the same.

Technical Field

The present invention relates to an electrodeposition wire tool and a method for manufacturing the same, and more particularly to an electrodeposition wire tool in which metal-coated abrasive grains are retained on an outer peripheral surface of a magnetic wire body, and a method for manufacturing the same.

Background

Electrodeposition line tools have been disclosed in Japanese patent application laid-open Nos. 53-96589 (patent document 1), 53-14489 (patent document 2), 63-34071 (patent document 3), and 2004-50301 (patent document 4).

Patent document 1 discloses a method for manufacturing an electrodeposited wire tool, in which abrasive grains are mixed in a plating solution and a piano wire is subjected to composite plating in a state of being immersed (immersed) in the plating solution.

However, according to this method, it is difficult to stably produce an electrodeposited wire tool in which abrasive grains are uniformly dispersed at a high density at a high speed.

Patent document 2 discloses a method for manufacturing an electrodeposited wire tool, in which a piano wire is magnetized, and metal-coated abrasive grains having magnetism or having been subjected to a magnetic treatment in advance are adsorbed onto the magnetized piano wire and fixed by plating while maintaining the adsorbed state.

Further, the following are described: the surface of the abrasive grain is coated with a magnetic metal, i.e., iron or nickel, by an ion spraying method or a plating method, and the metal-coated abrasive grain thus obtained is magnetized.

However, in patent document 2, when the metal-coated abrasive particles coated with iron or nickel are adsorbed on the magnetized piano wire, the metal-coated abrasive particles aggregate. This is because iron and nickel are ferromagnetic substances, and hence the magnetic attraction force is too large relative to the size (weight) of the abrasive grains. This tendency is large particularly when the abrasive grain size is 60 μm or less.

Patent document 3 discloses a method for producing an electrodeposited grindstone, in which a ferromagnetic metal coating layer is formed on the surface of abrasive grains in an electroless plating solution containing nickel ions, the abrasive grains are magnetized by a magnetizing device, and the magnetized metal-coated abrasive grains are put into a plating solution in which a ferromagnetic grindstone base metal is impregnated, stirred, and plated. At present, diamond abrasive grains coated with electroless Ni — B plating are not commercially available and are very expensive to produce.

Patent document 4 describes an example in which metal-coated diamond abrasive grains coated with an electroless Ni — P plating layer are magnetically adsorbed on a piano wire and fixed by a nickel plating layer.

However, the electroless Ni — P plating layer shown in patent document 4 is nonmagnetic, and the nonmagnetic metal-coated abrasive grains cannot be adsorbed on the piano wire at a high density.

In addition, the decrease in the adsorption force deteriorates the uniform dispersibility of the abrasive grains of the electrodeposited wire tool.

Patent document 1: japanese laid-open patent publication No. 53-96589

Patent document 2: japanese laid-open patent publication No. 53-14489

Patent document 3: japanese laid-open patent publication No. 63-34071

Patent document 4: japanese patent application laid-open No. 2004-50301

Disclosure of Invention

Accordingly, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a high-quality electrodeposited wire tool and a method of manufacturing the same.

An electrodeposition wire tool according to the present invention includes: the abrasive particles are coated with a metal and fixed to the outer peripheral surface of the magnetic linear body by a plating layer. The metal-coated electroless Ni-P plating layer contains P in an amount of 4 mass% or more, and at least a part of the electroless Ni-P plating layer is crystallized.

The electrodeposited wire tool having such a structure is hard because at least a part of the electroless Ni — P plating layer coated on the abrasive grains made of diamond, CBN, or the like is crystallized. With such a structure, when an electrodeposition wire tool is used, the interface between the abrasive grains and the electroless Ni — P plating layer supporting them is hardly worn. This prevents the abrasive grains from falling off during machining, thereby increasing the tool life.

The content of P in the electroless Ni — P plating layer is preferably 6 mass% or more and 9 mass% or less.

This provides the best effect of preventing the abrasive grains from falling off during machining. In addition, the cost of the abrasive grains can be kept to a minimum. Metal abrasive grains coated with an electroless Ni — P plating layer having a P content less than 4 mass% within the range investigated by the inventors were not distributed in the market.

This is because there are four problems as follows:

(1) the control of the plating solution is difficult;

(2) the plating speed is slow;

(3) the service life of the plating solution is short;

(4) and the cost of the plating solution is high.

The metal-coated abrasive grains coated with the electroless Ni — B plating layer are not distributed in the market for the same reason. Further, the method of the present invention has a great advantage in the case of production by the method of the present invention described later.

When the content of P is 4 mass% or more, more preferably 6 mass% or more and 9 mass% or less, the specific resistance of the electroless Ni — B plating layer is increased, and the agglomerated metal-coated abrasive grains can be prevented from being fixed to the surface of the magnetic wire. Thus, an electrodeposition wire tool having a uniform abrasive grain height can be obtained.

Preferably, the metal-coated abrasive grains contain diamond and have an intensity ratio Ni in XRD analysis₃P (231)/diamond (111) is 0.01 to 0.3.

Here, the strength ratio Ni₃P (231) is based on Ni₃XRD peak intensity of 231 face of P crystal. Diamond (111) is the XRD peak intensity of the 111 plane based on diamond crystals.

By knowing these strength ratios, the degree of crystallization of the electroless Ni — P plating layer can be indirectly understood. By using abrasive grains having a strength within the holding range, the amount of adsorption of the abrasive grains can be made an ideal amount of adsorption, and the consumption of the abrasive grains and the power consumption can be reduced. If the strength ratio is less than 0.01, the amount of the abrasive grains adsorbed to the wire decreases, and the amount deviates slightly from the ideal state.

In the case where the strength ratio exceeds 0.3, a heat treatment for a considerably long time is required, and the surface of the metal-coated abrasive particle may be oxidized. When the oxidation is performed, the fixing strength of the abrasive grains to the wire by the nickel plating layer can be reduced.

It is also preferable that crystals having a particle diameter of 10nm or more are present in an average of 1X 10 from the surface of the electroless Ni-P plating layer to the portion where the metal-coated abrasive grains are present⁷Per mm²6X 10 above⁹Per mm²The following exists.

The density can be understood by observing the cross section of the metal-coated abrasive particle with a TEM (transmission electron microscope). To average 1 × 10⁷Per mm²The above density makes it possible to reduce the consumption of abrasive grains and the power consumption while making the amount of abrasive grains adsorbed ideal.

Due to density exceeding 6X 10⁹Per mm²Therefore, a heat treatment for a relatively long time is required, and the surface of the metal-coated abrasive particle may be oxidized. After oxidation, the fixing strength of the abrasive grains to the wire by the nickel plating layer may be reduced.

Preferably, when a cross section from the surface of the electroless Ni — P plating layer, which is a metal-coated portion, to a portion where the abrasive grains are present is observed, the ratio of crystals having a particle size of 10nm or more is 20% to 70% in the electroless plating layer.

Within this range, the amount of adsorption of the abrasive grains can be made to be an ideal amount of adsorption, and the consumption of the abrasive grains and the power consumption can be reduced.

If the ratio of crystals having a particle diameter of 10nm or more is less than 20%, the amount of adsorption of the abrasive grains onto the yarn decreases, and the amount of adsorption deviates slightly from the ideal value.

When the ratio of crystals having a particle diameter of 10nm or more is more than 70%, a considerably long heat treatment is required, and the surface of the metal-coated abrasive particle may be oxidized. After oxidation, the fixing strength of the abrasive grains to the wire by the nickel plating layer may be reduced.

The plating layer formed on the outer peripheral surface of the magnetic linear body is preferably a nickel plating layer.

By using the nickel plating layer, corrosion resistance and hardness are imparted to the electrodeposited wire tool. Thereby, the tool can withstand various use environments in which the tool is used as an electrodeposition wire tool.

More preferably, the average particle diameter of the nickel structure constituting the nickel plating layer is 0.0155 times or more and 1.000 times or less with respect to the thickness of the plating layer. This can be understood by performing EBSD analysis on a cross section of the nickel plating layer. The analysis was performed under the condition that each of the twins was a crystal grain boundary without including the edge grains.

In this way, the plating layer becomes soft, and the intake amount of sulfur, oxygen, hydrogen, and the like in the plating layer itself, which can harden the plating layer, is reduced. Thus, the nickel plating layer formed on the circumference of the piano wire is not broken, regardless of the degree of extreme bending.

An example of conditions for producing such a structure is a flow rate of a plating solution. The flow rate is preferably not less than the flow rate obtained by the following expression in the relationship between the flow rate of the plating solution and the current density.

In a cross-sectional area of X (mm)²) The flow rate (L/min) of the plating solution required for nickel plating at a current density of Y (A) through the piano wire in the vessel (2) is X × Y × 6 × 10^-5。

When the average grain size of the nickel structure is smaller than 0.0155% with respect to the thickness of the nickel plating layer, the plating layer itself becomes hard, and therefore, cracks are likely to occur due to bending.

When the average particle size of the nickel structure exceeds 1 time the thickness of the nickel plating layer, the particle size of the cross-sectional structure cannot be increased as compared with the thickness of the plating layer.

The average particle size of the nickel structure referred to herein is a particle size obtained by averaging the diameters of circles having areas equal to the areas of the crystal particles obtained by ebsd (electron back scatter Diffraction patterns) analysis.

The average S (sulfur) content of the nickel plating layer is preferably 1 mass% or less.

In general, electrodeposition wire type tools are subjected to a wide variety of stresses during their use. This causes cracking in the nickel plating layer, resulting in the degranulation of the metal-coated abrasive grains and breakage of the tool. However, the nickel plating layer has an average S (sulfur) content of 1 mass% or less, and the nickel plating layer is easily elongated.

Even if such a nickel plating layer is subjected to stress that causes cracking, the nickel plating layer prevents cracking by extending the portion of the plating layer that increases the load, and does not cause shedding of metal-coated abrasive grains or breakage of tools.

Further, since the pulley is easily bent, the pulley is smoothly wound.

It is preferable that the average S (sulfur) content of the nickel plating layer is 0atoms/cm³Above 3.0 × 10¹⁸atoms/cm³The following. When the content of S is as described above, the nickel plating layer formed around the piano wire is not broken regardless of the degree of extreme bending. In general, a nickel plating layer obtained without adding a gloss agent such as o-sulfonylbenzimide contains a very small amount of sulfur. Examples of the analysis method include high sensitivity analysis such as SIMS and the like, and accurate amount detection cannot be performed by reaching the measurement limit such as EDX-SEM (Energy Dispersive X-ray-Scanning Electron Microscope). In addition, Xatoms/cm³Is X10^-22X100/9.14 (mass%).

Nickel sulfate NiSO is typically used in nickel plating baths₄·6H₂O or nickel sulfamate Ni (NH)₂SO₃)₂·4H₂O, which contains sulfur.

The inventors believe that the above-mentioned very small amounts of sulfur are provided by them. The amount of sulfur taken into the plating layer has a great influence on the plating conditions, i.e., the properties of the formed plated structure. For example, the flow rate of the plating solution is set as described above.

It is preferable that the average O (oxygen) content of the nickel plating layer is 0atoms/cm³Above 2.0 × 10²⁰atoms/cm³The following.

These were also detected only in a very small amount by a high-sensitivity analysis such as SIMS. By setting the above oxygen content, the nickel plating layer formed around the piano wire does not crack regardless of the degree of extreme bending.

The oxygen is mainly taken out of the bath and precipitates such as hydroxides. The amount of oxygen taken into the plating solution is considered to have a large influence on the plating conditions and the properties of the plated structure formed. For example, the amount of oxygen is determined based on the flow rate of the plating solution, and the preferable flow rate of the plating solution is as described above.

Preferably, the secondary ion average intensity ratio (hydrogen average intensity/Ni average intensity) of hydrogen to Ni in SIMS analysis of the nickel plating layer is 0 or more and less than 2.8X 10^-2. The high sensitivity analysis of hydrogen by SIMS also detected only very trace amounts. When the intensity ratio of the secondary ions of nickel and hydrogen in the nickel plating is within the above range, the plating layer formed around the piano wire does not crack, regardless of the degree of extreme bending.

The hydrogen is mainly present as hydrogen atoms in the bath and hydrogen gas generated from the filaments. The amount of hydrogen taken into the plating layer is considered to have a great influence on the plating conditions and the properties of the formed structure. For example, the hydrogen intake amount is changed according to the flow rate of the plating solution, and the flow rate of the plating solution is preferably as described above.

The metal-coated abrasive grains preferably have a particle diameter of 5 μm or more and 1000 μm or less. Thus, a tool having excellent performance in the aspects of sharpness, surface roughness of a cut surface, bending of a workpiece, cross-sectional loss (カ - フロス), and the like is formed.

Preferably, the nickel plating layer and the metal-coated abrasive grains have a value of 0.26 to 0.8 inclusive of the thickness of the nickel plating layer per the average particle diameter of the abrasive grains.

The electrodeposition line tool satisfying such a relationship can maintain a high state for a long time together with the abrasive grain retention and sharpness.

Preferably, the magnetic wire body is a piano wire plated with brass or copper. Generally, before plating a piano wire, the piano wire needs to be immersed in an acid to remove an oxide film or the like.

Here, when a piano wire or the like is immersed in an acid, precipitates mainly composed of carbon called smear (スマット) are generated, and these cause a decrease in the adhesion of plating. Therefore, a process of removing stains after pickling is generally required.

However, since no stain is generated in the case of brass-plated or copper-plated piano wire, high adhesion force can be maintained and the process does not need to be unnecessarily performed.

The material of the filament body may be, in addition to piano wire, wire rods obtained by plating magnetic metal such as Ni, Ni alloy, stainless steel, etc., or nonmagnetic wires such as W wire, Mo wire, Cu alloy wire, etc., with Ni, etc., or twisted wires obtained by twisting 1 or 2 or more of these wire rods together.

The method for manufacturing the electrodeposition line tool of the present invention comprises: a step of heat-treating the metal-coated abrasive grains coated with the electroless Ni-P plating layer to crystallize at least a part of the electroless Ni-P plating layer; and a step of adding the metal-coated abrasive grains after the heat treatment to the plating solution and dispersing the same, and attracting the same to a magnetic linear body as a base material by magnetic induction, and fixing the same by the plating layer. The P content of the electroless Ni-P plating layer is 4 mass% or more.

In the method for manufacturing an electrodeposition wire tool including such a step, since at least a part of the electroless Ni — P plating layer is crystallized, the Ni — P plating layer is easily magnetized. As a result, the metal-coated abrasive grains are easily attracted to the magnetic wire-shaped body by magnetic induction.

As described above, the metal-coated abrasive grains coated with the electroless Ni — P plating layer of 4 mass% or more are distributed in the market and can be obtained at low cost. However, when metal-coated abrasive grains sold in the market are attracted to a magnetic linear body as a base material by magnetic force, the amount of attraction of the metal-coated abrasive grains is very small, and thus the metal-coated abrasive grains cannot be used. This is because the metal coating is amorphous and therefore nonmagnetic. In particular, when a commercially available metal-coated abrasive grain having a grain size of 10 μm or more is used to produce an electrodeposited wire tool at a production rate of 2m/min or more, the amount of adsorption of the metal-coated abrasive grain to the magnetic wire body is significantly reduced, and therefore, it cannot be used.

Although there is such a problem, in the present invention, the content of P is 4 mass% or more, and even if the metal-coated abrasive grains are coated with an amorphous and nonmagnetic electroless Ni — P plating layer, the metal-coated abrasive grains can be magnetized by heat-treating the metal-coated abrasive grains to crystallize at least a part of the Ni — P plating layer and applying a magnetic field. This can greatly increase the amount of metal-coated abrasive grains adsorbed to the magnetic linear body. Even if the amount is 4 mass% or less, the magnetic properties can be improved by performing the heat treatment more than before the heat treatment.

Further, the electroless Ni — P plating layer that coats the metal-coated abrasive grains produced by the heat treatment has a higher electrical resistance than Ni and the electroless Ni — B plating layer, and therefore, the consumption of abrasive grains and the power consumption that have been problematic in patent document 2 can be reduced.

More preferably, the P (phosphorus) content of the electroless Ni — P plating layer is 6 mass% or more and 9 mass% or less. In this range, the consumption of abrasive grains and the power consumption can be minimized.

As methods of attracting the metal-coated abrasive grains to the magnetic wire-shaped body by magnetic force, there are (1) magnetizing only the metal-coated abrasive grains, (2) magnetizing only the magnetic wire-shaped body, and (3) magnetizing the metal-coated abrasive grains and the magnetic wire-shaped body, and any of the methods may be employed.

Specific examples of the metal-coated abrasive grains subjected to the heat treatment include electroless Ni — P plating on diamond and CBN.

Specific examples of the linear body are as described above.

The temperature of the heat treatment is preferably 250 ℃ or higher and not higher than the melting point of the electroless Ni-P plating layer. By setting the temperature range to this range, the electroless Ni — P plating layer suitable for the present invention can be crystallized, and the amount of adsorption of the metal-coated abrasive grains can be increased remarkably.

In addition, when the metal-coated abrasive particles coated with the electroless Ni — P plating layer are heat-treated, the Ni — P plating layer also becomes hard. This can suppress wear around the abrasive grains and can improve the life of the electrodeposition wire tool.

When the temperature of the heat treatment is 250 ℃ or higher and the temperature is less than 250 ℃, the ratio of crystallization of the electroless Ni — P plating layer decreases, and therefore, it is difficult to adsorb the metal coating on the wire-shaped body by magnetic force. The reason why the melting point of the electroless Ni — P plating layer is set to be not higher than the melting point is that the metal-coated abrasive grains are more likely to change in quality when the melting point is exceeded.

The environment for the heat treatment is preferably a vacuum environment, a hydrogen environment, a nitrogen environment, or an argon environment (hereinafter, referred to as a vacuum environment or the like). When the surface of the electroless Ni — P plating layer coated with abrasive grains has an oxide film, the fixing force of the abrasive grains by plating is reduced. However, when heat treatment is performed in a vacuum atmosphere or the like, it is difficult to form an oxide film, and the fixing force of the metal-coated abrasive particles can be increased.

More preferably, the metal-coated abrasive grains are immersed in an acid after the heat treatment. Thus, even when an oxide film is formed on the surface of the electroless Ni — P plating layer, the oxide film can be removed by the treatment, and the fixing force of the metal-coated abrasive particle can be improved. Specifically, the treatment may be performed using hydrochloric acid, nitric acid, sulfuric acid, or the like.

Drawings

Fig. 1 is a cross-sectional view orthogonal to the long-side direction of an electrodeposition line tool according to embodiment 1 of the present invention;

fig. 2 is a cross-sectional view orthogonal to the long-side direction of the electrodeposition line tool according to embodiment 2 of the present invention;

FIG. 3 is a cross-sectional view orthogonal to the longitudinal direction showing a modified form of the electrodeposited wire shown in FIG. 1;

FIG. 4 is a cross-sectional view orthogonal to the longitudinal direction showing a modified form of the electrodeposited wire shown in FIG. 2;

fig. 5 is a cross-sectional view orthogonal to the long-side direction of an electrodeposition line tool according to embodiment 4 of the present invention;

fig. 6 is a cross-sectional view orthogonal to the long-side direction of the electrodeposition line tool according to embodiment 5 of the present invention;

fig. 7 is a cross-sectional view orthogonal to the long-side direction of an electrodeposition line tool according to embodiment 6 of the present invention;

fig. 8 is a cross-sectional view orthogonal to the long-side direction of an electrodeposition line tool according to embodiment 7 of the present invention;

fig. 9 is a cross-sectional view orthogonal to the long-side direction of an electrodeposition line tool according to embodiment 8 of the present invention;

fig. 10 is a cross-sectional view orthogonal to the long-side direction of an electrodeposition line tool according to embodiment 9 of the present invention;

FIG. 11 is a XRD chart showing diamond abrasive grains heat-treated by the method described in example 5;

FIG. 12 is a XRD chart showing diamond abrasive grains which have not been heat-treated by the method described in example 5;

FIG. 13 is a view showing a cross-sectional portion of the diamond abrasive grains and an electroless Ni-P plating layer by a scanning transmission electron microscope (HD-2700) manufactured by Hitachi high tech Co., Ltd;

FIG. 14 is a view showing a cross-sectional portion of the diamond abrasive grains and an electroless Ni-P plating layer by a scanning transmission electron microscope (HD-2700) manufactured by Hitachi high tech Co., Ltd;

FIG. 15 is an enlarged cross-sectional view of the electroless Ni-P plating 202 of the sample of FIG. 14;

FIG. 16 is a cross-sectional view showing the photograph in FIG. 15, in which the crystalline portion is black and the amorphous portion is white;

FIG. 17 is a graph showing the results of SIMS analysis of the nickel plating layer formed on the wire of example A;

FIG. 18 is a graph showing the results of SIMS analysis of the nickel plating layer formed on the wire of example B;

FIG. 19 is a graph showing the results of SIMS analysis of the nickel plating layer formed on the wire of example D.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. In the following embodiments, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated. Further, the embodiments may be combined.

(embodiment mode 1)

Fig. 1 is a cross-sectional view orthogonal to the longitudinal direction of an electrodeposition line tool according to embodiment 1 of the present invention. Referring to fig. 1, an electrodeposition wire tool 10 includes a core wire 4 extending in a longitudinal direction, a plating layer 3 provided on an outer peripheral surface 41 of the core wire 4, superabrasive grains 1 held by the plating layer 3, and a coating layer 2 coating the outer peripheral surface of the superabrasive grains 1. The core wire 4 may be a piano wire, for example. The superabrasive grains 1 are diamond abrasive grains or Cubic Boron Nitride (CBN) abrasive grains.

The coating layer 2 is composed of an electroless Ni-P plating layer. The coating layer 2 is heat-treated to crystallize a part or all of the electroless Ni-P plating layer. The superabrasive grains 1 subjected to the heat treatment are placed in a plating solution and are magnetically attracted to the core wire 4 serving as a base material in a dispersed state, and are fixed by the plating layer.

(embodiment mode 2)

Fig. 2 is a sectional view showing the electrodeposition line tool according to embodiment 2 of the present invention, the sectional view being orthogonal to the longitudinal direction. Referring to fig. 2, the electrodeposition wire type tool according to embodiment 2 of the present invention is different from the electrodeposition wire type tool according to embodiment 1 in that a coating layer 5 is formed on an outer peripheral surface 41 of a core wire 4. The coating layer 5 is formed of a brass plating layer or a copper plating layer.

Even the electrodeposition line tool according to embodiment 2 thus configured has the same effect as the electrodeposition line tool according to embodiment 1.

(embodiment mode 3)

Fig. 3 is a cross-sectional view orthogonal to the longitudinal direction showing the trimmed form of the electrodeposited wire shown in fig. 1. Fig. 4 is a cross-sectional view orthogonal to the longitudinal direction showing the trimmed form of the electrodeposited wire shown in fig. 2.

As shown in fig. 3 and 4, the same effects as those of embodiments 1 and 2 are obtained even when the superabrasive grains 1 are exposed from the coating layer 2.

(embodiment mode 4)

Fig. 5 is a cross-sectional view orthogonal to the longitudinal direction of an electrodeposition line tool according to embodiment 4 of the present invention. Referring to fig. 5, the electrodeposition wire tool 110 has a core wire 104 extending in the longitudinal direction, a plating layer 103 provided on the outer peripheral surface 141 of the core wire 104, superabrasive grains 101 held by the plating layer 103, and a coating layer 102 coating the outer peripheral surface of the superabrasive grains 101. The sulfur content in the nickel plating layer 103 is 1 mass% or less. The core wire 104 may be, for example, a piano wire. The superabrasive grains 101 are diamond abrasive grains or Cubic Boron Nitride (CBN) abrasive grains. By bringing the superabrasive grains 101 into contact with the core wire 104 without using magnetism, the electrodeposited wire tool 110 can be manufactured.

It is preferable that the average S (sulfur) content of the nickel plating layer is 0atoms/cm³Above 3.0 × 10¹⁸atoms/cm³The following. When the content of S is set as described above, the nickel plating layer formed around the piano wire is not broken regardless of the degree of extreme bending. Generally, the nickel plating layer obtained contains a very small amount of sulfur even when no gloss agent such as o-sulfonylbenzimide is added. Examples of the analysis method include high sensitivity analysis such as SIMS, and EDX-SEM (Energy Dispersive X-ray-Scanning Electron microscope) which can not detect an accurate amount because the measurement limit is reached.

Nickel sulfate NiSO is generally used for nickel plating solutions₄·6H₂O or nickel sulfamate Ni (NH)₂SO₃)₂·4H₂O, which contains sulfur.

The inventors believe that the above-mentioned very small amounts of sulfur are provided by them. It is considered that the amount of sulfur taken into the plating layer has a great influence on the plating conditions, i.e., the properties of the structure of the formed plating layer. An example of the flow rate of the plating solution is described later.

In a cross-sectional area of X (mm)²) In the vessel (2), the flow rate (L/min) of the plating solution required for nickel plating at a current density of Y (A) is X × Y × 6 × 10^-5。

It is also detected only in a very small amount by a high sensitivity analysis such as SIMS. By setting the above oxygen content, the nickel plating layer formed around the piano wire does not crack regardless of the degree of extreme bending.

The main sources of oxygen are considered to be precipitates such as plating solutions and hydroxides. The amount of oxygen taken into the plating solution also has a great influence on the plating conditions and the properties of the structure of the plating layer formed. For example, the amount of oxygen is determined based on the flow rate of the plating solution, and the preferable flow rate of the plating solution is as described above.

The average intensity ratio of secondary ions of hydrogen and Ni (hydrogen average intensity) in SIMS analysis of the nickel plating layer is preferable/Ni average strength) of 0 or more and less than 2.8X 10^-2. Hydrogen is also detected only in very small amounts by SIMS high sensitivity analysis. When the average intensity ratio of the secondary ions of hydrogen and Ni of the nickel plating layer is within the above range, the plating layer formed around the piano wire is not broken regardless of the degree of extreme bending.

The hydrogen is believed to be primarily evolved from the hydrogen atoms in the bath and the production of hydrogen gas from the filament. The amount of hydrogen taken into the plating layer also has a great influence on the plating conditions, i.e., the properties of the structure of the plating layer formed. For example, the hydrogen intake amount is changed according to the flow rate of the plating solution, and the flow rate of the plating solution is preferably as described above.

The average grain size of the nickel structure constituting the nickel plating layer may be larger than 0.23 μm when the plating thickness is 15 μm. Which can be understood by EBSD analysis of the cross section of the nickel plating layer. The analysis was performed under the condition that each of the twins was set as a crystal grain boundary without containing the edge grains (ェッジグレィン).

This makes the plating layer soft and reduces the amount of uptake of sulfur, oxygen, hydrogen, and the like into the plating layer, which hardens the plating layer. Thus, the nickel plating layer formed around the piano wire is not broken regardless of the degree of extreme bending.

An example of conditions for forming such a structure is a flow rate of a plating solution. The relationship between the flow rate of the plating solution and the current density was as described above. Preferably, the abrasive particles are coated with a metal.

The particle diameter of the metal-coated abrasive grains is preferably in the range of 5 μm to 1000 μm.

By forming such a particle size, a tool having excellent performance in terms of sharpness, surface roughness of a cut surface, bending of a workpiece, kerf loss, and the like is obtained.

Preferably, the nickel plating layer and the metal-coated abrasive grains have a value of the thickness of the nickel plating layer/the average particle diameter of the abrasive grains of 0.26 to 0.8.

An electrodeposition linear tool satisfying such a relationship can maintain a high state for a long time together with the abrasive grain retention force and sharpness.

(embodiment 5)

Fig. 6 is a cross-sectional view orthogonal to the longitudinal direction of an electrodeposition line tool according to embodiment 5 of the present invention. Referring to fig. 6, the electrodeposition line tool according to embodiment 5 of the present invention differs from the electrodeposition line tool according to embodiment 4 in that a coating layer 105 is formed on an outer peripheral surface 141 of a core wire 104. Coating layer 105 is formed of a brass plating layer or a copper plating layer.

Even the electrodeposition line tool according to embodiment 5 thus constituted has the same effect as the electrodeposition line tool according to embodiment 4.

(embodiment mode 6)

Fig. 7 is a cross-sectional view orthogonal to the longitudinal direction of the electrodeposition line tool according to embodiment 6 of the present invention. Referring to fig. 7, an electrodeposition wire type tool 110 according to embodiment 6 of the present invention differs from the electrodeposition wire type tool according to embodiment 4 in that a coating is not provided on the outer peripheral surface of the superabrasive grains 101.

Even the electrodeposition line type tool according to embodiment 6 thus configured can have the same effect as the electrodeposition line type tool according to embodiment 4.

(embodiment 7)

Fig. 8 is a cross-sectional view orthogonal to the longitudinal direction of an electrodeposition line tool according to embodiment 7 of the present invention. Referring to fig. 8, the electrodeposition wire type tool according to embodiment 7 of the present invention is different from the electrodeposition wire type tool according to embodiment 6 in that a coating layer 105 is formed on an outer peripheral surface 141 of a core wire 104.

Even the electrodeposition line tool according to embodiment 7 thus configured can have the same effect as the electrodeposition line tool according to embodiment 6.

(embodiment mode 8)

Fig. 9 is a cross-sectional view orthogonal to the longitudinal direction of an electrodeposition line tool according to embodiment 8 of the present invention. Referring to fig. 9, an electrodeposition wire type tool 110 according to embodiment 8 of the present invention differs from the electrodeposition wire type tool according to embodiment 6 in that the surface of superabrasive grains 101 is exposed.

Even the electrodeposition wire type tool according to embodiment 8 thus configured can have the same effect as the electrodeposition wire type tool according to embodiment 6.

As a method of exposing the surface of the superabrasive grains 101 in fig. 9, there may be mentioned a method of thinning the plating layer 103, or a method of removing a part of the plating layer 103 after once forming the plating layer as in embodiment 6.

(embodiment mode 9)

Fig. 10 is a cross-sectional view orthogonal to the longitudinal direction of an electrodeposition line tool according to embodiment 9 of the present invention. Referring to fig. 10, an electrodeposition wire type tool 110 according to embodiment 9 of the present invention differs from the electrodeposition wire type tool according to embodiment 8 in that a coating layer 105 is formed on an outer peripheral surface 141 of a core wire 104.

Even the electrodeposition wire type tool according to embodiment 9 thus configured can have the same effect as the electrodeposition wire type tool according to embodiment 8.

Example 1

Diamond abrasive grains coated with an electroless Ni — P plating layer having a P content of 3 mass%, 5 mass%, 7 mass%, 9 mass%, and 11 mass% were prepared.

The diamond abrasive grains had a grain size distribution with a center diameter of 29 μm and a ratio of the electroless Ni — P plating layer of the entire abrasive grains was 30 mass%. For measuring the particle size of the diamond abrasive grains, a laser refraction type particle size distribution measuring apparatus (Mastersizer sver.2.19) manufactured by malvern instruments ltd.

The abrasive grains were divided into halves, and half of the abrasive grains were heat-treated at 300 ℃ for 2 hours in vacuum. The other half was not subjected to any treatment.

These abrasive grains were put in a Ni sulfamate bath and dispersed to make the diameter of brass as a coated base material by magnetic forceThe piano wire is adsorbed and fixed by a nickel coating to manufacture the electro-deposition linear tool.

The production speeds (linear speeds) were all set to 2 m/min.

The results of the overall evaluation of the obtained electrodeposited wire, such as abrasive grain density and productivity, are shown below. Here, "good productivity" means that there is no consumption of abrasive grains and no power consumption.

In the following tables ∈ and ∘ indicate passed. Here, x represents a state more excellent than o. X represents a problem.

[ Table 1]

P content (% by mass)	3	5	7	9	11
						Heat treatment with abrasive particles	○(product of the invention 1)	O (invention product 2)	Very good (invention product 3)	Very good (invention product 4)	Very good (invention product 5)
Heat treatment without abrasive particles	X (comparative 1)	X (comparative 2)	X (comparative product 3)	X (comparative example 4)	X (comparative 5)

The products 4 and 3 of the present invention were the most excellent in abrasive grain density and productivity.

The products 1 and 2 and the product 5 of the present invention were slightly inferior in productivity and abrasive grain density to the product 3 and the product 4 of the present invention. However, even if the deterioration is slight, the improvement is extremely high as compared with the conventional art, and the material is very excellent.

Comparative product 1 can improve the abrasive grain density, but has a problem in productivity. The abrasive grains from comparative products 2 to 5 had low densities, and could not be used as an electrodeposition line tool.

Example 2

The diamond abrasive grains were changed to 41 μm in the center diameter of the grain size distribution and 55 mass% in the electroless Ni — P plating layer ratio of the entire abrasive grains, and an electrodeposition wire tool was manufactured to obtain the same effects as in example 1.

Example 3

Further, the same effects as in example 1 were obtained by changing the plating bath to the watt bath (ヮット bath) to prepare an electrodeposition wire tool.

Example 4

Diamond abrasive grains having a particle size distribution with a center diameter of 29 μm coated with an electroless Ni-P plating layer having a P content of 7 mass% were prepared. The percentage of the electroless Ni — P plating layer in the entire abrasive grain was 30 mass%.

The diamond abrasive grains were heat-treated at 280 ℃ for 2 hours in a hydrogen atmosphere.

As a plating solution, 0.1g/dm of a plating solution was added to a Watt bath³Two kinds of the baths (invention product 6) containing o-sulfobenzimide sodium and the bath (invention product 7) containing no o-sulfobenzimide sodium. The diamond abrasive grains subjected to the heat treatment were added to each plating solution so as to be dispersed, and the diamond abrasive grains were magnetically adsorbed to the diameter of the brass coated with the base materialAn electrodeposited wire tool was made by fixing abrasive grains in a nickel plating (Ni plating) on a 0.18mm piano wire. The production speed (line speed) was 2m/min for both types.

Adding 0.1g/dm of sodium o-sulfobenzoylimine into a watt bath³The plating solution of (1) and the plating solution without adding sodium o-sulfobenzimide were used to prepare the electrodeposition filaments of the invention No. 6 and No. 7, respectively. The weight ratio of sulfur (S) contained in each nickel plating layer was qualitatively and quantitatively analyzed by EDX-SEM (energy dispersive X-ray-Spectrometer-Scanning Electron Microscope), and the ratio of sulfur in inventive product 6 was 2 mass% and that in inventive product 7 was 0 mass%.

Moreover, they are wound around pulleys, and the winding difficulty is compared. The inventive product 7 was good in deflection and smooth in winding, and the inventive product 6 was inferior in deflection to the inventive product 7 and was difficult to wind.

Example 5

Diamond abrasive grains having a particle size distribution with a center diameter of 29.82 μm were prepared. In the measurement of the particle diameter of diamond abrasive grainsA laser refraction type particle size distribution measuring apparatus (Mastersizer S Ver.2.19) manufactured by Malvern Instruments Ltd. The diamond abrasive grains were coated with an electroless Ni-8 wt% P plating layer so as to account for 30 mass% of the entire diamond abrasive grains. Then, the diamond was placed in a vacuum sintering furnace at 1X 10^-4The heat treatment is carried out at 300 ℃ for 10 hours under Torr.

Fig. 11 shows an XRD chart for the abrasive grains after heat treatment. Fig. 12 shows an XRD chart of abrasive grains that were not heat-treated. An XRD analyzer (RINT2000) manufactured by chemical and electrical Co., Ltd was used as the XRD chart. XRD analysis of heat treated abrasive particles produced an intensity ratio of Ni₃P (231)/Dia (111) was 0.11. The value without heat treatment was 0.

Fig. 13 and 14 are views showing cross sections of the diamond abrasive grains and the electroless Ni — P plating layer by a scanning transmission electron microscope (HD-2700) manufactured by hitachi high and new technologies. Fig. 13 and 14 are sectional views of the same sample at different positions. As shown in fig. 13 and 14, an electroless Ni — P plating layer 202 and a diamond layer 201 are stacked on the nickel plating layer 203. The crystals 212 shown by black dots on the Ni — P layer 202 were observed. The crystal 212 has magnetism and includes Ni-P crystal and Ni crystal. This observation is the observation that the cross section of the diamond abrasive grains subjected to electroless Ni — P plating of the electrodeposited wire tool of the present invention produced was thinned with fib (focused Ion beam) and observed at an accelerating voltage of 200kV and 100000 times. The black dot portion defines the crystal of the present invention.

Here, the number of crystals having a diameter of 10nm or more is 6X 10⁷Per mm². The ratio of the black spot crystals to the whole was 45%.

Fig. 15 is an enlarged cross-sectional view showing the electroless Ni — P plating layer 202 in the sample of fig. 14. Fig. 16 is a cross-sectional view showing the photograph shown in fig. 15, in which the crystalline portion is black and the amorphous portion is white.

The TEM image was input to the calculation, and as shown in fig. 16, the black dot crystal portion was black and the amorphous portion was white, and the calculation was performed by converting them into 2 values. Software such as Microsoft Photo Editor AT Image ver4.5, Lia 32ver.0.376 β 1 was used in the above operation.

Next, three types of nickel sulfamate plating solutions shown in table 2 were prepared, and diamond abrasive grains were put in these plating solutions, respectively.

[ Table 2]

	Nickel sulfamate	Nickel chloride	Boric acid	Gloss agent
					Example A	550g/dm³	5g/dm³	30g/dm³	Is free of
Example B	450g/dm³	5g/dm³	30g/dm³	Is free of
					Example C	550g/dm³	5g/dm³	30g/dm³	Is provided with

The prepared abrasive grains were put into the plating solution described above to be dispersed. The magnetic force is applied to the diameter of the brass coated with the base materialThe piano wire is manufactured into an electro-deposition linear tool by fixing abrasive particles on a nickel coating.

The current density is 50A/dm²In a cross-sectional area of 2000mm²In a container of (2) 8dm³The plating solution flows through at a flow rate of/min.

The thickness of the plating layer was 15 μm in total.

Each of the three types of silk was cut every 30mm to prepare 10 pieces.

Furthermore, each sample was first bent 180 degrees.

The sample nickel plating of example a and example B did not crack at all.

The sample nickel plating of example C all produced large cracks. Each sample was quantitatively analyzed by EDX-SEM as follows.

Example a sulfur: detectable only at the error level.

Example B sulfur: detectable only at the error level.

Example C sulfur: 1.5% by mass.

Thereafter, in examples a and B, the wire bent as described above was once returned to the original state, and then bent by 1 degree and 180 degrees to evaluate the presence or absence of cracking of the nickel plating layer.

The results are shown below.

In example A, 0 out of 10 were ruptured.

In example B, 5 out of 10 were ruptured.

The results of observation with an EBSD device (OIM) manufactured by TSL and a scanning electron microscope (JSM-7001F) manufactured by Nippon electronics Co., Ltd are shown in Table 3 for the product of example A.

[ Table 3]

Diameter (μm)	Number of
		0.1	147
0.3	71
		0.5	20
0.7	7
		0.9	4
1.1	2
		1.3	0
1.5	1
		1.7	1
1.9	0
		2.1	0
2.3	0
		2.5	0
2.7	0
		2.9	1
3.1	0
		3.3	0
3.5	0
		3.7	0
3.9	1
		4.1	0
4.3	0
		4.5	0
4.7	0
		4.9	0
Average particle diameter (μm)	0.261735

The cross section of the nickel plating layer of the electrodeposited wire tool, which is the product of the present invention, was observed by ion polishing, EBSD measurement was performed at an acceleration voltage of 20kV and measurement was performed at a step of 0.03 μm, and SEM observation was performed at an acceleration voltage of 20kV or 10 kV. The calculation of the average abrasive grain size by EBSD was performed under the condition that each twind crystal is a grain boundary, without including edge grains.

Under the same conditions, the results of observation with an EBSD device (OIM) manufactured by TSL and a scanning electron microscope (JSM-7001F) manufactured by Nippon electronics Co., Ltd are shown in Table 4 for the product of example B.

[ Table 4]

Diameter (μm)	Number of
		0.1	356
0.3	133
		0.5	27
0.7	9
		0.9	5
1.1	2
		1.3	3
1.5	0
		1.7	0
1.9	0
		2.1	0
2.3	1
		2.5	0
2.7	0
		2.9	0
3.1	0
		3.3	1
3.5	0
		3.7	0
3.9	0
		4.1	0
4.3	0
		4.5	0
4.7	0
		4.9	0
Average particle diameter (μm)	0.210398

FIG. 17 is a graph showing SIMS analysis of the nickel plating layer formed on the wire of example A. FIG. 18 is a graph showing the results of SIMS analysis of the nickel plating layer formed on the wire of example B.

FIGS. 17 and 18 show an example of measurement using an SIMS apparatus (IMS-7F) manufactured by CAMECA. The measurement was carried out by cutting a wire tool for electrodeposition of the present invention, which was produced, from the surface of the nickel plating layer to a depth of 2.5 μm with cesium ions.

The average depth from the surface is shown below as deeper than 0.5. mu.m. The depth of 0.5 μm from the surface is excluded because the accuracy of the measured value is low.

Example A

Sulfur: 5.0X 10¹⁷atoms/cm³

Oxygen: 2.0X 10¹⁹atoms/cm³

Average intensity ratio of secondary ions (hydrogen average/nickel average): 5.6X 10^-3

Average particle diameter of nickel particles: 0.26 μm

Example B

Sulfur: 6.0X 10¹⁸atoms/cm³

Oxygen: 4.0X 10²⁰atoms/cm³

Average intensity ratio of secondary ions (hydrogen average/nickel average): 2.7X 10^-2

Average particle diameter of nickel particles: 0.21 μm

Example 6

Diamond abrasive grains having a particle size distribution with a center diameter of 29.82 μm were prepared. For measuring the particle size of the diamond abrasive grains, a laser refraction type particle size distribution measuring apparatus (Mastersizer S ver.2.19) manufactured by Malvern Instruments ltd.

The diamond abrasive grains were coated with an electroless Ni-8 mass% P plating layer so as to account for 30 mass% of the entire diamond abrasive grains. Further, diamond abrasive grains were put into a vacuum sintering furnace at 1X 10^-4The heat treatment is carried out at 300 ℃ for 10 hours under Torr.

An sulfamic acid Ni plating solution is prepared, and diamond abrasive grains are put into the plating solution. The prepared abrasive grains are put into the plating solution to be dispersed. And magnetically attracted to the diameter of brass coated with a base materialThe piano wire is fixed with abrasive particles by a nickel coating to manufacture an electro-deposition linear tool.

The plating layer thickness was 6 μm, 8 μm, 10 μm, 15 μm, 22 μm, 25 μm.

Mounting them on a cutter, cutting them respectivelyThree pieces of sapphire (sapphire) in inches.

The electrodeposition wire tool having a plating layer thickness of 8 μm, 10 μm, 15 μm or 22 μm was cut into 3 pieces and used, but the electrodeposition wire tool having a plating layer thickness of 6 μm or 25 μm had a reduced sharpness and was difficult to use thereafter.

The reason is that diamond abrasive grains are partially detached in the 6 μm electrodeposited wire tool. This is believed to be because the nickel coating supporting the diamond abrasive grains is thin. The electrodeposited wire tool with a thickness of 25 μm was because there was no shedding of diamond abrasive grains, and the diamond was worn away in use, with no portion protruding from the nickel plating.

Example 7

The abrasive grains were dispersed in a Watt bath, and fixed to the diameter of the brass-coated abrasive grains by a nickel plating layer by a composite plating method0.18mm piano wire, an electrodeposited wire tool was made.

As a plating solution, 1g/dm of a solution was added to a Watt bath³Two kinds of plating solution of o-sulfobenzimide sodium and plating solution without o-sulfobenzimide sodium.

Adding 1g/dm of the mixture into a watt bath³The plating solutions of o-sulfobenzimide sodium and the electrodeposition filaments obtained without adding o-sulfobenzimide sodium were respectively referred to as comparative product 1 and invention product 1. The weight ratio of sulfur (S) contained in each nickel plating layer was qualitatively and quantitatively analyzed by EDX-SEM (Energy dispersive x-ray-Spectrometer-Scanning Electron Microscope), and the ratio of sulfur in the comparative product was 3 mass%, and the ratio of sulfur in the present invention was 0 mass%.

The nickel plating layer was bent by 180 ° to evaluate the presence or absence of cracking. The fracture of comparative product 1 was confirmed, but the complete fracture of inventive product 1 was not confirmed.

Example 8

An electrodeposition wire type tool having diamond abrasive grains with a center diameter of 41.39 μm in a particle size distribution was produced. As a result, the same effects as in example 7 were obtained.

Example 9

In example 9, an electrodeposited wire tool was produced using metal-coated diamond abrasive grains instead of the diamond abrasive grains. As a result, the same effect as in example 7 was obtained.

Example 10

Next, table 2 was prepared to show three types of nickel sulfamate baths, into which diamond abrasive grains were respectively put.

Example D used the same nickel sulfamate plating solution as in example a, example E used the same nickel sulfamate plating solution as in example B, and example F used the same nickel sulfamate plating solution as in example C.

The prepared abrasive grains are put into the plating solution and dispersed. Then, the abrasive grains are adsorbed to the diameter of the brass coated with the base materialThe piano wire is fixed by a nickel coating to manufacture an electro-deposition linear tool.

The thickness of the plating layer was 15 μm in total.

Each of the three types of silk was cut every 30mm to prepare 10 pieces.

Furthermore, each sample was first bent 180 degrees.

The sample nickel plating layers of examples D and E did not crack at all.

The sample nickel plating of example F all produced large cracks. Each sample was quantitatively analyzed by EDX-SEM as follows.

Example D sulfur: detectable only at the error level.

Example E sulfur: detectable only at the error level.

Example F sulfur: 1.5% by mass.

Thereafter, in examples D and E, the wire bent as described above was once returned to the original state, and then bent by 180 degrees to evaluate the presence or absence of cracking of the nickel plating layer.

The results are shown below.

In example D, 0 out of 10 were ruptured.

In example E, 5 out of 10 were ruptured.

For the product of example D, the results of observation with an EBSD device (OIM) manufactured by TSL and a scanning electron microscope (JSM-7001F) manufactured by Nippon electronics Co., Ltd are shown in Table 5.

[ Table 5]

Diameter (μm)	Number of
		0.1	227
0.3	134
		0.5	22
0.7	14
		0.9	7
1.1	3
		1.3	1
1.5	0
		1.7	1
1.9	1
		2.1	1
2.3	1

2.5	0
		2.7	1
2.9	1
		3.1	0
3.3	1
		3.5	1
3.7	0
		3.9	0
4.1	0
		4.3	0
4.5	0
		4.7	0
4.9	0
		Average particle diameter (μm)	0.279102

The cross section of the nickel plating layer of the electrodeposited wire tool, which is the product of the present invention, was observed and treated by ion polishing, EBSD measurement was performed at an acceleration voltage of 20kV and a measurement step of 0.03 μm, and SEM observation was performed at an acceleration voltage of 20kV or 10 kV. The calculation of the average abrasive grain size by EBSD was performed under the condition that each twind crystal is a grain boundary, without including edge grains.

Under the same conditions, the results of observation with an EBSD device (OIM) manufactured by TSL and a scanning electron microscope (JSM-7001F) manufactured by Nippon electronics Co., Ltd are shown in Table 6 for the products of example E.

[ Table 6]

Diameter (μm)	Number of
		0.25	405
0.75	30
		1.25	1
1.75	2
		2.25	0
2.75	0
		3.25	0
3.75	0
		4.25	0
4.75	0
		5.25	0
5.75	1
		6.25	0
6.75	0
		7.25	0
7.75	0
		8.25	0
8.75	0
		9.25	0
9.75	0

Average particle diameter (μm)

0.230646

FIG. 19 shows an example of measurement using an SIMS apparatus (IMS-7F) manufactured by CAMECA. The measurement was carried out by cutting the electrodeposition linear tool of the present invention, which was produced, from the surface of the nickel plating layer to a depth of 2.5 μm with cesium ions, and measuring the cut product.

The average value of the depth from the surface of 0.5 μm or more is shown below. The depth of 0.5 μm from the surface is excluded because the accuracy of the measured value is low.

Example D

Sulfur: 1.0X 10¹⁸atoms/cm³

Oxygen: 3.0X 10¹⁹atoms/cm³

Average intensity ratio of secondary ions (hydrogen average/nickel average): 5.8X 10^-3

Average particle diameter of nickel particles: 0.28 μm

Example E

Sulfur: 5.8X 10¹⁸atoms/cm³

Oxygen: 4.0X 10²⁰atoms/cm³

Average particle diameter of nickel particles: 0.23 μm

Description of the symbols

1 superabrasive grain, 2 coating layer, 3 plating layer, 4 core wire, 10 electrodeposited wire tool, 41 outer peripheral surface

Claims

1. An electrodeposition line tool, comprising:

a linear body (4) and

a plurality of metal-coated abrasive grains (1) fixed to the outer peripheral surface of the linear body (4) by a plating layer (3) and coated with metal,

the grain diameter of the abrasive grains (1) is 5-1000 [ mu ] m,

the plating layer (3) formed on the outer peripheral surface (41) of the linear body (4) is a nickel plating layer,

the average S (sulfur) content of the nickel coating is more than 0atoms/cm³And 3.0X 10¹⁸atoms/cm³In the following, the following description is given,

the nickel plating layer has an average O (oxygen) content of more than 0atoms/cm³And 2.0X 10²⁰atoms/cm³In the following, the following description is given,

the ratio of the secondary Ion average intensity of hydrogen to the secondary Ion average intensity of Ni in SIMS (Secondary Ion Mass Spectrometry) analysis of the nickel plating layer is 0 or more and less than 2.8X 10^-2。

2. The electrodeposited wire tool as set forth in claim 1, wherein an average particle diameter of a nickel structure constituting the nickel plating layer is 0.0155 times or more and 1.000 times or less with respect to a thickness of the nickel plating layer.

3. The electrodeposition wire type tool according to claim 1 or 2, wherein the nickel plating layer and the abrasive grains (1) each have a value of 0.26 to 0.8 inclusive of the thickness of the nickel plating layer and the average particle diameter of the metal-coated abrasive grains.

4. An electrodeposition wire type tool according to claim 1 or 2, wherein the wire body (4) is a piano wire subjected to brass plating or copper plating.